KR101575232B1 - Apparatus for laser soldering - Google Patents

Abstract

A solder ball is disposed between terminals for electrical connection and laser soldering is performed by irradiating a laser beam. The solder balls are electrically connected to a plurality of first terminals of the camera unit and a plurality of second terminals of the printed circuit board, And includes a rotation plate, a rotation driving unit, a pick-up unit, a coating unit, a solder ball placement unit, and a laser unit. The rotation plate is rotatably installed, and a plurality of mounting portions on which the camera module and the camera module with the printed circuit board are mounted are spaced from each other along the rotation direction. The rotation drive unit drives the rotation plate along the rotation direction. The pick-up unit picks up the camera module from the accommodating portion in which the camera module is accommodated and moves it to the seating portion. The application unit is disposed adjacent to the pick-up unit along the rotation direction, and applies an adhesive material to the first terminal or the second terminal of the camera module which is seated on the seat portion. The solder ball placement unit is disposed adjacent to the application unit along the rotational direction, and places a solder ball on the adhesive material. The laser unit is disposed adjacent to the solder ball placement unit along the rotation direction, and irradiates the laser beam to the solder ball to electrically connect the first terminal and the second terminal.

Description

[0001] Apparatus for laser soldering [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laser soldering apparatus, and more particularly, to a laser soldering apparatus in which a solder ball is disposed between a terminal for electrically connecting and a terminal, and a laser beam is irradiated to perform laser soldering.

Generally, a mobile terminal refers to a device that can communicate and exchange data while moving. In recent years, mobile terminals have been becoming smaller, slimmer, and lighter in weight due to their portability, and they are moving toward multimedia that can be used for various functions.

As an example of a mobile terminal that seeks for multimedia as described above, a mobile terminal equipped with a camera module is exemplified. A camera module is installed on the front or rear surface of the mobile terminal, and various images are inputted through the camera module. May be converted into an image file and stored in the mobile terminal, and the stored image file may be utilized in various applications in the mobile terminal.

1 is a view showing an example of a state in which a camera unit and a printed circuit board are assembled.

Referring to FIG. 1 (a), the camera unit 10 includes a plurality of first terminals 11 electrically connected to components disposed therein. The components disposed inside the camera unit 10 may include a lens 12, a voice coil motor, a spring member 15, and the like. When the current is applied to the coil portion 13 of the voice coil motor coupled with the lens 12, the coil portion 13 moves back and forth between the permanent magnet portions 14 to perform the optical zoom function of the lens 12, Function and so on. The housing 16 encloses and protects parts disposed inside the camera unit 10. [

The printed circuit board 20 assembled with the camera unit 10 is for controlling components disposed in the camera unit 10 and includes a plurality of first terminals 11 corresponding to a plurality of first terminals 11 of the camera unit 10, And a second terminal (21) of the second terminal. A plurality of first terminals 11 of the camera unit 10 and a plurality of second terminals 21 of the printed circuit board 20 are arranged in a line in correspondence with each other, Respectively. When the camera unit 10 and the printed circuit board 20 are assembled, they can be adhered by the adhesive member 17. Since the adhesive member 17 has a certain volume, the first terminal 11 and the second terminal The camera unit 10 and the printed circuit board 20 are not electrically connected while the terminal 22 is assembled in a state where the terminals 22 are not in contact with each other.

In order to electrically connect the first terminal 11 of the camera unit 10 and the second terminal 21 of the printed circuit board 20 to the first terminal 11 and the second terminal 21 ), And the solder was directly soldered by the operator. However, since the size of the terminal is also miniaturized due to miniaturization of the camera unit 10, when the solder is directly soldered using the linear lead, the solder is spread between neighboring terminals, which should not be electrically connected to each other in the soldering process, (10) itself is made defective and can not be finely worked, and it takes a long time to work and the working efficiency is deteriorated. In addition, since the operator directly solders using a soldering machine, it is difficult to control the heat, and there is a problem that parts such as the camera module and the printed circuit board are damaged by heat at high temperature.

Accordingly, it is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing solder balls by providing a solder ball between terminals and terminals and automating a soldering process by irradiating a laser beam, And the soldering efficiency can be increased by shortening the working time.

