KR101417695B1 - Portable electronic device - Google Patents

Abstract

There is provided a modular material antenna assembly including an antenna block having a portion having a shape interlocking with a corresponding portion of a non-conductive frame to secure the antenna block to a non-conductive frame. The non-conductive frame is attached to the interior of the conductive housing, so that the non-conductive frame and the conductive housing form an integral structure. The antenna plexes are then mechanically secured to the antenna block. The antenna plex can also be electrically connected to the circuit board. The frame is designed to support a cover glass for a portable electronic device and can be attached to the housing. The dielectric constant of the antenna block is significantly lower than the dielectric constant of the frame.

Description

[0001] PORTABLE ELECTRONIC DEVICE [0002]

The present invention relates to consumer products, and more particularly to portable electronic devices.

A portable electronic device, for example, portable communication devices, such as tablet computing devices, according to the lines of the iPad ^TM are each produced by Apple Inc. of Cupertino, Calif., ^TM iPhone, iPod or ^TM Such as a portable media player. These devices often have a wireless communication mechanism to provide wireless communication between a portable device and a base station, a cell phone tower, a desktop computer, and the like. Common wireless communication mechanisms include IEEE 802.11 a, b, g and n (commonly known as "WiFi"), Worldwide Interoperability for Microwave Access (WiMAX), and Global System for Mobile Communications (GSM) Lt; RTI ID = 0.0 > communication < / RTI > There is a need for an improved technique for integrating an antenna into a portable electronic device to enable wireless communication.

SUMMARY OF THE INVENTION [

Compact folding for integrated circuit packaging compact folded ) Configuration

In general, the embodiments disclosed herein describe memory chip packaging designs suitable for use in consumer electronic devices such as laptops, cell phones, netbook computers, portable media players, and tablet computers. In particular, packaging designs for memory chips used in lightweight consumer electronic devices having a small, small enclosure are described. Packaging designs using memory chips may be referred to in the related description as "foldable memory devices. &Quot; The foldable memory device design can address assembly, electrical connection and RF shielding problems associated with the use of multiple chips in electronic devices. Methods and apparatus for implementing such chip packaging designs are described below.

In one embodiment of the chip packaging designs described herein, a plurality of chips may be coupled to the flexible circuit connector to form a memory device. The flexible circuit connector may include data and power traces used by the chips. The two chips on the adjacent flexible circuit connectors can be separated by a part of the flexible circuit connector of a predetermined length. When a memory device is installed in an electronic device, a portion of the flexible circuit connector between each of the chips may be bent or twisted to change the orientation of the chips relative to each other.

Through bending and twisting of the flexible circuit connectors between the chips, the memory device can be configured in various orientations during the installation process. For example, during one phase of the installation process, the first chip connected to the flexible circuit connector may be oriented side-by-side with the second chip. This orientation can be used while the second chip is attached to a component such as a printed circuit board (PCB). Then, during the second step, a part of the flexible circuit connector between the first and second chips is folded up, so that the orientation between the first chip and the second chip can be changed. For example, after folding, the first chip and the second chip may be aligned and bonded together in a stacked configuration. In general, when the memory device comprises three or more chips, the orientation of each of the chips to each other may be such that the flexible circuit connector is bent or folded at different locations through a number of steps until the chips are assembled into a final packaging configuration Lt; / RTI >

In certain embodiments, the flexible circuit connector may include metal connector pads for grounding the flexible circuit connector to a metal frame or other metallic components. To facilitate grounding, the flexible circuit connector may be folded in areas adjacent to the connector pads so that the connector pads are bonded to a specific surface, such as the surface of the metal frame. If properly grounded, the flexible circuit connector can be used to form part of the Faraday crate.

In one embodiment, the Faraday box can be used to block the radio frequency (RF) signals generated by the chips from reaching the antenna installed in the portable computing device. The antenna may be a component of the air interface used in the device. Using a flexible circuit connector instead of a separate metal shield to form part of the Faraday box can make the design thinner and lighter because the flexible circuit connector is thinner and lighter than conventional metal components used for RF shielding to be. For example, stainless steel is typically used to form a Faraday cage used in RF shielding. The flexible circuit connector may be about 1/6 the thickness of the stainless steel component used in this manner.

In a particular embodiment, a method of installing memory chips attached to a flexible circuit connector in a portable computing device is described. The method comprises: 1) attaching a first chip to a second chip via a flexible circuit connector; 2) attaching the first chip to the printed circuit board, wherein the first chip can be positioned so that the metal frame partially surrounds the first chip in the metal frame coupled to the printed circuit board; 3) folding the flexible circuit connector up to align the first chip and the second chip; 4) attaching the second chip to the first chip through an adhesive, wherein the first and second chips are aligned and bonded in a laminated configuration; 5) grounding a portion of the flexible circuit connector to one or more surfaces of the metal frame to prevent RF signals from leaking from the first chip and the second chip (leakage of RF signals, as described above, It can affect the antenna used); And 6) installing an assembly comprising a first chip, a second chip, a metal frame, and a printed circuit board in the portable computing device.

Rigidity stiffness ) And an internal frame optimized for heat transfer

In general, the embodiments disclosed herein describe structural components suitable for use in consumer electronic devices such as laptops, cell phones, netbook computers, portable media players, and tablet computers. In particular, structural components that address the strength and thermal problems associated with the design of lightweight consumer electronic devices with thinner, smaller enclosures are described. Methods for forming these structural components are also described.

In one embodiment, the consumer electronic device may be a thin portable electronic device having a display. The internal arrangement of the components of the thin portable electronic device can be considered as multiple laminated layers. The stacked layers may be associated with a particular height relative to the thickness of the device. Various device components, such as, but not limited to, display circuits, CPUs, speakers, memories, wireless communication circuits, and batteries, may be arranged and distributed over the stacked layers.

One of the laminated layers may be an inner frame. The inner frame may be coupled to an outer housing of the thin portable electronic device. The inner frame may be configured to provide heat dissipation capability, such as thermal diffusion to the heat generating components disposed in the layers adjacent to the inner frame. Also, the inner frame can be used to add the overall structural stiffness of the device. In addition, the inner frame can be used as an attachment point for other device components used in the device, such as a display.

In one embodiment, the inner frame may be an inner metal frame formed of a plurality of layers of different metals. For example, the inner metal frame may comprise an intermediate layer formed of a first metal disposed between two outer layers formed of a second metal. The first metal and the second metal may each be selected for their strength and / or heat conduction properties. Further, the thickness of each of the layers may be varied to improve its strength or thermal properties. In one embodiment, different metal layers of the inner metal frame may be joined using a cladding process.

In certain embodiments, the first metal used in the intermediate layer can be selected primarily for its thermal conductivity properties, so that the intermediate layer can act as a heat spreader, while the second metal used in the two outer layers is primarily internal May be selected to improve the strength of the metal frame, and thus the overall stiffness of the device. In general, the first metal and the second metal are formed of one or more of primarily thermal conduction properties, strength properties (e.g., stiffness), environmental properties (e.g., corrosion resistance), and decorative properties ≪ / RTI > As an example, the intermediate layer may be formed of copper selected for its thermal properties, and the two outer layers may be formed of stainless steel selected for its strength properties. In another embodiment, the second metal used in the two outer layers may be selected such that each of the outer layers acts as a heat spreader, while the first metal used in the intermediate layer may be selected for its strength properties .

When the first metal used in the intermediate layer of the inner metal frame is selected primarily for its thermal properties so that the intermediate layer can act as a heat spreader, one or more openings may be provided in the outer layers of the inner metal frame. Each opening may be disposed proximate the heat generating component in the apparatus. A thermal bridge may be provided that thermally couples the surface associated with the heat generating component to the intermediate layer of the inner metal frame through an opening in the outer layer proximate to the heat generating component. In certain embodiments, the thermal bridge may be formed of a soldering material or a thermally conductive adhesive tape.

Synthetic microphone boots to optimize sealing and mechanical properties ( composite microphone boot)

In general, the embodiments disclosed herein describe microphone assembly designs suitable for use in consumer electronic devices such as laptops, cell phones, netbook computers, portable media players, and tablet computers. The microphone assembly is installed in a consumer electronic device and can be used in applications including sound recording. In particular, microphone assemblies can be used in wireless communication applications such as digital telephony.

The microphone assembly may include a circuit board and a microphone coupled to the microphone boot. When the microphone assembly is installed inside the device, the microphone boot may provide a conduit for sound between the opening in the housing of the device and the microphone. Typically, the microphone boot includes a hollow enclosure capable of micro-conducting the sound. Thus, sound waves from outside the device can enter an opening in the housing, pass through a microphone boot, and then be received by a microphone.

When sound waves enter through the openings in the outer housing, it is desirable for sound quality purposes to minimize mixing of any sounds passing through the interior of the housing with sounds entering the microphone boot, such as sounds generated from internal speakers in the device. In order to prevent sound penetration into the microphone boot, it is desirable to provide high seal integrity at both ends of the microphone boot that can be maintained (which may not be destroyed) during operation of the device. Typically, one end of the microphone boot can be sealed to the interior surface of the housing, and the other end of the microphone boot can be sealed to the microphone. Methods and devices related to microphone boot designs with good sealing quality are described below.

The synthetic microphone boot may include a compressible center portion disposed between two end caps formed of a less compressible material than the center portion. For example, the end caps may be formed of a rigid plastic material, and the center portion may be formed of a more flexible plastic material such as a silicon resin plastic. As another example, the end caps may be formed of a more flexible plastic material, and the center portion may be formed of a more rigid plastic material. Generally, the end caps and the center portion may each be formed of materials of different hardness. In one embodiment, the relative hardness of each of the materials may be selected to improve the seal integrity and / or shock absorption properties of the synthetic microphone boot.

A synthetic microphone boot comprising a hollow interior portion may be formed by a double shot injection molding process. Different materials may be used each during one shot of the double shot injection molding process. For example, a harder plastic material may be used in one shot, and a more flexible plastic material may be used in the remaining shot. The materials used in each shot may be selected so that they are bonded together during the injection molding process.

In another embodiment, the end caps and center of the synthetic microphone boot may be separately formed and then laminated together. For example, the end caps or core can be individually molded or die-cut. The end caps and center are stacked together and can be held in place without physically bonding the components together. For example, the components can be mechanically depressed in any manner, such as by pressing together the components to keep the components in place when the components are installed in the device.

During installation, a pressure sensitive adhesive (PSA) may be attached to each end of the synthetic microphone boot. Then, through the PSA, one end of the synthetic microphone boot can be bonded to the surface associated with the microphone, and the opposite end can be bonded to the inner surface of the housing. A compressive force can be applied to the synthetic microphone boot. For example, a microphone assembly including a printed circuit, a microphone, and a microphone boot may be secured to the housing in a manner that compresses the microphone boot. The compressive force can be applied primarily on the center of the synthetic microphone boot and consequently its thickness can be reduced. The compressed center portion can exert an outward force on the end caps of the synthetic microphone boot, which allows for a good seal between the PSA and the housing at one end of the microphone boot and between the PSA and the microphone at the opposite end of the microphone boot And help. This implementation can provide sound isolation of more than 40 DBs.

In certain embodiments, the microphone boot may be formed as a hollow cylinder, but other shapes may be used if desired. The microphone boot may include a center portion disposed between the two end caps. In one embodiment, the size and shape of each end cap can be approximately the same. In other embodiments, the size and shape of each end cap can be different. For example, one end of the microphone boot can be sealed to the inner surface of the bent housing, and the end cap of the microphone boot facing the inside of the housing has a shape that matches the surface shape of the inner surface, . ≪ / RTI >

In one embodiment, a method of manufacturing a portable computing device is described. The method may include determining the size, shape, and material composition of the synthetic microphone boot. A synthetic microphone boot can then be formed. The synthetic microphone boot can be formed using a double shot injection molding process. The opposite ends of the synthetic microphone boot may then be bonded to the inner surface of the microphone and the housing of the portable computing device. For example, PSA can be used as a bonding agent. A microphone assembly including a synthetic microphone boot, a microphone, and a printed circuit board may be secured to the housing such that the synthetic microphone boot is held in place and the seal is maintained. Finally, an assembly of a portable computing device including a synthetic microphone boot can be completed.

Modular  Material antenna assembly

In general, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion that interlocks with a corresponding portion of a non-conductive frame to thereby secure the antenna block to the non-conductive frame. The non-conductive frame is attached to the interior of the conductive housing, so that the non-conductive frame and the conductive housing form an integral structure. The antenna flex is then mechanically supported by the antenna block and electrically connected to the circuit board. The frame is designed to support a cover glass for a portable electronic device and can be attached to the housing. The dielectric constant of the antenna block is significantly lower than the dielectric constant of the frame. In one embodiment, the antenna block is made of COP (Cyclo Olefin Polymer), while the frame is made of glass-filled plastic. The resulting dielectric constant difference improves antenna performance in conjunction with differences in dielectric loss tangent as well as interlocking portions of the frame and antenna block.

In another embodiment, a method for assembling a portable electronic device is provided. In this embodiment, a conductive housing is provided. Then, the non-conductive frame is bonded to the inside of the conductive housing to form an integrated structure. The non-conductive frame is formed of a frame material having a first permittivity. Then, the antenna block is fixed to the frame by interlocking a part of the antenna block having the first shape and a part of the frame having the second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second permittivity that is significantly lower than the first permittivity. The antenna plexes are then supported by the antenna block.

In another embodiment, there is provided a computer readable medium having a computer code for attaching a non-conductive frame to the interior of a conductive housing to form an integrated structure, wherein the non-conductive frame is formed of a frame material having a first permittivity. This may include computer code for controlling the arms of the robot to adhere the non-conductive frame to the interior of the conductive housing. The computer readable medium may also include computer code for securing the antenna block to the frame by interlocking a portion of the antenna block having the first shape and a portion of the frame having the second shape corresponding to the first shape. This may include computer code for controlling the arms of the robot to perform interlocking. The computer readable medium may also include computer code for causing the antenna flex to be mechanically supported by the antenna block. This may include a computer code for controlling the automatic thread driver to secure the antenna feed to the antenna block and to the conductive bracket welded to the housing.

PCB  formation

In general, the embodiments disclosed herein describe a printed circuit board (PCB) suitable for use in consumer electronic devices such as laptops, cell phones, netbook computers, portable media players, and tablet computers. Specifically, PCB designs are addressed that address the packaging problems that may arise when lightweight consumer electronic devices with thinner, smaller enclosures are used. Exemplary embodiments of PCBs and methods for designing and forming PCBs are described.

In one embodiment, the consumer electronic device may be a thin portable electronic device with a display. The internal arrangement of its components within the enclosure of a thin portable electronic device can be considered as multiple stacked layers and the display including the display driver circuit and the battery occupies some of the stacked layers. Other components, such as but not limited to a CPU, memory, audio components, wireless interfaces, data connectors, power connectors, and associated circuitry, may be connected to unoccupied layers adjacent to the display, Lt; RTI ID = 0.0 > occupied but not fully utilized. ≪ / RTI > In particular, PCB designs are described in which the various electrical components can be aligned and connected to each other in wellness spaces that may occur within the device enclosure after larger device components are placed and stuck in the enclosure.

In certain embodiments, a relatively thin multilayer PCB for use in a portable computing device may be provided. The multi-layer PCB may be formed in a planar configuration. During assembly of the portable computing device, the PCB may be bent at predetermined areas so as to be installed in a non-planar configuration. The ability to bend can be used to more efficiently fit the PCB within the available space remaining in the enclosure after larger components such as batteries are installed.

A multi-layer PCB may include a plurality of substrate layers and a plurality of trace layers, each trace layer being formed on top of the substrate layer. To form the trace layer, after a hard layer of a conductive material, such as copper, is deposited on top of the substrate layer, portions of the rigid layer may be removed to form the conductive traces. For PCBs installed in non-planar configurations, the conductive traces may become thicker in areas where more bending forces are expected. The conductive traces can be used to connect components electrically coupled to the PCB. The components may be positioned above and / or below the PCB to fit into the available space or connected to other internal components as needed.

The stiffness of the multilayer PCB can be locally adjusted to make the board more susceptible to bending in certain areas and more resistant to bending in other areas. Typically, the trace layer includes only those traces used to connect the components coupled to the PCB board, and any excess material not used to form the traces is removed. In one or more of the trace layers, the extra material may be used to alter the stiffness properties of the PCB. For example, extra trace material may be preserved in some trace layer regions to increase the overall stiffness of the PCB proximate these regions, and may be removed in other regions to improve the flexibility of the PCB.

In certain embodiments, one of the trace layers may be dedicated only to the adjustment of the stiffness characteristics of the PCB. The material of this trace layer can be chosen for its stiffness properties, not its conducting properties. In this layer, portions of the layer can be removed to reduce the stiffness of the PCB and improve the flexibility of the PCB where the material is removed. In one embodiment, a shape memory alloy such as Nitinol may be used.

In one embodiment, a main logic board may be formed from a multi-layer PCB. The main logic board may include a first rectangle connected to the second rectangle via a narrow connection. Components such as a processor, memory, and audio codec may be coupled to the main logic board. The main logic board may have a shape that conforms to the spaces remaining along one side of the battery above and below the top and bottom of the battery remaining after the battery is installed in the enclosure of the portable computing device. The main logic board can be installed in a planar or nonplanar configuration.

Small form Factor  Audio using connectors in electronic devices Porting

The personal media device includes at least a housing, the housing having a plurality of openings, at least one of the openings receiving a housing port arranged to output a first portion of the audible energy produced by the audio generator contained in the housing And at least one of the openings is an alternative port used to broadcast a second portion of the audible energy generated by the audio generator. When at least a portion of the housing port is blocked, at least a portion of the first portion of the audible energy is redirected to the alternate port, maintaining the perception that the audio output level of the output audio energy remains substantially unchanged.

In an aspect of the described embodiment, the alternate port is incorporated within the connector opening in such a manner that the alternate port is maintained substantially invisible by the user of the personal media device. In another aspect, the connector opening accommodates a data connector, while in another aspect the connector opening accommodates an audio jack.

The method described in the embodiments can be performed by performing at least the following operations: providing a housing having a size and shape suitable for surrounding a plurality of operating components used to provide the functionality of the personal media device, Attaching the speaker assembly to the interior of the housing, configuring a first air path to acoustically couple the speaker assembly to the external environment through the first audio output port, operating a second audio output A second air path is formed between the port and the speaker assembly such that when one of the audio output ports is blocked by the object, at least the remaining audio output ports remain unobstructed, The operation of physically placing the ports, and the audible sound produced by the speaker assembly 1 < / RTI > and second audio ports.

An integrated audible sound output system incorporated within a personal media device is described. In the described embodiments, the personal media device comprises at least a processor, an audio circuit, and a data retaining unit comprising at least an audible sound generator unit. An audible sound generator unit is arranged to generate an audible sound according to the audio data retrieved from the data retaining unit and decoded by the audio circuit and processed by the processor. The integrated audible sound output system includes a first audio output port and the first audio output port is acoustically coupled to the audible sound generator unit via a first air path. The system also includes a second audio port acoustically coupled to the audible sound generator unit via a second air path. The first and second air paths cooperate to communicate the audible sound produced by the audible sound generator unit to the external environment through the first audio port and the second audio port.

In another embodiment, a non-transitory computer readable medium for storing a computer program executed by a processor and used in a computer aided assembly of a personal media device is described. The computer readable medium includes at least: computer code for providing a housing having a size and shape suitable to surround a plurality of operating components used to provide the functionality of a personal media device; a computer code for attaching a speaker assembly to the interior of the housing Computer code, computer code for configuring a first air path to acoustically couple the speaker assembly to an external environment via a first audio output port, and a second audio output port independent of the first audio output port, To physically place the first audio output port and the second audio output port so that at least the remaining audio output ports remain unblocked when one of the audio output ports is blocked by the object Lt; / RTI > During operation of the personal media device, the first air path and the second air path cooperatively communicate the audible sound produced by the speaker assembly to the external environment using the first and second audio ports.

In general, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion that interlocks with a corresponding portion of a non-conductive frame to thereby secure the antenna block to the non-conductive frame. The non-conductive frame is attached to the interior of the conductive housing, so that the non-conductive frame and the conductive housing form an integral structure. Then, the antenna plex is mechanically supported by the antenna block and electrically connected to the circuit board. The frame is designed to support a cover glass for a portable electronic device and can be attached to the housing. The permittivity of the antenna block is significantly lower than the permittivity of the frame. In one embodiment, the antenna block is made of COP (Cyclo Olefin Polymer), while the frame is made of glass-filled plastic. The resulting dielectric constant difference improves antenna performance in conjunction with differences in dielectric loss tangent as well as interlocking portions of the frame and antenna block.

In another embodiment, a method for assembling a portable electronic device is provided. In this embodiment, a conductive housing is provided. Then, the non-conductive frame is bonded to the inside of the conductive housing to form an integrated structure. The non-conductive frame is formed of a frame material having a first permittivity. Then, the antenna block is fixed to the frame by interlocking a part of the antenna block having the first shape and a part of the frame having the second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second permittivity that is significantly lower than the first permittivity. The antenna plexes are then supported by the antenna block.

In another embodiment, there is provided a computer readable medium having a computer code for attaching a non-conductive frame to the interior of a conductive housing to form an integrated structure, wherein the non-conductive frame is formed of a frame material having a first permittivity. This may include computer code for controlling the arms of the robot to adhere the non-conductive frame to the interior of the conductive housing. The computer readable medium may also include computer code for securing the antenna block to the frame by interlocking a portion of the antenna block having the first shape and a portion of the frame having the second shape corresponding to the first shape. This may include computer code for controlling the arms of the robot to perform interlocking. The computer readable medium may also include computer code for causing the antenna flex to be mechanically supported by the antenna block. This may include a computer code for controlling the automatic thread driver to secure the antenna feed to the antenna block and to the conductive bracket welded to the housing.

