KR101442672B1 - Spray nozzle system using mask and method for fabricating touch screen for the same - Google Patents

Abstract

The present invention relates to a spray nozzle system using a mask and a method of manufacturing a touch screen using the same, and a spray nozzle system using the mask of the present invention and a method of manufacturing a touch screen using the same, A spray nozzle for discharging ink; A substrate opposed to the spray nozzle and to which ink ejected from the spray nozzle is landed; A mask disposed between the spray nozzle and the substrate and having a penetrating portion formed on a path of the ink so that the ink ejected from the spray nozzle passes through the ink ejection portion and is deposited on the substrate; A voltage is applied to the spray nozzle so that the ink ejected from the spray nozzle includes an electric charge and an electric field is generated between the substrate and the spray nozzle by a voltage applied to the spray nozzle, And a voltage application unit that is secondarily atomized.
Thus, according to the present invention, there is provided a spray nozzle system using a mask capable of precisely depositing ink on a substrate by uniformly atomizing the ink to a fine size, and a method of manufacturing a touch screen using the spray nozzle system.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a spray nozzle system using a mask,

The present invention relates to a spray nozzle system using a mask and a method of manufacturing a touch screen using the same. More particularly, the present invention relates to a spray nozzle system using a mask capable of precisely depositing ink onto a substrate in a minute size, And a method of manufacturing a screen.

Coating processes are indispensable not only in traditional industries such as automobiles and construction but also in manufacturing processes for displays and solar cells. Recently, as the application of touch screen has expanded, anti-fingerprint coating or anti-reflection coating applied to the touch window surface of smart phone, tablet, Coating process using a non-wet process.

Here, among the typical spray thin film wet coating techniques, the gas assisted atomization method, the ultrasonic spraying method, and the electric spraying method are widely used, but each technique has both advantages and disadvantages at the same time.

First, the gas-assisted atomizer method is problematic in that it is difficult to form a precise thin film coating because the size of the atomized droplets is randomly generated in a range of 15 to 200 탆 to cause unevenness. In addition, when the gas is jetted at high speed for fine atomization, droplets having a strong flow velocity are strongly collided with the substrate to cause a problem of reflux of droplets. Furthermore, the amount of liquid consumed is large, which is due to an increase in production cost in view of the high cost of the liquid used in the thin film coating. Finally, the viscosity of the applicable liquid is limited to 50 cP, which appears to be a problem in that the range of usable liquid is reduced.

On the other hand, the ultrasonic spray method can generate droplets in a size ranging from 1 to 200 mu m, but the droplets are uneven in size. In addition, since a large amount of liquid can not be sprayed quickly, it is difficult to apply to a mass production process, and the time required for reaching the substrate from the nozzle is long, so that the process speed is low. Finally, there is a problem that the viscosity of the applicable liquid is limited, as in the gas assisted atomizer method.

On the other hand, the electrospray method is suitable for uniform thin film coating because it can produce fine and uniform droplets in the range of several hundred nm to 5 μm. However, since the electric spray must be sprayed by applying electric force to the liquid surface, the range of the solution capable of forming the spray is limited. The electrical conductivity of the liquid should be at least about 10 ^-4 S / m. Finally, the amount of liquid to be sprayed is so limited that it is difficult to apply it to a mass production process.

Furthermore, even if the above-described spray coating methods are used, a thin film can be formed on the entire surface of the substrate, but it is impossible to form a pattern having a specific shape on the substrate.

1 is a schematic view showing a conventional invention using an electric spray.

Referring to FIG. 1, a conventional invention using electrospray is a focus patterning method for a charged particle using a pattern-perforated mask of Korean Patent No. 10-0907787 and a mask used therefor, (3), a pattern structure (4), electrode layers (5, 6) and voltage application means (7, 8).

Here, when a voltage is applied to the film 2 through the voltage applying means 7 and 8, an electrical focusing lens is formed on the pattern side formed on the film 2 to induce focus patterning.

FIG. 2 is a diagram schematically showing electric field concentration when applying 3 kV to a nozzle and applying 0, 1, 2.9, and 4 kV to a mask, respectively, according to the prior art of FIG.

Referring to FIG. 2, a voltage applied to the conductive mask in a state where 3 kV is applied to the nozzle is 0, 1 kV, 2.9 kV, and 7 kV, respectively. FIG. 2 (c) shows that by increasing the voltage applied to the mask, a further improved focusing lens effect is obtained but severe interference with the electric field generated from the nozzles in the opposite direction occurs. If a voltage higher than the nozzle is applied to the mask as shown in FIG. 2 (d), there arises a problem that focusing on the film cavity is interrupted.

