KR101532387B1 - Apparatus for manufacturing PCB by forming circuit pattern and connecting the circuit pattern through via-hole simultaneously - Google Patents

Abstract

The present invention relates to a printed circuit board printing apparatus for simultaneously forming a circuit pattern and an in-hole conducting line. Such a printed circuit board printing apparatus includes a screen printing apparatus that prints a circuit pattern using an electrically conductive paste on an insulating layer constituting a printed circuit board; And an insulative layer disposed on a lower surface of the insulating layer so that the conductive paste is printed in a through hole that conducts a circuit pattern formed on upper and lower surfaces of the insulating layer, And a device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board (PCB)

The present invention relates to a printed circuit board printing apparatus for forming a circuit pattern and a conductive line in a through hole. More particularly, the present invention relates to a printed circuit board printing apparatus for printing a circuit pattern on an upper surface and a lower surface of an insulating layer, And the conductive material can be completely printed on the inner circumferential surface of the through hole when the conductive line is formed.

FIG. 1 schematically shows a process of forming a circuit pattern on a conventional printed circuit board and conducting a circuit pattern formed on the upper and lower sides of the insulating layer.

Referring to FIG. 1, a conventional printed circuit board is prepared by first preparing a raw material (double-sided copper foil film) having a conductive layer on both sides of an insulating layer. A polyimide film is used as an insulating layer, and a copper film is used as a conductive layer.

Then, a front etching process is performed. In the case of double-sided copper foil film, the thickness of the copper foil is determined, and when conducting through-hole plating, a thickness of about 10 탆 or more is formed. Therefore, when it is desired to form a fine pattern, it is too thick, And the process of lowering the thickness is carried out.

Then, the through holes are passed through the conductive layer and the insulating layer to process the through holes. Next, a conductive layer is formed by exposing the conductive layer and the insulating layer having the through holes to a conductive aqueous solution to perform a pre-plating process (a shadow process).

Next, an electroless copper plating film is formed on the conductive layer and the insulating layer on which the conductive film is formed, and the inner wall of the through hole is coated with the conductive copper using the Pd (palladium) catalytic reaction. Using the electrolytic reaction of copper, the inner wall of the hole is completely coated with conductive copper.

Next, the photosensitive film is laminated, and the steps of exposure, development, erosion, and peeling are performed to form a circuit of a desired pattern to form a final circuit.

As described above, in the conventional printed circuit board, the process of implementing a circuit pattern formed on both sides of the insulating layer so as to be conductive through the through holes is complicated, which lowers the productivity and increases the defect rate.

SUMMARY OF THE INVENTION The present invention has been conceived in order to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor device and a manufacturing method thereof that can easily form a circuit pattern on an upper surface and a lower surface of an insulating layer by a printing method, And it is an object of the present invention to provide a printed circuit board printing apparatus in which a conductive material can be completely printed on the inner circumferential surface of a through hole when a conductive line is formed.

A printed circuit board printing apparatus for forming a circuit pattern and a conductive line in a through hole in accordance with the present invention includes a screen printing apparatus for printing a circuit pattern using an electrically conductive paste on an insulating layer constituting a printed circuit board; And an insulative layer disposed on a lower surface of the insulating layer so that the conductive paste is printed in a through hole that conducts a circuit pattern formed on upper and lower surfaces of the insulating layer, And a device.

The suction device may further include a suction plate for sucking air, and a seating plate disposed under the insulating layer and having a suction hole for sucking air through the hole when the suction pump is sucked.

The suction pump includes a first pump that sucks air when the squeegee of the screen printing apparatus moves from one side of the screen to the other side and prints a circuit pattern, and a second pump that sucks air after the squeegee is moved to the other side of the screen And a second pump for supplying the second pump.

The suction pump includes a first pump that sucks air when the squeegee of the screen printing apparatus moves from one side of the screen to the other side and prints a circuit pattern, and a second pump that sucks air after the squeegee is moved to the other side of the screen And the first pump is preferably operated together when the second pump is operated.

The printed circuit board printing apparatus for forming the circuit pattern and the in-hole conductive line according to the present invention can easily form a circuit pattern on the upper and lower surfaces of the insulating layer by a printing method, Thereby providing an effect of easily forming a conduction line for conducting current through the through hole.

