KR101682520B1 - Inspection apparatus and method - Google Patents

Abstract

Proposed are an apparatus and a method for inspecting an object to be processed, for variously inspecting defects of the object in one apparatus when the defects of the object is inspected, which includes: a support unit for supporting an object to be processed; a removing unit arranged at an upper side of the support unit to remove a portion of a film formed at an upper part of the object by using a laser beam; an inspecting unit arranged at the upper side of the support unit to transmit and receive a signal by making contact to a device of the object; an optical arranged at the upper side of the support unit and toward the inspecting unit to observe the inspecting unit; and a control unit for controlling a movement of the inspecting unit by using an image observed at the optical unit.

Description

[0001] DESCRIPTION [0002] Inspection apparatus and method [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus, and more particularly, to an inspection apparatus capable of variously inspecting defects of an object to be treated in a single apparatus in inspecting defects of the object to be processed, .

BACKGROUND ART A flat panel display device such as a liquid crystal display (LCD) or an organic light emitting display (OLED) has a lower substrate and an upper substrate facing each other. A liquid crystal layer, an organic layer, Lt; / RTI > In the lower substrate, a plurality of gate lines and data lines are formed in a matrix structure, and a plurality of pixels are formed therebetween. In order to individually drive the pixels, an operation element such as a thin film transistor, for example, a switching element is formed for each pixel.

On the other hand, if various defects such as a foreign matter adhering to a pixel, a gate line, a data line, a thin film transistor, or the like are generated during the process of manufacturing the flat panel display, the corresponding pixel does not operate normally. Accordingly, when a plurality of pixels, a gate line, a data line, a thin film transistor, and the like are formed on a lower substrate of a flat panel display, a defect of the lower substrate is inspected and a series of processes of repairing the confirmed defect is performed.

Conventionally, various processes for inspecting defects of a substrate have been performed in different apparatuses instead of one apparatus, and the efficiency of the process has been lowered, thereby lowering the productivity of the entire process.

KR 10-2015-0042759 A KR 10-2004-0104015 A

The present invention provides an inspection apparatus and a method for inspecting an object to be inspected, which can inspect defects of an object to be processed in various apparatuses in one apparatus.

The present invention provides an inspection apparatus and a method for inspecting an object to be inspected, which can generate and classify and store various defect information of an object to be processed simultaneously or sequentially.

An inspection apparatus according to an embodiment of the present invention includes: a support portion configured to support an object to be processed; A remover disposed above the support and capable of selectively removing a portion of the film formed on the object using the laser beam; An inspection unit disposed above the support unit and configured to be able to transmit and receive a signal in contact with the element of the object to be processed; An optical unit disposed above the supporting unit toward the inspection unit and observing the inspection unit; And a control unit configured to control the movement of the inspection unit using an image observed by the optical unit.

A first observation unit disposed above the support unit and capable of generating at least one of image information and component information of the object using an electron beam; And a second observation unit disposed above the support unit and capable of generating three-dimensional image information of the object to be processed at a lower magnification than the first observation unit.

A table on which the support portion is located; And a mounting part installed on the table, wherein the removing part, the inspection part, the optical part, the first observation part and the second observation part are mounted and supported.

The inspection unit may include a plurality of probes arranged to be inclined downward toward the support unit.

The controller generates end coordinates of the probe from the image of the probe observed by the optical unit, determines whether or not the probe and the object to be processed are in contact with each other by comparing the end coordinates of the probe with the reference coordinates, And an operation controller for controlling the movement of the probe using the probe.

Wherein the control unit comprises: a collecting unit for receiving information generated by the first observation unit and the second observation unit; And a storage unit for receiving and storing information classified by the collecting unit.

Wherein the first observation portion includes: a column in which a vacuum is formed; An electron beam emitter formed inside the column to emit an electron beam to the object to be processed; And a signal detector formed inside the column to obtain at least one of an electron and an X-ray emitted from the object to be processed.

