KR101416580B1

KR101416580B1 - Double-sided digitizer board with aluminum pattern and manufacturing method for thereof

Info

Publication number: KR101416580B1
Application number: KR1020140030372A
Authority: KR
Inventors: 최은국; 추정훈; 김보승
Original assignee: 하이쎌(주)
Priority date: 2014-03-14
Filing date: 2014-03-14
Publication date: 2014-08-06

Abstract

The present invention relates to a method and apparatus for manufacturing an electromagnetic induction type digitizer substrate using an electronic pen, in which aluminum having a relatively low conductivity and high conductivity is used as a main wiring layer, but an aluminum pattern having a double- The present invention relates to a double-sided digitizer substrate and a method of manufacturing the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a double-side digitizer substrate using an aluminum pattern, and a method of manufacturing the double-

The present invention relates to a digitizer substrate using aluminum and a method of manufacturing the same, and more particularly, to a method of manufacturing an electromagnetic induction type digitizer substrate using an electronic pen using aluminum having a relatively low cost and high conductivity as a main wiring layer, To a double-sided digitizer substrate using an aluminum pattern having a double-sided structure through an insulating layer formed through the insulating layer and a method for manufacturing the same.

The touch screen, which is the input / output means of the recently released mobile terminal, is a pressure sensitive type in which the machine senses the pressure change occurring when the touch screen is pressed, a capacitive type in which the machine senses the minute current flowing in the body, And the electromagnetic induction system that senses the electromagnetic waves generated by the electromagnetic induction system is used.

The first decompression method utilizes the phenomenon that pressure is increased compared to other parts by pointed pen or the like, and it is difficult to input with a soft, wide finger, and the recognition of 'multi touch' It has the advantage that it is difficult to select the precise position designated by the pen and the disadvantage that it is difficult. In addition, it is widely used for a personal digital assistant (PDA) or a control panel of a machine tool because the manufacturing cost is relatively low and the sharp object surface can be used as an input device.

The second capacitance equation is not input by ordinary pen or the like because it utilizes current generated from the skin. In addition, although multi-touch recognition is possible, it is difficult to select an accurate point, and there is a characteristic that recognition can be performed by using a glove through which electric current is passed or a special pen which can cause static electricity.

Finally, the electromagnetic induction method can recognize the intensity of the pressure of the dedicated pen, and it is possible to perform operations such as right and left clicks as a mouse. In the case of electromagnetic induction type touch screen, though it is impossible to multi touch, it is possible to perform fine manipulation considering the pressure like a brush, and it is possible to move coordinates when the pen is close to the screen without touching the actual touch.

The digitizer, which is a typical product using the electromagnetic induction type touch screen, can draw even a line of about 0.7 mm thickness using an electronic pen, so that it is possible to work more finely than a capacitive touch screen which usually senses a thickness of 3 to 4 mm And recently, devices equipped with a digitizer function in portable smart terminals and the like are being released.

The principle of the digitizer is that the digitizer panel on the bottom of the touch screen / display panel is equipped with a digitizer panel in which a thin metal film is formed, so that a thin electromagnetic field is generated by the power source, and the micro- And the electromagnetic pen is generated when the tip of the electronic pen approaches the touch screen. As a result, the electromagnetic field formed in the digitizer panel disposed on the lower side of the touch screen / display panel is deformed, And the motion of the electronic pen is analyzed.

Such a digitizer can be applied not only to a small portable terminal such as a smart phone but also to a large-sized tablet PC, a TV, and an electronic blackboard employing a large display, thereby reducing the manufacturing cost of the digitizer substrate and automating and simplifying the manufacturing process. There is a need for a large area digitizer and a manufacturing method that can be used for a small portable terminal device, a large-screen tablet PC, a TV, an electronic blackboard, and the like.

The FPCB, which is an important component of the digitizer, is manufactured by forming a copper foil on both sides of a pattern by using a double-sided FCCL (Flexible Copper Clad Laminate) with copper foil on both sides of an insulating substrate. FIG. 1 is a cross-sectional view illustrating a process of manufacturing such a conventional digitizer substrate. After a via 30 is formed by drilling so that the copper foil foil 20 laminated on both sides of the insulating substrate 10 is electrically connected, The copper layer 40 is formed on the entire surface of the substrate including the insulating layer 60 and the insulating layer 60. After forming the wiring layer through the exposure and etching processes using the dry film 50 having the wiring pattern formed thereon, .

However, such conventional double-sided FCCLs have a relatively high production cost due to the use of copper as a material of the main wiring layer. In addition, due to plating defects which electrically connect the copper foil formed on both sides of the insulating substrate and plating, The manufacturing process becomes complicated and the process time becomes long.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a digitizer, in which aluminum is used as a basic wiring layer in forming a circuit pattern, thereby lowering a manufacturing cost and filling a via with a conductive material without a separate plating process Sided digitizer substrate using an aluminum pattern capable of improving conductivity between wiring layers and a method of manufacturing the same.

