KR101705078B1 - Manufacturing method of double side metal-deposited film and double side metal-deposited film thereby - Google Patents

Abstract

In the present invention, a method of forming a metal thin film layer on both surfaces of a base film by using a roll-to-roll sputtering apparatus includes the steps of laminating a metal on the first surface of the base film while maintaining the temperature of the base film in a first temperature range Step S1; And a step (S2) of laminating a metal on the second surface of the base film while maintaining the temperature of the base film at a second temperature range higher than the first temperature range, and a method for manufacturing the double-side metal laminated film Sided metal laminated film. According to the production method of the present invention, it is possible to produce a double-side metal laminated film in which the thickness deviation of the metal thin film layers stacked on both surfaces of the base film is less than 1%, thereby minimizing the difference in surface resistance between both surfaces.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for producing a double-side metal laminated film and a double-side metal laminated film produced therefrom. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for producing a double-side metal laminated film and a double-side metal laminated film produced therefrom, and more particularly, Sided metal laminated film which can form a metal thin film layer without a variation in the thickness of a metal deposited on both surfaces by changing the processing temperature at the time of sputtering the surface and the second surface, will be.

The flexible metal laminated film is used as a substrate serving as a transmission medium for mounting an electric device such as a semiconductor chip on a circuit or transmitting a signal between the panel and the PCB after forming a printed circuit pattern thereon. In connection with this, the double-sided flexible metal laminated film generally requires miniaturization and weight reduction, durability and high reliability in accordance with the development of the technology according to the current trend, especially in the field of the electronic industry, The development of the material that has been promoted.

As to the double-sided metal laminated film to be used for this purpose, Patent Document 1 discloses a double-sided metal thin film laminated film in which a metal thin film is laminated by a method of casting a metal thin film on both sides of a polyimide film by using an adhesive. However, the above method has a limitation in reducing the thickness of the metal thin film to be cast, which is not suitable for the recent trend in which the pattern of the circuit is miniaturized.

In order to solve this problem, for example, Patent Document 2 discloses a method of electrodepositing a metal thin film by electrolytic plating. In this case, before the electrodeposition, the base film is laminated with a metal thin film on both sides by a plasma sputtering method or the like to form a seed layer, and then electroplating is performed on the seed layer to produce a double-sided metal thin film laminated film. A tie layer may be added on the base film and the seed layer.

In the case of the conventional double-sided metal laminated film, when the adhesive is produced by using the adhesive method and the casting method, the same metal is laminated or bonded on both sides, so that there is no difference in surface resistance between the metal surfaces. However, in the case of electrodeposition of a metal thin film, plasma sputtering on both surfaces proceeds in sequence in the step of forming a seed layer formed by electroplating by plasma sputtering before electrodeposition, There is a problem that a thickness difference occurs. The difference in the thickness of the seed layer is that sputtering, which is performed first on the first surface in a sequential sputtering process, is sputtering on the substrate film itself, and sputtering on the second surface is performed on one surface This is due to the fact that the surface resistance of the base film to be sputtered is different due to the substrate film formed with the metal deposition layer. As described above, the difference in the thickness of the metal thin film layer formed on both surfaces and the difference in the surface resistance result in a problem that the amount and thickness of the electrodeposited metal are changed. Therefore, a solution is needed.

KR2010-0086786A KR2013-0016851A

It is an object of the present invention to provide a method for forming a metal thin film layer on both surfaces of a base film, and a method for producing a both side metal laminated film having no difference in thickness between metal thin films formed on both sides.

Another object of the present invention is to provide a double-sided metal laminated film produced by the above method.

In the present invention, a method of forming a metal thin film layer on both surfaces of a base film by using a roll-to-roll sputtering apparatus includes the steps of laminating a metal on the first surface of the base film while maintaining the temperature of the base film in a first temperature range Step S1; And (S2) laminating a metal on the second surface of the base film while maintaining the temperature of the base film at a second temperature range higher than the first temperature range. .

The method of forming the metal thin film layer is preferably plasma sputtering.

The second temperature range is preferably 15 to 40 DEG C higher than the first temperature range. More preferably, the first temperature range is -10 to 0 占 폚; The second temperature range is 15 to 25 占 폚.

The step of vacuum drying the base film in a vacuum tank in a reduced pressure range of 10 ^-4 to 10 ^-2 Torr for more than 40 hours may be further included before the step S 1.

