KR101678159B1 - Composition of adhesive for wood-block - Google Patents
Composition of adhesive for wood-block Download PDFInfo
- Publication number
- KR101678159B1 KR101678159B1 KR1020140182625A KR20140182625A KR101678159B1 KR 101678159 B1 KR101678159 B1 KR 101678159B1 KR 1020140182625 A KR1020140182625 A KR 1020140182625A KR 20140182625 A KR20140182625 A KR 20140182625A KR 101678159 B1 KR101678159 B1 KR 101678159B1
- Authority
- KR
- South Korea
- Prior art keywords
- wood
- weight
- parts
- adhesive
- block
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C5/00—Pavings made of prefabricated single units
- E01C5/14—Pavings made of prefabricated single units made of wooden units
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/30—Presence of wood
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
본 발명은 폐목재 등을 파쇄한 우드칩을 이용하여 우드블럭을 제조하는데 사용되는 우드블럭용 접착제 조성물에 관한 것으로, 보다 상세하게는 우드블럭용 접착제 조성물에 있어서, 접착제 조성물 총량에 대하여, 목분 10~12중량부, 폴리에틸렌 글리콜(PEG) 45~55중량부, 글리세린(GL) 20~24중량부, 에틸렌글리콜(EG) 13~23중량부, 촉매제 0.1~0.2중량부를 포함하여 이루어지며, 반응온도 140~150℃, 반응시간 40~50분의 물리적 성질을 가지는 우드블럭용 접착제 조성물이 개시된다. The present invention relates to an adhesive composition for a wood block, which is used for producing a wood block using a wood chip obtained by shredding waste wood, etc. More particularly, the present invention relates to an adhesive composition for a wood block, And 20 to 24 parts by weight of glycerin (GL), 13 to 23 parts by weight of ethylene glycol (EG) and 0.1 to 0.2 parts by weight of a catalyst, and the reaction temperature An adhesive composition for a wood block having physical properties of 140 to 150 DEG C and a reaction time of 40 to 50 minutes.
Description
본 발명은 폐목재 등을 파쇄한 우드칩을 이용하여 우드블럭을 제조하는데 사용되는 우드블럭용 접착제 조성물에 관한 것이다.
The present invention relates to an adhesive composition for a wood block, which is used for producing a wood block using a wood chip obtained by shredding waste wood or the like.
일반적으로 목재를 이용하는 블럭은 통목재를 절단하여 블럭형태로 적용하거나, 목재를 잘게 파쇄하여 칩형태로 가공한 후 접착제와 혼합한 후 압축하여 블럭형태로 성형하게 된다.In general, a block using wood is cut into a block form by cutting a tubular wood or finely crushed into chips, mixed with an adhesive, and compressed to form a block.
그러나, 일반적인 우드블럭의 경우 그 형태 유지 및 강도유지를 위하여 접착제를 과도하게 혼합하게 되어 투수율이 현저하게 저하되는 경우가 대부분이었다. However, in the case of a general wood block, the adhesive is excessively mixed in order to maintain its shape and maintain its strength, and the permeability is remarkably lowered in most cases.
이러한 문제로 인하여 투수율을 높여주기 위한 다양한 방법들이 제시되고는 있으나, 우드칩이 썩게되는 문제점이 발생하게 되었고, 따라서 다양한 종류의 방부제가 첨가되는 것이다. Due to these problems, various methods for increasing the water permeability have been suggested, but wood chips have become rotten and various kinds of preservatives are added.
이러한 우드블럭 제조기술은 대한민국 등록특허 제10-0886838호 및 대한민국 등록특허 제10-0912953호 및 대한민국 등록특허 10-1452380호 등에 개시되어 있다. 그러나, 상기 특허들은 목재파쇄물과 접착제를 혼합하여 블럭형태로 성형하는 기술을 개시한 것으로, 사용되는 접착제는 통상사용되는 것으로 사용되는 접착제의 반응온도, 반응시간이 길어 생산성이 낮은 단점이 있었다. This wood block manufacturing technique is disclosed in Korean Patent No. 10-0886838, Korean Patent No. 10-0912953, and Korean Patent No. 10-1452380. However, the above-mentioned patents disclose a technique of molding wood chips and an adhesive into a block shape, and the adhesive used is usually used, and the adhesive used has a disadvantage in that the reaction temperature and reaction time of the adhesive are so long that the productivity is low.