According to an aspect of the present invention, there is provided a laser soldering apparatus for electrically connecting a plurality of first terminals of a camera unit to a plurality of second terminals of a printed circuit board, And a plurality of mounting portions on which the camera module and the printed circuit board are assembled, the mounting portions being spaced apart from each other in the rotating direction; A rotation driving unit for driving the rotation plate along the rotation direction; A pick-up unit for picking up the camera module from the accommodating part in which the camera module is accommodated and moving the camera module to the seating part; An application unit disposed adjacent to the pick-up unit along the rotation direction and applying an adhesive material to a first terminal or a second terminal of the camera module seated on the seat portion; A solder ball placement unit disposed adjacent to the application unit along the rotation direction, the solder ball placement unit placing a solder ball on the adhesive material; And a laser unit disposed adjacent to the solder ball arrangement unit along the rotation direction and irradiating the solder ball with a laser beam for electrically connecting the first terminal and the second terminal.

The laser soldering apparatus according to the present invention is characterized in that the mount portion has a suction hole for sucking the camera module to one side of the mount portion using an attraction force so as to align the camera module mounted on the mount portion with respect to one side .

The laser soldering apparatus according to the present invention is characterized in that the mount portion includes a receiving space in which the camera module is accommodated, three side surfaces formed in a side portion of the receiving space, and a bottom surface formed in a lower portion of the receiving space, The suction holes may be formed at two sides of the three side surfaces that intersect with each other, and at corners where the bottom surface meets.

The laser soldering apparatus according to the present invention may further comprise: a sensor installed in the seating part and detecting whether the camera module is seated in the seating part; And a controller for rotating the rotating plate when receiving the detection signal of the camera module from the sensor and restricting the rotation of the rotating plate if the sensing signal of the camera module is not received from the sensor.

The laser soldering apparatus according to the present invention includes: an inspection unit disposed adjacent to the laser unit along the rotation direction, for acquiring an image of the camera module and inspecting a soldering state of the camera module; A good product transferring unit arranged to be spaced apart from the inspection unit along the rotation direction and transferring the camera module judged by the inspection unit to a good product storage unit from the storage unit; And a defective article transfer unit which is disposed to be spaced apart from the inspection unit along the rotation direction and transfers the camera module which has been judged to be defective by the inspection unit from the placement section to the defective article receiving section.

The laser soldering apparatus according to the present invention can prevent the camera module from moving during the soldering process, thereby enabling a precise soldering process and eliminating the trouble of aligning the camera module from time to time, shortening the working time and increasing the efficiency of the process have.

In addition, the laser soldering apparatus according to the present invention eliminates the inconvenience of separately providing a fixing device for fixing the solder ball and simplifies the soldering operation.

Also, in the laser soldering apparatus according to the present invention, the solder ball can be accurately positioned at the soldering position even by using a small-sized solder ball, fine soldering work can be performed, and operation efficiency can be increased.

In addition, the laser soldering apparatus according to the present invention can perform soldering even if the space for soldering is narrow, and the intensity of the laser beam irradiated to the solder ball side can be adjusted, thereby preventing the components from being damaged by heat.

1 is a view showing an example of a state in which a camera unit and a printed circuit board are assembled,
2 is a schematic view of a laser soldering apparatus according to an embodiment of the present invention,
FIG. 3 is a view showing a rotation plate of the laser soldering apparatus of FIG. 2,
FIG. 4 is a view showing a state in which a camera module is aligned on one side of a seat part in the laser soldering apparatus of FIG. 2,
FIG. 5 is a view showing a soldering process of the first terminal of the camera unit and the second terminal of the printed circuit board using the laser soldering apparatus of FIG. 2;

Hereinafter, embodiments of the laser soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic view of a laser soldering apparatus according to an embodiment of the present invention, FIG. 3 is a view showing a rotation plate of the laser soldering apparatus of FIG. 2, and FIG. 4 is a cross- FIG. 5 is a view illustrating a soldering process of the first terminal of the camera unit and the second terminal of the printed circuit board using the laser soldering apparatus of FIG. 2; FIG.

