KR101502167B1 - Gas barrier film and display element using the same - Google Patents

Abstract

Provided is a gas barrier film capable of effectively preventing moisture from entering from a side where a gas barrier layer is not formed even when a gas barrier film having an organic-inorganic-laminate-type gas barrier layer formed only on one side. And a gas barrier layer having at least one organic region and at least one inorganic region on one surface of the substrate film, wherein the surface of the other surface of the base film is coated with a resin having barrier performance as a main component Discloses a gas barrier film having only a single layer.

A base film, a gas barrier layer, an organic layer, an inorganic layer, a resin having barrier properties

Description

TECHNICAL FIELD [0001] The present invention relates to a gas barrier film and a display device using the barrier film.

The present invention relates to a gas barrier film, a method for producing the same, and a display device using the gas barrier film.

Conventionally, gas barrier films used in display devices such as organic EL devices have been studied. Japanese Patent Application Laid-Open No. 2007-30451 discloses a gas barrier film in which a gas barrier layer is formed on one surface of a base film and a resin layer having a glass transition temperature of 60 ° C or more is formed on the other surface. Japanese Patent Application Laid-Open No. 9-254303 discloses a gas barrier film in which a gas barrier layer is formed on one surface of a base film and an inner layer is formed on the other surface. However, in such a gas barrier film, the water shielding property on the surface on which the gas barrier layer is not formed is insufficient. Therefore, in the manufacturing process of the organic EL element or the like, moisture or the like intrudes into the film or is influenced by emission of the intruded component or the like.

On the other hand, Japanese Unexamined Patent Publication (Kokai) No. 2006-35737 discloses a gas barrier film having an organic-inorganic laminate type gas barrier layer on both surfaces of a base film. However, in Japanese Laid-Open Patent Publication No. 2006-35737, since the organic-inorganic laminate type gas barrier layer is provided on both surfaces, the production thereof is difficult.

The object of the present invention is to solve the above-described problems, and it is an object of the present invention to provide a gas barrier film which can effectively prevent moisture from intruding from a side where a gas barrier layer is not formed It is an object of the present invention to provide a gas barrier film.

As a result of intensive investigation by the inventors under the above-mentioned problems, it has been found that an organic / inorganic multilayer gas barrier layer is formed on one side of a base film and a layer having a barrier property as a layer having a barrier property (Which may be referred to as " a styrene resin layer "). Specifically, this is achieved by the following means.

(1) A gas barrier laminate having a gas barrier layer having at least one organic region and at least one inorganic region on one surface of a base film, wherein a layer having barrier performance is provided on the other surface of the base film, A gas barrier film having only a layer mainly composed of a resin.

(2) The gas barrier film described in (1), wherein the gas barrier layer has at least one organic layer and at least one inorganic layer.

(3) The gas barrier film according to (1) or (2), wherein the resin of the layer mainly composed of a resin having barrier performance is polyvinyl alcohol.

(4) The gas barrier film according to (1) or (2), wherein the resin of the layer mainly composed of a resin having barrier performance is a polyfunctional acrylate.

(5) The gas barrier film according to any one of (2) to (4), wherein the organic layer is formed by curing a composition containing at least one of (meth) acrylates having a bisphenol skeleton.

(6) The gas barrier film as described in any one of (1) to (5), wherein the main component of the organic layer is the same as the layer mainly composed of a resin having barrier performance.

(7) The gas barrier film according to any one of (1) to (6), wherein the main component of the resin having a barrier property and the main component of the organic layer are all (meth) acrylate derivatives.

(8) The gas barrier film according to any one of (1) to (7), wherein the thickness of the layer mainly composed of a resin having barrier performance is 0.5 to 30 占 퐉.

(9) The gas barrier film according to any one of (1) to (8), wherein the thickness of the gas barrier film is 10 to 300 μm.

(10) The gas barrier film according to any one of (1) to (9).

(11) A process for producing a gas barrier film as described in any one of (1) to (10), wherein a gas barrier layer is formed on a base film, Is formed on the surface of the gas barrier film.

(12) A display element using the gas barrier film according to any one of (1) to (10).

(13) The display element according to (12), wherein the gas barrier film is used as a substrate of a display element.

(14) The display element according to (12), wherein the gas barrier film is used as a sealing film of a display element.

(15) The display element according to any one of (12) to (14), wherein the display element is formed on the display element such that the layer mainly composed of a resin having a barrier property of the gas barrier film is outside.

According to the present invention, also in the embodiment in which the organic-inorganic-laminate-type gas barrier layer is formed only on one side of the gas barrier film, it is possible to suppress invasion or release of water or gas into or from the base film. As a result, when a display element such as an organic EL element is manufactured, deterioration of the display element can be reduced, and a display element can be stably manufactured.

Hereinafter, the contents of the present invention will be described in detail. In the present specification, " " is used to mean that the numerical values described before and after the lower limit and the upper limit are included. The organic EL element in the present invention refers to an organic electroluminescence element.

In the gas barrier film of the present invention, a gas barrier layer having at least one organic region and at least one inorganic region (in this specification, the case of " organic inorganic stacked-layer type gas barrier layer " (Barrier resin layer) mainly composed of a resin having a barrier performance as a layer having barrier performance.

Here, the barrier resin layer means that the first component constituting the layer is a resin having barrier performance, and usually means that it contains 80 wt% or more of a resin having barrier performance. Therefore, it is not intended to exclude those containing other components within the scope not departing from the gist of the present invention. The term " layer having barrier performance " means that only the barrier resin layer is formed of a layer having barrier performance, and it means that a layer having other functions may be formed. That is, although the mode in which the other gas barrier layer is formed is not included in the scope of the present invention, the mode in which the barrier resin layer and the adhesive layer for attaching the base film or the other functional layer is formed is included in the scope of the present invention do.

Hereinafter, the case where the gas barrier film of the present invention is used for a sealing film of an organic EL device will be described as an example. It is needless to say that the present invention is not limited to these aspects.

Fig. 1 is a schematic view of a conventional gas barrier film and a gas barrier film of the present invention in the case of using the same in a sealing film of an organic EL device, wherein (a) shows a conventional gas barrier film, Barrier film. Here, (1) is the base film, (2) is the organic-inorganic laminate gas barrier layer, and (3) is the barrier resin layer. (C) shows an organic EL device, in which a laminate 5 such as a pair of electrodes, an electrode thereof, and an organic compound layer formed between the electrodes is formed on the substrate 4.