For the same purpose, the double-sided digitizer substrate using the aluminum pattern of the present invention includes an insulating substrate; An aluminum wiring layer formed on both surfaces of the insulating substrate; A via formed through the insulating substrate to connect the first wiring layer and the second wiring layer; A conductive material filled in the via to electrically connect the first and second wiring layers to each other; A first insulating layer formed to cover the first wiring layer, and a second insulating layer formed to cover the second wiring layer such that a part of the second wiring layer is exposed.

As the kind of the substrate, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate, acrylic resin, epoxy resin, vinyl acetate resin (EVA) , Polyarylate, polyimide, glass, silicon, ferrite, ceramic, and FR-4.

The conductive material is preferably a metal such as nickel, tin, copper, silver or gold, a conductive polymer such as PEDOT, or an organic material such as CNT (carbon nanotube) or graphene or a compound containing the same.

A method of manufacturing a two-sided digitizer substrate using an aluminum pattern according to the present invention comprises the steps of: forming an aluminum layer on both sides of an insulating substrate; Forming a peelable etch resist on the aluminum layer;

Etching and removing the aluminum layer except the etching resist; Forming a first wiring layer of aluminum on one surface of the insulating substrate and a second wiring layer on the other surface of the insulating substrate by peeling off the etching resist; Drilling the insulating substrate through the corrosion part of the second wiring layer to form a via through which a part of the first wiring layer is exposed; Filling the via with a conductive material so that the first and second wiring layers are conductive; Forming a first insulating layer to cover the first wiring layer and forming a second insulating layer covering the second wiring layer such that a part of the second wiring layer is exposed; .

Forming an aluminum layer on each side of the insulating substrate; Forming a via through the insulating substrate and an aluminum layer formed on one surface of the insulating substrate by drilling the aluminum layer formed on the other surface of the insulating substrate so as not to penetrate the aluminum layer; Filling the vias with a conductive material so that the aluminum layer formed on one surface and the other surface of the insulating substrate and the insulating substrate conducts; Forming a peelable etch resist on the aluminum layer; Etching and removing the aluminum layer except the etching resist; Forming a first wiring layer of aluminum on one surface of the insulating substrate and a second wiring layer on the other surface of the insulating substrate by peeling off the etching resist; Forming a first insulating layer to cover the first wiring layer and forming a second insulating layer covering the second wiring layer such that a part of the second wiring layer is exposed; &Lt; / RTI >

Forming an aluminum layer 120 on both sides of the insulating substrate; Forming a via through the insulating substrate and an aluminum layer formed on one surface of the insulating substrate by drilling the aluminum layer formed on the other surface of the insulating substrate so as not to penetrate the aluminum layer; Attaching a carrier film to the other aluminum layer of the insulating substrate; Filling the vias with a conductive material so that the aluminum layer formed on one surface and the other surface of the insulating substrate and the insulating substrate conducts; Removing the carrier film; Forming a peelable etch resist on the aluminum layer; Etching and removing the aluminum layer except the etching resist; Forming a first wiring layer of aluminum on one surface of the insulating substrate and a second wiring layer on the other surface of the insulating substrate by peeling off the etching resist; Forming a first insulating layer to cover the first wiring layer and forming a second insulating layer covering the second wiring layer such that a part of the second wiring layer is exposed; .

At this time, the step of forming the etching resist may be formed by a printing method using a resist ink, or by a photolithography method in which a dry film is attached and an exposure process is performed.

The forming of the vias may be performed by simultaneously drilling one surface of the insulating substrate and the aluminum layer formed on the other surface of the insulating substrate.

The step of filling the via with the conductive material may include filling the via with a conductive ink or a conductive paste and may be performed by a noncontact printing method such as an inkjet method, an electrostatic spray deposition (ESD) method, an aerosol jet, a metal jet, , Slot die, screen, rotary, gravure, gravure offset, polymer gravure, Aerosol, microplasma printing, imprinting

In addition, the step of forming the vias may be removed by using a plasma or scar remover to remove smears remaining in the vias during the via process.

The carrier film generally has a thickness of 25 to 200 탆 and a pressure-sensitive adhesive coated on the film in a thickness of 1 to 50 탆. The carrier film is made of polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide , Polyethylene naphthalate, heat-resistant epoxy resin, EVA resin, butyl rubber resin, polyarylate, polyimide, silicone, ferrite and FR-4 can be used.

The printing method for forming the first insulating layer and the second insulating layer may be a printing method such as a flat printing method, a roll printing method, a rotary printing method, a flexographic printing method, a gravure printing method, a gravure offset printing method, a reverse offset method, a polymer gravure printing method, , Inkjet printing, microgravure, or slot die, pad printing, or dispenser.

In addition, a plasma treatment may be performed on the insulating substrate to improve adhesion between the insulating substrate and the first insulating layer and between the insulating substrate and the second insulating layer.

Further, a primer layer having a thickness of 0.02 to 10 탆 may be additionally provided between the insulating substrate and the insulating layer.

