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KR101669212B1 - Light emitting diode possible color temperature adjustment and manufacturing method thereof - Google Patents

Light emitting diode possible color temperature adjustment and manufacturing method thereof Download PDF

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Publication number
KR101669212B1
KR101669212B1 KR1020150117854A KR20150117854A KR101669212B1 KR 101669212 B1 KR101669212 B1 KR 101669212B1 KR 1020150117854 A KR1020150117854 A KR 1020150117854A KR 20150117854 A KR20150117854 A KR 20150117854A KR 101669212 B1 KR101669212 B1 KR 101669212B1
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KR
South Korea
Prior art keywords
led
wiring
lens
leds
color temperature
Prior art date
Application number
KR1020150117854A
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Korean (ko)
Inventor
장일호
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장일호
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Priority to KR1020150117854A priority Critical patent/KR101669212B1/en
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Publication of KR101669212B1 publication Critical patent/KR101669212B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00—Lighting devices or systems producing a varying lighting effect
    • F21S10/02—Lighting devices or systems producing a varying lighting effect changing colors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to an LED capable of adjusting color temperature and brightness, and more particularly, to an LED having a light source and LEDs having two or more color temperatures different from each other, The present invention relates to an LED capable of adjusting the color temperature and adjusting the brightness of the LED so that the entire color temperature can be controlled by adjusting the brightness of the LED to be mixed evenly without color accumulation.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED capable of adjusting color temperature and a manufacturing method thereof,

The present invention relates to an LED capable of adjusting color temperature and a method of manufacturing the same, and more particularly, to an LED having two or more color temperatures different from each other in surface contact with a metal substrate or a ceramic substrate, The present invention relates to an LED capable of controlling various color temperatures by separately driving LEDs having different color temperature and a manufacturing method thereof.

LED light that can adjust color temperature can realize various color temperature by mixing monochromatic LED light source having different color temperature on a PCB and driving them individually. However, since the LED light source size and the surface mount size are increased on the PCB, the color clouding and ring phenomenon are severely generated when the color temperature is adjusted, and thus it is difficult to use the LED as a spotlight requiring condensation.

Also, when the total luminous flux (lm) emitted from the LED is transmitted and reflected through the lens due to the size of the LED light source and the size of the surface mounted on the PCB, the total luminous flux lt; RTI ID = 0.0 > lm. < / RTI >

To solve this problem, a method of increasing the size of the LED lamp or increasing the power consumption is used. However, such a spotlight lamp has a problem in that its size increases, power consumption increases, and manufacturing cost rises.

Korean Patent Publication No. 10-2007-0120367 (December 24, 2007)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide an LED capable of adjusting the color temperature with high power and high efficiency while having a simple structure.

It is another object of the present invention to provide a light emitting diode (LED) light source having different color temperatures by individually driving LEDs having different color temperatures at the time of lighting by configuring two or more LEDs having different color temperatures on one metal substrate or ceramic substrate And a method of manufacturing the same.

It is another object of the present invention to provide a light emitting diode (LED) light source having two or more color temperatures different from each other by combining a silicone lens having a high transmittance and a translucent light- And an LED capable of controlling the color temperature so that the LEDs are mixed evenly when the color temperature is adjusted, and a method of manufacturing the same.

It is still another object of the present invention to provide a spotlight lamp which can reduce the size of a secondary lens of a luminaire by combining a silicon lens having a narrow angle of refraction and a reflection angle of a silicon lens on an LED light source, It is possible to make a spotlight lamp required to reflect light evenly on the reflecting surface of the reflector and to obtain a spot light demanded by the total luminous flux lm emitted from the LED light source (LEDs) and a method of manufacturing the same, which can reduce the total luminous flux (lm) when reaching a spot, and is capable of controlling the color temperature with high output and high efficiency while being small in size.

According to an aspect of the present invention, there is provided an LED capable of controlling a color temperature, the LED having at least two LEDs printed with connection wires, connected to the wires, and a power connection terminal electrically connected to an external power source, A connected substrate; A non-conductive protective layer configured to expose the LED on the substrate separately through the cell, to expose the power connection terminal connected to the wiring, and to cover the wiring; A diaphragm that protrudes upward to surround the cell to separate the LEDs and divides the LEDs into respective regions; A coating layer formed on an upper surface of the substrate and filling each of the regions formed by the diaphragm to seal the LED; A housing fixed to the upper surface of the coating layer by being coupled with the substrate and the protective layer and having a reflecting portion formed to be inclined along the edge of the through hole formed to expose the LED in an upward direction; And a lens which is fixedly coupled with the housing and has a lower surface in contact with the LED and a surface in which the light is reflected in a translucent manner.

