KR101586739B1 - Film Touch Sensor and Method for Fabricating the Same - Google Patents

Abstract

The present invention relates to a film touch sensor and a manufacturing method thereof for performing a process by creating a separation layer on a carrier substrate and for using the separation layer as a wire coating layer when the carrier substrate is detached. The present invention comprises: the separation layer; an electrode pattern layer which is formed on the separation layer and which includes a sensing electrode and a pad electrode formed on one end of the sensing electrode; an insulation layer formed on the upper part of the electrode pattern layer; and a base film formed on the insulation layer. A circuit board is electrically connected to the pad electrode.

Description

Technical Field [0001] The present invention relates to a film touch sensor and a fabrication method thereof,

The present invention relates to a film touch sensor, and more particularly, to a film touch sensor for forming a separation layer on a carrier substrate to carry out the process, and a manufacturing method thereof.

There have been attempts to introduce a touch input method into a wider variety of electronic devices while the touch input method is being watched as a next generation input method. Accordingly, research and development on a touch sensor capable of being applied to various environments and capable of accurate touch recognition are actively performed have.

For example, in the case of an electronic device having a touch-type display, an ultra-thin flexible display which achieves light weight, low power and improved portability has been attracting attention as a next generation display, and development of a touch sensor applicable to such a display has been required.

Flexible display means a display made on a flexible substrate that can bend, bend or twist without loss of properties, and technology development is under way in the form of flexible LCD, flexible OLED and electronic paper.

In order to apply the touch input method to such a flexible display, a touch sensor excellent in flexing and restoring force and excellent in flexibility and stretchability is required.

As for the film touch sensor for manufacturing such a flexible display, a wiring substrate including wiring buried in a transparent resin base is proposed.

A wiring forming step of forming a metal wiring on the substrate; a lamination step of forming a transparent resin base material by applying and drying a transparent resin solution so as to cover the metal wiring; and a peeling step of peeling the transparent resin base material from the substrate .

In order to smoothly carry out the peeling process, an organic peeling material such as silicone resin or fluororesin, a diamond like carbon (DLC) thin film, a zirconium oxide thin film, or other inorganic peeling material is applied to the surface of the substrate A method of forming in advance is used.

However, when an inorganic stripping material is used, there is a problem that the metal wiring and the substrate remain on the surface of the substrate because the separation of the wiring and the substrate does not proceed smoothly when the substrate and the metal wiring are separated from the substrate. There is a problem in that the organic material is buried on the surface of the wiring and the substrate.

That is, there is a problem that the metal wiring of the wiring substrate can not be completely peeled off from the substrate even when the peeling material is used.

In order to solve such a problem, Korean Patent No. 10-1191865 discloses a method for manufacturing a flexible substrate in the form of a buried metal wiring, a sacrificial layer which can be removed by light or a solvent, After the polymer material (flexible substrate) is formed on the substrate, the sacrificial layer is removed by using light or a solvent to separate the metal wiring and the polymer material (flexible substrate) from the substrate.

However, such a method has a problem that it is difficult to remove the sacrificial layer in a large size, and a high temperature process can not be performed, so that various film substrates can not be used.

Korean Patent No. 10-1191865

In order to solve the problem of the prior art flexible display manufacturing method of the present invention, a film touch sensor is used in which a separation layer is formed on a carrier substrate and a separation layer is separated from the carrier substrate, And a method for producing the same.

An object of the present invention is to provide a film touch sensor in which an insulating layer used as a planarization layer is formed on a transparent conductive layer pattern and a method of manufacturing the same.

The present invention provides a film touch sensor and a method for manufacturing the same which can realize a fixed tax and heat resistance that can not be realized in a process of directly implementing a touch sensor on a film substrate, There is a purpose.

The present invention provides a film touch sensor capable of forming a separation layer on a carrier substrate to perform a touch sensor formation process, bonding a substrate film and separating the carrier substrate from the carrier substrate, and a method of manufacturing the same It has its purpose.

The present invention provides a film touch sensor and a method of manufacturing the same that do not require a separate separation layer removal process since the separation layer is formed on the carrier substrate and the separation layer is not removed even after separation from the carrier substrate have.

An object of the present invention is to provide a film touch sensor and a method of manufacturing the same which can further suppress the occurrence of cracks due to the difference in stress relieving ability by further forming a protective layer whose elasticity is controlled between the separation layer and the insulating layer.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a film touch sensor including: a separation layer; An electrode pattern layer formed on the isolation layer and including a sensing electrode and a pad electrode formed on one end of the sensing electrode; An insulating layer formed on the electrode pattern layer; A base film formed on the insulating layer; And a control unit.

In addition, the film touch sensor may further include a protective layer formed between the separation layer and the electrode pattern layer.

The insulating layer is characterized in that the difference in modulus of elasticity at 25 DEG C with the protective layer is 300 MPa or less.

The insulating layer is characterized in that the difference in elastic modulus at 25 캜 between the protective layer and the protective layer is 100 MPa or less.

The film touch sensor may further include a pad pattern layer formed under the pad electrode.

Here, the pad pattern layer may be formed of at least one material selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks.

In addition, the pad pattern layer may be a conductive layer of two or more layers.

The insulating layer is formed to cover the electrode pattern layer, and the surface opposite to the surface in contact with the electrode pattern layer is flat.

In addition, the insulating layer may be formed of at least one material selected from an organic insulating film and an inorganic insulating film.

And the electrode pattern layer is a transparent conductive layer.

