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KR101565091B1 - Wafer Transfer Apparatus for Monitoring Contamination of Semiconductor Processes - Google Patents

Wafer Transfer Apparatus for Monitoring Contamination of Semiconductor Processes Download PDF

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Publication number
KR101565091B1
KR101565091B1 KR1020150089481A KR20150089481A KR101565091B1 KR 101565091 B1 KR101565091 B1 KR 101565091B1 KR 1020150089481 A KR1020150089481 A KR 1020150089481A KR 20150089481 A KR20150089481 A KR 20150089481A KR 101565091 B1 KR101565091 B1 KR 101565091B1
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KR
South Korea
Prior art keywords
wafer
space
sensor
wafer transfer
transfer apparatus
Prior art date
Application number
KR1020150089481A
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Korean (ko)
Inventor
고준길
Original Assignee
주식회사 앤이티
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Priority to KR1020150089481A priority Critical patent/KR101565091B1/en
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Publication of KR101565091B1 publication Critical patent/KR101565091B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer transport apparatus to monitor contamination of a semiconductor process. According to the present invention, the wafer transport apparatus to monitor contamination of a semiconductor process comprises: a transport apparatus body formed in a rectangular box shape; a separation plate to separate an internal space of the transport apparatus body into a space for a sample and a wafer space wherein a wafer is loaded to be processed; a multi-port installed in the separation plate; an organic/inorganic compound measurement device installed in a space wherein a sample analysis equipment can be installed; a temperature/humidity sensor; a battery; a sensor; and a data repeater. When the wafer is produced and transported and a process is performed, a contaminated sample can be detected. According to the present invention, the wafer space and a sensor space are separated to prevent the sensor or the like from affecting the wafer and a production environment, and produce high quality wafers.

Description

TECHNICAL FIELD [0001] The present invention relates to a wafer transfer apparatus for monitoring semiconductor contamination,

The present invention relates to a wafer transfer apparatus for semiconductor wafer contamination monitoring, and more particularly, to a wafer transfer apparatus for semiconductor wafer contamination monitoring, which is capable of real-time monitoring of semiconductor process contamination, The present invention relates to a wafer transfer apparatus.

The semiconductor industry produces high value-added products based on advanced technology and continues to develop production technology to maintain its competitive edge. Major semiconductor products have already had a nanosize pattern for several years, and 300 mm of wafer size for product production has been mainstream, and mini-environment system has been introduced to ensure efficiency of manufacturing environment pollution management. There is a great need for the transition from the facility monitoring system (FMS) to the process monitoring system (PMS). Furthermore, in the process using a 300 mm wafer, a FOUP (Front Opening Unified Pod) (hereinafter referred to as a wafer transfer device) is used for transferring and storing wafers between processes. The wafer transfer apparatus has been introduced to prevent defects and to efficiently produce wafers by keeping the wafer exposure environment clean as the wafers are thickened and the pattern becomes finer. However, many of the chemicals and process gases used in the course of several tens of steps have flowed into the wafer transfer apparatus that remains on the wafer, causing contamination of the air in the wafer transfer apparatus and causing the wafer to be attracted to the wafer transfer apparatus. The necessity of managing the concentration of contaminants in the wafer transfer apparatus is absolutely emerging.

In addition, the importance of monitoring and preventing contamination due to molecular contaminants in the air, which affects the film quality characteristics of semiconductor devices, has been greatly increased. Although production is deteriorating due to the occurrence of unknown pollution and defects that are not identified, it is necessary to monitor the pollution of production facilities and bulk cleanroom, as well as the contamination between moving wafers. In case of pollution monitoring, it is impossible to limit the current FOUP structure. This is because the influence of the heat generation and the humidity change caused by the installation of the sensor and the sensor in the wafer transfer device may affect the production environment of the wafer.

[Prior Art Literature]

Korean Patent Publication No. 10-2004-0011995 (published Feb. 11, 2004) (200mm and 300mm wafer carrier together)

SUMMARY OF THE INVENTION It is an object of the present invention to overcome the above-described problems of the prior art and to provide a semiconductor wafer transfer apparatus and a semiconductor wafer transfer apparatus capable of realizing sampling and analysis in real time without affecting the production environment of a wafer, The present invention provides a new type of wafer transfer apparatus for semiconductor wafer contamination monitoring capable of transferring semiconductor wafers.

The object of the present invention is to provide a wafer transfer apparatus for semiconductor wafer contamination monitoring, which comprises a wafer transfer apparatus body in the form of a rectangular box, a space for sampling the internal space of the wafer transfer apparatus body, An AMC sensor installed in a space in which the sample analyzing facility can be installed, a battery, a sensor, and a data repeater, And a contamination sample is made possible during wafer process production, movement, and process progress.