또한, 완성된 구조체의 경우 강도유지를 위해 사용되는 접착제를 과도하게 투여하여 투수력이 저하되는 친환경 자재로 적용하기는 난해한 문제점도 있었다.
Further, in the case of the finished structure, it has been difficult to apply the adhesive used for maintaining the strength to an environmentally friendly material with reduced permeability.
본 발명에서는 상기한 문제점들을 해소하기 위하여 안출한 것으로서, 접착제를 구성함에 목분에 포함된 성분을 글리세린과 폴리에틸렌글리콜에 추출시켜 알파, 베타피넨, 리모닌 등 피톤치드와 같은 인체에 유익한 성분이 포함되어 친환경적이고, 방부효과를 가지며, 우드칩과 동일한 성분이 접착제에 포함되게 함으로써 접착력이 증대되고, 촉매를 사용함으로써 반응온도를 종래 접착제보나 낮은 온도와 짧은 반응시간을 가지게 함으로서 생산성을 높일 수 있는 우드블럭용 접착제 조성물을 제공하는 것을 그 해결과제로 한다.
The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a glue composition which comprises components extracted from glycerin and polyethylene glycol by extracting components of wood flour containing phytoncide such as alpha, betapinene, and limonin, It has an antiseptic effect and has the same effect as that of wood chip. It can increase the adhesive force by using the same component as wood chip. By using the catalyst, it is possible to increase the productivity by increasing the reaction temperature, It is an object of the present invention to provide an adhesive composition.
상기한 과제를 해결한 본 발명의 우드블럭용 접착제 조성물은 The adhesive composition for a wood block of the present invention, which solves the above problems,
우드블럭용 접착제 조성물에 있어서, 접착제 조성물 총량에 대하여, 목분 10~12중량부, 폴리에틸렌 글리콜(PEG) 45~55중량부, 글리세린(GL) 20~24중량부, 에틸렌글리콜(EG) 13~23중량부, 촉매제 0.1~0.2중량부를 포함하여 이루어지며, 반응온도 140~150℃, 반응시간 40~50분의 물리적 성질을 가지는 것을 특징으로 한다.(EN) A wood block adhesive composition comprising 10 to 12 parts by weight of wood powder, 45 to 55 parts by weight of polyethylene glycol (PEG), 20 to 24 parts by weight of glycerin (GL), and 13 to 23 parts by weight of ethylene glycol And 0.1 to 0.2 parts by weight of a catalyst, and has a physical property of a reaction temperature of 140 to 150 ° C. and a reaction time of 40 to 50 minutes.
여기서, 상기 촉매제는 황산(H2SO4), 산화알루미늄(Al2O3), 이산화규소(SiO2)를 포함하여 구성되며, 황산, 산화알루미늄, 이산화규소는 1:0.3:0.3의 중량비로 구성되어 이루어지는 것을 특징으로 한다. The catalyst comprises sulfuric acid (H 2 SO 4 ), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), sulfuric acid, aluminum oxide and silicon dioxide in a weight ratio of 1: 0.3: 0.3 As shown in FIG.
여기서, 상기 목분은 5㎜이하의 입도를 가지는 것을 특징으로 한다. Here, the wood powder has a particle size of 5 mm or less.
여기서, 상기 에틸렌 글리콜은 모노 에틸렌글리콜(Monoethylene Glycol), 디 에틸렌글리콜(Diethylene Glycol), 트리에틸렌글리콜(Triethylene Glycol)로 이루어진 군에서 선택되는 어느 하나인 것을 특징으로 한다.
Here, the ethylene glycol may be any one selected from the group consisting of monoethylene glycol, diethylene glycol, and triethylene glycol.
