KR101516615B1 - LED lamp manufacturing method comprising a radiation system using the PCB ground - Google Patents

Abstract

The invention provides a manufacturing method of an LED lamp including a radiation system using a PCB ground. The manufacturing method comprises: a first step of forming a pattern on an upper cooper facet on both sides of PCB of which the copper facets are formed facing each other, centering a middle layer (210) made of an FR-4 material, in a PCB assembly (50) applied with a LED light source; a second step of connecting an upper ground of the PCB assembly (50) with a pattern and a lower copper facet (230) by using a thermal conducting device (240); a third step of forming an auxiliary thermal conducting medium hole (242) which penetrates the upper ground (223) of the PCB assembly and the lower copper facet (230), and copper-plating the inside of the auxiliary thermal conducting medium hole; a fourth step of manufacturing an auxiliary thermal conducting medium (244) to swiftly transfer heat accumulated on the upper ground of the PCB assembly (50) to the lower copper facet (230); and a fifth step of inserting the auxiliary thermal conducting medium (244) to the auxiliary thermal conducting medium hole (242). The invention represents a manufacturing method of LED lamp having a radiation system using the PCB ground, which conducts the inner heat of the lamp integrated on an PCB ground to a radiating medium through the thermal conductor device (240) to swiftly radiate heat in high temperature, generated from the LED.

Description

[0001] The present invention relates to a method of manufacturing an LED lamp having a heat dissipation system using a PCB ground,

The present invention relates to a large-sized lamp having a power LED, and more particularly, it relates to a large-sized lamp having a power LED, and more particularly, to a heat sink of LED lamps by effectively transferring heat accumulated in a luminaire by a PCB ground to a heat- And more particularly, to a method of manufacturing an LED lighting fixture having a heat dissipation system using a PCB ground that maximizes heat resistance.

LED street light and security light, which are called meca of modern lighting, are positioned as high efficient lighting.

However, in order to maintain the light efficiency and lifetime of the LED light source which is excellent in lifetime and efficiency, it is impossible to manufacture a high efficiency lighting lamp without effectively dissipating the heat generated from the thermal terminal of the LED chip.

As an example of a heat dissipating structure for efficiently discharging heat generated from an LED, Japanese Patent Application No. 10-0975970 filed by the present inventor entitled " Large Lighting with Power LED ", etc. and Patent Application No. 10-2014-0157232 entitled " "LED lighting lamp manufacturing method with LED "

1, a double-sided board (FR-4 PCB) having a copper foil on the upper and lower portions of a FR-4 material as shown in FIG. 1 (a) And a solder pad for fixing the lead frame of the power LED 100 to the upper copper surface of the double-sided board 200. The double-sided board (FR-4 PCB) And the via hole 230 is formed in the via hole 230. The heat transfer medium 300 is interposed in the via hole 230 so that one side of the heat transfer medium 300 is in contact with the heat radiation point of the heat generating portion of the LED, A PCB assembly having a power LED 100, a double-sided board 200, and a heat transfer medium 300 formed in a package so as to be exposed to the via hole 230 of the PCB 200,

The PCB assembly 50 is provided with a heater pipe type heat dissipater 600 to rapidly dissipate heat generated from the LED by the heat dissipater 600 and uniformly dissipate the heat dissipation member.

However, in the above-mentioned heat dissipation system, the heat generated from the heat radiation point of the LED chip is efficiently dissipated through the heat transfer medium 300 through the heater pipe type heat dissipater attached to the back surface copper surface of the PCB assembly. However, The heat dissipated to the inside of the PCB assembly (i.e., the front side of the PCB assembly) does not have a heat dissipation path, so that the LED light source can not exert its function at the time of shipment.

Registered Patent No. 10-0975970 "Large illuminated lamp with power LED" Patent Application No. 10-2014-0157232 entitled " Method of manufacturing LED lighting lamp with heater pipe type heat sink "

Therefore, in order to dissipate the heat accumulated in the luminaire of the LED lighting lamp, the LED lighting lamp unit (50) is connected to the ground (223) formed on the upper copper foil surface (220) And a heat dissipation system using a PCB ground that transfers the heat accumulated inside the lamp assembly to the heat radiator coupled to the lower copper surface 230 of the PCB assembly 50 to effectively dissipate heat in the lamp of the LED illuminator have.