In addition, when the conduction line is formed by using the suction pump, the effect of perfectly printing the conductive material on the inner circumferential surface of the through hole is provided.

Further, the present invention provides the effect of improving the productivity by shortening the manufacturing time by the simplified process, and improving the quality of the product by lowering the defective rate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a method of forming a circuit pattern of a conventional printed circuit board and a flow-
2 is a schematic plan view of a printed circuit board printing apparatus according to an embodiment of the present invention,
FIG. 3 is a schematic view illustrating a process of manufacturing a printed circuit board using the printed circuit board printing apparatus according to the present invention.
4 is a schematic view of another embodiment of manufacturing a printed circuit board using a printed circuit board printing apparatus according to the present invention.
FIG. 5 is a drawing showing a part of FIG. 4,
FIGS. 6 to 8 schematically illustrate another embodiment of manufacturing a printed circuit board using the printed circuit board printing apparatus according to the present invention. FIGS.
9 is a view illustrating a printed circuit board printing apparatus according to another embodiment of the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic plan view of a printed circuit board printing apparatus according to an embodiment of the present invention. FIG. 3 is a view schematically showing a process of manufacturing a printed circuit board using the printed circuit board printing apparatus according to the present invention. to be.

Referring first to FIG. 2, a printed circuit board printing apparatus for forming a circuit pattern and an in-hole conducting line according to an embodiment of the present invention includes a screen printing apparatus 10 and a suction apparatus 20.

The screen printing apparatus 10 is provided for printing a circuit pattern on an insulating layer 40 constituting a printed circuit board using a conductive paste. The screen printing apparatus 10 includes a screen 11 having a pattern corresponding to a circuit pattern to be printed on an insulating layer 40 and a squeegee 12 for pushing a conductive paste into the screen 11 .

Since the configuration of the screen printing apparatus 10 adopts the well-known bar, a detailed description thereof will be omitted. As the screen printing apparatus 10, known devices such as flexo printing, flat-screen printing, roll-to-roll (R2R) printing, and rotary screen printing may be used.

The suction device 20 is provided with a circuit pattern formed by printing on the upper surface of the insulating layer 40 and a circuit pattern formed by printing on the lower surface of the insulating layer 40, And is provided for printing a conductive paste.

The suction device (20) is disposed below the insulating layer (40). A circuit pattern is formed on the upper surface and the lower surface of the insulating layer 40 by the screen printing apparatus 10. The suction device 20 sucks the conductive paste downward and prints a conductive paste in the through hole 41.

The suction device (20) includes a suction pump (21) and a seat plate (30).

The suction pump 21 is a pump for sucking air. The suction plate 30 is disposed on the lower side of the insulating layer 40 and has a suction hole 31 for sucking air through the passage hole 41 when the suction pump 21 is sucked. A plurality of suction holes (31) are provided on the seating plate (30).

The insulating layer 40 is seated on the upper surface of the seating plate 30 and the suction hole 31 sucks the external air through the passage hole 41 formed in the insulating layer 40, . The suction pump (21) is connected to one side of the seating plate (30).

Also, according to the present embodiment, the suction pump 21 includes a first pump 211 and a second pump 212.

The first pump 211 is provided to suck air when the squeegee 12 of the screen printing apparatus 10 moves from one side of the screen 11 to the other side to form a circuit pattern on the insulating layer 40 do.

That is, the first pump 211 operates during the formation of the circuit pattern on the insulating layer 40 so that the conductive paste is sucked to the inner circumferential surface of the through hole 41, and the conductive paste is first attached to the inner circumferential surface of the through hole 41 .

The second pump 212 is provided to suck air after the squeegee 12 is moved to the other side of the screen 11. That is, the second pump 212 forms a circuit pattern on the insulating layer 40, and then secondarily sucks air further so that the conductive paste can be attached to the inner circumferential surface of the through hole 41.

In addition, the first pump 211 may be implemented to operate in conjunction with the second pump 212. That is, the first pump 211 primarily sucks the conductive paste when the squeegee 12 moves from one side of the screen 11 to the other side, and the second pump 212 sucks the conductive paste, And moves to the other side of the screen 11, and secondarily sucks the conductive paste. At this time, the first pump 211 may be operated simultaneously. The first pump 211 and the second pump 212 operate simultaneously to increase the suction pressure of the conductive paste.