Other aspects and advantages will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS The illustrative embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.
Compact folding configuration for integrated circuit packaging
11A is a perspective view of a foldable memory device of a first pre-assembled configuration according to embodiments described.
11B is a perspective view of a foldable memory device of a second preassembled configuration according to the embodiments described.
11C is a perspective view of a flexible circuit connector for a foldable memory device according to embodiments described.
Figure 12 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) in an assembled configuration in accordance with the described embodiments.
13 illustrates a cross-sectional view of a portable computing device that includes a foldable memory device in accordance with the described embodiments.
Figure 14 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) in a preassembled configuration according to the embodiments described.
15A-15C illustrate perspective views of a foldable memory device coupled to a PCB according to embodiments described and attached to a metal frame using different attachment methods.
15D shows a perspective view of a foldable memory device coupled to a PCB according to the described embodiments, wherein the contacts associated with the foldable memory device are grounded using a conductive tape.
16 shows a perspective view of a foldable memory device coupled to a PCB in a preassembled configuration according to embodiments described.
17 is a flowchart of a method of assembling a portable computing device including a foldable memory device in accordance with the described embodiments.
18A shows a top view of a portable electronic device according to embodiments described.
18B shows a bottom view of a portable electronic device according to the embodiments described.
18C is a block diagram of a media player in accordance with the described embodiments.
Internal frame optimized for rigidity and heat transfer
21A shows a top view of a portable electronic device according to embodiments described.
21B shows a bottom view of the portable electronic device according to the embodiments described.
Figure 21C shows a block diagram of a portable electronic device in accordance with the described embodiments.
21D shows a cross-sectional view of a portable electronic device according to embodiments described.
22A and 22B show a top view and a bottom view of an inner frame according to the embodiments described.
22C shows a top view of the inner frame according to the embodiments described.
23A-23B show cross-sectional views of the inner frame according to the embodiments described.
24A-24B illustrate cross-sectional views of an inner frame thermally coupled to a plurality of device components in accordance with the described embodiments.
25 is a flow chart of a method of manufacturing a portable electronic device having an inner frame designed to have specific thermal structural characteristics according to the embodiments described.
26 is a block diagram of a portable computing device configured as a media player in accordance with the described embodiments.
Synthetic microphone boots to optimize sealing and mechanical properties
31A-31C illustrate perspective views of a microphone assembly including a microphone and a microphone boot in accordance with the described embodiments.
32A-32B show perspective views of a microphone assembly at different orientations within a housing of a portable computing device according to embodiments described.
33A-33B show side views of a microphone assembly at pre-installation and installation locations in a housing in accordance with the embodiments described.
33C shows a side view of the microphone assembly in the housing in response to an externally applied force.
Figures 34A-34D illustrate cross-sectional views and plan views of a synthetic microphone boot according to preferred embodiments.
35 is a flow diagram of a method for fabricating a portable computing device that includes a synthetic microphone boot in accordance with the preferred embodiments.
36A shows a top view of a portable electronic device according to embodiments described.
36B shows a bottom view of the portable electronic device according to the embodiments described.
Figure 36c is a block diagram of a media player according to the described embodiments.
Modular material antenna assembly
Figure 41 shows a perspective top view of an exemplary consumer product according to the described embodiments.
42 illustrates a perspective top view of a modular material antenna assembly in accordance with one embodiment.
43 illustrates a first cross-section of a modular material antenna assembly in accordance with one embodiment.
44 illustrates a second cross-section of a modular material antenna assembly in accordance with one embodiment.
45 shows an enlarged view of a planar perspective view of a modular material antenna assembly in accordance with one embodiment.
46 shows an alternative interlocking configuration according to one embodiment.
47 shows an alternative locking configuration according to another embodiment.
48 shows an alternative interlocking configuration according to one embodiment.
49 shows an alternative locking configuration according to another embodiment;
50 is a flow diagram illustrating a method for assembling a portable electronic device according to an embodiment.
51 is a block diagram of a portable consumer device in accordance with an embodiment of the present invention.
PCB formation
61A and 61B show a perspective view of a portable computing device and a block diagram of a portable computing device in accordance with the described embodiments.
62A, 62B and 62C show perspective and side views of the main warpable board in accordance with the described embodiments.
63A, 63B and 63C illustrate a perspective view, a plan view and a bottom view of a flexibly PCB according to the embodiments described.
64A-64C show plan views of a flexibly PCB in various flexural configurations.
Figures 65a-65e show side views of the flexiblable PCB in various flexural configurations.
66A shows a side cross-sectional view of a multi-layer PCB.
Figure 66b shows plan views of two trace layers in the multi-layer PCB of Figure 66a.
67 is a flowchart of a method of manufacturing a portable computing device using a multi-layer PCB.
68 is a block diagram of a portable computing device with media playback capability in accordance with the described embodiments.
Audio Porting with Connectors in Small Form Factor Electronics
71-72 are perspective views illustrating various views of a fully assembled personal media device in accordance with an embodiment of the present invention.
73 shows a cross-sectional view of a portable electronic device.
74 shows an enlarged view of a part of the housing shown in Fig. 72 shown in a front perspective view.
Figure 75 is a side view of a portion of the housing shown in Figure 5 highlighting the relationship between the output audio port and the sound reflective surface.
76 shows an internal view of a personal media device according to embodiments described.
77 shows a close-up view of the portion shown in Fig.
78 shows a cross-sectional view along line AA of FIG. 76;
79 shows another embodiment in which an audio jack is used to port an audible sound.
Figure 80 details the flow diagram illustrating the process according to the described embodiments.
81 is a block diagram of an arrangement of functional modules used by a portable media device.
82 is a block diagram of a media player suitable for use in the described embodiments.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the embodiments described may be practiced without some or all of these specific details. In other instances, the known process steps have not been described in detail in order not to unnecessarily obscure the underlying concepts.

Compact folding configuration for integrated circuit packaging

In the following drawings, a packaging design for using a plurality of memory chips, which can overcome the disadvantages described in the preceding paragraphs, is described. The packaging design may be referred to as a "foldable memory device ". The packaging design allows a memory device comprising a plurality of memory chips connected by a flexible circuit connector to be simply installed in a portable computing device. The flexible circuit connector can be used to provide data and / or power connections for the memory device and for RF shielding purposes. Using a flexible circuit connector instead of a separate metal shield for RF shielding helps to reduce the overall thickness profile of the memory unit and simplifies the assembly process since there is no need to install a separate metal RF shield.

These and other embodiments are described below with reference to Figures 11-18c. However, those skilled in the art will readily appreciate that the detailed description provided herein with respect to these drawings is for purposes of illustration only and should not be construed as limiting. Specifically, with reference to Figs. 11A-11C, a foldable memory device and its associated components in two different pre-assembled configurations are described. Next, a foldable memory device in the final assembled and installed configuration is described with reference to Figures 12 and 13. With reference to Figures 14 and 16, foldable memory device configurations that may occur during the assembly process before reaching the final configuration of the foldable memory device are described. Different folded memory device configurations can be obtained by folding or bending the flexible circuit connector portion of the foldable memory device at different locations.

With reference to Figures 15A-15D, different methods of grounding the flexible circuit connector portion of a foldable memory device are described. The flexible circuit connector may be grounded to be used as part of a Faraday crate enclosing the foldable memory device. A method of assembling a portable computing device including a foldable memory device is described with respect to FIG. A perspective view of a portable electronic device that may include a foldable memory device is described with reference to Figures 18a-18b. Finally, a block diagram of a portable media device that may include a foldable memory device is described in connection with FIG. 18C.

11A is a perspective view of a foldable memory device 1100 in a first pre-assembled configuration in accordance with the described embodiments. When installed, the foldable memory device 1100 may be used as part of a memory unit of a portable computing device. A foldable memory device such as 1100 may include two or more memory chips. Memory chips may be attached to a flexible circuit connector, such as 1112. In one embodiment, the memory chips may be flash memory NAND chips.

11A, two chips 1102 and 1104 are shown attached to the upper surface 1112a of the flexible circuit connector 1112. In Fig. 11C, the upper surface 1112a of the flexible circuit connector 1112 is shown without two chips attached thereto. A flexible circuit connector 1112 (also referred to as a "flex connector") may include traces to direct power to each of the chips, such as 1102 and 1104, and to enable data communication between the chips and other devices, such as the main logic board have.

In one embodiment, the flex connector 1112 may include components such as 1110 extending from the top surface 1112a. The components 1110 are disposed in the flap portion 1112f of the flexible connector. In certain embodiments, components 1110 may be part of a data interface that enables communication between a flex connector and a remote device, such as a power interface, that powers the main logic board and flex connector 1112.

Chips such as 1102 and 1104 may include data and power interfaces coupled to data and power interfaces on the flex connector 1112. [ In one embodiment, data and power interfaces (not shown) may be soldered to data and power interfaces (not shown) on the flex connector 1112. For example, the flex connector 1112 may include data and power interfaces on its top surface 1112a, where the corresponding interfaces on the bottom side of the chips, such as 1102 and 1104, may be soldered. In addition to soldering, other bonding mechanisms can be used to attach the chips to the top surface 1112a of the flex connector 1112. [ For example, a liquid adhesive or adhesive tape may be used to attach each of the chips 1102,1104 to the flex connector 1112 as well.

The flex 1112 may also include a number of shielding traces that enable the flex to act as part of a Faraday crate. The shielded traces may be coupled to connector pads, such as 1106. As described in more detail with respect to Figures 13, 14 and 15a-15c, the connector pads may be coupled to other conductive components to form a faraday box surrounding the chips when the chips are installed in a portable computing device, Taped or soldered. The Faraday box can prevent the RF signals generated from the chips from interfering with other components of the portable computing device. For example, the portable computing device may include an antenna, and the Faraday box may prevent RF signals generated from chips from reaching the antenna.

Chips such as 1102 and 1104 may be attached to the flex connector 1112 such that they are separated by a predetermined length of the flex connector, such as 1112c. The portion of the flex connector between the two chips may be referred to as a "separator ". The separating portion 1112c may warp and / or twist in different directions during installation of the foldable memory device to enable one or more different configurations of the foldable memory device. For example, the separating portion 1112c can be bent and / or twisted in one manner when the first chip is attached to the printed circuit board during the first mounting step, and then the top surface 1102a May be bent and / or twisted in a different manner when bonded to the top surface 1104a.

The distance 1105a between the chips can be selected so that the flex connector is wrapped around various components and / or adapted to different surfaces. For example, as shown in Figs. 13 and 14, the separation portion 1112c of the flex connector 1112 may be wrapped around the PCB board and the metal frame. In various embodiments, the distance 1105a can be adjusted to resolve discontinuities at the surrounding surface, e.g., component protrusion from the surface. For example, as shown in FIG. 14, the PCB board is at a different height relative to the metal frame. If desired, the separating portion 1112c can be bonded to these surfaces in a predetermined manner to conform to the intervening surfaces. In any case, the separator must conform to the intervening surfaces, and the topology of the intervening surfaces may affect the distance 1105a between the chips selected for use in a particular collapsible memory device design.

The width 1105b of the separating portion 1112c is shown approximately as the width of the chips 1102 and 1104. In various embodiments, the width 1105b may be greater or less than the width of the chips. For example, in one embodiment, the width 1105b of the separation portion 1112c between the chips can be narrowed to enable the separation portion to more easily twist or warp. In another embodiment, one or more openings may be disposed in the separating portion 1112c. When wrapped around the intervening surface, the opening can allow the component extending from the intervening surface to extend through the opening as opposed to the splicing component passing over the extended component. A separation portion 1112c designed in this manner may be more suitable for surfaces surrounding the elongated component.

The separation 1112c on the flex connector 1112 between the chips 1102 and 1104 allows the top surface 1102a of the chip 1102 to be aligned and bonded to the top surface 1104a of the chip 1104. In one embodiment, For example, along the line 1108. As shown in FIG. 11B, a perspective view of the flex connector 1112 including the chips 1102 and 1104 after folding is shown. 11B, the flex connector 1112 is folded up along the line 1108 to expose the bottom surface 1112b of the flex connector 1112. In Fig. In certain embodiments, the first and second chips may be the same size, and the two chips may be aligned directly on top of each other in a laminated configuration such that the corners of each chip are closely aligned. If desired, the two chips can be bonded together in this configuration. In Fig. 11B, the chips are shown in a configuration where they are not yet directly aligned, and additional alignment is necessary to align the chips directly.

In other embodiments, the flex connector may be folded and the chips may be aligned and bonded in an overlapping laminate configuration where the chips are not directly on top of each other. In this configuration, a part of the upper surface 1104a of the chip 1104 can protrude above the edge of the upper surface 1102a of the chip 1102. In other embodiments, chips 1102 and 1104 may have different sizes. In this embodiment, after folding, the chips can be stacked and aligned such that the smaller chips are centered on the larger chip. Centrifugal laminate alignment arrangements can also be used. For example, one or more outer edges of a smaller chip may be aligned with one or more outer edges of a larger chip.

12 shows a top view of a foldable memory device 1100 coupled to a printed circuit board (PCB) 1214 in an assembled configuration in accordance with the described embodiments. The foldable memory device 1100 may be a component of the assembly 1200. Assembly 1200 may include a PCB 1214 and a number of other components, such as a main logic board, which may be disposed under the shield lead (lid) 1206. Assembly 1200 may be attached to an enclosure of a portable computing device via a number of different attachment points, such as attachment points 1215. [

The flap portion 1112f of the foldable memory device 1100 may be attached to the shield lead 1206 and grounded. Flap portions 1112d and 1112e of foldable memory device 1100 may include connector pads. These portions can be folded upward to allow the connector pads to be grounded to a metal frame (see FIGS. 13 and 14) surrounding the foldable memory device 1100. As described above, at the time of grounding, the various parts of the flex connector and other metal components, such as the metal frame and shield lead 1206, may be part of a Faraday cage enclosing the chips.

The separator 1112c of the flex connector 1112 is shown folded in two places. The first fold is close to the bottom of the PCB 1214. The second fold is close to the height of the shield lead 1206. The separating portion 1112c is not formed to fit a small ledge of the PCB 1214 extending from the metal frame. Therefore, there may be a gap between the flex circuit and the metal frame. In other embodiments, the separating portion 1112c may be attached to the ridge, and thus the separating portion 1112c may be better fitted to the intervening surface.

13 shows a cross-sectional view of a portable computing device including a foldable memory device. The outer perimeter of the portable computing device may be formed by a cover glass 1216 and a housing 1208. Related circuits, such as a display 1218 and a display driver, may be disposed below the cover glass 1216. [ The assembly 1200 including the PCB 1214 and the foldable memory device 1100 may be disposed under the display circuitry. The assembly 1200 may be installed such that the top of the shield lead 1206 and the bottom surface 1112b of the flex connector 1112 face the inner surface of the housing 1208, respectively.

In the installed configuration of the foldable memory device, the first chip 1102 and the second chip 1104 are shown stacked on top of each other, and the first chip 1102 and the second chip 1104 have approximately the same size They are immediately aligned on top of each other. As described above, the first chip 1102 and the second chip 1104 can be shifted to the left or right with respect to each other if desired.

The flap portion 1112f of the flex connector 1112 may be attached to the shield lead 1206. [ The flap portion may include connector pads grounded to the shield lead 1206. The flap portion 1112e may be attached to the outer surface portion of the metal frame 1210 to ground the flex connector to the outer surface of the metal frame 1210. [ In other embodiments, the flap portion 1112e of the flex connector 1112 may be attached to the inner surface of the metal frame 1210 (see Fig. 15A).

The outer surface of the flex connector 1112 under the stacked chips is shown at a height slightly lower than the shield lead 1206 with respect to the height above the inner surface of the housing 1208. [ In other embodiments, the height of the stacked chips and the flex connector may be higher than the height of the shield. Further, the stacked chip configuration may include two or more chips, and is not limited to the two chips shown in Fig.

Typically, the shield lead used as part of the Faraday box may be formed of a conductive metal such as stainless steel. A flex connector such as 1112 may have a thickness of about 1/6 the thickness of a shield lead formed of stainless steel. Thus, using a flex connector instead of a metal shield can create additional space that can be used for other purposes in the packaging design. For example, the additional space may be used to increase the size of the battery used or to thicken the structure used to increase the stiffness of the device.

14 shows a top view of a foldable memory device coupled to a printed circuit board (PCB) 1214 in a preassembled configuration. In one embodiment of the mounting step, the first chip 1102 is disposed within the metal frame 1210 and can be coupled to the PCB 1214 via surface mount gluing. While the first chip is stuck to the PCB, a temporary fence 1224 can be provided in place on the first chip. While the first chip 1102 is attached to the PCB 1214, the detachment portion 1112c of the foldable memory device 1100 can be unfolded and disposed next to it, so that the foldable memory device can have a relatively flat configuration.

In one embodiment of the second installation step, after the first chip of the foldable memory device 1100 is secured to the PCB 1214, the separation portion 1112c of the foldable memory device 1100 is positioned on the side of the PCB 1214, Can be folded over the intervening surfaces comprised of the faces of the metal frame 1210, and therefore the chip 1104 and the flex connector portions associated therewith can be inverted. After being inverted, the flex components 1220 on the flap portion 1112f may be aligned to fit within each of the openings 1222 in the metal shield lead. In one embodiment, the flex components 1220 may be part of the data and power interfaces for the flex connector 1112. [

The foldable memory device may be configured such that when the flex components 1220 are aligned with the openings 1222, the two chips 1102 and 1104 are approximately aligned in a stacked configuration. A bonding agent such as a double-sided tape adhesive or a liquid adhesive may be applied to fix two chips in a laminated configuration as described above with reference to Figs. 12 and 13. Flap portions, such as 1112e, including connector pads, may then be grounded to other portions of the Faraday Cage, such as the face of the metal frame 1210. [ A number of different approaches may be applied to secure the connector pads on the flap portions of the flex connector 1112 to other portions of the Faraday crate. These approaches are described in connection with Figs. 15A-15C.

In one embodiment, the chips in the foldable memory device are stacked in a metal frame. In this configuration, the connector pads on the flap portions of the flex connector are attached to the metal frame to ground the flex connector and form a Faraday crate around the chips on the foldable memory device. 15A-15C illustrate perspective views of a foldable memory device coupled to a PCB according to embodiments described and attached to a metal frame using different attachment methods.

In Fig. 15A, connector pads, which may be formed from a conductive metal such as copper, may be disposed inside the metal frame 1210. Fig. The connector pads can then be soldered to the metal frame 1210 along the top edge 1226. [ In another embodiment, after the solder paste is applied to the connector pads, the connector pads and paste may be placed inside the metal frame. The metal frame can then be heated to melt the solder paste and bond the connector pads to the interior of the metal frame 1210. The solder paste may be disposed between the inside of the metal frame and the connector pads after the flap portion of the foldable memory device including the connector pads is disposed inside the metal frame.

15B, the flap portion 1228 of the foldable memory device may be folded over the outside of the metal frame, and a conductive adhesive, such as a conductive adhesive tape, may be applied to bond the connector pads to the outside of the metal frame. In this particular embodiment, Is applied. Pressure may be applied to the flap portion 1228 to ensure that a bond is formed. In another embodiment, solder paste may be applied between the outside of the metal frame and the connector pads 1228, as shown in Fig. 15C, and heat may be applied to solder the connector pads to the metal frame.

The foldable memory device may include a plurality of flap portions including metal connector pads. In some embodiments, one flap is disposed in a metal component, such as a metal frame, and may be bonded to the inside of the metal, while the other flap is folded over the outside of the metal component and the top of the shield lead, And may be bonded to the outside of the metal components, such as the outer portion. The connector pads may be disposed on the upper or lower surface of the flex connector depending on how the flexible connector is folded and depending on which surface (e.g., inner or outer surface) the connector pads are bonded to. As described above, the flap portions may be bonded to the surface using a conductive adhesive such as a conductive tape or a solder.

15D illustrates a foldable memory device 1240 coupled to the PCB, showing that the contacts (e.g., connector pads 1240) associated with the foldable memory device are grounded using the conductive tape 1230, in accordance with the described embodiments. Fig. In one embodiment, a flap portion such as 1112f on a flex connector of a foldable memory device includes connector pads 1240 on one side and components on the other side (components 1220 are shown in Fig. 14). In the embodiment illustrated in FIG. 14, the foldable memory device is folded up so that the components 1220 on the flap portion 1112f are sandwiched through the openings in the shield lead 1206. If the flap portion 1112f does not include components, the flap portion may be disposed on top of the shield lead to rest on top of the shield lead. In this embodiment, the connector pads may be disposed on the opposite flex connector to face the shield lead 1206.

As shown in Fig. 15A, 15B or 15C, when the flap portion is disposed on the shield lead, the connector pads can be exposed. Exposed connector pads 1240 may be covered with a conductive tape, such as 1230, such that the exposed connector pads are grounded to another component, such as the top of shield lead 1206, as shown in FIG. 15D. The connector pads 1240 may cause a portion of the flex connector on the foldable memory device to be used as part of the Faraday cage when it is earthed in this manner.

16 shows a perspective view of a foldable memory device coupled to a PCB in a preassembled configuration according to embodiments described. In this embodiment, the foldable memory device includes four chips 1202, 1203, 1204, and 1205 attached to a flex connector. The chips may have different sizes than the chips described above. For example, the chip may be thinner, such as about one-half the thickness of the chips described above, so that when the 1202, 1203, 1204, and 1205 are stacked on top of each other, And may have a height approximately equal to that of the laminated layer.

In one embodiment, a first chip, such as 1202 in a foldable memory device, may be attached to the PCB, such as 1214. Then, in one embodiment, the separation portion 1212d of the flex connector may be folded up and the chip 1203 may be bonded to the chip 1202. [ Then, the separator 1212e may be folded up, and the chip 1205 may be bonded to the chip 1204. These steps may be reversed, that is, after the chip 1205 is first bonded to the chip 1204, the chip 1203 may be bonded to the chip 1202.

After the chips 1202/1203 and 1204/1205 are bonded together the separation portion 1212c of the flex connector between the chips 1202 and 1204 is folded up and the chip stack 1204/1205 is bonded to the chip stack 1202 / 1203, respectively. The components 1220 on the flex connector on the bottom of the chip 1204 can be aligned so that the components fit through the openings 1222. [ The flap portions on the flex connector on the bottom surface of the chip 1204 can then be bonded and grounded to other metal components such as a metal frame and a shield lead, as described above, to form a Faraday crate around the stacked chips.

In another embodiment, folding of the foldable memory device may be performed in a different order (folding steps may vary depending on the foldable memory device configuration, these steps being provided for illustrative purposes only). For example, the separation portion 1212e of the flex connector may be folded up and the chip 1205 may be bonded to the chip 1204. [ Subsequently, the separating portion 1212c may be folded up and the chip stack 1204/1205 may be bonded to the chip 1202. The separator 1212d may then be folded up and the chip 1203 may be bonded to the chip stack 1202/1204/1205. In this embodiment, the flap portions of the flex connector may be disposed on the bottom of the chip 1203 rather than the chip 1204 as shown in Fig. The flap portions extending from the bottom of the chip 1203 may be bonded to other metal components such as the shield lead 1206 and the metal frame 1210 to form a Faraday crate around the stacked chips.

The above-described assembly steps using a foldable memory device may be implemented in the manufacture of a portable computing device. As an example, a method 1300 for assembling a portable computing device including a foldable memory device in accordance with the described embodiments is described with reference to FIG. At 1302, a plurality of memory chips, such as chips, may be connected to the flexible circuit connector. The flexible circuit connector may include power and data traces. Each of the chips can be connected to power and data traces on the flex connector so that power can be supplied to the chips and data can be moved to or from the chips through the data traces.

The chips may be used as part of a memory device on a portable computing device. At 1304, a first chip on the foldable memory device may be attached to the assembly to be installed in the portable computing device. For example, the assembly may include a printed circuit board, and the first chip may be attached to the printed circuit board. The assembly may be used to secure the foldable memory device in place during operation of the portable computing device. The assembly holding the foldable memory device may be already secured to the housing of the portable device or may be stuck during the subsequent assembly step.

In one embodiment, at 1306, the separating portion between the two chips can be folded over and the two chips can be aligned in a stacked configuration. At 1308, two chips may be bonded together in a stacked configuration. Generally, the folding steps may depend on how many chips are connected to each other, by the number of chips on the foldable memory device and through the separators of the flexible connector. The folding order can be influenced by whether or not part of the flexible connector is used as part of the Faraday box because the folding order is such that each chip is folded so that the proper connections used to ground the flex connector can be made. It may be necessary to finally arrange it at a predetermined position after the occurrence of the problem.