A method for inspecting an object to be processed according to an embodiment of the present invention includes the steps of: preparing an object to be inspected having an inspection region; Irradiating the object with a laser beam to expose at least a part of the operation element of the inspection area or the operation element connected to the inspection area; Contacting the probe to the exposed position; And checking the operation of the operating element through the probe.

The step of contacting the probe includes: moving the probe to the exposure position; Observing the motion of the probe with an optical unit; Generating an end coordinate of the probe from the image of the probe observed in the optical unit; Determining whether the probe is in contact with the end coordinates and the reference coordinates; And controlling movement of the probe using the result of the contact determination.

The step of checking the operation of the operating element may include a step of directly transmitting and receiving a signal to and from the operating element with the probe and checking whether the operating element is operating.

And checking the defective inspection area by observing the object to be treated prior to the process of preparing the object.

Emitting the electron beam to the inspection region after the process of preparing the object to be processed; Collecting a signal emitted from the inspection region by the electron beam; And generating defect information including at least one of image information and component information of the object to be processed in the inspection region using the signal.

And generating three-dimensional image information of the object to be inspected in the inspection region as defect information after the process of preparing the object to be processed.

And receiving and classifying at least one of the defect information in the inspection area and the inspection result of the operating device.

A process of repairing a defect using stored defect information, and a process of tracking and improving a defect generation process using stored defect information.

According to the embodiment of the present invention, it is possible to inspect defects of the object to be treated in various ways in one apparatus, and various defect information of the object to be processed can be simultaneously generated or generated in order and classified and stored. Can be improved. In addition, the stored defect information can be utilized in a process of repairing a defect, and can be utilized in a process of tracking and improving the cause of a defect.

For example, when the present invention is applied to a process for manufacturing various display devices, image information, component information, three-dimensional image information of a defective area of a substrate, and whether an element connected to a defective area or a defective area are operated simultaneously or continuously . At this time, whether or not the device operates can directly transmit and receive the device and the signal, and can be more accurately inspected.

In the case of existing test devices, there was no device capable of inspecting the electrical transistor characteristics (I _d -V _g graph) of each of the devices that are to be inspected during the in-line process, It was possible to confirm the characteristics indirectly or only whether the device was open or shorted. On the other hand, when the inspection apparatus according to the embodiment of the present invention is used, since the transistor characteristics of each element can be accurately checked, it is possible to determine whether the V _th shift or I _off shift It is possible to inspect even minute changes in the characteristics of the device.

Therefore, the efficiency of inspection can be improved, and the generated defect information can be classified, stored, and converted into a database. In addition, it is possible to efficiently repair the defects by utilizing the defect information, and to track and improve the cause of the defect. From this, the efficiency and the productivity of the entire process can be remarkably improved.

1 and 2 are views for explaining a testing apparatus according to an embodiment of the present invention.
3 to 5 are diagrams for explaining a method of inspecting an object to be processed according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various forms. It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS The drawings may be exaggerated or enlarged to illustrate embodiments of the invention, wherein like reference numerals refer to like elements throughout.

FIG. 1 is a schematic view showing an inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a partially enlarged view showing an inspection unit of an inspection apparatus according to an embodiment of the present invention. 4 is a schematic diagram showing a process of inspecting an operation of an object to be processed to which an embodiment of the present invention is applied, FIG. 3 is a flowchart showing a method of inspecting a material to be inspected according to an embodiment of the present invention. FIG.

First, to describe the embodiment of the present invention, the first axis, the second axis and the third axis are defined as follows. The first axis may be an axis extending in one direction on a reference plane parallel to a predetermined plane on which the sample is supported, and is defined as an x-axis. The second axis may be an axis extending in a direction intersecting with one direction on the reference plane, and is defined as a y-axis. The third axis may be an axis extending in a direction crossing the reference plane, which is defined as a z-axis. Of course, the definitions of the above axes are for the purpose of illustration of the present invention and are not intended to be limiting. Accordingly, the first axis to the third axis can be variously changed.

