KR101625971B1 - flexible inductor and its manufacture method - Google Patents
flexible inductor and its manufacture method Download PDFInfo
- Publication number
- KR101625971B1 KR101625971B1 KR1020150065396A KR20150065396A KR101625971B1 KR 101625971 B1 KR101625971 B1 KR 101625971B1 KR 1020150065396 A KR1020150065396 A KR 1020150065396A KR 20150065396 A KR20150065396 A KR 20150065396A KR 101625971 B1 KR101625971 B1 KR 101625971B1
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- printed circuit
- circuit board
- flexible printed
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- patterns
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- 238000000034 method Methods 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title description 25
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention provides a flexible inductor having excellent characteristics by narrowing the interval (pitch) between a via hole and a via hole by arranging via holes in a jig jig shape within a limited space so that electronic parts can be downsized and lightened.
The present invention relates to a flexible type core film; An upper flexible printed circuit board (FPCB) mounted on an upper surface of the core film and having upper patterns formed such that straight patterns are arranged in parallel at regular intervals; A lower flexible printed circuit board (FPCB) mounted on a lower surface of the core film located on the opposite side of the upper flexible printed circuit board, the lower flexible printed circuit board (FPCB) having lower patterns formed such that straight patterns are arranged at regular intervals in parallel; And at both ends of the upper pattern and both ends of the lower pattern so that the upper pattern of the upper flexible printed circuit board and the lower pattern of the lower flexible printed circuit board are connected to each other, And a via hole in which a lower pattern is electrically connected to form a coil, wherein the via hole is formed by: forming a via hole in which a pitch between the upper and lower patterns is narrowed, Adjacent via holes are arranged in a zigzag form.
Description
More particularly, the present invention relates to a flexible inductor and a method of manufacturing the flexible inductor. More particularly, the present invention relates to a flexible inductor and a method of manufacturing the same. More particularly, the present invention relates to a flexible inductor, The present invention relates to a flexible inductor having excellent characteristics by narrowing a pitch of a via hole and a manufacturing method thereof.
An inductor is one of the most important parts of an electric circuit together with a resistor, a condenser, an electron tube, a transistor, and a power source, and has a coil structure in which copper or aluminum is wound several times in a screw shape.
The inductor functions to suppress the abrupt change of the current by inducing the voltage proportional to the change of the current.
The ratio of the back electromotive force (back electromotive force) caused by the electromagnetic induction to the change of the current flowing in the circuit or the change amount of the time flowing through the winding and the electromotive force generated in the winding is referred to as inductance. The symbol of the inductor is marked with the letter 'L' after the acronym of the linkage which means magnetic coupling.
If one of the inductors is suddenly disconnected while current is flowing through the inductor, the current quickly becomes zero, resulting in a very high voltage, which causes a spark in the disconnected circuit area.
Using this principle, inductors are used as filters to prevent sudden changes in currents in various electronic products, oscillation circuits, current storage devices in power circuits, and filter out electrical noise.
In general, inductors are also used in integrated circuits (ICs) and communication MMICs. In particular, recently, with the emergence of System-on-Chip (SoC) related technology, a packaging technology that unifies various devices into a single chip has been developed, and an inductor having a small structure, low manufacturing cost, and excellent characteristics is required .
Thus, the inductance is defined as an element that can induce a predetermined inductance. The inductance value becomes larger as the magnetic field is formed around the inductor. In order to obtain a large inductance value, a length of the long conductor is required.
In addition, since the inductance is proportional not only to the line length but also to the mutual inductance, the line is made to twist in the narrowest space as much as possible.
However, when the inductor is formed on a microchip through a pattern, a long line is required to obtain a desired inductance value. However, since there is a space limitation, the following three types of inductors are used.
FIGS. 1 to 3 illustrate inductors formed on a microchip substrate according to a related art.
Figure 1 shows a spiral inductor. Helical inductors are often used because they draw concentric circles in one direction, so they have the advantage of creating a large inductance value with a small size because the magnetic field is added in the same direction in the mutual inductance. However, due to the large loss, it should be used carefully. There is a drawback to use air bridges or multilayered lines because the lines must be connected from the center to the outside.
Figure 2 shows a meander line inductor. The Mindler inductor is a snake twisted to eliminate the need for an air bridge. However, since the mutual inductances of mutual inductors are opposite to each other, they are offset from each other, making it difficult to make a high inductance value compared to the size.
Figure 3 shows a loop inductor. Loop inductors are not used much because they have poor shape and performance. However, it has a filtering characteristic and is used occasionally.
As described above, since the conventional inductor has many problems, an inductor having a simple process and a large inductance value is required.
Particularly, there is a demand for inductors having a large inductance in a small space as the demand for high-density and high-performance electronic equipment and the need for high-frequency mobile communication are required to downsize and integrate electronic devices.