Preferably, the space of the wafer is adjustable according to the type and size of the sensor.

Preferably, a chemical filter is provided to prevent contamination of air in the sensor area so that air, which is exhausted when the air inside the sensor area is exposed to the outside, does not affect the clean room.

Also preferably,

And the data of the sensor can be externally transmitted by wire or wireless.

As described above, according to the wafer transfer apparatus for monitoring semiconductor contamination contamination according to the present invention, in order to monitor contamination of the conventional wafer transfer apparatus, sensors and the like must be installed in the same space as the wafer, The present invention can separate the space between the wafer and the sensor inside the wafer transfer device so that the influence generated by the sensor or the like is not transferred to the wafer, So that it is possible to produce a wafer of good quality.

1 is a perspective view showing a wafer transfer apparatus for monitoring semiconductor process contamination according to an embodiment of the present invention.
Fig. 2 is a side sectional view of Fig. 1
Figure 3 is a schematic perspective view of Figure 1;

According to an aspect of the present invention, there is provided a wafer transfer apparatus for monitoring contamination of a semiconductor process,

A wafer transfer apparatus for semiconductor process contamination monitoring,

A wafer transfer device body in the form of a rectangular box,

A separation plate for separating the space inside the wafer transfer apparatus body into a space for a sample and a space into which a wafer can be inserted for proceeding;

A multi-port,

(AMC) sensor, a temperature / humidity sensor, a battery, a sensor, and a data repeater installed in a space in which the sample analysis facility can be installed. And a sample is possible.

The separation plate is made of a synthetic resin.

The wafer transfer apparatus 100 for semiconductor process contamination monitoring according to the present invention is provided with an equipment front end module (EFEM) (a standard interface device for supplying a wafer 11 in a transfer container to a semiconductor manufacturing process module including a substrate processing apparatus) Which is characterized by a structure in which the contamination is completely separated from the inside of the EFEM in order to prevent diffusion during the process.

Also, the space of the wafer can be adjusted according to the type and size of the sensor.

A chemical filter (21) is provided to prevent contamination of air in the sensor area so that the air exhausted when the air inside the sensor room is exposed to the outside does not affect the clean room.

Further, the data of the sensor can be externally transmitted by wire or wireless.

In other words, the wafer space and the space in which the sample and sensor are placed are separated.

Also, the air exhaust inside the sensor area is characterized by a space inside the clean room and a space in which the flow of air does not flow artificially.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a semiconductor wafer process contamination monitoring wafer transfer apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a wafer transfer apparatus for semiconductor process contamination monitoring according to an embodiment of the present invention, FIG. 2 is a side sectional view of FIG. 1, and FIG. 3 is a schematic perspective view of FIG.

Referring to FIG. 1, the interior of the wafer transfer apparatus is divided into a space S2 for a sample and a space space S1 in which a wafer can be inserted to carry out a process.

The two spaces S1 and S2 are formed as separate independent spaces except for the port 31 for sampling. The port 31 is blocked by the check valve 32 from flowing backward into the wafer space S1 from the space S2 for the sample. In the figure, a check valve 32 is provided for each port.

In addition to the wafer space S1 in which the process is performed, a space S2 through which a sample analysis facility can be installed in the lower part is secured through a separation plate.

In addition to the above, the conventional wafer transfer apparatus is maintained in the same manner as the conventional wafer transfer apparatus.

The sample space S2 may affect the contamination prevention and process of the Equipment Front End Module (EFEM) (a standard interface device that supplies the wafer 11 in the transfer vessel to a semiconductor manufacturing process module including the substrate processing apparatus) , It should not be exposed to the EFEM even if the door of the wafer transfer apparatus (right side in FIG. 1, not shown) is opened after being loaded in the EFEM.

During the sampling, the internal exhaust is discharged only through the exhaust port. In order to prevent contamination of the cleanroom by exhaust, a removable chemical filter with an exhaust fan (13) on the opposite side of the door (toward the cleanroom when loading EFEM) 21) was installed to minimize the environmental impact when the contamination source inside the wafer transfer apparatus was discharged to the outside. Air exhaust is possible through exhaust fan and chemical filter.

The wafer space S1 selects a space according to the type of the lower sensor and equipment.

The sample port is installed as multi-port (31) to allow multiple samples.

The data analyzed through the sensor is stored in the data storage device 17-1, and a device capable of real-time transmission is provided through the data wireless transmission device 17-2 to prevent a defect caused by contamination in advance.

Reference numeral 18 denotes a sensor, which is an air molecular contamination (AMC), a temperature and humidity, and a particle contamination monitoring sensor.

