KR101586577B1 - Position measuring apparatus, alignment apparatus, pattern drawing apparatus, and position measuring method - Google Patents

Abstract

A position measuring technique capable of accurately measuring the position of a substrate with respect to a light beam, and an alignment device and a patterning device using the position measuring technique.
An image pickup section for picking up a light beam and a first transmission section which pass through the first transmission section having transparency to the light beam in the substrate in the same field of view and a position deriving section for obtaining the position of the substrate on the basis of the image picked up by the image pickup section do.

Description

[0001] POSITION MEASURING APPARATUS, ALIGNMENT APPARATUS, PATTERN DRAWING APPARATUS, AND POSITION MEASURING METHOD [0002]

The present invention relates to a position measuring technique for measuring a position of a substrate with respect to a light beam emitted from an optical head, and an alignment device and a patterning device using the position measuring technique.

Various apparatuses have been proposed for irradiating a substrate with a light beam. For example, in Japanese Patent Application Laid-Open Nos. 2000-329523, 2003-162068, 2007-225886, and 2008-65034, a substrate supporting portion, such as a supporting stage, And irradiates a light beam onto the surface of the substrate supported by the substrate. In such an apparatus, in order to draw the pattern with high accuracy, it is necessary to align the position of the substrate to be drawn with the light beam (optical head) before pattern formation. Thus, the position of the substrate is measured, and the position of the light beam (or the optical head for emitting the light beam) is measured. The position of the substrate with respect to the light beam is obtained based on the positional information, and the light beam and the substrate are aligned with each other.

However, in the prior art, the position where the position of the substrate is measured and the place where the position of the light beam (or the optical head) is measured are different from each other. For this reason, it is necessary to move the support stage from the place where one measurement is made to the place where another measurement is performed. An error factor is included in the measurement due to the movement of the stage, and the accuracy (hereinafter referred to as " measurement accuracy ") of measuring the position of the substrate with respect to the light beam is lowered. In some cases, the measurement of the position of the light beam and the measurement of the position of the substrate are performed by using separate cameras. In this case, the measurement error may occur and the measurement accuracy may be lowered.

It is an object of the present invention to provide a position measuring technique capable of measuring the position of a substrate with respect to a light beam with high accuracy, and an alignment apparatus and a pattern writing apparatus using the position measuring technique.

A first aspect of the present invention relates to a position measuring apparatus and method for measuring a position of a substrate with respect to a light beam emitted from an optical head. The position measuring apparatus according to the present invention includes an imaging section for imaging a light beam and a first transmitting section that pass through a first transmitting section that is transmissive to a light beam in a substrate in the same field of view; And a position deriving section for obtaining the position of the substrate. A position measuring method according to the present invention is a position measuring method comprising the steps of irradiating a light beam to a transmissive portion having a transmissive property with respect to a light beam in a substrate, imaging the light beam and the transmissive portion passing through the transmissive portion in the same field of view, And a step of finding the position of the substrate based on the image.

In the invention thus constituted, the first transmission portion and the light beam of the substrate are picked up by the image pickup portion in the same field of view. Since the image thus picked up includes information reflecting the positional relationship between the light beam and the substrate, the position of the substrate with respect to the light beam can be obtained based on the image. Therefore, compared with the conventional technique in which the substrate and the light beam are separately picked up and the position of the substrate with respect to the light beam is determined based on the images, the error factor can be suppressed and the measurement accuracy can be improved.

According to a second aspect of the present invention, there is provided an alignment apparatus comprising: a position measuring section having the same configuration as the position measuring apparatus; and a position detecting section for detecting, based on the position of the substrate with respect to the light beam obtained by the position deriving section, And a position adjuster for adjusting the position of the substrate with respect to the light beam by moving at least one of the light beams in a plane orthogonal to the traveling direction of the light beam. In the present invention, the position of the substrate with respect to the light beam can be accurately obtained by using the position measuring section. Therefore, it is possible to adjust the position of the substrate with respect to the light beam with high accuracy based on the measurement result of the position measuring section.