The coating layer may be formed by coating each LED with a different color so as to have different color temperature arrays.

Wherein the substrate is made of a metal material or a ceramic material that accommodates the LED, an insulator is formed on the insulator, and a wiring is formed on the insulator to supply power to the LED. An LED mount disposed on the metal base and having at least one LED disposed therein; And an insulating film disposed on the lower side of the wiring, the LED supporting member being configured to cover the metal base around the LED-related member, wherein the LED mounted on the LED mounting part is electrically connected between the wires and connected to an external power connection terminal .

The protective layer may be composed of an insulator.

The LED capable of controlling the color temperature may further include at least one heat sink connected to the metal base at a lower portion of the metal base and discharging heat generated by the LED.

The lens may have a conical shape, and the top and side of the conical shape, which is the light reflecting surface, may be made semi-transparent.

The lens may have any one of semi-circular, semi-elliptical, and polygonal.

According to another aspect of the present invention, there is provided a method of manufacturing an LED capable of adjusting a color temperature, the method including: preparing a metal base by forming an insulating layer on a top surface and processing at least one fixing hole; A wiring step of forming a bridge terminal and a power connection terminal for supplying power to the LED on the upper surface of the insulating layer; Forming a top protective layer to expose through a cell corresponding to a power connection terminal and a portion where the LED is disposed; A LED mounting and bonding step of mounting an LED on a portion where the LED is disposed and electrically connecting an LED, a bridge terminal, and a power connection terminal; A diaphragm forming step of forming a diaphragm that covers the cell and protrudes upward to divide the cell on the protection layer; Forming a coating layer on the diaphragm to fill the diaphragm; Forming a housing on the protection layer such that the LED mounting portion, the bridge terminal, and the power connection terminal are exposed upward; And a lens coupling step of coupling the lens to the housing.

The coating layer may be formed by filling the diaphragm with a transparent material so that the LED, the bridge terminal, and the power connection terminal are embedded.

In the LED mounting and bonding step, the power connection terminal, the LED, and the bridge terminal may be connected by wire bonding or die bonding, respectively.

According to the present invention, since the LED is configured to be in surface contact with the metal substrate, the LED capable of adjusting the color temperature and the method of manufacturing the same having the above- Is directly emitted to the outside through the metal substrate to improve the heat radiation function.

Further, the present invention is advantageous in that the orientation angle of the white light emitted from the LED package can be easily changed by configuring the lens installed in the LED package module to be exchangeable.

In addition, according to the present invention, since the LED is formed of a matrix circuit, any one or a small number of the configured LEDs can stably provide white light of sufficient brightness even if the LED does not operate normally due to disconnection or burnout As a result, the life of the LED package module can be improved.

Accordingly, it is possible to improve the reliability and competitiveness of products in the field of illumination lamps, particularly illumination lamps and lighting products using LEDs, as well as related or similar fields.

1 is a perspective view illustrating an LED package module according to an embodiment of the present invention;
2 is an exploded perspective view of FIG. 1 according to an embodiment of the present invention.
3 is a circuit diagram illustrating an electrical connection relationship to an LED according to an embodiment of the present invention;
4 is a flow chart illustrating an embodiment of a method of manufacturing an LED package module according to the present invention.
5 to 10 are views showing a manufacturing process of an LED package module according to the present invention in the order of manufacturing.
11 is a view showing an example of a wide-angle lens according to an embodiment of the present invention.
12 is a view showing an example of a narrow-angle lens according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

1 is an exploded perspective view of an LED package module according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1 according to an embodiment of the present invention, FIG. 3 is a cross- Which is a circuit diagram illustrating the electrical connection relationship.

1 to 3, the LED package module A includes a substrate 100, a housing 200, and a lens 400.

The substrate 100 is provided with at least two LEDs 131 on its upper surface and at least two pairs of power supply terminals 150 electrically connected to an external power source.

The upper surface of the substrate 100 must be electrically isolated from the wires and terminals electrically connected to the LEDs 131 so that the insulating layer 111 having a high thermal conductivity and an extremely low electrical conductivity (near zero) Can be applied. The insulating layer 111 is provided on the lower surface of the wiring region and the area where the LED 131 is installed and is separately provided from the wiring and the terminals. Of course, when the electric conductivity of the substrate 100 is sufficiently low, the insulating layer 111 may not be applied as shown in Fig.