In addition, although not shown in FIG. 1, when a charged droplet is formed using a conventional electrospray method, a voltage should be applied to a nozzle for discharging a droplet. As shown in FIG. 2 (c) However, if the voltage difference between the nozzle and the mask is not large, there is a problem that the opposite interference effect occurs. To overcome this problem, a higher voltage must be applied to the nozzle. As a result, There is a problem that the effect of focusing is lowered.

Furthermore, there is a problem that the position of the mask is changed by the vibration or the like due to the pressure of the gas supplied to the nozzle in the process of discharging the droplet.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a spray nozzle system using a mask capable of precisely depositing ink on a substrate by atomizing ink to a fine size, and a method of manufacturing a touch screen using the spray nozzle system .

A spray nozzle system using a mask capable of performing stable patterning by fixing a position of a mask on a substrate, and a method of manufacturing a touch screen using the same.

According to the present invention, there is provided a spray nozzle comprising: a spray nozzle for discharging primarily atomized ink through collision with a gas; A substrate opposed to the spray nozzle and to which ink ejected from the spray nozzle is landed; A mask disposed between the spray nozzle and the substrate and having a penetrating portion formed on a path of the ink so that the ink ejected from the spray nozzle passes through the ink ejection portion and is deposited on the substrate; A voltage is applied to the spray nozzle so that the ink ejected from the spray nozzle includes an electric charge and an electric field is generated between the substrate and the spray nozzle by a voltage applied to the spray nozzle, And a second voltage application unit for atomizing the spray nozzle system.

Here, it is preferable that a voltage having the same polarity as a voltage applied to the spray nozzle is applied to the mask so that an electric field is concentrated inside the penetration portion.

The spray nozzle may further include: a liquid spraying unit for spraying the ink toward the substrate; And a gas injecting unit injecting a gas and colliding the gas with the ink on the movement path of the ink to primarily atomize the liquid.

Here, it is preferable that the gas collides perpendicularly with the movement path of the ink.

In addition, it is preferable to control the line width of a pattern printed on the substrate by adjusting the width of the penetration portion.

The apparatus may further include a nozzle transfer unit for moving the spray nozzle in a direction away from or close to the substrate or along a virtual plane parallel to the substrate.

In addition, it is preferable that the mask is made of a material having electrical insulation.

The mask may be made of an electrically conductive material, and an insulating layer may be interposed between the mask and the spray nozzle to block electrical connection between the mask and the spray nozzle.

The apparatus may further include a position adjuster for adjusting the position of the mask by applying an electric force or a magnetic force to the mask.

Here, it is preferable that the position adjuster is a magnet member provided under the substrate.

Preferably, the position adjuster is an electromagnetic induction device provided under the substrate.

Here, the plurality of spray nozzles face each other to discharge ink toward at least one of the one surface or the other surface of the substrate, and the mask may include at least one of the one surface or the other surface of the substrate corresponding to the spray nozzle for discharging the ink. It is preferable to be provided in any one of them.

In addition, it is preferable to control at least one of a voltage applied to the spray nozzle or an interval between the spray nozzle and the substrate to control the amount of electric charge contained in the ink discharged from the spray nozzle.

According to another aspect of the present invention, there is provided a mask preparation method comprising: preparing a mask using a spray nozzle system using the mask according to any one of claims 1 to 12, wherein the mask is patterned in a predetermined pattern; The mask being provided between the substrate and the spray nozzle; A patterning step of patterning the substrate by spraying ink from the spray nozzle; A mask removing step of removing the mask from the substrate; And a curing step of curing the patterned ink on the substrate. The present invention also provides a method of manufacturing a touch screen using a spray nozzle system using a mask.

Here, the mask preparation step may be performed through a roll-to-roll process.

In addition, it is preferable that the mask is formed of a DFR (dry film resist) layer, and the penetration portion is formed by a lithography process.

Here, the predetermined pattern in the mask preparation step may include a first electrode pattern in which a plurality of electrodes are arranged along a first direction; And a connection pattern connecting the electrode patterns.

The predetermined pattern may include a plurality of second electrode patterns arranged in a second direction perpendicular to the first direction.

According to the present invention, there is provided a spray nozzle system using a mask capable of atomizing ejected ink into a minute size and landing on a substrate, and a method of manufacturing a touch screen using the spray nozzle system.

In addition, there is no limit to the range of usable liquid, and the spray amount can be improved so as to be applicable to mass production.

In addition, the electric field can be concentrated on the substrate by using the mask, so that the ink can be focused on a predetermined region of the substrate on which the pattern is to be formed.

Further, by controlling the voltage applied to the spray nozzle, it is possible to control the charge contained in the ink discharged from the spray nozzle, so that a separate charge control device is unnecessary.