Further, on the insulating substrate or the second insulating layer, an electromagnetic wave absorbing layer including a magnetic sheet produced by mixing 50 to 95 parts by weight of electromagnetic wave absorbing magnetic powder and 5 to 50 parts by weight of a mixture of synthetic or natural rubber is formed The method comprising the steps of:

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The present invention provides a digitizer substrate having excellent conductivity at a relatively low cost by forming a wiring layer on an aluminum foil laminated or heat-sealed (pressed) on various insulating substrate materials and omitting a separate plating process.

The present invention also provides a method of fabricating a large area digitizer substrate which can be manufactured by increasing the conductivity while filling a via with a conductive material in comparison with a substrate on which a conventional plating layer is formed, It is possible.

In addition, the present invention can be manufactured by improving the conductivity while decreasing the thickness of the wiring layer. Thus, the present invention can be applied to an FPC, COB, COF, RFID, LED, OLED, OTFT, NFC Tag, A large-area digitizer substrate which can be applied to all products including wirings having electrodes such as cells, wall-paper, E-paper, E-passport, film battery and film memory, .

1 is a cross-sectional view illustrating a conventional digitizer manufacturing process,
2 is a cross-sectional view showing a manufacturing process according to the first embodiment of the present invention,
3 is a cross-sectional view showing a manufacturing process according to a second embodiment of the present invention,
4 is a cross-sectional view showing a manufacturing process according to a third embodiment of the present invention.

Hereinafter, a method of manufacturing a double-sided digitizer substrate using the aluminum pattern of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a cross-sectional view showing a manufacturing process according to the first embodiment of the present invention, and sequentially shows cross-sectional views of the digitizer of the stacked structure according to each manufacturing process described below.

In the present invention, the aluminum layer 120 is formed on both sides of the insulating substrate 110 by a first step (S 110) for the digitizer substrate.

The insulating substrate 110 may be formed of a material selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate, acrylic resin, epoxy resin, Resin, PET film, polyarylate, and polyimide may be used. Preferably, polyimide or polyethylene terephthalate, heat-resistant epoxy (FR-4), PET film can be used. In addition, the insulating substrate 110 may be a rigid substrate or a flexible substrate. In order to apply the flexible substrate to a portable terminal and to a terminal having a relatively large area, a rigid substrate or a flexible substrate may be used. .

Aluminum, which is a basic material of the first wiring layer 121 and the second wiring layer 122 to be described later, is formed on both surfaces of the insulating substrate 110 to have a thickness of 1 to 30 mu m, and an acrylic or epoxy- After the adhesive is coated, it is formed by a process such as joining with aluminum foil or thermocompression lamination. Also, it can be formed by a casting method or a laminating method which is a method of producing a copper laminated board commonly used in the manufacture of printed circuit boards.

The aluminum layer 120 is a main wiring material for electronic devices. The resistivity value of bulk aluminum is 2.74 mu O.cm, which is relatively lower than silver or copper. However, in terms of price of raw materials, It is very cheap at 1/100 of silver level. In addition, aluminum is excellent in adhesion to silicon, silicon oxide, polymer or other metals, and has excellent advantages in patterning a circuit because etching can be carried out without difficulty in that it exhibits stable chemical and physical properties due to the formation of a natural oxide film .

The aluminum layer 120 may be formed of a metal foil having a thickness of 1 to 30 μm through a milling process.

In a second step (S 120), a peelable etching resist 130 is formed on the aluminum layer 120. The etching resist 130 is used to etch the aluminum layer of the portion where the etching resist 130 is not formed. The etching resist 130 may be formed by a printing method using a resist ink, or by photolithography (Photo -lithography) method.

First, when the wiring layers 121 and 122 are formed by a printing method using resist ink, an ink capable of peeling off the alkali is used for smooth removal of the etching resist 130 after etching of the aluminum layer 120, For such an alkaline peel type resist ink, a resin having an acid value (-COOH) is preferably used, but an acrylic resin having no heat reactivity is preferably used in order to eliminate the influence by heat.

The resist inks can also be used in a variety of applications, such as flat or roll-to-roll screen printing, rotary printing, flexographic printing, gravure printing, gravure offset printing, reverse offset, polymer gravure printing, imprinting, inkjet printing, microgravure, A wiring pattern can be formed through a printing method such as a dispenser. Preferably, flat printing or roll-to-roll screen printing, rotary printing, gravure printing, or gravure offset printing can be used. Further, according to the subsequent process conditions, it is possible to undergo a curing step in accordance with the use conditions of the resist ink such as UV curing, high temperature or low temperature thermal drying curing, and IR curing.

When an etching resist is formed by a photolithography method, a dry film is first pressed on the aluminum layer 120 by applying heat and pressure. Thereafter, the remaining portion of the dry film of the hardened portion is removed through an exposure step of irradiating the dry film with ultraviolet light using a photomask having a circuit pattern formed thereon.

In a third step (S 130), the aluminum layer 120 is removed by etching, except for the portion where the etching resist 130 (resist ink or dry film) remains. That is, the etching resist (resist ink or dry film) 130 that prevents corrosion of the wiring layer remains on the first and second wiring layers, and by immersing aluminum in the etching solution, the etching resist (resist ink or dry film (Resist ink or dry film) 130 while preventing the peeling of the etching resist (resist ink or the dry film) 130 by selectively etching only the aluminum layer in the portion where the aluminum layer 130 is not formed, Iron chloride, ferric chloride, ferric chloride, hydrochloric acid compounds, and the like. However, the present invention is not limited thereto and various corrosive liquids may be used.