Prior to the step S1, the plasma treatment may be further performed on the base film in a vacuum of 10 ^-6 to 10 ^-3 Torr.

The metal thin film layer may be a tie layer of a Ni / Cr alloy having a Ni content of 80 to 95% and a thickness of 50 to 500 Å and serving as a conductive layer; Or a Cu-seed layer having a thickness of 500 ANGSTROM to 1500 ANGSTROM.

The present invention also provides a double-side metal laminated film produced by the above-described method.

According to the production method of the present invention, it is possible to produce a double-side metal laminated film in which the thickness deviation of the metal thin film layers stacked on both surfaces of the base film is less than 1%, thereby minimizing the difference in surface resistance between both surfaces.

1 is a schematic view of a single-drum type roll-to-roll sputtering apparatus to which the manufacturing method according to the present invention is applied.
2 is a schematic view of a multi-drum type roll-to-roll sputtering apparatus to which the manufacturing method according to the present invention is applied.
3A is a cross-sectional SEM photograph of a metal laminated film manufactured according to an embodiment of the present invention, and FIG. 3B is a cross-sectional SEM photograph of a metal laminated film manufactured by a conventional method.

A method of forming a metal thin film layer on both surfaces of a base film using a roll-to-roll sputtering apparatus, comprising the steps of: laminating a metal on the first surface of the base film while maintaining the temperature of the base film at a first temperature (S1); And (S2) laminating a metal on the second surface of the base film while maintaining the temperature of the base film at a second temperature higher than the first temperature. do.

1 is a schematic view of a roll-to-roll sputtering apparatus to which a manufacturing method according to the present invention is applied. 1, the apparatus 10 is configured such that the base film 12 wound on the take-up roll 11 is drawn out in the direction of the arrow, then passes through while touching the main drum 13 and wound around the take-up roll 14 . In the above-described process, the base film 12 may be subjected to a winding tension. Further, as many guide rolls 16 as necessary may be used between the winding roll 11 and the winding roll 14. At this time, a sputtering device 15 for radiating a plasma and / or an ion beam toward the main drum 13 is provided at one side of the main drum 13, and metal ions generated from the sputtering device 15 are supplied to the main drum 13 13) and is formed as a metal thin film layer. The main roll 13 and the sputtering apparatus 15 are usually provided in a vacuum chamber (not shown), and the main roll 13 and the spooling apparatus 15 ) In the vacuum chamber.

The present invention relates to a method for forming a metal thin film layer on both sides of a base film, and in one embodiment of the manufacturing method according to the present invention, the steps S1 and S2 are performed on both sides of the base film 12 A single-drum type device that can not be simultaneously deposited on the substrate. In this case, after the temperature of the main drum 13 is set to the first temperature, the metal is laminated on the first surface to complete the step S1, and then the temperature of the main drum 13 is set again to the second temperature , And the surface is changed to laminate a metal on the second surface of the base film (20), and the step S2 is completed.

In another embodiment of the manufacturing method according to the present invention, the steps S1 and S2 are performed using a multi-drum type device capable of being simultaneously deposited on both sides of the base film 20, as shown in FIG. 2 . The roll-to-roll sputtering apparatus 20 of the multi-drum type shown in FIG. 2 is configured such that the main drums 23-1 and 23-1 and the sputtering apparatuses 25-1 and 25-2 The metal film is laminated on the first surface of the base film 22 through the first main drum 23-1 set at the first temperature so that the step S1 is performed and then the second main drum 23-1, It is possible to stack the metal on both sides of the base film 22 in such a manner that the metal is laminated on the second side and the step S2 is performed.

In the manufacturing method of the present invention, the base film may be a thin film of a heat-resistant polymer material such as polyimide, polyethylene terephthalate, or polynaphthalene terephthalate. For example, the metal laminated film may be a flexible circuit substrate Preferably, the base film may be a film having a thickness of 75 to 125 μm formed of a polyimide or polyethylene terephthalate material.

