KR101694178B1 - Light Emitting Device - Google Patents

Abstract

The light emitting device according to the embodiment has a curved third pad formed between the light emitting chip and the soldering pad for connecting the ESD device to improve the insulation effect on the driving power.

Description

[0001] Light Emitting Device [0002]

The present invention relates to a light emitting device, and more particularly, to a light emitting device that prevents a short circuit of a driving power supplied to a light emitting chip while reducing the size of the package.

An LED (Light Emitting Device) that generates light by using an energy band gap of an active layer provided between an N-side nitride and a P-side nitride of a semiconductor can be used not only for living lights such as conventional fluorescent lamps, incandescent lamps, T5, A backlight unit for providing white light has been replaced.

Currently, LEDs are required to be smaller in package size and are required to have higher light intensity.

If the size of the package is to be reduced while the LED is outputting a higher amount of light, it is necessary to take measures to prevent short-circuiting of the direct current driving power supplied to the LED in the inner space of the very narrow package.

The embodiment provides a light emitting device that improves the insulating effect between a plurality of soldering pads.

A light emitting device according to an embodiment of the present invention includes a body having a cavity, a first pad mounted on a bottom surface of the body, for mounting the light emitting chip, a first pad spaced from the first pad on the bottom surface, A second pad, a plurality of soldering pads for connecting the light emitting chip and the ESD element in the first pad and the second pad, and a third pad formed between the first pad and the second pad; And the soldering pads may be arranged adjacent to the third pad.

Here, the third pad is nonconductive and may be formed of one of epoxy, silicon oxide, and PSR (Photo Solder Resistor).

It is also preferable that the third pad has the shortest distance from the plurality of soldering pads.

In addition, a straight line hole may be formed which has the shortest distance between the rim of the third pad and the rim of each soldering pad.

The embodiment provides a light emitting element that maximizes the insulation effect of a soldering pad for mounting a light emitting chip and an ESD element.

In the embodiment, a hole is formed between the solder pad and the third pad so that a short of the positive voltage and the negative voltage, which are defined by the third pad, can be suppressed as much as possible.

1 is a perspective view of a light emitting device according to a first embodiment,
2 is an enlarged view of region A in Fig. 1,
3 is a view of another embodiment of the third pad shown in FIG. 1,
4 is a reference to a third pad according to the second embodiment,
FIG. 5 is a perspective view of a backlight unit according to a first embodiment of the present invention in which the light emitting devices according to the embodiment are arranged in an array,
FIG. 6 is a perspective view of a backlight unit according to a second embodiment of the present invention in which light emitting devices according to the embodiment are arranged in an array, and FIG.
7 is a perspective view of an example in which the light emitting device according to the embodiment is applied to a lighting device.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on", "under", or "on" Quot; on ", " under ", " upper ", and lower " lower " directly "or" indirectly "through " another layer, or structure ".

Further, the description of the positional relationship between the respective layers or structures is referred to the present specification or the drawings attached hereto.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a light emitting device according to a first embodiment viewed from above, and FIG. 2 is an enlarged view of a region A of FIG.

1 and 2, a light emitting device according to an embodiment includes a body 20 having a cavity 20 and a bottom surface 11 for mounting the light emitting chip 30 and the ESD element 40 And an upper electrode 50 which is formed in the upper part of the body 10 and is formed along the outer surface of the body 10 in a lattice shape. Although not shown in the drawing, the lower electrode is provided on the lower side of the body, and the upper electrode 50 and the lower electrode (not shown) supply a positive voltage and a negative voltage to the light emitting chip 30, Thereby causing the chip 30 to generate light.

The light emitting chip 30 and the ESD element 40 are mounted on the bottom surface 11 and three soldering pads 51, 52 and 53 are provided for electrically connecting the light emitting chip 30 and the ESD element 40 . The soldering pad 53 and the soldering pad 52 are provided for connecting the ESD element 40 to the first pad 12 and the second pad 13 and the soldering pad 51 is provided for connecting the light emitting chip 30 And is connected to the second pad 13. Here, the ESD element 40 may be an element such as a zener diode, a varistor, and a TVS (Transient Voltage Suppression DIODE).