At 1310, the connector pads on the flexible circuit connector may be bonded to other metal components to form part of the Faraday crate. For example, as described above, the connector pads may be bonded to a metal frame surrounding the chips. Faraday boxes can be used to shield RF signals from leaking from the chips. For example, the portable computing device may include an antenna, and the chips may be surrounded by a Faraday crate to prevent RF signals generated from the chips from reaching the antenna. At 1312, when the foldable memory device surrounded by the Faraday cage is not part of an assembly already attached to the housing of the portable computing device, an assembly including a foldable memory device may be installed in the portable computing device.

In the above-described methods, one or more of the steps may be implemented by a processor in a computer assisted manufacturing process. For example, a processor may be programmed to cause the robotic device to install and fold the foldable memory device. As another example, a process can be programmed to cause the robotic device to couple chips to a flex connector or connector pads on a flex connector to other components.

18A and 18B illustrate a top view and a bottom view of a portable computing device 1400 in accordance with the described embodiments. The portable computing device may be suitable for holding in the hands of the user. A cover glass 1406 and a display 1404 can be disposed in the opening 1408 of the housing 1402. [ The cover glass may include an opening for an input mechanism such as an input button 1414. [ In one embodiment, input button 1414 may be used to return the portable computing device to a specific state, such as a home state.

Other input and output mechanisms may be arranged around the perimeter of the housing 1402. For example, a power switch such as 1410 may be placed at the upper edge of the housing, and a volume switch such as 1412 may be placed along one edge of the housing. An audio jack 1416 and a data / power connector interface for connecting headphones or other audio devices may be located at the lower edge of the housing. Housing 1402 also includes an aperture for camera 1415 that allows video data to be received.

18C is a block diagram of media player 1500 in accordance with the described embodiments. The media player 1500 includes a processor 1502 associated with a microprocessor or controller for controlling the overall operation of the media player 1500. The media player 1500 stores the media data associated with the media items in the file system 1504 or in the cache 1506. The file system 1504 is typically a storage disk or a plurality of disks. The file system typically provides mass storage capability for the media player 1500. However, since the access time to the file system 1504 is relatively expensive, the media player 1500 also includes a cache 1506. [ The cache 1506 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to the cache 1506 is substantially shorter than for the file system 1504. However, the cache 1506 does not have a large storage capability of the file system 1504.

In addition, the file system 1504 consumes more power than the cache 1506 upon activation. Power consumption is particularly important when the media player 1500 is a portable media player that is powered by a battery (not shown).

The media player 1500 also includes a user input device 1508 that allows a user of the media player 1500 to interact with the media player 1500. For example, the user input device 1508 may take various forms such as a button, a keypad, a dial, and the like. In addition, the media player 1500 includes a display 1510 (screen display) that can be controlled by the processor 1502 to display information to the user. The data bus 1511 may facilitate data transfer between at least the file system 1504, the cache 1506, the processor 1502 and the codec 1512.

In one embodiment, media player 1500 is responsible for storing a plurality of media items (e.g., songs) in file system 1504. When the user wishes the media player to play a particular media item, a list of available media items is displayed on the display 1510. The user may then use the user input device 1508 to select one of the available media items. Processor 1502 provides the coder / decoder (codec) 1512 with media data (e.g., an audio file) for a particular media item upon receipt of a selection of a particular media item. The codec 1512 then generates analog output signals for the speaker 1514. [ The speaker 1514 may be a speaker inside the media player 1500 or outside the media player 1500. For example, headphones or earphones connected to the media player 1500 may be considered external speakers.

Internal frame optimized for rigidity and heat transfer

The first factor that may be considered in the thermal structural design of thin, handheld electronic devices may be the placement of components associated with the user interface. After determining the external placement of the components, factors such as internal packaging, weight, strength and stiffness required to protect the device during expected operating conditions may be considered in connection with the design of the housing. Thermal problems such as the prevention of the occurrence of internal hot spots can then be considered. These design factors, when taken together, can affect each other. Thus, the design of the device may be an iterative process.

As an example of a thermal structural design process for a portable device, the device design is discussed in view of the factors described in the preceding paragraphs. Typically, the portable device may include a display. The display and input mechanism can generally be placed on one side of the device. If desired, a thin profile housing may be specified that encloses and seals all but the portion of the display that the user sees. The opposite side of the display may be primarily a structure associated with the housing, but may include openings for other input devices such as a camera.

Along the edges of the housing, various input / output mechanisms such as volume switches, power buttons, data and power connectors, audio jacks, and the like, may be deployed. The housing may include openings for receiving input / output mechanisms. The locations at which the input and output mechanisms are disposed may be selected to enhance the usability of the interface under the conditions intended for the device to operate. For example, in the case of a device intended to be operated by one hand, input mechanisms such as an audio control switch may be placed in a position where it is easily manipulated by a finger while the device is held in the palm of the hand. Output mechanisms such as audio jacks may also be placed at locations that do not interfere with the maintenance of the device, such as the upper edge of the device.

Once the components of the user interface are deployed, device components that are connected to the portable electronic device and enable the portable electronic device to operate for its intended functions may be packaged in the enclosure. Examples of internal device components may include a speaker, a microphone, a main logic board with a processor and memory, a non-volatile storage device, a data and power interface board, a display driver and a battery. As long as sufficient space is available for the necessary connectors between the components, certain flexibility may be provided in relation to the locations of the internal device components. In addition, approaches such as custom shape PCB or battery may be used to efficiently utilize the available interior space.

If the user interface is designed and the internal components are properly packaged in a small housing, thermal problems can be considered. Many internal components generate heat. Mechanisms may be required to dissipate and conduct heat internally to prevent the heat accumulating at certain locations and possibly damaging the internal components. The compact design of such devices leaves little room for convective cooling, i.e., space for air circulation within the device to dissipate heat. Therefore, other approaches may be needed to solve internal cooling problems.

One approach to solving the cooling problem may be to provide one or more structures configured to conduct heat from different internal locations within the device and to different internal locations. In addition to being used for cooling, these structures can be used to improve the structural characteristics of the device, such as an increase in overall stiffness of the device. In certain embodiments, inner frames designed to meet thermal and structural constraints associated with the design and operation of a portable electronic device are described. The inner frames may be configured to conduct and dissipate heat generated within the enclosure. In addition, the inner frames may be configured to increase the overall strength of the device.

The thermal structural design of these inner frames and their use in portable electronic devices are described below with reference to Figures 21A-26. It will be apparent, however, to one skilled in the art that the detailed description provided herein with respect to these drawings is for purposes of illustration only and is not to be construed as limiting. Specifically, the overall configuration of the portable electronic device will be described with reference to Figs. 21A to 21D. The apparatus may include an inner frame to be described having thermal conduction capabilities configured to meet thermal and structural constraints associated with the design and operation of the apparatus. 22A-22C, various embodiments of an inner frame are shown and described. 23A and 23B, the internal structures and materials associated with the inner frames are described. With reference to Figures 24A, 24B and 25, the combination of the inner frame and the related manufacturing methods for various device components are described. Finally, a portable computing device configured as a media player is described with respect to FIG.

21A and 21B show a top view and a side view of a portable electronic device 210 in accordance with the described embodiments. The device 210 may include a housing 2100 that surrounds the display 2104. The housing 2100 can be designed to have a relatively thin profile. The housing 2100 provides an opening 2108 in which the display 2104 is disposed. A cover glass 2106 is disposed on the display 2104. The cover glass 2106 aids sealing of the opening 2108. The device 210 may include a touch screen (not shown) associated with the display.

A significant proportion of the area of the top surface of the device 210 is occupied by the display 2104. This ratio can be smaller or larger if desired. In addition, the ratio of being dedicated to the display may vary from device to device. In some embodiments, the device 210 may not include a display.

As described above, the display 2104 may be a component in a user interface associated with the device 210. [ The user interface of the device 210 or other device components that contribute to the overall operation are distributed at various locations on the housing 2100 of the device 210. The placement of these components may affect the internal packaging, and thus the location of the heat generating components within the device.

As an example of an external arrangement of the device components, an input button 2114 is disposed on the front side. In one embodiment, input button 2114 may be used to receive an input indicating a request to return the device to a particular state, such as a "home" state. A volume switch 2112, which may be used to adjust the volume associated with various audio applications implemented on the device, may be disposed on one side of the housing 2100. [ A power switch 2110 is disposed on the upper side of the apparatus 210 and an opening for the audio jack and data / power connector is disposed on the lower side of the housing 2100 opposite to the upper side. The lower side of the housing 2100 includes an opening. A lens 2115 for a camera can be disposed in the opening.

FIG. 21C shows a block diagram of the device 210. FIG. A display 2104, a battery 2132, a touch screen 2122, a wireless communication interface 2126, a display controller 2120, audio components 2124 (e.g., speakers) Gt; 2105 < / RTI > The device 210 may include other components (not shown), such as a SIM card, a microphone, and a non-volatile memory, and is not limited to the components shown in FIG. 21C. The MLB 2105 may include a processor and a memory. The processor and memory may execute various programming instructions to cause the device to perform various functions. The user interface described above may be considered to allow the user to select and adjust various functions available on the device 210. [ In certain embodiments, these functions may be provided as user selectable application programs stored on the device.

21D shows a cross-sectional view of a portable electronic device 210 in accordance with the described embodiments. An enclosure may be formed from the upper glass 2106 and the housing 2100. [ Other enclosure configurations are possible, and the illustrated embodiments are not limited to this example. As shown in FIG. 21D, the housing 2100 can provide a cavity that is covered by the top glass 2106. The housing 2100 may include an outer surface and an inner surface, and the inner surface contour profile 2117 may be different from the outer profile of the housing 2100.

Within the enclosure, such as the enclosure, including the top glass 2106 and the housing 2100, various internal devices, such as device components associated with the user interface, that enable the device 210 to operate for its intended functions Components are packaged. For purposes of illustration, internal device components may be considered to be arranged in a plurality of stacked layers. The height of each of the stacked layers may be specified in relation to the overall thickness 2136 of the device. For example, the height of the center of the upper glass 2106 may be designated as a first ratio of the total thickness 2136, and the height of the battery 2132 may be designated as the second ratio of the total thickness 2136.

The display screen of the display 2104 may be disposed directly below the upper glass 2106. [ In one embodiment, the display screen and associated display driver circuitry may be packaged together as part of the display 2104. Under the display 2104, a device circuit 2130, such as a main logic board or circuitry associated with other components, and a battery 2132, which powers the device 210, may be located.

As described above and as shown in FIG. 21D, the internal components may be packed tightly, leaving little room for the passageways, which allows cooling through the air circulation to be effective for internal components that generate heat. Another approach to solving the internal heat problem that can be used with or instead of convective air cooling is to place the thermally conductive material near the heating source. The thermally conductive material can absorb heat from an internal heat source, such as a heat generating internal device component during operation of the device, and conduct it elsewhere to lower the temperature near the heat source.

In one embodiment, the thermally conductive material may be contained within an internal structure associated with the device 210, such as an inner frame 2140. An inner frame 2140, described in greater detail with respect to the Figures below, can be configured to conduct heat from one or more device components to another and to increase the overall strength of the device. For example, the inner frame 2140 can be configured to increase the overall stiffness of the device 210, such as the ability to withstand the bending moments experienced by the housing 2100.

21D, the inner frame 2140 is disposed at a height below the display 2104 and above the device circuit 2130. [ The inner frame 2140 may be placed in this position to direct heat generated by the display circuit away. Also, one or more heat sources associated with the device circuitry 2130 may be placed near the inner frame 2140 such that heat from these components can be conducted into the inner frame 2140 and away from the heat source.

Other packaging configurations are possible. Thus, in other embodiments, the inner frame 2140 may be disposed at different heights relative to the overall thickness 2136 of the device, and may also be disposed adjacent to different device components. Also, an apparatus such as 210 may include multiple frames, such as 2140, and the embodiments described are not limited to the use of a single inner frame 2140.

In one embodiment, the inner frame 2140 can be used as an attachment point for other device components. For example, the inner frame 2140 may be attached to the mounting surface, such as 2134a and 2134b, on the housing 2100 via fasteners or using a bonding agent. Other device components, such as the display 2104, may then be coupled to the inner frame 2140 rather than being coupled directly to the housing 2100. One advantage of coupling the display 2104 to the housing through the inner frame 2140 is that the display can be somewhat isolated from the bending moment associated with the housing 2100, i.e., the bending moment generated on the housing, RTI ID = 0.0 > 2140 < / RTI > Isolating the display 2104 from the bending moments associated with the housing 2100 can prevent the occurrence of damage to the display 2104, such as cracks.

Figures 22A and 22B show a top view 2142a and a bottom view 2142b of the inner frame 2140 in accordance with the described embodiments. In one embodiment, the inner frame may be formed as a multi-layer sheet, such as a sheet comprising a plurality of metal layers (see Figures 23a and 23b for a cross-section of the inner frame 2140 comprising different layers of the inner frame ). In certain embodiments, the inner frame 2140 may be formed with an intermediate layer of a first material inserted between two outer layers of a second material. The materials used for the intermediate and outer layers may be selected for their thermal and / or strength properties such as thermal conductivity.

In one embodiment, the first material used for the intermediate layer may be selected primarily for its thermal properties, while the second material used for the outer layers may be selected primarily for its strength properties. As an example, an intermediate layer of copper may be inserted between two layers of stainless steel, such as Iconel ^TM . The thermal conductivity of copper is about 25 times greater than Iconel ^TM , whereas stainless steel is much stronger than warpage, which is very flexible. In one embodiment, the intermediate layer may comprise about 50% of the inner frame thickness, and the outer layers may each comprise about 25% of the inner frame thickness. When the middle layer is copper and the outer layers are stainless steel, this configuration maintains about 94% of the stiffness of the inner frame of the same thickness made only from stainless steel.

Other material combinations are possible, and the embodiments described herein are not limited to a combination of copper and stainless steel. Other metal combinations, such as, for example, aluminum and stainless steel, may also be used. In addition, non-metallic and metallic materials or different types of non-metallic materials can be combined to form an inner frame, such as 2140.

In certain embodiments, an inner frame such as 2140 having a copper layer interposed between two stainless steel layers may be formed using a cladding process. In one implementation of the cladding process, a sheet of copper can be compressed at high pressure between two sheets of stainless steel to bond sheets. As an example, the sheets can be squeezed at high pressure between the two rollers as part of the cladding process. Sheets formed through the cladding process can be cut to form the inner frame 2140 shown in the figures.

In metallurgy, cladding is bonding different metals together. This is different from welding or bonding, which is a way of fastening metals together. Cladding can often be accomplished by injection molding two metals through a die, as well as pressing or rolling the sheets together under high pressure. The cladding process bonds the metals together "metallurgically" to produce a continuous strip that can be annealed, rolled and slitted to meet very exacting electrical, thermal and / or mechanical end use requirements. Cladding inlay or overlay may be provided on one or both base metal surfaces having precious metal or non-precious metal combinations.

Generally, a cladding can refer to a deposition process in which one metal is coated with another metal or the substrate material, which may be a non-metal, is coated with another metal. In some cladding processes, the metal may be melted on the substrate through a laser cladding process or the like. Thus, the embodiments described herein are not limited to a cladding process in which metal sheets are joined together under high pressure through a roller or the like.

In an inner frame, such as 2140, where the intermediate conductive layer is sandwiched between two outer layers having a much lower thermal conductivity, the outer layers may comprise one or more openings exposing the intermediate conductive layer. The openings may be provided to allow for better thermal coupling between the intermediate conductive layers and the heat generating component. In certain embodiments, the surface of the heat generating component can be thermally coupled to the intermediate conductive layer through a soldering material or through a thermally conductive tape. In computer applications, double-sided thermally conductive tapes are often used to connect heat sinks to components such as processors. In the embodiments described herein, a double-sided thermally conductive tape or soldering material may be used to bond the surface of the heat generating component to the inner frame 2140 and thus thermally connect.

On the inner frame 2140, the positions of the openings can be selected to be close to the heat generating components in the portable device. A plurality of openings 2150a-f are shown in the upper portion 2142a and the lower portion 2142b of the inner frame 2140. [ As shown, the open positions may be different from the upper portion 2142a of the inner frame 2140 to the lower portion 2142b. As shown in Figs. 22A and 22B, the open positions of the upper portion 2142a are at different positions from the lower portion 2142b. In addition, there are more openings in the upper portion 2142a than in the lower portion 2142b of the inner frame 2140.

In general, the locations of the openings in the outer layer of the inner frame 2140 may vary from device to device depending on the thermal packaging components used in each device and the underlying packaging scheme selected for each device. In one embodiment, the openings may be disposed only on one side of the inner frame, e.g., on the upper side or the lower side only. In other embodiments, the outer layers may be thermally conductive and the intermediate layer may be provided for strength, such as stainless steel inserted between two copper layers. In this example, the openings in the outer layer are not necessarily for thermal connection purposes, since the surface of the heat generating source can be directly bonded to the thermally conductive outer layers.

22C shows a top view of the inner frame 2160 according to the embodiments described. In one embodiment, the inner frame 2160 may include one or more openings, such as 2162, completely passing through the inner frame 2160. One or more openings may be used to place a component, such as a connector, through the inner frame 2160. In addition, openings that completely pass through the frame 2160 can be provided for fastening the inner frame 2160 to other components, such as the device housing 2100 described in connection with FIGS. 21A, 21B, and 21D.

As described above in connection with FIGS. 22A and 22B, the inner frame 2160 may include one or more openings in its outer layers that expose a rigid intermediate layer. In one embodiment, the openings may be filled with the same or different material as the material used for the intermediate layer. Opening 2150a is an example of a filled opening. In other embodiments, the openings may not be filled, and thus some recess or cavity is possible, wherein an opening is provided to expose the intermediate conductive layer. The opening 2164 is an example of an opening in the outer layer of the inner frame 2160 that forms the cavity.

In one embodiment, an elevated thermal connector such as 2166 may be provided. The raised thermal connector 2166 may be formed of a thermally conductive material such as copper. The raised thermal connector 2166 can be used to thermally couple a heat source disposed at a predetermined height above the inner frame 2160 to a conductive layer of an inner frame, such as an intermediate layer. The raised thermal connector can be used when a heat generating component that is too large to use direct soldering to provide thermal connection is located at a predetermined distance above the connector. In one embodiment, the raised thermal connector 2166 can be thermally insulated through an outer insulating layer, such as 2168.

In certain embodiments, the raised thermal connector 2166 may be coupled thereto after the inner frame 2160 is formed. For example, the raised thermal connector 2166 may be soldered or taped onto the inner frame 2160. In one embodiment, when openings are provided in the outer layers to expose the thermally conductive intermediate layer, an elevated thermal connector 2166 is provided in one of these locations to expose the surface of the heat- Lt; RTI ID = 0.0 > layer. ≪ / RTI > An example of an elevated thermal connector disposed in this example is also described with respect to Figure 4b.

23A-23B illustrate cross-sectional views of an inner frame, such as a cross-section, that may be used in an inner frame such as 2150 or 2160 (inner frames 2150 and 2160 are described in connection with FIGS. 22A-22C). 23A, a cross section including three layers is shown. The three layers include outer layers 2170a and 2170b and an intermediate layer 2172 disposed between the two outer layers.

The thickness of each of the intermediate and outer layers may be different. In one embodiment, the thickness of each of the outer layers may be approximately the same. In another embodiment, the thickness of each of the outer layers may be different. The thickness of the intermediate layer may be the same or different from the thickness of each of the two outer layers. In certain embodiments, the thickness of each of the two outer layers may be approximately the same, and the combined thickness of the two outer layers is approximately equal to the thickness of the intermediate layer.

The thickness of each layer may be varied to adjust the strength, weight and / or thermal properties of the inner frame. For example, the stainless steel layer may be made thicker to increase the overall strength of the inner frame. In another example, the copper layer may be made thicker to increase the thermal mass of the inner frame.

A first opening 2171a may be provided in the upper outer layer 2170a and a second opening 2171b may be provided in the lower outer layer 2170b. The opening 2171a in the upper outer layer 2170a is shown as unfilled and thus a small cavity is formed in proximity to the opening. The opening 2171b in the outer layer 2170b is shown filled with the same material as the middle layer. Some methods for filling openings such as 2171b are described in the following paragraphs.

In one embodiment, the openings 2171b may be wholly or partially filled during the cladding process. For example, the outer and intermediate layers may be sufficiently compressed together so that a portion of the intermediate layer projects through the opening. In other embodiments, the openings may be filled after the cladding process. The openings may be filled with the same or different material as the material of the intermediate layer. For example, the cavity formed from the opening may be filled with a soldering material provided to thermally couple the intermediate layer 2172 to the surface of the heat generating component. As another example, the inner frame may be submersed in another material to fill one or more of the openings.

Figure 23B shows another embodiment of a cross-section that can be used in an inner frame. In this embodiment, an intermediate layer 2172 is inserted between the two outer layers 2170a, 2170b. However, a portion of the intermediate layer 2172 is somewhat thermally isolated from other portions of the intermediate layer. Thermal isolation is illustrated by material 2173 extending from top layer 2170a to 2170b.

In some embodiments, it may be desirable to reduce the heat transfer rate between one portion of the inner frame and the other portion of the inner frame. This can be achieved by placing a material having a lower conductivity between two portions of the thermally conductive intermediate layer. For example, intermediate layer 2172 can be formed from two or more individual material strips inserted between sheets comprising outer layers. During the cladding process, within the gap between the strips, the outer layers can be squeezed together to connect the upper and lower layers and provide a reduced heat transfer rate between portions of the intermediate layer 2172. [ A similar process as described in the previous paragraph can be used to thermally couple the two layers. For example, in FIG. 23B, when the top layers are a thermally conductive material such as copper and the intermediate layer is a material of lower conductivity such as stainless steel formed of individual strips, during the cladding process, Can be pressed together through the gaps in the steel strips to thermally couple the upper and lower copper layers.

24A-24B illustrate cross-sectional views of an inner frame thermally coupled to a plurality of device components in accordance with the described embodiments. The normal direction of heat transfer into the intermediate layer is indicated by the arrows. In Figure 24a, different device components are shown connected to a cross section of the inner frame shown in Figure 23a. In this example, the intermediate layer 2172 of the inner frame may be formed of a thermally conductive material such as copper, while the outer layers may be formed of a material stronger than copper, such as stainless steel. Openings are provided in the outer layers to expose the intermediate layer so that a better thermal connection can be formed between the intermediate layer and the surfaces of the heat generating components proximate each opening.

In Fig. 24A, a controller circuit 2186 may be disposed on top layer 2170a. For example, the controller circuit 2186 may be a display circuit as described in connection with Figure 21D. A PCB 2180 may be disposed under the inner frame. PCB 2180 may include a number of components such as 2182a and 2182b. In one embodiment, the PCB may be a main logic board including a processor and a memory.

