KR101448686B1 - Gasket used in pipe line of semiconductor device manufacturing equipment - Google Patents

Abstract

The present invention relates to a gasket used for pipelines in semiconductor manufacturing facilities. More specifically, a plurality of penetrating holes is formed to face each other in a spiral centering a central point such that liquid or gas which passes through the holes rotates in a spiral. According to an embodiment of the present invention, the gasket effectively provides chemical into a reaction chamber by sealing and increasing hydraulic pressure, and purges chemical residues inside the pipelines or the reaction chamber. In addition, the gasket keeps the amount of fluid passing through the penetrating holes such that pipelines and the reaction chamber are purged in balance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a gasket used in piping of a semiconductor manufacturing facility,

The present invention relates to a gasket for use in a piping of a semiconductor manufacturing facility, and more particularly, to a gasket having a plurality of through holes formed in a spiral shape at symmetrical positions with respect to the center, whereby a liquid or gas passing through the through- To a gasket for use in a piping of a semiconductor manufacturing facility.

Generally, a semiconductor manufacturing process can be divided into a preparation step for manufacturing a wafer and a circuit design, a pre-process for processing a wafer, and a post-process for assembling and inspecting the wafer.

Particularly, the entire process includes various processes such as a thin film deposition process, an etching process, a diffusion process, and a cleaning process. Semiconductor manufacturing facilities such as chemical vapor deposition (CVD) and etching equipment are used for these processes.

The semiconductor manufacturing facility generally comprises an external supply device for storing various chemicals required for performing each process and a pipe and piping connection part for receiving the medicine from the external supply device. A purging device for removing chemical scum or the like is installed.

Korean Patent No. 10-1220436 (Prior Art 1) and Korean Patent Laid-Open No. 10-2005-0111681 (Prior Art 2) are disclosed in the related art.

1 is an exploded perspective view showing a connection structure of a pipe for a semiconductor process according to the prior art 1;

1, the connection structure of the pipe for semiconductor process according to the related art 1 includes a first connection pipe 110, a second connection pipe 120, a first connection pipe 110 and a second connection pipe 120, A screw 140 to be brought into close contact with an adjacent surface of the first connection pipe 110 and the second connection pipe 120 to the gasket 130 and a slip Ring 150 as shown in FIG.

The first connection pipe 110 is formed with an annular recess 112 at the center of its adjacent surface and a second connection pipe 120 is formed with a protrusion (not shown) corresponding to the recess 112 in the adjacent surface. And the gasket 130 has a recessed groove 112 on both sides thereof and a second protrusion 132 and a second recess 134 corresponding to the protrusion.

In the prior art 1, the inner diameter of the gasket 130, the inner diameter of the first connection pipe 110 and the inner diameter of the second connection pipe 120 are adopted to minimize occurrence of dead space and correspond to the depression grooves 112 and protrusions The second projecting portion 132 and the second recessed groove 134 are formed to effectively seal the connection portion.

However, according to the prior art 1, it is possible to maximize the sealing between the piping connection portions by the gasket 130, but the hydraulic pressure at the time of purging is lowered, so that the reaction chamber can not be effectively cleaned.

Fig. 2 is a diagram showing a purge gas supply circuit diagram of a semiconductor manufacturing facility according to Prior Art 2. Fig.

2, the purge flow apparatus of the semiconductor manufacturing facility according to the prior art 2 includes an MFC 220 for controlling a gas supply flow rate on a purge gas line 240, a valve 230 for opening and closing the gas line 240 A high pressure generating part 250 installed on the high pressure gas line 260 to enable the supply of the purge gas to be performed at a high pressure and a high pressure generating part 250 installed on the high pressure gas line 260 to selectively open and close the purge gas line 240 and the high pressure gas line 260 A reaction chamber 210 in which each process is performed, and a filter 290 on the exhaust line 280. The three-

The conventional art 2 can provide the purge gas line 240 and the high-pressure generating unit 250 on the separate high-pressure gas line 260 to achieve rapid purging, thereby effectively cleaning the reaction chamber 210. However, There is a problem that the process cost increases due to the provision of the generating unit 250. [

KR 10-1220436 B1 KR 10-2005-0111681 A

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing a semiconductor device, which comprises a step of forming a plurality of through holes at positions symmetrical with respect to a center, And a gasket for use in a piping of a semiconductor manufacturing facility capable of effectively supplying a chemical into a reaction chamber by increasing a hydraulic pressure while achieving a sealing effect.

Further, the through hole is formed in a spiral shape so that the liquid or gas passing through the through hole can be spirally rotated, thereby effectively purging the chemical residue existing in the pipe and the reaction chamber. Gasket.

The present invention also provides a gasket capable of balancing the piping and the reaction chamber in a balanced manner by making the flow rate of each through hole constant.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method comprising the steps of: interposing between a connection member (300) of a pipe for supplying a chemical used for manufacturing a semiconductor device to prevent leakage of the chemical, A plurality of through holes 332 penetrating from the upper surface to the lower surface are formed at symmetrical positions with respect to the center, and the through holes 332 are formed in the upper surface of the gasket 330, The liquid or gas passing through the through hole 332 is spirally rotated as it passes through the through hole 332. The liquid or gas passing through the through hole 332 rotates in a spiral manner.