The power supply terminal 150 is composed of at least two pairs, that is, at least four terminals. One pair of the power supply terminals 150 is connected to the LEDs emitting color temperature of 2500K and the other pair is connected to the wiring 151 to connect to the LEDs emitting color temperature of 7000K. In addition, the adjustment of the color temperature can be adjusted corresponding to the current, that is, the current or voltage can be variably applied to adjust the color temperature of 2500K to 7000K. For example, when power is supplied to the 2500K color temperature terminal of the power supply terminal 150, the current, or the voltage, can be adjusted to 2500K to 7000K. In addition, when connected to 7000K of the power supply terminal 150, the current, or the voltage can be adjusted to be adjusted to 2500K to 7000K.

The substrate 100 may be coated with the protective layer 120 on the upper surface of the metal base 110 such that the LED mount 130 and the power supply terminal 150 are exposed upwardly. The power supply terminal 150 may be electrically connected to the wiring 151 formed on the protection layer 120. In other words, the protective layer 120 may be configured to cover the wiring 151 and the power supply terminal 150 may be configured to be exposed to the upper portion of the protective layer 120. The diaphragm 124 separating each cell 122 of the protection layer 120 exposing the LED mount 130 of the protection layer 120 is formed. The diaphragm 124 may have a constant height and may protrude upward. And the diaphragm 124, so that the light emitted from each of the LEDs 131 can minimize mutual interference. Each of the diaphragms 124 is filled with a coating layer 126, and the coating layer 126 can be painted and displayed. The diaphragm 124 is made of an impermeable material that does not transmit light and the coating layer 126 is configured to transmit light generated from the LED 131. The coating layer 126 may be formed of a transparent synthetic resin material, silicone, or the like.

The colors applied to the coating layer 126 may be coated with different colors depending on the respective LED mounting portions 130. For example, colors coated on the coating layer 126 may be coated with RGB (Red, Green, Blue) at regular intervals, or yellow and blue may be coated in a zigzag fashion. Preferably, the coating layer 126 is formed by filling the diaphragm 124 in a zigzag form with yellow and blue. On the other hand, when the blue coating layer 126 is connected in zigzag fashion, a rhombic pattern is formed, and when the yellow coating layer 126 is connected, a rhombic pattern is formed.

The housing 200 protects the LED 131 and the terminals and concentrates the light emitted from the LED 131 in a forward direction (upward direction in FIG. 1) And a groove 230 having a groove formed therein is formed to expose the LED 131 in an upward direction. The fixing of the substrate 100 and the housing 200 is performed by combining at least one fixing hole 160 formed in the edge direction of the substrate 100 with a fixture 210 having a number corresponding to the corresponding position of the housing 200 . Meanwhile, the fixing member 210 may be connected to the fixing hole 160 in a stepped shape so that the housing 200 is firmly fixed to the substrate 100, and may be firmly coupled.

The engaging portion 420 of the lens 400 is coupled to the groove 230 of the housing 200 and is disposed on the coating layer 126. The lower surface (410) of the lens (400) is made transparent so as to transmit the light emitted from the LED (131). The side surface 430 and the upper surface 440 of the lens 400 are configured to diffuse the light transmitted through the transparent lower surface 410 to spread the light emitted from the LED 131 widely. The coupling part 420 of the lens 400 is fixedly coupled to the groove 230 of the housing 200.

A bridge terminal 140 formed on an upper surface of the metal base 110 and configured to expose the LED mounting portion 130 and a power supply terminal 150 and the wiring 151 can be constituted. A protective layer 120 is formed on the LED mount 130 in a state in which the LED mount 130 is exposed. That is, in the state that the protection layer 120 is formed, the LED mounting part 130 is exposed and formed by the cell 126 which is formed in a manner corresponding to the protection layer, and the bridge terminal 140 and the wiring 151 And is positioned below the protective layer 120. The power supply terminal 150 is configured to extend from the substrate 100 to an upper portion of the protection layer 120.