An opening 2171a in the outer layer 2170a may be disposed below the high temperature heating area 2188 associated with the controller circuit 2186. [ The opening 2171a is not filled. A thermal bridge 2184b, such as a soldering material, may be used to provide thermal connection between the surface of the device circuit 2186 and the intermediate layer 2172. [ The use of a thermal bridge such as 2184b may be desirable because the air gap between the hot heating region and the thermal bridge can act as an insulator to prevent conduction of heat into the intermediate layer. Leaving the cavity in which the thermal bridge can be placed can cause the controller circuit to be placed closer to the inner frame because no additional space is needed for the thermal bridge between the inner frame and the surface of the controller circuit. During operation, heat generated in the high temperature heating region 2188 may be conducted into the intermediate layer 2172 and away from the high temperature heating region 2188. Thus, the temperature near the high temperature heating zone can be reduced through the inner frame.

The opening 2171b in the outer layer 2170b is filled. A thermal bridge 2184a is provided between the surface of the PCB component 2182a and the middle layer 2172. [ Thermal bridge 2184a can increase the space between PCB component 2182a and the inner frame because opening 2171b is filled and does not provide a cavity through which thermal bridge can be placed. In one embodiment, thermal bridge 2184a may be a thermally conductive adhesive, such as a double-sided adhesive tape.

When thermal bridge 2184a is used near an opening such as 2171b, thermal bridge 2184a may be larger or smaller than the area of the opening. In the example of Figure 24A, the thermal bridge is shown as being larger than opening 2171b. The area of the thermal bridge, such as 2184a, can be selected to ensure that the proper bond is maintained during operation of the device.

As shown in FIG. 24A, only certain components of the PCB, such as the components that generate the most heat, can be thermally coupled to the inner frame, while the less hot components may not be thermally coupled to the inner frame. To illustrate this point, the PCB component 2182a is shown as being thermally connected to the inner frame, while the PCB component 2182b is shown as not being thermally connected to the inner frame. Depending on the design of a particular board and the number of components associated therewith, one or more components associated with the board may be thermally coupled to the inner frame.

24B, a cross-sectional view of device components thermally coupled to an inner frame is shown. In the cross section shown in Figure 24B, the top layer 2170a of the inner frame includes two openings exposing the thermally conductive intermediate layer 2172. [ The lower layer 2170b does not include any openings in this cross-section. On top layer 2170a, one of the openings near the column bridge 2194 is filled, while the other of the openings near the column bridge 2196 is not filled. A PCB 2190 including a PCB component 2192 is disposed on the inner frame. It is shown that other device components 2195 not associated with the PCB 2190 are disposed on the PCB 2190.

The PCB board is oriented so that the heat generating surface of the PCB component faces the inner frame. When a thermally conductive inner frame is used, the orientation / position of other internal components such as the PCB can be adjusted so that the surfaces associated with the thermally generated components can be thermally coupled to the inner frame. In addition, the requirement to facilitate the thermal connection between the device components on the PCB and the inner frame can also be a factor in the PCB design, i.e. the device components can be arranged on the PCB for easy thermal connection.

24B, the surface of the PCB component 2192, which is a thermally generated component, is shown thermally connected to the middle layer 2172 of the inner frame through a thermal bridge 2194. [ In addition, the surface of the component 2195, which is also a thermally generated component, is shown connected to the intermediate layer 2172 of the inner frame through a thermal connector 2198. [ The thermal connector 2198 is coupled to the surface of the intermediate layer 2172 and the device component 2195 via thermal bridges 2196. As discussed above in connection with FIG. 22C, the thermal connector 2198 may include an outer heat insulating layer surrounding the thermally conductive core. In this example, thermal connector 2198 is shown extending over the level of PCB 2190 to heat generating component 2195.

25 is a flow diagram of a method 2200 of manufacturing a portable electronic device having an inner frame designed to have particular thermal structural characteristics in accordance with the described embodiments. At 2202, an inner frame comprising a plurality of material layers can be constructed. The configuration process may include selecting the number of layers, the thickness of each layer, and the desired strength and thermal properties for each layer. The required strength and thermal properties for each layer can affect the material selected for each layer.

In embodiments where the layer selected for thermal properties is inserted between two outer layers selected to add strength to the inner frame, one or more openings may be formed in the outer layers. These openings may be provided to allow for better thermal coupling between the intermediate layer of the inner frame and the heat generating surface of the inner device component. At 2202, the arrangement of these openings can be determined.

At 2204, an inner frame with selected aperture positions, column and intensity properties may be generated. In one embodiment, the inner frame may be formed using a cladding process. At 2206, during the assembly process for the electronic device, the surfaces associated with the heat generating components in the electronic device may be thermally coupled to the inner frame. At 2208, the inner frame may be mechanically coupled to the housing of the electronic device. At 2210, one or more device components may be mechanically coupled to the inner frame.

26 is a block diagram of a media player 2300 in accordance with the described embodiments. The media player 2300 includes a processor 2302 associated with a microprocessor or controller for controlling the overall operation of the media player 2300. Media player 2300 stores media data associated with media items in file system 2304 and cache 2306. The file system 2304 is typically a storage disk or a plurality of disks. The file system typically provides mass storage capability for the media player 2300. However, since the access time to the file system 2304 is relatively slow, the media player 2300 also includes a cache 2306. [ The cache 2306 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to cache 2306 is substantially shorter than for file system 2304. [ However, the cache 2306 does not have a large storage capacity of the file system 2304.

In addition, the file system 2304 consumes more power than the cache 2306 upon activation. Power consumption is particularly important when the media player 2300 is a portable media player that is powered by a battery (not shown).

The media player 2300 also includes a user input device 2308 that allows a user of the media player 2300 to interact with the media player 2300. For example, the user input device 2308 may take various forms such as a button, a keypad, a dial, and the like. The media player 2300 also includes a display 2310 (screen display) that can be controlled by the processor 2302 to display information to the user. The data bus 2311 may facilitate data transfer between at least the file system 2304, the cache 2306, the processor 2302 and the codec 2312. [

In one embodiment, media player 2300 is responsible for storing a plurality of media items (e.g., songs) in file system 2304. When the user wants the media player to play a particular media item, a list of available media items is displayed on the display 2310. The user may then use the user input device 2308 to select one of the available media items. Processor 2302 provides the coder / decoder (CODEC) 2312 with media data (e.g., an audio file) for a particular media item upon receipt of a selection of a particular media item. The codec 2312 then generates analog output signals for the speaker 2314. The speaker 2314 may be a speaker inside the media player 2300 or outside the media player 2300. For example, headphones or earphones connected to the media player 2300 may be considered external speakers.

In some embodiments, a device component, such as a display, may be mechanically and thermally coupled to an inner frame. In other embodiments, the device components are mechanically connected to the inner frame, but may not be thermally connected. In still other embodiments, the device components are thermally connected to the inner frame and mechanically secured to the housing via other structural components.

In certain embodiments, the portable computing device may be assembled using a computer assisted manufacturing and assembly process. The computer assisted fabrication and assembly process may involve the use of multiple devices, such as multiple devices configured in an assembly line configuration. For example, the computer-assisted machine may be configured to form openings at different locations by removing material after the cladding process or by forming openings in the sheets prior to the cladding process. As another example, the robotic device may be configured to thermally couple the heat generating component to the inner frame, such as through a soldering process.

Synthetic microphones for optimizing sealing and mechanical properties Boot

In consumer electronic devices, such as portable computing devices, sound recording capabilities are very common. Thus, devices may typically include a microphone of some type. Often, microphones can be used in voice applications such as digital telephony, voice over IP (VoIP) and voice memo. In addition, a microphone can be used in video recording applications that simultaneously record video images and sounds.

The microphone may be located inside the electronic device. For example, in a portable computing device having a housing, an internal microphone configured to receive sound through an opening in the housing may be provided. There may be a distance between the inner microphone and the opening. Thus, a microphone boot can be used to provide a hollow tube between the opening and the inner microphone.

In a portable computing device, it may be desirable to prevent sound that is created inside or passes through the interior from mixing with sound from an external source that has entered the microphone boot through the opening in the housing. For example, if the device includes an internal speaker, it may be desirable to prevent the internally generated sound from the speaker from overwriting the externally generated sound received by the microphone via the microphone boot. In addition, methods such as echo cancellation can be used more easily when the externally generated sound entering the microphone boots is acoustically isolated from other sound sources. In telephony, echo cancellation refers to the process of removing echoes from voice communications to improve the quality of the phone conversation. The application of echo cancellation may require knowledge of the acoustic environment, such as the acoustic environment within the microphone boot, which is easier to determine when the microphone boot is acoustically isolated.

The interior of the microphone boot can be acoustically isolated by forming a microphone boot with a relatively soundproof material and by providing a good airtight seal at both ends of the microphone boot. Seal integrity may be affected by the materials or materials used to form the microphone boot and by the approach used to secure the microphone boot. For example, the microphone boot may be secured in a manner that maintains pressure on the seal, which helps to maintain seal integrity of the seal at each end of the microphone boot.

Seal integrity can be affected by the relative hardness of the material used to form the microphone boot. The advantage of the harder material is that it can provide a good platform for forming a seal at each end of the microphone boot. A disadvantage of harder materials is that the externally generated forces, such as those generated when the device is dropped, can be more easily transmitted to the interior of the device. If the force transmitted by the microphone boot is too large, the internal components of the portable computing device may be damaged. In light of the above, designs for microphone boots that utilize improved sealing qualities that harder materials can provide while addressing shock transfer characteristics associated with use of tighter materials are described below.

More specifically, referring to FIGS. 31A-36C, synthetic microphone boots are described that can use the more rigid materials selected for the sealing qualities and the more flexible materials selected for shock absorption qualities. However, those skilled in the art will readily recognize that the detailed description provided herein with respect to these drawings is provided for purposes of illustration only and is not to be construed as limiting. In particular, embodiments of a synthetic microphone boot utilizing a combination of a harder material and a more flexible material are described with reference to Figures 31a-31c. Referring to Figures 32A-32B, some examples of installation locations of a synthetic microphone boot incorporated as part of a microphone assembly are described. 33A-33B, a microphone assembly at pre-installation and installation locations is shown. During installation, the microphone boot can be secured in a compressed manner, which can improve seal integrity. The transfer of external force through the microphone boot during operation is described with reference to Figure 33C. 34A-34C, different embodiments of the synthetic microphone boot, including dimensions and materials, are described. A method of fabricating a portable computing device including a synthetic microphone boot is described with respect to FIG. Finally, with reference to Figures 36A-36C, a perspective view and block diagram of a portable computing device that may include a synthetic microphone boot is described.

FIGS. 31A-31C illustrate perspective views of a microphone assembly 3100 including a microphone 3106, a circuit board 3104, and a microphone boot such as 3102a, 3102b, and 3102c. Microphone 3106 is shown coupled to circuit board 3104. In certain embodiments, the circuit board may be formed of a rigid or flexible substrate. A microphone boot, such as 3102a, 3102b, and 3102c, may include surfaces surrounding cavity 3112. [ Cavity 3112 can act as a cathode. For example, and as described in greater detail above and in connection with FIGS. 32A and 32B, in a portable computing device, the cavity 3112 may be acoustically coupled to an opening in the housing, It can act as a sound tube of the inner micro for the sound produced.

The microphone boot may include an inner profile and an outer profile. The inner profile provides boundaries for inner cavity 3110a. As shown in Fig. 31A, the microphone boot 3102a has a cylinder shape. In this example, the outer profile 3108a and the inner profile 3110a are described approximately as two concentric cylinders. The upper surface 3111 and lower surface of the microphone boot 3102a are approximately flat.

The inner profile and outer profile of the microphone boot need not be formed in concentric shapes. In general, the inner and outer profiles may be different from each other, and each of them may have any shape, and the shape thereof may vary from top to bottom. For example, cavity 3112 may be wider at the top and narrower at the bottom. In addition, cavity 3112 may have a shape at the top and other shapes at the bottom. In addition, in certain embodiments, cavity 3112 may follow a curved path through the interior of the microphone boot.

As an example, FIG. 31B shows a microphone boot 3102b with different outer and inner profiles. The microphone boot 3102b includes a cylinder shaped inner surface profile 3110b and a rectangular outer surface profile 3108b. In another example, the profile may be reversed, so that the inner profile 3110b is rectangular and the outer profile 3108b is cylindrical. Like the example shown in Fig. 31A, the upper surface 3111 and the lower surface of the microphone boot are all flat.

In various embodiments, one or both of the top and bottom surfaces of the microphone boot may be curved. As an example, FIG. 31C shows a microphone boot 3102c including an upper curved surface 3111a and a lower plane. The microphone boot 3102c includes a rectangular profile 3110c and a rectangular profile 3108c.

In some embodiments, the top surface of the microphone boot, such as 3111a, may be bonded to the inner surface of the housing of the device. In order to improve seal integrity, it may be advantageous to form the top surface such that the curvature of the top surface, such as 3111a, is somewhat coincident with the curvature of the inner surface of the housing. For example, bending the top surface to match the inner surface of the housing can make the pressure on the top surface more uniform, which can improve seal integrity. In other embodiments, a microphone boot having an upper plane may be bonded to the inner curve, or a microphone boot having an upper curve may be bonded to the inner plane. In this embodiment, the upper plane or curved surface of the microphone boot can be formed to coincide with the inner surface by using compressive force, i. E. Compressing the microphone boot.

31A-31C illustrate that the top surface of the microphone 3106 is shown as flat, and the microphone boot with the bottom plane is shown bonded to the top plane of the microphone. In other embodiments, the top surface of the microphone 3106 may be inclined or curved, and if desired, the bottom surface of the microphone boot, such as 3102a, 3102b, and 3102c, may be inclined to some extent to match the top surface of the microphone. As described above, the formation of the microphone boot in this manner can improve the seal integrity between the lower surface of the microphone boot and the upper surface of the microphone.

In other embodiments, the lower surface of the microphone boot and the upper surface of the microphone may be formed differently. For example, the upper surface of the microphone may be bent, and the lower surface of the microphone boot may be flat. The lower portion of the microphone boot may be formed of a compressible material so that when the lower plane of the microphone boot is pressed toward the curved surface of the microphone, the lower plane of the microphone boot coincides with the upper curved surface of the microphone.

As described above, the microphone assembly can be installed inside a device such as a portable computer device. The microphone assembly and associated microphone boots may be arranged to align with the openings in the housing and to provide a bore between the openings and the microphone. The apertures may be disposed at various locations on the outer surface of the device. The arrangement of the openings can affect the placement and orientation of the microphone boot. Two examples of microphone assemblies in different orientations within a portable computing device are described below with respect to Figures 32a and 32b.

32A and 32B, a microphone assembly including a microphone 3106, a circuit board 3104, and a microphone boot 3102 is shown disposed within the housing 3120 for a portable computing device. The housing 3120 is approximately rectangular. The outer surface of the housing 3120 includes an outer profile 3120a and an inner profile 3120b. The outer profile 3120a and inner profile 3120b may be formed differently. For example, the outer surface 3120a can be flat in one region, but the corresponding interior can be bent. The inner shape close to the microphone boot can affect the seal integrity of the seal between the microphone boot and the inner surface. As discussed above, in some embodiments, the top surface of the microphone boot may be shaped to conform to the shape of the inner surface of the housing to improve seal integrity. Seal integrity may be important because a good airtight seal can help acoustically isolate the tubing inside the microphone boot.

In Figure 32a, the microphone boot 3102 is shown as oriented up, and the cavities in the microphone boot are aligned from the top to the bottom of the housing along the 'H' axis. In this embodiment, an upper cover, such as a cover glass, may be placed over the opening of the housing 3120. One embodiment of a portable computing device including a housing having a cover glass is shown in Figure 36A. The top cover may include an opening. During installation, the microphone assembly may be positioned within the housing such that the top surface of the microphone boot is aligned with where the opening in the top cover is at its mounting position. Then, when the upper cover is installed, the lower surface of the upper cover is bonded to the upper surface of the microphone boot, and a microphone can be formed between the opening in the upper cover and the microphone through the microphone boot.

In another embodiment, a housing such as 3120 may include an opening 3122 for a microphone, such as 3106. [ 32B, the housing 3120 is shown having an opening 3122 in its side near the corner. The microphone 3106 and the circuit board 3104 are shown as being arranged such that the top surface of the microphone and the circuit board are approximately parallel to the sides with openings and the openings in the microphone boot 3102 are aligned with the openings. The sound tube associated with the microphone boot is approximately aligned with the 'W' axis.

Other orientations of the microphone assembly and microphone boot are possible and are not limited to the orientations shown in Figures 32A and 32B. For example, in one embodiment, the top surface of the microphone boot 3102 may be bonded to the inner surface of the housing near the opening 3122 to form a tinplate. The orientation of the circuit board and microphone can then be adjusted so that the microphone boot and its internal conduit are slightly bent in a predetermined manner. The microphone boot can be constructed of flexible material to enable warpage. It may be undesirable to bend the microphone boot beyond a predetermined determined limit to avoid the possibility of a pinch-off of the hollow tube inside the microphone boot.

In another embodiment, a curved microphone boot may be provided. For example, a microphone boot can be configured like a pipe elbow. The pipe elbow may be provided with a curved shape in which the elbow is bent through a predetermined angle. The bent microphone boot may cause the orientation of the microphone and the printed circuit board to change relative to the housing, which may be desirable for packaging reasons. More details about bonding the microphone boot 3102 to the housing 3120 are described below with respect to Figures 33A and 33B.

33A-33B illustrate side views of a microphone assembly at pre-installation and installation locations in a housing, respectively, in accordance with the embodiments described. 33A, a cross section of the microphone boot 3102 is shown. One end of the microphone boot 3102 is aligned with the opening 3121a in the housing 3120 and the second end of the microphone boot is aligned with the microphone 3106. [ Therefore, a sound tube can be formed between the opening 3121a and the microphone 3106 through a microphone boot.

A first seal 3122 may be formed between the lower surface of the microphone boot 3102 and the upper surface of the microphone 3106. [ A second seal 3124 may be formed between the top surface of the microphone boot 3102 and the inner surface of the housing 3120 so that the microphone boot surrounds the opening in the housing 3120. [ In one embodiment, the first and second seals may be formed using an adhesive such as a pressure sensitive adhesive (PSA). The PSA may be provided as a double-sided tape. In another embodiment, the first seal 3122 or the second seal 3124 may be formed using a liquid adhesive.

In one embodiment, the microphone 3106 and the circuit board 3104 may be provided with the microphone boot 3102 already attached to the microphone 3106. [ In another embodiment, during device assembly, a microphone 3106 and a circuit board 3104 may be provided as separate components from the microphone boot 3102. [ When the microphone boot and microphone are provided as discrete components, the microphone boot 3102 may first be attached to the inner surface of the housing 3120 after being attached to the microphone 3106, or vice versa. The attachment process may include placing a PSA or some other sealing adhesive at each end of the microphone boot.

After the microphone boot 3102 is aligned with the opening 3121a of the housing and an initial bond is formed between the microphone boot and the interior of the housing, compressive forces such as 3130a and 3130b may be applied on the microphone boot. The compressive forces can be generated when the microphone boot 3102, the microphone 3106, and the circuit board 3104 are secured in place. For example, one or more fasteners, such as screws, may be used to secure the circuit board 3104 to the housing 3120 or some other nearby structure. When the screw is stuck, compressive forces can be generated on the microphone boot 3102. Compressive forces can be used to squeeze any air pockets surrounding the seals, which can improve seal integrity of the seal.

As shown in FIG. 33A, the housing 3120 is bent near the microphone boot 3102. Thus, the compressive forces are distributed nonuniformly through the microphone boot. For example, the compressive forces on the side 3114a of the microphone boot may be less than the compressive forces on the side 3114b of the microphone boot. As described above, in some embodiments, the microphone boot 3102 may be configured to distribute the compression forces more uniformly. For example, the upper surface of the microphone boot may be inclined to follow the curvature of the inner surface of the housing 3120. [ In other embodiments, the upper surface of the microphone boot 3102 may not follow the curvature of the inner surface of the housing (e.g., the upper surface may be flat while the inner surface may be curved, as shown in Figure 33A) The top surface of the microphone boot can be used to deform the microphone boot so that it follows the inner surface of the housing.

A height 3135 between the circuit board 3104 and one location of the housing is shown in Figure 33A. After installation, the height 3135 may vary, as shown in Figure 33B. For example, the height 3135 may be reduced, which may be associated with a decrease in the height of the microphone boot 3120. The height reduction of the microphone boot may depend on its initial dimensions, the material used to form the microphone boot, and the amount of compressive force applied on the microphone boot.

A reduction in the height of the microphone boot may cause the inflation force 3140 to be transmitted to the microphone boot. The inflation force 3140 can push the seals 3122 and 3124, which can improve the seal integrity of the seals. For example, as discussed above, the compressive forces may help remove air pockets. The improvement in seal integrity can make the acoustic isolation characteristics for the hollow tube inside the microphone boot 3102 better. For example, as the seals become more air intrusive, the penetration of sound into the microphone boot through the sound paths within the housing 3120 may be reduced. In one embodiment, the acoustic isolation in the bell of the microphone boot may be greater than about 40 DB.

33C shows a side view of a microphone assembly installed within housing 3120 in response to an externally applied force 3142. Fig. During operation, a device such as a handheld computing device may experience external enforcement, such as 3142. For example, the device may fall, which creates a force.

Externally applied forces can be transmitted over various paths throughout the device. A force such as 3142a may be transmitted through the microphone boot 3102 and also a force such as 3142b may be transmitted into the microphone 3106 and into the circuit board 3104. The force can be delivered in a dynamic manner. For example, the microphone boot may expand after contraction in response to force, causing height 3135c to change. The expansion and contraction of the microphone boot can push and pull attachments between various components, e.g., between the microphone 3102 and the circuit board 3104 and on each side of the seals 3122, 3124.

If the microphone boot is not properly designed, the expansion and contraction of the microphone boot 3102, as well as the warping of other components such as the circuit board 3104, may reduce the seal integrity of the seals such as 3122 or 3124. According to testing, it has been found that in some microphone boot designs, seals such as 3122 or 3124 can be pulled individually, or the microphone 3106 can be pulled from the circuit board 3104, or the circuit board can be damaged. In one embodiment, the microphone assembly may be designed to withstand up to 10,000 g of acceleration, which may be the boundary of the magnitude of the external applied force.

During testing, it has been found that microphone assemblies using a microphone boot formed of a more flexible, more compressible, monolithic material may be more resistant to impact damage such as shock resulting from a rapid acceleration than a microphone boot formed of a harder material. It has been found, however, that a microphone boot formed of a more rigid single material may provide better seal integrity and thus better acoustic isolation than a microphone boot formed of a more flexible material. However, microphone assemblies using a microphone boot formed of a more rigid material may be less susceptible to impact damage.

To take advantage of the more flexible material impact resistance properties and the improved sealing quality of the rigid material, synthetic microphone boot designs can be provided. The synthetic microphone boot can use a combination of rigid and flexible materials. Tighter materials can be used to improve seal integrity, while more flexible materials can be used to improve impact resistance. Embodiments of synthetic microphone boot designs that may be used in a microphone assembly are described below in connection with Figures 34A-34D.