The plurality of through holes 332 may be formed of two to eight.

The plurality of through holes 332 include central through holes 332c-2 and 332d-2 in the form of a circular or propeller.

The gasket 330 may be made of any one of stainless steel (SUS), zinc, copper, and nickel.

According to the present invention, there is an effect that the sealing effect can be obtained and at the same time, the chemical pressure can be effectively supplied to the reaction chamber by increasing the hydraulic pressure.

In addition, there is an effect that the chemical residue existing in the pipe and the reaction chamber can be effectively purged.

Further, the flow rate of each through hole is made constant, and the piping and the reaction chamber can be purged in a balanced manner.

1 is an exploded perspective view showing a connection structure of a pipe for a semiconductor process according to the prior art 1. Fig.
Fig. 2 is a circuit diagram of a purge gas supply circuit of a semiconductor manufacturing facility according to Prior Art 2. Fig.
3 is an exploded perspective view of a piping connecting member of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied.
4 is a sectional view of a piping connection portion of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied;
Figures 5A-5D illustrate various embodiments of gaskets according to the present invention.
FIG. 6 is a view illustrating an operation state of a piping connection portion of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied. FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a gasket (hereinafter referred to as "gasket") used in piping of a semiconductor manufacturing facility according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

Generally, semiconductor manufacturing processes require various chemicals for processing wafers. These chemicals are stored in the chemical storage tank and fed into the reaction chamber through the connecting piping. After the completion of each step, a purge gas such as nitrogen or argon is supplied to the inside of the connection pipe through a gas line connected to one side of the pipe connection part for supplying the chemical agent to remove the chemical wastes remaining in the reaction chamber .

The gasket is interposed between the reaction chamber and the pipe connection member provided between the reaction chamber and the chemical storage tank, and plays an important role in sealing between the connection members.

FIG. 3 is an exploded perspective view of a piping connecting member of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied, and FIG. 4 is a sectional view of a piping connecting portion of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied.

3 and 4, a piping connecting member 300 of a semiconductor manufacturing facility to which a gasket 330 according to an embodiment of the present invention is applied includes a first connecting part 310, a second connecting part 320, A gasket 330 interposed between the first connection part 310 and the second connection part 320 and a bolt 350 and a Pam nut 330 for closely connecting and linking the first connection part 310 and the second connection part 320. [ have.

Here, the first connection unit 310 is linked to a reaction chamber (not shown) in which a semiconductor manufacturing process is substantially performed, and the second connection unit 320 is connected to a chemical storage tank (not shown) do. On the other hand, a purge gas pipe for cleaning the inside of the reaction chamber may be connected between the second connection part and the chemical supply storage tank when the process is completed in the reaction chamber.

Accordingly, the chemical or purge gas, that is, the liquid or the gas, can be selectively moved into the pipe connecting member of the semiconductor manufacturing facility to which the gasket according to the embodiment of the present invention is applied.

The gasket 330 interposed between the first connection part 310 and the second connection part 320 serves as a seal for preventing the chemical from leaking from the pipe connection member 300.

Since the gasket 330 is in contact with the explosive medicine, it is preferable that the gasket 330 is made of a metallic material in order to prevent damage to the exterior due to corrosion. Typically, it may be implemented by any one of stainless steel (SUS), zinc, copper, and nickel.

On the other hand, a plurality of through holes 332 penetrating from the upper surface to the lower surface may be formed on the gasket 330.

Conventionally, a gasket used in a semiconductor manufacturing facility has a circular hollow portion formed at a central portion thereof. However, in the case of the gasket 330 according to the present invention, a blind gasket is used as a gasket 330, And a hole 332 is formed.

Hereinafter, the shape and arrangement of the plurality of through holes 332 formed on the gasket 330 will be described in detail.

5A- 5D illustrate various embodiments of gaskets according to the present invention.

5A is a view showing a state in which three through holes 332a are radially arranged with respect to the center of the gasket 330. FIG. 5A is a sectional view taken along line AA 'of FIG. 5A, (C) is a partial perspective view of the gasket 330 which is cut off at the right side with reference to line BB 'in (A).

5A is a view showing a radial arrangement of seven through holes 332b with respect to the center of the gasket 330. FIG. 5B is a cross-sectional view taken along line AA 'of FIG. 5A, Is a partial perspective view of the gasket 330 taken along the BB 'line of FIG.

5C is a view showing a circular central through hole 332c-2 formed in the center of the gasket 330 and seven through holes 332c-1 radially arranged, and FIG. 3A is a cross-sectional view taken along line AA 'of FIG. 4A, and FIG. 4C is a partial perspective view of a gasket 330 taken along the BB' line of FIG.

