KR101438723B1 - Cooling system of a computer having a gpu - Google Patents

Abstract

The computer board cooling system includes a main board, a plurality of expansion boards, and a fan for the first board. The main board extends in a first direction in a plate shape and includes a plurality of first connection slots connected to the first end in the first direction. The extension boards extend parallel to the main board and are coupled to the first connection slots. The first board fan is disposed at a second end opposite to the first end of the main board so as to circulate air so that external air flows through the upper portion of the main board and the extension boards.

Description

{COOLING SYSTEM OF A COMPUTER HAVING A GPU}

The present invention relates to a computer board cooling system, and more particularly, to a cooling system of a computer board equipped with a GPU.

The number of expansion boards or graphics cards to be connected to the main board increases as the specifications required by the computer become higher and the connection structure between the main board and the expansion board or the graphic card becomes complicated. Furthermore, when various expansion boards are required for the implementation of a high-performance computer such as a supercomputer, a plurality of graphic processing unit (GPU) boards for specializing in graphics processing need to be fixed on the main board There arises a problem that the structure becomes complicated.

As described above, if the board connection structure inside the computer becomes complicated, there arises a problem that the design of the cooling system becomes complicated and the cooling efficiency is reduced as well as problems of assembly and exchange occur. Particularly, when a large number of high-performance graphic processing boards are installed in a computer, the design of cooling and heat dissipation systems becomes more important.

The cooling system developed until recently has been mainly designed to dissipate the heat inside the computer case to the outside through an air circulation system using mainly a fan. In this case, the fan is mounted directly on the board or secured in the computer case to cool the board and dissipate heat inside the computer to the outside. However, in the case of the fan fixed to the computer case, it is difficult to enhance the effect of dissipating the heated air inside the computer to the outside due to the complicated structures inside the computer. Further, there is a problem in designing a fan that can effectively dissipate air in consideration of the structure inside the computer.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a computer board cooling system with improved cooling effect.

According to an embodiment of the present invention, a computer board cooling system includes a main board, a plurality of expansion boards, and a fan for the first board. The main board extends in a first direction in a plate shape and includes a plurality of first connection slots connected to the first end in the first direction. The extension boards extend parallel to the main board and are coupled to the first connection slots. The first board fan is disposed at a second end opposite to the first end of the main board so as to circulate air so that external air flows through the upper portion of the main board and the extension boards.

In one embodiment, each of the extension boards may have a plurality of second connection slots extending in a second direction perpendicular to the extending direction of the extension boards. And a plurality of sub-boards coupled to the second connection slots in a direction perpendicular to an extending direction of the extension boards.

In one embodiment, each of the sub-boards may be one of an expansion card, a solid state drive (SSD), or a graphics processing unit (GPU).

In one embodiment, the apparatus may further include a first separation frame that separates the main board and the expansion boards from another space, disposes the main board in the first space, and disposes the expansion boards in the second space.

In one embodiment, air circulated through the fan for the first board may pass through the first and second spaces.

In one embodiment, the apparatus may further include a power supply unit disposed in the second space and supplying power to the main board.

In one embodiment, the air conditioner may further include a second board fan disposed at an end of the power unit to circulate the air through the first and second spaces.

In one embodiment, it may further comprise a second separation frame disposed above or below the first separation frame. The second separation frame forms a third space with the first separation frame in the area where the main board is disposed, and the fourth space and the fourth space in the area where the expansion boards are arranged.

In one embodiment, the sub-boards may be located in the fourth space.

In one embodiment, it may further include first and second fans for the GPU, which are disposed at both ends of the sub-boards, and circulate the air through the third and fourth spaces.

In one embodiment, the second separation frame may be an outer case.

In one embodiment, the second separation frame and the outer case form a fifth space in an area where the main board is disposed, and in a region where the expansion boards are arranged, Can be formed.

In one embodiment, the first and second power fans may be disposed at both ends of the fifth and sixth spaces to circulate the air through the fifth and sixth spaces, respectively.

In one embodiment, the apparatus may further include a power supply unit disposed in the fifth space and supplying power to the main board.

According to the present invention, the cooling effect of the main board and the expansion boards can be improved by including the main board coupled in parallel with each other and the board fan controlling the air flow at the upper part of the expansion boards.

Particularly, since the main board and the expansion boards are separated from other spaces through the first separation frame, only the space in which the main board and the expansion boards are formed is cooled separately through the board fan, so that the cooling effect can be further improved .