Here, the transparent conductive layer may be formed of at least one material selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks.

The electrode pattern layer may further include a bridge electrode.

The electrode pattern layer may be a conductive layer of two or more layers.

And the separation layer is formed on the carrier substrate and then separated from the carrier substrate.

The separating layer is characterized in that the separating force with the carrier substrate is 1 N / 25 mm or less.

In addition, the separating layer is characterized in that the separating force with the carrier substrate is 0.1 N / 25 mm or less.

The separation layer has a surface energy of 30 to 70 mN / m after peeling off from the carrier substrate.

Further, the surface energy difference between the separation layer and the carrier substrate is 10 mN / m or more.

The carrier substrate is a glass substrate.

The separation layer is a polymer organic film.

Here, the polymer organic film may be formed of at least one selected from the group consisting of polyimide, polyvinyl alcohol, polyamic acid, polyamide, polyethylene, polystyrene, polynorbornene ), A phenylmaleimide copolymer, a polyazobenzene, a polyphenylenephthalamide, a polyester, a polymethyl methacrylate, a polyarylate, At least one substance selected from the group consisting of a cinnamate-based polymer, a coumarin-based polymer, a phthalimidine-based polymer, a chalcone-based polymer, and an aromatic acetylene-based polymer.

The thickness of the separation layer is 10 to 1000 nm.

The thickness of the separation layer is 50 to 500 nm.

The film touch sensor may further include a circuit board electrically connected to the pad electrode.

Further, the circuit board is electrically connected to the pad electrode through the separation layer.

In addition, the circuit board is electrically connected to the pad electrode through the pad pattern layer.

The base film may be any one of a polarizing plate, an isotropic film, a retardation film, and a protective film.

The film touch sensor may further include an adhesive layer formed between the insulating layer and the base film.

Further, the adhesive layer is formed of a pressure-sensitive adhesive or an adhesive.

According to another aspect of the present invention, there is provided a method of manufacturing a film touch sensor including: forming a separation layer on a carrier substrate; Forming an electrode pattern layer including a sensing electrode and a pad electrode on the isolation layer; Forming an insulating layer on the electrode pattern layer; Attaching a base film on the insulating layer; And a carrier substrate removing step of separating the separation layer from the carrier substrate; And a control unit.

Here, the base film adhering step is characterized in that the base film and the insulating layer are bonded by an adhesive.

Further, in the step of attaching the base film, the base film and the insulating layer are bonded by a pressure-sensitive adhesive.

The method of manufacturing a film touch sensor may further include: forming a protective layer on the isolation layer after the isolation layer formation step; Removing a portion of the protective layer in a region corresponding to a portion where the pad electrode is to be formed to expose the isolation layer; Wherein the electrode pattern layer forming step forms an electrode pattern layer on the protective layer and the exposed separation layer.

The method of manufacturing a film touch sensor may further include: forming a protective layer on the isolation layer after the isolation layer formation step; Wherein forming the protective layer includes exposing a part of the isolation layer in a region where the pad electrode is to be formed, and forming the electrode pattern layer includes forming an electrode pattern layer on the protective layer and the exposed isolation layer .

The method of fabricating the film touch sensor may further include: forming a pad pattern layer in advance on a portion where the pad electrode is to be formed; As shown in FIG.

The carrier substrate removing step separates the separation layer from the carrier substrate by using a lift-off method or a peel-off method.

Here, the carrier substrate removing step separates the separation layer from the carrier substrate with a force of 1 N / 25 mm or less.

The method of manufacturing the film touch sensor may further include: a circuit board bonding step of bonding the circuit board to the pad electrode after the carrier substrate removing step; As shown in FIG.

In addition, the method of manufacturing a film touch sensor may include: a circuit board bonding step of bonding a circuit board to the pad pattern layer after the carrier substrate removing step; As shown in FIG.

The film touch sensor and the manufacturing method thereof according to the present invention have the following effects.

First, the separation layer is formed on the carrier substrate, and the separation layer is used as a wiring coating layer when separated from the carrier substrate, thereby improving process efficiency and productivity.

Second, the efficiency of the touch sensor manufacturing process can be improved by forming the insulating layer used as the planarization layer on the transparent conductive layer pattern.

Third, a process for realizing a touch sensor on a carrier substrate is carried out, thereby securing fixed weight, heat resistance, and diversifying the film substrate.

Fourth, the pad pattern layer may be formed of a single layer or a plurality of layers of metal or metal oxide on the separation layer, thereby effectively reducing the contact resistance with the circuit board and improving the stability of the process.

Fifth, after separating the carrier substrate from the carrier substrate without removing the separation layer formed on the carrier substrate, the circuit substrate may be attached to the pad pattern layer to increase the efficiency of the process.

Sixth, since separation layer removal process is not performed after separation from the carrier substrate, the process can be simplified and the problem of being applied to the touch sensor area in the removal process can be solved.

Seventh, a protective layer having a controlled elastic modulus can be additionally formed between the separation layer and the insulating layer to suppress the occurrence of cracks due to the difference in stress relieving ability.

1 to 4 are structural cross-sectional views of a film touch sensor according to an embodiment of the present invention
5A through 5K are cross-sectional views of a process according to an embodiment of a method of manufacturing a film touch sensor according to the present invention

Hereinafter, preferred embodiments of the film touch sensor and the manufacturing method thereof according to the present invention will be described in detail as follows.

