KR101595470B1 - Method of fabricating of Organic Light Emitting Display Device - Google Patents

Abstract

The present invention relates to a method of manufacturing an organic light emitting diode display capable of improving productivity and reliability and prolonging the life span of the organic light emitting display, Forming a barrier layer in which a microcrystalline barrier layer and a porous barrier layer are alternately laminated so as to surround the periphery of the device, wherein the barrier layer of the microcrystalline structure is formed using a mask spaced from the substrate And the porous barrier layer is formed using the mask closely adhered to the substrate.

OLED, moisture, deterioration, barrier film, mask

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of fabricating an organic light-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an organic light emitting display device, and more particularly, to a method of manufacturing an organic light emitting display device capable of improving productivity and reliability and extending its service life.

The image display device that realizes various information on the screen is a core technology of the information communication age and it is becoming thinner, lighter, more portable and higher performance. Accordingly, an organic light emitting display device for displaying an image by controlling the amount of light emitted from the organic light emitting layer by using a flat panel display capable of reducing weight and volume, which is a disadvantage of a cathode ray tube (CRT)

The OLED display is a self-luminous device using a thin light emitting layer between electrodes, and has an advantage that it can be thinned like a paper. A general organic light emitting display has a structure in which a sub-pixel driver array and an organic electroluminescent array are formed on a substrate, and light emitted from the organic electroluminescent array of the organic electroluminescent array passes through the substrate or the barrier layer to display an image.

The organic electroluminescent device is deteriorated by internal factors such as degradation of the electrode and the light emitting layer due to oxygen, deterioration due to the reaction between the light emitting layer and the interface, and deterioration easily due to external factors such as moisture, oxygen, ultraviolet rays, . Particularly, external oxygen and moisture have a serious effect on the lifetime of the device, so encapsulation of the organic electroluminescent device is very important.

In the encapsulation method, a substrate on which an organic electroluminescent device is formed is sealed with a protective cap. Before the protective cap is sealed, a moisture absorbent is attached to the inner center of the protective cap to absorb moisture, I will. Further, in order to prevent the moisture absorbent from falling on the organic material layer, a semi-permeable membrane is attached to the back surface of the protective cap so that moisture, oxygen,

As described above, in order to protect the organic material layer of the organic electroluminescent device from oxygen and moisture, a method of encapsulating using a protective cap such as metal or glass requires using an additional material such as an adhesive or a moisture absorbent for encapsulation, Can be increased. In addition, the volume and thickness of the organic light emitting diode display can be increased according to the formation of the protective cap, and the flexible cap is difficult to apply because the protective cap is made of glass.

In order to overcome this difficulty, a method of forming a barrier layer of a thin film by another method of encapsulating an organic electroluminescent device has been attempted. A film in which an inorganic insulating film and an organic insulating film are laminated is used as a barrier layer.

However, the method of forming an inorganic insulating film is disadvantageous in that the deposition temperature must be high, the thin film is not excellent in the curling force, and the density of the thin film is not dense. Thus, the inorganic insulating film is used as a barrier film of an organic electroluminescent device There is a limit.

The organic insulating film has a high moisture permeability and deteriorates the organic electroluminescent device to deteriorate its service life. These laminated films are formed through repetitive processes in different chambers, so there is a great deal of movement between the chambers and the initial investment equipment decreases the production yield and increases the cost.

In addition, due to differences in stress characteristics between different film materials, foreign matter or pin-holes are generated in the laminated film. The generated foreign matter or pinhole weakens the interfaces of the films, thereby accelerating the rate of moisture permeation through the interface, and delamination phenomenon occurs between the films, thereby lowering the reliability and lifetime of the OLED display.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an organic light emitting display capable of improving productivity and reliability and extending the service life.

A method of manufacturing an organic light emitting display according to the present invention includes the steps of preparing a substrate on which an organic electroluminescent device is formed, and alternately stacking a barrier layer of a microcrystal structure and a barrier layer of a porous material so as to surround the periphery of the organic electroluminescent device Wherein a barrier layer of the microcrystalline structure is formed using a mask spaced from the substrate, and the porous barrier layer is formed using the mask adhered from the substrate.

The forming of the barrier layer may include: forming a first barrier layer of the microcrystalline structure on the substrate so as to surround the organic electroluminescent device; forming a first barrier layer on the first barrier layer, Forming a first barrier layer and a second barrier layer on the first barrier layer and the second barrier layer in the same process condition as the first barrier layer; 3 barrier layer.