In addition, the sub-boards fixed in a direction perpendicular to the expansion boards are separated from the first separation frame and the second separation frame, or the first separation frame and the outer frame and are disposed in a separate space, Since the GPU fans for cooling the boards are disposed in the space, it is possible to improve the cooling effect on the sub-boards such as the GPU having a high heat generation.

In addition, since the power supply unit is disposed in a space in which the main board and the expansion boards are disposed and in a space separate from the space in which the sub-boards are disposed, power fans for cooling the space in which the power unit is disposed are separately disposed, It is possible to separately cool the power source unit, thereby improving the cooling effect.

In contrast, since the power unit is separated from the space in which the sub-boards are disposed and is simultaneously disposed in the space where the main boards and the expansion boards are disposed, it is possible to cool the sub- have.

1 is a cross-sectional view illustrating a computer board cooling system according to an embodiment of the present invention.
Fig. 2 is an exploded perspective view of the computer board cooling system of Fig. 1, except for the outer case; Fig.
3 is a cross-sectional view illustrating a computer board cooling system according to another embodiment of the present invention.
4 is a cross-sectional view illustrating a computer board cooling system according to another embodiment of the present invention.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a computer board cooling system according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of the computer board cooling system of Fig. 1, except for the outer case; Fig.

1 and 2, a computer board cooling system 1 according to the present embodiment includes a main board 10, a plurality of expansion boards 20, a plurality of sub-boards 30, an outer case 40 The first separating frame 50, the second separating frame 60, the first board fan 70, the first and second GPU fans 80 and 85, and the first and second power supply fans 90, 95).

The main board 10 is formed in a flat plate shape and extends in a first direction D1. A main processing unit 11 such as a CPU is mounted on the first main board 10 and a plurality of first connection slots 12 are connected to a first end in the first direction D1. That is, the first connection slots 12 extend in a direction parallel to the direction in which the first main board 10 extends, and the connection terminals of the first connection slots 12 extend in the first direction D1. The first connection slots 12 are arranged in a row along corners of the main board 10 extending in a third direction D3 perpendicular to the first direction D1.

Each of the extension boards 20 is coupled to each of the first connection slots 12 and is disposed in the first direction D1 parallel to the extending direction of the main board 10. [ Since the first connection slots 12 are mounted in series in the third direction D3 along the edge of the end of the main board 10, And are arranged in a line along corners of the main board 10 because they are coupled with the main board 12. Thus, the main board 10 and the extension boards 20 are arranged on the same plane. Meanwhile, although not shown in detail, the extension boards 20 may be connected to the main board 10 in the same number of pins and the same shape, and the number and shape of the pins may be variously modified.

The sub boards 30 are coupled to each of the extension boards 20 in a second direction D2 perpendicular to the extending direction of the extension boards 20. [ Specifically, a plurality of second connection slots 21 are mounted in each of the extension boards 20 in the second direction D2 perpendicular to the extending direction of the extension boards 20. [ In this case, the second connection slots 21 are opened so that the second connection slots 21 can be connected in the second direction D2, and a plurality of extension boards 20 are provided along the third direction D3 Are arranged side by side. 1 and 2, the second connection slots 21 are mounted on opposite sides of the ends of the extension boards 20, to which the first connection slots 12 are connected. However, And the second connection slots 21 may be mounted at various positions.

The sub-boards 30 include a connection part 32 and the connection part 32 is coupled to the second connection slots 21, respectively. Thus, the sub-boards 30 extend in the second direction D2 perpendicular to the arrangement direction of the main board 10 and the extension boards 20, and the second connection slots 21 are arranged in parallel in the third direction, the sub-boards 30 are also arranged in parallel with each other.

In the present embodiment, the sub-boards 30 extend in a positive second direction (+ D2), which is the upper direction of the main board 10 and the extension boards 20, as shown in the figure.

Each of the sub-boards 30 may be any one of an expansion card, a solid state drive (SSD), and a graphic processing unit (GPU). Hereinafter, the sub- For example, In this case, the processing device 31 may be mounted on each of the sub-boards 30.

The outer case 40 includes upper and lower cases 41 and 42 facing each other and first and second side cases 43 and 44 facing each other to form a storage space therein. Meanwhile, in the present embodiment, the main board 10 and the expansion boards 20 are accommodated in the lower part of the storage space of the outer case 40 so as to be adjacent to the lower case 42.