Next, a testing apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 to 4. Fig. The inspection apparatus is an apparatus for inspecting defects of an object to be processed 10 and includes a support unit 200, a removal unit 400, an inspection unit 500, an optical unit 600 and a control unit 900, , A mounting portion 300, a first observation portion 700, and a second observation portion 800. [ The inspection apparatus can inspect the defects of the object 10 in various ways in one apparatus and can generate and classify and store various defect information of the object 10 simultaneously or in sequence. The stored defect information can subsequently be utilized in the defect repairing process and can be used for tracking and improving the defective process.

The object to be processed 10 may be a lower substrate of a liquid crystal display device and a plurality of gate lines a and data lines b may be formed in a matrix structure on an upper side of the object 10, The pixel c may be formed. In order to individually drive each pixel c, for example, a thin film transistor may be formed as an operating element A in each pixel c. Of course, the object to be processed 10 is not limited to the above, and a process of manufacturing various electronic devices in a process of manufacturing various display devices including a LCD, an OLED, and an LED, a solar cell, Or may be a wafer or a glass panel.

The table 100 may be a block having a predetermined thickness and area, for example, having a top surface formed in a flat plate shape. The table 100 serves to stably support the structure of the inspection apparatus. The support portion 200 may be positioned on the upper surface of the table 100.

The supporting portion 200 may be formed to support the object 10 and may be a plate type stage having a supporting surface of a predetermined shape and size capable of supporting the object to be processed 10, . The supporting part 200 is provided with a lift pin (not shown) or a vacuum chuck (not shown) to stably support the object 10 and clamping means (not shown) Can be accurately aligned to the positions defined by the first axial direction and the second axial direction. The support part 200 may be installed on the upper surface of the table 100 and may be fixed on the upper surface of the table 100 so as to be movable in the first axis direction, the second axis direction and the third axis direction .

The mounting portion 300 may be installed on the upper surface of the table 100. The removal unit 400, the inspection unit 500, the optical unit 600, the first observation unit 700, and the second observation unit 800 may be mounted and supported on the mounting unit 300. The mounting portion 300 may be formed to be movable in the first axis direction, the second axis direction, and the third axis direction and may be provided on the upper surface of the table 100 or may be formed to be movable in the first axis direction and the second axis direction. And may be installed on the upper surface of the table 100 or may be installed on the upper surface of the table 100 and fixed in position. Meanwhile, when the mounting portion 300 is formed to be movable in the first axis direction and the second axis direction, the movement in the third axis direction may be controlled by the support portion 200. [

For example, when the support portion 200 is installed on the upper surface of the table 100 and its position is fixed, the mounting portion 300 is formed to be movable in the first axis direction, the second axis direction, and the third axis direction And may be installed on the upper surface of the table 100.

On the other hand, when the support portion 200 is installed on the upper surface of the table 100 so as to be movable in the first axial direction, the second axial direction and the third axial direction, the mounting portion 300 is provided on the upper surface of the table 100 And its position can be fixed. Of course, the above-described method is only an example for relatively moving the support part 200 and the mounting part 300 relative to each other. In addition to the above-described method, any method for relatively moving the support part 200 and the mounting part 300 relative to each other may be applied.

The mounting portion 300 may include a first shaft member 310, a second shaft member 320, a moving block 330, and a third shaft member 340. The first shaft members 310 may extend in the first axis direction and may be installed at both side edges of the table 100 in the second axis direction away from each other in the second axis direction. The first shaft member 310 serves to move the second shaft member 320 in the first axial direction. The second shaft member 320 may extend in the second axial direction, and both end portions of the first shaft member 310 may be mounted on the first shaft member 310, respectively. The second shaft member 320 serves to move the moving block 330 in the second axial direction. A plurality of moving blocks 330 are provided, and may be mounted on the second shaft member 320 so as to be movable in the second axial direction.