In addition, by providing the mask with a nonconductive material or by forming an insulating layer between the conductive mask and the spray nozzle, an electric field focusing effect similar to that of initially applying charges to the conductive mask by accumulating charges on top of the mask or insulating layer Can be obtained.

Further, even if a high voltage is not applied to the nozzle or the mask, the effect of concentrating the electric field inside the penetration portion can be expected.

In addition, the effect of concentrating the electric field inside the penetrating portion can be expected even if there is little difference in voltage applied to the mask compared to the voltage applied to the nozzle, or even when the magnitude of the voltage applied to the mask is large

Further, by adjusting the position of the mask through the position adjustment unit, the position of the mask is changed by ink jetting or other factors, thereby preventing the ink from being patterned into an undesired area by the user.

FIG. 1 is a view schematically showing a conventional invention using an electric spray, and FIG.
FIG. 2 is a view schematically showing the electric field concentration when applying 3 kV to the nozzle and applying 0, 1, 2.9, and 7 kV to the mask, respectively,
3 is a perspective view schematically showing a spray nozzle system using a mask according to a first embodiment of the present invention,
FIG. 4 is a front view schematically showing a spray nozzle system using the mask according to FIG. 3,
5 is a view schematically showing the electric field concentration when 3 kV is applied to a nozzle using a spray nozzle system using the mask shown in FIG. 3, and 0, 1, 2.9, and 7 kV are respectively applied to the mask,
FIG. 6 is a photograph of a printed substrate using a spray nozzle system using the mask according to FIG. 3,
7 is a perspective view schematically showing a spray nozzle system using a mask according to a second embodiment of the present invention,
8 is a flowchart illustrating a method of manufacturing a touch screen using a spray nozzle system using a mask according to a third embodiment of the present invention,
9 is a perspective view schematically showing a spray nozzle system using a mask used in a method of manufacturing a touch screen using a spray nozzle system using a mask according to a third embodiment of the present invention,
10 is a front view schematically showing a spray nozzle system using the mask of FIG.

Prior to the description, components having the same configuration are denoted by the same reference numerals as those in the first embodiment. In other embodiments, configurations different from those of the first embodiment will be described do.

Hereinafter, a spray nozzle system 100 using a mask according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a perspective view schematically showing a spray nozzle system using a mask according to the first embodiment of the present invention, and FIG. 4 is a front view schematically showing a spray nozzle system using the mask according to FIG.

Referring to FIG. 3 or 4, the spray nozzle system 100 according to the first embodiment of the present invention can finely and uniformly atomize ink through collision with a gas and an electric field, and improve the electric field concentration using a mask A mask 130, a voltage applying unit 140, a nozzle transferring unit 150, and a position adjusting unit 160. The spraying nozzle 110 and the substrate transferring unit 150 are provided with a spray nozzle 110, a substrate 120, a mask 130,

The spray nozzle 110 collides the ejected ink with a gas to cause the ink to be primarily atomized, and an electric field is first applied to the liquid surface of the atomized liquid so that the atomized ink is secondarily atomized, And includes a case 111, a liquid jetting unit 112, and a gas jetting unit 113. [

The case 111 accommodates the liquid spraying unit 112 and the gas spraying unit 113 therein so that collision between the liquid and the gas is generated in the case 111. [

That is, when the ink is ejected to the outside of the case 111, the ink is already in a primary atomized state, and secondary atomization occurs due to the electric field applied to the liquid surface of the ink outside the case 110

On the other hand, in the case 111, a gas jetted from the gas jetting unit 120 flows, and a gas flow path for guiding the gas to collide with the jetting path of the ink perpendicularly is formed.

Here, collision between the gas and the ink is a very important factor for the primary atomization of the ink, and the gas collides with the injection path of the ink in a perpendicular direction, so that the ink can be stably atomized.

That is, when the gas does not form a perpendicular to the jetting path of the ink and collides with the ink, the gas can affect the ejecting direction of the ink or the direction opposite to the ejecting direction of the ink, In this case, reflow phenomenon may occur in which the atomized ink collides with the substrate (S) at too high speed and bounces again, and when the force is applied in the direction opposite to the ink ejection direction due to the collision, It may adversely affect the injection speed or the injection flow rate of the ink.

Therefore, it is preferable that the gas collides perpendicularly with the injection path of the ink to prevent such a problem, but this problem can be solved by adjusting the jetting speed of the ink, so that it is not limited thereto.

The liquid injector 112 injects ink toward the substrate as a passage through which ink flows.