2 to 5, a laser soldering apparatus according to an embodiment of the present invention includes solder balls disposed between terminals for electrical connection and terminals, and laser-soldered by irradiating a laser beam. The laser soldering apparatus includes a rotation plate 110, A pickup unit 120, a coating unit 130, a solder ball placement unit 140, a laser unit 150, and a driving unit (not shown), a sensor 112, a controller (not shown) An inspection unit 160, a good product transfer unit 170, and a defective product transfer unit 180. [

The terminal and the terminal for performing the laser soldering in the present embodiment will be described taking the first terminal 11 of the camera unit 10 and the second terminal 21 of the printed circuit board 20 as an example.

The rotation plate 110 is rotatably installed and a plurality of seating portions 111 on which the camera module 30 with the camera unit 10 and the printed circuit board 20 are mounted It is arranged to be separated. In this embodiment, eight seating portions 111 are provided, but the number of the seating portions 111 can be changed.

In order to align the camera module 30 mounted on one side with respect to the other, the mounting part 111 may be provided with a suction hole for sucking the camera module 30 to one side of the mounting part 111 H).

The mounting portion 111 on which the camera module 30 is mounted is provided on the rotating plate 110. When the camera module 30 is soldered to the mounting portion 111 without being fixed to the mounting portion 111, As the plate 110 rotates, the camera module 30 moves in and out of the seat 111. When the soldering process is performed in a state in which the camera module 30 is not fixed, the position of the camera module 30 is frequently changed in the mount part 111, It is troublesome to work, and it takes a long time to work and the process efficiency may be lowered.

3 and 4, the seating part 111 includes a receiving space in which the camera module 30 is received, three side surfaces a1, a2 and a3 formed on the side of the receiving space, And a bottom surface (a4) formed on the bottom surface.

Here, the suction holes H may be formed at the two sides intersecting among the three side surfaces and at the corner where the bottom surface a4 meets. Specifically, the suction holes H are formed on the edge or the second side a2, the third side a3 and the bottom surface a4 where the first side surface a1, the second side surface a2 and the bottom surface a4 meet, May be formed at the corner where they meet. That is, the camera module 30 is fixed while being in contact with the first side surface a1, the second side surface a2 and the bottom surface a4 in the seating part 111, or the second side surface a2 and the third side surface a3) and the bottom surface (a4).

The camera module 30 is attracted to the seating part 111 through the suction holes H to prevent the camera module 30 from moving during the soldering process and thus a precise soldering process can be performed, It is possible to shorten the working time and increase the efficiency of the process.

The rotation driving unit (not shown) drives the rotation plate 110 along the rotation direction. Here, a motor or the like for generating a rotational driving force may be used for the rotation driving portion rotary plate 110.

The sensor 112 is installed on the seat part 111 and detects whether the camera module 30 is seated on the seat part 111 or not. That is, the sensor 112 senses the camera module 30 in the seating part 111 and confirms whether the camera module 30 is placed in the seating part 111. [

The control unit rotates the rotation plate 110 when receiving the detection signal of the camera module 30 from the sensor 112 and rotates the rotation plate 110 if the detection signal of the camera module 30 is not received from the sensor 112. [ Thereby restricting the rotation of the plate 110.

Specifically, upon receipt of the sensing signal of the camera module 30, the controller recognizes that the camera module 30 is normally disposed in the seating unit 111, and rotates the rotation plate 110 to continue the soldering process. It is recognized that the camera module 30 is not disposed in the seating part 111 unless the sensing signal of the camera module 30 is received, When the camera module 30 receives the detection signal of the camera module 30 after the camera module 30 is normally disposed at the seating part 111, the rotation plate 110 is rotated again.

The pick-up unit 120 picks up the camera module 30 from a receiving part (not shown) in which the camera module 30 is received and moves the camera module 30 to the seating part 111. The camera module 30 having the camera unit 10 and the printed circuit board 20 can be accommodated in a plurality of accommodating portions and the pickup unit 120 can be accommodated in any one of the plurality of camera modules 30. [ (30) is picked up and moved to the seating part (111).

The application unit 130 is disposed adjacent to the pick-up unit 120 along the rotation direction A and is connected to the first terminal 11 or the second terminal 11 of the camera module 30, 21 is coated with an adhesive material 131.