A third aspect of the present invention is a pattern writing apparatus comprising: an optical head having an optical modulator for modulating a light beam, the optical head irradiating a substrate with a modulated light beam optically modulated by the optical modulator; At least one of the substrate and the optical head is moved in a plane perpendicular to the traveling direction of the light beam based on the position of the substrate with respect to the light beam obtained by the position deriving unit, And a position adjusting section for adjusting the position of the substrate, the position adjustment section performs adjustment by the position adjusting section, and then irradiates the surface of the substrate other than the first transmitting section with the modulated light beam to draw the pattern. Also in the present invention, the position of the substrate with respect to the light beam is accurately obtained by using the position measuring unit, and the position of the substrate with respect to the light beam is adjusted with high accuracy. Then, the modulated light beam is irradiated on the surface of the substrate to draw a pattern. Thus, an excellent pattern is formed on the surface of the substrate.

According to the present invention, since the position of the substrate with respect to the light beam is obtained based on the image of the first transmissive portion of the substrate and the light beam in the same field of view, the position of the substrate can be measured with high accuracy.

1 is a side view schematically showing an example of a pattern writing apparatus to which the present invention is applicable.
FIG. 2 is a partial plan view schematically showing the pattern writing apparatus of FIG. 1; FIG.
3 is a partially enlarged side view of the patterning device of FIG.
4 is a flow chart showing the operation of the patterning device of FIG.
5 is a diagram showing the positional relationship between the support stage and the substrate in the loading process.
Fig. 6 is a diagram schematically showing an imaging process of an alignment through hole. Fig.
7 is a diagram showing another embodiment of a position measuring apparatus according to the present invention.
8 is a diagram showing another embodiment of a position measuring apparatus according to the present invention.
9 is a view showing still another embodiment of a position measuring apparatus according to the present invention.

1 is a side view schematically showing an example of a pattern writing apparatus to which the present invention is applicable. FIG. 2 is a partial plan view schematically showing the pattern writing apparatus of FIG. 1; FIG. 3 is a partially enlarged side view of the patterning device of FIG. In order to show the positional relationship of each part of the pattern writing apparatus 1, XYZ orthogonal coordinate axes in which the Z axis direction is the vertical direction are appropriately represented in these drawings. Further, if necessary, the arrow side of each coordinate axis is referred to as both sides or (+ side), and the opposite side of the arrows in each coordinate axis is referred to as a negative side or (- side).

In the patterning device 1, an unprocessed substrate S is carried into the apparatus from the loading / unloading outlet 11 on the negative side in the Y-axis direction by a transfer robot (not shown). Then, patterning is performed on the substrate S in the apparatus. Thereafter, the patterned substrate S is transported to the outside of the apparatus through the loading / unloading port 11 by the carrying robot. The substrate S to be imaged by the patterning device 1 includes an FPC (Flexible Printed Circuits) substrate or a printed wiring board coated with a photosensitive material such as a resist solution on its upper surface (one side surface) . In the substrate S, two through holes Sa and Sb are provided at positions having a predetermined positional relationship with respect to the surface area of the substrate S on which a pattern is to be drawn. More specifically, in the present embodiment, the two through holes Sa and Sb are provided so as to be spaced apart in the Y direction, and function as reference marks (alignment marks) for aligning the substrate S as described later.

The patterning device 1 includes a supporting portion 3 for supporting a transferred substrate S, an exposure portion 5 for exposing and irradiating the substrate S supported on the supporting portion 3 with a light beam, An imaging section 9 for imaging the through holes Sa, Sb and the light beam LB in the same field of view, and a controller 100 for controlling the respective sections 3, 5, 9.

The support portion 3 is provided with a support stage 31 for supporting and supporting the back surface of the substrate S placed on the upper surface thereof. The support stage 31 is provided with transmission through holes 32a and 32b which function as a transmission portion 32 for transmitting a light beam at positions corresponding to the alignment through holes Sa and Sb, respectively. That is, the through holes 32a and 32b for transmission are provided in the Y direction at the same pitch as the pitch distances of the through holes Sa and Sb in the Y direction. However, in the present embodiment, the through-holes 32a and 32b have a larger inner diameter than the through-holes for alignment Sa and Sb. Then, the transport robot places the substrate S on the support stage 31 so that the alignment through holes Sa and Sb are contained in the through holes 32a and 32b, respectively, when viewed in the vertical direction Z.

