KR101406850B1 - Light emitting device package apparatus and its manufacturing method - Google Patents

Abstract

The present invention relates to a light emitting device package apparatus and a method of manufacturing the light emitting device package apparatus. The light emitting device package apparatus of the present invention comprises a light emitting device; a substrate electrically connected to the light emitting device; and a package member providing an insertion groove to which the light emitting device and the substrate are inserted and made of a transmitting material to be able to transfer the light generated from the light emitting device to the outside. Therefore, the present invention can improve an optical viewing angle of products by expanding a light irradiation area, improve productivity by simplifying the structure, and reduce production costs as a reflective layer is not required.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package apparatus and a manufacturing method thereof,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package device and a method of manufacturing a light emitting device package device, and more particularly, to a light emitting device package device and a method of manufacturing a light emitting device package device capable of widening a light irradiation area in all directions.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through PN formation of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. Further, such an LED is resistant to impact and vibration, does not require preheating time and complicated driving, can be packaged in various forms, and can be applied to various applications.

The light emitted from such a conventional light emitting device is irradiated only above the substrate on which the light emitting device is mounted and the light irradiation area is very narrow and the viewing angle is narrow so that it has been difficult to use it for various types of illumination or display applications .

US 7828459 B

The idea of the present invention is to expand the application range for various types of illumination and display applications by applying a light transmissive package member and inserting the light emitting element into the groove to widen the light irradiation area to the upper and lower sides to improve the wide viewing angle And a method of manufacturing a light emitting device package device.

According to an aspect of the present invention, there is provided a light emitting device packaging apparatus comprising: a light emitting element; A substrate electrically connected to the light emitting element; And a package member formed of a light-transmitting material to form an insertion groove into which the light emitting device and the substrate are inserted, and to transmit light generated from the light emitting device to the outside.

According to an aspect of the present invention, the light emitting device may be selected from at least one of a flip chip type light emitting device, a vertical type light emitting device, and a horizontal type light emitting device.

According to an aspect of the present invention, a wiring layer may be formed on the substrate so as to be electrically connected to an electrode terminal formed on an upper surface of the package member.

In addition, the light emitting device packaging device according to the present invention may further include a lens layer formed on the light emitting device.

In addition, the light emitting device packaging device according to the present invention may further include a fluorescent layer formed on the light emitting device.

According to an aspect of the present invention, a plurality of protrusions may be formed on a surface of the package member in order to scatter light.

In addition, the light emitting device packaging device according to the present invention may further include a heat dissipation member that is in thermal contact with the light emitting device.

According to an aspect of the present invention, there is provided a method of manufacturing a light emitting device package device, the method comprising: preparing a package member having an insertion groove formed on an upper surface thereof and made of a light emitting material; Inserting a light emitting element into the insertion groove; And forming a second layer above the light emitting device.

According to an aspect of the present invention, the second layer may be formed by selecting at least one of a lens layer, a fluorescent layer, and combinations thereof.

According to an aspect of the present invention, in the step of inserting the light emitting element into the insertion groove, the light emitting element may be seated on the substrate.

The light emitting device package device and the method of manufacturing the light emitting device package device according to the present invention can increase the light viewing angle of the product to improve the optical viewing angle of the product and improve the productivity by simplifying the structure, It is possible to have an effect.

1 is a cross-sectional view schematically showing a light emitting device packaging apparatus according to some embodiments of the present invention.
2 is a cross-sectional view showing a radiation path of the light emitting device packaging device of FIG.
3 is a cross-sectional view schematically showing a light emitting device packaging apparatus according to some embodiments of the present invention.
4 is a perspective view schematically showing a light emitting device package module according to some embodiments of the present invention.
5 is a side view showing a light irradiation area of a general light emitting device package device.
FIG. 6 is a side view showing the light irradiation area of the light emitting device package device according to some embodiments of the present invention. FIG.
FIG. 7 is a circuit diagram showing an example of a wiring circuit for connecting the wiring layer of FIG. 1 and the electrode terminals of FIG. 4;
FIGS. 8 to 10 are cross-sectional views illustrating a method of fabricating a light emitting device package device according to some embodiments of the present invention.
FIGS. 11 to 13 are cross-sectional views showing steps of a method of manufacturing a light emitting device package device according to some embodiments of the present invention.
14 is a flowchart showing a method of manufacturing a light emitting device package device according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It will be understood that throughout the specification, when referring to an element such as a film, an area or a substrate being "on", "connected", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a cross-sectional view schematically showing a light emitting device packaging apparatus 100 according to some embodiments of the present invention.

1, a light emitting device packaging apparatus 100 according to some embodiments of the present invention includes a light emitting device 10, a substrate 20, a package member 30, (60).

Here, the light emitting device 10 is provided on one surface of the substrate 20, and is made of a semiconductor. For example, a blue light emitting LED made of a nitride semiconductor, an LED for ultraviolet light emission, and the like can be applied. The nitride semiconductor is represented by the general formula AlxGayInzN (0? X? 1, 0? Y? 1, 0? Z? 1, X + Y + Z = 1).