In addition, the present invention can effectively dissipate the heat generated from the LEDs of the LED lamps, and dissipate the heat emitted from the LEDs to cool the LEDs at a uniform temperature without any difference in temperature, thereby maintaining the light efficiency and lifetime of the LEDs uniformly, The LED lighting lamp is provided.

In order to achieve the above object, the present invention provides a PCB assembly (50) on which an LED light source is mounted by forming a pattern on the upper copper foil surface of a double-sided PCB having a copper foil on the upper and lower surfaces of the intermediate layer (210) A first step of,

A second step of connecting the ground and the lower copper surface of the upper copper foil surface of the patterned PCB assembly 50 to the heat conduction means 240,

An auxiliary heat transfer medium hole 242 penetrating between the ground 223 and the lower copper foil surface 230 of the upper copper foil surface of the PCB assembly 50 is formed and Cu plating is performed on the inside diameter of the auxiliary heat transfer medium hole 242 Third,

A fourth step of manufacturing an auxiliary heat transfer medium 244 for rapidly transferring the heat accumulated on the ground on the upper surface of the PCB assembly 50 to the copper surface 230 of the lower portion of the PCB assembly 50,

And a fifth step of inserting the auxiliary heat transfer medium (244) in the auxiliary heat transfer medium hole (242). In this method, the heat inside the luminaire integrated in the PCB ground is transferred to the heat transfer means 240 so that the heat generated by the LED can be radiated quickly.

The present invention is characterized in that a heat conductive means is connected between a ground 223 formed on an upper copper foil surface 220 of a PCB assembly 50 constituting an LED lighting lamp and a lower copper foil surface 230, And the heat sink 60, which is coupled to the lower copper foil surface, is made of a heater pipe type heat sink, so that the heat sink formed in the heat sink has a uniform temperature Thereby preventing the LEDs from being heated at a specific position and maintaining the light efficiency and lifetime of the LEDs on an average, thereby improving the performance and lifetime of the LED lighting lamp.

FIG. 1 is a diagram showing a large lighting lamp having a conventional power LED,
2 is a block diagram of an LED circuit of the PCB assembly 50 of the present invention.
3 is a cross-sectional view taken along line AA of Fig.
4 is a sectional view taken along line BB of Fig.
5 is a view showing a configuration of an auxiliary heat transfer medium according to the present invention.
6 is a configuration diagram of an LED lighting lamp to which a heater pipe type heat sink of the present invention is coupled.
7 and 8 are views showing the structure of a heater pipe type heat discharger of the present invention.
9 is a flowchart illustrating a method of manufacturing an LED lighting lamp according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a cross-sectional view illustrating the structure of the heat conductive unit 240 connecting the ground 223 and the lower copper surface 230 of the upper copper foil 220 on the PCB assembly 50, which is a main component of the present invention. Sectional view.

The heat conductive means 240 for connecting the ground 223 and the lower copper surface 230 of the upper copper foil surface 220 of the PCB assembly 50 illustrated in FIG. 4 to conduct heat accumulated in the LED illumination lamp apparatus, It is preferable that the upper and lower parts of the PCB assembly 50 are made of copper so that the upper and lower parts of the PCB assembly 50 are made of copper. The auxiliary heat transfer medium hole 242 is formed in the auxiliary heat transfer medium hole 242 and copper plating 243 is applied to the inside diameter of the auxiliary heat transfer medium hole 242 to form the ground 223 of the copper foil surface 220 on the PCB assembly 50, The hole 242 is used as the heat conduction means 240 between the copper foil surface 230 and the hole 242 through the auxiliary heat transfer medium 244 to smoothly transfer the accumulated high heat in the LED lamp device to the heat sink.

The configuration of the heat conduction unit 240 will be described in detail.

The PCB assembly 50 having the LED light source mounted on the LED lighting lamp is formed with a copper foil on both the upper and lower surfaces. An electrical circuit is formed on the upper copper foil surface 220, a lower copper foil surface 230, The heat sink is usually coupled.

The PCB assembly 50 mounted in the LED lighting device includes a lower copper foil surface 220 on which the LED light source is mounted and a lower copper foil surface 230 on which the heat sink is coupled, Toward the cover portion side.

2 is a top view of a conventional double-sided board on which an electronic circuit is formed. FIG. 2 is a view showing a pattern 221 formed on an upper copper foil surface 220 of a double-sided board.