In the conventional gas barrier film (a), since the moisture penetrates from the base film 1 side and the moisture permeates the gas barrier film, the deterioration of the device due to moisture . On the other hand, in the gas barrier film (b) of the present invention, penetration of moisture is sealed by the organic-inorganic-laminate-type gas barrier layer (2) and the barrier resin layer (3).

1, the gas barrier film of the present invention may be used as a substrate for an organic EL device, or may be used for both. It may be used for other display elements. Also in these cases, it is preferable that the barrier resin layer is formed so as to be external to the display element.

The thickness of the gas barrier film of the present invention is preferably 10 to 300 mu m, more preferably 25 to 250 mu m.

(A layer containing a resin having barrier performance as a main component)

The resin having the barrier performance in the layer (barrier resin layer) containing the resin having the barrier property of the present invention as a main component is a resin having a barrier property, for example, a gas component such as oxygen or moisture affecting the material constituting the organic EL element And the like. Specific examples include polyfunctional acrylates used for organic layers of polyvinyl alcohol, polyvinylidene chloride copolymer, ethylene-vinyl alcohol copolymer, synthetic mica-containing resin layer and organic-inorganic laminate-type gas barrier layer, Polyvinyl alcohol and polyfunctional acrylates are preferred.

The barrier resin layer is preferably the same as the main component of the organic layer constituting the gas barrier layer. With such a configuration, there is an advantage that film formation is easy.

It is preferable that the barrier resin layer has a vapor permeability of 0.001 to 10 g / m 2day when measured under conditions of a gas barrier property of 25 ° C and a relative humidity of 50%.

The thickness of the barrier resin layer is preferably 0.5 to 30 占 퐉, more preferably 1 to 20 占 퐉.

The barrier resin layer is preferably formed by applying the resin composition on the base film, but a means such as attaching the resin film with an adhesive or the like may be employed.

(Gas barrier layer)

The gas barrier layer in the present invention is a layer having a function of blocking oxygen and moisture in the atmosphere, and is an organic-inorganic laminate type in which an organic region and an inorganic region or an organic layer and an inorganic layer are laminated.

Organic and inorganic regions or organic and inorganic layers are typically laminated together. In the case of being composed of an organic region and an inorganic region, it may be a so-called gradient material layer in which each region continuously changes in the film thickness direction. Examples of the inclined materials include those described in Kim et al., "Journal of Vacuum Science and Technology A Vol.23 p971-977 (2005 American Vacuum Society) Journal of Vacuum Science and Technology, Vol. 23, pp. 971-977, 2005 Published by the American Vacuum Society), or a continuous layer having no interface between an organic layer and an inorganic layer as disclosed in U.S. Patent Publication No. 2004-46497. Hereinafter, for the sake of simplicity, the organic layer and the organic region are described as the "organic layer", and the inorganic layer and the inorganic region are described as the "inorganic layer".

The number of layers constituting the gas barrier layer is not particularly limited, but typically 2 to 30 layers are preferable, and 3 to 20 layers are more preferable.

The thickness of the gas barrier layer is not particularly limited, but is preferably 0.2 to 30 占 퐉, for example, 0.5 to 15 占 퐉.

(Inorganic layer)

The inorganic layer is usually a layer of a thin film made of a metal compound. Any method can be used as the method for forming the inorganic layer as long as it can form the target thin film. For example, a coating method, a sputtering method, a vacuum deposition method, an ion plating method, a plasma CVD method, and the like are suitable. Specifically, JP-A-3400324, JP-A-2002-322561, The forming method described in each publication can be adopted.

The component contained in the inorganic layer is not particularly limited as long as it satisfies the above performance. For example, it may contain at least one metal selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce, An oxide, a nitride, a carbide, an oxynitride, an oxide carbide, a nitride carbide, a oxynitride carbide, or the like can be used. Among them, an oxide, a nitride or an oxynitride of a metal selected from Si, Al, In, Sn, Zn and Ti is preferable, and a metal oxide, a nitride or an oxynitride of Si or Al is particularly preferable. They may contain other elements as secondary components.

The thickness of the inorganic layer is not particularly limited, but is preferably in the range of 5 nm to 500 nm, more preferably 10 nm to 200 nm. In addition, two or more inorganic layers may be laminated. In this case, each layer may have the same composition or a different composition. Also, as disclosed in U.S. Patent Application Publication No. 2004-46497, the layer may be a layer in which the interface with the organic layer is unclear and the composition continuously changes in the film thickness direction.

(Organic layer)

In the present invention, the polymer is preferably an organic layer composed of a polymeric compound of a radically polymerizable compound and / or a cationically polymerizable compound having an ether group as a functional group.

(Polymerizable compound)

The polymerizable compound used in the present invention is a compound having an ethylenically unsaturated bond at the terminal or side chain and / or a compound having an epoxy or oxetane at the terminal or side chain. Of these, compounds having an ethylenic unsaturated bond at the terminal or side chain are preferable. Examples of the compound having an ethylenically unsaturated bond at the terminal or side chain include (meth) acrylate compounds (acrylate and methacrylate are also referred to as (meth) acrylate), acrylamide compounds, styrene compounds, Maleic anhydride, and the like.

(Meth) acrylate compounds are preferably (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate and the like.

As the styrene compound, styrene,? -Methylstyrene, 4-methylstyrene, divinylbenzene, 4-hydroxystyrene, 4-carboxystyrene and the like are preferable.

Specific examples of the (meth) acrylate compound are shown below, but the present invention is not limited thereto.

(Polymerization initiator)

The organic layer in the present invention is usually obtained by applying and curing a polymerizable composition, but the polymerizable composition may contain a polymerization initiator. When a photopolymerization initiator is used, its content is preferably 0.1 mol% or more, more preferably 0.5 to 2 mol%, based on the total amount of the polymerizable compounds. With such a composition, the polymerization reaction via the active ingredient-generating reaction can be appropriately controlled. Examples of photopolymerization initiators include, but are not limited to, Irgacure series (e.g., Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, and Irgacure series available from Ciba Specialty Chemicals, Darocure series (e.g., Dauro Cure TPO, Dauro Cure 1173, etc.), Quantacure PDO, Sartomer < (R) > (For example, Ezacure TZM, Ezacure TZT, etc.) which are commercially available from Mitsubishi Chemical Corporation.