Figures 34A-34D illustrate cross-sectional views of synthetic microphone boots such as 3200, 3225, and 3235, in accordance with preferred embodiments. The upper and lower seals formed in each of the microphone boots are shown. 34A shows a top view of a microphone boot 3200 including a seal 3202a. This top view shows that the microphone boot 3200 includes a circular opening 3210 for an internal passageway 3215 that forms a bore through the microphone boot. A seal 3202a, such as a washer, may be formed on the upper portion of the microphone boot 3200. As discussed above, the external and internal profiles of the microphone boot, such as 3200, may vary through the internal passageway. Thus, the top view of the microphone boot may vary depending on the surface contours selected for the outer and inner profiles. Seal 3202a may be designed to substantially cover the top surface of microphone boot 3200. Thus, the shape of the seal 3202a can vary accordingly.

Referring again to Figure 34A, the microphone boot may include a first end cap portion 3204a. The first end cap 3204a may be formed of a first material and may have a first thickness 3212. A sealing portion 3202a may be bonded to the upper portion of the first end cap 3204a. A second end cap 3204b may be disposed at the bottom of the microphone boot. The second end cap may be formed of a second material and may have a second thickness 3216. The center portion 3206 of the microphone boot of thickness 3214 may be disposed between the first end cap 3204a and the second end cap 3204b. The center portion may be formed of a third material. The first thickness 3212, the second thickness 3216, and the third thickness 3214 may be different from each other.

The sealing portion 3202b may be bonded to the second end cap 3204b. As described above, the sealing portion 3202a can be bonded to the same surface as the inner surface of the housing. The sealing portion 3202b may be bonded to the same surface as the upper surface of the microphone. The sealing portions 3202a and 3202b may be formed of a common material or a different material. For example, the sealing portions may be formed of a common PSA or two different PSAs.

In certain embodiments, the first and second materials used in the first end cap 3204a and the second end cap 3204b may be selected for their ability to enhance seal integrity, May be selected for their shock absorption qualities. As discussed above, the use of rigid materials may improve seal integrity associated with microphone boot seals such as 3202a and 3202b, while the use of more flexible materials may improve the impact resistance of the microphone assembly. Thus, the materials selected for the first end cap and the second cap may be formed of stiffer materials to improve sealing integrity, and the center portion may be formed from a first end cap and a second end cap And may be formed of a more flexible and more compressible material. In one embodiment, the first and second end caps may be formed of rigid plastic, and the center portion may be formed of a plastic that is more flexible than the end caps, such as silicon-based plastic.

In certain embodiments, the first end cap 3204a and the second end cap 3204b may be formed of a more rigid first material, and the center portion may be formed of a more flexible second material. The microphone boot designed in this manner can be integrally formed during the double shot injection molding process using the first material during one shot and using the second material during another shot. The first and second materials may be selected such that the materials are bonded together during the double shot injection molding process. In other embodiments, the first end cap 3204a, the second end cap 3204b, and the center portion 3206 may be individually bonded together, such as a die cut, and then bonded together in a predetermined manner to form a microphone boot.

In one embodiment, the first end cap 3204a and the second end cap 3204b may be formed approximately the same to have a common thickness. However, the thickness 3214 of the center portion may be different. In other embodiments, the first end cap and the second end cap may be formed differently. For example, FIG. 34B shows a microphone boot 3225 in which the first end cap 3228a is formed differently from the second end cap 3228b. The microphone boot includes a central portion 3230 and the materials used for the center portion 3230, the first end cap 3228a and the second end cap 3228b can improve sealing integrity and / or impact resistance in the manner described above Lt; / RTI >

The upper surface of the first end cap 3228a may be bent or inclined in a predetermined manner. As described above, it may be desirable to form the first end cap 3228a substantially along the surface to which it is to be bonded. For example, the first end cap 3228a may be formed to follow the curved inner surface of the housing, as shown in Figures 33A-33C. Seals 3226a and 3226b may be bonded to first end cap 3228a and second end cap 3228b, respectively. The seals can be formed to follow the surface to which they are bonded. Thus, the seal 3226a may be bent to conform to the shape of the first end cap 3228a, while the seal 3226b is relatively flatter to conform to the planar shape of the lower end cap 3228b.

34A and 34B show center portions 3206 and 3230 of microphone boots having a relatively constant thickness. In other embodiments, the thickness of the center of the microphone boot may vary. For example, in FIG. 34C, a microphone boot 3235 having a different thickness of the center portion 3240 is shown. The microphone boot 3235 may include a first end cap 3238a having a sloped top surface and a second end cap 3238b having a flat bottom surface. Seals 3236a and 3236b may be attached to each end cap. The thickness of the second end cap 3238b is shown to be relatively constant in this example.

In Figure 34C, the thickness of the central portion 3240 changes from thicker to thinner. In addition, the thickness of the first end cap 3238a becomes thicker in the thinner regions of the central portion 3240, and thinner in the thicker regions of the central portion. In other embodiments, the interface between the central portion 3240 and the first end cap 3238a may be relatively horizontal, and the second end cap may be thinner or thicker, so that the central portion 3240 and the second end The interface between the cap 3238b can be inclined to change the central thickness profile. In yet another embodiment, both the first end cap 3238a and the interfaces between the central portion 3240 and the second end cap 3238b can be inclined in a predetermined manner.

The thickness of the center portion 3240 of the microphone boot may be altered to change the distribution of compressive forces within the microphone boot when the microphone boot is installed. For example, the thickness of the central portion 3240 may be varied to produce a more uniform distribution of compressive forces and to allow better sealing of the end caps, such as 3238a. In other embodiments, the central portion 3240 may be thicker or thinner in certain areas to adjust shock-absorbing properties in these areas. In still other embodiments, the center portion may be thicker or thinner in certain areas, for example, to create a desired impact transmission path for directing the impact from a weaker region toward a region having greater structural strength.

In the synthetic microphone boots described in connection with Figures 34A-34D, a number of materials are used to form the synthesis boot. In one embodiment, as shown in Figure 34D, a single material may be used for the microphone boot. The microphone boot 3245 includes a central portion 3250 of a single material. Seals 3246a and 3246b attached to the microphone boot are shown. It may be possible to use a single material, such as a harder single material selected for its ability to improve seal integrity, if the shock absorbing effects are compensated in some other way, rather than using the second shock absorbing material.

In one example, the geometry of the microphone boot, such as 3245, can be adjusted to change its shock absorption properties. For example, a bulge, such as 3250a, may be provided in the microphone boot 3245 to help dissipate the shocks delivered through the microphone boot. In another example, the microphone assembly may be adjusted in a predetermined manner to improve its shock absorbing capability. For example, cushioning features may be designed in the manner in which the microphone assembly is attached, or a more flexible circuit board may be used within the microphone assembly to improve the cushioning properties of the microphone assembly.

35 is a flowchart 3300 of a method of fabricating a portable computing device that includes a synthetic microphone boot according to the preferred embodiments. At 3302, microphone boot dimensions and materials may be selected. For example, in a synthetic microphone boot that includes a central portion disposed between two end caps, the dimensions to be used for each of the end caps and the center portion can be determined. The dimensions may be selected to improve the seal integrity and shock absorption properties of the microphone boot. Also, the materials to be used for each component can be selected. As discussed above, materials may also be selected to improve the seal integrity and shock absorption properties of the microphone boot.

A microphone boot according to the specified dimensions and materials may then be formed. In one embodiment, the microphone boot may be a composite microphone boot formed from a plurality of materials and components formed integrally using an injection molding process. At 3304, a first portion of the microphone boot may be formed in one shot of the double shot injection molding process. At 3306, a second portion of the microphone boot may be formed in another shot of the injection molding process. Different materials may be used in each of the shots. In other embodiments, different portions of the microphone boot may be formed separately and then assembled together after each of the components are formed.

At 3308, a microphone boot can be attached to the microphone. The microphone may be part of a microphone assembly that includes a circuit board and a microphone coupled to the microphone boot. At 3310, a microphone assembly may be attached to a housing of an electronic device, such as a portable computing device, to form a seal between the microphone and the housing. In one embodiment, the seal may be formed using a pressure sensitive adhesive. At 3312, when the assembly is secured, the microphone boot can be compressed in a predetermined manner. Compression can change the dimensions of the microphone boot and allow the microphone boot to apply forces to its associated seals. The applied force can be used to improve the seal integrity of the seals.

36A and 36B illustrate a top view and a bottom view of a portable computing device 3400 in accordance with the described embodiments. The portable computing device may be suitable to be held in the hands of the user. A cover glass 3406 and a display 3404 can be disposed in the opening 3408 of the housing 3402. [ The cover glass may include an opening for an input mechanism such as an input button 3414. [ In one embodiment, input button 3414 may be used to return the portable computing device to a specific state, such as a home state.

Other input and output mechanisms may be arranged around the housing 3402. [ For example, a power switch such as 3410 may be placed at the upper edge of the housing, and a volume switch such as 3412 may be placed along one edge of the housing. An audio jack 3416 and a data / power connector interface for connecting a headphone or other audio device may be located at the lower edge of the housing. Housing 3402 also includes an aperture for camera 3415 to allow video data to be received.

Figure 36C is a block diagram of a media player 3500 in accordance with the described embodiments. The media player 3500 includes a processor 3502 associated with a microprocessor or controller for controlling the overall operation of the media player 3500. Media player 3500 stores media data associated with media items in file system 3504 and cache 3506. The file system 3504 is typically a storage disk or a plurality of disks. The file system typically provides mass storage capability for the media player 3500. However, since the access time to the file system 3504 is relatively expensive, the media player 3500 also includes a cache 3506. [ The cache 3506 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to cache 3506 is significantly shorter than for file system 3504. However, the cache 3506 does not have a large storage capability of the file system 3504.

In addition, the file system 3504 consumes more power than the cache 3506 upon activation. Power consumption is particularly important when the media player 3500 is a portable media player that is powered by a battery (not shown).

The media player 3500 also includes a user input device 3508 that allows a user of the media player 3500 to interact with the media player 3500. For example, the user input device 3508 may take various forms such as a button, a keypad, a dial, and the like. The media player 3500 also includes a display 3510 (screen display) that can be controlled by the processor 3502 to display information to the user. The data bus 3511 may facilitate data transfer between at least the file system 3504, the cache 3506, the processor 3502 and the codec 3512.

In one embodiment, media player 3500 is responsible for storing a plurality of media items (e.g., songs) in file system 3504. When the user wants the media player to play a particular media item, a list of available media items is displayed on display 3510. [ The user may then use the user input device 3508 to select one of the available media items. Processor 3502 provides the coder / decoder (codec) 3512 with media data (e.g., an audio file) for a particular media item upon receipt of a selection of a particular media item. The codec 3512 then generates analog output signals for the speaker 3514. The speaker 3514 may be a speaker inside the media player 3500 or outside the media player 3500. For example, headphones or earphones connected to the media player 3500 may be considered external speakers.

In the above-described method, one or more of the steps may be performed using a computer assisted manufacturing process. The computer assisted manufacturing process may include programming one or more different devices to form or assemble the microphone boot and portable computing device. For example, a robotic device can be programmed to install a microphone assembly including a microphone boot and / or microphone in a specific orientation within the housing of the portable computing device.

Modular  Material antenna assembly

In general, the embodiments disclosed herein describe a modular material antenna assembly that includes an antenna block having a portion that interlocks with a corresponding portion of a non-conductive frame to thereby secure the antenna block to the non-conductive frame. The non-conductive frame is attached to the interior of the conductive housing, so that the non-conductive frame and the conductive housing form an integral structure. Then, the antenna plex is mechanically supported by the antenna block and electrically connected to the circuit board. The frame is designed to support a cover glass for a portable electronic device and can be attached to the housing. The permittivity of the antenna block is significantly lower than the permittivity of the frame. In one embodiment, the antenna block is made of COP (Cyclo Olefin Polymer), while the frame is made of glass filled plastic. The resulting dielectric constant difference improves antenna performance in conjunction with differences in dielectric loss tangent as well as interlocking portions of the frame and antenna block.

41 shows a perspective plan view showing an exemplary consumer product 4100 in accordance with the described embodiments. The consumer product (4100) can take many forms, notably the portable media players such as the iPod ^TM or iPod Touch ^TM , each manufactured by Apple Inc. of Cupertino, CA, smartphones such as the iPhone ^TM , and the iPad ^TM And the like. Consumer product 4100 may transmit and / or receive wireless communications using internal antennas. Such wireless communications can be performed for many different purposes. For example, as will be described later, the wireless communication may be performed for a mobile telephone communication, WiFi communication, Bluetooth ^TM communication, wireless broadband communications. Making these communications more efficient and effective provides an improved user experience when using the consumer product 4100. [

42 illustrates a perspective top view of a modular material antenna assembly in accordance with one embodiment. Here, a housing 4200 made of a conductive material is provided. One example of a conductive material suitable for use in this embodiment is stainless steel, but one of ordinary skill in the art will recognize that there are many other potential materials suitable for this embodiment, One should not be construed as being limited to stainless steel. A frame 4202 is attached to the housing 4200 and is generally operable to support a front face (not shown) of the apparatus. The front surface can be made of a transparent material such as glass and can act to cover the device, but allows the user to see the bottom display (not shown) through the cover. This display can also act as an input device. For example, the display may be one of many different types of touch screens.

To support the cover, the frame 4202 can include a rim 4204 having a flange portion 4206. In one embodiment, the cover is bonded to the rim 4204 around the flange 4206, thus sealing the entire device. Thus, the rim 4204 serves not only as a support for the cover, but also as a bonding area where the cover can be anchored to the frame. The frame 4202 may be made of a non-conductive material such as glass filled plastic. One exemplary glass-filled plastic suitable for use with frame 4202 is KALIX ^TM manufactured by Solvay Advanced Polymers of GA Alpharetta. KALIX ^TM contains 50% glass fiber reinforced high performance nylon. One of ordinary skill in the art will recognize that there are many other potential frame materials suitable for use in this embodiment, and unless the claims are explicitly recited, they are limited to KALIX ^TM or any other glass- .

The dielectric constant of the frame 4202 is considerably larger than the dielectric constant of the antenna block 4208. [ The glass filled plastic has a dielectric constant of, for example, about 5, while the COP that can be used for the antenna block material as described above can have a dielectric constant of about 2.25. In addition, the dielectric loss tangent of the frame 4202 is significantly greater than the dielectric loss tangent of the antenna block 4208. The glass filled plastic may have a dielectric loss tangent, for example between 2.5 and 4, while an antenna block 4208 composed of COPs may have a dielectric loss tangent of about 0.0005. Dielectric loss tangent is a parameter of a dielectric material that quantifies the inherent electromagnetic energy dissipation of dielectric materials. This term refers to the angle in the complex plane between the resistive (loss) component of the electromagnetic field and its response (lossless) component. The smaller the dielectric loss tangent, the less the loss of antenna reception.

In addition to being formed of an antenna block material having a dielectric constant considerably lower than that of the frame material as just described, the antenna block 4208 also has a shape interlocking with the corresponding portion of the frame 4202 to secure the antenna block to the frame . This is shown in Figures 43 and 44. The device may further include printed circuit board (not shown) integrated circuits, other electrical components may be installed on the circuit board, and may be used to control the display as well as to operate the device. The printed circuit board may include a processor or processors configured to perform various functions of the apparatus.

43 illustrates a first cross-sectional view of a modular material antenna assembly in accordance with one embodiment. This cross-sectional view shows the view from the side of the device of Fig. As shown in FIG. 43, the antenna block 4208 includes a portion 4210 having a shape interlocking with a corresponding portion 4212 of the frame 4202. Here, the interlocking portions include a notched portion 4210 of the antenna block 4208 with a tabbed portion 4212 of the frame 4202. However, one of ordinary skill in the art will recognize that there can be many different ways to interlock these components in a manner that affixes the antenna block 4208 to the frame 4202, and the claims are not explicitly mentioned Should not be limited to any particular shape (s).

44 illustrates a second cross-sectional view of a modular material antenna assembly in accordance with one embodiment. This cross-sectional view shows the view from the upper end of the apparatus of Fig. Here, the antenna block 4208 has another portion 4214 having a shape interlocking with the corresponding portion 4216 of the frame 4202. This portion 4214 is the tab portion on the antenna block 4208 side while the portion 4216 is the notch portion 4216 on the frame 4202 side. By alternating the tab portion and the notch portion between the antenna block 4208 and the frame 4202, the antenna block 4208 can be more firmly fixed to the frame 4202. [ It should be noted that there is no need for any particular number of such corresponding portions to exist for interlocking antenna block 4208 and frame 4202. It is sufficient to have a set of interlocking portions to secure the antenna block 4208 to the frame 4202. [ However, additional interlocking portions may be provided to provide additional strength of the coupling of the two components. A bracket 4218 is shown which is connected to the housing 4200 and provides electrical conduction between the housing 4200 and an item screwed into the bracket 4218 through a threaded bore 4222 . The bracket 4218 can be welded to the housing 4200. The bracket 4218 may be made of a conductive material.

45 shows an enlarged view of a planar perspective view of a modular material antenna assembly in accordance with one embodiment. Here, the antenna flex 4222 is mechanically secured to the top of the antenna block 4208. [ The antenna flex 4222 can be secured to the antenna block 4208 through the use of screws 4224 into the bracket 4218 shown in FIG. Note that the bracket 4218 need not be a separate component from the housing 4200, and in one embodiment the bracket 4218 is formed integrally with the housing 4200. The antenna flex 4222 may be electrically connected to a circuit board (not shown) of a consumer product, and electrical components on the circuit board may be electrically connected to the housing 4200 to ground each of the components.

In addition, the antenna block 4208 can be grounded to the housing 4200. In one example, a conductive spring (known as a grounding spring) may be used to perform this task. The spring itself may have shapes interlocking with corresponding portions of the antenna block 4208 and the housing 4200 to secure the grounding spring. These springs are designed to be resiliently deformed, which can reduce the impact or other trauma to the consumer device. The elastic deformation of the spring may cause the spring to remain between the antenna block 4208 and the housing 4200 even during a fall accident or other such impact.

42-45, the antenna block 4208 is shown as having a particular shape, but the antenna block generally need not be formed in any particular shape. In fact, the shape of the antenna block may vary based on a number of different factors, including the design and shape of the neighboring structures, the convenience of construction, the ease of installation, and how tightly the antenna block must be fastened to the frame. The manner in which the frame and the antenna block interlock with each other can also affect antenna performance and it is believed that manufacturing the interlocking portions with materials having different permittivities further improves antenna performance. That is, interlocking aspects of different permittivity materials improve antenna performance beyond what occurs when different permittivity materials are connected without interlocking portions.

In addition, the shape of the antenna block may change the characteristics of the wireless reception of the device. Certain shapes and / or sizes may generally increase or decrease radio reception. In addition, certain shapes and sizes may increase wireless reception when the device is used in a predetermined manner, and may reduce wireless reception when the device is used in other ways. For example, the position of the user's hand while grasping the device may change the wireless reception characteristics of the device. This effect can be reduced or eliminated by providing more space between the antenna block and the portion of the housing where the user typically grips the device or by the placement of a non-conductive physical buffer material such as a rubber buffer. Thus, the antenna block can be designed to balance all of the above factors in the most efficient manner possible.

The antenna block, frame and housing may be made of any suitable material using any suitable process. This may include, for example, metals, synthetic materials, plastics, and the like. These components may be manufactured using any suitable approach, such as, for example, forming, forging, injection molding, molding, stamping, and any other suitable manufacturing process or combinations thereof.

An antenna block may be configured to operate over any suitable band or bands to cover any existing or new services of interest. If desired, multiple antenna blocks may be provided to cover more bands, or more than one antenna may be provided with wide bandwidth resonant elements to cover multiple communication bands of interest. Nothing herein is to be construed as limiting the claimed embodiments to a single antenna block, unless expressly disclaimed.

46 shows an alternative interlocking configuration according to one embodiment. This figure shows a close-up of the interlocking shape area of the antenna block and frame, and other features of the antenna block and frame (and possibly other interlocking shapes elsewhere on these elements) are not shown. Here, the antenna block 4600 includes a round notch portion 4602 that interlocks with the round tab portion 4604 of the frame 4606. [ Assembling is made easier by manufacturing interlocking portions having round shapes rather than a substantially rectangular shape because these shapes slip together faster than many rectangular shapes. However, this must be offset by the fact that the round shape may not provide as large a separation resistance as the substantially rectangular shape.

47 shows an alternative locking configuration according to another embodiment. This figure shows a close-up of the interlocking shape area of the antenna block and frame, and other features of the antenna block and frame (and possibly other interlocking shapes elsewhere on these elements) are not shown. This embodiment is similar to that shown in Fig. 46 except that the antenna block 4700 includes a rounded tab portion 4702 interlocking with a rounded notch portion 4704 of the frame 4706. Fig. As in the embodiment of FIG. 46, the round design can speed up the assembly, but may be less reliable with regard to locking the antenna block 4700 to the frame 4706.

48 shows an alternative interlocking configuration according to one embodiment. This figure shows a close-up of the interlocking shape area of the antenna block and frame, and other features of the antenna block and frame (and possibly other interlocking shapes elsewhere on these elements) are not shown. Here, the antenna block 4800 includes a notch portion 4802 having a rectangular portion 4804 and a rounded portion 4806. The notch portion 4802 interlocks with the tab portion 4808 of the frame 4810. Tab portion 4808 includes a rectangular portion 4812 and a rounded portion 4814. [ This design provides excellent locking capability and provides significant resistance to separation of the antenna block 4800 and the frame 4810. [ However, this must be offset by the fact that the assembly of such interlocking portions may be difficult or even impossible if there are a plurality of such notch portions 4802 and tab portions 4808 in the device. However, this embodiment may be ideal when there is only a single interlocking portion for each of the antenna block and frame.

49 shows an alternative locking configuration according to another embodiment; This figure shows a close-up of the interlocking shape area of the antenna block and frame, and other features of the antenna block and frame (and possibly other interlocking shapes elsewhere on these elements) are not shown. This embodiment is similar to that shown in Figure 48 except that the antenna block 4900 includes a rectangular portion 4904 and a tab portion 4902 having a rounded portion 4906. [ The tab portion 4902 interlocks with the notch portion 4908 of the frame 4910. The notch portion 4908 includes a rectangular portion 4912 and a rounded portion 4914. As in the embodiment of Figure 48, this embodiment may be ideal when there is only a single interlocking portion for each antenna block and frame.

50 is a flow diagram illustrating a method for assembling a portable electronic device according to an embodiment. At 5000, a conductive housing is provided. The housing may be made of, for example, stainless steel. At 5002, the bracket is welded to the housing. The bracket may be made of a conductive material. At 5004, the non-conductive frame is bonded or secured to the interior of the conductive housing to form an integral structure. The non-conductive frame is formed of a frame material having a first permittivity. At 5006, the antenna block is secured to the frame by interlocking a portion of the antenna having the first shape and a portion of the frame having the second shape corresponding to the first shape. The antenna block is formed of an antenna block material having a second permittivity that is significantly lower than the first permittivity. At 5008, the antenna plexes are mechanically secured to the antenna block. The antenna plex can also be electrically connected to the circuit board.