Since the solder ball S has a spherical shape, if the solder ball S is not fixed to the soldering position P1 for electrically connecting the first terminal 11 and the second terminal 21, Can be released from the soldering position P1. As described above, when the solder ball S is separated from the soldering position P1, the solder ball S is lost, and the solder ball S needs to be disposed again, so that the operation becomes troublesome and the working efficiency may be lowered. Therefore, adhesion between the first terminal 11 and the second terminal 21 is prevented so that the solder ball S disposed at the soldering position P1 between the first terminal 11 and the second terminal 21 is not released. The material 131 is applied to fix the solder ball S to be disposed later. Here, the adhesive material may be a flux.

The application of the adhesive material 131 between the first terminal 11 and the second terminal 21 eliminates the necessity of separately providing a fixing device for fixing the solder ball S and simplifies the soldering operation .

The solder ball placement unit 140 is disposed adjacent to the coating unit 130 along the rotational direction A and places a solder ball S on the adhesive material 131.

Since the solder ball S electrically connecting the first terminal 11 and the second terminal 21 has a very small size of 300 μm, 400 μm, 500 μm, or the like, Disposing the solder ball S on the material 131 is limited. The solder ball placement unit 140 disposes the solder ball S on the adhesive material 131 in order to accurately position the solder ball S on the adhesive material 131. [

Here, the solder ball placement unit 140 includes a suction unit (not shown) for generating a suction force to suck the solder ball S and a suction unit for sucking the solder ball S on the adhesive material 131 And a driving unit (not shown) for driving the driving unit.

The solder ball S can be accurately positioned at the soldering position P1 even by using the small solder ball S by arranging the solder ball S on the adhesive material 131 using the solder ball placement unit 140 And it is possible to perform fine soldering work, and the work efficiency can be increased.

The laser unit 150 is disposed adjacent to the solder ball arranging unit 140 along the rotation direction A and is disposed on the solder ball S in order to electrically connect the first terminal 11 and the second terminal 21. [ The laser beam L is irradiated.

The laser unit 150 may include a laser head unit 151, a laser oscillator (not shown), an optical fiber (not shown), and the like. The laser beam L output from the laser oscillator may be transmitted to the laser head unit And the laser beam L may be irradiated to the solder ball S side in the laser head portion 151. [ The laser beam L is adjustable in intensity as necessary and the solder ball S is melted as it is irradiated on the solder ball S side to electrically connect the first terminal 11 and the second terminal 21.

Soldering can be performed even if the space for soldering is narrow, and the intensity of the laser beam L irradiated to the solder ball S side can be adjusted, thereby preventing the components from being damaged by heat .

The inspection unit 160 is disposed adjacent to the laser unit 150 along the rotation direction A and acquires an image of the camera module 30 to check the soldering condition of the camera module 30. [ The inspection unit 160 may include a camera capable of photographing the soldering state of the camera module 30 and a judging unit for judging the camera module as good or defective by acquiring an image photographed from the camera.

The good quality transfer unit 170 is disposed to be spaced apart from the inspection unit 160 along the rotation direction A and the camera module 30 which has been judged to be good in the inspection unit 160 is transferred from the seating part 111 to the non- Lt; / RTI > As described above, the camera module 30 which has been judged as a good product can be used in a terminal such as a cellular phone, a PDA, etc. since the first terminal 11 and the second terminal 21 are normally soldered.

Although not shown in the drawings, the good quality conveying unit 170 can be realized by a structure in which a motor and a ball screw are combined, a pneumatic cylinder operated by pneumatic pressure, or a linear driving unit. The description is omitted.

The defective product delivery unit 180 is disposed to be spaced apart from the inspection unit 160 along the rotational direction A and the camera module 30 which has been judged as defective by the inspection unit 160 is received from the seating part 111 Lt; / RTI > As described above, the camera module 30 that has been determined to be defective can not use the camera module 30 because the first terminal 11 and the second terminal 21 are not normally soldered.

Although not shown in the drawings, the defective product transfer unit can be realized by a structure in which a motor and a ball screw are combined, a pneumatic cylinder operated by pneumatic pressure, or a linear drive unit. Such a structure is obvious to those skilled in the art, do.