(Method of forming organic layer)

The method of forming the organic layer is not specifically defined, but can be formed by, for example, solution coating or vacuum film forming. Examples of the solution coating method include a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, a slide coating method, or a coating method described in U.S. Patent No. 2681294 It can be applied by an extrusion coating method using a hopper. The vacuum film forming method is not particularly limited, but a film forming method such as vapor deposition or plasma CVD is preferable. In the present invention, the polymer may be applied as a solution, or a hybrid coating method containing an inorganic substance as disclosed in Japanese Patent Application Laid-Open Nos. 2000-323273 and 2004-25732 may be used .

(Crosslinking method of polymerizable compound)

In the present invention, the polymerizable compound is irradiated with heat or various energy rays, and is polymerized and crosslinked to form an organic layer containing the polymer as a main component. Examples of the energy ray include ultraviolet rays, visible rays, infrared rays, electron rays, X rays, gamma rays, and the like. At this time, a photopolymerization initiator is used in the case of polymerization by heat, a photopolymerization initiator and a sensitizer are used in the case of polymerization by visible light. Among the above, it is preferable to polymerize and crosslink the polymerizable compound containing a photopolymerization initiator with ultraviolet rays.

In the present invention, a composition containing a polymerizable compound is usually cured by light irradiation, but the light to be irradiated is usually ultraviolet light by a high-pressure mercury lamp or a low-pressure mercury lamp. The irradiation energy is preferably 0.5 J / cm 2 or more, more preferably 2 J / cm 2 or more. In the case of the (meth) acrylate compound, since the polymerization inhibition is caused by oxygen in the air, it is preferable to lower the oxygen concentration or the oxygen partial pressure during polymerization. When the oxygen concentration at the time of polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less. When the oxygen partial pressure at the time of polymerization is lowered by the depressurization method, the total pressure is preferably 1000 Pa or lower, more preferably 100 Pa or lower. It is particularly preferable to conduct ultraviolet polymerization by irradiating energy of 2 J / cm 2 or more under a reduced pressure of 100 Pa or less.

The organic layer in the present invention is preferably smooth and has a high film hardness. The smoothness of the organic layer is preferably less than 1 nm, more preferably less than 0.5 nm, as an average roughness (Ra value) of 1 占 퐉. The polymerization ratio of the monomer is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, particularly preferably 92% or more. The term "polymerization rate" as used herein means the ratio of the polymerizable group that is reacted among all the polymerizable groups (acryloyl group and methacryloyl group) in the monomer mixture. The polymerization rate can be quantified by the infrared absorption method.

Although the thickness of the organic layer is not particularly limited, if it is too thin, it becomes difficult to obtain the uniformity of the film thickness. If it is too thick, cracks are generated by the external force and the barrier property is deteriorated. From this viewpoint, the thickness of the organic layer is preferably 50 nm to 2000 nm, more preferably 200 nm to 1500 nm.

It is preferable that the organic layer is smooth as described above. The smoothness of the organic layer is preferably less than 1 nm, more preferably less than 0.5 nm, as an average roughness (Ra value) of 1 占 퐉. It is required that the surface of the organic layer does not have foreign substances such as particles and projections. Therefore, it is preferable that the film formation of the organic layer is performed in a clean room. The cleanliness is preferably 10000 or less in class, and more preferably 1000 or less in class.

It is preferable that the hardness of the organic layer is high. It is known that when the hardness of the organic layer is high, the inorganic layer is formed smoothly and as a result, the barrier ability is improved. The hardness of the organic layer can be represented by a minute hardness based on the nanoindentation method. The micro hardness of the organic layer is preferably 150 N / mm or more, more preferably 180 N / mm or more, and particularly preferably 200 N / mm or more.

It is preferable that two or more organic layers are laminated. In this case, at least one layer may be the organic layer described above, and the other organic layer may be the organic layer described above, or an organic layer derived from another composition. Also, as one layer of the organic layer, as disclosed in U.S. Patent Publication No. 2004-46497, the layer may be a layer in which the interface with the inorganic layer is unclear and the composition continuously changes in the film thickness direction.

(Substrate film)

The gas barrier film of the present invention usually uses a plastic film as a substrate film. The plastic film to be used is not particularly limited in terms of the material and the thickness of the film if it can hold a laminate such as an organic layer and an inorganic layer, and can be appropriately selected depending on the intended use. Specific examples of the plastic film include polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene resin, transparent fluororesin, polyimide, fluorinated polyimide resin, polyamide resin, polyamideimide resin , Polyetherimide resins, cellulose acylate resins, polyurethane resins, polyether ether ketone resins, polycarbonate resins, alicyclic polyolefin resins, polyarylate resins, polyethersulfone resins, polysulfone resins, cycloolefin copolymers, An alicyclic denatured polycarbonate resin, an alicyclic denatured polycarbonate resin, an alicyclic denatured polycarbonate resin, a fluorene ring denatured polyester resin, and an acryloyl compound. Among them, polyester resins (for example, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN)) are preferable.

When the gas barrier film of the present invention is used as a substrate of a device such as an organic EL device to be described later, the plastic film is preferably made of a material having heat resistance. Concretely, it is preferable that it is made of a transparent material having a high glass transition temperature (Tg) of 100 占 폚 or more and / or a linear thermal expansion coefficient of 40 ppm / 占 폚 or less. Tg and the coefficient of linear expansion can be adjusted by additives and the like. Examples of such a thermoplastic resin include polyethylene naphthalate (PEN: 120 占 폚), polycarbonate (PC: 140 占 폚), alicyclic polyolefin (e.g., Zeonoa 1600: 160 占 폚 manufactured by Nippon Zeon Co., Ltd.) (PES: 210 占 폚), polyether sulfone (PES: 220 占 폚), polysulfone (PSF: 190 占 폚), cycloolefin copolymer (COC: compound of Japanese Patent Application Laid- 260 ° C), fluorene ring-modified polycarbonate (BCF-PC: compound of Japanese Unexamined Patent Publication No. 2000-227603: 225 ° C), alicyclic modified polycarbonate (manufactured by Mitsubishi Gas Chemical Co., (Compound of JP-A No. 2000-227603: 205 占 폚) and acryloyl compound (compound of JP-A 2002-80616: at 300 占 폚 or higher) (parentheses indicate Tg) . In particular, when transparency is required, it is preferable to use an alicyclic polyolefin or the like.

