KR101624142B1 - Auto loading and unloading device using semiconductor jedec tray - Google Patents

Abstract

The present invention relates to an automatic rotating apparatus using a semiconductor jade tray, and more particularly, to a loading unit for transferring a test tray to a preparation tray on which semiconductor chips are placed, and a preparation tray and a test tray which are transported by the loading unit, And a loading unit comprising a flipper for transferring the semiconductor chip to the test tray.
Unlike the prior art, the present invention automatically loads and unloads a semiconductor JEDEC tray, thereby enhancing the convenience of the operator.

Description

Technical Field [0001] The present invention relates to an automatic rotating apparatus using a semiconductor jade tray,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic turning apparatus using a semiconductor jade tray, and more particularly, to an automatic turning apparatus using a semiconductor jade tray for automatically loading and unloading a semiconductor jade tray, To a rotating device.

BACKGROUND ART [0002] In manufacturing semiconductor devices, solder bumps are bonded to terminals made of metal on an IC substrate (chip) formed of a semiconductor wafer. After the terminals are formed by vapor deposition or the like, an oxide film is formed on the surface due to contact with oxygen in the atmosphere or the like, and the oxide film hinders the bonding of the terminals and the solder bumps.

Thus, conventionally, before the solder bumps are bonded to the terminals, the oxide film on the surface of the terminals is removed by the flux. Specifically, the flux activates the surface of the terminal to remove (reduce) the oxide film while covering the surface thereof to prevent new oxidation, thereby maintaining the active state of the surface of the terminal. However, the flux may remain as a residue between the surface of the terminal and the solder bump.

Further, when the solder bumps are melted and bonded to the terminals, gas generated from the heated flux may remain as voids in the solder bumps. Correspondingly, a method of supplying a vapor of a carboxylic acid, such as formic acid, to a chip in a reduced-pressure atmosphere and heating the chip is used. In this method, formic acid reduces the oxide film on the surface of the terminal of the chip without causing residue, and formic acid does not generate gas even when heated, and since the atmosphere is decompressed, it is discharged from the solder bump even if gas is generated . The heated solder bumps are melted and bonded to the terminals.

In recent years, in order to reduce the footprint of a semiconductor device, a three-dimensional mounting method for manufacturing a semiconductor device by stacking a plurality of chips has been developed. In this three-dimensional mounting method, a wiring made of a conductor penetrating the chip in the thickness direction, for example, TSV (Through Silicon Via) is formed in each chip, and an electrode pad (terminal) And connected to the solder bumps formed at the ends of the other chip wirings to form a circuit three-dimensionally.

Particularly, a tray on which a semiconductor chip is mounted is manually loaded and unloaded for inspection or transfer, thereby deteriorating inspection efficiency and delaying inspection time. Therefore, there is a need to improve this.

BACKGROUND ART [0002] The background art of the present invention is disclosed in Korean Patent Laid-Open Publication No. 10-2013-0083400 (published on Mar. 07, 201, entitled "Semiconductor Device Manufacturing System and Semiconductor Device Manufacturing Method").

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method thereof that can increase the convenience of an operator by allowing a tray, And an object of the present invention is to provide an automatic rotation device using a semiconductor jet tray.

In addition, the present invention can improve the inspection efficiency by automatically performing a loading, unloading and moving process of a tray on which a semiconductor chip is mounted through an automatic facility, The object of the present invention is to provide a rotating device.

An automatic rotating apparatus using a semiconductor jade tray according to the present invention includes: a loading unit for transferring a semiconductor chip placed on a preparation tray to a test tray; A conveyance rail for conveying and transferring the test tray on which the semiconductor chip is placed and returning the test tray; And a chamber through which the test tray is conveyed along the transfer rail.

The loading unit comprising: a loading unit for transferring the test tray to a preparation tray on which the semiconductor chip is placed; And a flipper for reversing the preparation tray and the test tray in a folded state transferred by the loading unit and transferring the semiconductor chip to the test tray.