The features and advantages of the film touch sensor and the manufacturing method thereof according to the present invention will be apparent from the following detailed description of each embodiment.

1 to 4 are sectional views of a film touch sensor according to an embodiment of the present invention.

The present invention relates to a method for manufacturing a touch sensor, which comprises forming a separation layer on a carrier substrate, performing a touch sensor formation process, separating the carrier substrate from the carrier substrate, And the film base material can be diversified.

A pad pattern layer made of a metal or a metal oxide is formed on a separation layer in a single layer or a plurality of stacked layers to effectively reduce the contact resistance with the circuit board and increase the stability of the process.

As shown in FIG. 1, the film touch sensor according to the present invention includes a separation layer; An electrode pattern layer formed on the isolation layer and including a sensing electrode and a pad electrode formed on one end of the sensing electrode; An insulating layer formed on the electrode pattern layer; A base film formed on the insulating layer; And a control unit.

Here, the separation layer may be a polymer organic film, for example, polyimide, polyvinyl alcohol, polyamic acid, polyamide, polyethylene, polystyrene, ), Polynorbornene, phenylmaleimide copolymer, polyazobenzene, polyphenylenephthalamide, polyester, polymethyl methacrylate, polymethylmethacrylate, polymethylmethacrylate, At least one selected from the group consisting of polyarylates, cinnamate polymers, coumarin polymers, phthalimidine polymers, chalcone polymers and aromatic acetylene polymers, ≪ / RTI >

After the separation layer 20 is coated on the carrier substrate 10, an electrode pattern layer or the like is formed thereon and then finally separated from the carrier substrate 10.

The separating force of the separating layer 20 is preferably 1 N / 25 mm or less, more preferably 0.1 N / 25 mm or less. That is, it is preferable that the separation layer 20 is formed of a material such that the physical force applied when the separation layer 20 and the carrier substrate 10 are separated does not exceed 1 N / 25 mm, especially 0.1 N / 25 mm.

When the peeling force of the separating layer 20 is more than 1 N / 25 mm, the separating layer 20 may not be separated neatly when separated from the carrier substrate, and the separating layer 20 may remain on the carrier substrate. This is because there is a possibility that cracks may occur in at least one of the protective layer 30, the electrode pattern layer 50, and the insulating layer 70.

Particularly, the peeling force of the separation layer 20 is more preferably 0.1 N / 25 mm or less, and in the case of 0.1 N / 25 mm or less, the curl generated in the film after peeling from the carrier substrate is more controllable . Although the curl does not cause any problem in terms of the function of the film touch sensor, it is advantageous to reduce the curl since the process efficiency in the joining process, the cutting process, and the like may be lowered.

Here, the thickness of the separation layer 20 is preferably 10 to 1000 nm, more preferably 50 to 500 nm. If the thickness of the separating layer 20 is less than 10 nm, the uniformity of the separating layer may be reduced and the electrode pattern may not be uniformly formed, or the separating layer 20 may be locally peeled and torn, There is a problem that the curl is not controlled. If the thickness exceeds 1000 nm, the peeling force is not lowered further, and the flexibility of the film is deteriorated.

It is also preferable that the separation layer has a surface energy of 30 to 70 mN / m after peeling off from the carrier substrate, and a surface energy difference between the separation layer and the carrier substrate is preferably 10 mN / m or more. The separating layer must be stably adhered to the carrier substrate in the process of manufacturing the film touch sensor from the carrier substrate to the carrier substrate and peeled off easily from the carrier substrate in order to prevent tearing or curling of the film touch sensor do. When the surface energy of the separation layer is set to 30 to 70 mN / m, the peeling force can be adjusted, and adhesion between the separation layer and the adjacent protective layer or electrode pattern layer is ensured and the process efficiency is improved. Also, when the difference in surface energy between the separation layer and the carrier substrate is 10 mN / m or more, it can be smoothly peeled off from the carrier substrate, thereby preventing tearing of the film touch sensor and cracks in each layer of the film touch sensor.

An electrode pattern layer 50 is formed on the upper part of the separation layer 20. The separation layer 20 functions as a coating layer covering the electrode pattern layer 50 after being separated from the carrier substrate, Which serves as a protective layer for protecting the semiconductor device from external contact.

At least one protective layer 30 may be further formed on the isolation layer 20. One or more protective layers 30 may be formed on the separation layer 20 since the separation layer 20 alone may be difficult to protect the electrode pattern against external contact or impact

The protective layer 30 includes at least one of an organic insulating film and an inorganic insulating film, and may be formed by a method of coating and hardening or by vapor deposition.

The protective layer may be formed by partially removing the portion where the pad electrode is to be formed by a method such as patterning, or by applying the portion except for the portion where the pad electrode is to be formed. Preferably, a protective layer may be formed such that the separation layer is exposed. This is because the circuit board and the pad electrode can be connected smoothly when the circuit board is connected.

The pad pattern layer 40 may be formed under the pad electrode. The pad pattern layer can be provided for the purpose of lowering the contact resistance when the circuit board and the pad electrode are connected. When the contact resistance is sufficiently low when the pad electrode and the circuit board are connected, the pad pattern layer may be omitted.

The pad pattern layer 40 may be formed of one or more materials selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks.

Here, the metal may be any one of Au, Ag, Cu, Mo, Al, Pd, Ne, and Ag-APC.

The metal nanowires may be any one of silver nanowires, copper nanowires, zirconium nanowires, and gold nanowires.

The metal oxide is selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), florinthine oxide (ZnO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide- IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO).