Hereinafter, the operation of the apparatus for printing a printed circuit board according to an embodiment of the present invention will be described in detail with reference to a process of forming a circuit pattern.

3 (a) and 3 (b), a through hole 41 is formed in the insulating layer 40 first. The through holes 41 are formed through upper and lower surfaces of the insulating layer 40. As the insulating layer 40, a known material such as a polyimide film may be used.

The first circuit pattern 50 is printed on the upper surface of the insulating layer 40. When the first circuit pattern 50 is formed, the second circuit pattern 60 is formed by turning the insulating layer 40 upside down.

The first circuit pattern 50 is printed on the upper surface of the insulating layer 40 in a screen manner using a conductive paste. As the conductive paste, known materials such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al)

When the first circuit pattern 50 is formed, a part of the conductive paste is sucked downward while air is sucked by the suction device 20 and is coupled to the inner circumferential surface of the through hole 41. A part of the first circuit pattern 50 is sucked to the inside of the through hole 41 and attached to the inner circumferential surface of the through hole 41, as shown in FIGS. 3 (c) and 3 (d)

Specifically, the conductive paste is primarily sucked by the first pump 211 while the squeegee 12 is moving from one side of the screen 11 to the other side, and the squeegee 12 is sucked by the screen 11 The conductive paste is secondarily sucked by the second pump 212 so that the conductive paste is printed on the inner circumferential surface of the through hole 41.

Of course, when the squeegee 12 is completely moved to the other side of the screen 11 and the second pump 212 is operated, the first pump 211 is operated during the movement of the squeegee 12, 1 pump 211 may be operated together to increase the suction pressure of the conductive paste.

Since the high viscosity conductive paste for a fine circuit has a high viscosity, the degree of self-flowing due to the self weight of the conductive paste may be small, and the conductive paste having a high viscosity may block the upper side of the through hole 41 while printing the circuit pattern It is possible to cause non-conduction of circuit patterns formed on the upper and lower surfaces of the insulating layer 40.

Accordingly, when the circuit pattern is printed on the insulating layer 40, the suction device 20 sucks air into the through hole 41 so that the conductive paste is attached to the inner circumferential surface without blocking the upper portion of the through hole 41, 70 can be formed.

The second circuit pattern 60 is formed by printing a conductive paste on the insulating layer 40 on which the first circuit pattern 50 is formed in a state of being inverted.

According to the present embodiment, the second circuit pattern 60 is performed after the first circuit pattern 50 is heat-treated and cured. Specifically, after the first circuit pattern 50 is cured, the insulating layer 40 is turned over so that the upper surface of the insulating layer 40 is the lower surface.

The first circuit pattern 50 formed on the upper surface of the insulating layer 40 is inverted and turned to the lower surface of the insulating layer 40. In this state, the second circuit pattern 60 is formed.

When the second circuit pattern 60 is formed, the suction device 20 sucks the conductive paste into the through hole 41 as in the case of forming the first circuit pattern 50. The conductive paste sucked into the through hole (41) is coupled to the inner peripheral surface of the through hole (41).

3 (e) and 3 (f), when the squeegee 12 is moved from one side of the screen 11 to the other side, the conductive paste is moved by the first pump 211 When the squeegee 12 is completely moved to the other side of the screen 11, the conductive paste is secondarily sucked by the second pump 212 and conductive paste is printed on the inner circumferential surface of the through hole 41 .

Of course, when the squeegee 12 is completely moved to the other side of the screen 11 and the second pump 212 is operated, the first pump 211 is operated during the movement of the squeegee 12, 1 pumps 211 may also operate together to increase the suction pressure of the conductive paste.

Therefore, when forming the first circuit pattern 50, a portion of the conductive line 70 is formed on the inner circumferential surface of the through hole 41, and when the second circuit pattern 60 is formed, A portion of the line 70 is formed.