51 is a block diagram of a portable consumer device in accordance with an embodiment of the present invention. The portable consumer device 5100 may use a modular material antenna assembly according to any of the embodiments described above. The portable consumer device 5100 includes a processor 5102 associated with a microprocessor or controller for controlling the overall operation of the portable consumer device 5100. The portable consumer device 5100 stores media data associated with the media items in the file system 5104 or cache 5106. The file system 5104 is typically a storage disk or a plurality of disks. File system 5104 typically provides mass storage capability for portable consumer device 5100. The file system 5104 may store media data as well as non-media data (e.g., when operating in disk mode). However, since the access time to the file system 5104 is relatively expensive, the portable consumer device 5100 may also include a cache 5106. [ The cache 5106 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to the cache 5106 is much shorter than for the file system 5104. However, the cache 5106 does not have a large storage capability of the file system 5104. In addition, the file system 5104 consumes more power than the cache 5106 upon activation. Power consumption is often a problem when the portable consumer device 5100 is a portable consumer device that is powered by a battery (not shown).

In one embodiment, the portable consumer device 5100 is responsible for storing a plurality of media items (e.g., songs) in a file system 5104. If the user wishes the portable consumer device to play a particular media item, a list of available media items is displayed on display 5108. The user can then select one of the available media items using the touchpad installed within the display 5108. [ Processor 5102 provides the coder / decoder (codec) 5110 with media data (e.g., an audio file) for a particular media item upon receipt of a selection of a particular media item. The codec 5110 then generates the analog output signals for the speaker 5112. The speaker 5112 may be a speaker inside the portable consumer device 5100 or external to the portable consumer device 5100. For example, headphones or earphones connected to the portable consumer device 5100 may be considered external speakers. The speaker 5112 can be used not only to output audio sounds associated with media items being played back, but also to output sound effects and cellular telephone call audio. The sound effects may be stored on the portable consumer device 5100 as audio data, for example, in a file system 5104, cache 5106, ROM 5114, or RAM 1116. Sound effects may be output in response to user input or system requests. When a particular sound effect is about to be output to the speaker 5112, the associated sound effect audio data may be retrieved by the processor 5102 and provided to the codec 5110, which in turn causes the audio signals to be sent to the speaker 5112 to provide. When audio data for a media item is also output, the processor 5102 may process sound effects as well as audio data for the media item. In this case, the audio data for the sound effect may be mixed with the audio data for the media item. The mixed audio data may then be provided to the codec 5110, which provides the audio signals to the speaker 5112 (relating to both the media item and the sound effect).

The portable consumer device 5100 also includes a network / bus interface 5118 coupled to the data link 5120. Data link 5118 allows portable consumer device 5100 to be coupled to a host computer. The data link 5118 may be provided via a wired connection or a wireless connection. For a wireless connection, the network / bus interface 5118 may include a wireless transceiver.

PCB  formation

The first factor that can be considered in the packaging of a portable computing device with a display and a desired thin profile is the placement of larger components such as displays, display circuits and batteries within the housing. In addition, the arrangement of support and / or attachment structures necessary to secure larger device components to the housing can be considered. Larger device components and their associated support structures must be provided with sufficient space to enable various input and output mechanisms such as volume switches, power buttons, data and power connectors, and audio jacks to be arranged around the outer edges of the housing As shown in FIG. The remaining spaces not occupied by the larger components include the processor and memory, speakers, microphones, cameras and circuit boards associated therewith, as well as a wide variety of components that allow all device components to be controlled and manipulated for their intended functions Other internal components, such as but not limited to connections, may be deployed.

The remaining space that is not occupied by the larger components may be irregularly shaped and may be distributed at various locations and height levels throughout the enclosure. The components of the custom shape can be designed to fit in these spaces. The components may then be linked together in a predetermined manner. For example, many of the components may communicate with a controller board, such as a main logic board, to receive operational instructions to enable the portable device to provide its intended functionality. As another example, many of the components require power, which may be supplied from the internal battery via various power connections. Typically, the space between components can be used to route data and / or power connections. Thus, the space for the required power and data connections can be considered in the packaging design of the device.

One solution for connecting various electrical components distributed internally within the housing is to use flexible connectors (flexible connectors are often referred to as "flex" connectors). One disadvantage of the flex connectors is an increase in manufacturing steps. Two manufacturing steps are added each time one internal component is connected to another internal component by the flex connector. One of the steps in the assembly process can be eliminated by connecting the flex to one of the components during its manufacture. However, during assembly, it is typically necessary that at least one end of the flex connector is connected to an associated internal component.

Another disadvantage of the flex connectors is that the connection points to which the flex is connected to the component may be vulnerable to failure during operation of the device. For example, the flex connection points may be vulnerable to failures resulting from the same impacts as when the device is dropped over other types of connections. In addition, during assembly, the flex connection points may be improperly formed, which can lead to premature or unexpected failure of the device. Thus, the use of flex connectors can cause additional instances where manufacturing errors may occur that reduce the overall reliability of the device.

As described in detail herein, flexibly, continuously formed PCBs can be used to provide a packaging environment associated with thin, handheld electronic devices, while eliminating the flex connectors. As an example, a single continuous PCB may include two large portions, such as two rectangular portions, which are connected by a portion of the PCB that is much thinner than the two rectangular portions. The two large portions of the PCB may be formed by two separate PCBs and then joined by a flex connector. Instead, a continuous PCB board can be formed in which the connector portion of the PCB can be used in place of the flex connector. The relative thinness of the connector portion can cause the connector portion to flex easily.

Larger portions of the PCB may be formed in a shape (e.g., non-rectangular) and sized to fit internally available spaces within the housing. The length and shape of the connector portion of the PCB may be determined based on the internal passages present between the spaces in which larger portions of the PCB are disposed. In one embodiment, the connector portion of the PCB can be rotated at various positions to accommodate internal passageways that may be available between larger portions of the PCB. In other embodiments, larger portions of the PCB may be made to fit them into the available interior space.

The profile of the portable computing device, the components that need to be connected, and the arrangement of the various components may be determined using available spaces in the housing that can be formed to fit the bendable PCBs described herein, It can affect the circuit. Accordingly, a perspective view of a portable computing device with an exemplary profile and a block diagram of components of the portable computing device are described with reference to Figures 61A and 61B. In one embodiment, the bendable PCB may be formed as a main logic board. Thus, with reference to Figs. 62A, 62B and 62C, a bendable main logic board including an exemplary board layout within a housing of a portable computing device is described. Other configurations and arrangements of bendable PCBs are described with reference to Figures 63a, 63b and 63c. With reference to Figures 64a-65e, a number of configurations for a bendable PCB are illustrated. The stiffness properties of the bendable PCB may be adjusted by adjusting the formation of one or more trace layers of the trace layers in the PCB. The formation and adjustment of these layers is described with reference to Figures 66a-66b. A method of manufacturing a portable computing device using a bendable PCB is described with reference to FIG. Finally, a block diagram of a portable computing device with media playback capability is described with respect to FIG.

61A illustrates a perspective view of a portable computing device 610 having a relatively thin profile in accordance with the described embodiments. The portable computing device 610 may include a housing 6100 having an opening 6108 therein. A display 6104 surrounded by a frame may be disposed within aperture 6108. [ A display circuit for the display 6104 may be disposed within the housing 6100, e.g., directly below the display 6104. As described above, the arrangement of the display circuitry can affect the internal spaces available in the housing 6100.

A touch screen may be associated with the display 6104. A circuit associated with the touch screen, such as a touch screen controller, may be disposed within the housing 6100. [ The display 6104 can be sealed through cover glass 6106. [ The input button 6114 may be disposed in the opening of the cover glass 6106. [ A detection circuit associated with the input button 6114 may be disposed within the housing 6100. [ In one embodiment, the input button may be used to return the device 610 to a specific state, such as a home state.

Multiple input and output mechanisms can be placed around the edges of the housing. For example, a data / power connector 6118 and an audio jack 6116 may be disposed at the lower edge of the housing 6100, and a power switch 6110 may be located at the upper edge of the housing 6100. The housing 6100 may also include openings for speakers and / or microphones. Circuits supporting these components can be packaged inside the housing 6100. [ This circuit can be implemented on a variety of circuit boards, such as the bendable PCBs described herein, disposed within the housing.

A block diagram of device 610 is shown in Figure 61B. The aforementioned components are typically controlled by a processor on the main logic board (MLB) 6105. Accordingly, various internal connections may be provided that allow data to be moved between the MLB 6105 and various components. The routing of the internal data connections may depend on the manner in which the various components are packaged, including the location where the MLB 6105 is located within the housing 6100 and the available internal paths that occur after placement of various internal device components.

In connection with the data connections, the MLB 6105 may be connected to a display controller 6120 coupled to the display 6104. [ In addition, the MLB 6105 may be coupled to audio components, such as speakers, an audio jack 6116, a microphone, or associated audio support circuitry including an audio codec. In addition, the MLB 6105 may be coupled to various input devices such as a touch screen 6122, a volume switch circuit, an input button circuit, and a power switch circuit. In addition, the MLB 6105 can be connected to various data interfaces that allow the MLB to receive and transmit external data, such as a wireless interface 6126 and / or a data / power connector 6118 that may include an antenna have.

In addition to data connections, many internal device components may receive power from an internal power source, such as battery 6130. [ For example, battery 6130 may be coupled to MLB 6105, display 6104, display controller 6120, touchscreen 6122 and data / power connector 6118. The routing of power connections, such as data connections, may depend on the placement of various internal device components, such as battery 6130 and available internal passageways in housing 6100.

With reference to the figures below, embodiments of bendable PCBs are described. In one embodiment, the bendable PCBs may include portions of various sizes formed to fit within the internal available spaces distributed throughout the housing. Portions of larger size of the PCB may be connected by thin connector portions formed to fit within the internal passageways available between the larger portions. Larger portions and connector portions may be formed as continuous PCBs. In certain embodiments, a main logic board may be formed from a bendable PCB as illustrated in the following figures.

62A, 62B, and 62C illustrate perspective and side views of the warpable MLB 6105 in accordance with the described embodiments. 62A is a cross-sectional view of the housing 6100. Fig. The cross-section of the housing 6100 includes a length 6150 and a width 6151. Length 6150 and width 6151 may vary for different cross sections depending on the internal surface profile of housing 6100. [

The battery 6130 can be disposed in the center of the housing. In one embodiment, the battery 6130 is configured such that an internal space is available near the upper end of the battery, an internal space is available near the lower end of the battery, an internal space is available along one side of the battery, Size. The MLB 6105 is formed such that the first portion 6105a fits into the inner space near the upper end of the battery and the second portion 6105b fits into the inner space near the lower end of the battery. The connector portion 6105c can connect the first portion 6105a and the second portion 6105b. The connector portion 6105c is thinner and longer than the first and second portions 6105a and 6105b. Connector portion 6105c is shown routed along an internal passageway on one side of battery 6130.

The shapes and positions of the first portion 6105a, the second portion 6105b, and the connector portion 6105c are provided for illustrative purposes only, and are not intended to be limiting. In various embodiments, the first portion 6105a and the second portion 6105b of the MLB 6105 may be larger or smaller than those shown in the figures. Also, the first portion 6105a may have a different shape and size than the second portion 6105b. Also, the shape of each portion, such as 6105a and 6105b, may not be rectangular, and may include curved surfaces if desired. In addition, a PCB such as MLB 6105 may include two or more larger portions. For example, a bendable PCB, such as MLB 6105, may include three large portions connected by two connector portions.

In various embodiments, connector portion 6105c may be attached to larger portions 6105a, 6105b at different locations. For example, connector portion 6105c may be attached to portions 6105a and 6105b near their centers to further form an "I" shape. In this example, the connector 6105c may include a battery 6132 if there is an available internal passageway, or the case of the battery 6132 may include a groove on its upper or lower surface that can be used as a passageway to the connector 6105c. As shown in FIG.

The connector 6105c need not be formed in a straight line. For example, connector 6105c may be formed to follow a curved path or along a plurality of straight line segments (e.g., step or zigzag path) at different angles with respect to each other. In another example, connector 6105c may include one or more shunts. Shunts can be connected to other circuits such as additional PCBs. As described in more detail with respect to Figures 62c and 64b-65e, after the connector 6105c is formed, the connector may be bent or twisted in various configurations to follow a particular internal passage. For example, as described in more detail with respect to Figure 62C, the connector may be configured to traverse different heights within the apparatus.

Figure 62 (b) shows a section perpendicular to the section of Figure 62 (a) with a constant width value. The MLB 6105 may be disposed at a height 6152 below the top of the battery 6130. The first and second portions 6105a and 6105b of the MLB may be sized to fit the space available between the upper side of the battery 6130 and the lower side of the battery 6130. [ The connector portion 6105c may traverse the side connecting the lower and upper sides of the battery and is indicated by the dotted lines.

In one embodiment, as shown in Figure 62B, the MLB 6105 can be installed in a planar configuration with a relatively constant height across the PCB, i.e., 6105a, 6105b, and 6105c are installed at similar heights. In other embodiments, the MLB may be installed in a non-planar configuration. For example, in Figure 62c, the first portion 6105a is installed at a height above the top of the battery 6130 and at the same height as the display 6104, and the second portion 6105b is located at a height above the top of the battery 6130 It is installed at the height below. The connector portion 6105c traverses the height difference between the first portion 6105a and the second portion 6105b.

62A-62C illustrate embodiments of a bendable PCB configured as an MLB 6105. In Fig. For purposes of illustration, the larger upper surface area of the MLB 6105 is shown to be installed approximately parallel to the underside of the device housing. In other embodiments, the bendable PCB may be installed such that the larger top surface area is generally perpendicular to the bottom of the device housing (see FIG. 63A). In still other embodiments, the first portion of the bendable PCB may be installed parallel to the bottom of the housing, and the second portion may be perpendicular to the bottom of the housing. For example, in Fig. 62A, the portion 6105a may be provided approximately parallel to the lower portion of the housing, and the connector 6105c may be bent at a right angle so that the connector 6105c may be substantially perpendicular As shown in FIG. The vertical orientations are described for illustrative purposes only. The angles at which each of the portions of the bendable PCB, such as the MLB 6105, are installed may be different and are not limited to vertically oriented installations to each other or to housings of various dimensions.

63A shows a perspective view of a bendable PCB 6160 in which the larger surface areas of the PCB are installed in a configuration that is substantially perpendicular to the bottom of the housing 6100. Fig. In the unbrached position, the PCB 6160 is approximately a rectangular strip, which is shown for illustrative purposes, since other shapes can be used. A top view and a bottom view of the PCB 6160 in unbent locations are shown in Figures 63b and 63c. In Figure 63A, the PCB 6160 bends around a corner to fit the space between the device component 6165 and the housing 6100. [ The device component 6165 can be either 1) substantially structural, such as 1) part of a frame for fixing other internal components, 2) part of a device component, such as a battery, installed in the housing, or 3) combinations thereof.

During assembly, the PCB 6160 can be bent and / or twisted to fit into a desired space, such as around a corner between the device component 6165 and the housing 6100, after being provided as a flat strip. In one embodiment, the materials of PCB 6160 can be configured not to retain its curved shape. Thus, the PCB 6160 may have to be secured to remain in its bent position, as shown in Figure 63a.

As an example, to secure the PCB in a curved shape, a PCB 6160 may be attached to the sides or bottom of the housing 6100 and / or to the sides of the device component 6165. As another example, if the space in which the PCB 6160 is disposed is sufficiently narrow, such as the space between the device component 6165 and the housing 6100, the PCB 6160 can be slid into the desired space after being bent during assembly. The bending moment stored in the PCB 6160 can direct the PCB 6160 to the sides of the space and help to stick within the space in which it is placed (i.e., the PCB 6160 will be flat if not forced ).

In another embodiment, during assembly, the PCB 6160 may be provided as a flat strip. However, the PCB 6160 can be configured to maintain or partially retain the shape after it is bent. PCB 6160 can be configured to be stiffer in other areas, such as areas designed to be bent and flattened more specifically in certain areas, such as areas designed to be flat. Details of the formation of a PCB, such as 6160 with various stiffness characteristics, are described in more detail with respect to Figures 66a and 66b.

In yet another embodiment, the PCB 6160 can be formed into its curved shape prior to assembly. For example, the PCB 6160 can be formed into a curved shape. In another example, the PCB 6160 is formed in a flat shape, but can then be adjusted to a curved shape prior to assembly of the portable computing device. A bent PCB 6160 may then be provided for the assembly process.

In various embodiments, the PCB 6160 may include components that are attached only on the top side of the PCB 6160, only on the underside of the PCB 6160, or on both the top and bottom sides of the PCB 6160. The attached components can extend over the surfaces of the PCB 6160. The component locations may be selected according to the available spaces in the housing when the PCB 6160 is in its installed position. In addition, the component positions can be selected based on where the intended flexure positions are located on the PCB. In some embodiments, it may be desirable to attach certain components to be away from regions that are intended to be highly curved because warping can damage the attachment of the component or component to the PCB 6160 .

63B and 63C show a top view and a bottom view of the PCB 6160. In Fig. 63B, components 6162a and 6162b are disposed on top of the PCB 6160 near the ends of the PCB 6160. Fig. In one embodiment, the components can be positioned away from the bending axis 6165, which is indicated by the arrows 6164 in the bending direction, because a large amount of bending can damage the attachment of the components to the PCB 6160 It is because.

The height gap associated with each component attached to PCB 6160, such as components 6162a and 6162b, may vary from component to component. For example, component 6162b may extend further from the top of the board than component 6162a. The height of each component affects the amount of space or space required when the PCB 6160 is installed. The height of each of these components may affect where each component is placed on the PCB 6160. For example, when the PCB 6160 is in the installed position, the component 6162b is in a position where the PCB 6160 extends away from the device component 6165. The location of the component 6162b on the PCB 6160 may have been selected to be placed in this area away from the device component 6165 when it is installed since the space between the device component 6165 and the housing 6100 This is because there may be more available space in this area.

As described above, the PCB 6160 may include components on its top and bottom surfaces. The layout and number of components on each of the top and bottom surfaces may be different. For example, in FIG. 63B, two components are mounted on the upper surface of the PCB 6160 at a distance from each other. 63C, three components having different sizes are shown attached to the lower surface of the PCB 6160, which is relatively closer to each other as compared to the components shown in FIG. 63B.

Figures 64A-65E show a top view and a side view of the flexibles PCB 6170 in various flexural configurations. As described above, a flexible PCB such as 6170 can be formed in a bent configuration. For example, each of the arrangements shown in connection with Figs. 64A-65E may be formed with the flexural arrangement shown in each of the figures. In alternative embodiments, the PCB 6170 may be bent in a different configuration before or after assembly after being formed into a non-bent configuration. For example, the PCB 6170 may be bent into the configuration shown in Fig. 64A after being formed into any one of the configurations shown in Figs. 64B and 64C. As another example, PCB 6170 may be bent about axis 6165 along direction 6164 to achieve the configurations shown in Figures 64b and 64c, respectively, after being formed with the configuration shown in Figure 64a.

A PCB such as 6170 may be configured to return to its original shape after being warped, or it may be configured to maintain or partially retain a particular warp configuration after warping occurs. At certain locations, PCBs such as the 6170 can be bent through multiple axes. In addition, PCBs can bend or twist in certain locations. In Figures 65d and 65e, portions 6170a and 6170c are installed at angularly specific configurations and at different heights, which causes bending and distortion in portion 6170b of PCB 6170.

In other embodiments, a PCB such as 6170 may be bent at multiple locations. For example, in FIG. 64A, each of the portions 6170a, 6170b, and 6170c may be curved in a specific direction and around a particular axis and by a certain amount (e.g., Direction by a certain amount of angles). As another example, in Figure 64A, portions 6170a, 6170b, and / or 6170c may each be bent at multiple locations. For example, portion 6170b may be bent at two different locations. Thus, the assembly, including the installation of a particular PCB 6170, can include a number of different bending steps.

The bendable PCB 6170 may be shaped and / or bent to fit a space around a particular object. For example, in Figure 65a, a side view of an internal device component 6176a surrounded by PCB 6170 is shown. PCB 6170 can be bent to follow substantially the side periphery of component 6176a. The side perimeter of the component 6176a may include straight portions, step line portions, or curved portions. As shown in Figs. 64B and 64C, the PCB 6170 can be bent to fit around the curved surface when, for example, the device component 6176a includes a curved side periphery.

65B is a side view of the device component 6176b. The PCB 6170 can be bent to fit around the upper and lower surfaces of the component 6176b. The component 6176b may be formed irregularly. For example, component 6176b includes two indentations. The board components 6178a and 6178b are disposed at locations on the top surface of the PCB 6170 so that when the PCB 6170 is bent around the component 6176b the board components are positioned within the side profile of the component 6176b, Lt; RTI ID = 0.0 > space. ≪ / RTI >

Figure 65c shows a side view of the device component 6176c and a side view of the device component 6180. [ In one embodiment, the device component 6180 may be a structural component, such as an internal frame. The PCB 6170 can be bent around the device component 6176c and the device component 6180. [ The component 6178a may be disposed on the upper surface of the PCB 6170 and the component 6178b may be disposed on the lower surface of the PCB 6170. [ The components 6178a, 6178b may be arranged to fit into the spaces surrounding the device components 6176c, 6180 created by their indentations.

PCB 6170 is shown as bent so that the lower surface of PCB 6170 is approximately parallel to the side of device component 6176c. In one embodiment, the bottom surface of the PCB 6170 may include a connector. The connector may be disposed on the PCB 6170 so that when the PCB 6170 is bent in its installed configuration, the connector is aligned with the connector on the side of the device 6176c so that the two connectors can be connected. The two connectors can be connected in a variety of ways. For example, the two connectors may be configured to be engaged or soldered together.

As described above, bendable PCBs are provided. It may be desirable to construct the PCBs so that the curved shape is maintained after bending. In general, it may be desirable to change the stiffness characteristics associated with the bendable PCB. With reference to Figures 66a-66b, methods and PCB configurations that may be used to form PCBs having different stiffness characteristics are described. 66A shows a side cross-section of a multi-layer PCB 6200. Fig. As more or fewer layers can be used than shown, the number of layers is provided for illustrative purposes.

PCB 6200 may include multiple trace layers, such as 6202a, 6202b, 6202c, and multiple substrate layers, such as 6206a, 6206b, 6206c. The trace layers may be used to form data and / or power connections to and between various PCB components such as 6204a and 6204b. Although the PCB components 6204a and 6204b are shown as being disposed on the top surface of the PCB 6200, in other embodiments the components may be disposed on the bottom surface of the PCB 6200. [

The trace layers are typically formed of a conductive material such as copper. The trace layer may be formed of a hard layer such as a foil layer and then a portion of the layer may be removed by etching or milling to form traces connecting the various components.

The substrate layers may be formed of different materials depending on the insulation requirements of the specific circuits on the PCB board. Some examples of substrate materials that can be used are (Teflon), FR-4, FR-1, CEM-1 or CEM-3. The different layers may be laminated together with an epoxy resin prepeg. Some examples of prepreg materials that may be used include phenolic cotton paper, FR-3 (Woven glass and epoxy), FR-4 (Woven glass and epoxy), FR- FR-6 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy) (Woven glass and epoxy), CEM-5 (Woven glass and polyester), and the like.