The pad pattern layer 40 may be formed of a carbon material including carbon nanotube (CNT) or graphene.

The conductive polymer includes polypyrrole, polythiophene, polyacetylene, PEDOT, and polyaniline, and may be formed of such a conductive polymer.

The conductive ink is an ink in which a metal powder and a curable polymer binder are mixed, and an electrode may be formed using the ink.

2A and 2B, the pad pattern layer 40 is formed in the form of a first pad pattern layer 41 and a second pad pattern layer 42 in order to reduce the electrical resistance and the contact resistance with the circuit board. Or more of the conductive layer.

An example of a specific laminated structure of the pad pattern layer 40 is as follows. A structure in which a metal is stacked and a metal is stacked thereon, a structure in which a metal is stacked and a metal oxide is stacked thereon, a structure in which a metal is stacked, a metal oxide is stacked thereon, A structure in which a metal oxide is stacked, a metal is stacked on the metal oxide, and a metal oxide is further stacked thereon.

An electrode pattern layer 50 is formed on the isolation layer 20 or the protection layer 30. The electrode pattern layer 50 includes a sensing electrode SE for sensing the touch and a pad electrode PE formed at one end of the sensing electrode SE. Here, the sensing electrode SE may include not only an electrode for sensing a touch but also a wiring pattern connected to the electrode. The pad electrode PE can be electrically connected to the circuit board.

The electrode pattern layer 50 is a transparent conductive layer and may be formed of one or more materials selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks.

Here, the metal may be any one of Au, Ag, Cu, Mo, Al, Pd, Ne, and Ag-APC.

The metal nanowires may be any one of silver nanowires, copper nanowires, zirconium nanowires, and gold nanowires.

The metal oxide is selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), florinthine oxide (ZnO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide- IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO).

The electrode pattern layer 40 may be formed of a carbon material including carbon nanotube (CNT) or graphene.

The conductive polymer includes polypyrrole, polythiophene, polyacetylene, PEDOT, and polyaniline, and may be formed of such a conductive polymer.

The conductive ink is an ink in which a metal powder and a curable polymer binder are mixed, and an electrode may be formed using the ink.

The electrode pattern layer 50 may be formed of two or more conductive layers in the form of a first electrode layer 51 and a second electrode layer 52, as shown in FIG. 2A, in order to reduce electrical resistance.

The electrode pattern layer 50 may be formed of one layer of ITO, AgNW (silver nano wire), or metal mesh. In the case of forming two or more layers, the first electrode layer 51 may be formed of a transparent metal such as ITO And the second electrode layer 52 can be formed on the ITO electrode layer using metal, AgNW or the like in order to further lower the electrical resistance.

In order to improve the electrical conductivity of the electrode pattern layer 50, at least one electrode pattern layer made of metal or metal oxide may be formed. More specifically, the electrode pattern layer may be formed by forming a transparent conductive layer of a metal or a metal oxide on a separation layer or a protective layer, and then further laminating a transparent conductive layer to form an electrode pattern, An electrode pattern can be formed by laminating a transparent conductive layer and then forming a transparent conductive layer with a metal or a metal oxide. A specific example of the lamination structure of the electrode pattern is as follows. A structure in which a metal or metal oxide pattern layer is further formed between the separation layer and the electrode pattern layer, a structure in which a metal or metal oxide pattern layer is further formed between the electrode pattern layer and the insulation layer, A metal oxide pattern layer may be further formed, and further, one or more electrode pattern layers made of a transparent conductive material may be included.

A specific example of the lamination structure of the applicable electrode pattern layer 50 is as follows.

A structure in which a metal oxide is laminated and a silver nano wire is laminated thereon, a structure in which a metal oxide is laminated and a metal is laminated thereon, a structure in which a metal oxide is laminated and a metal mesh electrode is laminated thereon, A structure for laminating a metal oxide on the metal oxide layer, a structure for laminating a metal oxide on the metal oxide layer, a structure for laminating a metal oxide on the metal oxide layer, a structure for laminating a metal oxide on the metal oxide layer, And a structure in which a metal layer is laminated on the metal layer, and a structure in which a metal layer is laminated on the metal layer, and a structure in which a metal layer is laminated on the metal layer, It is not limited to the above-described laminated structure.

The electrode pattern layer may include an electrical insulating layer between the first electrode pattern layer and the second electrode pattern layer and may form a contact hole by patterning the electrical insulating layer to form the second conductive layer as a bridge electrode .

The structure of the electrode pattern layer will be described below in terms of the touch sensor method.

The pattern structure of the electrode pattern layer is preferably an electrode pattern structure used for the electrostatic capacity method, and mutual-capacitance or self-capacitance may be applied.

In case of mutual-capacitance, it may be a lattice electrode structure having a horizontal axis and a vertical axis. Bridge electrodes may be formed at the intersections of the electrodes on the horizontal axis and the vertical axis or the horizontal axis electrode pattern layer and the vertical axis electrode pattern layer may be formed and electrically separated from each other.

In the case of a self-capacitance type, it may be an electrode layer structure in which a change in capacitance is read using one electrode at each point.