Then, in the fourth step S 140, the etching resist (resist ink or dry film) 130 is peeled off in a state in which the aluminum layer in the portion free of the etching resist (resist ink or dry film) A first wiring layer 121 made of aluminum is formed on one surface of the insulating substrate 110 and a second wiring layer 122 is formed on the other surface of the insulating substrate 110.

When using an etching resist (resist ink or dry film) 130 capable of peeling off the alkali, it is possible to remove the peeling-type ink by spraying the amine-based stripping liquid in a nozzle-jetting manner, or to remove the caustic soda (NaOH) KOH) can be used to peel off the etching resist.

The first wiring layer 121 and the second wiring layer 121 formed of an aluminum thin film having a thickness of 1 to 30 μm are formed on one side surface and the other side surface of the insulating substrate 110 by removing the etching resist (resist ink or dry film) 122, respectively.

In a fifth step S 150, the insulating substrate 110 is drilled through the corrosion part of the second wiring layer 122 to form a via 150 through which a part of the first wiring layer 121 is exposed.

That is, as shown in FIG. 2, a portion corroded to expose a central portion of the via land of the first wiring layer 121 to the lower side of the insulating substrate 110 so as to communicate with a part of the via land of the second wiring layer 122 CNC Drill, UV or CO2 Laser to form the vias 150.

Thereafter, a process may be further performed to remove the scratches (smear) remaining in the vias by using a plasma or scratch removal agent.

In a sixth step S 160, the via 150 is filled with a conductive material 151 for smooth conduction between the first insulating layer 140 and the second insulating layer 150. The conductive material 151 is filled in the via hole 150 so that the first wiring layer 121 and the second wiring layer 122 can be smoothly conducted and the first wiring layer 121 ) And the second wiring layer 122. In addition, it is possible to reduce the defective ratio due to non-uniformity of the plating and significantly reduce the time and cost for the process.

The conductive material 151 may be filled in the via 150 by filling the via 150 with a conductive ink or a conductive paste and may be formed by an inkjet method, an electrostatic spray deposition (ESD) method, an aerosol jet, a metal jet, By filling a conductive ink or a conductive paste using any one of a non-contact printing method such as a dispensing method, a slot die, a screen, a rotary, a gravure, a gravure offset, a polymer gravure, an aerosol, a microplasma printing, Lt; / RTI > In this case, the material used for the conductive ink may be a metal such as nickel, tin, copper, silver, gold, a conductive polymer such as PEDOT, and an organic material such as CNT (carbon nanotube) have.

Alternatively, a conductive paste composed of a silver or copper powder and a thermosetting resin or an ultraviolet ray-curable resin for binding them, a metal or a conductive ink may be filled, followed by curing by applying light of a short wavelength band such as heat or ultraviolet rays . The thermosetting resin or the ultraviolet ray-curable resin is a resin that maintains a liquid state at room temperature and is cured when light of a short wavelength band such as heat or ultraviolet ray is applied. The epoxy resin, polyester resin, acrylic resin, xylene resin, polyurethane resin , Urea resin, amino resin, alkyd resin and the like can be used.

In the case of the inkjet method, the nozzle diameter is determined according to the size of the via 150, and the conductive material contained in the ink needs to have a primary particle size of 200 nm or less as particles having a size of 10 nm to 10 μm. If the primary particle size exceeds 200 nm, the dispersibility is low, so that large and uneven particles are likely to form due to agglomeration, and the fluidity of the ink is deteriorated due to poor agglomeration. In addition, the solid content with respect to the total content is limited to 10 to 80 wt% or less. When the solid content is less than 10%, the formed viscosity is too low, and it is difficult to form the via 150 filling layer having sufficient flowability and conductivity even by any one printing method or application method. On the other hand, So that appropriate filling can not be achieved by various printing methods or coating methods.

In addition, it is possible to use Aerosol jet, which is a technique of spraying small particles brought by a ESD or an ultrasonic sprayer using an induction gas, which is a method of splitting organic particles by applying a high voltage to a nozzle and finely dividing organic particles. In addition, Electro Hydro Dynamic (EHD) patterning technology, which can be ejected by drop using an ink jet, can also be utilized by utilizing metaljet technology that melts and patterns and high voltage ESD technology.

Thereafter, the filled ink is mainly dried by the heat curing method, and the IR, UV curing or dual curing method may be adopted in some cases. Specifically, the ink is filled after the first stage ink is dried, and the solvent is evaporated (dry step), followed by a complete curing step in two stages. After drying at 50 ~ 70 ℃ ± 5 ℃, the curing step is fully cured at 100 ~ 180 ℃.

When the vias 150 are formed by plating, the vias 150 can be provided with conductivity by electroplating or electroless plating.