본 발명의 접착제 조성물은 MDF합판등에 사용되는 요소수지 등을 사용하지 않고 친환경 소재를 사용함으로써 작업도중 역한냄새가 발생하지 않아 작업자의 작업환경을 개선하는 효과를 가진다. The adhesive composition of the present invention does not use a urea resin or the like used for MDF plywood and the like and uses an eco-friendly material, so that it does not generate a strong smell during the operation, thereby improving the working environment of a worker.
또한, 본 발명은 촉매를 사용함으로써 반응온도를 기존에 사용되는 접착제의 반응온도 170~190℃, 반응시간 60~120분을 반응온도 140~150℃, 반응시간 40~50분으로 낮출수 있어 생산성이 향상되는 효과가 있다. Further, by using the catalyst, the reaction temperature can be lowered to 170-190 ° C for a conventional adhesive and 60-120 minutes for a reaction temperature to 140-150 ° C for a reaction time of 40-50 minutes, Is improved.
또한, 본 발명은 목분이 함유됨으로써 우드칩과 동일한 성분이 접착제에 포함되어 접착력이 증대되고, 목분에 포함된 성분인 알파, 베타피넨, 리모닌 등 피톤치드와 같은 인체에 유익한 성분이 글리세린과 폴리에틸렌글리콜에 추출되게 됨으로 친환경적 자재를 제공할 수 있는 효과가 있으며, 별도의 방부제를 첨가하지 않아도 방부효과를 가지는 효과를 가진다.
In addition, the present invention is characterized in that the same ingredients as the wood chips are contained in the adhesive to increase the adhesive strength by containing the wood chips, and the components beneficial to the human body such as phytoncide such as alpha, betapinene and limonin, which are components contained in wood flour, are glycerin and polyethylene glycol So that it is possible to provide an environmentally friendly material, and it has an effect of preserving effect even if no additional preservative is added.
이하, 본 발명을 보다 구체적으로 설명하기로 한다. Hereinafter, the present invention will be described in more detail.
본 발명은 폐목재 등을 파쇄한 우드칩을 이용하여 우드블럭을 제조하는데 사용되는 우드블럭용 접착제 조성물에 관한 것이다.The present invention relates to an adhesive composition for a wood block, which is used for producing a wood block using a wood chip obtained by shredding waste wood or the like.
본 발명에 따라 제공되는 우드블럭용 접착제 조성물은 목분, 폴리에틸렌글리콜(PEG), 글리세린(GL), 에틸렌글리콜(EG), 촉매제를 포함하여 이루어지며, 바람직하게 접착제 조성물 총량에 대하여, 목분 10~12중량부, 폴리에틸렌 글리콜(PEG) 45~55중량부, 글리세린(GL) 20~24중량부, 에틸렌글리콜(EG) 13~23중량부, 촉매제 0.1~0.2중량부를 포함하여 이루어지며, 반응온도 140~150℃, 반응시간 40~50분의 물리적 성질을 가지는 것에 그 기술적 특징이 있다. The adhesive composition for a wood block provided according to the present invention comprises wood powder, polyethylene glycol (PEG), glycerin (GL), ethylene glycol (EG) and a catalyst, And 20 to 24 parts by weight of glycerin (GL), 13 to 23 parts by weight of ethylene glycol (EG), and 0.1 to 0.2 parts by weight of a catalyst, 150 ° C, and a reaction time of 40 to 50 minutes.
본 발명에 따르면, 상기 촉매제는 황산(H2SO4), 산화알루미늄(Al2O3), 이산화규소(SiO2)를 포함하여 구성되며, 황산, 산화알루미늄, 이산화규소는 1:0.3:0.3의 중량비로 구성되어 이루어지는 것을 특징으로 한다. According to the present invention, the catalyst comprises sulfuric acid (H 2 SO 4 ), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), sulfuric acid, aluminum oxide and silicon dioxide in a ratio of 1: 0.3: 0.3 By weight.