The first pad 12 is electrically connected to the upper electrode 50 and the second pad 13 is electrically connected to the lower electrode (not shown). The upper electrode 50 and the lower electrode are electrically connected to the anode and the cathode, .

The soldering pads 51 and 53 are located on the second pad 13 and are in electrical connection with the second pad 13. The soldering pad 51 is located on the first pad 12 and is in electrical connection with the first pad 12.

A third pad 15 is formed between the first pad 12 and the second pad 13 to electrically isolate the first pad 12 and the second pad 13 from each other. The third pad 15 may be formed by applying a non-conductive material between the first pad 12 and the second pad 13 on the bottom surface 11. Preferably, the third pad 15 may be formed by applying one of epoxy, silicon oxide, and PSR (Photo Solder Resistor) to the bottom surface 11.

On the other hand, the third pad 15 may be formed in the form of a curve having a radius of curvature between the soldering pads 51, 52 and 53. The rim of the third pad 15 is formed so that the distances between the edges of the soldering pads 51, 52 and 53 and the shortest distances d1, d2 and d3 are the same. To this end, the third pad 15 forms a curve between the soldering pads 51, 53 and the soldering pad 52. 2, the shortest distance d1 between the rim of the third pad 15 and the rim of the soldering pad 51, the shortest distance d2 between the rim of the third pad 15 and the rim of the soldering pad 52, And the shortest distance d3 between the edge of the third pad 15 and the edge of the soldering pad 53 may all have the same value. The soldering pads 51, 52 and 53 are all arranged in the neighborhood of the third pad 15 so that the soldering pads 51, 52 and 53 are arranged in the shortest distance equal to the rim of the third pad 15 . Of course, d1, d2, and d3 of the light emitting device according to the embodiment need not be all the same value. However, when d1, d2, and d3 all have the same value, each of the soldering pads 51, 52, and 53 can maintain a certain distance, It is ideal. At this time, the third pad 15 can electrically partition the first pad 12 and the second pad 13 while maintaining a constant width d4.

 Here, the width d4 of the third pad 15 may be 40 占 퐉, 50 占 퐉, or more. However, if the width d4 is set too narrow, the first pad 12 and the second pad 13 may be too close to each other to electrically short-circuit. Preferably, the width d4 is 50 m To 1000 [mu] m.

In the present embodiment, the width of the third pad 15 may decrease or increase from the upper side of the body 10 where the upper electrode 50 is located to the lower side. The width of the third pad 15 may be varied in consideration of electrical interference between the first pad 12 and the second pad 13.

The cavity 20 may be filled with an encapsulating material. The encapsulant to be filled in the cavity 20 according to the wavelength of the light emitted from the light emitting chip 30 may include a phosphor. For example, if it is assumed that the light emitted from the light emitting chip 30 is light having a blue wavelength range and that white light is emitted from the light emitting device according to the embodiment, the cavity 20 may be filled with an encapsulant including a yellow fluorescent material In this case, the blue light emitted from the light emitting device according to the embodiment may be excited by the yellow phosphor to emit white light.

Here, the encapsulant may be formed by filling a single phosphor with a single layer, filling it with a plurality of layers, or filling a plurality of phosphors with a single layer or a plurality of layers. However, the present invention is not limited thereto.

Meanwhile, in the first embodiment shown and described with reference to FIGS. 1 and 2, the width d4 of the third pad 15 can be varied in width for ease of design and manufacture. For example, the width d4 may be formed in a direction closer to the direction of the soldering pads 51, 52, 53, or in a direction away from the direction of the soldering pads 51, 52, 53, .

3 shows a reference to another embodiment of the third pad shown in Fig.