The electrode pattern layer 50 may have a structure in which a photosensitive resist 60 is formed on the upper portion as shown in FIG. 2B. The electrode pattern layer 50 may be formed by a method such as photolithography. The electrode pattern layer 50 may be removed after the electrode pattern layer is formed or may remain, depending on the type of the photosensitive resist. In the structure in which the photosensitive resist remains, the photosensitive resist may serve to protect the electrode pattern layer

An insulating layer 70 is formed on the electrode pattern layer 50. The insulating layer may prevent corrosion of the electrode pattern and protect the surface of the electrode pattern. It is preferable that the insulating layer 70 is formed to have a constant thickness by filling the gap between the electrode and the wiring. That is, it is preferable that the surface opposite to the surface in contact with the electrode pattern layer 50 is formed flat so as not to reveal the irregularities of the electrode.

The difference in modulus of elasticity between the protective layer 30 and the insulating layer 70 at 25 캜 is preferably 300 MPa or less, more preferably 100 MPa or less. This is because the difference in the modulus of elasticity between the protective layer and the insulating layer is made to be 300 MPa or less at 25 DEG C because when the difference in modulus of elasticity exceeds 300 MPa, This is because an imbalance occurs in the elimination ability and a crack is generated.

The reason for measuring the difference in elastic modulus at 25 占 폚 is that cracks should not occur in the environment used by the user.

The insulating layer is not particularly limited as long as it is an organic insulating material satisfying that the difference in elastic modulus with respect to the protective layer is 300 MPa or less. However, the insulating layer is preferably a thermosetting or UV curable organic polymer.

The insulating layer may be formed of at least one material selected from the group consisting of an epoxy compound, an acrylic compound, and a melamine compound.

The insulating layer 70 itself can function as an adhesive layer composed of an adhesive or an adhesive. The insulating layer may include at least one material selected from the group consisting of polyester, polyether, polyurethane, epoxy, silicone, and acrylic. When the insulating layer 70 functions as an adhesive layer, the base film 100 may be directly bonded onto the insulating layer 70 as shown in FIGS.

3, a separate adhesive layer 80 may be formed between the insulating layer 70 and the base film 100 and bonded thereto. The adhesive layer 80 is formed of a pressure-sensitive adhesive or an adhesive, and can be either a thermosetting type or a UV-curing type. In this case, the adhesive layer may be first formed on one side of the base film 100 and then the base film may be adhered. An NCF (Non Carrier Film) type adhesive film or an adhesive film may be used. Further, the base film 100 may be adhered by coating an adhesive layer on the upper surface of the insulating layer. It is possible to apply an OCR (Optically Clear Resin) type liquid adhesive, cover the substrate film, and cure it. The adhesive or pressure-sensitive adhesive used for bonding the base film 100 is preferably a polyester, polyether, polyurethane, epoxy, silicone, or acrylic material.

Here, the base film 100 may be a transparent film or a polarizing plate.

As the transparent film, a film excellent in transparency, mechanical strength and thermal stability may be used. Specific examples thereof include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; Cellulose-based resins such as diacetylcellulose and triacetylcellulose; Polycarbonate resin; Acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; Styrene resins such as polystyrene and acrylonitrile-styrene copolymer; Polyolefin resins such as polyethylene, polypropylene, cyclo- or norbornene-structured polyolefins, ethylene-propylene copolymers; Vinyl chloride resin; Amide resins such as nylon and aromatic polyamide; Imide resin; Polyether sulfone type resin; Sulfone based resin; Polyether ether ketone resin; A sulfided polyphenylene resin; Vinyl alcohol-based resin; Vinylidene chloride resins; Vinyl butyral resin; Allylate series resin; Polyoxymethylene type resin; Epoxy resin, and the like, and a film composed of the blend of the thermoplastic resin may also be used. Further, a film made of a thermosetting resin such as (meth) acrylic, urethane, acrylic urethane, epoxy, or silicone or a film made of an ultraviolet curable resin may be used. Though the thickness of such a transparent film can be suitably determined, it generally ranges from 1 to 500 占 퐉 in view of workability such as strength and handleability, and thin layer properties. Particularly preferably 1 to 300 mu m, and more preferably 5 to 200 mu m.

Such a transparent film may contain one or more suitable additives. Examples of the additive include an ultraviolet absorber, an antioxidant, a lubricant, a plasticizer, a release agent, a coloring inhibitor, a flame retardant, a nucleating agent, an antistatic agent, a pigment and a colorant. The transparent film may be a structure including various functional layers such as a hard coating layer, an antireflection layer, and a gas barrier layer on one side or both sides of the film. The functional layer is not limited to the above, and various functional layers .

Further, if necessary, the transparent film may be surface-treated. Examples of the surface treatment include a chemical treatment such as an alkaline treatment including a dry treatment such as a plasma treatment, a corona treatment, a primer treatment, and a saponification treatment.

Further, the transparent film may be an isotropic film, a retardation film, or a protective film.

Nx and ny are the main refractive index in the film plane, nz is the refractive index in the film thickness direction, and d is the film thickness) is 40 nm or less and 15 nm or less, And the retardation in the thickness direction (Rth, Rth = [(nx + ny) / 2-nz] xd) is from -90 nm to +75 nm, preferably -80 nm to +60 nm, particularly preferably -70 nm to +45 nm desirable.

The retardation film is a film produced by the uniaxial stretching, biaxial stretching, polymer coating and liquid crystal coating method of a polymer film, and is generally used for improving the viewing angle of the display, improving the color feeling, improving the light leakage, do.

The types of the retardation film include a wave plate of 1/2 or 1/4, a positive C plate, a negative C plate, a positive A plate, a negative A plate, and a biaxial wave plate.