Typically, an electrical circuit of the LED light source is formed on the upper copper foil surface 220 of the PCB assembly 50. The circuit formation is performed through a process such as pretreatment, exposure, development, etching, peeling, And a portion of the pad 224 is etched away to form an electrically insulating portion and separated into a pattern 221 and a ground 223 by a space 222.

The pattern 221 is an electrical circuit that connects the node 15 and the cathode 12 of the LED mounted on the pad 224 and emits light from the LED light source when power is applied to both ends.

The space 222 is used for forming a pattern as an electrical circuit, and forms a pattern by removing unnecessary copper plates through processes such as pretreatment, exposure, development, etching, peeling, etc., in order to make the copper plate into an electric circuit.

The portion of the pad 224 is used to mount the LED light source among the patterns 221 and the node 15 and the cathode 12 are connected to the anode of the LED light source by disconnection A circuit to be connected is formed.

The ground 223 is left without removing the copper foil surface for maintaining the mechanical strength of the PCB and for electrical grounding (earth).

The heat generated in the heat dissipation point 19 in the process of emitting light from the LED light source is transmitted to the PCB assembly (not shown) through the heat transfer medium 30 And the heat is dissipated through the heat discharging body 60 provided on the lower copper foil surface of the PCB assembly 50.

However, a part of the heat generated at the heat radiation point 19 is not transmitted to the lower copper foil surface 230 of the PCB assembly 50 through the heat transfer medium 30, The temperature of the copper foil surface on the PCB assembly 50 is increased by the accumulated heat accumulated in the space between the lamp unit and the lamp assembly. As a result, the LED light source mounted on the PCB assembly 50 can not exhibit its function due to the temperature characteristic.

Accordingly, in order to solve the above problem, it is necessary to heat the upper ground 223 of the PCB assembly 50, which is not related to the electrical circuit of the LED light source, among the copper foils on the PCB assembly 50, And the heat sink 240 is connected to the lower copper surface 230 of the PCB assembly 50 to which the body is coupled.

The heat conduction unit 240 is connected to the ground 223 to transmit the high heat of the ground 223 formed on the PCB assembly 50 having the heat inside the lamp to the copper lower surface 230 of the PCB assembly 50, And the lower copper foil surface 230 are connected to each other.

The heat conduction unit 240 may be formed by plating an intermediate layer 210 of FR-4 material interposed between the upper ground 223 and the lower copper surface 230 of the side end portion of the PCB assembly 50 cut by the module for LED lighting lamps 241).

Further, the position of the heat conduction unit 240 may be formed at the side end of the PCB assembly 50 cut by the module for the LED lighting lamp, and the ground 223 formed at the upper portion of the PCB assembly 50, As shown in FIG. 4, a position adjacent to the LED light source, such as the auxiliary auxiliary heat transfer medium hole 242, is preferable in terms of effective heat transfer, as shown in FIG.

The ground 223 formed on the copper foil surface of the PCB assembly 50 and the copper foil surface 230 formed on the lower portion of the PCB assembly 50 are electrically connected to each other by copper plating 243 on the auxiliary heat transfer medium hole 242, (Cu).

The auxiliary heat transfer medium 244 is inserted into the auxiliary heat transfer medium hole 242 to increase the thermal conductivity between the ground 223 formed on the upper copper surface 220 of the PCB assembly 50 and the copper surface 230 formed on the lower side.

The auxiliary heat transfer medium 244 is preferably made of lead (Pb), copper (Cu), or silver (Ag) in consideration of thermal conductivity and economical efficiency.

" 또는 원주표면을 따라 요철부가 형성된 원기둥형상"

"으로 형성 하는 것이 바람직하다.Also, the shape of the auxiliary heat transfer medium 244 is a cylindrical shape having a concave / convex portion formed at the lower end thereof in consideration of the point where the heat conduction flows on the surface of the object,

Or " cylindrical "shaped < / RTI >

"Is preferable.

In the description of the present invention, a specific configuration of a large-sized lamp having an LED is disclosed in a large-sized lamp having a power LED of the present applicant's patent application No. 10-0975970, which is disclosed in the background art, and a detailed description thereof will be omitted In order to facilitate understanding of the present invention, a basic configuration will be described together.