In order to meet such a demand, "an inductor formed using a polymer film and a manufacturing method thereof" of Korean Patent Registration No. 10-0575358 and a method of manufacturing a high efficiency inductor, an inductor, and an inductor are disclosed in Korean Patent Registration No. 10-0723032 Quot; packaging structure using "
Such prior art documents disclose a structure in which a via hole is formed to penetrate a substrate or a film to form a coil on a substrate or a film, and a wire is formed to connect the via hole to form a coil. The via holes are arranged in a straight line The gap between the via hole and the via hole can not be narrowed. Therefore, there is a disadvantage in that it is only limited to form the coil. That is, if a large number of coils are to be formed to increase the capacity, the total area must be relatively large.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device in which via holes are arranged in a jig- (Pitch) of the flexible inductor, and has excellent characteristics, and a method of manufacturing the same.
It is another object of the present invention to provide a flexible inductor capable of being flexible in the up, down, left, and right directions, and continuing mass production and quality maintenance, and a manufacturing method thereof.
It is still another object of the present invention to provide a flexible inductor having a multilayer structure and a manufacturing method thereof.
According to an aspect of the present invention, there is provided a flexible indexer comprising: a flexible type core film; An upper flexible printed circuit board (FPCB) mounted on an upper surface of the core film, the upper flexible printed circuit board (FPCB) being formed on the surface of the upper film so that linear upper patterns are arranged at regular intervals and in parallel; A lower flexible printed circuit board (FPCB) mounted on a lower surface of the core film positioned on the opposite side of the upper flexible printed circuit board, the lower flexible printed circuit board (FPCB) being formed on the surface of the lower flexible printed circuit board so that linear lower patterns are arranged at regular intervals; The upper and lower patterns of the upper flexible printed circuit board and the lower flexible printed circuit board are connected to each other so that both ends of the upper pattern and the lower pattern of the straight line are aligned with each other, And a via hole formed at both ends of the upper and lower patterns and electrically connected to both ends of the upper pattern and the lower pattern to form a coil part, The via holes are arranged in a zigzag form so that the pitch of the adjacent via holes becomes narrow so that the number of patterns of the coil portion can be narrowed and the width of the core film is set to a width within a via hole formed at both ends of the pattern .
It is preferable that one of the upper pattern and the lower pattern is formed to be parallel to each other with a predetermined inclination, and the upper pattern and the lower pattern are formed on one or both sides of the upper flexible printed circuit board and the lower flexible printed circuit board Do.
The upper and lower flexible printed circuit boards and the lower flexible printed circuit boards are stacked on the upper and lower surfaces of the core film in a state that the upper flexible printed circuit board and the lower flexible printed circuit board are installed. It is preferable that the patterns are connected in series or in parallel.
It is preferable that an electromagnetic wave shielding film is provided on at least one of the upper flexible printed circuit board and the lower flexible printed circuit board.
According to an aspect of the present invention, there is provided a method of manufacturing a flexible indexer, including: providing a flexible type core film, an upper flexible printed circuit board and a lower printed circuit board; Wherein upper and lower patterns are formed on a surface of the upper flexible printed circuit board and a lower printed circuit board such that linear patterns are arranged in parallel at regular intervals, Forming a pattern unit of a unit unit with respect to a total area of the circuit board and the lower printed circuit board; Attaching the upper flexible printed circuit board and the lower flexible printed circuit board on the upper and lower surfaces of the core film with the pattern units of the unit unit by heat fusion; A via hole is formed at both ends of the pattern so that the upper and lower patterns forming the pattern unit of the unit unit are mutually connected in a state of being thermally welded to the upper and lower surfaces of the core film, And forming the upper and lower patterns electrically to form a coil; And cutting the unit units formed with the coils to form a single product.
According to the flexible inductor of the present invention, by arranging via holes in a jig jig shape in a limited space, it is possible to narrow the pitches of adjacent via holes and to achieve excellent characteristics and miniaturization and weight reduction of electronic parts.
In addition, the present invention uses flexible material to enable flexibility in the up, down, left, and right directions, and has the effect of continuing mass production and quality maintenance.
In particular, by providing a flexible inductor having a multilayer structure, the capacity can be easily increased.
FIG. 1 is a view showing a conventional spiral inductor,
FIG. 2 is a view showing a conventional meander line inductor, and FIG.