The support stage 31 has a plurality of suction holes formed on a horizontally formed surface, and a suction mechanism (not shown) sucks the suction holes to hold the substrate S while supporting the substrate S from the vertical direction. Thereby, the substrate S loaded on the supporting portion 3 by the carrying robot can be reliably supported by the supporting stage 31, so that patterning with respect to the substrate S can be performed stably. When the patterning is completed and the substrate S is taken out, the suction of the suction hole is stopped, and the substrate S can be taken out of the supporting portion 3 by the carrying robot, that is, unloaded. After the suction is stopped, the substrate S may be pushed up from the support stage 31 by a peeling member such as a peeling roller or a peeling pin to support the unloading operation.

1, the support stage 31 is connected to the mover 37a of the linear motor 37 via an elevation table 33, a rotary table 34, and a support plate 35. As shown in Fig. Therefore, the support stage 31 can be raised and lowered by the lifting table 33, and is rotatable by the rotation table 34. [ It is also possible to drive the support stage 31 in the Y axis direction by driving the mover 37a along the stator 37b of the linear motor 37 extending in the Y axis direction.

The exposure section 5 has a plurality of optical heads 6 arranged on the upper side with respect to the movable region of the support stage 31. Each optical head 6 exposes a substrate S by irradiating a light beam toward the substrate S supported by the support stage 31 from below. Further, the plurality of optical heads 6 are arranged side by side in the X-axis direction, and are responsible for exposure of different areas in the X-axis direction. The support table 51 for supporting the plurality of optical heads 6 is movable along a pair of linear guides 52 extending in the X-axis direction. Therefore, by driving the support table along the linear guide 52 by a linear motor (not shown), it is possible to collectively move the plurality of optical heads 6 in the X-axis direction.

The image pickup section 9 has a CCD (Charge Coupled Device) camera 91. When the plurality of optical heads 6 are positioned at the alignment positions as shown in Fig. 2, the CCD camera 91 is located at the most (-X) side of the plurality of optical heads 6, And is disposed on the path of the light beam emitted from the light source 6a. That is, as shown in Fig. 3, the CCD camera 91 is located vertically below the optical head 6a and vertically below the movement path of the support stage 31 in the Y direction. When the optical beam LB is emitted from the optical head 6a in a state in which the substantially central portion of the through hole 32a of the support stage 31 is located directly above the CCD camera 91, The light beam LB and the alignment through hole Sa are picked up in the same field of view through the through hole 32a (see Fig. 6 (a)). When the optical beam LB is emitted from the optical head 6a in a state in which the substantially central portion of the through hole 32b of the support stage 31 is located directly above the CCD camera 91, The light beam LB and the alignment through-hole Sb are captured in the same field of view through the through-hole 32b (see Fig. 6 (b)). The image pickup unit 9 sends the image thus picked up to the controller 100.

This completes the outline of the mechanical structure of the patterning device 1. [ Next, the controller 100, which is an electrical structure of the pattern writing apparatus 1, will be described. The controller 100 operates to radiate the light beam LB from each optical head 6 and to scan the surface of the substrate S supported by the support stage 31 to draw the pattern on the surface of the substrate S And includes a data processing unit 110, an image processing unit 120, a scan control unit 130, and an irradiation control unit 140.

The data processing unit 110 includes a CPU (Central Processing Unit) for executing a logical operation, a ROM (Read Only Memory) for storing a program for controlling the CPU and the like, and a RAM (Random Access Memory) and so on. The data processing section 110 controls each section of the pattern writing apparatus 1 through the image processing section 120, the scan control section 130 and the irradiation control section 140 in accordance with a program stored in the ROM.