According to the present invention, air is passed from the wafer space to the sample space through the multi-port 31, the particles are measured by the organic / inorganic compound measuring device 14, and then the air molecule contamination, temperature and humidity, And the monitoring result signal is transmitted to an external device (not shown) through a data relay. More specifically, the organic / inorganic compound measuring device 14 further includes an AMC detector and a pump for measuring HCl, HF, and NH3. The organic / inorganic compound analyzer 14 eventually serves as a sensor for measuring organic and inorganic compounds in the air.

According to the present invention, the space between the wafer and the sensor is separated from the space inside the wafer transfer device so that the influence generated by the sensor or the like is not transferred to the wafer, so that the production environment of the wafer is not affected and a wafer of good quality can be produced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. In addition, it will be understood by those of ordinary skill in the art that various embodiments are possible within the scope of the technical idea of the present invention.

10. Wafer transfer device
11. Wafer transfer device body
14. Oil / Inorganic Compounds (AMC Sensor)
16. Battery
17-1. Data storage device
17-2. Data wireless transmission device
18. Temperature / humidity sensor
31. Multiport
32. Check valve
42. Separator plate

Claims (4)

A wafer transfer apparatus for semiconductor process contamination monitoring,
A wafer transfer device body in the form of a rectangular box,
A separation plate for separating the internal space of the wafer transfer apparatus body into a space for a sample and a wafer space which is a space into which a wafer can be inserted to carry out a process;
And a multi-port connected to the check valve for preventing backflow from the space for the sample to the wafer space,
An organic / inorganic compound measuring device installed in a space in which the sample analyzing facility can be installed, a battery, a sensor, and a data repeater,
And a chemical filter for preventing air from being exhausted when the air inside the sensor area is exposed to the outside does not affect the clean room. The present invention is characterized in that contamination samples are possible during wafer process production, Wafer transfer device for semiconductor process contamination monitoring.
The apparatus according to claim 1, wherein the wafer space is adjustable according to the type and size of the sensor.
delete The method according to claim 1,
And the sensor data can be transferred to the outside by wire or wireless.
KR1020150089481A 2015-06-24 2015-06-24 Wafer Transfer Apparatus for Monitoring Contamination of Semiconductor Processes KR101565091B1 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018102055A1 (en) * 2016-12-02 2018-06-07 Applied Materials, Inc. Advanced in-situ particle detection system for semiconductor substrate processing systems
US10790176B2 (en) 2017-10-30 2020-09-29 Samsung Electronics Co., Ltd. Substrate carrier
KR20210015270A (en) 2019-08-01 2021-02-10 주식회사 유타렉스 Foup management system
KR102256132B1 (en) 2020-02-18 2021-05-25 (주)캔탑스 Automated Material Handling System for Managing Carrier Internal Pollution
KR102333314B1 (en) 2020-11-19 2021-12-02 주식회사 하이퓨리티 Apparatus for monitoring contamination of semiconductor processes using open path structure
KR102333316B1 (en) 2020-11-19 2021-12-02 주식회사 하이퓨리티 Apparatus with open path structure for monitoring contamination of semiconductor processes
US11733077B2 (en) 2021-03-29 2023-08-22 Samsung Electronics Co., Ltd. Carrier for measurement and wafer transfer system including the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101507436B1 (en) * 2014-05-14 2015-04-07 주식회사 위드텍 Apparatus for monitoring contaminants in air

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101507436B1 (en) * 2014-05-14 2015-04-07 주식회사 위드텍 Apparatus for monitoring contaminants in air

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018102055A1 (en) * 2016-12-02 2018-06-07 Applied Materials, Inc. Advanced in-situ particle detection system for semiconductor substrate processing systems
US10365216B2 (en) 2016-12-02 2019-07-30 Applied Materials, Inc. Advanced in-situ particle detection system for semiconductor substrate processing systems
US10883932B2 (en) 2016-12-02 2021-01-05 Applied Materials, Inc. Advanced in-situ particle detection system for semiconductor substrate processing systems
US10790176B2 (en) 2017-10-30 2020-09-29 Samsung Electronics Co., Ltd. Substrate carrier
KR20210015270A (en) 2019-08-01 2021-02-10 주식회사 유타렉스 Foup management system
KR102256132B1 (en) 2020-02-18 2021-05-25 (주)캔탑스 Automated Material Handling System for Managing Carrier Internal Pollution
US11597607B2 (en) 2020-02-18 2023-03-07 Cantops Co., Ltd. Automated material handling system having carrier pollution management function
KR102333314B1 (en) 2020-11-19 2021-12-02 주식회사 하이퓨리티 Apparatus for monitoring contamination of semiconductor processes using open path structure
KR102333316B1 (en) 2020-11-19 2021-12-02 주식회사 하이퓨리티 Apparatus with open path structure for monitoring contamination of semiconductor processes
US11733077B2 (en) 2021-03-29 2023-08-22 Samsung Electronics Co., Ltd. Carrier for measurement and wafer transfer system including the same

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