Hereinafter, the operation of the laser soldering apparatus of the present embodiment having the above-described structure will be schematically described with reference to the drawings.

5, the pick-up unit 120 picks up the camera module 30 from the receptacle and places it on the seating part 111. When the coating unit 130 contacts the first terminal 11 and the second terminal 21 An adhesive material 131 is applied to the first terminal 11 and the second terminal 21 at a soldering position P1 for electrically connecting the solder ball placement unit 140 to the adhesive material 131, The solder ball S is disposed and the laser unit 150 irradiates the laser beam L toward the solder ball S to electrically connect the first terminal 11 and the second terminal 21. [

In the laser soldering apparatus of the present invention constructed as described above, since the camera module is attracted to the mounting portion through the suction holes, the camera module can be prevented from moving during the soldering process, and a precise soldering process can be performed. It is possible to obtain the effect that the work time can be shortened and the efficiency of the process can be increased.

Further, in the laser soldering apparatus of the present invention constructed as described above, by disposing an adhesive material between the first terminal and the second terminal, it is possible to eliminate the inconvenience of separately providing a fixing device for fixing the solder ball, The effect that the operation can be simplified can be obtained.

The laser soldering apparatus of the present invention constructed as described above can arrange the solder balls on the adhesive material using the solder ball arranging unit so that the solder balls can be accurately positioned at the soldering positions even with the small solder balls, The soldering operation can be performed, and the operation efficiency can be increased.

In addition, the laser soldering apparatus of the present invention constructed as described above can perform soldering even if the space for soldering is small, and the intensity of the laser beam irradiated to the solder ball side can be adjusted, It is possible to obtain an effect of preventing damage to the substrate.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

110: Rotating plate
120: Pickup unit
130: dispensing unit
140: solder ball placement unit
150: Laser unit
160: Inspection unit
170: Good-quality conveying unit
180: defective conveying unit
112: sensor
S: solder ball
L: laser beam

Claims (5)

A laser soldering apparatus for electrically connecting a plurality of first terminals of a camera unit to a plurality of second terminals of a printed circuit board,
A rotating plate rotatably mounted on the rotating plate and having a plurality of mounting portions on which the camera module and the printed circuit board are assembled, the mounting portions being spaced apart from each other in the rotating direction;
A rotation driving unit for driving the rotation plate along the rotation direction;
A pick-up unit for picking up the camera module from the accommodating part in which the camera module is accommodated and moving the camera module to the seating part;
An application unit disposed adjacent to the pick-up unit along the rotation direction and applying an adhesive material to a first terminal or a second terminal of the camera module seated on the seat portion;
A solder ball placement unit disposed adjacent to the application unit along the rotation direction, the solder ball placement unit placing a solder ball on the adhesive material; And
And a laser unit disposed adjacent to the solder ball placement unit along the rotation direction and irradiating the solder ball with a laser beam for electrically connecting the first terminal and the second terminal,
Wherein the mounting portion includes a receiving space in which the camera module is accommodated, three side surfaces formed in a side portion of the receiving space, and a bottom surface formed in a lower portion of the receiving space, And a suction hole for sucking the camera module to one side of the seat portion using an attraction force,
Wherein the suction hole is formed at two edges of the three side surfaces intersecting with each other and at a corner where the bottom surface meets,
Wherein the camera unit is fixed while being in contact with the two side surfaces and the bottom surface. delete delete The method according to claim 1,
A sensor installed in the seating part and detecting whether the camera module is seated in the seating part; And
And a controller for rotating the rotating plate when the sensing signal of the camera module is received from the sensor and restricting the rotation of the rotating plate if the sensing signal of the camera module is not received from the sensor, Laser soldering equipment. The method according to claim 1,
An inspection unit disposed adjacent to the laser unit along the rotation direction, for acquiring an image of the camera module and inspecting a soldering condition of the camera module;
A good product transferring unit arranged to be spaced apart from the inspection unit along the rotation direction and transferring the camera module judged by the inspection unit to a good product storage unit from the storage unit; And
And a defective product transfer unit arranged to be spaced apart from the inspection unit along the rotation direction and to transfer the camera module which has been judged to be defective by the inspection unit from the placement portion to the defective product storage portion.

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