The third shaft member 340 is formed to extend in the third axial direction and may be mounted to the moving block 330, respectively. The inspection unit 500, the optical unit 600, the first observation unit 700, and the second observation unit 800 are mounted on the third shaft member 340, respectively. The shape of the third shaft member 340 can be variously changed and any one of the plurality of third shaft members 340 is formed in a plate type so that the inspection unit 500 and the optical unit 600 can be easily mounted . The third shaft member 340 serves to move the inspection unit 500, the optical unit 600, the first observation unit 700, and the second observation unit 800 in the third axis direction. The first shaft member 310, the second shaft member 320, the moving block 330, and the third shaft member 340 for movement in the first axial direction, the second axial direction, and the third axial direction, For example, the structure and the manner of the linear motor can be applied to each of the detailed structures and methods.

The removing unit 400 is disposed on the upper side of the support unit 200 and can be mounted on the second shaft member 320 so as to be movable in the second axis direction. The removing unit 400 may be formed to selectively remove a part of the film formed on the object 10 using the laser beam. For example, the remover 400 includes a laser beam oscillator (not shown) for irradiating a laser beam, a wavelength shutter (not shown) for passing or blocking a laser beam corresponding to the wavelength, (Not shown) for polarizing the laser beam, a polarizer (not shown) for polarizing the laser beam, and a beam splitter (not shown) for forming the focus of the laser beam. The removal unit 400 establishes process parameters such as the laser beam power, wavelength, and processing method in consideration of the thickness and component information of the film to be processed of the material to be processed 10, It is possible to selectively remove a desired film from among a plurality of films formed on the upper side of the object to be processed 10. The configuration of the removing unit 400 is one example for explaining the removing unit 400, and the configuration of the removing unit 400 may be variously changed according to the type of the laser beam, the wavelength range, and the like.

The inspection part 500 is disposed on the upper side of the support part 200 and can be mounted on the third shaft member of the plate type so as to be movable in the third axial direction. The inspection unit 500 can be formed to be able to transmit and receive signals in contact with elements of the object 10 to be processed.

The inspection unit 500 may include an inspection unit body 510, a probe block 520, and a probe 530. A plurality of inspection unit bodies 510 may be mounted to the third shaft member so as to be movable in the third axis direction. The upper portion of the inspection body 510 may be formed in a block shape and the lower portion may be formed in a plate shape so that the probe block 520 can be mounted. For example, two probe blocks 520 may be mounted on any one of the plurality of inspection unit bodies 510a, and one probe block 520 may be mounted on the remaining 510b of the plurality of inspection unit bodies. A plurality of probe blocks 520 are disposed radially and may be mounted on the lower portion of the examination unit body 510 so as to be movable in at least one of a first axis direction and a second axis direction. The probe 530 may be mounted on the probe block 520 so as to be inclined downward toward the support part 200. A plurality of probes 530 may be provided, for example, three probes 530 may be spaced apart from each other. Of course, the number of probes 530 can be variously changed corresponding to the number of electrodes of the operation element A to which the probes 530 are contacted.

The optical unit 600 may be disposed on the upper side of the support unit 200 toward the inspection unit 500 and may be disposed on the upper side of the position where the ends of the probes 530 are gathered, for example. The optical unit 600 serves to observe the movement of the inspection unit 500 and may be, for example, an optical microscope or an image sensor. The manner in which the optical unit 600 observes the movement of the inspection unit 500 is as follows. For example, the focus of the optical part 600 is formed on the operating element A of the object 10 to be inspected. When the probe 530 moves in the third axial direction to contact the operating element A and approaches the operating element A at a distance of several micrometers, e.g., 3 占 퐉 to 5 占 퐉, the focal point of the optical part 600 The probe 530 is switched. When the focus is switched to the probe 530, the observed image is transmitted to the controller 900 and used for generating the end coordinates of the probe 530. [

The first observation unit 700 is disposed on the upper side of the support unit 200 and can be mounted on the third shaft member 340 so as to be movable in the third axis direction. The first observation unit 700 may be configured to generate at least one of image information and component information of the object 10 to be processed using an electron beam and includes a column 710, an electron beam emitter 720, a signal detector 730 ), A holder 740, and a transmission window 750.