1 and 3, a LED lighting lamp having a heat discharging body according to an embodiment of the present invention includes a power LED 10, a double-sided board (FR-4 PCB) 200, a double- The heat transfer medium 30 and the heat sink 60 are fitted into the via hole 23 of the heat sink 200.

The power LED 10 includes a V-shaped reflector 11 fixed to an electrode plate 9 and an anode terminal 12 connected to one side of the electrode plate 9 and an anode terminal 12 A gold bonding wire 13 of gold is bent toward the cathode (K) terminal 15 in order to ensure electrical contact between the members.

The power LED has a concave lens 14 mounted on the center of the V-shaped reflector 11 and a cathode terminal 15 connected to the bottom of the V- When a voltage is applied to the anode (A) terminal 12 and the cathode (K) terminal 15, the gold (Au) bonding wire 13 connected to the anode 12 ' And the semiconductor (e) moves from the high energy to the low energy with the odd (K) terminal 15 to generate light simultaneously with the start of the discharge.

The inside of the V-shaped reflector 11 is filled with a resin mold 16, and a convex lens 17 is seated thereon. A heat dissipation point (19) is formed in the power LED heat generation region (18).

The double-sided board (FR-4 PCB) 200 is formed by attaching Cu thin faces 220 and 223 to upper and lower portions of an intermediate layer 210 of FR-4 material. A via hole 23 is formed by punching every place and a lead frame (positive pole, negative pole) of the power LED 10, that is, an anode (A) terminal 12 and a cathode A solder pad 34 for fixing the terminal 15 is formed.

The heat transfer medium 30 is fitted into the via hole 23 of the double-sided board 20 so that the heat transfer medium is formed to have a height equal to the height of the solder pad 34.

형상으로 가공한 열전도성 칩(Chip)(32)으로 구성할 수 있다. 이러한 열전도성 칩(32)은 칩의 표면적을 확대하여 방열 효율을 향상시킬 수 있으며 기존의 스루홀에 무연납(Pb)을 충진 및 고착시키는 번거로움을 대신하게 된다. That is, in the present invention, the heat transfer medium 30 is implemented in a simple manner and the thermal efficiency is improved. As shown in FIG. 2, the cylindrical non-ferrous metal is cut,

And a thermally conductive chip (Chip) 32 processed into a shape. Such a thermally conductive chip 32 can increase the surface area of the chip to improve the heat radiation efficiency and replace the burden of filling and fixing Pb in the existing through hole.

The thermally conductive chip 32 may be formed of lead (Pb), copper (Cu), silver (Ag) or the like, more preferably silver (Ag).

The thermally conductive chip 32 is inserted into a plurality of via holes 23 formed in the double-sided substrate 20 and then joined with the thermal terminal of the LED 10 to have a heat dissipation structure.

That is, the power LED 10 is integrated from the rear heat dissipation point 19 to the lower end of the lower copper (Cu) thin surface 230 of the double-sided board 200 through the heat conductive chip 32 as the heat transfer medium 30 Thereby facilitating heat transfer. The power LED 10, the double-sided board 200, and the thermoelectric chip 32 are packaged together to form the PCB assembly 50.

FIG. 6 is a view showing a part of a LED lighting lamp 2 having a heater pipe type heat sink according to an embodiment of the present invention, in which a PCB assembly 50 and a heat sink 60 are combined.

The LED lighting lamp having the heat sink shown in Fig. 1 can be mainly used as a street lamp. Therefore, the street light is installed at a high place from above the ground, and the power LEDs 100 are directed downward as shown in the drawing to illuminate the road.

In view of this, the power LEDs 10 shown in FIG. 6 are shown inverted with respect to the power LEDs 10 shown in FIG.

The heat discharging body 60 is coupled to the back surface of the PCB assembly 50 formed by the power LEDs 10 as a light source and the combined PCB assembly 50 and the heat discharging body 60 are mounted in a luminaire Thereby completing the LED lighting lamp having the heater pipe type heat sink 60 (not shown).

The heat sink 60 is interposed and fixed on the lower copper (Cu) thin wall 230 where the heat transfer medium 30 is exposed on both sides of the double-sided board 200 in the PCB assembly 50, Thereby maximizing the natural thermal efficiency against high temperature.