When the gas barrier film of the present invention is used in combination with a polarizing plate, it is preferable that the barrier laminate of the gas barrier film is oriented toward the inside of the cell and disposed on the innermost side (adjacent to the device). At this time, since the gas barrier film is disposed inside the cell relative to the polarizing plate, the retardation value of the gas barrier film becomes important. The gas barrier film in this embodiment is obtained by laminating a gas barrier film using a base film having a retardation value of 10 nm or less and a circular polarizer (1/4 wave plate + (1/2 wave plate) + linear polarizer) It is preferable to use a linear polarizer in combination with a gas barrier film using a base film having a retardation value of 100 nm to 180 nm which can be used as a quarter wavelength plate or a quarter wavelength plate.

Examples of the base film having retardation of 10 nm or less include cellulose triacetate (Fujifilm Corporation: Fujitac), polycarbonate (Pure Ace Co., Ltd., Kaneka Corporation: Ermec Corp.), cycloolefin polymer (Pellet), Topol (Pellet), Polyarylate (Uni), Cycloolefin copolymer (Mitsui Chemical Co., Ltd.) U100 (pellet), transparent polyimide (Mitsubishi Gas Chemical Co., Ltd.: Neoprim), and the like.

As the 1/4 wavelength plate, a film adjusted to a desired retardation value by appropriately stretching the film can be used.

Since the gas barrier film of the present invention is used as a device such as an organic EL device, the plastic film is transparent, that is, has a light transmittance of usually not less than 80%, preferably not less than 85%, more preferably not less than 90% . The light transmittance can be calculated by measuring the total light transmittance and the scattered light amount using a method described in JIS-K7105, that is, an integrated light transmittance measuring apparatus, and subtracting the diffuse transmittance from the total light transmittance.

Even when the gas barrier film of the present invention is used for display purposes, transparency is not necessarily required when it is not provided on the observation side. Therefore, in such a case, an opaque material may be used as the plastic film. Examples of the opaque material include polyimide, polyacrylonitrile, a known liquid crystal polymer, and the like.

The thickness of the plastic film used in the gas barrier film of the present invention is not particularly limited as it is appropriately selected depending on the application, but is typically 1 to 800 占 퐉, preferably 10 to 200 占 퐉. These plastic films may have functional layers such as a transparent conductive layer and a primer layer. The functional layer is described in detail in Japanese Patent Application Laid-Open No. 2006-289627, paragraphs 0036 to 0038. Examples of the functional layers other than these include a mat layer, a protective layer, an antistatic layer, a smoothing layer, an antistatic layer, an adhesion improving layer, a light shielding layer, an antireflection layer, a hard coat layer, a stress relaxation layer, Antifouling layer, printed layer, and an easy-to-adhere layer.

(Display element)

Examples of the display element in the present invention include a liquid crystal display element, a touch panel, an organic EL element, a thin film transistor (TFT) image display element, and an electronic paper.

Liquid crystal display element

The reflection type liquid crystal display device has a structure comprising a lower substrate, a reflective electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, a transparent electrode, an upper substrate, a quarter wave plate, and a polarizing film in this order from below. In the case of color display, it is preferable to further form a color filter layer between the reflective electrode and the lower alignment film, or between the upper alignment film and the transparent electrode.

The transmissive liquid crystal display device has a structure composed of a backlight, a polarizing plate, a? / 4 plate, a lower transparent electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, an upper transparent electrode, an upper substrate, a? . In the case of color display, it is preferable to further form a color filter layer between the lower transparent electrode and the lower alignment film, or between the upper alignment film and the transparent electrode.

The type of the liquid crystal cell is not particularly limited, but it is more preferable to use a twisted nematic (TN) type, a super twisted nematic (STN) type or a hybrid aligned nematic (HAN) type, a VA (vertically aligned nematic) Controlled Birefringence, OCB (Compressed Bend), IPS (In-Plane Switching), and CPA (Continuous Pinwheel Aligment).

Touch panel

The touch panel can be applied to those described in JP-A-5-127822 and JP-A-2002-48913.

Organic EL device

The organic EL element refers to an organic electroluminescence element. An organic EL element has a cathode and an anode on a substrate, and has an organic compound layer including a light emitting layer between both electrodes. At least one of the positive electrode and the negative electrode is transparent in the nature of the light emitting element.

As the mode of lamination of the organic compound layer in the present invention, an embodiment in which the hole transporting layer, the light emitting layer, and the electron transporting layer are laminated in this order from the anode side is preferable. Further, a charge block layer or the like may be provided between the hole transporting layer and the light emitting layer, or between the light emitting layer and the electron transporting layer. A hole injecting layer may be provided between the anode and the hole transporting layer, and an electron injecting layer may be provided between the cathode and the electron transporting layer. The light emitting layer may be a single layer or may be divided into a first light emitting layer, a second light emitting layer, and a third light emitting layer. Each layer may be divided into a plurality of secondary layers.

Next, each element constituting the organic EL element will be described in detail.

Board

The substrate used in the organic EL device in the present invention may be the gas barrier film of the present invention or a substrate used in a known organic EL device. When a known substrate is employed, it may be a resin film or a gas barrier film. In the case of a gas barrier film, the gas barrier film disclosed in Japanese Laid-Open Patent Publication No. 2004-136466, Japanese Laid-Open Patent Publication No. 2004-148566, Japanese Laid-Open Patent Publication No. 2005-246716, Japanese Patent Laid-Open Publication No. 2005-262529, Can be preferably used.

When a known substrate is employed, its thickness is not particularly specified, but is preferably from 30 μm to 700 μm, more preferably from 40 μm to 200 μm, and still more preferably from 50 μm to 150 μm. In any case, the haze is preferably 3% or less, more preferably 2% or less, still more preferably 1% or less, and the total light transmittance is preferably 70% or more, more preferably 80% It is more than 90%.

anode

The anode usually has a function as an electrode for supplying holes to the organic compound layer, and its shape, structure, size and the like are not particularly limited and can be appropriately selected from known electrode materials according to the use and purpose of the light-emitting element. As described above, the anode is usually formed as a transparent anode. Transparent cathodes are described in detail in Yasaka Sawada supervised " new development of transparent electrode film " published by CMC (1999). When a plastic substrate having low heat resistance is used as the substrate, a transparent anode formed of ITO or IZO at a low temperature of 150 DEG C or less is preferable.

cathode

The shape of the cathode is not particularly limited as long as it has a function as an electrode for injecting electrons into the organic compound layer. The shape, structure, and size of the cathode are not particularly limited and may be appropriately selected from known electrode materials depending on the use and purpose of the light-emitting element.