The gas injecting portion 113 is a gas injecting portion and the gas injected from the gas injecting portion 113 flows along the gas flow path formed inside the case 111 to form a perpendicular to the injection path of the ink, Is the same as that described in the case 111. Fig.

Since the substrate 120 is a well-known technique in which ink ejected from the spray nozzle 110 is landed, a detailed description will be omitted here.

The substrate 120 may be grounded to increase the potential difference between the substrate 120 and the spray nozzle 110 applied with the voltage by the voltage application unit 140, but the present invention is not limited thereto.

The mask 130 is provided between the substrate 120 and the spray nozzle 110 to concentrate the electric field formed between the spray nozzle 110 and the substrate 120 toward the penetration part 131 formed in the mask 130 Thereby improving the accuracy of landing of the ink discharged from the spray nozzle 110.

That is, in the mask 130, a penetration portion 131 is formed on the movement path of the ink so that the ink reaches the substrate 120. Here, the shape of the penetration portion 131 may be formed to correspond to the print path on the substrate 120, or may be formed in only a part of the region and may be transferred at the same time as the transfer of the substrate 120 or the spray nozzle 110 But is not limited thereto.

In the spray nozzle system 100 according to the first embodiment of the present invention, the through-holes 131 are formed in a plurality of lines spaced apart from each other, but not limited thereto, It is natural that it can be changed.

That is, since the ink that has passed through the penetrating portion 131 is landed on the substrate, a pattern to be printed on the substrate 110 is determined according to the shape of the penetrating portion 131, and the shape of the penetrating portion 131 is adjusted, The width of the pattern formed on the substrate 110 can be adjusted by adjusting the width of the pattern.

The mask 130 is preferably applied with a voltage of the same polarity as the voltage applied to the spray nozzle 110 so that an electric field is concentrated inside the penetration part 131, but the present invention is not limited thereto.

The mask 130 may be formed of a nonconductive material to generate a repulsive force through the charge accumulated on the mask 130 to enhance the electric field focusing of the penetration portion 131, The insulating layer 132 may be provided between the spray nozzles 110 to prevent irregular atomization of the ink due to the interference of the electric field between the mask 130 and the spray nozzle 110. However,

Here, when the insulating layer 132 is formed on the mask 130, the insulating layer 132 may be formed of a material such as polymide or polytetrafluoroethylene (PTFE) Ridges, SiO2 oxides, and the like, but is not limited thereto.

The voltage application unit 140 applies a voltage to the spray nozzle 110 so that the ink discharged from the spray nozzle 110 contains charge and the voltage applied to the spray nozzle 110 by the voltage applied to the spray nozzle 110. [ An electric field is generated between the substrates 120 to secondarily atomize the ink ejected from the spray nozzle 110.

That is, the ink is discharged toward the substrate 120 through the spray nozzle 110 applied with the voltage from the voltage application unit 140, and the voltage of the same polarity as the charge of the ink is applied to the mask 120 The ink is concentrated and adhered to the inside of the through portion 131. [

An electric field is formed between the spray nozzle 110 and the substrate 120 by the voltage applied to the spray nozzle 110 so that the ink that is primarily atomized by the collision with the gas is re- And is finely atomized into droplets uniform in size and finer in size.

The nozzle transfer unit 150 is connected to the spray nozzle 110 to move the spray nozzle 110 along a virtual plane parallel or substantially parallel to the substrate 120 in a direction away from or close to the substrate 120.

Here, the distance between the spray nozzle 110 and the substrate 120 may be adjusted to control the amount of charge contained in the ink.

If the area of the substrate 120 is sufficiently small, the ink discharged from the spray nozzle 110 may land on the substrate 120 even when the spray nozzle 110 is fixed, Additional movement of the substrate 120 or the spray nozzle 110 is required when the ejection area of the ink ejected from the spray nozzle 110 is sufficiently wider than the ejection area of the ink.

Here, further movement of the substrate 120 in a direction perpendicular to the transport direction is required, which can be achieved by the nozzle transport unit 150. Of course, the nozzle 120 is not limited to the direction perpendicular to the conveying direction of the substrate 120, and it is natural that the nozzle 110 can move in the conveying direction of the substrate 120 by the nozzle conveying unit 150.

The position adjusting unit 160 is provided under the substrate 120 and adjusts the position of the mask 130 by applying an electric force or a magnetic force to the mask 130. Since the position of the mask 130 may be changed by the gas ejected from the gas ejecting unit 113 to primarily atomize the ink, the mask 130 may be fixed to prevent the position change due to the gas ejection, It is necessary to adjust the position of the mask 130 through the position adjusting unit 160 or change the position of the mask 130 from the changed position to the original position.