That is, part of the conductive line 70 is formed at the same time when the first circuit pattern 50 is formed and part of the remaining conductive line 70 is formed at the same time when the second circuit pattern 60 is formed, The conductive lines 70 in the through holes 41 are formed simultaneously with the formation of the first and second circuit patterns.

As described above, the printed circuit board printing apparatus for forming the circuit pattern and the in-hole conductive line according to the present invention forms a circuit pattern on the top and bottom surfaces of the insulating layer 40 on which the through holes 41 are formed. At this time, the conductive paste formed by the circuit pattern is sucked along the inner circumferential surface of the through hole 41 by the suction device 20 so that the conduction line 70 is easily formed.

Therefore, the conduction line 70 in the through hole 41 for conducting the circuit pattern and the circuit pattern can be realized through a quick and simplified process.

In addition, the circuit pattern and the conduction line 70 in the through hole 41 are formed at the same time to shorten the process time, thereby remarkably improving the productivity, and significantly reducing the defective rate generated in the conventional complicated process by a simplified process And provides an effect of improving the quality of the product.

4 and 6 to 8 illustrate a flowchart of another embodiment of manufacturing a printed circuit board using the printed circuit board printing apparatus according to the present invention.

Referring to FIG. 4, a first circuit pattern 50 is formed on one surface of the insulating layer 40, and a heat treatment process is performed. The first circuit pattern 50 is cured and shrunk during the heat treatment. Then, the through hole 41 is machined.

Next, a second circuit pattern 60 is formed on the other surface of the insulating layer 40, and the conductive paste is sucked using the suction device 20 at this time. Specifically, when the squeegee 12 moves from one side of the screen 11 to the other side, the first pump 211 operates to suck the conductive paste.

Then, when the squeegee 12 moves to the other side of the screen 11, the second pump 212 operates to suck the conductive paste secondarily. Then, by conducting the heat treatment process, the conductive paste is shrunk while being cured.

Of course, the first pump 211 operates when the squeegee 12 moves from one side of the screen 11 to the other, and further, when the second pump 212 operates, the first pump 211 ) Simultaneously operate to increase the suction pressure of the conductive paste.

5, the suction device 20 sucks the conductive paste twice to completely form the conduction line 70 connecting the first and second circuit patterns 50 and 60 . That is, even if the conductive paste sucked along the inner circumferential surface of the through hole 41 is not completely connected to the first circuit pattern during the first suction of the conductive paste, the secondary suction of the conductive paste is successively performed, Patterns 50 and 60 are perfectly connected. Therefore, the first and second circuit patterns 50 and 60 are not connected to each other, thereby preventing defects that may occur.

6, a first circuit pattern 50 is formed on one surface of the insulating layer 40, heat treatment is performed, a second circuit pattern 60 is formed on the other surface of the insulating layer 40, and heat treatment is performed do. Then, the through hole 41 is machined.

Next, a conductive paste is printed in the through hole 41, and a suction process is performed using the suction device 20 at this time. Specifically, when the squeegee 12 moves from one side of the screen 11 to the other side, the first pump 211 operates to suck the conductive paste.

Then, when the squeegee 12 moves to the other side of the screen 11, the second pump 212 operates to suck the conductive paste secondarily. The subsequent heat treatment process is the same as in the embodiment of Fig.

Of course, the first pump 211 operates when the squeegee 12 moves from one side of the screen 11 to the other, and further, when the second pump 212 operates, the first pump 211 ) Simultaneously operate to increase the suction pressure of the conductive paste.

7, the first and second circuit patterns 50 and 60 are formed on one surface and the other surface of the insulating layer 40, respectively, and a nonconductive protective film 80 is laminated on the first circuit pattern 50, do. Then, the through hole 41 is machined.

A process of printing a conductive paste on the inside of the through hole 41 is performed and a process of sucking the conductive paste by the suction device 20 is performed. At this time, the first pump 211 primarily sucks the conductive paste, and when the squeegee 12 moves to the other side of the screen 11, the second pump 212 operates to suck the conductive paste secondarily.

4 and 6, the first pump 211 may be implemented to operate with the second pump 212 when the squeegee 12 is moved to the other side of the screen 11 . Further, the subsequent heat treatment process is the same as the embodiment of Fig.

