KR101700036B1

KR101700036B1 - LDI In-Line double-sided drum-type exposure apparatus

Info

Publication number: KR101700036B1
Application number: KR1020150089116A
Authority: KR
Inventors: 최현호
Original assignee: 아주하이텍(주)
Priority date: 2015-06-23
Filing date: 2015-06-23
Publication date: 2017-02-08
Also published as: KR20170000448A

Abstract

The present invention relates to a drum type LDI In-Line double-side exposure apparatus,
The object of the technical implementation is to form the surface of the exposure apparatus with a drum surface rotating unit and a back surface exposure unit, and to form the back surface exposure unit and the back surface exposure unit in a single So that unnecessary labor is prevented from being consumed and the working efficiency is accordingly improved. Thus, the productivity and the economical efficiency are greatly increased. Type LDI In-Line double-side exposure apparatus.
In order to achieve the above object, according to a concrete means of the present invention,
An alignment guide for guiding and supplying a work substrate;
A surface exposure unit for exposing the surface of the substrate to be processed;
An inverted alignment guide for guiding the surface-exposed substrate to be processed;
A back-side exposure unit for exposing the back surface of the substrate to be processed;
And a substrate discharge guide for discharging and guiding the backside exposed substrate to be processed.

Description

[0001] The present invention relates to a drum type LDI in-line double-side exposure apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drum type double-side exposure apparatus, and more particularly, to a drum type double-side exposure apparatus which includes a surface exposure unit having a drum rotation system, Type LDI In-Line double-side exposure apparatus.

In general, a printed circuit board (PCB) is a device that easily connects various electronic devices according to a certain frame, and is used for all electronic products, such as digital TVs, wired and wireless telephones, Is a widely used component. Also, it can be divided into general purpose PCB, module PCB, and package PCB depending on the application.

That is, the circuit board is formed by attaching a thin plate of copper or the like to one side of a phenol resin insulating plate or an epoxy resin insulating plate or the like and then etching (a step of etching and leaving only a circuit on the line) , Double-sided boards, multi-layer boards and the like depending on the number of wiring circuit surfaces. The higher the number of layers, the better the mounting force of components and the higher the precision of the products. In recent years, ultra-thin printed circuit boards (0.04 to 0.2 mm) have been widely used in the electronics industry. There has been an increase in the use of a double-sided substrate in which circuits are formed on both sides and interconnected through holes, or a multi-layer substrate on which both sides thereof are expanded as well as a plurality of layers.

Currently, photo lithography, which forms a pattern by photographic transfer, has been widely used for manufacturing a printed circuit board. Particularly, a semi-analytical method capable of coping with high density of wiring density is widely used. The method for manufacturing a printed circuit board using the semimaritive method includes a seed layer forming step, a pre-treatment step, a dry film laminating step, an exposure step, a development step, an electrolytic copper plating step, a dry film peeling step, (flash etching) process. Among them, since the circuit pattern is formed by using the artwork film, the artwork film is liable to be damaged and its correction is difficult. Accordingly, there is provided a laser direct imaging (LDI) exposure apparatus for directly exposing a layer to be exposed on a substrate using a laser diode as a light source without using a photomask.

That is, in order to print the PCB, Rigid, and FPCB patterns, UV light is passed through a film mask to form a desired pattern. Recently, by replacing UV light with a UV laser and irradiating the laser directly onto the film, And an LDI exposure apparatus which makes it possible to quickly form a more precise pattern than a film is used.

In addition, the LDI exposure apparatus adopts a method of forming an image by scanning a laser light source through a polygon mirror or using a DMD (Digital Micro Device) chip.

In a conventional LDI exposure apparatus, a stage is generally moved to pattern the photosensitive resin thereon. The irradiated light is reflected by the DMD, thereby performing pattern exposure.

However, the above-mentioned conventional exposure apparatus which is commonly used has inevitably caused a problem in a limited structure in which the lamination and the width of the circuit board pattern can not be made larger due to the effective region limit of the projection lens, , The exposure operation must be performed using only one projection lens and only a single operation stage corresponding thereto. Therefore, there is a problem that there is a considerable limitation and difficulty in improving the productivity of the product per unit time in the exposure operation of the double- .

Meanwhile, in recent years, as various attempts to improve the productivity of products, there have been many technologies such as "exposure apparatus and substrate calibrating apparatus" disclosed in the Korean Intellectual Property Office (Laid-Open Patent Application No. 2009-0042710).