The first separation frame 50 is disposed on the main board 10 and the extension boards 20 so that the space in which the main board 10 and the extension boards 20 are disposed is divided into different spaces .

The first separation frame 50 includes a first surface 51 disposed at an upper portion of the main board 10 and parallel to the main board 10, A second face 53 disposed parallel to the extension boards 20 and a third face 52 connecting the first face 51 and the second face 53. In this case, the interval between the first surface 51 and the main board 10 may be greater than the interval between the second surface 53 and the extension boards 20. [ This is because the main processing units 11 such as a CPU are mounted on the main board 10 and the heat generation amount is larger than that of the expansion boards 20, thereby improving the heat generating effect. Accordingly, the third surface 52 may be formed as an inclined surface.

A space between the first surface 51 and the lower case 42 is defined as a first space 77 and a space between the second surface 53 and the lower case 42 is defined as a second space 78 The main board 10 is disposed in the first space 77 and the expansion boards 20 are disposed in the second space 78. In this case,

A plurality of openings 54 are formed in the second surface 53 and each of the sub-boards 30 penetrates through the openings 54. That is, the sub-boards 30 are fixed to the second connection slots 21 of the extension boards 20 through the openings 54, and the connection portions 32 of the sub- The upper portion of the connection portion 32 is located on the upper surface of the second surface 53. [ Therefore, the second connection slots 21 and the extension boards 20 are disposed in the second space 78.

The first board fan 70 is disposed at a second end opposite to the first end of the main board 10 on which the first connection slots 12 are mounted. That is, the first board fan 70 is disposed at the corner where the lower case 42 and the first side case 43 meet. Thus, the fan 70 for the first board circulates air through the first and second spaces 77 and 78. For example, the air 71 introduced from the outside through the first board fan 70 passes through the first space 77 and flows into the first space 77, Cooling the expansion board 10 and continuing to advance through the second space 78 to cool the expansion board 20 disposed in the second space 78, 44) to the outside (74).

The fan 70 for the first board has a special fan for cooling the first and second spaces 77 and 78 formed by the first separation frame 50 and the lower case 42, . Therefore, it is possible to design the capacity of the first board fan 70 only considering the amount of heat generated by the main board 10 and the expansion boards 20, thereby improving the cooling effect.

The second separation frame 60 is disposed above the first separation frame 50 and the sub-boards 30 to separate the space in which the sub-boards 30 are disposed from the other space.

Specifically, the second separation frame 60 includes a fourth surface 61 disposed on the main board 10 in parallel with the first surface 51 of the first separation frame 50, A fifth surface 63 disposed on the boards 20 and above the sub-boards 30 in parallel with the second surface 53 of the first separation frame 50, And a sixth surface 62 connecting the fifth surface 63 with the second surface 62. In this case, the sixth surface 62 is formed as an inclined surface like the third surface 52 in order to keep the interval between the first separation frame 50 and the second separation frame 60 the same .

A space between the fourth surface 61 and the first surface 51 is referred to as a third space 87 and a space between the fifth surface 63 and the second surface 53 is referred to as a fourth space A separate space is not disposed in the third space 87, and the sub-boards 30 are disposed in the fourth space 88. In this case, since the sub-boards 30 are arranged to extend in the second direction D2, the third and fourth spaces 87 and 88 are formed in the first and second spaces 77 and 78, Can be formed larger.

The first and second GPU fans 80 and 85 are disposed in the third space 87 and the fourth space 88, respectively. Specifically, the fans 80 and 85 for the first and second GPUs are disposed at both ends of the sub-boards 30, respectively. That is, the first GPU fan 80 is disposed adjacent to the third surface 52 and the sixth surface 62 in the third space 87, and the second GPU fan 85 is disposed adjacent to the third surface 52 and the sixth surface 62, Is disposed adjacent to the second side case (44) in the fourth space (88). This is to improve the cooling effect of the sub-boards 30 when the sub-boards 30 are a GPU as in the present embodiment because the heat is very strong. Alternatively, the fan 80 for the first GPU may be disposed adjacent to the first side case 43 in the third space 87.

Thus, the fans 80 and 85 for the first and second GPU circulate the air so that the outside air passes through the third and fourth spaces 87 and 88. For example, the air 81 introduced from the outside through the first GPU fan 80 passes through the first GPU fan 80 and is placed in the fourth space 88 The sub-boards 30 are cooled and continue to pass through the second GPU fan 85 to the outside (83).