본 발명에 따르면, 상기 목분은 5㎜이하의 입도를 가지는 것을 사용하며, 바람직하게는 2㎜이하의 입도를 가지는 것을 사용하는 것이 좋으며, 보다 바람직하게는 0.1~2㎜의 입도를 가지는 것을 사용하는 것이 더욱 좋다. 만일, 5㎜이상의 입도를 가지는 것을 사용할 경우 우두칩과의 반응성이 떨어져 접착력이 저하되는 문제점을 가진다. 한편으로는 접착성, 에너지효율 증대 등의 우수한 효과를 가지기 위하여는 2㎜이하의 입도를 가지는 목분을 사용하는 것이 좋다. According to the present invention, the wood powder having a particle size of 5 mm or less is used, and it is preferable to use a wood powder having a particle size of 2 mm or less, more preferably a particle size of 0.1 to 2 mm It is better. If a powder having a particle size of 5 mm or more is used, the reactivity with the wax chip is deteriorated and the adhesive force is deteriorated. On the other hand, it is preferable to use wood flour having a particle size of 2 mm or less in order to obtain excellent effects such as adhesion and energy efficiency.
본 발명에 따르면, 상기 에틸렌 글리콜은 모노에틸렌글리콜(Monoethylene Glycol), 디에틸렌글리콜(Diethylene Glycol), 트리에틸렌글리콜(Triethylene Glycol)로 이루어진 군에서 선택되는 어느 하나를 사용하며, 보다 바람직하게는 말단에 OH기가 많은 것을 사용하는 것이 반응성이 빠르고 좋다. According to the present invention, the ethylene glycol may be any one selected from the group consisting of monoethylene glycol, diethylene glycol, and triethylene glycol, and more preferably, Use of a compound having a large number of OH groups is preferable because of its high reactivity.
한편, 본 발명에 사용되는 목분의 함량은 접착제 총량에 대하여 10~12중량부를 사용하는 것이 바람직한데, 만일 상기 임계치를 벗어날 경우에는 우드칩과의 반응성이 저하되어 접착성이 저하되는 문제가 있을 수 있다. On the other hand, the amount of wood flour used in the present invention is preferably 10 to 12 parts by weight based on the total amount of the adhesive. If the wood flour exceeds the above-mentioned threshold value, the reactivity with the wood chip is lowered, have.
이하, 본 발명을 바람직한 실시예를 들어 보다 상세히 설명하기로 한다. 단, 하기의 실시예는 본 발명을 설명하기 위한 예시로서 하기의 실시예로 본 발명을 한정하는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to preferred embodiments. However, the following examples are provided for illustrative purposes only and are not intended to limit the scope of the present invention.
<접착제 조성물 구성><Composition of adhesive composition>
하기 표 1에 나타낸바와 같은 구성비를 가지도록 접착제조성물을 준비하였다. 혼합단위는 중량부이다. An adhesive composition was prepared so as to have the composition ratios shown in Table 1 below. The mixing unit is parts by weight.
상기 표 1에서 목분은 입도 0.1~2㎜를 만족하는 목분을 사용하였다.In Table 1, wood powder having a particle size of 0.1 to 2 mm was used.
[실시예 1][Example 1]
상기 표 1에서 준비된 조성물 1로 이루어진 접착제를 사용하여 우드칩과 조성물1을 배합한 후, 금형틀에 주입한 다음, 반응온도 140~150℃, 반응시간 40~50분으로 하여, 통상의 방법에 따라 우드블럭을 제조하여, 제조된 우드블럭의 물성을 테스트하여 보았다. 그 결과는 하기 표 2에 나타내었다. The wood chip and the composition 1 were mixed using the adhesive 1 composed of the composition 1 prepared in the above Table 1, and then the mixture was injected into a mold, and the reaction was carried out at a reaction temperature of 140 to 150 ° C and a reaction time of 40 to 50 minutes. Wood block was manufactured and the physical properties of the manufactured wood block were tested. The results are shown in Table 2 below.
이때, 사용된 조성물 1로 되는 접착제 조성물은 우드칩 100중량부에 대하여 50중량부를 사용하였다. At this time, the adhesive composition used as the composition 1 was used in an amount of 50 parts by weight based on 100 parts by weight of wood chips.