In addition, the housing 200 is formed with a groove 230 formed to penetrate along the lower inner surface so that the lens 400 can be easily detached. Accordingly, the engaging portion 420 can be formed on the lower portion of the lens 400 to correspond to the groove 230. Here, the groove 230 and the engaging portion 420 may be formed to have a concavo-convex shape and be coupled to each other to be coupled in a forced fit manner. Particularly, the material of the lens 400 is made of a silicone material which is deformable by an external force so that the lens 400 can be easily coupled in an interference fit manner.

The power supply terminal 150 and the wiring 151 are electrically connected to each other on the substrate 100 on both sides of an area where the LED 131 is provided (a cell-shaped area including a plurality of LED mounting parts) When the power source is applied through the power supply terminal 150, the LED 131 emits light. The LED mounting portion 130 and the bridge terminal 140 to which the LEDs 131 are to be mounted can be formed repeatedly between the wirings 151, respectively.

The wiring 151 and the LED 131 and the LED 131 and the bridge terminal 140 are connected to each other by die bonding or wire bonding to form a plurality of The LED 131 may be connected in the form of a matrix circuit as shown in FIG.

Even when an abnormality occurs in any one of the plurality of LEDs 131 installed on the substrate 100 and the circuit is disconnected, the remaining LEDs 131 can be normally supplied with power. For example, if any one of the five LEDs connected in series at the top occurs, the four LEDs other than the one in which the abnormality has occurred normally operate.

FIG. 4 is a flow chart for explaining an embodiment of a method for manufacturing an LED package module according to the present invention, and FIGS. 5 to 10 are views showing a process for manufacturing an LED package module according to the present invention in the order of manufacturing.

4 to 10, an LED package module manufacturing method includes forming an insulating layer 111 on an upper surface of a metal base 110 to expose an LED mount 130, (Step S110). Of course, as described above, when the electrical conductivity of the substrate 100 is very low, the insulating layer 111 may not be formed.

A terminal such as the bridge terminal 140 and the power supply terminal 150 is formed on the upper surface of the insulating layer 111 as shown in FIG. 6 (step S120).

Next, as shown in FIG. 6, the protective layer 120 is formed to be fixed to the fixing hole 160 (step S130). At this time, the LED mounting portion 130 and the power connection terminal 150 are exposed to the outside of the protection layer 120. The protective layer 120 forms the diaphragm 124 around the perforated cell 122 corresponding to the LED mount 130 (step S140). Since the function of the diaphragm 124 has been described above, a description thereof will be omitted. Next, as shown in FIG. 7, the LED 131 is mounted on the LED mount 130, and the LED 131, the bridge terminal 140, and the wiring 151 are electrically connected (step S150). A coating layer 126 is formed to fill the diaphragm as shown in FIG. 8 (step S160). The housing 200 is coupled to the upper surface of the protection layer 120 as shown in FIG. 9 (step S170).

In addition, the housing 200 may be formed to be fixed to the upper portion of the substrate 100 by an insert injection method. Here, the electrical connection between the LED 131, the bridge terminal 140, and the wiring 151 can be achieved by die bonding or wire bonding.

In parallel with the steps S110 to S170, the surface of the lens 400 is processed in accordance with the set index of refraction (step S210). Then, as shown in FIG. 10, The LED package module A according to the present invention can be completed by being coupled to the housing 200 (step S300).

FIG. 11 is a view showing an example of a wide-angle lens according to an embodiment of the present invention, and FIG. 12 is a view showing an example of a narrow-angle lens according to an embodiment of the present invention.

11 and 12, the surface processing of the lens 400 is configured to make the lower surface 410 transparent, while the side surface 430 and the upper surface 440 are made translucent to form small protrusions, The light emitted from the LED 131 collected by the lower surface 410 of the LED chip 400 is diffused through the side surface 430 and the upper surface 440 to be irradiated to the outside.

The engaging portion 420 of the lens 400 thus processed is engaged with the groove 230 of the housing 200.

The LEDs 131 disposed in the cells of one LED mount 130 may be configured by arranging two or more LEDs 131 having different color temperatures of emitted light. For example, two LEDs 131 having different color temperatures are arranged in one cell, the LEDs 131 having different color temperatures are connected to each other, and two corresponding pairs of the power supply terminals 150 are arranged can do. With this configuration, the color temperature can be displayed in two ways, 2500K and 7000K. As described above, the color temperature can be adjusted by adjusting the voltage and the current, and the color temperature can be adjusted from 2500K to 7000K by configuring the switch circuit in the wiring 151 thus configured. Also, as described above, the color temperature of 2500K to 7000K can be adjusted by adjusting the voltage and the current.