Thus, the first and second fans for the GPU 80 and 85 can be divided into the third and fourth spaces 87 and 88 formed by the first separation frame 50 and the second separation frame 60, And a cooling fan (not shown). Accordingly, the sub-boards 30 having a relatively large amount of heat can be intensively cooled, and the capacities of the fans 80 and 85 for the first and second GPUs 80 and 85 It is possible to improve the cooling effect.

The first and second power supply fans 90 and 95 are disposed in the space between the second separation frame 60 and the upper case 41 and in the first and second side cases 43 and 44, .

Specifically, a space between the fourth surface 61 of the second separation frame 60 and the upper case 41 is defined as a fifth space 97, and the space between the fifth surface 63 and the upper case 41, The first power source fan 90 is disposed in the fifth space 97 so as to be adjacent to the first side case 43 and the space between the first side case 43 and the first side case 43 is defined as a sixth space 98, 2 power supply fan 95 is disposed adjacent to the second side case 44 in the sixth space 98. [ The power supply unit 64 is disposed in the fifth space 97. The power supply unit 64 is connected to the main board 10 to supply power to the main board 10.

The amount of heat generated by the power source unit 64 is also considerable so that the power source unit 64 is separately disposed in the fifth space 97 and the power source unit 64 is disposed through the first and second power source fans 90 and 95 The air in the fifth and sixth spaces 97 and 98 is circulated to improve the cooling effect. For example, the air 91 introduced from the outside through the first power source fan 90 cools the power source unit 64 while passing through the fifth space 97, and the sixth space 98 (93), and then exits to the outside through the second power source fan (95) (94).

The first and second power supply fans 90 and 95 cool the fifth and sixth spaces 97 and 98 formed by the second separation frame 60 and the upper case 41, And serves as a dedicated fan for this purpose. Therefore, the capacities of the first and second power supply fans 90 and 95 can be designed in consideration of only the amount of heat generated by the power supply unit 64, so that the cooling effect can be improved.

3 is a cross-sectional view illustrating a computer board cooling system according to another embodiment of the present invention.

3, the computer board cooling system 2 according to the present embodiment includes a main board 110, a plurality of expansion boards 120, a plurality of sub-boards 130, an outer case 140, 1 separation frame 160, first and second board fans 170 and 175, fans for first and second GPUs 180 and 185, and first power fan 190 ).

The main board 110 is formed in a flat plate shape and extends in a first direction D1. A main processing unit 111 such as a CPU is mounted on the first main board 110 and a plurality of first connection slots 112 are connected to a first end in the first direction D1. That is, the first connection slots 112 extend in a direction parallel to the extending direction of the first main board 110, and the connection terminals of the first connection slots 112 extend in the first direction D1. Also, although not shown, the first connection slots 112 are arranged in a line along corners of the main board 110 extending in a third direction D3 perpendicular to the first direction D1.

Each of the extension boards 120 is coupled to each of the first connection slots 112 and is disposed in the first direction D1 parallel to the extension direction of the main board 110. [ The first connection slots 112 are mounted in series in the third direction D3 along the edge of the main board 110 so that the extension boards 120 are also connected to the main board 110, 1 connection slots 112, so that they are arranged in a row along corners of the main board 110. [ Thus, the main board 110 and the extension boards 120 are disposed on the same plane.

The sub boards 130 are coupled to each of the extension boards 120 in a second direction D2 perpendicular to the extension direction of the extension boards 120. [ In the present embodiment, the sub-boards 130 extend in a negative second direction -D2, which is the lower direction of the main board 110 and the extension boards 120, as shown in the figure.

Specifically, a plurality of second connection slots 121 are mounted in each of the extension boards 120 in the second direction D2 perpendicular to the extending direction of the extension boards 120. [ In this case, the second connection slots 121 are opened in the second direction D2 to connect the expansion boards 120 to the third direction D3, As shown in FIG.

The sub-boards 130 include a connection part 132 and the connection part 132 is coupled to the second connection slots 121, respectively. Thus, the sub-boards 130 extend in the second direction D2 perpendicular to the arrangement direction of the main board 110 and the extension boards 120. Although not shown, Since the connection slots 121 are arranged in parallel in the third direction, the sub-boards 130 are also arranged in parallel with each other.