The distance from the substrate to the mask spaced apart is 10 to 10 mm, the deposition rate of the barrier layer of the microcrystalline structure is 500 A / min or less, and the deposition rate of the porous layer is 500 A / min or more.

The barrier layer of the microcrystalline structure is formed wider than the opening area of the mask, and the porous barrier layer is formed to be the same as the opening area of the mask.

The barrier layers of the barrier film are formed in the same chamber.

The barrier layer of the microcrystalline structure is formed of any one of SiNx, SiOx, SiON, SiOC, and a-C, or a combination of two or more of them.

The porous barrier layer is made of any one of SiNx, SiOx, SiON, SiOC, and a-C, or a combination of two or more of them.

A method of manufacturing an organic light emitting diode display according to another embodiment of the present invention includes the steps of preparing a substrate having an organic electroluminescent device formed thereon and a step of forming a mask to surround the organic electroluminescent device Forming a first barrier layer, forming a second barrier layer on the first barrier layer using the mask adhered from the substrate, and forming a second barrier layer on the periphery of the second barrier layer, And forming a third barrier layer on the first barrier layer under the same conditions as the formation of the first barrier layer.

The present invention relates to a barrier layer surrounding an organic electroluminescent device to form a porous second barrier layer between a plurality of layers to relieve stress between barrier layers and to form a first barrier layer And the third barrier layer to prevent penetration of moisture or gas from the outside.

Further, the present invention prevents penetration of moisture or gas from the outside to prevent deterioration of the organic electroluminescent device, and improves the ductility characteristics to absorb external impact, thereby improving the durability and reliability of the OLED display, Can be extended.

Further, the present invention can reduce the processing time and the process cost according to the mask material cost by forming the barrier film composed of a plurality of barrier layers using a single mask.

In addition, since the first barrier layer, the second barrier layer and the third barrier layer are deposited in one same chamber, the present invention can reduce the movement of the chambers and the initial investment equipment even when a plurality of barrier layers are deposited, And reduce costs.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3 are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

1, a substrate 110 having a cell driving array (not shown) and an organic light emitting array (not shown) formed thereon is provided in a chamber 160, and then an organic electroluminescent device 130 The first barrier layer 151 is formed.

The type of the substrate 110 is not particularly limited and may be various, and it may be a glass substrate, a plastic substrate, a silicon substrate, or the like.

The organic electroluminescent device 130 includes a plurality of sub-pixels, a cell driving array (not shown) includes a plurality of signal lines, a plurality of transistors, and a plurality of capacitors. The transistors include a switching transistor, .

The switching transistor supplies a data signal from the data line in response to the scanning signal of the gate line, and the driving transistor controls the amount of current flowing in the organic light emitting array (not shown) in response to the data signal from the switching transistor. The capacitor plays a role of allowing a constant current to flow through the driving transistor even if the switching transistor is turned off.

An organic light emitting array (not shown) emits light of red, green, and blue according to the flow of current to display predetermined image information. The organic light emitting array includes a first electrode connected to the driving transistor, a second electrode which is an opposite electrode, and an organic light emitting layer disposed between and emitting light.

When the organic light emitting display is designed as a back light, the first electrode is formed of a transparent conductive layer. When the OLED display is designed as a front emission type, the second electrode is formed of a transparent conductive layer.

The organic light emitting layer is a layer in which light is emitted when a voltage of different polarity is applied to the first electrode and the second electrode and the exciton formed by the combination of holes and electrons injected from the first electrode and the second electrode drops to the ground state .

The organic light emitting layer is formed by sequentially stacking a hole injection layer (HIL), a hole transporting layer (HTL), an emission layer (EML), an electron transporting layer (ETL) electron injection layer (EIL).

Since the organic luminescent layer is made of an organic material and easily influenced by external moisture and oxygen, it is necessary to form a barrier film 150 surrounding the organic electroluminescent device 130 to prevent damage to the organic material due to external moisture and oxygen .

The first barrier layer 151 is formed on the substrate 110 on which the organic electroluminescent device 130 is formed by PECVD deposition. The first barrier layer 151 is deposited using the mask 170 spaced apart from the substrate 110 by d after the substrate 110 having the organic electroluminescent device 130 formed therein is introduced into the chamber 160. Then, do. At this time, the distance d between the substrate 110 and the mask 170 is 10 to 10 mm, and the deposition rate is 500 Å / min or less.