[실시예 2][Example 2]
상기 표 1에서 준비된 조성물 2로 이루어진 접착제를 사용하여 우드칩과 조성물2를 배합한 후, 금형틀에 주입한 다음, 반응온도 150℃, 반응시간 40분으로 하여, 통상의 방법에 따라 우드블럭을 제조하여, 제조된 우드블럭의 물성을 테스트하여 보았다. 그 결과는 하기 표2에 나타내었다.The wood chip and the composition 2 were mixed using the adhesive composition 2 prepared in the above Table 1, and then the mixture was injected into a metal mold. Then, a wood block was prepared according to a conventional method at a reaction temperature of 150 ° C and a reaction time of 40 minutes And the physical properties of the wood block were tested. The results are shown in Table 2 below.
이때, 사용된 조성물 2로 되는 접착제 조성물은 우드칩 100중량부에 대하여 40중량부를 사용하였다.At this time, 40 parts by weight of the adhesive composition used as the composition 2 was used for 100 parts by weight of wood chips.
[비교예 1][Comparative Example 1]
통상 사용되는 접착제수지를 사용한 대한민국등록특허 제10-1452380호에 개시된 <실시예 2>의 방법으로 우드블록을 제조한 후, 그 우드블록의 물성을 비교하여 보았으며,그 결과는 하기 표 2에 나타내었다. A wood block was prepared by the method of Example 2 disclosed in Korean Patent No. 10-1452380 using a commonly used adhesive resin and then the physical properties of the wood block were compared and the results are shown in Table 2 Respectively.
상기 표 2의 각각의 물성시험값은 시험편을 3개 준비하고, KS규정에 따라 시험하고 평균한 값을 나타낸 것이다. The test results of the respective properties in Table 2 are obtained by preparing three test pieces and testing and averaging them according to KS regulations.
그 결과, 본 발명에서 제공되는 접착제 조성물을 사용할 경우, 친환경 접착제를 이용하여 비교예 1의 물성에 가까운 매우 우수한 물성을 가지는 우드블럭을 제공할 수 있음을 알게 되었다. As a result, it was found that when using the adhesive composition provided in the present invention, it is possible to provide a wood block having very good physical properties close to the physical properties of Comparative Example 1 by using an environmentally friendly adhesive.
Claims (4)
접착제 조성물 총량에 대하여, 목분 10~12중량부, 폴리에틸렌 글리콜(PEG) 45~55중량부, 글리세린(GL) 20~24중량부, 에틸렌글리콜(EG) 13~23중량부, 촉매제 0.1~0.2중량부를 포함하여 이루어지며, 반응온도 140~150℃, 반응시간 40~50분의 물리적 성질을 가지되, 상기 촉매제는 황산(H2SO4), 산화알루미늄(Al2O3), 이산화규소(SiO2)를 포함하여 구성되며, 황산, 산화알루미늄, 이산화규소는 1:0.3:0.3의 중량비로 혼합되어 이루어지는 것을 특징으로 하는 우드블럭용 접착제 조성물.
In the adhesive composition for a wood block,
10 to 12 parts by weight of wood powder, 45 to 55 parts by weight of polyethylene glycol (PEG), 20 to 24 parts by weight of glycerin (GL), 13 to 23 parts by weight of ethylene glycol (EG) (H 2 SO 4 ), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), silicon dioxide (SiO 2 ) and the like, and the catalyst has a physical property of a reaction temperature of 140 to 150 ° C. and a reaction time of 40 to 50 minutes. 2 ), and sulfuric acid, aluminum oxide, and silicon dioxide are mixed in a weight ratio of 1: 0.3: 0.3.
상기 목분은 5㎜이하의 입도를 가지는 것을 특징으로 하는 우드블럭용 접착제 조성물.
The method according to claim 1,
Wherein the wood powder has a particle size of 5 mm or less.