The column 710 extends in the third axis direction, and a predetermined vacuum is formed therein, and an electron beam transmitting portion may be formed on one side. The inside of the column 710 can be controlled to a predetermined vacuum so that the electron beam can be generated and accelerated. The electron beam emitter 720 may be formed inside the column 710 to emit an electron beam to the article 10 to be processed. The electron beam emitter 720 includes electron emitting means 721 for emitting electrons to the electron beam transmitting portion side of the column 710 and electron collecting means 720 for focusing the electrons emitted from the electron emitting means 721 in the form of a beam to the electron beam transmitting portion side of the column 710 And a lens module 722 for accelerating the lens.

The signal detector 730 may be formed inside the column 710 to obtain at least one of the electrons and X-rays emitted from the object to be processed 10, A first detector 731 for detecting electrons such as reflected electrons collected into the interior of the column 710 and a second detector 732 for detecting X-rays emitted from the object 10 and collected into the column 710 ). The first detector 731 may be, for example, a semiconductor detector, and may be disposed within the column 710 to align with the electron beam transmission portion of the column 710. The central region of the first detector 731 is penetrated in the third axis direction so that the electron beam can pass through. The reflected electrons collected into the column 710 are acquired by the first detector 731, and the electric current generated from the reflected electrons is utilized for generating the image information of the object 10 to be processed. The second detector 732 may include an energy dispersive X-ray spectroscopy detector (EDS detector) and may be disposed within the column 710 to face the electron beam transmissive portion side of the column 710 have. The energy intensity and the detection frequency of the X-rays detected by the second detector 732 are subjected to quantitative analysis and qualitative analysis to be utilized for generating the component information of the object 10 to be processed.

The holder 740 is detachably mounted to the electron beam transmission portion of the column 710 to maintain the internal vacuum of the column 710. A through hole is formed in the central region of the holder 740 and can be hermetically sealed to mount the transmission window 750. The transmission window 750 serves to pass electron beams, electrons, and X-rays, and may be a conductive wafer such as a silicon wafer or a silicon carbide wafer. A via hole having a width of several microns to several hundreds of microns is formed in the central region of the transmission window 750, and a predetermined membrane such as a silicon nitride film having a thickness of several nm to several hundreds of nm may be provided to seal the via hole. The electron beam passes through the membrane and is emitted to the object to be processed 10, and reflection electrons and X-rays can be collected into the inside of the column 710.

The second observation part 800 is disposed on the upper side of the support part 200 and can be mounted on the third shaft part 340 so as to be movable in the third axis direction. The second observation unit 800 may be formed to generate three-dimensional image information of the object 10 at a lower magnification than the first observation unit 700, and may be, for example, a 3D optical microscope or a 3D image sensor.

The control unit 900 is connected to each component of the inspection apparatus and is provided to control the overall operation of the inspection unit. In particular, it is possible to control the movement of the inspection unit 500 using the image observed by the optical unit 600 And can be formed so as to sort and store the information generated by the first observation unit 700 and the second observation unit 800 and the inspection results of the inspection unit 500.

The control unit 900 may include an operation control unit 910, a collecting unit 920, and a storage unit 930. The operation control unit 910 generates end coordinates of the probe 530 from the image of the probe 530 observed in the optical unit 600 and generates the end coordinates of the probe 530 by comparing the end coordinates of the probe 530 with the reference coordinates, It is possible to determine whether or not the object to be processed 10 is in contact with the electrodes of the operation element A and to control the movement of the probe 530 using the determination result. Here, the reference coordinates may be coordinates in the first axis direction and the second axis direction of the respective electrodes of the operation element A to which the probe 530 desires to contact.

The principle that the operation control unit 910 determines whether the probe 530 is in contact is as follows. For example, while the probes 530 are aligned on the upper side of the operating element A and move in the third axis direction and approach the operating element A side, the end coordinates of the probe 530 coincide with the reference coordinates. On the other hand, when the probes 530 are brought into contact with the respective electrodes of the operating element A, the ends of the probes 530 move by several μm or several nm in at least one of the first axial direction and the second axial direction do. Therefore, when the probe 530 contacts the operating element A of the object 10, the end coordinates of the probe 530 are different from the reference coordinates. In this case, the operation control unit 910 determines that the probe 530 has contacted the operation element A and stops the movement of the probe 530. [

According to the above-described method, since the optical unit 600 is disposed on the upper side of the probe 530, it is possible to accurately determine whether the probe 530 is in contact with the probe 530 even if the measurement depth thereof can not have a high magnification.