In addition, the method of plating and the method of filling the inside of the via 150 with the conductive material can be performed in parallel. Illustratively, after forming a metal plating film on the vias 150 by the plating method, the vias 150 can be made conductive by filling conductive spaces in the remaining voids.

In the seventh step S 170, a first insulating layer 140 is formed to cover the first wiring layer 121 and a second insulating layer 140 is formed to cover the second wiring layer 122 to expose a portion of the second wiring layer 122. The second insulating layer 160 is formed.

In this case, the first insulating layer 140 is formed by a printing method using a material having an insulating property, so that a roll-to-roll process can be applied. The first insulating layer 140 is formed by a printing method so as to cover the first wiring layer 121 on the insulating substrate 110 The first insulating layer 140 is printed.

The first insulating layer 140 may be formed to a thickness of 1 to 30 μm, and the composition of the first insulating layer 140 may be epoxy, acrylic, polyimide, or a mixture thereof. A mixture containing a metal oxide such as indium oxide (In2O3), zinc oxide (ZnO) or the like may also be used. Likewise, the first insulating layer 140 may be formed by a method such as screen printing, rotary printing, flexographic printing, gravure printing, gravure offset printing, reverse offset, polymer gravure printing, imprinting, inkjet printing, microgravure, A die, a pad printing or a dispenser may be used. Preferably, flat printing or roll-to-roll screen printing, rotary printing, gravure printing or gravure offset printing can be used.

The second insulating layer 160 is formed on the second wiring layer 122 such that a part of the second wiring layer 122 is exposed. The second insulating layer 160 may have a thickness of 1 to 30 탆, preferably 1 to 15 탆, by the same method as the first insulating layer 140 described above.

Meanwhile, the digitizer substrate according to the present invention may include an electromagnetic wave absorbing layer including a magnetic sheet so that the digitizer substrate absorbs or reflects radio waves and transmits signals without being affected by electromagnetic waves.

At this time, the magnetic sheet may be manufactured by extrusion using a rolling roller by mixing a magnetic powder for absorbing electromagnetic waves having flattened tabular grains and a binder, and attaching the tab to the digitizer substrate according to the present invention. The thickness of the adhesive layer 180 may be in the range of 30 to 100 mu m, preferably including an adhesive.

Specifically, the magnetic sheet may be prepared from 50 to 95 parts by weight of radio wave-absorbing magnetic powder having planarized platelet particles and 5 to 50 parts by weight of synthetic rubber, natural rubber or a mixture thereof as a binder, The magnetic powder is preferably of a plate-like particle, but may be of various shape particles as required, or may be a metal-based ferromagnetic powder, an oxide-based ferromagnetic powder, or a mixture thereof.

In addition, non-conductive films, sheets or pad type adhesives or pressure sensitive adhesive components may be used to enhance the adhesion between the magnetic sheet and the insulating substrate. Acrylic double-sided adhesive films, hot-melt type EVA (vinyl acetate resin) A rubber spray type adhesive film can be used. As the coating agent component, components such as acrylic adhesive, hot melt type EVA (vinyl acetate resin) adhesive, butyl rubber adhesive, silicone coating agent, acrylic coating agent and epoxy coating agent can be used.

FIG. 3 is a plan view showing a manufacturing process according to the second embodiment of the present invention. As shown in FIG. 3, when a material having an aluminum layer 120 formed on both sides of an insulating substrate 110 is used as in the first embodiment of the present invention, The vias 150 are formed in advance before the first wiring layer 121 and the second wiring layer 122 are formed and the conductive material 151 is filled. The same contents as those in the first embodiment of the present invention already described in the following description will not be described in detail.

In the first step S 210, the aluminum layer 120 is formed on both surfaces of the insulating substrate 110, as in the first embodiment.

In a second step S220, the aluminum layer formed on one surface of the insulating substrate 110 and the insulating substrate 110 is drilled through the aluminum layer formed on the other surface of the insulating substrate 110, 150). That is, in the first embodiment of the present invention, the vias 150 are formed after the first wiring layer 121 and the second wiring layer 122 are formed. In the second embodiment, the first wiring layer 121 and the second wiring layer 122 are formed. The via 150 is formed before the second wiring layer 122 is formed.

In this case, even if the etching resist is somewhat complicated, drilling is performed before the etching resist is formed. Therefore, in the process of forming the via 150 or filling the via 150, the first wiring portion 121 or the second wiring portion 122 Can be prevented from being damaged.

Next, in a third step S 230, the conductive material 151 is filled in the vias 150 such that the aluminum layer 120 formed on one surface and the other surface of the insulating substrate 110 and the insulating substrate 110 are electrically connected . Similarly, a conductive paste (ink or paste) 151 is filled in the vias 150 to fill the vias 150, and silver or copper powder and a conductive paste composed of a thermosetting resin or a UV- Or a metal or conductive ink may be filled, followed by curing by applying light having a short wavelength such as heat or ultraviolet light.