In the spray nozzle system 100 according to the first embodiment of the present invention, the position adjusting unit 160 is provided with a magnet member or an electromagnetic induction device for generating an electromagnetic induction reaction, but the present invention is not limited thereto.

Hereinafter, the operation of the first embodiment of the above-described spray nozzle system will be described.

First, the operation of the spray nozzle 110 in the spray nozzle system 100 using the mask according to the first embodiment of the present invention will be described.

The ink flowing in the liquid jetting section 112 is jetted toward the substrate 120.

The ink ejected toward the substrate S collides with the gas injected through the gas injecting section 113 inside the case 111, and primary atomization occurs due to collision with the gas. The liquid surface of the ink becomes unstable due to collision with the gas, and even if the property of the ink material is nonpolar or the electric conductivity is extremely low due to the instability of the liquid surface, the secondary atomization by the electric field is actively generated, Will be described later.

Here, it is preferable, but not limited, that the gas collides with the ink forming path perpendicular to the injection path of the ink to prevent the ink from being impacted by the impact with the gas.

The ink is primarily atomized by the collision with the gas and the unstabilized ink is secondarily atomized by the electric field generated between the spray nozzle 110 and the substrate 120. The liquid flow rate that can be atomized can be significantly increased as compared with the case where the liquid is atomized by using only the electric field because the liquid is primarily atomized by the collision with the gas.

When the ink is ejected using such a method, it is possible to increase both the ink spray amount, which is an advantage of the gas assisted atomizer, and the generation of a fine and uniform droplet, which is an advantage of electrospray. In addition, it is possible to guide the movement path of droplets secondarily atomized by the electric field between the spray nozzle 110 and the substrate 120, thereby solving the problem of reflux of droplets or increase in ink consumption. Furthermore, since the process of changing the liquid level on the nozzle to Taylor-Cone is not a process of making a spray at the end, the ink or non-conductive material made of a material having a low electric conductivity may be secondarily atomized This principle is as follows.

The force applied in the electric spray using electric energy is as follows.

Here, ρ _e means free electrons in the liquid surface, ε is the permittivity of the liquid surface, ε ₀ is the permittivity in vacuum, and E is the electric field.

In the case of an ink having a dielectic property, the following two forces act in the above equation, and in the case of a non-polar liquid, the electric force according to the second term in the above equation acts. This is called dielectrophoretic force. At this time, there is only an electric force acting in the vertical direction of the liquid surface, and no electric force acts on the surface in contact with the liquid surface, so that a cone-shaped liquid surface called a taylor-cone is not formed, .

However, as in the spray nozzle 110 according to the first embodiment of the present invention, when the droplet is primarily atomized by inducing collision with the gas, secondary pulverization may occur even though the dielectrophoretic force is weak have.

Accordingly, atomization of the liquid can be easily induced without distinguishing the polarity and the non-polarity from the non-conductive material by utilizing the spray nozzle 110 according to the first embodiment of the present invention.

It is also possible to adjust the distance between the spray nozzle 110 and the substrate 120 through the nozzle transfer unit 150 or adjust the voltage applied to the spray nozzle 110 through the voltage application unit 140, It is possible to easily adjust the amount of charge contained in the ink without adding it.

The operation of the spray nozzle system 100 using the mask using the spray nozzle 110 will be described.

The ink that is secondarily atomized by the spray nozzle 110 moves toward the substrate 120 side in a state including the charge of either positive polarity (+) or negative polarity (-).

Here, the mask 130 receives a voltage from the voltage applying unit 140 so as to have the same polarity as that of the ink contained in the ink. Since the polarity of the mask 130 and the polarity of the ink are the same, Thereby preventing the light beam from landing.

That is, a voltage having the same polarity as that of the electric charge contained in the ink is applied to the mask 130, thereby guiding the ink to be concentrated and landed on the penetration portion 131 side of the mask 130.

When the voltage applied to the mask is larger than the voltage applied to the nozzle when the voltage is applied to the mask through the conventional method, the electric field due to the voltage applied to the mask is applied to the electric field by the voltage applied to the nozzle A large voltage of 7 to 10 kV or more must be applied to the nozzle, and a voltage of 3 to 6 kV or more must be applied to the mask. In this condition, an optimum field concentration effect is obtained within this condition . That is, a voltage difference of at least 4 kV must be maintained between the nozzle and the mask to stably generate electric spray.

 However, according to the spray nozzle system 100 using the mask according to the first embodiment of the present invention, the width of the voltage difference between the nozzle and the mask is largely eliminated as in the conventional invention, Even if the voltage applied to the spray nozzle 110 is larger than the voltage applied to the spray nozzle 110, the convergence of the electric field occurs to the penetration portion 131 side.