8, the first and second circuit patterns 50 and 60 are formed on one surface and the other surface of the insulating layer 40, the first protective film 80 is laminated on the first circuit pattern 50, , The second protective film 90 is laminated on the second circuit pattern 60.

Then, the through hole 41 is processed and a step of printing a conductive paste in the through hole 41 is performed. When the conductive paste is to be poured into the through hole 41, the suction process is performed by the suction device 20, and the primary suction process is performed by the first pump 211 as in the embodiment of Fig. 4, 2 pump 212 performs a secondary suction process.

Of course, as in the embodiment of FIGS. 4, 6 and 7, when the first pump 211 is operated with the second pump 212 when the squeegee 12 is moved to the other side of the screen 11, . Further, the subsequent heat treatment process is the same as the embodiment of Fig.

As described above, when the printed circuit board is formed by the process according to Figs. 4 to 7, the printed circuit board printing apparatus according to the present invention is used to form the first and second circuit patterns 50 and 60, (70) can be easily formed.

Meanwhile, FIG. 9 schematically shows another embodiment according to the present invention.

According to this embodiment, when a screen printing is performed in a roll-to-roll manner to form a circuit pattern, an example in which the printing apparatus according to the present invention is employed is shown.

The insulating layer 40 is drawn out in the form of a film from the rolls 80 disposed on both sides and the circuit pattern is printed in a screen manner between the rolls 80 arranged on both sides. An insulating film 40 in the form of a film is disposed on the upper side between the rolls 80 disposed on both sides and a porous support 90 is disposed on the lower side of the insulating layer 40. As the porous support 90, a porous paper, a porous plastic, a fabric, or the like may be used.

The suction device 20 adopted in the present invention is disposed below the porous support 90. 9, the insulating layer 40, the porous support 90 and the suction device 20 are disposed apart from each other. However, in the actual process, the insulating layer 40, the porous support 90, And the suction device 20 are disposed in contact with each other.

The suction device 20 operates in the same manner as in the embodiment of FIG. 3, so that the conductive layer 40 is electrically conductive to the inside of the through hole 41, The paste is sucked to form the conduction line 70 in the through hole 41.

The porous support 90 functions to prevent the suction device 20 from being contaminated when the conductive paste is discharged through the through hole 41 by the suction device 20. The insulating layer 40 on which the circuit pattern is formed after the screen printing passes through the drying section and is discharged to the other roll 80.

The operation and effect of the printed circuit board printing apparatus for forming the circuit pattern and the in-hole conductive line according to the present embodiment are the same as those of the embodiment of FIG. 3 described above, and thus a detailed description thereof will be omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and many modifications may be made without departing from the scope of the present invention.

10 ... Screen printing device 11 ... Screen
12 ... squeegee 20 ... suction device
21 ... suction pump 211 ... first pump
212 ... second pump 30 ... seat plate
31 ... suction hole 40 ... insulating layer
41 ... through hole 50 ... first circuit pattern
60 ... second circuit pattern 70 ... conduction line

Claims (4)

A screen printing apparatus 10 for printing a circuit pattern using a conductive paste when the insulating layer 40 is wound on a pair of rolls spaced apart from each other, pulled out from one roll and wound on the roll on the other side;
A porous support which is made of a fabric and wound on a pair of rolls spaced apart from each other in contact with the insulating layer 40 at the lower side of the insulating layer 40, 90);
And a conductive pattern formed on the lower surface and the lower surface of the insulating layer and electrically connected to the conductive pattern formed on the lower surface of the insulating layer, A suction device (20) for sucking the conductive paste downward so that the paste is printed; And
And a drying device provided at the rear end of the screen printing device (10) and the suction device (20) for drying the printed circuit pattern,
The suction device 20 includes a suction pump 21 for sucking air and a suction plate 31 having a plurality of suction holes 31 for sucking air through the hole 41 when the suction pump 21 is sucked, (30)
The suction pump 21 includes a first pump 211 for sucking air primarily when the squeegee 12 of the screen printing apparatus 10 moves from one side of the screen 11 to the other side and prints a circuit pattern, And a second pump (212) for secondarily sucking air together with the first pump (211) after the squeegee (12) is moved to the other side of the screen (11) And a conductive line in the through hole.
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