Each of the sub-boards 130 may be an expansion card, a solid state drive (SSD), or a graphic processing unit (GPU), and each of the sub- The processing apparatus 131 can be mounted.

The outer case 140 includes upper and lower cases 141 and 142 facing each other and first and second side cases 143 and 144 facing each other to form a storage space therein. The main board 110 and the extension boards 120 are accommodated in the upper part of the storage space of the outer case 140 so as to be adjacent to the upper case 141. [

 The first separation frame 150 is disposed below the main board 110 and the expansion boards 120 so that a space in which the main boards 110 and the expansion boards 120 are disposed is divided into different spaces .

The first separation frame 150 is disposed in parallel with the main board 110 and the expansion boards 120. The main board 110 and the expansion boards 120 are connected to the first And may be fixed on the separation frame 150.

The space between the first separation frame 150 and the upper case 141 in which the main board 110 is disposed is divided into a first space 177 and the first space 177 in which the expansion boards 120 are disposed. The space between the separation frame 150 and the upper case 141 may be defined as a second space 177. [ In this case, although not shown, a plurality of openings are formed in the first separation frame 150 corresponding to the second space 177, and the sub-boards 130 penetrate through the openings, The lower part of the connection part 132 is fixed to the lower part of the first separation frame 150 with respect to the connection part 132 of the sub- Located.

The first board fan 170 is disposed at a second end opposite to the first end of the main board 110 on which the first connection slots 112 are mounted. That is, the first board fan 170 is disposed at an edge portion where the upper case 141 and the first side case 143 meet.

The second board fan 175 is disposed at an edge portion of the upper case 141 and the second side case 144 that are opposite to the first board fan 170.

Thus, the fans for the first and second boards 170 and 175 circulate air through the first and second spaces 177 and 178. For example, the air 171 introduced from the outside through the fan 170 for the first board passes through the first space 177 and flows through the first space 177 disposed in the first space 177, Cooling the expansion board 120 disposed in the second space 178 while passing through the second space 178 and cooling the first board fan 110, (174). ≪ / RTI >

The first and second board fans 170 and 175 may include first and second spaces 177 and 178 formed by the first separation frame 150 and the upper case 141, And serves as a dedicated fan for cooling. Therefore, since the capacities of the first and second board fans 170 and 175 can be designed only by the amount of heat generated by the main board 110 and the expansion boards 120, have.

The second separation frame 160 is disposed below the first separation frame 150 and the sub-boards 130 to separate the space in which the sub-boards 130 are disposed from other spaces.

Specifically, the second separation frame 160 includes a first surface 161 disposed in parallel with the first separation frame 150 at a lower portion of the main board 110, the extension boards 120, A second surface 163 disposed at a lower portion of the sub-boards 130 in parallel with the first separation frame 150 and a second surface 163 disposed between the first surface 161 and the second surface 163, And a surface 162. In this case, the second surface 163 is disposed below the first surface 161 to secure a space for accommodating the sub-boards 130 and a space for accommodating a power supply unit 164 to be described later And as a result, the third surface 162 may be formed as an inclined surface.

A space between the first surface 161 and the first separation frame 150 is divided into a third space 187 and a space between the second surface 163 and the first separation frame 150. 4 space 188. A separate board is not disposed in the third space 187 and the sub boards 130 are disposed in the fourth space 188. [ In this case, since the sub-boards 130 are arranged to extend in the second direction D2, the third and fourth spaces 187 and 188 are spaced apart from the first and second spaces 177 and 178, Can be formed larger.

The fans 180 and 185 for the first and second GPUs are disposed in the third space 187 and the fourth space 188, respectively. Specifically, the fans 180 and 185 for the first and second GPUs are disposed at both ends of the sub-boards 130, respectively. That is, the fan 180 for the first GPU is disposed adjacent to the second surface 162 in the third space 187, and the fan 185 for the second GPU is disposed adjacent to the fourth space 188, And is disposed adjacent to the second side case 144 on the second side case 144. This is to improve the cooling effect of the sub-boards 130 when the sub-boards 130 are a GPU as in the present embodiment because the heat is very strong. Alternatively, the fan 180 for the first GPU may be disposed adjacent to the first side case 143 in the third space 187.