Examples of the material constituting the cathode include metals, alloys, metal oxides, electrically conductive compounds, and mixtures thereof. Specific examples thereof include rare earth metals such as Group 2 metals (for example, Mg and Ca), gold, silver, lead, aluminum, lithium-aluminum alloys, magnesium-silver alloys, indium and ytterbium. These may be used alone or in combination of two or more in view of achieving both stability and electron injection properties.

Among them, as a material constituting the negative electrode, a material mainly composed of aluminum is preferable. The material mainly composed of aluminum refers to aluminum alone, an alloy of aluminum with 0.01 to 10 mass% of an alkali metal or a Group 2 metal (for example, a lithium-aluminum alloy, a magnesium-aluminum alloy, etc.). The material of the negative electrode is described in detail in JP-A-2-15595 and JP-A-5-121172. Further, a dielectric layer made of an alkali metal or a fluoride, oxide or the like of a Group 2 metal may be inserted between the cathode and the organic compound layer to a thickness of 0.1 to 5 nm. This dielectric layer can be regarded as one type of electron injection layer.

The thickness of the negative electrode can be appropriately selected depending on the material constituting the negative electrode and can not be uniformly defined, but is usually about 10 nm to 5 탆, preferably 50 nm to 1 탆.

The cathode may be transparent or opaque. The transparent cathode can be formed by forming a thin film of the material of the cathode to a thickness of 1 to 10 nm and further laminating a transparent conductive material such as ITO or IZO.

The light-

The organic EL device has at least one organic compound layer including a light-emitting layer. As the organic compound layer other than the organic light-emitting layer, the hole transport layer, the electron transport layer, the charge block layer, the hole injection layer, Each layer can be mentioned.

- Organic light emitting layer -

The organic luminescent layer has a function of receiving holes from an anode, a hole injecting layer, or a hole transporting layer, receiving electrons from a cathode, an electron injecting layer, or an electron transporting layer and providing a place for recombination of holes and electrons to emit light . The light emitting layer may be composed of only the light emitting material, or may be a mixed layer of the host material and the light emitting material. The light emitting material may be a fluorescent light emitting material or a phosphorescent light emitting material, and one dopant or two or more kinds of dopants may be used. The host material is preferably a charge transporting material. The host material may be one species or two or more species. For example, a mixture of a host material of electron transporting property and a host material of hole transporting property may be cited. Further, the light emitting layer may contain a material which does not have charge transportability and does not emit light. Further, the light emitting layer may be one layer, two layers or more, or each layer may emit light of a different color.

Examples of the fluorescent light emitting material include, for example, benzooxazole derivatives, benzoimidazole derivatives, benzothiazole derivatives, styrylbenzene derivatives, polyphenyl derivatives, diphenylbutadiene derivatives, tetraphenylbutadiene derivatives, naphthalimide A pyridazine derivative, a cyclopentadiene derivative, a bisstyryl anthracene derivative, a quinacridone derivative, a pyrrolopyridine derivative, a quinacridone derivative, a quinacridone derivative, a coumarin derivative, a condensed aromatic compound, a perinone derivative, an oxadiazole derivative, an oxazine derivative, , Various metal complexes represented by metal complexes of 8-quinolinol derivatives, metal complexes of pyromethene derivatives, and metal complexes of pyromethene derivatives, such as thiadiazolopyridine derivatives, cyclopentadiene derivatives, styrylamine derivatives, diketopyrrolopyrrole derivatives, aromatic dimethylidine compounds, , Polymer compounds such as polythiophene, polyphenylene, and polyphenylene vinylene, organic silane derivatives And compounds of the like.

The phosphorescent material may be, for example, a complex containing a transition metal atom or a lanthanoid atom. The transition metal atom is not particularly limited, but ruthenium, rhodium, palladium, tungsten, rhenium, osmium, iridium, and platinum are preferable, and rhenium, iridium, and platinum are more preferable.

Examples of the lanthanoid atom include lanthanum, cerium, praseodym, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, tulium, ytterbium and ruthemium. Among these lanthanoid atoms, neodymium, europium, and gadolinium are preferable.

Examples of the ligands of the complexes include G. Wilkinson et al., Comprehensive Coordination Chemistry, published by Pergamon Press, 1987, H. Yersin, Photochemistry and Photophysics of Coordination Compounds, Springer-Verlag, 1987 Published by Sakamoto Yamamoto, " Organometallic Chemistry-Fundamentals and Applications- " issued to Shokabo Sha 1982, and the like.

Examples of the host material contained in the light emitting layer include those having a carbazole skeleton, those having a diarylamine skeleton, those having a pyridine skeleton, those having a pyrazine skeleton, those having a triazine skeleton, and aryl Silane skeleton, and materials exemplified as the hole injection layer, the hole transport layer, the electron injection layer, and the electron transport layer which will be described later.

- Hole injection layer, Hole transport layer -

The hole injection layer and the hole transport layer are layers having a function of receiving holes from the anode or the anode side and transporting them to the cathode side. Specific examples of the hole injection layer and the hole transport layer are carbazole derivatives, triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, There can be mentioned an aromatic amine compound, an arylamine derivative, an amino substituted chalcone derivative, a styrylanthracene derivative, a fluorenone derivative, a hydrazone derivative, a stilbene derivative, a silazane derivative, an aromatic tertiary amine compound, A phosphorus compound, a phosphorus compound, an organic silane derivative, carbon, and the like.

- electron injection layer, electron transport layer -

The electron injection layer and the electron transport layer are layers having a function of receiving electrons from the cathode or cathode side and transporting them to the anode side. Specific examples of the electron injection layer and the electron transport layer are a triazole derivative, an oxazole derivative, an oxadiazole derivative, an imidazole derivative, a fluorenone derivative, an anthraquinodimethane derivative, an anthrone derivative, a diphenylquinone derivative, Quinolinol derivatives, carbodiimide derivatives, fluorenylidene methane derivatives, distyrylpyrazine derivatives, aromatic ring tetracarboxylic acid anhydrides such as naphthalene and perylene, phthalocyanine derivatives, metal complexes of 8-quinolinol derivatives, metal phthalocyanine, It is preferably a layer containing various metal complexes represented by a metal complex having oxazole or benzothiazole as a ligand, an organosilane derivative, and the like.