The substrate and trace layers can be adjusted to affect their stiffness and flexibility. For example, the trace or substrate layer may be thickened or thinned to make the multilayer PCB harder or more flexible. In addition, the substrate or trace layer material can be selected for its relative stiffness to other materials.

In one embodiment, the metal layer selected for stiffness characteristics, but not its conducting properties, can replace the trace layer. The metal layer can be strong enough to maintain the bent shape of the PCB when the multilayer PCB, such as 6200, is bent. More than one such layer may be used in a multi-layer PCB. In some embodiments, such "hardened" layers may not include traces.

In certain embodiments, the enhancement layer may comprise a shape memory alloy such as Nitinol. The shape memory alloy may be formed into a desired warped shape and then planarized and mounted on a PCB such as the 6200. The shape selected for the shape memory alloy layer may be a desired curved shape for a PCB such as 6200. [ The board components may be attached to the PCB 6200 in its flattened position. The shape memory alloy can then be adjusted to return to its shape retained in its memory. For example, the shape memory alloy can be heated. When the shape memory alloy returns to its position in its memory, the entire PCB can be bent in this configuration.

FIG. 66B shows a top view of two trace layers, such as 6202a, 6202b, or 6202c in the multi-layer PCB of FIG. 66a. The first trace layer includes four traces (6212a, 6212b, 6212c, 6216). The traces may be located above the substrate 6218. PCB 6200 is configured to flex around axis 6165 along direction 6165. In this region, the traces 6212a, 6212b, 6212c can be thickened to resist damage that may arise from warping. Trace 6216 is already thick and therefore its size is not increased in the flexure region close to axis 6165.

Typically, extra material not used to form the trace is removed from the trace layer. In one embodiment, the material of whether or not to strengthen the PCB in certain areas may be left. For example, extra materials such as 6208 and 6210 may be left to strengthen the PCB in these areas. In one embodiment, extra material is removed near the bending axis 6165. The excess material can be removed to make the PCB less rigid and more flexible in this area.

Another trace layer, which does not include traces and includes only material 6220, is shown in Figure 66b. This material can only be selected for its strength properties such as its stiffness properties. A portion of the material is removed near the bending axis, allowing the PCB to flex more easily in this area. In other embodiments, additional material may be added to this area rather than being removed. Additional material may be added to enable the trace layer, and thus the PCB, to remain in shape after being bent about axis 6165. [

67 is a flowchart of a method 6300 of manufacturing a portable computing device using a multi-layer PCB. At 6302, the board shape can be determined. The board may have portions of different sizes depending on the intended space for each portion to fit, as well as whether and how each of the portions should be warped. As described above, the board may be formed flat, or may be formed in a configuration that already includes bent portions.

At 6304, the component locations on the top and / or bottom surface of the board may be selected. The component locations can be selected based on the available space around the board in its installation configuration. At 6306, trace locations and trace locations for the board can be determined. The trace locations may become thicker at locations where more board warpage is expected.

At 6308, board stiffness characteristics can be selected. The trace material in the trace layers may then be left in predetermined areas or removed in certain areas to adjust the stiffness or flexibility properties of the board. Also, one or more layers may be dedicated to adjustment of the stiffness characteristics of the board. For example, a metal layer selected for its strength can be used to keep the shape after the board is bent.

At 6310, a bendable PCB may be formed in accordance with the specifications determined above. The PCB may be formed in a planar shape or may be formed in a bent state. Various components can be attached to the PCB. At 6312, the portable computing device can be assembled using the formed PCB. The assembly process may include installing the formed PCB in a flexure configuration. The formed PCB may be bent more than once during the assembly process.

In certain embodiments, the portable computing device may be assembled using a computer assisted manufacturing and assembly process. The computer assisted manufacturing and assembly process may involve the use of multiple devices, such as multiple devices configured in an assembly line configuration. For example, at 6310, in a first computer-aided assembly process, multiple devices may be programmed to form a bendable PCB in accordance with the specifications determined at 6302-6308. The first computer-aided assembly process may include programming the different devices to form the board substrates and / or cut into specific shapes, and to form specific trace patterns that may be different for each substrate layer on the PCB. Other computer assisted manufacturing processes may require devices such as robot assemblies that can be programmed to assemble a portable computing device. The robot assemblers can be programmed to move the PCB through one or more flexure configurations during assembly of the portable computing device.

68 is a block diagram of a media player 6400 in accordance with the described embodiments. Media player 6400 includes a processor 6402 associated with a microprocessor or controller for controlling the overall operation of media player 6400. [ Media player 6400 stores media data associated with media items in file system 6404 and cache 6406. The file system 6404 is typically a storage disk or a plurality of disks. The file system typically provides mass storage capability for the media player 6400. However, since the access time to the file system 6404 is relatively expensive, the media player 6400 also includes a cache 6406. [ The cache 6406 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to cache 6406 is significantly shorter than for file system 6404. [ However, the cache 6406 does not have a large storage capability of the file system 6404.

In addition, the file system 6404 consumes more power than the cache 6406 upon activation. Power consumption is particularly important when the media player 6400 is a portable media player that is powered by a battery (not shown).

Media player 6400 also includes a user input device 6408 that allows a user of media player 6400 to interact with media player 6400. [ For example, the user input device 6408 may take various forms such as a button, a keypad, a dial, and the like. The media player 6400 also includes a display 6410 (screen display) that can be controlled by the processor 6402 to display information to the user. The data bus 6411 may facilitate data transfer between at least the file system 6404, the cache 6406, the processor 6402 and the codec 6412.

In one embodiment, the media player 6400 is responsible for storing a plurality of media items (e.g., songs) in the file system 6404. When the user wants the media player to play a particular media item, a list of available media items is displayed on the display 6410. [ The user may then use the user input device 6408 to select one of the available media items. Processor 6402 provides the coder / decoder (codec) 6412 with media data (e.g., an audio file) for a particular media item upon receipt of a selection of a particular media item. The codec 6412 then generates analog output signals for the speaker 6414. The speaker 6414 may be a speaker inside the media player 6400 or outside the media player 6400. For example, headphones or earphones connected to the media player 6400 will be considered external speakers.

Small form Factor  Audio using connectors in electronic devices Porting

Aspects of the described embodiments relate to small form factor electronics. In the remainder of this description, a small form factor electronic device is described in connection with a personal media device. The personal media device may include a housing adapted to surround and support the various operating components. The housing can support a variety of input and output mechanisms such as volume switches, power buttons, data and power connectors, audio jacks, and the like. The housing may include openings for receiving input / output mechanisms. The locations at which the input and output mechanisms are disposed may be selected to enhance the usability of the interface under the conditions intended for the device to operate. For example, in the case of a device intended to be operated by one hand, input mechanisms such as an audio control switch can be placed in a position where the device is easily manipulated with the finger while being held in the palm of the hand. Other output mechanisms, such as audio jacks, may be located at locations that do not interfere with the holding of the device, e.g., at the upper edge of the device.

Device components that are connected to the personal media device and allow the personal media device to operate for its intended functions may be packaged in the enclosure. As long as sufficient space is available for the necessary connections between the components, certain flexibility may be provided in relation to the locations of the internal device components. In addition, approaches such as custom printed circuit boards (PCB) or batteries can be used to make efficient use of the available internal spaces. The personal media device may include audio circuitry adapted to generate audible sound. The audible sound may be generated by a sound device that receives and uses audio signals to adjust the volume of air in the enclosure. In one embodiment, the audible sound may be generated by an audible sound generator placed within the housing. The audible sound may take the form of music provided by decoding music files held in the personal media device. The audible sound may be actively ported through two or more openings in the housing of the personal media device. The audible sound generator may take the form of acoustic loudspeakers with at least a diaphragm, and the acoustic loudspeakers may be placed in a sound enclosure, also referred to as a speaker box. In one implementation, the apertures may include a first aperture in the housing used to direct at least a portion of the audible sound produced by the acoustic speakers. A second aperture can be used to direct at least the remaining portion of the audible sound produced by the acoustic speakers. The second opening may be associated with the connector assembly and may be referred to as a connector port.

The connector assembly used to accommodate the connector port can be widely varied. For example, the connector assembly may take the form of a data / power connector (such as a standard 30 pin type connector). The connector assembly may be associated with an output device, such as an audio jack, having an audio jack barrel sized and shaped according to an audio post. The audio post can be inserted into the audio jack barrel. In this manner, the electrical contacts on the audio post contact the corresponding contact pads on the inner surface of the audio jack barrel, allowing electrical signals to be transmitted between the external circuitry (such as headphones) and the personal media device. Typically, when the audio post is inserted into the audio jack barrel, the acoustic speakers are disabled, so that the insertion of the audio jack in the audio jack barrel does not interfere with the output of the audible sound.

In order to enhance the listening experience, the internal dimensions of the connector port / speaker assembly may be acoustically optimized for the transmission of sound energy. In one implementation, the housing port and the connector port may have different sizes. One of the advantages of using more than one port is that the overall audio experience can be improved due to an increase in the partially recognized sound volume. In addition to increasing the overall recognition volume, the configuration of the housing port and connector port makes it very unlikely to completely cover both the housing port and the connector port. Thus, the user can grasp the personal media device without having to worry about completely shutting off the air path from the speakers to the external environment. Moreover, the presence of the second port reduces the overall resistance to airflow in the air path from the speaker to the outside world, thus providing a better acoustic experience.

These and other embodiments are described below with reference to Figures 71-82. However, it will be readily understood by those skilled in the art that the detailed description provided herein with respect to these drawings is for purposes of illustration only and should not be construed as limiting.

Figures 71-72 are perspective views illustrating various views of a fully assembled personal media device 7100 in accordance with an embodiment of the present invention. The portable media device 7100 may have a size for placement in small areas such as one hand operation and a pocket, i.e., the personal media device 7100 may be a handheld pocket sized electronic device. For example, the personal media device 7100 may correspond to a computer, a media device, a communication device, and the like. The personal media device 7100 may process media such as data, more specifically audio. The personal media device 7100 can generally correspond to a music player, a game player, a video player, a personal digital assistant (PDA), and the like. In connection with being handheld, the personal media device 7100 can be manipulated with only the user's hand (s), i.e. no reference surface such as a desktop is needed. In some instances, the handheld device has a size for placement in a pocket of a user. Because of the pocket size, the user does not have to carry the device directly, so the device can be carried almost anywhere that the user moves (e.g., the user is not limited by carrying a large, large, heavy device) .

The personal media device 7100 can be widely varied. In some embodiments, the personal media device 7100 can perform a single function (e.g., a device dedicated to playing and storing media), and in other instances a personal media device can perform a number of functions (E.g., a device that plays / stores media, receives / sends a telephone call / text message / Internet, and performs web browsing). The personal media device 7100 may communicate wirelessly (with or without assistance of a wireless enabling accessory system) and / or through wired paths (e.g., using conventional electrical wires). In some embodiments, the personal media device 7100 may be extremely portable (e.g., small form factor, thin, low profile, light weight). The personal media device 7100 may have a size for placement in small areas, such as one hand operation and a pocket, i.e., the personal media device 7100 may be a handheld pocket sized electronic device. The personal media device 7100 may correspond to any electronic device, such as an iPod ^TM or iPhone ^TM , available from Apple Inc. of Cupertino, CA.

The personal media device 7100 may include a housing 7102 configured to at least partially surround any suitable number of components associated with the personal media device 7100. [ For example, the housing 7102 may surround and support a variety of electrical components (including integrated circuit chips and other circuitry) to provide computing operations for the device. Integrated circuit chips and other circuits may include a microprocessor, memory, battery, circuit board, I / O, various input / output (I / O) support circuits, Although not shown in this figure, the housing 7102 may define a cavity in which components may be disposed, and the housing 7102 may also define a housing 7102 within the housing 7102 or within openings through the surface of the housing 7102, Lt; RTI ID = 0.0 > of the < / RTI >

In addition, the housing 7102 may at least partially define the appearance of the personal media device 7100. In other words, the shape and shape of the housing 7102 may help define the overall shape and shape of the personal media device 7100, or the shape of the housing 7102 may embody the physical appearance of the personal media device 7100 have. Any suitable shape may be used. In some embodiments, the size and shape of the housing 7102 can be adjusted to fit comfortably in the user's hand. In some embodiments, the shape includes slightly curved back and heavily curved sides. The housing 7102 is integrally formed in such a manner as to constitute a complete single unit. By being integrally formed, the housing 7102 has a seamless appearance unlike a conventional housing including two parts that are fastened together to form a leak and a joint therebetween. That is, unlike traditional housings, housing 7102 does not include any gaps and is therefore more robust and aesthetically pleasing. The housing 7102 may be formed of any number of materials including, for example, plastic, metal, ceramic, and the like. In one embodiment, the housing 7102 may be formed of stainless steel to provide structural integrity and support for all subassemblies installed therein, as well as providing aesthetic and attractive appearance and feel. When it is a metal, the housing 7102 can be formed using conventional collapsible core metal forming techniques known to those skilled in the art.

The personal media device 7100 also includes a cover 7106 that includes a planar outer surface. The outer surface may flush, for example, at the same height as the edge of the housing wall surrounding the edge of the cover. The cover 7106 cooperates with the housing 7102 to enclose the personal media device 7100. The cover 7106 may be disposed in various ways compared to the housing, but in the illustrated embodiment, the cover 7106 is disposed in and near the mouth of the cavity of the housing 7102. [ That is, the cover 7106 is fitted in the opening 7108. In an alternative embodiment, the cover 7106 may be opaque and may include a touch sensing mechanism to form the touchpad. The cover 7106 may be configured to define / carry the user interface of the personal media device 7100. [ The cover 7106 may provide a viewing area for the display assembly 7104 that is used to display to the user other information (e.g., text, objects, graphics) as well as a graphical user interface (GUI). Display assembly 7104 may be part of a display unit (not shown) that is assembled and included in housing 7102. [ Such user input events may be used for any number of purposes, such as resetting the personal media device 7100, selecting between display screens provided on the display assembly 7104, and the like. In one embodiment, the cover 7106 is a protective upper layer of a transparent or translucent material (clear), and thus the display assembly 7104 is visible through it. That is, the cover 7106 serves as a window for the display assembly 7104 (i.e., a transparent cover is disposed over the display screen). In one particular embodiment, the cover 7106 is formed from glass (e.g., cover glass), and more specifically, highly polished glass. However, it should be appreciated that other transparent materials such as clear plastic can be used.

The viewing area may sense the touch to receive one or more touch inputs to help control various aspects of what is being displayed on the display screen. In some instances, more than one input may be received at the same time (e.g., multi-touch). In these embodiments, a touch sensitive layer (not shown) may be disposed under the cover glass 7106. The touch sensitive layer may be disposed, for example, between cover glass 7106 and display assembly 7104. In some examples, the touch sensitive layer is applied to the display assembly 7104, while in other examples, the touch sensitive layer is applied to the cover glass 7106. The touch sensitive layer may be affixed (e.g., printed, deposited, laminated, or bonded) to the inner surface of cover glass 7106, for example. The touch sensitive layer generally includes a plurality of sensors configured to be activated when a finger touches an upper surface of the cover glass 7106. [ In the simplest example, an electrical signal is generated whenever a finger passes the sensor. The number of signals in a given time frame may indicate the position, direction, speed and acceleration of the finger on the touch sensitive portion, i.e. more signals may indicate that the user has moved his finger more. In most instances, signals are monitored by an electronic interface, which converts the number, combination, and frequency of signals into position, direction, velocity, and acceleration information. This information can then be used by the personal media device 7100 to perform the desired control functions on the display assembly 7104.

The personal media device 7100 may also include one or more switches including a power switch, a volume control switch, a user input device, and the like. The power switch 7110 may be configured to turn on and off the personal media device 7100 while the volume switch 7112 is configured to change the volume level generated by the personal media device 7100. [ The personal media device 7100 may also include one or more connectors for communicating data and / or power to and from the personal media device 7100. [ For example, opening 7115 may accommodate audio jack 7116, while opening 7117 may accommodate data / power connector 7118. The audio jack 7116 allows audio information to be output from the personal media device 7100 via a wired connector, while the connector 7118 is coupled to a host device such as a general purpose computer (e.g., a desktop computer, a portable computer) Thereby allowing data to be transmitted and received therefrom. The connector 7118 can be used to upload or download audio, video, and other image data, as well as an operating system, applications, etc., to and from the personal media device 7100. For example, connector 7118 may be used to download songs and playlists, audiobooks, pictures, etc. into the storage mechanism (memory) of personal media device 7100. The connector 7118 also enables power to be delivered to the personal media device 7100.

The portion 7200 of the personal media device 7100 may include a plurality of communication features. For example, portion 7200 may include at least a first audio port 7120 that may be used to output a first portion of the audible sound produced by the audible sound generator assembly contained within housing 7102 . Audible sound generator assemblies can take many forms. However, in the illustrated embodiment, the audible sound generator assembly includes at least a diaphragm arranged to vibrate in synchronization with the audio signals provided by the processing unit contained within the personal media device 7100. [ The audio signals may be provided by a processing unit that decodes the audio data files held in the personal media device 7100. [ The second audio port 7122, which is contained within the connector assembly 7118, can be used to output the remaining portion of the audible sound produced by the audible sound generator assembly. In this manner, the first audio port 7120 and the second audio port 7122 can cooperatively output the audible sound produced by the audible sound generator assembly. The cooperation means that the placement of the second audio port 7122, for example when the first audio port 7120 is intercepted or interrupted (by finger, clothing, etc.), substantially eliminates the possibility that the second audio port 7122 is also blocked It means to exclude. Thus, the first audio port 7120 and the second audio port 7122 share an air path from the audible sound generator to the external environment, so that a portion of the air path (e.g., the first audio port 7120 and At least a portion of the first portion of the audible sound produced by the audible sound generator assembly is manually redirected to the second audio port 7122 when the audible sound generator assembly is intercepted or interrupted, .

By way of example, connector assembly 7118 may receive an external connector (such as a 30-pin connector) such that when a connector is coupled with connector assembly 7118, a substantial portion of second audio port 7122 is blocked or interrupted . In such a situation, the user of the personal media device 7100 is unlikely to grasp the housing 7102 in such a way as to obstruct or block the first audio port 7120. The presence of the first audio port 7120 can be detected from the second audio port 7122 to the first audio port 7120 even if the combined connector is capable of substantially blocking or interrupting the second audio port 7122. [ Lt; RTI ID = 0.0 > audio output level < / RTI >

Figure 73 shows a cross-sectional view of the portable electronic device 7100 shown in Figures 71-72. Housing 7102 may surround various internal device components, such as those associated with a user interface, that allow the personal media device 7100 to operate for its intended functions. For purposes of illustration, internal device components may be considered to be arranged in multiple stacked layers. For example, the display screen of the display assembly 7104 may be disposed directly beneath the top glass 7106. In one embodiment, the display screen and associated display driver circuitry may be packaged together as part of display assembly 7104. Beneath display assembly 7104 may be disposed device circuitry 7130, such as circuitry associated with a major logic board or other components, and battery 7132, which powers the personal media device 7100. [

The inner frame 7140 can increase the overall stiffness of the personal media device 7100, for example by improving its ability to withstand the bending moments experienced by the housing 7102. [ The inner frame 7140 can be formed of many strong resilient materials. For example, when inner frame 7140 is formed of a metal such as stainless steel, inner frame 7140 may be referred to as M (metal) -frame 7140. The M-frame 7140 not only provides structural support for the personal media device 7100, but may also serve to facilitate delivery of heat generated by various internal components to the external environment. The M-frame 7140 may be disposed below the display assembly 7104 and above the device circuitry 7130. In this manner, M-frame 7140 may provide support for various internal components, as well as help transfer heat from internal components such as display assembly 7104.

M-frame 7140 may be used as an attachment point for other device components. For example, the M-frame 7140 may be attached to the mounting surface, such as 7134a and 7134b, on the housing 7102 via fasteners or using a bonding agent. Other device components, such as display assembly 7104, may then be coupled to M-frame 7140 rather than directly coupled to housing 7102. [ One advantage of coupling the display assembly 7104 to the housing via the M-frame 7140 is that the display 7104 can be somewhat isolated from the bending moment associated with the housing 7102, i.e., The bending moment may be dissipated into the M-frame 7140. Isolating the display assembly 7104 from the bending moment associated with the housing 7102 can prevent damage to the display assembly 7104, such as cracks, from occurring.

It should be noted that in some embodiments the personal media device 7100 may include additional internal frames. For example, a frame 7150 can be attached directly to the housing 7102 and can generally act to support the top glass 7106. [ In this regard, frame 7150 may be referred to as G (glass) -frame 7150. Frame 7150 can include rim 7152 with flange portion 7154 and cover glass 7106 can be attached to rim 7152 near flange 7154 to support cover glass 7106. [ And the entire device is sealed. The G-frame 7150 can be made of a non-conductive frame material such as glass filled plastic. One exemplary glass-filled plastic suitable for use in G-frame 7150 is KALIX ^TM manufactured by Solvay Advanced Polymers of GA Alpharetta. KALIX ^TM contains 50% glass fiber reinforced high performance nylon. One of ordinary skill in the art will recognize that there are many other potential frame materials suitable for use in this embodiment, and unless the claims are explicitly recited, they are limited to KALIX ^TM or any other glass- .

74 shows an enlarged view of a portion 7200 of the housing 7102 shown in FIG. 72 shown in a front view. In the remainder of this description and without loss of generality, the first audio port 7120 will be referred to as the housing port 7202 and the second audio port 7122 will be referred to as the connector port 7204. The housing port 7202 may have a size and shape that maintains the overall shape and appearance of the housing 7102. For example, the sidewalls 7206 of the housing 7102 may have a spline or curved shape that helps the user hold the personal media device 7100 in the hand. Thus, the housing port 7202 can be formed to more easily match the shape of the side walls 7206. The housing port 7202 may be disposed at a distance "d" from the back surface 7208 of the housing 7102. [ The housing port 7202 can be configured in such a way that the sound 7210 emitted from the housing port 7202 can be oriented at an angle of &thetas; toward the back surface 7208 of the housing 7102 as shown in FIG. 75 have. In this manner, when the personal media device 7100 is placed on the support surface S, the audible sound 7210 emitted from the housing port 7202 can be oriented at an angle of &thetas; , At least a portion of the audible sound 7210 may be directed towards the support surface S. In this way, the support surface S can act as a sound board, and thus at least a portion of the audible sound 7210 can be reflected from the support surface S, providing more robust sounding audio.

76 shows a view of the interior 7500 of the personal media device 7100 in accordance with the described embodiments. 76, M-frame 7140 can be used to provide support for various internal components, such as audio sound generator assembly 7504 and connector assembly 7506. [ In the illustrated embodiment, the audio sound generator assembly 7504 may be secured to the housing 7102 via a G-frame 7150 and an M-frame 7140. The connector assembly 7506 may be surface mounted to a printed circuit board (PCB) 7508. Audio sound generator assembly 7504 may include a speaker box 7510 having a first portion 7512 and a second portion 7514. The first portion 7512 may include an audio sound generator unit 7516 arranged to provide audible sound 7518. The first portion 7512 may be configured to provide a first air path 7520. The first air path 7520 can acoustically couple the audio sound generator unit 7516 and the housing port 7202 through the housing port assembly 7522. [ The first portion 7524 of the audible sound 7518 is transmitted from the audio sound generator unit 7516 via the housing port assembly 7522 and the housing port 7202 using the first air path 7520 to the outside Environment.