상기 에틸렌 글리콜은 모노 에틸렌글리콜(Monoethylene Glycol), 디 에틸렌글리콜(Diethylene Glycol), 트리에틸렌글리콜(Triethylene Glycol)로 이루어진 군에서 선택되는 어느 하나인 것을 특징으로 하는 우드블럭용 접착제 조성물.The method according to claim 1,
Wherein the ethylene glycol is any one selected from the group consisting of Monoethylene Glycol, Diethylene Glycol, and Triethylene Glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140182625A KR101678159B1 (en) | 2014-12-17 | 2014-12-17 | Composition of adhesive for wood-block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140182625A KR101678159B1 (en) | 2014-12-17 | 2014-12-17 | Composition of adhesive for wood-block |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160073819A KR20160073819A (en) | 2016-06-27 |
| KR101678159B1 true KR101678159B1 (en) | 2016-11-21 |
Family
ID=56344448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140182625A KR101678159B1 (en) | 2014-12-17 | 2014-12-17 | Composition of adhesive for wood-block |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101678159B1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003525997A (en) * | 2000-03-09 | 2003-09-02 | エイティーオー・フィンドレー・インコーポレーテッド | Water dispersible hot melt adhesive based on sulfonated copolyester |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867864A (en) * | 1994-08-30 | 1996-03-12 | Koyo Sangyo Kk | Adhesive for sliced veneer |
| KR100912953B1 (en) | 2007-05-25 | 2009-08-20 | 최영곤 | Wood block using wood powder and method for manufacturing the same |
| KR100886838B1 (en) | 2008-07-03 | 2009-03-04 | (주)간삼파트너스 종합건축사사무소 | Woodchips and structural materials using prepreg of powder and chips of woods |
| KR101452380B1 (en) | 2014-03-28 | 2014-10-22 | (주)신화금속 | Eco woodblock and method of making it |
-
2014
- 2014-12-17 KR KR1020140182625A patent/KR101678159B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003525997A (en) * | 2000-03-09 | 2003-09-02 | エイティーオー・フィンドレー・インコーポレーテッド | Water dispersible hot melt adhesive based on sulfonated copolyester |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160073819A (en) | 2016-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY150816A (en) | Reactive polyarylene ether and method for the manufacture thereof | |
| MX2020012102A (en) | An antimicrobial composition. | |
| CN101513744A (en) | Aldehyde-free environment-friendly flame-retardant plywood and a preparation method thereof | |
| CN105171886A (en) | Method for producing fiberboard containing ultramicro amount of residual formaldehyde | |
| CN106189884A (en) | Glue | |
| KR101678159B1 (en) | Composition of adhesive for wood-block | |
| WO2022097014A1 (en) | Lignin-based bonding resin | |
| KR102039313B1 (en) | The method for manufacturing and composition the same elastic paving material of eco-friendly water-soluble coating composition for surface enhancement of Cork Chips | |
| US20150298347A1 (en) | Wood polymer/plastic composite material available for direct connection construction and method for manufacturing same | |
| EP2679649A1 (en) | Additive for increasing toughness of marble glue | |
| JP5147881B2 (en) | Spray binder composition | |
| CN107446538B (en) | Silanol-based double-component waterborne polyurethane wood adhesive and preparation method thereof | |
| CN103627331B (en) | Waterproof waterborne adhesive and preparation method thereof | |
| CN106118506A (en) | Sealant | |
| JP6043696B2 (en) | Wood board manufacturing method | |
| CN105885818B (en) | Guanidine gum fracturing fluid crosslinking agent and the preparation method and application thereof | |
| CN105802519A (en) | Wood-plastic material binder for building construction | |
| CN105295809A (en) | Environmentally friendly carton adhesive added with aromatic agent | |
| CN106675475A (en) | Adhesive for automobile part processing | |
| CN104004481B (en) | A kind of porcelain glass cement and preparation method thereof | |
| KR101930536B1 (en) | method of manufacturing square lumber type artificiality dunnage and square lumber type artificiality dunnage | |
| CN104004468B (en) | Stalk board water-fast modifying agent of inorganic adhesive and preparation method thereof | |
| CN104446286B (en) | Raw material formula of bronzy sculpture | |
| CN106189985A (en) | Wood glue and preparation method thereof | |
| CN106752408A (en) | A kind of plates of automobile stamping parts surface anticorrosion processes coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20191031 Year of fee payment: 4 |