According to the manufacturing method of the present invention, the metal laminated on both sides of the base film may be, for example, an alloy of copper and copper-nickel. Particularly, the production method according to the present invention is useful for producing a metal laminated film used for producing a flexible copper foil laminated film. In this case, the metal laminated on both sides of the base film has a Ni content of 80 to 95 wt% A Ni / Cr alloy lie-layer having a thickness of 50 ANGSTROM to 500 ANGSTROM and serving as a conductive layer; And / or a Cu-seed layer having a thickness of 500 to 1500 Å. The flexible copper thin film laminated film widely used as a substrate for a flexible-PCB is completed by forming a copper thin film layer on the metal laminated film by electrolytic plating.

The present invention is useful when a metal thin film layer is formed on both sides of a base film by physical vapor deposition (PVD), in particular, a plasma sputtering method. At this time, in forming the metal thin film layer sequentially on both sides of the base film, the thickness of the metal thin film layer stacked on both sides is uniformly guided by varying the temperature of the base film on which the metal thin film is laminated in each step Feature.

In the step of depositing the metal on both sides of the substrate film by using the sputtering method, the amount of metal deposited during the processing in the same processing environment is different, and a defect occurs due to the difference in surface resistance between the first processing surface and the second processing surface do. This phenomenon differs depending on the degree of activation of the gas used when the sputtering proceeds. When the first processing is performed, the processing proceeds in the form of a polymer film. However, when the second processing proceeds, the metal is deposited on the back because it is processed in the first processed film form. Therefore, the substrate films to be substantially deposited become different from each other, and accordingly, the cooling effect by the main drum is not generated uniformly. Even though the fabrication is proceeded under the same conditions, the processing environment is changed, so that the degree of activation of the gas used for sputtering is different, and the amount or thickness of the deposited metal is changed.

If the voltages supplied to the deposited metal targets are different from each other, the thickness of the first surface and the second deposited metal can be adjusted. However, since the metal target is continuously consumed as the sputtering proceeds, There is a difficulty. In the present invention, the above problems are solved by adjusting the temperature condition of the drum which gives a cooling effect at the time of both-side machining, and the thickness of the metal deposited on both surfaces of the base film can be made equal.

In this case, the second temperature range is preferably 15 to 40 ° C higher than the first temperature range. By way of non-limiting intention, it is understood that various factors such as out-gasing of the gas in the film due to the temperature difference, conductivity difference, etc. affect the thickness and the surface quality of the metal. Particularly preferably, the first temperature range is set at -10 to 0 占 폚, and the second temperature range is set at 15 to 25 占 폚 to set the cooling temperature of the main drum (s) of the drum.

In the manufacturing method of the present invention, prior to the step S1, vacuum drying of the base film and / or plasma treatment may be added.

In the vacuum drying step, water and gas on the film are effectively removed, and the polyimide film thus obtained is used to reduce the generation of oxides and other unnecessary compounds in the step S1 and / or the step S2, thereby improving adhesion and insulation. The vacuum drying may preferably be performed by vacuum drying the vacuum tank in a reduced pressure state in the range of 10 ^-4 to 10 ^-2 Torr for at least 40 hours. For the vacuum drying method for a polymer material used as a base film of a flexible metal laminated film, reference may be made to the disclosure of KR2013-0020242A.

On the other hand, the plasma treatment step is performed for the purpose of securing the adhesion between the polymer film and the metal through chemical activation, surface cleaning, and roughness improvement of the substrate film surface. The plasma treatment is preferably performed using an RF plasma or an ion beam under a pressure of 10 ^-6 to 10 ^-3 Torr, and may be performed while introducing Ar, O _2, and / or N ₂ gas. Further, reference may be made to those disclosed in KR2014-0015870A, KR2013-0016851A, etc., for plasma treatment of a polymer material used as a base film of a flexible metal laminated film.

Hereinafter, the present invention will be described in more detail with reference to Examples. This is for further illustrating the present invention, and the scope of the present invention is not limited to these examples.

Example 1

A metal (Cu) was deposited on both sides of a PET film (Toray, U-483) having a thickness of 100 탆 in the following manner.

First, in order to improve the adhesive force between the PET film and the metal, surface cleaning, and roughness in order to process the first side of the base film, both sides in a vacuum state under the following conditions were subjected to plasma treatment. That is, the plasma processing power was set to 1.0 kv, and the input gas was composed of Ar gas.

Next, Cu serving as a conductive layer was deposited on the surface of the nonconductive PET film by using a sputtering method such as physical vapor deposition (PVD) on the plasma-treated PET film. The deposition was carried out using a deposition apparatus (Plamor type MF cathode, speed: 2 mpm) manufactured by Germany A. At this time, the temperature of the main drum was set at -10 ° C to 0 ° C to produce a one-sided flexible metal laminated film (S1).