The loading section includes: a head; A guide rail member for freely moving and guiding the head in plan view; And a clamp provided on the lower side of the head to hold or place the test tray or the preparation tray.

The loading unit further includes a suction member provided on the head and adapted to suction the test tray or the preparation tray.

The flipper comprising: a frame; A jaw provided at both sides of the frame to hold the test tray and the preparation tray; And a rotating member for connecting and rotating both sides of the jaws facing each other.

Wherein the loading unit and the flipper are installed in a work platform; The preparation tray and the test tray are preferably aligned with a magazine provided on the work table.

The transferring rail preferably has a stopper for adjusting the transfer speed of the test tray passing through the chamber.

Wherein the test tray is provided with a plurality of openings at respective different positions on the same edge; The transferring rail preferably includes a sensor member for detecting the transferring number of the test tray through the detection of the position of the recognition hole.

As described above, the automatic rotation device using the semiconductor jade tray according to the present invention can increase the convenience of the operator by passing the tray on which the semiconductor chip is mounted through the chamber with the automatic equipment, Can efficiently utilize the working time.

Further, the present invention can improve the inspection efficiency by automatically performing the loading, unloading, and moving processes of the tray on which the semiconductor chip is mounted through the automatic facility.

1 is a perspective view of an automatic rotating apparatus using a semiconductor jet tray according to an embodiment of the present invention.
2 is a plan view of an automatic rotating apparatus using a semiconductor jet tray according to an embodiment of the present invention.
3 is a front view of an automatic rotation apparatus using a semiconductor jet tray according to an embodiment of the present invention.
4 is a perspective view of a loading unit of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
FIG. 5 is a top view of a loading unit of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention. FIG.
6 is a front view of a loading unit of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
7 is a side view of a loading portion of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
8 is a bottom view of a loading part of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
9 is a flipper perspective view of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
10 is a plan view of a flipper of an automatic rotary apparatus using a semiconductor jet tray according to an embodiment of the present invention.
11 is a front view of a flipper of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
12 is a perspective view of a stopper provided on a transfer rail of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
13 is a plan view showing a sensor member provided on a transfer rail of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.
FIG. 14 is a plan view showing a tray using state of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an automatic rotating apparatus using a semiconductor jet tray according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 1 is a perspective view of an automatic rotary apparatus using a semiconductor jet tray according to an embodiment of the present invention, FIG. 2 is a plan view of an automatic rotary apparatus using a semiconductor jet tray according to an embodiment of the present invention, 1 is a front view of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

FIG. 14 is a plan view showing a tray usage state of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

1 to 3 and 14, an automatic turning apparatus 100 using a semiconductor jet tray according to an embodiment of the present invention includes a loading unit 200, a conveying rail 300, and a chamber 10, .

The loading unit 200 serves to transfer the semiconductor chips placed on the preparation tray 2 for preparation of inspection to the test tray 4. [

At this time, the preparation tray 2 is made of a resin material in order to reduce the cost and the transportation weight, and the test tray 4 is made of a material which can withstand the high temperature environment for inspecting the semiconductor chip 6. In particular, the test tray 4 is made of aluminum.

Of course, the preparation tray 2 and the test tray 4 may be formed in various ways.

The transfer rail 300 guides the test tray 4 with the semiconductor chip 6 transferred thereinto into the chamber 10 and transfers the test tray 4 having passed through the chamber 10 to the loading unit 200 And serves as a conveying guide. At this time, the conveying rails 300 can be arranged in various shapes according to the layout. In particular, the conveying rail 300 may be variously applied, for convenience, as a conveyor belt.

The chamber 10 functions to pass the test tray 4 conveyed along the conveyance rail 300 and to perform the inspection. The chamber 10 is provided with a heating unit (not shown) and a cooling unit (not shown), and a conveyor belt (not shown) or the like for conveying the test tray 4 at a predetermined speed Respectively.

Meanwhile, the loading unit 200 includes a loading unit 210 and a flipper 220.

FIG. 4 is a perspective view of a loading section of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention, FIG. 5 is a top view of a loading section of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention, 6 is a front view of a loading unit of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

FIG. 7 is a side view of a loading portion of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention, and FIG. 8 is a bottom view of a loading section of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention .

2, 4 to 8 and 14, the loading unit 210 serves to transfer the test tray 4 to the preparation tray 2 on which the semiconductor chip 6 is placed. The loading unit 210 serves to transfer the semiconductor chip 6 to the test tray 4 and to transfer the test tray 4 on which the semiconductor chip 6 is placed to the transfer rail 300. [ And moves the test tray 4 returned to the initial position of the conveyance rail 300 after passing through the chamber 10.

The flipper 220 has a function of transferring the semiconductor chip 6 to the test tray 4 by reversing the preparation tray 2 and the test tray 4 in a folded state transferred by the loading unit 210 do.

Here, the loading section 210 includes a head 212, a guide rail member 214, and a clamp 216.

The head 212 connects the clamp 216.

The guide rail member 214 serves to guide the head 212 freely in a plane, that is, to move freely in the X-Y direction. The guide rails are formed in various shapes and automatically move the head 212 to the set position. The head 212 is connected to the guide rail member 214 in various manners to be freely guided for movement.

The clamp 216 is provided under the head 212 and serves to hold the test tray 4 and the preparation tray 2 individually or integrally with the test tray 4 and the preparation tray 2 together. Thus, the clamp 216 is provided on the head 212 so as to be movable up and down.

Of course, the clamp 216 can be variously adapted to load or unload the test tray 4 and the preparation tray 2. [

In addition, the head 212 has an alignment member 217. The alignment member 217 serves to align the test tray 4 clamped by the clamp 216 and the preparation tray 2 so as to be completely superimposed. The alignment member 217 is variously applicable.

In addition, the test tray 4 and the preparation tray 2 are placed in the magazines 22, 24, and 26, respectively.

Particularly, initially, the preparation tray 2 on which the semiconductor chip 6 is placed is stacked on the first magazine 22, and the test tray 4 is stacked on the second magazine 24.

The clamp 216 moves one preparation tray 2 stacked on the first magazine 22 to the second magazine 24. Thus, the test tray 4 and the preparation tray 2 are superimposed.

Thereafter, the clamp 216 moves the superimposed test tray 4 and the preparation tray 2 to the frame 222 of the flipper 220.

Due to the flipper 220, the inverted preparation tray 2 is transferred to the third magazine 26 by the clamp 216. At this time, the test tray 4 on which the semiconductor chip 6 is transferred is transferred to the conveying rail 300 by the clamp 216.

The inspected test tray 4 is placed on the frame 222 of the flipper 220 by the clamp 216 and the preparation tray 2 is placed on the test tray 4 placed on the frame 222, Loses.

The preparatory tray 2 to which the semiconductor chip 6 has been transferred is moved to the first magazine 22 or another magazine and the test tray 4 is transferred to the second magazine 24 after being inverted by the flipper 220 Loses.

In particular, the magazines 22, 24, and 26 are fixed to the work table 10. The work table 10 can be deformed into various shapes. The loading unit 200 and the flipper 220 are installed on the work table 10.

In addition, each magazine 22, 24, 26 has a cylinder member 30 on its lower side. The cylinder member 30 serves to adjust the height of the preparation tray 2 or the test tray 4 corresponding to the clamp 216 so that the clamp 216 can be stably clamped.

The loading section 210 further includes an adsorption member 218. The adsorption member 218 serves to adsorb and stably transport the test tray 4 or the preparation tray 2 which is provided in the head 212 and clamped by the clamp 216. The adsorption member 218 is preferably composed of an air tube and an adsorption pad. For convenience, the alignment member 217 is shown to move the air tube included in the adsorption member 218 to move and align the test tray 4 and the preparation tray 2 to completely overlap.

10 is a plan view of a flipper of an automatic rotary apparatus using a semiconductor jet tray according to an embodiment of the present invention. FIG. 11 is a plan view of a flipper of an automatic rotary apparatus using a semiconductor jet tray according to an embodiment of the present invention. Is a front view of a flipper of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

The flipper 220 includes a frame 222, a jaw 224, and a rotating member 226.