FIG. 3 is a view showing a loop inductor according to the prior art,
4 is an exploded perspective view showing a structure of a flexible inductor according to the present invention,
5 is a view showing an example of an upper pattern provided in the flexible inductor according to the present invention,
FIG. 6 is an enlarged view of the upper pattern of FIG. 5,
7 is a view showing an example of a lower pattern provided in the flexible inductor according to the present invention,
FIG. 8 is an enlarged view of the upper pattern of FIG. 7,
9 is a view illustrating a state in which a coil is formed by interconnecting an upper pattern and a lower pattern provided in the flexible inductor according to the present invention,
10 to 11 are enlarged sectional views showing structures of via holes and patterns provided in the flexible inductor according to the present invention. Fig. 10 shows an example in which a pattern is formed on only one side, Fig. 11 shows an example in which patterns are formed on both sides Fig.
Fig. 12 is a view showing an example in which an electromagnetic wave shielding film is provided in the display of Fig. 10,
13 is a view showing an example of forming a pattern portion in a wide area of a film in order to manufacture a flexible inductor according to the present invention, and cutting the same into unit units. In Fig. 13, the pattern portion is omitted, FIG.
14 is a view showing an example of a large-area core film for manufacturing a flexible inductor according to the present invention,
15 is a block diagram of a flexible inductor according to the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Prior to the description of the present invention, the following specific structure or functional description is merely illustrative for the purpose of describing an embodiment according to the concept of the present invention, and embodiments according to the concept of the present invention may be embodied in various forms , And should not be construed as limited to the embodiments described herein.
In addition, embodiments according to the concept of the present invention can make various changes and have various forms, so that specific embodiments are illustrated in the drawings and described in detail herein. However, it should be understood that the embodiments according to the concept of the present invention are not intended to limit the present invention to specific modes of operation, but include all modifications, equivalents and alternatives falling within the spirit and scope of the present invention.
FIG. 4 is a perspective view illustrating a structure of a flexible inductor according to the present invention, FIG. 5 is a view showing an example of an upper pattern provided in the flexible inductor according to the present invention, FIG. 6 is a cross- 7 is an enlarged view of an upper pattern of the flexible inductor according to the present invention. FIG. 8 is an enlarged view of an upper pattern of FIG. 7, and FIG. 9 is a cross- FIGS. 10 to 11 are enlarged sectional views showing a structure of a via hole and a pattern in a flexible inductor according to the present invention, wherein FIG. 10 is a perspective view of a flexible inductor, FIG. 10 is a view showing an example where a pattern is formed on only one side, FIG. 11 is an example where a pattern is formed on both sides, and FIG. 12 is a view 10 shows an example in which an electromagnetic wave shielding film is provided.
As shown in these figures, the flexible inductor according to the present invention can be configured to include a
The
The upper flexible printed
The lower flexible printed
The via
The via
As described above, according to the present invention, since the pitch p of adjacent via
In addition, it is preferable that the width of the
Particularly, when forming the
The upper and
Particularly, in the present invention, the upper flexible printed
At this time, the
12, the electromagnetic
13 is a view showing an example of forming a pattern portion in a wide area film to cut the flexible portion in a unit unit in order to manufacture a flexible inductor according to the present invention. In FIG. 13, the pattern portion is omitted, FIG. 14 is a view showing an example of a wide area core film for manufacturing a flexible inductor according to the present invention, and FIG. 15 is a block diagram according to the manufacture of a flexible inductor according to the present invention.
As shown in the drawing, a method of manufacturing a flexible inductor according to the present invention includes the steps of forming a flexible
The upper and lower flexible printed
The
The upper flexible printed
The upper and lower flexible printed
The upper and
The cutting line L of the unit unit u is cut in the state that the coil unit is formed as described above to form a single product. At this time, the individual products formed by cutting the unit unit u can be formed in a small size.
According to the present invention, the pattern unit of the unit unit (u) is formed on the core film (110) having a large total area, the upper flexible printed circuit board (120) and the lower flexible printed circuit board (130) , And cut along the cutting line L of the unit unit u, so that a single product can be manufactured, and the manufacturing process is simple, mass production is possible, and the quality is maintained. Particularly, the present invention is characterized in that a single product can be flexible up, down, left, and right.
Further, since the present invention is capable of continuous stacking, a multi-stage indexer can be constructed, and the patterns can be connected in series or in parallel, thereby making it possible to increase the size while reducing the size.
The most important technology of the present invention is characterized in that the arrangement of the via holes is arranged in a zigzag form in order to reduce the pitch of the via holes connecting the both ends of the patterns to form the coil, and the via holes are arranged in a zigzag The capacity can be increased at a limited area.