The light emitting device 10 can be formed by epitaxially growing nitride semiconductors such as InN, AlN, InGaN, AlGaN, and InGaAlN on a substrate by a vapor phase growth method such as MOCVD. The light emitting element 10 may be formed using a semiconductor such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, or AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. Further, the light emitting element 20 can be selected to have an arbitrary wavelength. In addition, various types of light emitting devices such as a flip chip type, a vertical type, and a horizontal type can be applied to the light emitting device 10.

The substrate 20 is mounted on the light emitting device 10 and is electrically connected to the light emitting device 10 and has a suitable mechanical strength and insulation property to support the light emitting device 10 Can be made of a material.

For example, a ceramic substrate may be applied to the substrate 20 in consideration of thermal conductivity. The substrate 20 is electrically connected to the electrode terminal 40 of FIG. 4 formed on the upper surface of the package member 30 so as to connect the light emitting element 10 with an external power source. The wiring layer 21 may be formed to be a printed circuit board (PCB) having a plurality of epoxy resin sheets formed thereon. The substrate 20 may be formed of a synthetic resin substrate such as resin or glass epoxy or a metal substrate such as aluminum, copper, zinc, tin, lead, gold or silver which is insulated, It can be applied in frame or film form.

The package member 30 is formed with an insertion groove 30a into which the light emitting element 10 and the substrate 20 are inserted and is provided with a light emitting element 10 for transmitting light generated from the light emitting element 10 to the outside And may be made of a resin such as a thermosetting resin or a thermoplastic resin. Specific examples thereof include a modified epoxy resin composition such as an epoxy resin composition, a silicone resin composition and a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, a modified polyimide resin composition, a polyphthalamide (PPA ), Polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin.

The package member 30 may be formed of a material that can transmit light from the light emitting element 10 to the outside. The package member 30 may have a light transmittance of about 70% or more and about 90% or more of light from the light emitting element 10. As the material for forming the package member 30, a transparent resin or glass having excellent durability such as an epoxy resin, a silicone resin, an acrylic resin, and a urea resin may be applied.

1, a light emitting device package 100 according to some embodiments of the present invention includes a lens layer 50 and a fluorescent layer 51 formed on the light emitting device 10, .

Here, the lens layer 50 may control an angle of light emitted from the light emitting device 10 using a refractive index, and the fluorescent layer 51 may reflect light emitted from the light emitting device 10 The wavelength can be converted.

The material for forming the lens layer 50 may be a modified epoxy resin composition such as an epoxy resin composition, a silicone resin composition, or a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, a polyimide resin composition, A resin such as polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied.

The lens layer 50 may be formed of a material that can transmit light from the light emitting element 10 to the outside. The package member 30 may have a light transmittance of about 70% or more and about 90% or more of light from the light emitting element 10. As the material forming the lens layer 50, a transparent resin or glass having excellent durability such as an epoxy resin, a silicone resin, an acrylic resin and a urea resin may be applied.

Further, the lens layer 50 may be the same material as the package member 30, or may be another material. The other material means that the kind and composition are not identical at all.

2 is a cross-sectional view showing a radiation path of the light emitting device packaging device 100 of FIG.

Accordingly, in the radiation path of the light emitting device packaging apparatus 100 according to some embodiments of the present invention, light generated from the light emitting device 10 can be irradiated upward of the light emitting device 10 A part of the light may be refracted in one direction to be irradiated to the upper side of the light emitting element 10 while the light irradiated to the side of the light emitting element 10 passes through the inside of the package member 30 which is transparent, A part of the light may be totally reflected within the package member 30 and irradiated to the lower side of the light emitting device 10. [

3 is a cross-sectional view schematically showing a light emitting device packaging apparatus 200 according to some embodiments of the present invention.

As shown in FIG. 3, the package member 30 may have a plurality of protrusions 31 formed on its surface to scatter light.

Light is scattered from the surface of the package member 30 by the protrusions 31, thereby widening the light irradiation area and further improving the luminous efficiency.

The heat dissipating member 60 is in thermal contact with the light emitting device 10 and is made of gold (Au), silver (Ag), platinum (Pt), aluminum (Al) (Cu), solder, palladium (Pd), nickel (Ni), cobalt (Co), chromium (Cr), titanium (Ti), ceramics and the like.

4 is a perspective view schematically showing a light emitting device package module 1000 according to some embodiments of the present invention.

The plurality of light emitting devices 10 described above may be assembled into one substrate 20 and one package member 30 to form the light emitting device package module 1000 as shown in FIG. The light emitting device package module 1000 may be applied to an illumination or a display panel.