- hole blocking layer -

The hole blocking layer is a layer having a function of preventing the holes transported from the anode side to the light emitting layer from escaping to the cathode side. In the present invention, a hole blocking layer can be formed as the organic compound layer adjacent to the light emitting layer and the cathode side. The electron transporting layer and the electron injecting layer may also function as the hole blocking layer.

Examples of the organic compound constituting the hole blocking layer include aluminum complexes such as BAlq, triazole derivatives, phenanthroline derivatives such as BCP, and the like.

A layer having a function of preventing electrons transported to the light emitting layer from escaping to the anode side at the cathode side may be formed at a position adjacent to the light emitting layer and the anode side. The hole transporting layer / hole injecting layer may also serve this function.

(Solar cell)

The gas barrier film of the present invention can also be used as a sealing film of a solar cell element. Here, the gas barrier film of the present invention is preferably sealed so that the adhesive layer is close to the solar cell element. The solar cell element to which the gas barrier film of the present invention is preferably used is not particularly limited, but may be, for example, a single crystal silicon solar cell element, a polycrystalline silicon solar cell element, a single junction type, Silicon-based solar cell devices, III-V compound semiconductor solar cell devices such as gallium arsenide (GaAs) and indium phosphide (InP), II-VI compound semiconductor solar cell devices such as cadmium telluride (CdTe), copper / indium / selenium III-VI compound semiconductors such as copper (III), gallium (III), gallium (III), and cerium (CIS), and copper / indium / gallium / selenium / sulfur A cell element, a dye-sensitized solar cell element, and an organic solar cell element. Among them, in the present invention, it is preferable that the solar cell element is a copper / indium / selenium system (so-called CIS system), a copper / indium / gallium / selenium system (so- (A so-called ClGSS-based) solar cell device, preferably an I-III-VI compound semiconductor solar cell device.

Example

Hereinafter, the present invention will be described in more detail with reference to examples. The materials, amounts, ratios, processing contents, processing procedures and the like shown in the following examples can be appropriately changed as long as they do not depart from the gist of the present invention. Therefore, the scope of the present invention is not limited to the following specific examples.

[Example 1] Production and evaluation of gas barrier film (1)

Gas barrier films (Sample Nos. 101 to 115) in which an inorganic layer and an organic layer were formed on a base film were produced according to the following procedure. Details of the structure of each gas barrier film are as shown in Table 1. Polyethylene naphthalate (PEN, thickness: 100 mu m, Q65A, manufactured by Teijin DuPont Co., Ltd.) was used as the base film.

[1] Formation of Inorganic Layer (X)

Using a reactive sputtering apparatus, an inorganic layer of aluminum oxide was formed. The specific film forming conditions are shown below.

The vacuum chamber of the reactive sputtering apparatus was evacuated to an ultimate pressure of 5 x 10 < ^-4 > Pa with an oil rotary pump and a turbo molecular pump. Next, argon was introduced as a plasma gas, and a power of 2000 W was applied from a plasma power source. Purity oxygen gas was introduced into the chamber, the film formation pressure was adjusted to 0.3 Pa, and the film was formed for a predetermined time to form an inorganic layer of aluminum oxide. The obtained aluminum oxide film had a film thickness of 40 nm and a film density of 3.01 g / cm 3.

[2] Formation of organic layer (Y, W, Z, V, U)

The organic layer was formed by using five methods: a film forming method (organic layers Y, W, V, and U) by solvent application under atmospheric pressure; and a film forming method by flash evaporation (organic layer Z) under reduced pressure. The specific contents of the film formation are shown below.

[2-1] Deposition of the organic layer (Y) by solvent application under atmospheric pressure

9 g of tripropylene glycol diacrylate (TPGDA, manufactured by Daicel Cytec) as photopolymerizable acrylate and 0.1 g of a photopolymerization initiator (Irgacure 907, manufactured by Ciba Specialty Chemicals, Inc.) were dissolved in 190 g of methyl ethyl ketone to prepare a coating liquid Respectively. This coating liquid was applied to a base film using a wire bar and irradiated with a light intensity of 350 mW / cm 2 and a light irradiation dose of 500 mJ / cm 2 using a air-cooled metal halide lamp (manufactured by Igraphics Co., Ltd.) under a nitrogen purge of 0.1% / Cm < 2 > to form an organic layer (Y). The film thickness was about 500 nm.

[2-2] Deposition of the organic layer (W) by solvent application under atmospheric pressure

Except that dipentaerythritol hexaacrylate (DPHA: Shin-Nakamura Chemical Co., Ltd.) was used instead of tripropylene glycol diacrylate (TPGDA) as photopolymerizable acrylate. The film thickness was about 500 nm.

[2-3] Deposition of the organic layer (Z) by flash evaporation under reduced pressure

9.7 g of butyl ethyl propane diol diacrylate (BEPGA, manufactured by Kyowa Chemical Industry Co., Ltd.) as photopolymerizable acrylate, and 0.3 g of photopolymerization initiator (EZACURE-TZT, manufactured by Lamberti spa) were mixed to prepare a deposition liquid. This deposition liquid was deposited on the substrate by flash deposition under the condition that the internal pressure of the vacuum chamber was 3 Pa. Subsequently, under the condition of the same degree of vacuum, the organic layer Z was formed by irradiating ultraviolet rays of a dose of 2 J / cm 2. The film thickness was about 1200 nm. The formation of the organic layer Z was carried out using an organic inorganic laminate film forming apparatus Guardian 200 (Vitex Systems).

[2-4] Deposition of the organic layer (V) by solvent application under atmospheric pressure

9 g of bisphenol A type epoxy acrylate (NK Oligo EA-1020, manufactured by Shin-Nakamura Chemical Co., Ltd.) as a photopolymerizable acrylate and 0.1 g of a photopolymerization initiator (Irgacure 907 manufactured by Ciba Specialty Chemicals) were dissolved in 190 g of methyl ethyl ketone To prepare a coating solution. This coating liquid was applied to a base film using a wire bar and irradiated with a light intensity of 350 mW / cm 2 and a light irradiation dose of 500 mJ / cm 2 using a air-cooled metal halide lamp (manufactured by Igraphics Co., Ltd.) under a nitrogen purge of 0.1% / Cm < 2 > to form an organic layer (V). The film thickness was about 500 nm.