Further, when the third step (S 230) is performed by the roll-to-roll process, a step of attaching the carrier film to the aluminum layer 120 formed on the other surface may be additionally performed. This allows the thin substrate to reduce the stretching due to tension in the roll-to-roll process

In this case, the attached carrier film is generally coated with a film having a thickness of 25 to 200 μm to a thickness of 1 to 50 μm, and the carrier film is made of polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, Any one selected from polyetherimide, polyethylene naphthalate, heat-resistant epoxy resin, EVA resin, butyl rubber resin, polyarylate, polyimide, silicone, ferrite and FR-4 may be used, Is a polyimide or polyethylene terephthalate film.

Thereafter, the filled ink is mainly dried by the heat curing method, and the IR, UV curing or dual curing method may be adopted in some cases. Specifically, the ink is filled after the first stage ink is dried, and the solvent is evaporated (dry step), followed by a complete curing step in two stages. The dry step is dried at 50 ~ 70 ℃ ± 5 ℃ and then cured at 160 ~ 180 ℃.

In a fourth step (S 240), a peelable etching resist (resist ink or dry film) 130 is formed on the aluminum layer 120. The etching resist (resist ink or dry film) 130 is used to etch an aluminum layer in a portion where the etching resist (resist ink or dry film) 130 is not formed. The etching resist (resist ink or dry film) 130, or a dry film is pressed on the aluminum layer 120 by applying heat and pressure to the aluminum layer 120 by a photolithography method. Thereafter, the remaining portion of the dry film of the hardened portion is removed through development using an exposure step of irradiating the dry film with ultraviolet rays using a photomask having a circuit pattern formed thereon.

In the fifth step S 250, the aluminum layer 120 except for the etching resist (resist ink or dry film) 130 is corroded and removed. That is, the insulating substrate 110 on which the etching resist (resist ink or dry film) 130 is formed is immersed in a corrosive solution so that the aluminum (Al) in the portion where the etching resist (Resist ink or dry film) 130 is prevented by selectively corroding and removing only the layer of copper chloride, copper chloride, iron chloride, ferric chloride, ferric chloride , A hydrochloric acid compound, and the like. However, the present invention is not limited thereto and various corrosive liquids can be used.

In the sixth step (S 260), the etching resist (resist ink or dry film) 130 (resist ink or dry film) 130 is removed in a state where the aluminum layer of the portion where the etching resist A first wiring layer 121 of aluminum is formed on one surface of the insulating substrate 110 and a second wiring layer 122 is formed on the other surface of the insulating substrate 110 by peeling off the insulating layer.

As described above, the etching resist 130 of the resist ink is removed, so that a first wiring layer 121 and a second wiring layer 122 formed of an aluminum thin film having a thickness of 1 to 30 탆 are formed on one side surface and the other side surface of the insulating substrate 110 It remains.

In a seventh step S 270, a first insulating layer 140 is formed to cover the first wiring layer 121, and a second insulating layer 140 covering the second wiring layer 122 is formed to expose a portion of the second wiring layer 122. The second insulating layer 160 is formed.

FIG. 4 is a plan view illustrating a manufacturing process according to a third embodiment of the present invention. Referring to FIG. 4, in a step S 220 of forming the vias 150 while performing almost the same process as the second embodiment, 110, and an aluminum layer formed on one surface and the other surface. Even if the vias 150 pass through the aluminum layer 120 located on the lower surface of the insulating substrate 110, the same electrical conduction effect can be obtained by filling the conductive material 151 in the vias 150 in the same manner, An appropriate method can be selected and applied according to the complexity of the resist and the process.

In addition, when the step of forming the via 150 by the roll-to-roll process (S 220 - 1) is performed, a step of attaching the carrier film 170 to the aluminum layer 120 formed on the other surface may be additionally performed. This serves to reduce the expansion and contraction of the thin substrate due to tension in the roll-to-roll process, and on the other hand to prevent the conductive material from flowing out to the opposite side when filling the conductive material into the via. In this case, the attached carrier film 170 is generally coated with a film having a thickness of 25 to 200 μm to a thickness of 1 to 50 μm, and the carrier film is made of polybutylene terephthalate, polyethylene terephthalate, Any one selected from polyether, polyetherimide, polyethylene naphthalate, heat-resistant epoxy, EVA, butyl rubber resin, polyarylate, polyimide, silicone, ferrite and FR-4 And is preferably a polyimide or polyethylene terephthalate film.

In this case, the carrier film 170 may be removed before the step (S 240) of forming the etching resist 130 is performed.

A common method in the manufacturing process according to each embodiment is as follows.

First, the via 150 is formed by drilling using CNC Drill, UV or CO2 Laser.

The via 150 may be filled with a conductive material by filling the via 150 with a conductive material (ink or paste) 151. The conductive material may be an inkjet method, an electrostatic spray deposition (ESD) a conductive ink or a conductive paste using any one of a non-contact type printing method such as jet, dispensing, slot die, screen, rotary, gravure, gravure offset, polymer gravure, Aerosol, microplasma printing, And filling. In this case, the material used for the conductive ink may be a metal such as nickel, tin, copper, silver, gold, a conductive polymer such as PEDOT, and an organic material such as CNT (carbon nanotube) have.