6 to 8, the heat discharging body 60 according to the present invention includes a base plate 62 coupled to a lower copper foil surface 230 of a double-sided board 200, And a plurality of lower heat-radiating plates 64 are arranged on the base plate 62 in an upright manner.

The base plate 62 is connected to the lower copper surface 230 of the double-sided board 200 and is coupled to the lower hole 23 and contacts the heat transfer medium 30, Heat is transferred to the plurality of heat sinks 64 in a lump. The base plate 62 and the heat radiating plate 64 can be processed by pressing a plate material made of aluminum.

In the present invention, a coupling hole 64a is formed in the base plate 62 at the same height in the body of each heat sink 64, and the heater pipe 66 is coupled through the coupling hole 64a, The temperature of the heat sink 64 at the same height in the base plate 62 is maintained at the same temperature by the heat conduction, thereby preventing the heat eddy phenomenon caused by the temperature difference of each heat sink 64, The temperature of the base plate 62 becomes uniform, so that the heat radiation effect of each LED becomes uniform.

The main body of the heat radiating plate 64 is preferably provided with a pair of engaging holes 62a and a pair of engaging holes 62b, (64a). That is, each of the heat sinks 64 has a pair of coupling holes 64a having different heights, and both ends of a U-shaped heater pipe 66 are inserted into the pair of coupling holes 64a.

8, in order to effectively engage the heat sink 64 with the base plate 62, the engaging hole 64a of the heat sink 64 through which the rectilinear portion 66b of the heater pipe 66 penetrates, And the heater pipe curve fitting hole 64c of the heat radiating plate 64 through which the curved portion 66c of the heater pipe passes is formed differently so that the heat radiating plate 64 is disposed up to the heater pipe curved portion 66c, The heat dissipation effect is maximized by maximizing the number of the heat dissipating plates 64 provided on the heat dissipating plate 64.

The heater pipe curve coupling hole 64c is an elongated coupling hole in which a pair of coupling holes 64a through which both ends of the U-shaped heater pipe 66 are inserted is connected.

That is, the heat radiating plate of the heater pipe type heat discharging body installed in the luminaire, which is conventionally limited space, is connected to only the straight portion of the heater pipe and is not installed in the curved portion of the heater pipe.

A plurality of coupling holes 64a may be formed on the heat radiating plate 64 so that a plurality of heater pipes 66 can be coupled to the heat radiating plate 64.

It is preferable that the heat pipe 66 penetratingly coupled to the coupling hole 64a is welded to the heat sink 64. This is because even if the heater pipe 66 is tightly inserted into the coupling hole 64a and is coupled therewith, 64) and the heater pipe is small (incomplete coupling), heat can not be rapidly transferred between the heater pipe and the heat sink. Therefore, it is preferable to weld the joints between the heat sink 64 and the heater pipe in order to make them more tight.

The heater pipe 66 is preferably made of a copper (Cu) material having a high thermal conductivity. The heater pipe 66 is filled with a thermally conductive liquid and the liquid having a specific heat capacity greater than that of the metal It is preferable to fill.

If the whole heater pipe is made of copper (Cu), it is difficult to manufacture and process due to the physical properties of copper (Cu) itself, which is economically disadvantageous and also ineffective for rapid heat conduction between the heat sinks 64. In particular, There is an effect of preventing electrical accidents such as a short circuit caused by a filler in the LED lighting lamp using electricity.

The thickness of the heater pipe is preferably 0.3 0.6 mm considering the economical efficiency, easiness of fabrication, and the risk of breakage due to the expansion of the filler due to the high temperature.

Both ends of the heater pipe 66 form an openable and closable cap 66a to fill or replenish the filling material in the heater pipe 66. [

When the temperature of the heater pipe 66 rises, it is preferable that the cap 66a is screwed into the heater pipe 66 because the cap 66a may be detached by expansion due to high temperature.

Although the heater pipe 60 is formed in a U shape, it may be formed in various shapes such as a zigzag shape.

At least one heat dissipation hole 64b may be formed in the heat dissipating plate 64, which allows more efficient heat dissipation.

One end of the heat radiating plate 64 is coupled to the base plate 62 and the other end thereof is connected and fixed to the heat radiating plate by a connecting hole 68 to maintain a solid structure.