The protective film may be a film including an adhesive layer on at least one side of a film made of a polymer resin, or a self-adhesive film such as polypropylene, and may be used for protecting the surface of the touch sensor and improving the processability.

As the polarizing plate, any known one used in the display panel can be used.

Specifically, a film obtained by stretching a polyvinyl alcohol film to provide a protective layer on at least one surface of a polarizer obtained by dyeing iodine or a dichroic dye, a film obtained by orienting a liquid crystal to have a polarizer performance, a film made of polyvinyl alcohol Or the like, and then stretching and dyeing the resultant, and the present invention is not limited thereto.

The film touch sensor of the present invention can be electrically connected to the circuit board as in Fig. The circuit board may be a flexible printed circuit board (FPCB), for example, and electrically connects the touch control circuit to the film touch sensor of the present invention. The film touch sensor can be bonded to the circuit board using a conductive adhesive.

An electrode corresponding to the pad electrode PE is formed on one end of the circuit board 110 and is electrically connected to the pad electrode PE by a conductive adhesive. And may be connected through the pad pattern layer 40 to reduce the contact resistance between the pad electrode and the circuit board. As an example of the film touch sensor connected to the circuit board, the circuit board may be bonded to the pad pattern layer as shown in FIG. 4, and may be connected through the separation layer.

The method of attaching the circuit board to the pad electrode through the pad pattern layer is to selectively reduce the contact resistance between the circuit board and the pad electrode according to the manufacturing process and product specifications.

Further, the circuit board may be connected to the exposed pad electrode or pad pattern layer by removing the separation layer. The process of removing the separation layer 20 may be a wet etching process, and the etching solution may be selected depending on the material of the separation layer 20.

For example, when the material of the separating layer 20 is a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer or the like, it can be removed with a basic chemical such as KOH, TMAH or amines, A polymer, a coumarin-based polymer, a chalcone-based polymer, an aromatic acetylenic polymer or the like, it can be removed with an acidic chemical such as phosphoric acid, acetic acid, nitric acid or the like.

The manufacturing process of the film touch sensor according to the present invention having the above-described structure will be described with reference to FIGS. 5A to 5K.

5A to 5K are cross-sectional views illustrating a method of manufacturing a film touch sensor according to a first embodiment of the present invention, and a method of manufacturing the film touch sensor according to the present invention will be described in detail with reference to the drawings.

As shown in FIG. 5A, a separation layer 20 is formed by first coating a polymer organic film on a carrier substrate 10.

As a method of applying the separation layer, known coating methods can be used.

For example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating and the like can be mentioned.

The carrier substrate 10 is preferably a glass substrate, but not limited to a glass substrate, and other substrate may be used as the carrier substrate 10. However, a material having heat resistance that can not be deformed even at a high temperature, that is, can maintain flatness so as to withstand the process temperature at the time of forming an electrode is preferable.

The curing process for forming the separation layer 20 as described above may be performed using heat curing or UV curing alone, or using a combination of thermal curing and UV curing.

As shown in FIG. 5B, an organic insulating material is applied on the separation layer to form the protective layer 30. [

5C, a region where the pad pattern layer 40 is to be formed is patterned to remove a protective layer of a region where the pad pattern layer 40 is to be formed in the passivation layer 30. Next, as shown in FIG.

The protective layer 30 may be removed by a method such as patterning to form a pad pattern layer for circuit connection, or may be applied except for a portion where the pad pattern layer is to be formed. A pad pattern layer for connection to the circuit board can be formed at a portion where the protective layer is not formed. In the present embodiment, it is explained that the protective layer is patterned and removed.

5D, a metal layer is deposited on the protective layer and the protective layer are removed to form a pad pattern layer 40 with the metal layer remaining only on the patterned region of the protective layer.

The pad pattern layer 40 may be formed of at least one material selected from the group consisting of metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks, and may be formed of one or more conductive layers As shown in FIG. In the case of the first layer, a pad pattern layer may be formed of at least one material selected from metals and metal oxides. In the case of a two-layer structure, for example, the first pad pattern layer 41 is preferably made of copper, and the second pad pattern layer 42 is preferably made of a material having better conductivity than the electrode material such as gold. In addition, when the pad electrode is formed of a material having a low resistance and the contact resistance is sufficiently low at circuit connection, the pad pattern layer may be omitted. In this embodiment, it is described that the pad pattern layer has a laminate structure of two layers.

Then, an electrode pattern layer is formed on the protective layer and the pad pattern layer.

5E, a silver nano wire (AgNW) transparent conductive layer is formed as a first electrode layer 51, and a metal is deposited as a second electrode layer 52 on the transparent conductive layer. 5F, a photosensitive resist 60 is formed on the metal conductive layer. Thereafter, selective patterning is performed through a photolithography process to form an electrode pattern layer 50 as shown in FIG. 5G.

The transparent conductive layer may be formed by a sputtering process such as CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition), screen printing, gravure printing, reverse offset, , Ink jet (Ink Jet), or dry or wet plating. In the case of film formation by a sputtering process, a mask having a desired electrode pattern shape is disposed on a substrate, and a sputtering process is performed, A pattern layer may be formed. In addition, a conductive layer may be formed on the entire surface by the above-described film formation method, and the electrode pattern layer may be formed by photolithography.

The photosensitive resist 60 may be a negative type photosensitive resist or a positive type photosensitive resist. After the patterning process, the photosensitive resist may remain on the electrode pattern layer 50 And may be removed. In this embodiment, a negative-type photosensitive resist is used and a laminated structure remaining on the electrode pattern after the patterning process is completed will be described.