5 is a view schematically showing the electric field concentration when 3 kV is applied to a nozzle using a spray nozzle system using the mask shown in FIG. 3, and 0, 1, 2.9, and 7 kV are respectively applied to the mask.

5 (a), (b), and (c) show the case where a voltage of 3 kV is applied to the spray nozzle 110 and the upper part of the mask 130 is insulated by the insulator 132, (d) show the case where voltages are applied to the mask 130 at 0, 1, 2.9, and 4 kV, respectively. Compared with the electric field in Fig. 2, the case in Fig. 5 shows that the electric field is concentrated inside the penetrating portion 131 as compared with the case in Fig.

Here, the mask 130 may have an effect of concentrating the electric field inside the penetration part 131 even when the insulation layer 132 is formed on the upper part or the non-conductive material is not applied to the mask 130 .

5D, even if the voltage applied to the mask 130 is larger than the voltage applied to the spray nozzle 110, the voltage applied to the mask 130 is greatly affected by the voltage applied to the mask 130, The influence of the voltage applied to the mask 130 is not greatly affected.

That is, in the spray nozzle system 100 using the mask according to the first embodiment of the present invention, even when a voltage of 3 kV or less is applied to the spray nozzle 110 and a voltage applied to the mask 130 is 0.1 to 2.9 kV The effect of concentrating the electric field inside the penetration part 131 can be obtained. Furthermore, even when the voltage applied to the mask is 7 kV, the concentration effect of the electric field can be obtained.

6 is a photograph of a printed substrate using a spray nozzle system using the mask according to FIG.

Referring to FIG. 6, the spray nozzle system 100 using the mask according to the first embodiment of the present invention is used, and the width of the penetration part 131 is 1 mm.

6A, the line width of the pattern formed on the substrate 120 when the voltage is not applied to the mask 130 is formed to have a line width of approximately 1 mm similar to the width of the penetration portion 131. [ Referring to FIG. 6 (b), the line width of the pattern is approximately 20 μm with the voltage applied to the mask 130.

Furthermore, as the voltage applied to the mask 130 increases, the line width of the pattern decreases and the voltage applied to the mask 130 is adjusted to form a pattern having a desired width. have.

Referring to FIG. 6 (c), a structure having a high aspect ratio can be formed by repeatedly landing ink while maintaining the same magnitude of voltage applied to the mask 130.

In addition, even when the mask 130 is formed of a nonconductive material without forming the insulating layer 132 on the mask 130, a nonconductive mask 130 is formed between the spray nozzle 110 and the substrate 120 The electric field is concentrated in a region smaller than the penetration portion 131 formed in the mask 130. [

The spray coating system 100 using the mask according to the first embodiment of the present invention can be utilized in various fields. A coating system in which an ink including a dye, an organic particle, an inorganic particle and the like is coated on an arbitrary surface can be utilized. In particular, it can be utilized for coating or patterning metal particles such as gold, silver, copper, aluminum, and nickel.

In addition, it can be used for coating or patterning an oxide such as TiO ₂ . For example, thin film patterning of active materials in dye-sensitized solar cells, thin film patterning of oxide materials such as TiO ₂ in organic solar cells, patterning of conductive materials such as PEDOT: PSS, patterning of active thin films such as P3HT, Various materials such as ITO (Indium Tin Oxide) ink, Ag nanowire, carbon nanotube, graphene solution and conductive polymer material in the transparent electrode field are coated on the conductive substrate or PET, PI , A non-conductive film substrate such as a PC or a PEN, a glass substrate, a silicon wafer, or the like, but the present invention is not limited thereto.

Next, a spray nozzle system using a mask according to a second embodiment of the present invention will be described.

Referring to FIG. 7, the spray nozzle system 200 using the mask according to the second embodiment of the present invention can finely and uniformly atomize ink through collision with the gas and electric field, and improve the electric field concentration using the mask The mask 130, the voltage application unit 140, and the nozzle transfer unit 150, which are capable of simultaneously printing both sides of the substrate 120. The spraying nozzle 110, the substrate 120, And a position adjusting unit 160.

The spray nozzles 110 are provided on the surfaces facing each other with the substrate 120 interposed therebetween so as to be capable of simultaneously discharging ink toward both sides of the substrate 120. The spray nozzles 110 always discharge the ink toward both sides of the substrate 120 But discharges the ink toward at least one of both surfaces of the substrate 120. [

That is, in the spray nozzle system 200 using the mask according to the second embodiment of the present invention, when there is a need to form a pattern on both sides of the substrate 120, A spray nozzle 110 may be provided on the substrate 120 so that both surfaces of the substrate 120 can be simultaneously patterned to improve the process speed.