Although the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
110 - core film 120 - upper flexible printed circuit board
122 - upper pattern 130 - lower flexible printed circuit board
132 - Lower pattern 140 - Via hole
Claims (5)
An upper flexible printed circuit board (FPCB) mounted on an upper surface of the core film, the upper flexible printed circuit board (FPCB) being formed on the surface of the upper film so that linear upper patterns are arranged at regular intervals and in parallel;
A lower flexible printed circuit board (FPCB) mounted on a lower surface of the core film positioned on the opposite side of the upper flexible printed circuit board, the lower flexible printed circuit board (FPCB) being formed on the surface of the lower flexible printed circuit board so that linear lower patterns are arranged at regular intervals; And
The upper and lower patterns of the upper flexible printed circuit board and the lower flexible printed circuit board are formed at both ends of the upper and lower patterns in a state in which both ends of the upper pattern and the lower pattern in a straight line are aligned so that both ends of the lower flexible printed circuit board and the lower pattern of the lower flexible printed circuit board are mutually connected And a via hole in which a conductive layer is formed, and both ends of the upper pattern and the lower pattern are electrically connected to form a coil part,
Wherein the via hole comprises:
The adjacent via holes are arranged in a zigzag shape so that the pitch between the upper and lower patterns is narrowed and the pitch of the via holes adjacent to each other is narrowed so that the number of patterns of the coil portion can be increased,
Wherein a width of the core film is formed within a width of a via hole formed at both ends of the pattern.
Wherein one of the upper pattern and the lower pattern has a predetermined inclination and is arranged in parallel,
Wherein the upper and lower patterns are formed on one or both surfaces of an upper flexible printed circuit board and a lower flexible printed circuit board.
Wherein the upper and lower flexible printed circuit boards and the lower flexible printed circuit boards are disposed on upper and lower surfaces of the core film,
Wherein the upper and lower patterns formed on the upper flexible printed circuit board and the lower flexible printed circuit board are connected in series or in parallel.
Wherein an electromagnetic wave shielding film is provided on at least one of the upper flexible printed circuit board and the lower flexible printed circuit board.
Wherein upper and lower patterns are formed on a surface of the upper flexible printed circuit board and a lower printed circuit board so that linear patterns are arranged in parallel at regular intervals,
The upper patterns and the lower patterns forming a pattern unit of a unit unit with respect to the entire area of the upper flexible printed circuit board and the lower printed circuit board;
Attaching the upper flexible printed circuit board and the lower flexible printed circuit board on which the pattern units of the unit unit are formed to the upper and lower faces of the core film by thermal fusion bonding;
A via hole is formed at both ends of the pattern so that the upper and lower patterns forming the pattern unit of the unit unit are mutually connected in a state of being thermally welded to the upper and lower surfaces of the core film, And forming the upper and lower patterns electrically to form a coil; And
And cutting the unit units formed with the coils to form a single product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150065396A KR101625971B1 (en) | 2015-05-11 | 2015-05-11 | flexible inductor and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150065396A KR101625971B1 (en) | 2015-05-11 | 2015-05-11 | flexible inductor and its manufacture method |
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| Publication Number | Publication Date |
|---|---|
| KR101625971B1 true KR101625971B1 (en) | 2016-06-01 |
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| KR1020150065396A KR101625971B1 (en) | 2015-05-11 | 2015-05-11 | flexible inductor and its manufacture method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040110213A (en) * | 2003-06-18 | 2004-12-31 | 재단법인서울대학교산학협력재단 | Inductor formed by using polymer film and method of forming the same |
| KR20060102493A (en) * | 2005-03-23 | 2006-09-27 | 스미다 코포레이션 | Inductor |
| JP2007503716A (en) * | 2003-08-26 | 2007-02-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ultra-thin flexible inductor |
| KR100723032B1 (en) | 2005-10-19 | 2007-05-30 | 삼성전자주식회사 | High efficiency inductor, method for fabricating the inductor and packaging structure using the inductor |
| KR20080063854A (en) * | 2005-12-07 | 2008-07-07 | 스미다 코포레이션 가부시키가이샤 | Flexible coil |
-
2015
- 2015-05-11 KR KR1020150065396A patent/KR101625971B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040110213A (en) * | 2003-06-18 | 2004-12-31 | 재단법인서울대학교산학협력재단 | Inductor formed by using polymer film and method of forming the same |
| KR100575358B1 (en) | 2003-06-18 | 2006-05-03 | 재단법인서울대학교산학협력재단 | Inductor formed by using polymer film and method of forming the same |
| JP2007503716A (en) * | 2003-08-26 | 2007-02-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ultra-thin flexible inductor |
| KR20060102493A (en) * | 2005-03-23 | 2006-09-27 | 스미다 코포레이션 | Inductor |
| KR100723032B1 (en) | 2005-10-19 | 2007-05-30 | 삼성전자주식회사 | High efficiency inductor, method for fabricating the inductor and packaging structure using the inductor |
| KR20080063854A (en) * | 2005-12-07 | 2008-07-07 | 스미다 코포레이션 가부시키가이샤 | Flexible coil |
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