[2-5] Deposition of the organic layer (U) by solvent application under atmospheric pressure

Except for using epoxy acrylate (EB3702, manufactured by Daicel Cytec) instead of bisphenol A type epoxy acrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK Oligo EA-1020) as photopolymerizable acrylate, I followed. The film thickness was about 500 nm.

[3] Formation of Barrier Resin Layer (P)

The barrier resin layer was formed by the following six methods. The specific contents of the film formation are shown below.

[3-1] Deposition of the barrier resin layer (P-1)

Polyvinyl alcohol (PVA117H, manufactured by Kuraray Co., Ltd.) was dissolved in pure water at 2% by weight to prepare a coating liquid. This coating liquid was applied to a base film using a wire bar and dried at 80 캜 to form a barrier resin layer (P-1). The film thickness was about 700 nm.

[3-2] Deposition of the barrier resin layer (P-2)

Was dissolved in a mixed solvent of toluene / tetrahydrofuran = 1/2 (weight ratio) so that the amount of the vinylidene chloride copolymer (Saren Resin F216, manufactured by Asahi Chemical Industry Co., Ltd.) was 15% by weight. This coating liquid was applied to a base film using a wire bar and dried at 105 캜 to form a barrier resin layer (P-2). The film thickness was about 2.5 mu m.

[3-3] Deposition of the barrier resin layer (P-3)

Ethylene-vinyl alcohol copolymer (PONA NOR 30L, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) was dissolved in a mixed solvent of pure water / isopropanol = 1/1 (weight ratio) so as to be 12 wt%. This coating liquid was applied to a base film using a wire bar and dried at 110 DEG C to form a barrier resin layer (P-3). The film thickness was about 2 mu m.

[3-4] Deposition of the barrier resin layer (P-4)

A dispersion liquid 1 in which synthetic mica (tetraxylic mica (Na-Ts), manufactured by Toei Kogyo Seiyaku Co., Ltd.) was dispersed in pure water to 0.65 wt% and polyvinyl alcohol (PVA210, manufactured by Kuraray Co., (2) were mixed so that the dispersion (1) and the solution (2) were mixed so as to have a solid component ratio (volume ratio) of (1) / (2) = 3/7. This coating liquid was applied to a base film using a wire bar to form a barrier resin layer (P-4). The film thickness was about 1 mu m.

[3-5] Deposition of the barrier resin layer (P-5)

(P-4), except that hydroxyethyl cellulose (manufactured by Wako Pure Chemical Industries, Ltd.) was used instead of the polyvinyl alcohol of the solution (2). The film thickness was about 1 mu m.

[3-6] Deposition of the barrier resin layer (P-6)

9 g of dipentaerythritol hexaacrylate (DPHA, Shin-Nakamura Chemical Co., Ltd.) as photopolymerizable acrylate and 0.1 g of a photopolymerization initiator (Irgacure 907, manufactured by Ciba Specialty Chemicals, Inc.) were dissolved in 190 g of methyl ethyl ketone, Respectively. This coating liquid was applied to a base film using a wire bar and irradiated with a light intensity of 350 mW / cm 2 and a light irradiation dose of 1 J / cm 2 using a air-cooled metal halide lamp (manufactured by Igraphics Co., Ltd.) under a nitrogen purge with an oxygen concentration of 0.1% Cm < 2 > to form a barrier resin layer (P-6). The film thickness was about 1 mu m.

[4] Production of gas barrier film

The gas barrier film was produced by sequentially forming the inorganic layer and the organic layer on the substrate film in accordance with the constitution of each sample described in Table 1. [ The manufacturing method was performed by the following three methods.

[4-1] A method of repeating the formation of an organic layer by solvent application and the formation of an inorganic layer under reduced pressure (lamination A)

An organic layer and an inorganic layer were laminated on a substrate. In order to laminate the inorganic layer on the organic layer, the organic layer was formed by applying the solvent, then the pressure was reduced by putting it in the vacuum chamber, and the inorganic layer was formed after maintaining the vacuum degree at 10 ^-3 Pa or less for a certain time. When the organic layer is laminated on the inorganic layer, the organic layer is formed by solvent application immediately after the inorganic layer is formed.

[4-2] Method of forming a uniform film of an organic layer and an inorganic layer under reduced pressure (Lamination B)

The organic layer and the inorganic layer were laminated using the above-described organic inorganic laminate film forming apparatus Guardian200. This apparatus is capable of continuous film formation under a reduced pressure environment because both the organic layer and the inorganic layer are formed under a reduced pressure environment and the organic layer and the inorganic film deposition chamber are connected. Therefore, the barrier layer is not opened to the atmosphere until it is completed.

[4-3] A method in which only the first layer is coated with a solvent to form an organic layer and the remaining layer is formed under reduced pressure (lamination C)

A first organic layer was formed on the substrate by a solvent coating method. Subsequently, the substrate having the first organic layer was put in a vacuum chamber, reduced in pressure, held at a vacuum degree of 10 ^-3 Pa or less for a predetermined time, and then an inorganic layer and an organic layer were alternately formed.

[5] Property evaluation of gas barrier film

All properties of the gas barrier film were evaluated using the following apparatus.

[Layer Composition (Thickness)]

The thin section of the film sample was observed and measured with a scanning electron microscope " S-900 type ", manufactured by Hitachi, Ltd.

[Water vapor permeability (g / m 2 / day)]

PERMATRAN-W3 / 31 " (condition: 40 DEG C, relative humidity: 90%) manufactured by MOCON. Further, a value of 0.01 g / m < 2 > / day or less, which is the measurement limit of the MOCON apparatus, was supplemented by the following method. First, a metal Ca was directly deposited on the gas barrier film, and the film and the glass substrate were encapsulated with commercially available encapsulating materials for organic EL so that the deposited Ca was inward. Next, the measurement sample was kept at the above-described temperature and humidity condition, and the water vapor permeability was obtained from the optical density change of the metal Ca on the gas barrier film (the metal luster decreased by hydroxide or oxidation). Details were measured with reference to the methods described in the following references.