Here, the through-hole 131 of the mask 130 may be formed in the same shape on both sides of the substrate 120, and may be provided on the both sides of the substrate 120 in different shapes.

The voltage applied to the spray nozzle 110 or the mask 130 through the voltage applying unit 140 may be set such that the spray nozzle 110 or the mask 130 is positioned on either the upper or lower side of the substrate 120 It is necessary to vary the size depending on whether or not it is deployed.

That is, the spray nozzle 110 disposed on the substrate 120 needs to be applied with a voltage smaller than the voltage applied to the spray nozzle 110 disposed under the substrate 120, The voltage applied to the mask 130 disposed on the lower portion of the substrate 120 needs to be higher than the voltage applied to the mask 130 disposed on the lower portion of the substrate 120, Will be. However, the present invention is not limited to this, and it is not necessary to set the magnitude of the voltage differently depending on whether or not the ink that has been atomized in the secondary is sufficiently disposed on the upper and lower sides of the substrate 120 if it is sufficiently small to neglect the influence of gravity.

The operation of the second embodiment of the spray nozzle system using the above-described mask is the same as that described in the spray nozzle system using the mask according to the first embodiment, and a detailed description thereof will be omitted here.

Next, a method of manufacturing a touch screen (S100) using a spray nozzle system using a mask according to a third embodiment of the present invention will be described.

9 is a perspective view schematically showing a spray nozzle system using a mask used in a method of manufacturing a touch screen using a spray nozzle system using a mask according to a third embodiment of the present invention.

Referring to FIG. 9, before describing a method (S100) for manufacturing a touch screen using a spray nozzle system using a mask according to a third embodiment of the present invention, a spray nozzle system using a mask Explain.

The spray nozzle system using the mask used in the method of manufacturing the touch screen (S100) using the spray nozzle system using the mask according to the third embodiment of the present invention is similar to the spray nozzle system using the mask described in the first embodiment of the present invention (100). ≪ / RTI >

However, the shape of the penetration portion 131 of the mask 130 is different from that of the first embodiment, wherein the penetration portion 131 includes a plurality of first electrodes 135 spaced apart from each other in the first direction, A pattern 136 is formed.

That is, the first electrodes 135 are provided in a plurality spaced apart from each other along the first line 134 formed along the first direction, and are formed in a rhombic shape, but the present invention is not limited thereto.

In addition, a plurality of lines spaced apart in parallel to the first line 134 are formed, and the first electrodes 135 are also formed on these lines.

Meanwhile, the connection pattern 136 is formed between the first electrodes 135 and connects the first electrodes 135 to each other, but is not limited thereto.

A through hole 131 is formed in each line so that the first electrode 135 and the connection pattern 136 are formed at the same time so that the electrodes of the touch screen panel and the connection pattern 131 are formed by the ink discharged from the spray nozzle 110. [ .

Furthermore, second electrodes (not shown) spaced from each other along a second direction perpendicular to the first direction may be formed simultaneously with the first electrode 135 and the first connection pattern 136, It is not.

8 is a flowchart illustrating a method of manufacturing a touch screen using a spray nozzle system using a mask according to a third embodiment of the present invention.

Referring to FIG. 8, a method of manufacturing a touch screen (S100) using a spray nozzle system using a mask according to a third embodiment of the present invention is to manufacture a touch screen using a spray nozzle system using the mask, A mask preparation step S110, a patterning preparation step S120, a patterning step S130, a mask removal step S140, and a curing step S150.

The mask preparation step S110 is a step of patterning the penetration part 131 in the mask 130 into a predetermined pattern shape. In the third embodiment of the present invention, since the method of manufacturing the touch screen panel, the through-hole 131 is patterned in a shape in which the first electrode 135 and the connection pattern 136 are integrally formed as described above.

In the method of manufacturing a touch screen (S100) using a spray nozzle system using a mask according to the third embodiment of the present invention, the mask preparation step (S110) may be performed through a roll-to-roll process, but is not limited thereto.

The patterning preparation step (S120) is a step of providing a mask 130 between the substrate 120 and the spray nozzle 110.

Here, the mask 130 is formed of a dry film resist (DFR), and the penetration portion 131 can be formed by a lithography process, but is not limited thereto.

The patterning step S 130 is a step of spraying ink from the spray nozzle 110 to print a pattern similar to the shape of the penetration part 131 on the substrate 120. Since this step is the same as that described in the spray nozzle system using the mask according to the first embodiment, detailed description thereof will be omitted here.

The mask removing step S140 is a step of removing unnecessary masks 130 from the substrate 110 after printing a desired pattern on the substrate 110. [ Since the method of removing the mask 130 from the substrate 110 is a well-known technique, a detailed description thereof will be omitted here.