The frame 222 serves to connect or support the jaws 224 and the rotary member 226. The frame 222 is applicable in various shapes and various materials.

The jaws 224 are provided on both sides of the frame 222 to support the test tray 4 and the preparation tray 2 placed by the clamps 216 and to hold the test tray 4 and the preparation tray 2 ). At this time, the jaws 224 are variously applicable, for example, they are operated by the operation of the cylinders on both sides.

In addition, the rotary member 226 connects both sides of the opposing jaws 224 and rotates them. The rotary member 226 is forcibly rotated in both directions or in one direction by a motor or the like. Thus, the jaws 224 are rotated while fixing the test tray 4 and the preparation tray 2.

In particular, after the rotary member 226 rotates the jaws 224, the jaws 224 are opened and simply support the preparation tray 2 and the test tray 4.

12 is a perspective view of a stopper provided on a transfer rail of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

The test tray 4 having passed through the chamber 10 has its conveying speed adjusted on the conveying rail 300. This is because the test tray 4 is moved along the relatively long conveyance rail 300 and the cycle time for the inspection is maintained as the conveyance speed is increased.

  Thus, the conveying rail 300 has the stopper 310 for controlling the conveying speed of the test tray 4 having passed through the chamber 10. The stopper 310 is provided on the conveying rail 300 so as to be able to move up and down and stop the test tray 4 to be instantaneously lowered.

13 is a plan view showing a sensor member provided on a conveying rail of an automatic turning apparatus using a semiconductor jet tray according to an embodiment of the present invention.

The test tray 4 is provided with a plurality of apertures 322 at different positions on the same edge.

The conveying rail 300 includes a sensor member 320 for detecting the number of conveyance of the test tray 4 through the detection of the position of the recognition hole 322. The sensor member 320 recognizes the position of the recognition hole 322 by checking whether the light irradiated to the test tray 4 is returned or not, thereby checking the number of the test tray 4 passing through the corresponding point do.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand. Accordingly, the true scope of the present invention should be determined by the following claims.

100: Automatic rotating device using semiconductor jade tray
200: loading unit 210: loading unit
212: head 214: guide rail member
216: clamp 217: alignment member
218: absorption member 220: flipper
222: Frame 224: Joe
226: Rotation member 300: Feeding rail
310: Stopper

Claims (7)

A loading unit for transferring the semiconductor chips placed in the preparation tray to a test tray; A conveyance rail for conveying and transferring the test tray on which the semiconductor chip is placed and returning the test tray; And a chamber through which the test tray is conveyed along the transfer rail,
The loading unit comprising: a loading unit for transferring the test tray to a preparation tray on which the semiconductor chip is placed; And a flipper for reversing the preparation tray and the test tray in a folded state conveyed by the loading unit to transfer the semiconductor chip to the test tray,
The loading section includes: a head; And a suction member provided on the head for sucking the test tray or the preparation tray,
Wherein the head comprises an alignment member connected to the adsorption member for aligning the test tray and the preparation tray so that the preparation tray is completely superimposed.
The apparatus according to claim 1,
A guide rail member for freely moving and guiding the head in plan view; And
And a clamp provided on a lower side of the head to grip or place the test tray or the preparation tray.
delete The image forming apparatus according to claim 1 or 2,
frame;
A jaw provided at both sides of the frame to hold the test tray and the preparation tray; And
And a rotary member for connecting and rotating both sides of the jaws facing each other.
The method according to claim 1,
Wherein the loading unit and the flipper are installed in a work platform;
Wherein the preparation tray and the test tray are aligned with magazines provided on the work table.
The method according to claim 1,
Wherein the conveying rail includes a stopper for adjusting the conveying speed of the test tray passing through the chamber.
The method according to claim 1,
Wherein the test tray is provided with a plurality of openings at respective different positions on the same edge;
Wherein the conveying rail includes a sensor member for detecting a conveying number of the test tray through the detection of the position of the recognition hole.

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