The image processing unit 120 adds various image processes to the image outputted from the CCD camera 91 in accordance with a command from the data processing unit 110, and writes the image after the image processing into the RAM. Then, the data processing unit 110 reads out the image from the RAM and derives information (hereinafter referred to as " substrate position information ") indicating the position of the substrate S with respect to the light beam LB. As described above, in this embodiment, the data processing unit 110 has a function as the position deriving unit 111. [

In addition to the position deriving unit 111, the data processing unit 110 has an alignment function, a data correction function, and an RIP function. Among them, the alignment function is a function of aligning the substrate S with respect to the optical head 6 based on the substrate position information. The data correction function is a function of generating correction design data by performing coordinate correction or rotation correction based on the substrate position information obtained by the position deriving unit 111, with design data including a pattern to be drawn on the substrate. Here, the design data is data generated by CAD (computer aided design) beforehand outside the pattern writing apparatus 1 and is stored in the RAM of the data processing unit 110 before pattern drawing. The remaining RIP function rasterizes the correction design data to generate run length data, that is, drawing data, and saves it in the RAM. The rendering data thus generated is output to the scan control unit 130 and the irradiation control unit 140.

The scan control unit 130 controls the movement of the support stage 31 and the optical head 6 during the patterning operation based on the drawing data. The irradiation control section 140 controls ON / OFF of the light beam LB from the optical head 6 during the pattern drawing operation, and irradiates the modulated light beam LB according to the pattern. More specifically, the pattern drawing operation is performed as follows.

4 is a flow chart showing the operation of the patterning device of FIG. 5 is a diagram showing the positional relationship between the support stage and the substrate in the loading process. 6 is a diagram schematically showing an image pickup process of an alignment through hole. In the patterning device 1, in step S1, the carrying robot carries the substrate S into the apparatus from the loading / unloading outlet 11 and carries it onto the supporting stage 31 (loading processing). At this time, based on the positional information of the support stage 31, the positional information of the through holes 32a and 32b in the support stage 31, the positional information of the alignment through holes Sa and Sb in the substrate S, The loading process is performed, and the substrate S is placed on the support stage 31 as shown in Fig. More specifically, the transport robot transports the substrate S to the upper surface of the support stage 31 so that the through holes Sa and Sb for alignment are contained in the through holes 32a and 32b, respectively, when viewed from below in the vertical direction.

When the loading of the substrate S is completed, the controller 100 controls each part of the apparatus in accordance with the program stored in the ROM to write a pattern corresponding to the design data to the patterning area (alignment through holes Sa, Sb On the substrate surface area). More specifically, in step S2, the support stage 31 moves toward one side in the Y-axis direction, that is, toward the (+ Y) side. The support stage 31 stops moving when the through hole 32a for transmission on the (+ Y) side of the support stage 31 reaches a position immediately above the CCD camera 91. [ Subsequently, the optical head 6a located vertically above the CCD camera 91 projects the light beam LB in the (-Z) direction. Then, the light beam LB advances in the (-Z) direction and is incident on the imaging surface of the CCD camera 91 through the alignment through hole Sa and the transmission through hole 32a as shown in Fig. 6 (a-1) . Thus, the CCD camera 91 picks up the light beam LB as well as the alignment through hole Sa at the same time in the same field of view. In the present embodiment, the effective beam diameter (the light intensity of the light beam LB) of the through-hole 32a (32b) for transmission, the field of view of the CCD camera 91, the through- The peak value or the beam diameter which is 1 / e ² of the value on the optical axis). 6 (a-2), the image Ia captured by the CCD camera 91 includes the image Ilb of the light beam LB inside the image Isa of the alignment through hole Sa, for example.

Here, when the substrate S is ideally positioned relative to the optical head 6a, the image Ilb of the light beam LB is located at the center position of the image Isa of the through hole Sa, The image Ilb of the light beam LB deviates from the center position of the image Isa of the through hole Sa as shown in Fig. Thus, in the present embodiment, the position deriving unit 111 obtains the position of the alignment through hole Sa on the (+ Y) side with respect to the light beam LB, that is, the substrate position information, based on the image picked up by the CCD camera 91 And stored in the RAM (step S3).