In addition, the method of plating and the method of filling the inside of the via 150 with the conductive material 151 can be performed in parallel. Illustratively, after forming a metal plating film on the vias 150 by the plating method, the vias 150 can be made conductive by filling conductive spaces in the remaining voids.

At this time, a primer layer for increasing the adhesion between the insulating substrate 110 and the first insulating layer 140 and the second insulating layer 160 may be additionally provided. The primer layer may be a silane primer, and preferably has a thickness of 0.02 to 10 탆. Examples of such silane series primers include vinyltris (2-methoxyethoxy) silane, 3-glycidoxypropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane , 3-aminopropyltriethoxysilane, and the like, and epoxy, acrylic, and silicone based primers can be used.

In addition, a plasma treatment may be performed to improve adhesion with the primer layer before the primer layer is coated on the insulating substrate 110. By such a plasma process, irregularities can be formed on the surface of the insulating substrate 110 to increase the contact area between the primer layer and each insulating layer to increase the adhesive force.

In addition, reliability can be improved by adding an electromagnetic wave absorbing layer including a magnetic sheet on the first insulating layer 140 or the second insulating layer 160.

In the present invention, at least one of the steps of forming the first insulating layer 140 or the second insulating layer 160 may be formed by a roll-to-roll process. When a digitizer substrate is manufactured in a large area, Such as flat screen printing or roll to plate screen printing, rotary printing, gravure printing, gravure offset, reverse offset, polymer gravure, flexo, and pad printing.

The digitizer manufactured through the manufacturing method of the present invention can be used in parts of portable terminals, tablet PCs, monitors, TVs, billboards, and the like.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

110: Insulation substrate 120: Aluminum layer
121: first wiring layer 122: second wiring layer
130: etching resist 140: first insulating layer
150: Vias 151: Conductive material
160: Second insulating layer 170: Carrier film
180: Electromagnetic wave absorbing layer

Claims

An insulating substrate (110);
A first wiring layer 121 and a second wiring layer 122 formed on both sides of the insulating substrate 110 and made of aluminum, respectively;
A via 150 formed through the insulating substrate 110 to connect the first wiring layer 121 and the second wiring layer 122;
A conductive material 151 filled in the via 150 to electrically connect the first wiring layer 121 and the second wiring layer 122 to each other;
A first insulating layer 140 formed to cover the first wiring layer 121 and a second insulating layer 160 formed to cover the second wiring layer 122 such that a part of the second wiring layer 122 is exposed. Lt; / RTI >
Wherein a primer layer having a thickness of 0.02 to 10 탆 is additionally provided between the insulating substrate 110 and the first insulating layer 140 and between the insulating substrate 110 and the second insulating layer 160. [ A double - sided digitizer substrate.

The method according to claim 1,
Examples of the substrate include polyvinylidene fluoride resins such as polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate, acrylic resin, epoxy resin, vinyl acetate resin (EVA) Wherein the substrate is any one selected from the group consisting of polyimide, polyimide, glass, silicon, ferrite, ceramic and FR-4.

The method according to claim 1,
The conductive material 151 is an organic material such as a metal such as nickel, tin, copper, silver, and gold and a conductive polymer such as PEDOT, and CNT (carbon nanotube) Double - sided digitizer substrate using pattern.

A method of manufacturing an electromagnetic type digitizer substrate using an electronic pen,
(S110) forming an aluminum layer 120 on both sides of the insulating substrate 110;
Forming a peelable etch resist 130 on the aluminum layer 120 (S 120);
Etching (S 130) the portion of the aluminum layer 120 excluding the etching resist 130 by etching;
Forming a first wiring layer 121 of aluminum on one surface of the insulating substrate 110 and a second wiring layer 122 on the other surface of the insulating substrate 110 by peeling off the etching resist 130 140);
A step (S 150) of drilling the insulating substrate (110) through the corrosion part of the second wiring layer (122) to form a via (150) through which a part of the first wiring layer (121) is exposed;
Filling the via 150 with a conductive material 151 so that the first wiring layer 121 and the second wiring layer 122 are conductive S 160;
A first insulating layer 140 is formed to cover the first wiring layer 121 and a second insulating layer 160 covering the second wiring layer 122 so that a part of the second wiring layer 122 is exposed. (S 170); Lt; / RTI >
Wherein a primer layer having a thickness of 0.02 to 10 탆 is additionally provided between the insulating substrate 110 and the first insulating layer 140 and between the insulating substrate 110 and the second insulating layer 160. [ METHOD FOR MANUFACTURING SINGLE -