The first barrier layer 151 is formed by separating the mask 170 from the substrate 110 so that the first barrier layer 151 can be formed wider than the opening region of the mask 170. [ Accordingly, the first barrier layer 151 is formed to surround the side surface of the organic electroluminescent device 130. Since the first barrier layer 151 is deposited at a deposition rate of 500 ANGSTROM / min or less, the crystal structure of the first barrier layer 151 can be more effectively prevented from being infiltrated with foreign moisture.

As the first barrier layer 151, a multilayer film made of any one of SiNx, SiOx, SiON, SiOC, and a-C, or a combination of two or more of them may be used.

When the first barrier layer 151 surrounding the organic electroluminescent device 130 is formed to have a microcrystalline structure under the above-described process conditions, moisture or gas is generated from the organic film, Deterioration of the element 130 can be prevented, so that the effect can be maximized.

Referring to FIG. 2, a second barrier layer 152 is formed on the first barrier layer 151 using PECVD deposition

Specifically, the mask 170 is brought into close contact with the substrate 110 on which the first barrier layer 151 is formed in the same chamber 160 in which the first barrier layer 151 is formed to deposit the second barrier layer 152 do. At this time, the distance between the substrate 110 and the mask 170 is 10 탆 or less, and the deposition rate is 500 Å / min or more.

The second barrier layer 152 can be formed in the opening region of the mask 170 because the mask 170 is closely contacted from the substrate 110 to form the second barrier layer 152. Thus, the second barrier layer 152 is formed on the upper surface of the first barrier layer 151. [ Since the second barrier layer 152 is deposited at a rate of 500 ANGSTROM / min or more, its crystal structure is porous, so that the stress of the barrier film can be relaxed and the bonding property between the films can be improved.

As the second barrier layer 152, a multilayer film made of any one of SiNx, SiOx, SiON, SiOC, and a-C or a combination of two or more of them may be used. The thickness of the second barrier layer 152 is thicker than the thickness of the first barrier layer 151.

Since the process of depositing the second barrier layer 152 is performed in the same chamber as that of the chamber 160 in which the first barrier layer 151 is formed, migration and initial investment equipment between the chambers can be reduced even when a plurality of films are deposited The production yield can be improved and the cost can be lowered.

Referring to FIG. 3, a third barrier layer 153 is formed on the second barrier layer 152 using a PECVD deposition method to form a barrier film 150. The third barrier layer 153 is formed in the same manner as the first barrier layer 151.

Specifically, the mask 170 is disposed on the substrate 110 on which the second barrier layer 152 is formed in the same chamber 160 in which the first barrier layer 151 and the second barrier layer 152 are formed, So that the third barrier layer 153 is deposited. At this time, the distance d between the substrate 110 and the mask 170 is 10 to 10 mm, and the deposition rate is 500 Å / min or less.

The third barrier layer 153 is formed by separating the mask 170 from the substrate 110 so that the third barrier layer 153 can be formed wider than the opening area of the mask 170. [ The third barrier layer 153 thus covers the top and side surfaces of the second barrier layer 152 and is formed on the first barrier layer 151 where the edges are exposed by the second barrier layer 152 .

Since the third barrier layer 153 is deposited at a deposition rate of 500 ANGSTROM / min or less, the crystal structure of the third barrier layer 153 can be more effectively prevented from being infiltrated with foreign moisture. As the third barrier layer 153, a multilayer film made of any one of SiNx, SiOx, SiON, SiOC, and a-C or a combination of two or more of them may be used. The thickness of the third barrier layer 153 is thinner than the thickness of the second barrier layer 152.

The third barrier layer 153 is a barrier layer having a microcrystalline structure and is formed at the outermost portion of the organic light emitting device 130 to prevent moisture or gas from penetrating into the organic light emitting device 130 from the outside have.

In the present invention, the process of depositing the barrier film 150 including the first barrier layer 151, the second barrier layer 152 and the third barrier layer 153 having different film qualities is performed by one identical chamber 160 ), It is possible to reduce the movement of the chambers and the initial investment equipment even when a plurality of barrier layers are deposited, thereby improving the production yield and lowering the cost.

In addition, the present invention can reduce the processing time and the process cost according to the mask material cost by forming the barrier film 150 composed of a plurality of barrier layers using the single mask 170. [

As described above, the barrier layer 150 of the present invention may include the first barrier layer 151, the second barrier layer 152, and the third barrier layer 153. However, the barrier layer 150 of the present invention is not limited thereto, and the barrier layer 150 may be formed of a barrier layer having a plurality of microcrystalline structures and a porous barrier layer as shown in FIG.