FIG. 5 is a side view showing a light irradiation area A1 of a general light emitting device package device, and FIG. 6 is a sectional view of the light irradiation area A1 and the light emitting area A1 of the light emitting device packaging device 100 according to some embodiments of the present invention. (A3) and (A4), respectively.

As shown in Fig. 5, in the light emitting device 1 mounted on the conventional package member 3, only the upper region A1 located above the light emitting element 1 is irradiated with light, The light emitting device 10 assembled to the package member 30 of the present invention not only includes the upper region A1 located above the light emitting element 10 but also the upper side region A2, The light can be irradiated even to the area A3 and the lower area A4.

7 is a circuit diagram showing an example of a wiring circuit for connecting the wiring layer 21 of Fig. 1 and the electrode terminals 40 of Fig.

7, the wiring circuit connecting the wiring layer 21 of FIG. 1 and the electrode terminals 40 of FIG. 4 can be formed by arranging the light emitting elements 10 in parallel by the wiring circuit In addition, it is also possible to connect in series.

FIGS. 8 to 10 are cross-sectional views illustrating a method of fabricating a light emitting device package device 100 according to some embodiments of the present invention, and FIG. 14 is a cross-sectional view illustrating a light emitting device package device 100 according to some embodiments of the present invention. (100) according to the second embodiment of the present invention.

As shown in FIG. 10, a manufacturing method of the light emitting device packaging apparatus 100 according to the present invention will be described. First, as shown in FIG. 8, an insertion groove 30a is formed on an upper surface, (S1) of preparing a package member (30) made of the same material.

Next, as shown in FIG. 9, a step S2 of inserting the light emitting device 10 into the insertion groove 30a may be performed.

In the step S2 of inserting the light emitting element 10 into the insertion groove 30a, the light emitting element 10 may be seated on the substrate 20 as shown in FIG.

Next, as shown in FIG. 10, a step S3 of forming a second layer above the light emitting device 10 may be performed.

Here, the second layer may be formed by selecting at least one of the lens layer 50, the fluorescent layer 51, and combinations thereof.

Figs. 11 to 13 are cross-sectional views showing steps of a method of manufacturing the light emitting device packaging device 100 according to some embodiments of the present invention.

First, as shown in FIG. 11, a step of preparing a package member 30 formed with an insertion groove 30a on an upper surface, a substrate 20 inserted into the insertion groove 30a, (S1).

Next, as shown in FIG. 12, a step S2 of inserting the light emitting element 10 into the insertion groove 30a may be performed.

Next, as shown in FIG. 13, a step S3 of forming a second layer above the light emitting device 10 may be performed.

It is needless to say that the present invention is not limited to the above-described embodiment, and can be modified by those skilled in the art without departing from the spirit of the present invention.

Accordingly, the scope of claim of the present invention is not limited within the scope of the detailed description, but will be defined by the following claims and technical ideas thereof.

1: light emitting element 3: package member
10: light emitting device 20: substrate
21: wiring layer 30: package member
30a: insertion groove 31: projection
100, 200: light emitting device package device 40: electrode terminal
50: Lens layer 51: Fluorescent layer
60: radiation member 1000: light emitting device package module
A1: upper region A2: upper side region
A3: lateral area A4: lower lateral area

Claims (10)

A light emitting element;
A substrate electrically connected to the light emitting device to support the light emitting device; And
A package member made of a transparent material for transmitting light generated from the light emitting device to the outside, the package having an insertion groove into which the light emitting device and the substrate are inserted; And
And a lens layer formed on the insertion groove and covering the light emitting device and the substrate to partially irradiate the light from the light emitting device to the package member,
The light from the light emitting element is irradiated to the upper side of the light emitting element through the lens layer and the light partially irradiated inside the package member is also irradiated to the lower side of the light emitting element by total internal reflection within the package member , And a light emitting device package device. The method according to claim 1,
Wherein the light emitting element is selected from at least one of a flip chip type light emitting element, a vertical type light emitting element and a horizontal type light emitting element. The method according to claim 1,
Wherein a wiring layer is formed on the substrate so as to be electrically connected to an electrode terminal formed on an upper surface of the package member. delete The method according to claim 1,
A fluorescent layer formed on the light emitting element;
Emitting device package. The method according to claim 1,
Wherein the package member has a plurality of protrusions formed on a surface thereof for scattering light. The method according to claim 1,
A heat dissipating member in thermal contact with the light emitting element;
Emitting device package. A method of manufacturing a light emitting device package device according to claim 1,
Preparing a package member having an insertion groove formed on an upper surface thereof and made of a transparent material;
Inserting a light emitting element into the insertion groove; And
Forming a second layer above the light emitting device; Emitting device package. 9. The method of claim 8,
Wherein the second layer is formed by selecting at least one of a lens layer, a fluorescent layer, and combinations thereof. 9. The method of claim 8,
Wherein the step of inserting the light emitting device into the inserting groove inserts the substrate into the inserting groove, and then the light emitting device is seated on the substrate.

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