Thus, the fans 180 and 185 for the first and second GPU circulate the air so that the outside air passes through the third and fourth spaces 187 and 188. For example, the air 181 introduced from the outside through the fan 180 for the first GPU passes through the fan 180 for the first GPU 180, and is then placed in the fourth space 188 The sub-boards 130 are cooled and continue to pass through the fan 185 for the second GPU to the outside (183).

The fans 180 and 185 for the first and second GPUs are connected to the third and fourth spaces 187 and 188 formed by the first separation frame 150 and the second separation frame 160. [ And a cooling fan (not shown). Accordingly, it is possible to intensively cool the sub-boards 130 having a relatively large heating value, and to increase the capacity of the first and second fans for the first and second GPUs 180 and 185 It is possible to improve the cooling effect.

The first power source fan 190 is disposed adjacent to the first side case 143 in a space between the second separation frame 160 and the lower case 142.

The space between the first surface 161 of the second separation frame 160 and the lower case 142 is defined as a fifth space 197 and the space between the second surface 163 and the lower case 142, The first power source fan 190 is disposed in the fifth space 197 so as to be adjacent to the first side case 143. In this case, A power supply unit 164 is disposed in the fifth space 197. The power supply unit 164 is connected to the main board 110 and supplies power to the main board 110.

The power source unit 164 may be separately disposed in the fifth space 197 and the power source unit 164 may be disposed in the fifth space 197 through the first power source fan 190. [ Circulates the air in the six spaces 197 and 198, thereby improving the cooling effect. For example, the air 191 introduced from the outside through the first power source fan 190 may cool the power source unit 164 while passing through the fifth space 197, (193), then passes through the second side case (144) and exits to the outside (194).

The first power source fan 190 is provided with a dedicated fan for cooling the fifth and sixth spaces 197 and 198 formed by the second separation frame 160 and the lower case 142, . Therefore, the capacity of the first power source fan 190 can be designed in consideration of only the amount of heat generated by the power source unit 164, so that the cooling effect can be improved.

Meanwhile, although not shown, the second power source fan may be further disposed adjacent to the second side case 144 so as to face the first power source fan 190, thereby improving the cooling effect.

4 is a cross-sectional view illustrating a computer board cooling system according to another embodiment of the present invention.

4, the computer board cooling system 3 according to the present embodiment includes a main board 210, a plurality of expansion boards 220, a plurality of sub-boards 230, an outer case 240, 1 separation frame 250, fans for the first and second boards 270 and 275, and fans for the first and second GPUs 280 and 285.

The main board 210 is formed in a flat plate shape and extends in a first direction D1. A main processing unit 211 such as a CPU is mounted on the first main board 210 and a plurality of first connection slots 212 are connected to a first end in the first direction D1. That is, the first connection slots 212 extend in a direction parallel to the extending direction of the first main board 210, and the connection terminals of the first connection slots 212 extend in the first direction D1. Although not shown, the first connection slots 212 are arranged in a line along corners of the main board 210 extending in a third direction D3 perpendicular to the first direction D1.

Each of the extension boards 220 is coupled to each of the first connection slots 212 and is disposed in the first direction D1 parallel to the extension direction of the main board 210. [ Since the first connection slots 212 are mounted in series in the third direction D3 along the edge of the end of the main board 210, 1 connection slots 212, so that they are arranged in a line along the corners of the main board 210. Thus, the main board 210 and the expansion boards 220 are disposed on the same plane.

The sub-boards 230 are coupled to the extension boards 220 in a second direction D2 perpendicular to the extending direction of the extension boards 220, respectively. In the present embodiment, the sub-boards 230 extend in a negative second direction -D2, which is the lower direction of the main board 210 and the extension boards 220, as shown in the figure.

Specifically, a plurality of second connection slots 221 are mounted in each of the extension boards 220 in the second direction D2 perpendicular to the extending direction of the extension boards 220. [ In this case, the second connection slots 221 are opened to allow connection in the second direction D2. Although not shown, the third direction D3 may be formed in each of the extension boards 220, As shown in FIG.

The sub-boards 230 include a connection unit 232 and the connection unit 232 is coupled to the second connection slots 221, respectively. The sub-boards 230 extend in the second direction D2 perpendicular to the direction in which the main boards 210 and the extension boards 220 are arranged. Although not shown, Since the connection slots 221 are arranged in parallel in the third direction, the sub-boards 230 are also arranged in parallel with each other.

Each of the sub-boards 230 may be an expansion card, a solid state drive (SSD), or a graphic processing unit (GPU). Each of the sub- The processing apparatus 231 can be mounted.