Subsequently, information on the position of the alignment through hole Sb on the (-Y) side is derived in the same manner as described above (steps S4 and S5). That is, in step S4, the support stage 31 moves in the (+ Y) side direction further. The support stage 31 stops moving when the through hole 32b on the (-Y) side of the support stage 31 reaches a position just above the CCD camera 91. [ Subsequently, the optical head 6a located vertically above the CCD camera 91 projects the light beam LB (Fig. 6 (b-1)). The position deriving unit 111 derives the position (substrate position information) of the alignment through hole Sb on the (-Y) side with respect to the light beam LB based on the image Ib captured by the CCD camera 91 at this time, (Step S5).

When the substrate position information at two points different from each other within the plane of the substrate S is obtained in this way, the data processing section 110 obtains the positional displacement of the substrate S with respect to the light beam LB from the substrate position information. In step S6, the support stage 31 moves in the XY plane to correct the positional deviation, and the positional relationship between the substrate S supported by the support stage 31 and the front optical head 6 is adjusted, A plurality of optical heads 6 are aligned at a position to start exposure to the substrate S on the stage 31 (alignment processing).

In parallel with this alignment processing (step S6), the data processing section 110 executes coordinate correction and rotation correction of the design data on the basis of the substrate position information to generate correction design data (step S7) Data is subjected to RIP processing to generate drawing data (step S8).

When these steps S6 to S8 are completed, the support stage 31 starts moving in the Y-axis direction. Each of the plurality of optical heads 6 irradiates the light beam LB of the pattern corresponding to the imaging data with respect to the surface of the substrate S moving with the support stage 31. [ Thus, each of the plurality of optical heads 6 scans the light beam LB with respect to the substrate surface in the Y-axis direction (main scanning direction) to form a pattern (line pattern) for one line in the pattern writing area. In this manner, a plurality of line patterns corresponding to the number of the optical heads 6 are formed side by side at intervals in the X-axis direction.

When formation of the plurality of line patterns is completed, the controller 100 moves the optical head 6 in the X-axis direction (sub-scan direction). As a result, each of the plurality of optical heads 6 faces between a plurality of line patterns previously formed. When the support stage 31 starts to move in the Y-axis direction, which is the reverse side from the previous stage, a plurality of optical heads 6 are formed on the patterning area of the substrate S moving with the support stage 31 And irradiates a light beam LB of a pattern corresponding to the imaging data.

Thus, the light beam LB from the optical head 6 is scanned between the angles of the plurality of line patterns formed first, and a new line pattern is formed. Thus, the pattern is drawn over the entire patterning area of the substrate S by sequentially forming a plurality of line patterns while intermittently moving the optical head 6 in the X-axis direction. Finally, when the pattern formation is completed, the transfer robot receives the patterned substrate S from the support stage 31 and takes it out of the apparatus through the loading / unloading outlet 11 (step S10).

As described above, in the present embodiment, the alignment through-holes Sb (Sb) and the light beam LB provided on the substrate S are picked up by the CCD camera 91 in the same field of view, and based on the image Ia And the position of the substrate S with respect to the light beam LB is obtained. Therefore, compared with the prior art in which the substrate and the light beam are separately picked up and the position of the substrate with respect to the light beam is derived based on these images, the error factor can be suppressed and the measurement accuracy can be increased.

In addition, the position of the substrate S with respect to the light beam LB (optical head 6) can be accurately obtained, and the position of the substrate S with respect to the light beam LB can be adjusted with high accuracy, that is, have. Then, after the alignment process is performed in this manner, the modulated light beam LB is irradiated onto the surface of the substrate other than the through holes 32a and 32b to draw the pattern. Therefore, the pattern can be formed on the surface of the substrate S with high accuracy.

As described above, in the present embodiment, the data processing unit 110 having the support stage 31, the image pickup unit 9, and the position deriving unit 111 is used for the "position measurement apparatus" and the "position measurement unit" An example is made. The alignment through holes Sa and Sb correspond to an example of the " first through hole " of the present invention and function as a " first transmitting portion " The through holes 32a and 32b correspond to an example of the "second through hole" of the present invention and function as a "second transmitting portion" of the present invention. The linear motor 37 for moving the support stage 31 in the Y-axis direction corresponds to an example of the " position adjusting portion " of the present invention.