The curing step 150 is a step of curing the patterned ink on the substrate 110. But can be cured using heat or cured using ultraviolet rays.

10 is a front view schematically showing a spray nozzle system using the mask of FIG.

Referring to FIG. 10, it can be seen that the shape of the touch screen panel is clearly manufactured by the method of manufacturing the touch screen (S100) using the spray nozzle system using the mask according to the third embodiment of the present invention.

Meanwhile, the electrode pattern and the connection pattern may be simultaneously patterned on both sides of the substrate 120 as described in the second embodiment of the present invention, but the present invention is not limited thereto.

The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

1: Spray coating apparatus using conventional electrospray
2: Film 3: Substrate
4: pattern structure 5, 6: electrode layer
7, 8: voltage applying means
100: Spray nozzle system with mask
110: Spray nozzle 120:
130: mask 140:
150: nozzle feed part 160:
S100: Manufacture of touch screen using spray nozzle system using mask
S110: Mask preparation step S120: Patterning preparation step
S130: patterning step S140: mask removing step
S150: Curing step

Claims (18)

A spray nozzle that primarily discharges atomized ink through collision with a gas;
A substrate opposed to the spray nozzle and to which ink ejected from the spray nozzle is landed;
A mask disposed between the spray nozzle and the substrate and having a penetrating portion formed on a path of the ink so that the ink ejected from the spray nozzle passes through the ink ejection portion and is deposited on the substrate;
A voltage is applied to the spray nozzle so that the ink ejected from the spray nozzle includes an electric charge and an electric field is generated between the substrate and the spray nozzle by a voltage applied to the spray nozzle, And a second voltage application unit for atomizing the spray nozzle system. The method according to claim 1,
Wherein the mask is applied with a voltage of the same polarity as the voltage applied to the spray nozzle so that an electric field is concentrated inside the penetration portion. The method according to claim 1,
Wherein the spray nozzle comprises: a liquid spraying part for spraying ink toward the substrate; And a gas ejecting part for ejecting a gas and colliding the gas with the ink on the movement path of the ink to primarily atomize the liquid. The method of claim 3,
Wherein the gas is vertically collided with the movement path of the ink. The method according to claim 1,
And controlling a line width of a pattern printed on the substrate by adjusting a width of the penetration portion. The method according to claim 1,
Further comprising a nozzle transfer unit for moving the spray nozzle in a direction away from or close to the substrate or along a virtual plane parallel to the substrate. The method according to claim 1,
Wherein the mask is made of a material having electrical insulation. The method according to claim 1,
The mask is made of a material having electrical conductivity,
Further comprising an insulating layer interposed between the mask and the spray nozzle to block electrical connection between the mask and the spray nozzle. 9. The method of claim 8,
Further comprising a position adjuster capable of adjusting a position of the mask by applying an electric force or a magnetic force to the mask. 10. The method of claim 9,
Wherein the position adjustment unit is a magnet member provided at a lower portion of the substrate. 10. The method of claim 9,
Wherein the position adjuster is an electromagnetic induction device provided at a lower portion of the substrate. The method according to claim 1,
Wherein the plurality of spray nozzles face each other to discharge ink toward at least one of the one surface or the other surface of the substrate,
Wherein the mask is provided on at least one of a surface of the substrate and a surface of the substrate corresponding to a spray nozzle for discharging the ink. 13. The method according to any one of claims 1 to 12,
Wherein the controller controls at least one of a voltage applied to the spray nozzle and an interval between the spray nozzle and the substrate to control the amount of charge contained in ink discharged from the spray nozzle. A spray nozzle system using the mask according to any one of claims 1 to 12,
A mask preparation step of patterning the penetration part in the mask in a predetermined pattern;
The mask being provided between the substrate and the spray nozzle;
A patterning step of patterning the substrate by spraying ink from the spray nozzle;
A mask removing step of removing the mask from the substrate;
And a curing step of curing the patterned ink on the substrate. ≪ RTI ID = 0.0 > 21. < / RTI > 15. The method of claim 14,
Wherein the mask preparation step is performed through a roll-to-roll process. 16. The method of claim 15,
The mask is formed of a dry film resist (DFR)
Wherein the through-hole is formed by a lithography process. 15. The method of claim 14,
The predetermined pattern in the mask preparation step may include a first electrode pattern in which a plurality of first patterns are arranged along a first direction; And a connection pattern for connecting the electrode pattern to the electrode pattern. 18. The method of claim 17,
Wherein the predetermined pattern includes a plurality of second electrode patterns arranged in a second direction perpendicular to the first direction.

Images