The collecting unit 920 receives the information generated by the first observing unit 700 and the second observing unit 800 and the inspection result information of the inspector 500 and classifies the received information. For example, morphological information of defects can be generated from the image information generated in the first observation unit 700 and classified into each type. In addition, qualitative information on defects can be generated from the component information generated in the first observation unit 700, and classified into types. Further, by using the three-dimensional image information generated by the second observation unit 800, accurate positions of defects in the first axis direction, the second axis direction, and the third axis direction can be generated and classified by position , The exact position of the defect in the third axis direction can be known, and it can be accurately known which defect among the plurality of films formed on the lower side of the article to be processed 10 is located. In addition, it is possible to generate the defect information using the inspection result information generated by the inspection unit 500, and to classify the defective defect information into whether the defective defect is caused by operation of the operation element A in the inspection area or the operation element A connected to the inspection area. The defect information may be collected in a collecting unit 920, then input to a storage unit 930, and stored in a single table.

Next, a method for inspecting an object to be inspected according to an embodiment of the present invention will be described with reference to Figs. 1 to 5. Fig. At this time, contents overlapping with the above description of the inspection apparatus will be omitted or briefly explained.

A method for inspecting an object to be inspected according to an embodiment of the present invention includes the steps of: preparing an object to be inspected having an inspection area; irradiating a laser beam to the object to be inspected, A step of exposing a part of the probe, a step of contacting the probe to the exposed position, and a step of checking the operation of the operating element through the probe. In this case, the process may further include observing the object to be treated prior to the process of preparing the object to be inspected, thereby confirming the defective inspection region.

In addition, a process of discharging an electron beam to an inspection region, a process of collecting a signal emitted from an inspection region by an electron beam, and a process of collecting a signal to be processed in an inspection region And generating at least one of image information and component information. The method may further include the step of generating three-dimensional image information of the object to be inspected in the inspection area after the process of preparing the object to be processed.

The defects of the object 10 to be inspected are inspected and an inspection area is confirmed (S100). Automated Optical Inspection (AOI) method can be applied to this process. When the inspection area is confirmed, the article to be processed 10 is provided on the support 200 (S200).

Signals are collected using an electron beam in the inspection area of the object to be processed 10, and the first defect information of the inspection area is generated using the collected signals (S300). For example, the first observation portion 700 is positioned above the inspection region, and the electron beam is emitted to the inspection region. And collects signals such as electrons and X-rays emitted from the inspection region by the electron beam, and generates image information and component information in the inspection region using the collected signals. And generates first defect information from the image information and component information of the inspection area. Therefore, the first defect information may include both morphological information and qualitative information of defects generated in the inspection area.

Dimensional image information of the inspection region of the object to be processed 10, and generates second defect information of the inspection region using the generated three-dimensional image information (S400). For example, the second observation section 800 is positioned above the inspection region, and the second observation section 800 is used to generate a three-dimensional image of the inspection region. And generates second defect information from the three-dimensional image of the inspection area. Accordingly, the second defect information may include position information in the first axis direction, the second axis direction, and the third axis direction of the defect generated in the inspection area.

Fig. 4 (a) is a schematic view showing a cross section of an operation element A, for example, a thin film transistor formed on an object 10 to be processed. Referring to FIGS. 3 and 4 (a), a sectional structure and an operation method of the operation element A will be described below. A gate electrode 11 is formed on the object 10 to be processed and a gate insulating film 12 is formed on the gate electrode 11 and a channel 13 is formed on the gate insulating film 12 A source 14 is formed on one side of the upper surface of the channel 13 and a drain 15 is formed on the other side of the channel 13. A passivation 16 is formed on top of the channel 13, the source 14 and the drain 15. The gate electrode 11 is connected to the gate line A, the source 14 is connected to the data line b and the drain 15 is connected to the pixel c. When a signal is applied to the gate electrode 11, the channel 13 electrically connects the source 14 and the drain 15, and the pixel c can be operated by receiving a signal from the data line b .