The outer case 240 includes upper and lower cases 241 and 242 facing each other and first and second side cases 243 and 244 facing each other to form a storage space therein. Meanwhile, in the present embodiment, the main board 210 and the extension boards 220 are accommodated in the upper part of the storage space of the outer case 240 so as to be adjacent to the upper case 241.

Meanwhile, in this embodiment, the power supply unit 264 is mounted on the upper case 241, which is an upper portion of the expansion boards 220. The power supply unit 264 is connected to the main board 210 to supply power to the main board 210.

 The first separation frame 250 is disposed below the main board 210 and the extension boards 220 so that the main board 210, the extension boards 220, and the power source unit 264 Separate the placed space from the other space.

The first separation frame 250 is disposed parallel to the main board 210 and the extension boards 220. The main board 210 and the extension boards 220 are connected to the first And can be fixed on the separation frame 250.

A space between the first separation frame 250 and the upper case 241 in which the main board 210 is disposed is divided into a first space 277 and the first space 277 in which the expansion boards 220 are disposed. The space between the separation frame 250 and the upper case 241 may be defined as a second space 277. In this case, although not shown, a plurality of openings are formed in the first separation frame 250 corresponding to the second space 277, and the sub-boards 230 pass through the openings, The lower part of the connection part 232 is fixed to the lower part of the first separation frame 250 with respect to the connection part 232 of the sub- Located.

The first board fan 270 is disposed at a second end opposite to the first end of the main board 210 on which the first connection slots 212 are mounted. That is, the first board fan 270 is disposed at an edge portion where the upper case 241 and the first side case 243 meet.

The fan 275 for the second board is disposed at an edge portion where the upper case 241 and the second side case 244 meet to face the fan 270 for the first board.

Thus, the fans 270 and 275 for the first and second boards circulate air through the first and second spaces 277 and 278. For example, the air 271 introduced from the outside through the first board fan 270 passes through the first space 277 and passes through the first space 277, Cooling the expansion board 220 and the power supply unit 264 disposed in the second space 278 while passing the second space 278 through the second space 278, (274) through the second board fan (275).

The first and second board fans 270 and 275 are formed by the first and second spaces 277 and 278 formed by the first separation frame 250 and the upper case 241, And serves as a dedicated fan for cooling. Therefore, the capacities of the first and second board fans 270 and 275 can be designed only in consideration of the amount of heat generated by the main board 210, the extension boards 220, and the power supply unit 264, The cooling effect can be improved.

In this embodiment, since the power supply unit 264 is disposed in the second space 278, it is possible to improve space utilization as compared with the previously described embodiments, and in consideration of heat generation of the power supply unit 264, The cooling capacity of the first and second board fans 270 and 275 can be designed to be increased, so that the cooling effect can be kept the same.

Accordingly, in the present embodiment, the power supply unit 264 need not be housed in a separate space, so that the second separation frame can be omitted, and the first separation frame 250 and the lower case 242 can be omitted Third and fourth spaces 287 and 288 can be defined. That is, the third space 287 may be defined as a lower space of the first space 277, and the fourth space 288 may be defined as a lower space of the second space 278.

In this case, no additional board is disposed in the third space 287, and the sub-boards 230 are disposed in the fourth space 288. In this case, since the sub-boards 230 are arranged to extend in the second direction D2, the third and fourth spaces 287 and 288 are spaced apart from the first and second spaces 277 and 278, Can be formed larger.

The first and second GPU fans 280 and 285 are disposed in the third space 287 and the fourth space 288, respectively. Specifically, the fans for the first and second GPUs 280 and 285 are disposed at both ends of the sub-boards 230, respectively. That is, the first GPU fan 280 is disposed adjacent to one end of the sub-boards 230 in the third space 287, and the second GPU fan 285 is disposed adjacent to the fourth Is disposed adjacent to the second side case (244) in the space (288). This is to improve the cooling effect of the sub-boards 230 when the sub-boards 230 are a GPU as in the present embodiment because the heat is very strong. Alternatively, the fan 280 for the first GPU may be disposed adjacent to the first side case 243 in the third space 287.

Thus, the fans for the first and second GPUs 280 and 285 circulate air so that outside air passes through the third and fourth spaces 287 and 288. For example, the air 281 introduced from the outside through the first fan for the GPU 280 is passed through the fan 282 for the first GPU 280 and then placed in the fourth space 288 (230), and continues to pass through the second GPU fan (285) and out of the sub-boards (283).