Referring to FIG. 3, the soldering pads 51 and 53 are vertically disposed on the second pad 13, and the soldering pad 52 is positioned on the first pad 12.

3, the third pad 15 is formed vertically from the upper side to the lower side, and the soldering pad 52 and the soldering pad 53 are connected to each other And may be formed in a curve from the neighboring region to the right lower end. This is because the shortest distance d6 between the soldering pad 51 and the third pad 15 and the shortest distance d7 between the soldering pad 53 and the third pad 15 and the shortest distance d6 between the soldering pad 52 and third And the shortest distance d8 formed by the pads 15 have the same or substantially similar values. Therefore, the third pad 15 is curved to maintain d7 = d8, and a straight line can be formed for the soldering pad 51 which is arranged independently.

4 shows a reference diagram for a third pad according to the second embodiment.

The description of the light emitting chip, the body, the cavity, the bottom surface, and the upper electrode, the lower electrode, and the ESD element of the light emitting device in FIG. 4 is the same as that of the light emitting chip 30, the body 10, Reference numerals and explanations for the surface 11, the cavity 20, the upper electrode 50, the lower electrode (not shown), and the ESD element 40 will be used. In the description of FIG. 4, reference numerals of the light emitting chip 30 and the ESD element 40 are the same as those shown in FIG.

4, the soldering pads 151 and 153 are located on the second pad 113, the soldering pads 152 are located on the first pad 112, and the soldering pads 151 and 153 and the soldering pads 152, the third pad 115 is formed. The third pad 115 may be formed of an insulating material of epoxy, silicon oxide, or various other materials, and may preferably be formed of a photo solder resistor (PSR). The third pads 115 may have the shortest distances from the edges of the respective soldering pads 151, 152, and 153, or may be formed similarly. The third pad 115 can electrically insulate the first pad 112 and the second pad 113 while maintaining a constant width d9. Here, the width d9 may be formed to be 40 占 퐉, 50 占 퐉, or more. However, if the width d9 is set too narrow, the first pad 112 and the second pad 113 may be too close to each other to cause a short. Preferably, the width d9 is in the range of 50 to 1000 Mu] m.

On the other hand, the third pad 115 may have holes 161, 162, and 163 for insulation in one region. The holes 161, 162, and 163 may be disposed on a straight line that forms the shortest distance between the rim of each of the soldering pads 151, 152, and 153 and the rim of the third pad 115. The holes 161, 162 and 163 are formed in such a manner that when the soldering pads 151, 152 and 153 are soldered to the light emitting chip 30 or the ESD element 40, The third pad 115 does not move toward the third pad 115. For this purpose, the holes 161, 162 and 163 are in the form of holes which are not subjected to a separate plating process.

FIG. 5 is a perspective view of a backlight unit according to a first embodiment of the present invention, in which the light emitting devices according to the embodiment are arranged in an array.

5, the backlight unit includes a lower receiving member 200, a light emitting device module 210 for outputting light, a light guide plate 220 disposed adjacent to the light emitting device module 210, and a plurality of optical sheets (not shown) . ≪ / RTI > A plurality of optical sheets (not shown) may be placed on the light guide plate 220.

The light emitting device module 210 may be formed as an array by mounting a plurality of light emitting devices 211a to 211n on the printed circuit board 212. As the printed circuit board 212, an FPCB (Flexible PCB), a MCPCB (Metal Core PCB), or an FR4 PCB may be used. In addition, the printed circuit board 212 can be manufactured in various shapes according to the structure of the backlight assembly as well as the rectangular plate shape.

The light guide plate 220 changes the light emitted from the light emitting devices 211a to 211n into a planar light source to provide a liquid crystal display panel (not shown), uniformizes the luminance distribution of light provided from the light guide plate 220, (Not shown) for reflecting the light emitted toward the rear of the light guide plate 220 by the light guide plate 220 may be positioned on the back surface of the light guide plate 220.

6 shows a perspective view of a second embodiment of a backlight unit constructed by arranging the light emitting elements according to the embodiment in an array.