The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made as long as the gist of the present invention is not deviated. For example, in the first embodiment, the light beam LB that has passed through the alignment through-hole Sa is guided to the imaging section 9 through the transmission through hole 32a. However, as shown in Fig. 7, The window member 32c may be provided in the through-hole 32a. The window member 32c is made of a transmissive material that is transparent to the light beam LB. In this manner, in the present embodiment, the "second transmitting portion" of the present invention is constituted by the penetration hole 32a and the window member 32c.

In the embodiment shown in Fig. 7, a cross mark (not shown) is provided as a "second reference mark" in the window member 32c, and an image Ia picked up by the CCD camera 91 is marked with a cross mark Image < / RTI > Therefore, the positional relationship between the light beam LB, the substrate S, and the support stage 31 can also be derived based on the image Ilb of the light beam LB, the image Isa of the through hole Sa, and the image Imk2 of the cross mark. Of course, a window member provided with cross marks may also be provided in the through-hole 32b on the (-Y) side so that the positional relationship between the light beam LB, the substrate S, and the support stage 31 can be derived. The precision of pattern drawing can be further increased based on the information indicating the positional relationship.

In the embodiment shown in Fig. 7, the window member 32c is disposed at the uppermost portion of the transmission through hole 32a, and supports the substrate S from the upper surface of the window member 32c. Therefore, the following operational effects can be obtained. Since the inner diameter of the penetration through hole 32a is larger than the inner diameter of the through hole Sa, for example, as shown in Fig. 6, the peripheral portion of the through hole Sa is not supported by the support stage 31, There is a possibility that a downward stress is generated with respect to the portion. On the other hand, in the embodiment shown in Fig. 7, since the peripheral portion is supported by the window member 32c, the pattern can be drawn on the substrate S without causing the deformation.

8, the inner diameter at the uppermost portion of the through hole 32a for penetration is slightly wider than the inner diameter of the through hole Sa, for example, as shown in Fig. 8, in order to widen the support range of the peripheral portion without providing the window member. . Of course, the penetration hole 32b may be formed in the same manner.

In the above-described embodiment, the inside of the through-holes 32a and 32b is an air layer, but the inside may be filled with the transparent member. Further, the entire support stage 31 may be made of a transparent member.

Although the through holes Sa and Sb for alignment are provided in the substrate S and function as the "first transmitting portion" of the present invention in the above embodiment, the substrate S may be constituted by a sheet member having permeability to the light beam LB A " first transmitting portion " may be provided instead of the through hole. For example, as shown in Fig. 9, for example, a cross mark MK1 is provided as a "first reference mark" in the surface area of the surface of the substrate S (sheet member) other than the patterning area for pattern formation , And this mark portion Sc may function as the " first transmitting portion " of the present invention. In this case, as shown in Fig. 9, for example, the image Im captured by the CCD camera 91 includes the image Imk1 of the cross mark MK1. Therefore, it is possible to derive the position of the substrate S with respect to the light beam LB based on the image Ilb of the light beam LB and the image Imk1 of the mark part Sc.

Although the various embodiments have been described for the first transmitting portion and the second transmitting portion, needless to say, these embodiments may be appropriately combined. For example, the mark portion Sc shown in Fig. 9 may be used as the first transmissive portion, and the transmissive through hole 32a and the window member 32c shown in Fig. 7 may be used as the second transmissive portion.

In the above embodiment, the substrate position information is derived for each of the two first transmissive portions (the alignment through holes Sa and Sb and the mark portion Sc) of the substrate S, and based on these information, the optical head 6 Alignment of the substrate S, that is, alignment processing, is performed. However, the alignment processing may be performed by deriving the substrate position information for three or more first transmitting portions.

In the above embodiment, the support stage 31 holds the back surface of the substrate S by suction. However, the holding state of the substrate S is not limited to this. For example, A so-called mechanical chuck method may be employed.

Further, the object of the position measuring apparatus according to the present invention is not limited to the patterning apparatus, but can be applied to an apparatus for irradiating a substrate with a light beam, for example, a laser processing apparatus or a laser trimming apparatus.