(S500) at least a part of the operation element (A) by irradiating a laser beam to the operation element (A) of the inspection area or the operation element (A) connected to the inspection area. A plurality of holes h are formed by irradiating a laser beam in the direction from the upper side of the operation element A toward the gate electrode 11, the source 14 and the drain 15, The gate electrode 11, the source 14 and the drain 15 are exposed to the upper side of the operation element A as shown in Fig.

The probe 530 is brought into contact with the exposed position of the operating element A (S600). For example, the inspection unit 500 is moved above the exposure position of the operation element A, and the probes 530 are aligned above the exposure position. The probe 530 is moved in the third axial direction and the probe 530 is moved to the exposure position and the movement of the probe 530 is observed with the optical unit 600. [ When the focal point of the probe 530 is formed in the optical unit 600, the end coordinate of the probe 530 is generated from the image of the probe 530 to be observed, and whether or not the probe 530 is in contact with the reference coordinate . At this time, when the end coordinates of the probe 530 are different from the reference coordinates, it is determined that the probe 530 is in direct contact with the exposed positions of the gate electrode 11, the source 14, and the drain 15. And controls the movement of the probe 530 using the contact determination result. That is, if it is determined that the probe 530 is in direct contact with the exposed position of the gate electrode 11, the source 14 and the drain 15, the movement of the probe 530 is stopped. A state in which the probe 530 is in direct contact with the exposed position of the gate electrode 11, the source 14 and the drain 15 is shown in Fig.

The operation of the operation element A is checked through the probe 530, and the third defect information is generated therefrom (S700). For example, the probe 530 directly transmits / receives a signal to / from the operating element A to check whether the operating element A operates. In the above method, the inspection voltage V is applied to the gate electrode 11, the source 14 and the drain 15 of the operation element A and the current I is measured to determine the current value It is judged that the operating element A normally operates if it is included in the range of the appropriate current value and it is judged that the operating element A does not operate normally when the measured current value is out of the range of the corrected current value have. The operating element A generates the third defect information from the operation inspection result. Therefore, the third defect information may include, as defect information, the operation state of the operation element A in the inspection area or the operation element A connected to the inspection area.

According to another aspect of the present invention, there is provided a method of inspecting an inspection region using an electron beam, comprising the steps of: generating a three-dimensional image of an inspection region and inspecting the inspection region; The operation of directly inspecting the operation of the operation element A connected to the operation element A is not particularly limited. For example, the order of the above-described processes may be variously changed in addition to the order shown in FIG. 5, and the above-described processes may be performed at the same time.

The defect information of the inspection area generated in each of the processes is input, classified, and stored (S800). This process can be performed in the control unit 900. Subsequently, it is possible to perform at least one of repairing defects using the stored defect information, and tracking and improving the defect creation process using the stored defect information.

The stored defect information can be utilized in the subsequent defect repairing process. That is, in the process of repairing defects, it is possible to determine whether or not the defects are repaired using defect information in the inspection area, and perform efficient repair in response to the determination. For example, if the defect of the inspection position is confirmed in the first defect information and the second defect information but the operation of the operation element A is confirmed in the third defect information, the defect can not be repaired, If it is confirmed that the operation element A is not operated in the third defect information, a process of repairing the defect may be performed. At this time, the repair facility and the method may be determined to correspond to the first defect information and the second defect information .

In addition, the stored defect information can be utilized in the process of tracking and improving the defect generating process. For example, if the first defect information in the inspection area is analyzed and the iron component is identified at a predetermined position in the inspection area, the process related to the iron component is determined as the defect process, and the corresponding process is tracked. Can be identified and improved. Alternatively, when the first defect information and the second defect information in the inspection area are analyzed and it is ascertained that the foreign substance adheres to the drain 15 of the operation element A, the step of forming the operation element A is referred to as a cause of defect It is possible to track problems of the process and improve the process.