The electrode pattern formation may further include an additional electrode pattern formation step depending on the electrode pattern structure.

Next, an insulating layer 70 is formed so that the electrode pattern layer 50 is covered as shown in FIG. 5H. The thickness of the insulating layer 70 is formed to be equal to or larger than the thickness of the electrode, so that the upper surface of the insulating layer has a flat shape. That is, an insulating material having appropriate viscoelasticity should be used so that irregularities of the electrode are not transferred.

Specifically, a liquid material to be an insulating layer is applied on the electrode pattern layer, and an insulating layer is formed by a method such as thermal curing or UV curing.

As a method of applying the insulating layer, a known coating method can be used.

For example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating and the like can be mentioned.

Next, an adhesive layer 80 is formed on the insulating layer 70 to attach the base film 100 as shown in FIG. 5I. In this case, the adhesive layer 80 may be formed on one side of the base film 100 and then adhere to the base film. An NCF (Non Carrier Film) type adhesive film or an adhesive film may be used. An adhesive layer 80 may be coated on the insulating layer 70 to adhere the base film 100. An OCR (Optically Clear Resin) type liquid adhesive may be applied, the base film may be covered, .

Next, as shown in FIG. 5J, the separation layer 20 on which the electrodes are formed is separated from the carrier substrate 10 used for the manufacturing process of the touch sensor.

In the present invention, the separation layer 20 is separated by a method of peeling from the carrier substrate 10.

The method of peeling may be a lift-off method or a peel-off method, but is not limited thereto.

In this case, the magnitude of the force applied at the time of peeling may vary depending on the peeling force of the separation layer, but it is preferably 1 N / 25 mm or less, more preferably 0.1 N / 25 mm or less. If the peeling force is more than 1 N / 25 mm, there is a possibility that the film touch sensor tears when peeling off from the carrier substrate, and excessive force is applied to the film touch sensor, have.

Next, the film touch sensor and the circuit board 110 may be bonded together. At this time, a conductive adhesive may be used to bond the circuit board 110 to the film touch sensor.

The conductive adhesive refers to a conductive filler such as gold, silver, copper, nickel, carbon, aluminum, or plating dispersed in a binder such as epoxy, silicone, urethane, acrylic or polyimide resin.

When the circuit board 110 is connected to the carrier substrate 10 after being separated from the carrier substrate 10, it is preferable to bond them in the direction of the separation layer 20 using a conductive adhesive. The circuit board 110 may be connected to the pad electrode PE through the separation layer 20 or may be connected to the pad electrode PE through the pad pattern layer 40 formed under the pad electrode PE through the separation layer 20. [ (PE).

5K, the pad electrode PE and the circuit board 110 are connected to each other through the pad pattern layer 40. That is, this embodiment describes that the circuit board is connected to the circuit board 110 by bonding the circuit board with the pad pattern layer through the separation layer by the conductive adhesive agent.

The film touch sensor manufactured by the present invention may be disposed such that the base film is positioned on the viewer side when adhered to the display panel, and conversely, the film may be disposed on the display panel side. Further, the separation layer may be bonded to another optical film, for example, a polarizing plate, a transparent film or the like.

The film touch sensor and the method of manufacturing the same according to the present invention realize a touch sensor on a carrier substrate, so that it is possible to secure a fixed tax and heat resistance that can not be achieved in a process of directly implementing a touch sensor on a film substrate, will be. That is, a base film having a low heat resistance can be used because the base film is bonded after the formation of the electrodes.

Further, after the carrier substrate is separated from the carrier substrate without removing the separation layer formed on the carrier substrate, the circuit substrate may be attached through the separation layer, or the separation layer may be removed and the circuit substrate may be attached to improve the efficiency of the process have.

In addition, the peeling force and the surface energy of the separation layer can be parameterized to improve the efficiency of the process and to prevent cracks during the process.

As described above, it will be understood that the present invention is implemented in a modified form without departing from the essential characteristics of the present invention.

It is therefore to be understood that the specified embodiments are to be considered in an illustrative rather than a restrictive sense and that the scope of the invention is indicated by the appended claims rather than by the foregoing description and that all such differences falling within the scope of equivalents are intended to be embraced therein It should be interpreted.

10. Carrier substrate 20. Separation layer
30. Protective layer 40. Pad pattern layer
41. First pad pattern layer 42. Second pad pattern layer
50. Electrode pattern layer 51. First electrode layer
52. Second electrode layer 60. A photosensitive resist
70. Insulation layer 80. Adhesive layer
100. Base film 110. Circuit board
SE. Sensing electrode PE. Pad electrode

Claims (39)