INDUSTRIAL APPLICABILITY The present invention can be applied to a position measuring technique for measuring the position of a substrate with respect to a light beam emitted from an optical head and a technique for adjusting the position of a substrate with respect to a light beam using the position measuring technique and a patterning technique Do.

1: patterning device 6, 6a: optical head
9: imaging section 31: support stage
32: (second) transmitting portion
32a, 32b: Through holes (second through hole, second transmitting portion)
32c: window member 91: CCD camera (imaging unit)
111: Position deriving portion Ia, Ib, Ic:
LB: light beam MK1: cross mark (first reference mark)
S: substrate
Sa, Sb: alignment through holes (first through hole, first transmission portion)
Sc: mark attaching (first transmitting portion) Z: (light beam advancing) direction

Claims (11)

A position measuring apparatus for measuring a position of a substrate with respect to a light beam emitted from an optical head,
An imaging section for imaging the light beam and the first transmitting section, which pass through the first transmitting section having transparency to the light beam, in the same field of view within the substrate,
And a position deriving section for obtaining the position of the substrate with respect to the light beam based on the image picked up by the imaging section,
Wherein the field of view of the imaging unit is larger than the first transmissive portion and the first transmissive portion is larger than the effective beam diameter of the light beam. The method according to claim 1,
Wherein the first transmitting portion has a first through hole provided through the substrate in the traveling direction of the light beam. The method according to claim 1,
Wherein the substrate is composed of a sheet member having transparency with respect to the light beam,
Wherein the first transmitting portion is a mark applying portion provided with a first reference mark with respect to the sheet member. The method according to any one of claims 1 to 3,
And a support stage for supporting the substrate from an opposite side of the main surface of the substrate on which the light beam is incident,
Wherein the support stage has a second transmission portion for guiding the light beam passed through the first transmission portion to the imaging portion,
And the imaging section captures the light beam and the first transmitting section through the second transmitting section in the same field of view. The method of claim 4,
And the second transmissive portion has a second through hole provided through the support stage in the traveling direction of the light beam. The method of claim 5,
The second transmissive portion has a window member made of a transmissive material having transparency to the light beam and provided on the support stage to cover the second through hole,
Wherein the imaging section captures the light beam and the first transmitting section through the window member in the same field of view. The method of claim 6,
And a second reference mark is given to the window member in the second transmitting portion. The method of claim 2,
And a second transmissive portion composed of a second through hole provided so as to penetrate in the traveling direction of the light beam with an inner diameter larger than the inner diameter of the first through hole,
Wherein the support stage includes a first through hole and a second through hole, wherein the support stage includes a first through hole, a second through hole, and a second through hole, Supporting the substrate,
And the imaging section captures the light beam and the first transmitting section through the second transmitting section in the same field of view. A position measuring unit having the same configuration as the position measuring apparatus according to claim 1,
At least one of the substrate and the optical head is moved in a plane perpendicular to the traveling direction of the light beam based on the position of the substrate with respect to the light beam obtained by the position deriving unit of the position measuring unit, And a position adjusting section for adjusting the position of the substrate. An optical head for irradiating a light beam onto a substrate,
A position measuring unit having the same configuration as the position measuring apparatus according to claim 1,
At least one of the substrate and the optical head is moved in a plane perpendicular to a traveling direction of the light beam based on a position of the substrate with respect to the light beam obtained by the position deriving unit, And a position adjusting unit for adjusting the position,
Wherein the light beam is irradiated to the surface of the substrate other than the first transmissive portion after the adjustment by the position adjustment portion is performed to draw the pattern. A position measuring method for measuring a position of a substrate with respect to a light beam emitted from an optical head,
Irradiating the light beam onto a transmissive portion of the substrate that is transmissive to the light beam;
Capturing an image of the light beam and the transmissive portion passing through the transmissive portion by the imaging portion within the same field of view;
And obtaining a position of the substrate with respect to the light beam based on the picked-up image,
Wherein the field of view of the imaging section is larger than the transmissive section and the transmissive section is larger than the effective beam diameter of the light beam.

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