However, the "exposure apparatus and substrate calibrating apparatus" as such a prior art disclosure technique is a technique for preventing the deformation of the circuit board in the exposure process, In particular, the structure of the table on which exposure is performed has a flat structure, and the transfer device of the table also takes a horizontal transfer structure. , It is impossible to realize the maximum exposure speed, and when a high-resolution product is produced, the exposure area in a unit time is reduced, so that the problem of lowering productivity is left intact.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the conventional problems of conventional exposure apparatuses,

It is an object of the present invention to provide a surface exposure unit and a backside exposure unit which are formed by a surface exposure unit and a backside exposure unit each having a drum rotation system and a backside exposure unit, So that unnecessary labor is prevented from being consumed and the working efficiency is accordingly improved. Thus, the productivity and the economical efficiency are greatly increased. Type LDI In-Line double-side exposure apparatus.

In order to accomplish the above object, according to a concrete means of a drum type LDI In-Line double-side exposure apparatus according to the present invention,

An alignment guide for guiding and supplying a work substrate;

A surface exposure unit for exposing the surface of the substrate to be processed;

An inverted alignment guide for guiding the surface-exposed substrate to be processed;

A back-side exposure unit for exposing the back surface of the substrate to be processed;

And a substrate discharge guide for discharging and guiding the backside exposed substrate to be processed.

As described above, the drum type LDI In-Line double-sided exposure apparatus according to the present invention comprises a surface exposure unit having a drum rotation system and a backside exposure unit, wherein the backside exposure unit and the backside exposure unit are arranged in a sequential flow relationship This makes it possible to simultaneously perform a double-side exposure operation of the substrate to be processed only through a single process, thereby avoiding unnecessary waste of labor and improving work efficiency Of course, productivity and economy are also increased, which provides a very useful anticipatory effect.

Fig. 1 is an overall configuration diagram of a drum type LDI In-Line double-side exposure apparatus according to the present invention
2 is an enlarged cross-sectional view of a surface exposure induction drum and a backside exposure induction drum applied to the present invention
3 is a magnified operating state diagram of a surface exposure unit applied to the present invention
4 is a magnified operating state diagram of the back-side exposure unit applied to the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a drum type LDI In-Line double-side exposure apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, a schematic configuration of the present invention will be described with reference to the accompanying drawings.

This is because the alignment guide 1, the surface exposure unit 2, the reverse alignment guide 3, the back side exposure unit 4 and the substrate discharge guide 5, which are constructed by a series of flow process methods, .

First, the alignment guide 1 is a means for supplying a printed circuit board to be subjected to exposure processing, that is, a substrate P to be worked, to a surface exposure unit 2 to be described later, , The aligning guide 1 is preferably a kind of position adjusting and feeding device for adjusting the position of the workpiece P in the horizontal direction to the left and right in accordance with the direction in which the workpiece P is to be supplied, Do.

The surface exposure unit 2 clamps and fixes the substrate P to be processed supplied from the above-described alignment guide 1 with a bending induction structure so that the surface of the substrate P to be processed is exposed 1 or 3, the surface exposure unit 2 is provided with a surface exposure table 21 having a predetermined height as a basic constitution, The surface of the substrate P to be processed is exposed to light by irradiating an exposure processing means such as a laser to the left surface of the surface exposure inducing drum 22 on which the surface is to be formed, (Here, the detailed configuration of the surface laser optical head is the same as that applied to the general LDI exposure apparatus, and the same operation configuration and operation Having a principle Hereinafter, a detailed description thereof will be omitted.)

At this time, in the surface exposure unit 2 described above, the surface exposure inducing drum 22 has a pair of automatic fixing means, for example, a workpiece-to-be-processed P, The front end surface exposure clamp 221 and the rear surface surface exposure clamp 222 which are engaged and fixed at the front end and the rear end of the wafer W are further formed as shown in FIG. 1 or FIG. 3, The front stage surface exposure clamp 221 and the rear stage surface exposure clamp 222 are formed into a flexible mounting fixing structure in which the installation interval is variably controlled in accordance with the setting standard of the substrate P to be subjected to the surface exposure processing do.

2, the surface exposure inducing drum 22 is provided with a vacuum suction device 223 on the inner surface thereof, and the surface exposure inducing drum 22 And a vacuum suction hole 224 for allowing the outside air to be sucked by the vacuum sucking device 223 is further provided.

The inversion aligning guide 3 continuously guides the substrate P subjected to the surface exposure treatment through the surface exposure unit 2 to the back surface exposure unit 4 described later, The reverse alignment guide 3 is made up of a kind of position adjusting and conveying device such as the above-described alignment guide 1. In this case, As shown in Fig. 1 or Fig. 4, the aligning guide 3 is provided with an inverted introduction guiding guide 31 having a downward inclined structure on the upper central surface thereof, It is preferable that a buffer 32 device for adjusting the operation speed of the reverse turn-in guide 31 is further installed.