That is, the barrier layer 150 of the present invention is formed by repeatedly performing the process of forming the first barrier layer 151 having a microcrystalline structure and the process of forming the porous second barrier layer 152, 3 barrier layer 153 on the substrate.

Therefore, the present invention is characterized in that barrier layers of the same microcrystalline structure are formed on the outermost surface of the barrier film 150 under the same process conditions as those of the first barrier layer 151 or the third barrier layer 153, A porous barrier layer is formed between the barrier layers.

As described above, the present invention can reduce the stress between the barrier layers 150 by forming the porous second barrier layer 152 between the barrier layers 150 surrounding the organic electroluminescent device 130. 5, the first barrier layer 151 and the third barrier layer 153 having a microcrystal structure are formed on the top and side surfaces of the mask 170 that are spaced apart from the uppermost layer, Prevent penetration of gas or gas.

As a result, the present invention prevents permeation of water or gas from the outside to deteriorate the organic electroluminescent device 130, and at the same time improves the ductility characteristics and absorbs external impacts, so that the durability and reliability Can be improved and the life span can be extended.

The above-described techniques represent presently preferred embodiments, and the present invention is not limited to the above-described embodiments and the accompanying drawings. Modifications and other uses of the embodiments will be apparent to those skilled in the art, and such modifications and other uses are intended to be included within the spirit of the present invention or defined by the scope of the appended claims.

1 to 3 are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

4 is a cross-sectional view illustrating an organic light emitting display according to another embodiment of the present invention.

5 is a photograph for explaining a method for manufacturing an organic light emitting display according to the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

110: substrate 130: organic electroluminescent device

150: barrier film 151: first barrier layer

152: second barrier layer 153: third barrier layer

160: chamber 170: mask

Claims (10)

Preparing a substrate on which an organic electroluminescent device is formed; And Forming a barrier film in which a microcrystalline barrier layer and a porous barrier layer are alternately stacked so as to surround the periphery of the organic electroluminescent device, Wherein the barrier layer of the microcrystalline structure is formed using a mask spaced from the substrate, Wherein the porous barrier layer is formed using the mask closely adhered to the substrate. The method of claim 1, wherein forming the barrier layer comprises: Forming a first barrier layer of the microcrystalline structure on the substrate so as to surround the organic electroluminescent device; Forming a porous second barrier layer on the first barrier layer; Repeating the steps of forming the first barrier layer and the second barrier layer; And forming a third barrier layer on the first barrier layer and the second barrier layer under the same process conditions as those of the first barrier layer. 2. The method of claim 1, wherein a distance from the substrate to the mask spaced apart is between 10 um and 10 mm, The deposition rate of the barrier layer of the microcrystalline structure is 500 ANGSTROM / min or less, And the deposition rate of the porous barrier layer is 500 ANGSTROM / min or more. 2. The semiconductor device according to claim 1, wherein the barrier layer of the microcrystalline structure is formed wider than the opening region of the mask, Wherein the porous barrier layer is formed to be the same as the opening area of the mask. The method according to claim 1, wherein barrier layers of the barrier film are formed in the same chamber. The method according to claim 1, wherein the barrier layer of the microcrystalline structure is formed of any one of SiNx, SiOx, SiON, SiOC, and a-C, or a combination of two or more thereof. The method of claim 1, wherein the porous barrier layer comprises one of SiNx, SiOx, SiON, SiOC, and a-C, or a combination of two or more thereof. Preparing a substrate on which an organic electroluminescent device is formed; Forming a first barrier layer around the periphery of the organic electroluminescent device using a mask spaced from the substrate; Forming a second barrier layer on the first barrier layer using the mask adhered from the substrate; And And forming a third barrier layer on the exposed first barrier layer at the same time as surrounding the second barrier layer under the same conditions as the formation of the first barrier layer. Way. 9. The method of claim 8, further comprising: repeating the step of forming the first barrier layer and the step of forming the second barrier layer before forming the third barrier layer, Wherein the first barrier layer, the second barrier layer, and the third barrier layer are formed in the same chamber. The method of claim 8, wherein the first barrier layer and the third barrier layer are barrier layers of a microcrystalline structure, the second barrier layer is a porous barrier layer, Wherein the first barrier layer and the third barrier layer in the microcrystalline structure are formed at the outermost portion of the organic electroluminescent device, Wherein the first barrier layer and the third barrier layer are formed using the mask spaced from the substrate by 10 to 10 mm, Wherein the first barrier layer or the second barrier layer is formed of any one of SiNx, SiOx, SiON, SiOC, and a-C.

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