A separation layer;
An electrode pattern layer formed on the isolation layer and including a sensing electrode and a pad electrode formed on one end of the sensing electrode;
An insulating layer formed on the electrode pattern layer so as to cover the entire electrode pattern layer;
A base film formed on the insulating layer;
Wherein the insulating layer is formed to cover the electrode pattern layer, and the surface opposite to the surface in contact with the electrode pattern layer is flat. The method according to claim 1,
Wherein the film touch sensor further comprises a protective layer formed between the separation layer and the electrode pattern layer. 3. The method of claim 2,
Wherein the insulating layer has a difference in elastic modulus at 25 캜 between the protective layer and the protective layer is 300 MPa or less. 3. The method of claim 2,
Wherein the insulating layer has a difference in elastic modulus at 25 DEG C of not more than 100 MPa with the protective layer. The method according to claim 1,
Wherein the film touch sensor further comprises a pad pattern layer formed under the pad electrode. 6. The method of claim 5,
Wherein the pad pattern layer is formed of at least one material selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks. 6. The method of claim 5,
Wherein the pad pattern layer is a conductive layer of two or more layers. delete The method according to claim 1,
Wherein the insulating layer is formed of at least one material selected from an organic insulating film and an inorganic insulating film. The method according to claim 1,
Wherein the electrode pattern layer is a transparent conductive layer. 11. The method of claim 10,
Wherein the transparent conductive layer
A film touch sensor formed from one or more materials selected from metals, metal nanowires, metal oxides, carbon nanotubes, graphenes, conductive polymers, and conductive inks. 11. The method of claim 10,
Wherein the electrode pattern layer further comprises a bridge electrode. 11. The method according to claim 1 or 10,
Wherein the electrode pattern layer is a conductive layer of two or more layers. The method according to claim 1,
Wherein,
Wherein the film touch sensor is formed on the carrier substrate and separated from the carrier substrate. 15. The method of claim 14,
Wherein,
And a peeling force with the carrier substrate is 1 N / 25 mm or less. 15. The method of claim 14,
Wherein,
And a peeling force with the carrier substrate is 0.1 N / 25 mm or less. 15. The method of claim 14,
Wherein the separation layer has a surface energy of 30 to 70 mN / m after separation from the carrier substrate. 18. The method of claim 17,
Wherein the surface energy difference between the separation layer and the carrier substrate is 10 mN / m or more. 15. The method of claim 14,
Wherein the carrier substrate is a glass substrate. The method according to claim 1 or 14,
Wherein the separation layer is a polymer organic film. 21. The method of claim 20,
The polymer organic film may be,
Polyimide, polyvinyl alcohol, polyamic acid, polyamide, polyethylene, polystylene, polynorbornene, phenylmaleimide copolymer, Polyamides such as phenylmaleimide copolymer, polyazobenzene, polyphenylenephthalamide, polyester, polymethyl methacrylate, polyarylate, cinnamate, A film touch sensor comprising at least one material selected from the group consisting of a polymer, a coumarin-based polymer, a phthalimidine-based polymer, a chalcone-based polymer, and an aromatic acetylene-based polymer. The method according to claim 1 or 14,
Wherein the separation layer has a thickness of 10 to 1000 nm. The method according to claim 1 or 14,
Wherein the separation layer has a thickness of 50 to 500 nm. The method according to claim 1,
Wherein the film touch sensor further comprises a circuit board electrically connected to the pad electrode. 25. The method of claim 24,
Wherein the circuit board is electrically connected to the pad electrode through a separation layer. 25. The method of claim 24,
Wherein the circuit board is electrically connected to the pad electrode through a pad pattern layer. The method according to claim 1,
Wherein the base film is any one of a polarizing plate, an isotropic film, a retardation film, and a protective film. The method according to claim 1,
Wherein the film touch sensor further comprises an adhesive layer formed between the insulating layer and the base film. 29. The method of claim 28,
Wherein the adhesive layer is formed of an adhesive or an adhesive. A separation layer forming step of forming a separation layer on the carrier substrate;
Forming an electrode pattern layer including a sensing electrode and a pad electrode on the isolation layer;
Forming an insulating layer on the electrode pattern layer so as to cover the entire electrode pattern layer and flatten the surface opposite to the surface in contact with the electrode pattern layer;
Attaching a base film on the insulating layer; And
A carrier substrate removing step of separating the separation layer from the carrier substrate;
The method comprising the steps of: 31. The method of claim 30,
Wherein the base film adhering step comprises bonding the base film and the insulating layer with an adhesive. 31. The method of claim 30,
Wherein the step of attaching the base film comprises bonding the base film and the insulating layer to each other with an adhesive. 31. The method of claim 30,
The method for fabricating a film touch sensor includes: forming a protective layer on the isolation layer after the isolation layer formation step;
Removing a portion of the protective layer in a region corresponding to a portion where the pad electrode is to be formed to expose the isolation layer;
Further comprising:
Wherein the electrode pattern layer forming step forms an electrode pattern layer on the protective layer and the exposed separation layer. 31. The method of claim 30,
The method for fabricating a film touch sensor includes: forming a protective layer on the isolation layer after the isolation layer formation step;
Further comprising:
The passivation layer may be formed to partially expose the isolation layer in the region where the pad electrode is to be formed.
Wherein the electrode pattern layer forming step forms an electrode pattern layer on the protective layer and the exposed separation layer. 34. The method according to any one of claims 30, 33 and 34,
The method of manufacturing the film touch sensor
Forming a pad pattern layer in advance on a portion where the pad electrode is to be formed;
Further comprising the steps of: 31. The method of claim 30,
Wherein the carrier substrate removing step separates the separation layer from the carrier substrate using a lift-off or a peel-off method. 37. The method of claim 30 or 36,
The carrier substrate removing step
And separating the separation layer from the carrier substrate with a force of 1 N / 25 mm or less. 36. The method of claim 30 or 36,
The method of manufacturing a film touch sensor includes: a circuit board bonding step of bonding a circuit board to the pad electrode after the carrier substrate removing step;
Further comprising the steps of: 36. The method of claim 35,
The method of fabricating the film touch sensor includes: a circuit board bonding step of bonding a circuit board to the pad pattern layer after the carrier substrate removing step;
Further comprising the steps of:

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