It should be noted that the above-described embodiments of the present invention are for the purpose of illustrating the present invention and not for the purpose of limitation of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims and their equivalents. You will understand.

100: Table 200: Support
300: mounting part 400: removing part
500: inspection part 600: optical part
700: second inspection part 800: second observation part
900:

Claims (15)

A support formed to be able to support the object to be processed;
A remover disposed above the support and capable of selectively removing a portion of the film formed on the object using the laser beam;
An inspection unit disposed above the support unit and configured to be able to transmit and receive a signal in contact with the element of the object to be processed;
An optical unit disposed above the supporting unit toward the inspection unit and observing the inspection unit; And
And a control unit configured to control the movement of the inspection unit using an image observed by the optical unit,
Wherein the control unit controls the operation of the removal unit to form a hole in the element of the object to be processed and expose the gate electrode, the source and the drain of the element upward. The method according to claim 1,
A first observation unit disposed above the support unit and capable of generating at least one of image information and component information of the object using an electron beam; And
And a second observation unit disposed above the support unit and capable of generating three-dimensional image information of the object to be processed at a lower magnification than the first observation unit. The method of claim 2,
A table on which the support portion is located; And
And a mounting unit installed on the table and mounted with the removal unit, the inspection unit, the optical unit, the first observation unit, and the second observation unit mounted thereon. The method according to any one of claims 1 to 3,
Wherein the inspection unit includes a plurality of probes arranged to be inclined downward toward the support unit. The method of claim 4,
Wherein,
The end portion of the probe is generated from an image of the probe observed by the optical portion, and whether or not the probe and the object to be processed are in contact with each other is determined by comparing the end coordinates of the probe with the reference coordinates, And an operation control unit for controlling the movement of the probe. The method according to claim 2 or 3,
Wherein the control unit comprises: a collecting unit for receiving information generated by the first observation unit and the second observation unit; And
And a storage unit for receiving and storing information classified by the collecting unit. The method according to claim 2 or 3,
Wherein the first observation portion
A column in which a vacuum is formed;
An electron beam emitter formed inside the column to emit an electron beam to the object to be processed; And
And a signal detector formed inside the column so as to obtain at least one of an electron and an X-ray emitted from the object to be processed. A process of preparing an object to be inspected whose inspection area is identified;
A step of irradiating a laser beam onto the object to be processed to form a hole in the operation element connected to the inspection area or the operation element connected to the inspection area and exposing the gate electrode, the source and the drain of the operation element upward;
Contacting the probe to an exposed position of the operating element; And
And inspecting an operation of the operating element through the probe. The method of claim 8,
The process of contacting the probe includes:
Moving the probe to the exposure position;
Observing the motion of the probe with an optical unit;
Generating an end coordinate of the probe from the image of the probe observed in the optical unit;
Determining whether the probe is in contact with the end coordinates and the reference coordinates; And
And controlling the movement of the probe using the result of the contact determination. The method of claim 8,
Wherein the step of inspecting the operation of the operating element comprises:
And transmitting a signal directly to and from the operating element with the probe to check whether the operating element is operating. The method of claim 8,
Before the process of preparing the object to be processed,
And inspecting the object to be inspected to identify a defective inspection area. The method of claim 8,
After the process of preparing the object to be processed,
Emitting the electron beam to the inspection area;
Collecting a signal emitted from the inspection region by the electron beam; And
And generating defect information including at least one of image information and component information of the object to be processed in the inspection region using the signal. The method of claim 8,
After the process of preparing the object to be processed,
And generating three-dimensional image information of the object in the inspection area as defect information. The method according to claim 12 or 13,
And a step of receiving, classifying and storing at least one of defect information in the inspection area and inspection result of the operating element. 15. The method of claim 14,
A defect repairing step of repairing defects using stored defect information, and a defect inspecting step of defect defect inspecting step using stored defect information.

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