The back side exposure unit 2 is provided with a workpiece P to be supplied (input) from the aforementioned reverse alignment guide 1, that is, a workpiece to be subjected to the surface exposure processing by the surface side exposure unit 2 The back surface exposure unit 4 is a means for clamping and fixing the substrate P with a bending induction structure to expose the back surface of the substrate P to be processed in a secondary shape, As shown in the figure, the back exposure table 41 having a predetermined height is used as a basic structure, and a back exposure guide drum 42 is mounted on the upper surface of the back exposure table 41, It is preferable to further include a rear laser optical head 43 for irradiating the right side surface of the drum 22 with exposure processing means such as laser to cause the back surface of the substrate P to be exposed to be exposed. Here, the backside laser optical head has the above- To have the same configuration and operation principle of an optical head, in particular description thereof will be omitted hereinafter.)

At this time, in the above-described back-side exposure unit 4, the back-side exposure inducing drum 42 has a pair of automatic fixing means spaced apart from each other by a predetermined distance, The front end exposure clamp 421 and the rear end exposure clamp 422, which are engaged with the front end and the rear end of the substrate P, are further formed as shown in FIG. 1 or FIG. 4, Thus, the exposure clamp 421 and the exposure clamp 422 on the front stage and on the rear stage, which are provided as described above, can be flexibly mounted and fixed to each other, .

2, in the backside exposure unit 4 described above, the backside exposure induction drum 42 is provided with a vacuum suction device 423 on the inner side thereof, The vacuum suction device 424 is provided with a plurality of through holes on the outer surface of the vacuum suction device 42 so as to allow the outside air to be sucked by the vacuum suction device 423. Here, The suction hole has the same function as the vacuum suction apparatus and the vacuum suction hole of the surface exposure induction drum described above, and the same name is used here.)

Finally, the substrate discharge guide 5 is a means for causing the substrate P to be subjected to back exposure through the backside exposure unit 4 to be discharged and guided to the outside, It is preferable that the guide 5 is installed by a conveying apparatus having an automatic flow system, for example, a conveyor apparatus.

Therefore, the following description will be made about the coupling-installing relationship of the drum type LDI In-Line double-side exposure apparatus according to the present invention having the above-described structure;

This is achieved by arranging the alignment guide 1, the surface exposure unit 2, the reverse alignment guide 3, and the backside exposure unit 3, as shown in FIG. 1, 4) -substrate discharge guide 5, the drum type LDI In-Line double-side exposure apparatus according to the present invention is implemented.

On the other hand, the drum-type LDI In-Line double-side exposure apparatus constructed as described above according to the present invention has a flexible substrate made of a material such as a copper foil and a resin such as a substrate made of a fluid material, A series of process steps and a mutual action relationship between components will be described as follows.

First, the substrate P to be processed, which has been cut to a predetermined size, is supplied (injected) into the surface exposure unit 2 by a continuous flow induction method using the aligning guide 1.

3, the front end portion of the substrate P to be processed which is fed into the surface exposure unit 2 is caught by the front end surface exposure clamp 221 on the upper surface of the surface exposure inducing drum 22 The substrate P is fixed to the surface exposure inducing drum 22 by the automatic clamping by the front end surface exposure clamping section 221. In this fixed relationship, .

At this time, the substrate P to be processed is rotated, and the surface exposure inducing drum 22 sucks the substrate P to be processed, which is rotation-induced by the vacuum suction action by the vacuum suction hole 224 formed on the surface thereof, 2, and is brought into close contact with the outer surface of the surface exposure inducing drum 22 as a banding structure as shown in FIG. 2. At the same time, the rear end of the substrate P to be worked is fixed to the rear end surface exposure clamp 222 So as to have a firm bonding force.

Thus, in this manner, the work surface of the work substrate P (B) adhered to the outer surface of the surface exposure inducing drum 22 by the front end surface exposure clam 221, the rear surface surface exposure clamp 222 and the vacuum adsorption action, Is guided and rotated in the rightward direction by the surface exposure inducing drum 22 so that the surface of the substrate P to be processed, which is rotated as described above, is guided to the surface laser optical head 23 The surface of the workpiece P subjected to the surface exposure treatment rotates together with the surface exposure inducing drum 22 and returns to the upper side of the surface exposure unit 2 as described above, , The clamping state of the front end surface exposure clamp unit 221 and the rear end surface exposure clamp 222 and the vacuum adsorption action are released and the surface of the workpiece substrate P subjected to the surface exposure processing is shown in FIG. As shown in Fig. 3, A.