<References>

G. NISATO, P. C. P.BOUTEN, P. J. S. LIKKERVEER, etc. SID Conference Record of International Display Research Conference 1435-1438

[X-ray reflectance measurement (film density of inorganic layer)]

Using an evaluation sample prepared by forming an inorganic layer on a Si wafer, the measurement was carried out using an ATX-G manufactured by Rigaku Corporation. From the measurement results, the film density of the inorganic layer thin film was calculated.

[Example 2] Production and evaluation of gas barrier film (2)

A gas barrier film (Sample Nos. 201 to 208 (a)) was produced in the same manner as in Example 1, except that polyethylene terephthalate (PET, thickness 100 m, Toray Co., ).

[Example 3] Production and evaluation of organic EL device (1)

[1] Production of organic EL element substrate

A conductive glass substrate (surface resistance value 10? /?) Having an ITO film was washed with 2-propanol and then subjected to UV-ozone treatment for 10 minutes. The following organic compound layers were sequentially deposited on the substrate (anode) by vacuum deposition.

(First hole transporting layer)

Copper phthalocyanine: film thickness 10 nm

(Second hole transporting layer)

N, N'-diphenyl-N, N'-dinaphthylbenzidine: film thickness 40 nm

(Light emitting layer and electron transporting layer)

Tris (8-hydroxyquinolinato) aluminum: film thickness 60 nm

Finally, 1 nm lithium fluoride and 100 nm metal aluminum were sequentially deposited to form a negative electrode, and a silicon nitride film having a thickness of 3 탆 was deposited thereon by a parallel plate CVD method to produce an organic EL device.

[2] Installation of gas barrier layer on organic EL device

The barrier film prepared in Example 1 and the organic EL element substrate were attached so that the barrier layer was on the side of the organic EL element by using a thermosetting adhesive (Epotech 310, Daizo Nichimori Co., Ltd.) The adhesive was cured by heating at 65 DEG C for 3 hours. The thus-sealed organic EL devices (samples Nos. 301 to 315) were prepared for each 20 elements.

[3] Evaluation on the light emitting surface of the organic EL element (1)

Immediately after the production, the organic EL devices (samples Nos. 301 to 315) were irradiated with a voltage of 7 V by using a source major unit (SMU2400 type, manufactured by Keithley) to emit light. As a result of observing the light emitting surface using a microscope, it was confirmed that any element gave uniform light emission without dark spots.

Next, each device was allowed to stand in a dark room with a relative humidity of 90% at 60 DEG C for 24 hours, and then observed on the light emitting surface. The ratio of elements in which dark spots larger than 300 mu m in diameter are observed is defined as a failure rate, and the failure rate of each element is shown in Table 3. [

[Example 4] Production and evaluation of organic EL device (2)

(Sample Nos. 401 to 408) sealed using the gas barrier film prepared in Example 2 as a sealing film. In setting the gas barrier layer on the organic EL device, ultraviolet rays were irradiated in a glove box substituted with argon gas using an ultraviolet curing type adhesive (XNR5516HV, Nagaseichiba) instead of a thermosetting adhesive Followed by curing. The same procedure as in Example 3 was followed to evaluate the failure rate after each device was allowed to stand at 60 ° C and a relative humidity of 90% for 24 hours. The results are shown in Table 4.

[Example 5] Production of organic EL device using gas barrier film as a substrate (1)

The gas barrier film prepared in Example 1 was introduced into a vacuum chamber, and a transparent electrode made of ITO thin film having a thickness of 0.2 탆 was formed by DC magnetron sputtering using an ITO target. The gas barrier film having the ITO film was placed in a cleaning container, ultrasonically cleaned in 2-propanol, and subjected to UV-ozone treatment for 30 minutes. Using this substrate, organic EL devices (samples Nos. 501 to 508) were produced in the same manner as in Example 3. [ This device is flexible because both the substrate and the encapsulating film are mainly made of resin. The same procedure as in Example 3 was followed to evaluate the failure rate after each device was allowed to stand at 60 ° C and a relative humidity of 90% for 24 hours. The results are shown in Table 5.

From the results of Tables 3 to 5, it was found that the barrier film having the barrier resin layer of the present invention had a lower failure rate of the organic EL element than the barrier film having no barrier resin layer and was excellent. It was also found that the barrier film of the present invention is both effective as a sealing film or as a substrate of an organic EL device.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional gas barrier film and a gas barrier film of the present invention in the case of using the film as a sealing film of an organic EL device; FIG.

Claims (15)

A gas barrier layer having at least one organic region and at least one inorganic region on one surface of the base film, And the other surface of the base film has only a layer containing 80% by weight or more of a resin having barrier performance as a layer having barrier performance. A gas barrier layer having at least one organic layer and at least one inorganic layer on one surface of the base film, And the other surface of the base film has only a layer containing 80% by weight or more of a resin having barrier performance as a layer having barrier performance. 3. The method of claim 2, Wherein the resin of the layer containing 80% by weight or more of the resin having the barrier performance is polyvinyl alcohol. 3. The method of claim 2, Wherein the resin of the layer containing at least 80% by weight of the resin having the barrier performance is a polyfunctional acrylate. 3. The method of claim 2, Wherein the organic layer is formed by curing a composition containing at least one of (meth) acrylates having a bisphenol skeleton. 6. The method according to any one of claims 2 to 5, Wherein the main component of the organic layer is the same as the layer containing at least 80% by weight of the resin having the barrier performance. The method according to any one of claims 2, 4 and 5, Wherein all of the main component of the organic layer and the layer containing at least 80% by weight of the resin having the barrier performance is a (meth) acrylate derivative. 6. The method according to any one of claims 1 to 5, Wherein the thickness of the layer containing 80% by weight or more of the resin having barrier performance is 0.5 to 30 占 퐉. 6. The method according to any one of claims 1 to 5, Wherein the thickness of the gas barrier film is 10 to 300 占 퐉. 6. The method according to any one of claims 1 to 5, Gas barrier film for display element. 6. A method for producing a gas barrier film as set forth in any one of claims 1 to 5, Forming a gas barrier layer on a base film, and then forming a layer containing at least 80 wt% of a resin having barrier performance on the opposite side of the base film. A display device using the gas barrier film according to any one of claims 1 to 5. 13. The method of claim 12, Wherein the gas barrier film is used as a substrate of the display element. 13. The method of claim 12, Wherein the gas barrier film is used as a sealing film of the display element. 13. The method of claim 12, Wherein a layer containing 80% by weight or more of a resin having a barrier property of the gas barrier film is formed on the display element so as to be outside the display element.

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