5A is a view showing a central through hole 332d-2 in the form of a propeller formed in the center of the gasket 330 and three through holes 332d-1 arranged radially, 3A is a cross-sectional view of AA 'and BB' of FIG. 3A, and FIG. 3A is a partial perspective view of a gasket 330 taken along the AA 'and BB' lines of FIG.

First, the shape of the through hole 332 is preferably a square shape, as shown in Figs. 5A to 5D (A), in consideration of the inclined portion inside the through hole 332 to be described below. However, the present invention is not limited to this, and may be formed in various shapes such as a rectangular fan shape.

As shown in FIGS. 5A to 5D (D), the through hole 332 is provided with an inclined portion which is inclined in a predetermined direction from the upper surface to the lower surface of the gasket 330.

Due to the inclined portion, the through hole 332 formed on the gasket 330 may be spirally formed while rotating clockwise or counterclockwise from the upper surface to the lower surface as a whole. If the inclined surfaces of the through holes 332 are formed in the right upper end to the left lower end direction, a counterclockwise helical shape is formed. If the inclined surfaces are formed in the left upper end direction and the right lower end direction, a clockwise helical shape is formed.

Here, as shown in FIG. 5 (a) to FIG. 5 (d), the inclined portion is preferably implemented as a planar inclined portion having a straight line in cross section, but may be implemented as a gentle inclined portion having a circular arc shape for smooth fluid flow Of course it is.

The arrangement of the through holes 332 may be variously arranged at symmetrical positions with respect to the center of the gasket 330. Here, the symmetry may include not only symmetry of the origin but also symmetry with respect to a straight line axis extending from the origin in opposite directions.

5A to 5D, three or seven through holes 332a, 332b, 332c-1, and 332d-1 may be formed symmetrically with respect to the origin, and Figs. 5c to d The central through holes 332c-2 and 332d-2 may be formed at the central portion as in the case of FIG.

Here, the central through holes 332c-2 and 332d-2 may be formed in the shape of a circular or propeller. The central through hole 332d-2 in the form of a propeller is formed by a circular through- And a plurality of wing through holes formed in the wing.

In the case of the gasket 300 having the central through-hole 332d-2 in the form of a propeller, the inclined portion is formed in a double shape by forming the inclined portions in the wing through hole and the radial through hole 332d-1, respectively. As a result, it is possible to generate a stronger whirl than that, and the chemical wastes existing in the tube can be effectively purged.

5A to 5D are merely illustrative of the type of the origin symmetry according to the preferred embodiment of the present invention and may be embodied in a form symmetrical on a straight line extending from the center although not shown in the drawing other than the origin symmetry .

Therefore, the number and position of the through holes 332 are not limited to a great extent. It is preferable that the fluid passing through the gasket 330 has a sufficient helical fluid rotational force when the fluid passes through the through hole 332. The number of the through holes 332 is preferably 2 to 8, It would be desirable to be arranged in a radial form.

6 is an operational state diagram of a piping connection portion of a semiconductor manufacturing facility to which a gasket according to an embodiment of the present invention is applied.

Referring to FIG. 6, the fluid passing through the through hole 332 of the gasket image 330 is spirally rotated as it passes through the through hole 332. That is, the fluid that has flowed in a straight line shape rotates in a clockwise or counterclockwise direction due to the inclined portion formed in a certain direction while passing through the through hole, thereby forming a helical fluid movement path.

According to the present invention, by forming the plurality of through holes 332 on the blind gasket 330, the sealing effect can be obtained, and at the same time, the chemical pressure can be effectively increased by increasing the hydraulic pressure.

In addition, since the plurality of through holes 332 are symmetrically arranged with respect to the center of the gasket 300, the flow rates of the through holes are uniform, and the piping and the reaction chamber can be balanced.

In addition, since the plurality of through holes 332 are formed in a spiral shape, the chemical residue existing in the piping and the reaction chamber can be efficiently purged.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. It will be understood that the invention may be embodied in other specific forms without departing from the spirit or scope of the invention. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

300: Piping connecting member of a semiconductor manufacturing facility to which a gasket of the present invention is applied
310: first connecting member 320: second connecting member
330: gasket 332: through-hole
332c-2, 332d-2: Central through hole 340: Pam nut
350: Bolt

Claims (4)

A flat plate-like gasket (not shown) interposed between the connecting members 300 for supplying chemicals used in semiconductor manufacturing to prevent leakage of the chemicals and to move the liquid or gas passing through the pipe while spirally rotating 330,
The gasket 330 is made of any one of stainless steel (SUS), zinc, copper, and nickel,
Two through eight through holes 332 penetrating from the top surface to the bottom surface are formed at symmetrical positions with respect to the center,
The plurality of through-holes 332 includes a central through hole 332c-2 and 332d-2 in the form of a circular or propeller and a through hole 332c-2 and 332d-2 radially disposed around the central through hole 332c- (332c-1, 332d-1)
The through hole 332 is formed in a spiral shape by rotating clockwise or counterclockwise from the upper surface to the lower surface,
Wherein a liquid or gas passing through the through hole (332) spirally passes through the through hole (332). delete delete delete

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