The heater pipe 66 having such a configuration reduces the temperature difference between the heat sinks by distributing the heat evenly throughout the heat sink 64 via the filler, thereby preventing the heat vortex phenomenon of the heat sink and further enhancing the heat radiation efficiency.

9 is a flow chart illustrating a method of manufacturing an LED lighting lamp having a heat dissipation system using PCB ground.

Referring to FIG. 9, in a method of manufacturing an LED lighting lamp having a heat dissipation system using PCB ground,

First, a pattern (not shown) is formed on the upper copper surface 220 of the double-sided PCB according to the LED lighting lamp to implement the double-sided PCB (PCB assembly) having the copper foil surfaces 220 and 230 on the upper and lower sides with the intermediate layer 210 of the FR- 221,

And a second step of connecting the upper ground 223 and the lower copper foil surface 230 of the patterned PCB assembly 50 to the heat conductive means 240,

 The second-stage heat conductive means is formed on the side edge of the patterned PCB assembly 50 and includes an intermediate layer of FR-4 material interposed between the ground 223 formed on the upper copper foil surface 220 and the lower copper foil surface 230, (Cu) plating (241).

In addition to the configuration of the copper plating-based heat conduction means formed at the side end portions of the patterned PCB assembly 50 in the second step, the upper ground 223 and the lower copper foil face 230 of the PCB assembly 50 are passed through (Cu) plating on the inside diameter of the auxiliary heat transfer medium hole 242. The third heat transfer medium hole 242 is formed in the auxiliary heat transfer medium hole 242. [

A fourth step of manufacturing an auxiliary heat transfer medium 244 for rapidly transferring the heat accumulated in the ground on the upper surface of the PCB assembly 50 to the copper surface of the lower portion of the PCB assembly 50,

The auxiliary heat transfer medium hole 242 or the copper auxiliary heat transfer medium hole 242 is formed in the auxiliary heat transfer medium hole 242 or the copper auxiliary heat transfer medium hole 242 in order to rapidly transfer the heat accumulated on the ground on the upper surface of the PCB assembly 50 to the copper surface of the lower portion of the PCB assembly 50 244) is inserted through the fifth step, and a LED lighting lamp having a heat dissipation system using the PCB ground is manufactured.

The material of the auxiliary heat transfer medium 244 manufactured in the fourth step may be any one of lead (pb), copper (cu) and silver (Ag) in consideration of economical efficiency and thermal conductivity.

"으로 형성되거나, 원기둥 단면부가 요철형상"

"으로 형성되는 것으로 할 수 있으며, 이는 물체의 표면을 따라 열 잘 전도되는 것을 이용한 것으로써 동일 체적에서 표면적을 최대화 하기 위해 원주면 또는 단면부에 굴곡진 요철형상을 형성하였다.Further, the shape of the auxiliary heat transfer medium 244 is formed in a cylindrical shape, and the circumferential surface of the cylindrical heat transfer medium 244 has a concavo-

Quot ;, or "

Quot ;, which is formed by the use of a thermally conductive material along the surface of an object, thereby forming a curved concavo-convex shape on a circumferential surface or an end surface in order to maximize the surface area in the same volume.

The LED lighting lamp having the PCB ground-use heat dissipation system includes a PCB assembly 50 and a lower copper surface 230 to which the heat radiation point 19 of the LED light source mounted on the PCB assembly 50 and the heat sink 60 are coupled It is possible to add a configuration that efficiently passes the high heat generated from the LED light source to the heat radiator through the via hole 23 and the heat transfer medium 30 is inserted into the via hole.

The heat sink provided in the LED lighting lamp using the PCB ground thermal conductivity may include a base plate 62 coupled to the lower copper surface 230 of the PCB assembly 50 and a plurality of The heat dissipating plate 64 and the heat dissipating plate 64 are each provided with a coupling hole 64a and the coupling hole 64a formed in the linear portion 66b of the heater pipe is connected to each of the heat dissipating plates 64 One coupling hole 64a is formed at a portion in contact with the base plate 62 and the other coupling hole 64a is formed at a position distant from the base plate 62 and the curve of the heater pipe A heater pipe curved portion coupling hole 64c is formed in the heat radiating plate 64 coupled to the portion 66c and the heater pipe curved portion coupling hole 64c is formed with a U- 66 are penetratingly coupled to each other.

The heater pipe 66 of the heater pipe type heat discharging body may be filled with water or insulating oil so as to improve the heat radiating effect.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of claims and equivalents thereof.