On the other hand, the substrate P to be processed, that is, the substrate P subjected to the surface exposure treatment, discharged to the inverse alignment guide 3 is continuously guided by the inversion introduction inducing guide 31, (Input) into the back side exposure unit 4, as shown in Fig.

At this time, as shown in Fig. 4, the substrate P to be supplied (input) to the back-side exposure unit 4 is transferred to the back-side exposure inducing drum 42 The surface of the substrate P to be exposed is brought into contact with the outer surface of the rear exposure inducing drum 42 and the rear surface of the substrate P to be processed is moved outward It is reversed to the exposed form.

Thereafter, as described above, the substrate P to be processed, which is inserted into the back-side exposure inducing drum 42 in an inverted form, has the same working principle as the above-described surface-exposure unit 2, A rear end exposure clamp 422, and a vacuum suction hole, and is guided in a leftward direction by the coupling relationship on the back surface exposure inducing drum 22, The back surface of the substrate P to be processed is subjected to exposure processing by laser irradiation by the laser optical head 43. [

Subsequently, as the finishing process, the substrate P subjected to back-side exposure processing is rotated in the leftward direction together with the back-side exposure inducing drum 42 and returned to the upper side of the back-side exposure unit 4, When the work target substrate P is returned to the upper side of the back exposure unit 4 by the backward exposure inducing drum 42 rotating in the left direction, The rotational direction of the back side exposure inducing drum 42 that rotates in the left direction is rotationally transformed in the reverse direction, that is, the right direction as shown in FIG. 4 by a predetermined operation control, When the clamping state of the exposure clamp 422 at the rear end and the exposure clamping portion 421 at the front end and the vacuum adsorption action at the rear exposure inducing drum 42 are released together with the converted rotational action, Processed workbench (P) is converted into a substrate discharge induction (5) as shown in FIG. 2, and is stably discharged. By this series of processes, the two-side exposure work of the substrate P to be processed is completed .

On the other hand, as a further explanation, the above-described surface exposure inducing drum 22 and back exposure inducing drum 42 are subjected to rotational force interrupted by a motive power motor which is automatically actuated by a set control relationship. The operation control by the control unit 20 corresponds to a general technique, and a detailed illustration and description thereof are omitted.

1: Align guide 2: Surface exposure unit
3: reverse alignment guide 4: backside exposure unit
5: substrate discharge guide 21: surface exposure table
22: surface exposure induction drum 23: surface laser optical head
31: inverting input guiding guide 32: buffer
41: backside exposure table 42: backside exposure induction drum
43: rear laser optical head

Claims

An alignment guide 1 for guiding and supplying a substrate P to be worked and a substrate P to be processed supplied from the alignment guide 1 are clamped and fixed by a banding structure to expose the surface of the substrate to be processed An inverse alignment guide 3 for continuously guiding the flow of a surface-exposed substrate P subjected to the surface exposure treatment by the surface exposure unit 2, Back exposure unit 4 for clamping and fixing the substrate P to be processed which is flowed by the back exposure unit 4 with a banding structure and exposing the back surface of the substrate P to be processed by the back exposure unit 4 And a substrate discharge guide 5 for discharging and guiding the exposed substrate P to be worked on,
The inverted alignment guide (3) has an inverted input guiding guide (31) having a downward inclined structure on the upper central plane;
The drum type LDI In-Line double-side exposure apparatus according to claim 1, further comprising a buffer (32) mounted on one side of the inverted turn-in guide (31) to adjust an operation speed of the inverted turn-in guide (31).

The method of claim 1, further comprising:
The surface exposure unit (2) includes a surface exposure table (21);
Mounting a surface exposure inducing drum (22) on the upper surface of the surface exposure table (21);
A surface laser optical head 23 is further mounted on the left surface of the surface exposure inducing drum 22. The surface exposure inducing drum 22 is further provided with a pair of arrangements in which a front end surface exposure clamp 221 and a rear end surface exposure clamp 222 are spaced apart from each other on an outer diameter surface thereof, And the rear stage surface exposure clamp 222 are fixedly installed in a variable adjustment structure in accordance with the setting standard of the substrate P to be exposed.

delete

The method of claim 1, further comprising:
The back side exposure unit 4 includes a back side exposure table 41;
Mounting a backside exposure induction drum (42) on the top surface of the backside exposure table (41);
A rear laser optical head 43 is further mounted on the right side surface of the rear exposure inducing drum 42. The back surface exposure inducing drum 42 is further provided with a pair of arrangement in which the exposure clamp 421 on the front surface and the exposure clamp 422 on the rear surface are spaced apart from each other on the outer surface thereof, ) And the rear end exposure clamp 422 are fixedly installed in a variable adjustment structure in accordance with the setting standard of the substrate to be exposed.