Finally, in order to improve the adhesive force between the PET film and the metal, surface cleaning, and roughness for processing the second surface, the first treatment under vacuum was performed under the following conditions. That is, the plasma processing power was set to 1.0 kv, and the input gas was composed of Ar gas. The surface of the non-conductive PET film is deposited on the plasma-treated PET film by physical vapor deposition (PVD) sputtering. The temperature of the main drum is raised to 15 to 25 ° C To produce a double-sided flexible metal laminated film (S2).

Comparative Example 1

The double-sided flexible metal laminated film was produced in the same manner as in Example 1, except that the cooling temperature of the main drum was set to -20 to -10 ° C.

Comparative Example 2

Sided flexible metal laminated film was produced in the same manner as in Example 1, except that the cooling temperature of the main drum was set to -10 to 0 캜.

Experimental Example

The double-sided flexible metal laminated films produced according to the above Examples and Comparative Examples were evaluated and the results are shown in Table 1 below. The surface resistance was measured with an 8 cm x 8 cm sample and then measured according to JIS K7194. Thickness measurements were taken from SEM images, and SEM images were obtained using a Hitachi S-3400N instrument.

Item Thickness (Å) Surface resistance (mΩ / □) Example 1 The first side 1486 297 Second side 1497 295 Comparative Example 1 Second side 1955 268 Comparative Example 2 Second side 1899 275

It can be seen from Table 1 and FIGS. 3A and 3D that the thicknesses of the first and second surfaces of the metal laminated film produced according to the present invention are 1486 Å and 1497 Å, respectively, with a deviation of 1% It can be confirmed that they are almost similar. The difference between the above-mentioned small thickness deviation and the surface resistance value guarantees a uniform quality of the plating layer formed on both sides, for example, to perform a post-process such as electroplating on both sides.

On the other hand, when the temperature of the main drum is set to be the same as that at the time of processing the first surface (Comparative Example 2) or when the temperature of the main drum is set to be lower (Comparative Example 1), the thickness deviation from the first surface is 31.6 % And 27.8%, respectively. As a result, it can be confirmed that the surface resistance value is also very large.

11, 21 .. Roll 12, 22. Base film
13, 23-1, 23-2, main drum 14, 24,
15, 25-1, 25-2. Sputtering apparatus 16, 26. Guide roll

Claims (9)

A method of forming a metal thin film layer on both surfaces of a base film using a roll-to-roll sputtering apparatus,
(S1) stacking a metal on the first surface of the substrate film while maintaining the temperature of the substrate film in a first temperature range; And
(S2) laminating a metal on the second surface of the base film while maintaining the temperature of the base film at a second temperature range higher than the first temperature range. The method according to claim 1, wherein the method of forming the metal thin film layer is plasma sputtering. The method according to claim 1, wherein the second temperature range is 15 to 40 ° C higher than the first temperature range. The method of claim 1, wherein the first temperature range is from -10 to 0 占 폚; And the second temperature range is 15 to 25 占 폚. The double-sided metal laminated film according to claim 1, further comprising a step of vacuum-drying the substrate film in a vacuum tank in a reduced pressure range of 10 ^-4 to 10 ^-2 Torr for at least 40 hours prior to step S 1 Gt; The method of manufacturing a double-side metal laminated film according to claim 1, further comprising the step of performing a plasma treatment on the base film in a vacuum of 10 ^-6 to 10 ^-3 Torr prior to the step of S1. The method according to claim 1, wherein the metal thin film layer is a Ni / Cr alloy tie layer having a Ni content of 80 to 95 wt% and a thickness of 50 to 500 Å and serving as a conductive layer; Or a Cu-seed layer having a thickness of 500 Å to 1500 Å. The double-sided metal laminated film produced by the method of claim 1, wherein the thickness deviation of the metal thin film layer formed on the first and second surfaces is less than 1%. The method of claim 8, wherein the metal thin film layer is a tie layer of a Ni / Cr alloy having a Ni content of 80 to 95 wt% and a thickness of 50 to 500 Å and serving as a conductive layer; Or a Cu-seed layer having a thickness of 500 to 1500 ANGSTROM.

Images