A method of manufacturing an electromagnetic type digitizer substrate using an electronic pen,
A step (S 210) of forming an aluminum layer 120 on both sides of the insulating substrate 110;
Forming a via 150 through the aluminum layer formed on one surface of the insulating substrate 110 and the insulating substrate 110 by drilling the aluminum layer formed on the other surface of the insulating substrate 110 so as not to penetrate, ;
Filling the via 150 with the conductive material 151 so that the aluminum layer 120 formed on one surface and the other surface of the insulating substrate 110 and the insulating substrate 110 are electrically connected to each other;
Forming a peelable etch resist 130 on the aluminum layer 120 (S 240);
Etching (S 250) a portion of the aluminum layer 120 excluding the etching resist 130 by etching;
Forming a first wiring layer 121 of aluminum on one surface of the insulating substrate 110 and a second wiring layer 122 on the other surface of the insulating substrate 110 by peeling off the etching resist 130 260);
A first insulating layer 140 is formed to cover the first wiring layer 121 and a second insulating layer 160 covering the second wiring layer 122 so that a part of the second wiring layer 122 is exposed. (S 270); Lt; / RTI >
Wherein a primer layer having a thickness of 0.02 to 10 탆 is additionally provided between the insulating substrate 110 and the first insulating layer 140 and between the insulating substrate 110 and the second insulating layer 160. [ METHOD FOR MANUFACTURING SINGLE -

A method of manufacturing an electromagnetic type digitizer substrate using an electronic pen,
A step (S 210) of forming an aluminum layer 120 on both sides of the insulating substrate 110;
Forming a via 150 through the aluminum layer formed on one surface of the insulating substrate 110 and the insulating substrate 110 by drilling the aluminum layer formed on the other surface of the insulating substrate 110 so as not to penetrate, ;
(S 220-1) attaching a carrier film to the aluminum layer of the other surface of the insulating substrate 110;
Filling the via 150 with the conductive material 151 so that the aluminum layer 120 formed on one surface and the other surface of the insulating substrate 110 and the insulating substrate 110 are electrically connected to each other;
Removing the carrier film 180 (S 230 - 1);
Forming a peelable etch resist 130 on the aluminum layer 120 (S 240);
Etching (S 250) a portion of the aluminum layer 120 excluding the etching resist 130 by etching;
Forming a first wiring layer 121 of aluminum on one surface of the insulating substrate 110 and a second wiring layer 122 on the other surface of the insulating substrate 110 by peeling off the etching resist 130 260);
A first insulating layer 140 is formed to cover the first wiring layer 121 and a second insulating layer 160 covering the second wiring layer 122 so that a part of the second wiring layer 122 is exposed. (S 270); Lt; / RTI >
Wherein a primer layer having a thickness of 0.02 to 10 탆 is additionally provided between the insulating substrate 110 and the first insulating layer 140 and between the insulating substrate 110 and the second insulating layer 160. [ METHOD FOR MANUFACTURING SINGLE -

The method according to any one of claims 4, 5, and 6,
The steps of forming the etching resist 130 (S 120 and S 240) may be formed by a printing method using a resist ink, or by a photolithography method in which a dry film is attached and an exposure process is performed A method of manufacturing a double-sided digitizer substrate using an aluminum pattern.

7. The method according to any one of claims 5 to 6,
The step of forming the via 150 (S 220)
Wherein the insulator is drilled to penetrate through one side of the insulating substrate and the aluminum layer formed on the other side of the insulating substrate.

The method according to any one of claims 4, 5, and 6,
The step of filling the via 150 with the conductive material 151 (S 160, S 230)
A non-contact type printing method such as an ink jet method, an electrostatic spray deposition (ESD), an aerosol jet, a metal jet, and a dispensing method, a slot die, a screen, a rotary, a gravure, Wherein the method is any one of gravure offset, polymer gravure, aerosol, microplasma printing, and imprinting.

The method according to any one of claims 4, 5, and 6,
The steps (S 150, S 220) of forming the vias (150)
Wherein a plasma or scratch removal agent is used to remove smears remaining in the vias during the via machining, and removing the smears.

The method according to claim 6,
In general, the carrier film 180 is coated with a film having a thickness of 25 to 200 袖 m and a pressure-sensitive adhesive of 1 to 50 袖 m, and the carrier film is made of polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, Wherein the aluminum pattern is any one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polybutylene terephthalate, polybutylene terephthalate, polybutylene terephthalate, polybutylene terephthalate, METHOD FOR MANUFACTURING SINGLE -

The method according to any one of claims 4, 5, and 6,
The printing method for forming the first insulating layer 140 and the second insulating layer 160 may be a printing method such as a flat plate or roll-to-roll screen printing, rotary printing, flexo printing, gravure printing, gravure offset printing, reverse offset, Wherein the printing method is selected from printing, imprinting, inkjet printing, microgravure, slot die, pad printing, or dispenser.

The method according to any one of claims 4, 5, and 6,
A plasma treatment is performed on the insulating substrate 110 to improve adhesion between the insulating substrate 110 and the first insulating layer 140 and between the insulating substrate 110 and the second insulating layer 160 Sided digitizer substrate using an aluminum pattern.

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The method according to any one of claims 4, 5, and 6,
A magnetic sheet formed by mixing 50 to 95 parts by weight of magnetic powder for electromagnetic wave absorption and 5 to 50 parts by weight of a mixture of synthetic or natural rubber on the insulating substrate 110 or the second insulating layer 160, And forming an electromagnetic wave absorbing layer (180) containing the electromagnetic wave absorbing layer (180).

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