(50) - PCB assembly (60) - heat sink
(62) - base plate (64) - heat sink
(64a) - coupling hole (64b) - discharge hole
(64c) - heater pipe curved portion engaging hole (64d) - heat sink bend
(66) - heater pipe (66a) - cap
(66b) - heater pipe straight portion (66c) - heater pipe curved portion
(200) - double sided substrate (210) - intermediate layer of FR-4 material
(220) -upper copper (Cu) flake 221 - pattern
(222) -space (223) -ground
(224) - Pad (230) - Lower copper (Cu)
(240) - heat conduction means (241) - copper (Cu) plated heat conduction means
(242) - Auxiliary heat transfer medium holes (243) - Copper (Cu) plated auxiliary heat transfer medium holes
(244) - auxiliary heat transfer medium

Claims (11)

A method of manufacturing an LED lamp that dissipates heat generated from an LED light source through a heat sink,
The PCB assembly 50 on which the LED light source is mounted includes a first step of forming a pattern 221 on the upper copper foil surface of the double-sided PCB having the copper foil on the upper and lower surfaces of the intermediate layer 210 of the FR-
And a second step of connecting the upper ground 223 and the lower copper foil surface 230 of the patterned PCB assembly 50 to the heat conductive means 240. The lower copper surface 230 of the PCB assembly 50 The heat pipe body 60 includes a base plate 62 coupled to a lower copper surface 230 of the PCB assembly 50, A plurality of heat dissipating plates 64 that are coupled upright on the heat dissipating plates 62 and the heat dissipating plates 64 are formed with coupling holes 64a and the coupling holes 64a formed in the linear portions 66b of the heater pipes The heat sink 64 is formed in a pair of different heights and one coupling hole 64a is formed in a portion in contact with the base plate 62 and the other coupling hole 64a is formed in a portion far from the base plate 62 And the heat radiating plate 64 connected to the curved portion 64c of the heater pipe is provided with a heater pipe curved portion engaging hole 6 And a U-shaped heater pipe 66 is coupled to the coupling hole 64a and the heater pipe curved portion coupling hole 64c through a heat dissipation system using the PCB ground. Method of manufacturing LED lights.
The method according to claim 1,
The heat conduction means 240 formed in the second step includes an intermediate layer 210 of FR-4 material formed between the upper ground 223 and the lower copper foil 230 at the side edge of the patterned PCB assembly 50, (Cu) plating (241) is performed on the PCB ground.
3. The method of claim 2,
The second heat transfer means 240 forms an auxiliary heat transfer medium hole 242 penetrating between the upper ground 223 and the lower copper foil surface 230 of the PCB assembly 50, And a third step of copper plating the copper foil on the PCB ground.
The method of claim 3,
An auxiliary heat transfer medium 244 interposed in the auxiliary heat transfer medium hole 242 for rapidly transferring the heat accumulated in the ground 223 on the upper part of the PCB assembly 50 to the copper foil surface 230 under the PCB assembly 50 The manufacturing method of the LED lighting lamp according to any one of the preceding claims, further comprising a fourth step of manufacturing the LED lighting fixture using the PCB ground.
5. The method of claim 4,
And a fifth step of inserting an auxiliary heat transfer medium (244) into the auxiliary heat transfer medium hole (242).
6. The method of claim 5,
Wherein the auxiliary heat transfer medium (244) is made of lead (pb), copper (cu) or silver (ag).
The method according to claim 6,
The auxiliary heat transfer medium 244 is formed in a cylindrical shape, and the circumferential surface of the cylindrical heat transfer medium 244 has a concavo-

≪ RTI ID = 0.0 > 1, < / RTI > wherein the PCB ground is used.
The method according to claim 6,
The auxiliary heat transfer medium 244 is formed in a cylindrical shape,

≪ RTI ID = 0.0 > 1, < / RTI > wherein the PCB ground is used.
The method according to claim 1,
The PCB assembly 50 includes a via hole for each LED where the double-sided board (FR-4 PCB) is located, and a heat transfer medium is interposed in the via hole. One side of the heat transfer medium 30, And the other side is in contact with the lower copper foil surface.
delete The method according to claim 1,
Wherein the heater pipe (66) having the U-shape is filled with one of water and insulating oil.

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