The first and second fans for the GPU 280 and 285 cool the third and fourth spaces 287 and 288 formed by the first separation frame 250 and the lower case 242, And serves as a dedicated fan for this purpose. Therefore, it is possible to intensively cool the sub-boards 230 having a relatively large heating value, and to increase the capacity of the first and second fans for the first and second GPUs 280 and 285 It is possible to improve the cooling effect.

According to the embodiments of the present invention as described above, since the main board coupled to each other in parallel and the board fan controlling the air flow in the upper portion of the expansion boards are included, the cooling effect of the main board and the expansion boards can be improved .

Particularly, since the main board and the expansion boards are separated from other spaces through the first separation frame, only the space in which the main board and the expansion boards are formed is cooled separately through the board fan, so that the cooling effect can be further improved .

In addition, the sub-boards fixed in a direction perpendicular to the expansion boards are separated from the first separation frame and the second separation frame, or the first separation frame and the outer frame and are disposed in a separate space, Since the GPU fans for cooling the boards are disposed in the space, it is possible to improve the cooling effect on the sub-boards such as the GPU having a high heat generation.

In addition, since the power supply unit is disposed in a space in which the main board and the expansion boards are disposed and in a space separate from the space in which the sub-boards are disposed, power fans for cooling the space in which the power unit is disposed are separately disposed, It is possible to separately cool the power source unit, thereby improving the cooling effect.

In contrast, since the power unit is separated from the space in which the sub-boards are disposed and is simultaneously disposed in the space where the main boards and the expansion boards are disposed, it is possible to cool the sub- have.

The computer board cooling system according to the present invention has industrial applicability that can be used in high performance computers such as supercomputers equipped with a GPU.

1, 2, 3: Computer board cooling system
10, 110, 210: main board 20, 120, 220: extension board
30, 130, 230: Sub-board 40, 140, 240:
50, 150, 250: first separation frame 60, 160: second separation frame
70, 170, 175, 270, 275: fan for board
80, 85, 180, 185, 280, 285: Fan for GPU
90, 95, 190: Fan for power supply

Claims (14)

A main board extending in a plate shape in a first direction and including a plurality of first connection slots connected to the first end in the first direction;
A plurality of extension boards extending in parallel with the main board, coupled to the first connection slots, each having a plurality of second connection slots extending in a second direction perpendicular to the first direction;
A first board fan disposed at a second end opposite to the first end of the main board for circulating air so that external air flows through the upper portion of the main board and the extension boards;
A plurality of sub-boards coupled to each of the second connection slots in a direction perpendicular to an extension direction of the extension boards;
A first separation frame for separating the main board and the expansion boards from another space and arranging the main board in a first space and the expansion boards in a second space; And
And a second separation frame disposed above or below the first separation frame,
The second separation frame forms a third space with the first separation frame in the area where the main board is disposed and forms the first separation frame and the fourth space in the area where the expansion boards are arranged A computer board cooling system. delete 2. The computer board cooling system of claim 1, wherein each of the sub-boards is one of an expansion card, a solid state drive (SSD), and a graphics processing unit (GPU). delete 2. The computer board cooling system of claim 1, wherein air circulated through the fan for the first board passes through the first and second spaces. The computer board cooling system as claimed in claim 5, further comprising a power supply unit disposed in the second space and supplying power to the main board. 7. The computer board cooling system of claim 6, further comprising: a second board fan disposed at an end of the power supply unit to circulate air through the first and second spaces. delete The computer board cooling system of claim 1, wherein the sub-boards are disposed in the fourth space. 10. The computer board cooling system of claim 9, further comprising first and second fans for the GPU that are disposed at both ends of the subboards and circulate air through the third and fourth spaces. The computer board cooling system of claim 1, wherein the second separation frame is an outer case. The apparatus according to claim 1, wherein, in a region where the main board is disposed, the second separation frame and the outer case form a fifth space,
And the second separation frame and the outer case form a sixth space in a region where the expansion boards are disposed. 13. The computer board cooling system of claim 12, further comprising first and second power fans disposed at both ends of the fifth and sixth spaces for circulating air to pass through the fifth and sixth spaces. 13. The computer board cooling system according to claim 12, further comprising a power supply unit disposed in the fifth space and supplying power to the main board.

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