6 illustrates a vertical type backlight unit. Referring to FIG. 6, the backlight unit may include a lower receiving member 350, a reflector 320, a plurality of light emitting device modules 340, and a plurality of optical sheets 330 have.

At this time, the light emitting device module 340 can be mounted on the printed circuit board 342 so that the plurality of light emitting devices 344a to 344n can be arrayed easily.

On the other hand, when a plurality of protrusions are formed on the bottom surface of the light emitting devices 344a to 344n and the light emitting devices 344a to 344n are formed of those emitting light of R, G, and B colors to form white light, The color mixing effect of red light, green light and blue light can be improved. Of course, even when the light emitting elements 344a to 344n emit only white light, the white light can be uniformly emitted and emitted by the projections on the bottom surface.

The reflector 320 can reduce light loss by using a plate having a high light reflectivity. The optical sheet 330 may include at least one of a brightness enhancement sheet 332, a prism sheet 334, and a diffusion sheet 336.

The diffusion sheet 336 directs the light incident from the light emitting elements 344a to 344n to the front of the liquid crystal display panel (not shown) and diffuses the light so as to have a uniform distribution over a wide range to form a liquid crystal display panel ). The prism sheet 334 serves to vertically emit light that is obliquely incident on the prism sheet. That is, at least one prism sheet 334 may be disposed below the liquid crystal display panel (not shown) to vertically convert the light emitted from the diffusion sheet 336. The brightness enhancement sheet 332 transmits light parallel to its transmission axis and reflects light perpendicular to the transmission axis.

Further, the light emitting device according to this embodiment can be applied to a lighting apparatus.

An example in which the light emitting device according to the present embodiment is applied to the illumination device will be described with reference to Fig.

7, the lighting apparatus 500 includes a light-emitting element 501a to 501n arranged on one side of a light-emitting element 502 and a light-emitting element 501a, To 501n are provided.

Fig. 7 illustrates a fluorescent lamp type light bulb. However, the light emitting device according to the present exemplary embodiment is not limited to the general bulb type, FPL type, fluorescent lamp type, halogen lamp type, metal lamp type, and various other types and socket standards.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: body 11: bottom surface
12: first pad 13: second pad
15: third pad 20: cavity
30: light emitting chip 40: ESD element
50: upper electrode 51, 52, 53: soldering pad

Claims (12)

A body having a cavity;
A first pad provided on a bottom surface of the body for mounting the light emitting chip;
A second pad spaced apart from the first pad on the bottom surface and mounting the ESD element;
A plurality of soldering pads for connecting the light emitting chip and the ESD device in the first pad and the second pad;
A third pad formed between the first pad and the second pad; And
And a hole provided between the third pad and the plurality of soldering pads,
And the soldering pads are arranged adjacent to the third pad. The method according to claim 1,
The third pad may include:
And a width of 40 占 퐉 or more and 1000 占 퐉 or less. The method according to claim 1,
The third pad may include:
Epoxy, silicon oxide, and PSR (Photo Solder Resistor). The method according to claim 1,
The third pad may include:
The shortest distance to the plurality of soldering pads being the same as the shortest distance. The method according to claim 1,
The third pad may include:
And a curved portion formed on the bottom surface with a width. 6. The method of claim 5,
The third pad may include:
And the width decreases from one side toward the other side. The method according to claim 1,
Wherein the plurality of soldering pads include:
Wherein at least one of the first pads is provided,
And at least two of the second pads are provided. 8. The method of claim 7,
The third pad may include:
And a shortest distance between the solder pads and one of the solder pads is equal to a distance from the solder pads arranged on the second pads. delete The method according to claim 1,
The hole
And a light emitting element provided on a straight line that forms a shortest distance between a rim of the third pad and a rim of each soldering pad. A display device comprising the light emitting element according to any one of claims 1 to 8 and 10. A lighting apparatus comprising the light emitting element according to any one of claims 1 to 8 and 10.

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