The second portion 7514 may be formed integrally with the first portion 7512. A second portion 7514 (also referred to as a "side car" portion) may be configured to provide a second air path 7526. The second air path 7526 can acoustically couple the audio sound generator unit 7516 and the connector port 7204 through the connector assembly 7506. In this manner, the second portion 7528 of the audible sound 7518 can be communicated from the audio sound generator unit 7516 to the external environment via the connector port 7204 using the second air path 7526. To assure secure attachment of the audio sound generator assembly 7504, a fastener 7530 can be used. The fastener 7530 can be widely varied. The fastener 7530 can take the form of a screw 7530 that secures the audio sound generator assembly 7504, the M-frame 7140 and the connector assembly 7506 to the housing 7102.

The presence of at least two parallel air paths in the form of the first air path 7520 and the second air path 7526 has many benefits. One such benefit is that the presence of at least two air paths reduces the overall resistance to air flow, thereby reducing the amount of audible sound energy lost during normal operation. In this way, audible efficiency (i.e., perceived sound level at a given volume input level) can be significantly increased. In addition, by providing at least two parallel air paths through which the audible sound 7518 produced by the audible sound generator unit 7516 can travel, any increase in resistance to airflow occurring in one air path Can be compensated at least in part by passive redirection to other air paths that represent an air path of less resistance. In this way, even if one audio output port is partially or even completely blocked, the recognized output sound level will not substantially decrease. In this manner, the preservation of the audio presentation provided by the personal media device 7100 can significantly improve user perception of the audio performance of the personal media device 7100.

For example, when the audio sound generator unit 7516 is providing audible sound 7518, the first portion 7524 can be communicated to the housing port 7202 via the first air path 7520. The second portion 7528 of the audible sound 7518 may be simultaneously transmitted to the connector port 7204 through the second air path 7526. When recognized by the user, the recognized sound levels (i.e., acoustic energy levels) at the housing port 7202 and connector port 7204 are approximately the same. That is, full audio recognition will cause the listener to conclude that the audible sound 7210 is being emitted from a substantially single location, rather than at least two locations. However, if, for example, a user places a finger or other object in a position that blocks or interferes with the housing port 7202, the resistance to air flow in the air path 7520 will increase significantly, The amount of acoustic energy output will be significantly reduced. In this situation, the increase in resistance to air flow experienced in the first air path 7520 is such that at least a portion of the first portion 7524 is passively (e.g., biased) from the first air path 7520 to the second air path 7526 It can be redirected. In this way, even though the amount of acoustic energy output at the housing port 7202 is significantly reduced, the amount of acoustic energy output at the connector port 7204 is reduced from the first air path 7520 to the second air path 7526, Lt; / RTI > can be significantly increased due to manual redirection of the acoustic energy into < RTI ID = 0.0 > In this way, the perceived overall audio output level (i.e., volume level) can be maintained substantially unchanged.

Thus, the overall integrity of the first air path 7520 and the second air path 7526 is particularly advantageous in terms of audio efficiency, the perception of audio balance between the various output ports, and the ability to maintain the overall sound experience Lt; RTI ID = 0.0 > at least < / RTI > For example, any systematic increase in resistance to airflow in the air path can reduce the overall audio efficiency of the audio sound generator assembly 7504. For example, the second air path 7526 is directly connected to the external environment through the connector port 7204. In order to prevent the ingress of dust and other debris from the external environment to degrade the quality of the air pathway 7526 (e.g., by increasing the systematic resistance to airflow due to accumulation of debris), the connector port 7204 And the second portion 7514. The filter portion 7532 may be disposed between the first portion 7514 and the second portion 7514. [ The filter 7532 (described in greater detail below and shown below) can be used to prevent debris such as water and dust from contaminating the second air path 7526. Moreover, in the embodiments described, the filter 7532 is robust and accessible so that it can provide the ability to periodically clean the filter 7532 without causing damage to the user. Further, a foam seal 7533 and a foam seal 7535 can be applied simultaneously to the housing port 7202 and the connector port 7204. The foam seal 7535 used to air seal the housing port 7202 may take the form of a relatively thick foam layer and decorative mesh while the foam seal 7535 may be in the form of a wrap It can take the form of a foam ring using a lap joint.

In a particularly useful embodiment, filter 7532 may take the form of a decorative / hydrophobic mesh laminate 7532 that may be disposed within air path 7526. When placed in air path 7526, the decorative / hydrophobic mesh laminate 7532 can prevent moisture and dust from penetrating into the personal media device 7100. The mesh laminate 7532 may comprise a plurality of layers including at least a mesh layer. The mesh layer may provide a decorative screen that may prevent direct viewing of the interior of the personal media device 7100 from the external environment. Generally, the mesh portion of the mesh laminate 7532 can be formed of a rugged waterproof material. In some instances, the mesh material may be strong enough to provide at least some structural support for the connector port 7204. The strength of the decorative mesh can be large enough, for example, to resist damage caused by the insertion of an object into the connector port.

In addition to protecting the interior of the personal media device 7100, as well as providing protection from dust and water infiltration, the mesh is kept accessible for cleaning and debris removal. The accessibility of the mesh is particularly useful because dust or other debris is very likely to be collected in the mesh laminate 7532. The dust or other debris collected in the mesh can be particularly harmful because contaminants such as dust are collected in the mesh and interfere with the output of audible sound and thus can affect the overall performance of the personal media device 7100 as well as the overall user experience As shown in FIG. By simply inserting a cleaning tool such as a damp cotton swab, the dust and lint-like debris from the mesh can be cleaned to prevent the sealing from being hindered and the sound output from being deteriorated.

Features such as air seal 7534 can be used to help maintain the integrity of second air path 7526. Air seal 7534 may be used to seal the junction between the back portion and second portion 7514 of connector assembly 7506. Seal 7534 can be formed of any suitably compliant material having suitable sealing properties. For example, the seal 7534 may take the form of a foam seal 7534. Because of the compressibility of the foam, the foam seal 7534 can be compressed in place between the adapter 7536 of the second portion 7514 (shown in FIG. 77) and the adapter 7538 of the connector assembly 7506. In the illustrated embodiment, adapter 7536 may be formed along adapter 7538 such that adapter 7536 can be tightly coupled together. In this manner, the adapter 7536 can be tightly coupled into the receiving space provided by the adapter 7538.

During assembly, the audio sound generator unit 7504 can be placed in the housing 7102 using tilting motion. The tilting action may cause the adapter 7536 to tilt into and be received by the adapter 7538 and at this point the pressure is applied to the second portion 7514 to cause the audio sound generator unit 7504 to engage the connector assembly 7506 ) And the PCB 7508, respectively. By tilting and applying pressure, the adapter 7536 compresses the foam seal 7534 between the adapter 7536 and the adapter 7538 so that the foam seal 7534 is subjected to significant pressure. The adapter 7538 may be configured to enhance the pressure exerted by the foam seal 7534 so that the foam seal 7534 may block the penetration of moisture or other contaminants into the air path 7526 At least substantially inhibiting the ability to improve. Batch pins associated with the second portion 7514 may be used for tilting in the insertion process. The placement pins may have a configuration and location configured to be inserted through a receiving aperture in the PCB 7508. The PCB 7508 and connector assembly 7506 are soldered together during the reflow process so that the placement pin also includes a second portion 7514 at a location where the second portion 7514 can not be easily separated from the connector assembly 7506 .

Moreover, the retention feature 7540 can be used to further ensure the integrity of the air seal of the second air path 7526. The hold feature 7540 can be coupled to the M-frame 7140 and prevents the adapter 7536 and the adapter 7538 from being separated when coupled in place. Thus, the M-frame 7140 may be disposed on top of the connector assembly 7506 and the speaker box 7510. M-frame 7140 may include fingers that may be coupled within a retaining feature 7540 that may be disposed on a shell portion of connector assembly 7506 in one embodiment. The M-frame 7140 may also include spring fingers that can apply a load to one side of the second portion 7514 that faces the connector assembly 7506. The force generated by the spring fingers can cause the foam seal 7534 to be over-compressed at the junction of the adapter 7534 and the adapter 7536. [ Thus, when in place, the M-frame 7140 can prevent the connector assembly 7506 and the second portion 7514 from being separated. It should be noted that the audible sound generation unit 7504 may be firmly installed in the M-frame 7140 and the G-frame 7150. This rigid mounting can help prevent buzzing and amplify audible sound through the housing backing 7208, which can be reinforced when the personal media device 7100 is on a hard surface such as a desk or table .

77 shows a close-up view of the portion 7600 shown in Fig. Portion 7600 provides a more detailed view of the connection of connector assembly 7506 and second portion 7514. [ Particularly, portion 7600 represents additional detail of the mesh lamination of filter 7532. The filter 7532 may be formed of a decorative mesh 7602 that is used to partially prevent other contaminants such as water and dust from entering and deteriorating into the second air path 7526. During assembly of the personal media device 7100, the connector assembly 7506 is mounted and attached to the PCB 7508 using surface mounting techniques referred to as solder reflow or more simply as reflow. During the reflow process, molten solder is used to electrically connect the various components on the electrical pads and traces that are part of the PCB 7508. The filter 7532 can not withstand the reflow process used to surface mount the connector assembly 7506 to the printed circuit board 7508 and therefore the filter 7532 can be connected to the connector It can not be an integral part of the assembly 7506. The filter 7532 may thus be installed using techniques that may be referred to as "portcullis" (i.e., sliding gate) assembly techniques after the connector assembly 7506 has been surface mounted to the PCB 7508 have. Like the sliding gate, the filter 7532 can be dropped in place during assembly using slots or grooves. Once in place, the filter 7532 can be sealed in place using an adhesive such as glue. In this manner, the filter 7532 can be sealed to prevent environmental contaminants from entering the interior of the personal media device.

78 shows a cross-sectional view 7700 along the line AA in FIG. 76; FIG. Cross-sectional view 7700 shows the sealing ability of the foam seal 7534 and the relationship between the adapter 7536 and the adapter 7538. In particular, by using the retaining spring 7701, the _retention force (F _retention ) can be directly applied to the second portion 7514. [ The _retention force F _retention may then cause the adapter 7536 to collide directly onto the "spear" shaped portion 7702 of the adapter 7538. [ In this manner, the chamfered surfaces 7704,7706 of the window portion 7702 form a _foam (not shown) for the M-frame 7140 with the components of the _retention (F _retention ) Can be directed to the "over-compression" portion 7708 of the seal 7534, thus significantly increasing the sealing ability of the foam seal 7534. The audible sound generating unit 7504 has a Size, and shape of the connector assembly 7506. During assembly of the personal media device 7100, the connector assembly 7506 may be coupled to the PCB 7508 using connector alignment pins 7714 in the PCB opening 7716. [ Of the seal 7718. The seal 7718 can be used to improve the seal and thus reduce the likelihood of sound leakage.

79 may be used instead of or in addition to connector port 7204 to enable audio jack port 7900 to be used to output audible sound generated by audible sound generator unit 7516 using audio jack air path 7902 Other embodiments are shown. Audio jack air path 7902 may acoustically connect audible sound generator unit 7516 to audio jack unit 7904. In particular, the second portion 7514 may be connected to the audio jack unit 7904, for example, in an audio jack barrel 7906. [ In this manner, portion 7908 of audible sound 7518 may be emitted from audio jack port 7900 when not occupied by the audio jack post. When an audio jack post is inserted into the audio jack barrel 7906, the audible sound generator unit 7516 is typically disabled and thus provides no conflict with any potentially audible sound emitted from the audio jack port 7900 It should be noted that it does not.

80 shows a flow chart detailing process 8000 in accordance with the described embodiments. Process 8000 may begin at 8002 by providing a housing for surrounding a plurality of operating components used to provide the functionality of the personal media device. The housing may be formed of a metal such as stainless steel or aluminum, and may have a seamless monolithic structure. The housing may include a plurality of openings each having a size and shape for receiving input / output devices, switches, connectors, and the like. Then, at 8004, the speaker assembly can be attached to the interior of the housing. The speaker assembly may take various forms. In the described embodiments, the speaker assembly includes an acoustic speaker, for example formed in a diaphragm, that vibrates according to the electrical signals provided by the audio circuitry for decoding the audio files held in the personal media device. Then, at 8006, a first air path is constructed. The first air path acoustically couples the speaker assembly to the external environment through the first audio output port. In the illustrated embodiment, the first audio output port may take the form of an opening in the housing. Then, at 8008, a second air path is configured between the speaker assembly and a second audio output port independent of the first audio output port. Independent means that the first audio output port and the second audio output port can be physically located such that one or the other of the ports can be blocked by an object such as a user's finger but not both . In this way, at least one of the audio ports can always remain substantially unblocked.

At 8010, audible sound is generated by the speaker assembly. At 8012, the audible sound is cooperatively communicated from the speaker assembly to the external environment using the first and second audio ports. The cooperative propagation is such that an increase in resistance to the transfer of acoustic energy in one air path leads to a passive redirection of at least a portion of the acoustic energy from the higher resistance air path to the lower resistance air path Which means that the second air path is connected. For example, if the first audio output port is interrupted or at least disturbed and an increase in resistance to the flow of acoustic energy in the first air path occurs, at least a portion of the acoustic energy to be interrupted is redirected to the second air path. In this way, the perceived audio output level by the personal media device is maintained substantially unchanged.

81 is a block diagram of an arrangement of functional modules 8100 used by a portable media device. The portable media device may be, for example, the portable media device 7102 shown in Figures 71 and 72. The array 8100 includes a media player 8102 that can output media for a user of the portable media device as well as store and retrieve data in association with the data storage device 8104. [ Array 8100 also includes a graphical user interface (GUI) manager 8106. [ The GUI manager 8106 operates to control information displayed and provided to the display device. The arrangement 8100 also includes a communication module 8108 that facilitates communication between the portable media device and the accessory device. Array 8100 also includes an accessory manager 8110 that operates to authenticate and acquire data from an accessory device that may be coupled to the portable media device. For example, the accessory device may be a wireless interface accessory, such as the wireless interface accessory 7106 shown in FIG. 71, coupled to the portable media device 7102.

82 is a block diagram of a media player 8150 suitable for use in the described embodiments. Media player 8150 represents the circuitry of a representative portable media device. Media player 8150 includes a processor 8152 associated with a microprocessor or controller for controlling the overall operation of media player 8150. [ Media player 8150 stores media data associated with media items in file system 8154 and cache 8156. File system 8154 is typically a storage disk or a plurality of disks. File system 8154 typically provides mass storage capability for media player 8150. [ However, since the access time to the file system 8154 is relatively expensive, the media player 8150 may also include a cache 8156. [ The cache 8156 is, for example, a random access memory (RAM) provided by a semiconductor memory. The access time relative to cache 8156 is significantly shorter than for file system 8154. [ However, cache 8156 does not have a large storage capability of file system 8154. [ In addition, the file system 8154 consumes more power than the cache 8156 upon activation. Power consumption is often a problem when media player 8150 is a portable media device powered by battery 8174. [ Media player 8150 may also include RAM 8170 and read only memory (ROM) ROM 8172 may also store programs, utilities, or processes to be executed in a nonvolatile manner. RAM 8170 provides volatile data storage for cache 8156, for example.

Media player 8150 also includes a user input device 8158 that allows a user of media player 8150 to interact with media player 8150. [ For example, the user input device 8158 may take various forms such as a button, a keypad, a dial, a touch screen, an audio input interface, a video / image capture input interface, an input in the form of sensor data, In addition, media player 8150 includes a display 8160 (screen display) that can be controlled by processor 8152 to display information to a user. The data bus 8166 may assist in transferring data between at least the file system 8154, the cache 8156, the processor 8152 and the codec 8163.

In one embodiment, media player 8150 is responsible for storing a plurality of media items (e.g., songs, podcasts, etc.) within file system 8154. When the user wants the media player to play a particular media item, a list of available media items is displayed on the display 8160. [ The user may then use the user input device 8158 to select one of the available media items. Processor 8152 provides media data (e.g., an audio file) to a coder / decoder (codec) 8163 for a particular media item upon receipt of a selection of a particular media item. The codec 8163 then generates analog output signals for the speaker 8164. The speaker 8164 may be a speaker inside the media player 8150 or outside the media player 8150. [ For example, headphones or earphones connected to media player 8150 may be considered external speakers.

Media player 8150 also includes a network / bus interface 8161 coupled to data link 8162. [ Data link 8162 allows media player 8150 to be coupled to a host computer or accessory devices. The data link 8162 may be provided via a wired connection or a wireless connection. For wireless connections, the network / bus interface 8161 may include a wireless transceiver. Media items (media assets) may be associated with one or more different types of media content. In one embodiment, the media items are audio tracks (e.g., songs, audiobooks, and podcasts). In another embodiment, the media items are images (e.g., pictures). However, in other embodiments, the media items may be any combination of audio, graphics, or video content.

In one embodiment, an internal antenna is used for Wi-Fi communication, such as those conforming to the IEEE 802.11 a, b, g, and n standards. Wi-Fi is typically used to wirelessly network computing devices, so generally computer-related information is transmitted over a Wi-Fi connection. However, other types of communications have increasingly been performed over Wi-Fi connections, including, for example, video phone calls, downloads of electronic books to tablet computers, and the like. The modular material antenna assembly described herein can be used for such Wi-Fi communications. In another embodiment, the internal antenna is used for short range wireless networking communications, such as those compliant with the Bluetooth ^TM standard.

In another embodiment, the internal antenna is used for wireless broadband (WiBB) communications such as IEEE 802.16, Local Multipoint Distribution Service (LMDS) and Multichannel Multipoint Distribution Service (MMDS), also known as WiMAX. In another embodiment, the internal antenna is used for cellular communication. (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Evolution-Data Optimized (EV-DO), Enhanced Data Rates for GSM Evolution (EDGE) Digital Enhanced Cordless Telecommunications), digital AMPS (IS-136 / TDMA), and Integrated Digital Enhanced Network (iDEN).

In some embodiments, the internal antenna is a broadband antenna that can be configured to receive a plurality of different frequency bands. In the future, additional bands are expected to evolve as new wireless services become available. The antenna designs of the various embodiments may be configured to operate over any suitable band or bands to cover any existing or new services of interest. If desired, multiple antennas may be provided to cover multiple bands, or one or more antennas may have wide bandwidth resonant elements to cover multiple communication bands of interest. One benefit of using a broadband antenna design that covers a large number of communication bands of interest is to reduce device complexity and cost and to minimize the amount of handheld devices that are allocated for antenna structures.

The broadband design may be used for one or more antennas in wireless devices when it is necessary to provide a plurality of discrete antennas or to cover a relatively larger range of frequencies without using tunable antenna arrays. If desired, the broadband antenna design may be tunable to extend its bandwidth coverage, or may be used in conjunction with additional antennas. However, broadband designs in general tend to reduce or eliminate the need for multiple antennas and tunable configurations.

In addition, embodiments of the present invention also relate to computer storage products having a computer readable medium having computer code for performing various computer implemented operations. The media and computer code may be those specially designed and constructed for the purposes of the present invention, or may be of a kind well known and available to those skilled in the computer software arts. Examples of computer-readable media include magnetic media such as hard disks, floppy disks, and magnetic tape; Optical media such as CD-ROM and DVD and hologram devices; Magneto-optical media such as magneto-optical disks; And hardware devices that are specially configured to store and execute program code, such as an application specific integrated circuit (ASIC), a programmable logic device (PLD), and a ROM and RAM device. Examples of computer code include machine code such as those generated by a compiler, and files containing high-level code executed by a computer using an interpreter.

In one embodiment, a computer-readable medium is provided that includes computer program instructions for performing the various steps of assembling a portable electronic device. In particular, the computer program instructions may be operable to control a variety of automated installation components such as, for example, a robotic arm, an automatic screw driver, etc., that may assemble the device without requiring human intervention (or at least minimizing human intervention) . In this manner, the computer instructions can be used to weld the bracket to the conductive housing, to bond the non-conductive frame to the interior of the conductive housing, to bond the portion of the antenna having the first shape and the portion of the frame having the second shape corresponding to the first shape Interlocking to secure the antenna block to the frame, mechanically fixing the antenna flex to the antenna block, e.g., by threading through the antenna flex and bracket, and the like.

Many features and benefits of the present invention are apparent from the description, and therefore, are intended to cover all such features and advantages of the present invention by the appended claims. In addition, various modifications and changes will readily occur to those skilled in the art, and the present invention should not be construed as limited to the exact construction and operation shown and described. Accordingly, all suitable modifications and equivalents may be regarded as falling within the scope of the present invention.

Claims (10)

A thermostructural component for a portable computing device,
Comprising an inner metal frame formed of at least two different metals,
The two different metals are arranged in layers,
The inner metal frame
Two outer metal layers formed of a first metal and configured to impart structural stiffness to the inner metal frame; And
An intermediate metal layer disposed between the two outer metal layers and formed of a second metal having a thermal conductivity greater than that of the first metal,
/ RTI >
Wherein the intermediate metal layer is configured to conduct heat such that heat generated by the heat generating component in the portable computing device is diffused out in the intermediate metal layer of the inner metal frame, The metal layer is connected through a cladding process;
Wherein the two outer metal layers comprise one or more openings for allowing a thermal bridge to thermally couple the intermediate metal layer to a surface of the heat generating component. The method according to claim 1,
Wherein the first metal is stainless steel and the second metal is copper. 3. The method according to claim 1 or 2,
Wherein the at least one opening is filled with a thermal conductive material. The method of claim 3,
Wherein the thermal conductive material is the second metal. 3. The method according to claim 1 or 2,
Wherein the two outer metal layers are formed of stainless steel, the intermediate metal layer is formed of copper, each of the stainless steel layers is 25% of the thickness of the inner frame, and the copper layer is 50% Thermal structural components. As a portable electronic device,
A housing having an overall thickness;
A plurality of device components disposed within the housing at different heights relative to the overall thickness of the housing;
An inner frame disposed at one height relative to the total thickness and coupled to the housing and formed of at least two different materials, the two different materials being arranged in layers,
Two outer layers formed of a first material and configured to add structural rigidity of the device; And
And an intermediate layer disposed between the two outer layers, the intermediate layer being formed of a second material having a thermal conductivity greater than that of the first material, wherein the heat generated by the plurality of device components The conductive layer being configured to conduct the heat to diffuse out in the intermediate layer, the two outer layers including a plurality of openings each exposing a portion of the intermediate layer; And
A plurality of thermal bridges each configured to thermally couple a heat generating surface associated with one of the plurality of device components to the intermediate layer through one of the plurality of openings proximate the heat generating surface,
≪ / RTI > The method according to claim 6,
Wherein the two outer layers are formed of a first metal and the intermediate layer is formed of a second metal. 8. The method of claim 7,
Wherein the two outer layers and the intermediate layer are connected via a cladding process. 9. The method of claim 8,
Wherein a portion of the intermediate layer is extruded into each of the apertures during the cladding process. The method according to claim 6,
Wherein the plurality of openings are disposed only in one of the two outer layers.

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