That is, the LEDs having 2 to 4 color temperatures are each formed in one LED mounting part 130, and a switch circuit is formed between the respective matrix circuits to variously implement the color temperature of 2500K to 7000K, So that the color temperature of 2500K to 7000K can be represented in various ways.

The lens 400 shown in Fig. 11 is a lens configured to be widely irradiated by diffusing light emitted from the LED 131 as a wide-angle lens. In this case, a condenser refractor capable of collecting the widely illuminated light is required. When such a wide angle lens is used, there is an advantage that the color lump or the ring phenomenon is reduced. In addition, according to the configuration of the present invention, the LED light is prevented from overlapping with the diaphragm 124, and the upper surface 440 and the side surface 430 of the lens 400 are surface-treated to be translucent, It has the advantage of almost completely eliminating the ringing phenomenon. Meanwhile, as described above, the lower surface 410 of the lens 400 is processed transparently.

It is also possible to use a narrow-angle lens as shown in FIG. The coarse lens does not need a separate condenser. However, since the light irradiated from the LED is directly condensed and irradiated, it is possible to enlarge the condensed part of the light. However, according to the present invention, the LED light is prevented from overlapping with the diaphragm 124, The surface of the upper surface 442 is dispersed by the surface treatment, so that it is possible to eliminate the lump of light and the ringing phenomenon. The coarse lens may be a quadrilateral, semi-circular, semi-elliptical, or polygonal. Meanwhile, the lower surface 412 of the lens 402 is treated as described above.

The LED package module according to the present invention and its manufacturing method have been described above. It will be understood by those skilled in the art that the technical features of the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

Therefore, it is to be understood that the embodiments described above are intended to be illustrative, and not restrictive, in all respects, and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, And all equivalents and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

100: substrate 110: metal base
111: insulating layer 120: protective layer
122: cell 124: diaphragm
126: Coating layer 130: LED mounting part
131: LED 140: Bridge terminal
150: power supply terminal 151: wiring
160: Fixing hole 170:
200: housing 230: groove
400: lens 410: bottom surface
420: engaging portion 430: side
440: upper surface

Claims (11)

At least two LEDs connected to the connection wiring are mounted, a power connection terminal electrically connected to the variable external power supply is connected to the connection wiring;
A non-conductive protective layer made of an insulator, the non-conductive protective layer being configured to expose the LED through the cell on the substrate and to expose the power connection terminal in a connected state to the wiring;
A diaphragm protruding upwardly from the cell to separate the LEDs from each other and configured to be opaque so as to reduce mutual interference of light emitted from the LEDs,
A coating layer formed on the upper surface of the substrate and filling each of the regions formed by the diaphragm to seal the LED, the coating layer being composed of different colors;
A housing fixed to the upper surface of the coating layer by being coupled with the substrate and the protective layer and having a reflecting portion formed to be inclined along the edge of the through hole formed to expose the LED in an upward direction; And
The lower surface contacting with the LED is transparent, the side reflecting light is formed in a translucent manner, and the upper surface is formed into a conical shape having a narrow bottom, and a plurality of projections are formed on the side surface and the upper surface, And a lens for diffusing light transmitted through the lower surface to emit light emitted from the LED to the outside,
Wherein:
A metal base formed of a metal material that accommodates the LED, an insulator formed on the insulator, and a wiring formed on the insulator to supply power to the LED;
An LED mount disposed on the metal base and having at least one LED electrically connected to an external power connection terminal; And
And an insulating film disposed on the periphery of the LED mounting part to cover the metal base and disposed under the wiring.
delete delete delete delete delete 2. The lens of claim 1,
LED that can adjust the color temperature which is composed of either semicircular, semi-elliptical, polygonal horn.
delete delete delete delete
KR1020150117854A 2015-08-21 2015-08-21 Light emitting diode possible color temperature adjustment and manufacturing method thereof KR101669212B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032346A (en) 2004-07-16 2006-02-02 Osram Sylvania Inc Light emitting diode disk optical instrument equipped with heatsink chassis
KR101255671B1 (en) * 2012-03-08 2013-04-17 장일호 Led package module and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032346A (en) 2004-07-16 2006-02-02 Osram Sylvania Inc Light emitting diode disk optical instrument equipped with heatsink chassis
KR101255671B1 (en) * 2012-03-08 2013-04-17 장일호 Led package module and manufacturing method thereof

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