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KR101388876B1 - Lighting fixture - Google Patents

Lighting fixture Download PDF

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Publication number
KR101388876B1
KR101388876B1 KR1020110099944A KR20110099944A KR101388876B1 KR 101388876 B1 KR101388876 B1 KR 101388876B1 KR 1020110099944 A KR1020110099944 A KR 1020110099944A KR 20110099944 A KR20110099944 A KR 20110099944A KR 101388876 B1 KR101388876 B1 KR 101388876B1
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KR
South Korea
Prior art keywords
light emitting
substrate
lighting device
rows
mounting
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KR1020110099944A
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Korean (ko)
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KR20120037880A (en
Inventor
나오키 스기시타
코지 야나기다
준이치로 야마모토
가즈후미 요시다
유이치로 다카하라
Original Assignee
도시바 라이텍쿠 가부시키가이샤
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

[과제] 간소화된 구성으로, 발광소자의 온도 상승을 억제하기 쉽고, 또한, 발광소자로부터 출사되는 광의 이미지를 균일화할 수 있는 조명기구를 제공한다.
[해결수단] 본 발명은, 기구 장착면(C)에 설치된 배선 기구(Cb)에 대향하는 장착부(4)와, 이 장착부(4)의 주위에 위치하고, 실장면이 전면측으로 향하여져 배치된 기판(21)과, 이 기판(21)에 실장되고, 반경이 다른 대략 동심원의 원주상에, 또는 크기가 다른 중심을 대략 같게 하는 다각형의 둘레 위에 복수의 열을 이루어 나열되고, 인접하는 열간에, 둘레방향으로 오프셋되어 배치된 각 열 동수의 발광소자(22)를 구비하는 조명기구이다.[PROBLEMS] With a simplified configuration, it is easy to suppress the temperature rise of a light emitting device and to provide a lighting device capable of uniformizing the image of light emitted from the light emitting device.
[Method] The present invention is a substrate disposed on the mounting portion 4 facing the wiring mechanism Cb provided on the mechanism mounting surface C, and around the mounting portion 4, with the mounting surface facing the front side. (21) and a plurality of rows are arranged on the substrate 21, arranged in a plurality of rows on the circumference of substantially concentric circles of different radii, or on the periphery of the polygons of approximately equal centers of different sizes, between adjacent rows, It is a lighting fixture provided with the light emitting elements 22 of each column equally offset by the circumferential direction.

Description

조명기구{LIGHTING FIXTURE}LIGHTING FIXTURE

본 발명의 실시 형태는, 광원으로서 LED 등의 발광소자를 사용한 조명기구에 관한 것이다.Embodiment of this invention relates to the lighting fixture using light emitting elements, such as LED, as a light source.

일반 주택용의 조명기구에 있어서는, 주광원으로 환상(環狀)의 형광 램프를 사용하고, 이 환상의 형광 램프의 하방측을 덮도록 커버 부재(세이드)를 설치하여, 외관 형상을 둥근 형태로 구성하는 것이 보급되어 있다.In a luminaire for a general house, an annular fluorescent lamp is used as the main light source, and a cover member (shade) is provided to cover the lower side of the annular fluorescent lamp, and the exterior shape is formed in a round shape. It is prevalent.

최근, LED 등의 발광소자의 고출력화, 고효율화 및 보급화에 수반하여, 광원으로서 발광소자를 사용하여 장수명화(長壽命化)를 기대할 수 있는 상기와 같은 일반 주택용의 조명기구가 개발되어 있다.In recent years, with high output, high efficiency, and widespread use of light emitting devices such as LEDs, lighting fixtures for general houses such as those which can be expected to have a long life using light emitting devices as light sources have been developed.

한편, LED 등의 발광소자는, 그 온도가 상승함에 따라, 광의 출력이 저하하고, 내용년수(耐用年數)도 짧아진다. 이 때문에, LED나 EL소자 등의 고체 발광소자를 광원으로 하는 조명기구에 있어서, 내용연수를 늘리거나 발광 효율 등의 특성을 개선하기 위해서, 발광소자의 온도가 상승함을 억제할 필요가 있다.On the other hand, as the temperature of the light emitting elements such as LEDs increases, the output of light decreases, and the useful life thereof also becomes short. For this reason, in the lighting fixture which uses solid light emitting elements, such as LED and an EL element as a light source, in order to increase the useful life or to improve characteristics, such as luminous efficiency, it is necessary to suppress the temperature rise of a light emitting element.

종래, 광원으로서 LED를 사용한 일반 주택용의 조명기구로서, 예를 들면, 천정면에 설치된 실링 마운트 키트로의 장착부의 주위에 LED를 점등 제어하는 점등장치를 설치하고, 이 점등장치의 근방 외주에 복수의 LED를 배치한 것이 있다. 이 LED는, 횡방향의 외주측을 향하여 광을 출사(出射)하도록 배치되어 있고, 출사된 광을 천장면측에 설치된 반사판에서 반사시켜 전면(前面)측에 조사(照射)하는 것이다.Conventionally, as a lighting fixture for general houses using LED as a light source, for example, a lighting device for lighting the LED is controlled around a mounting portion of a ceiling mount kit provided on a ceiling surface, and a plurality of lighting devices are provided on the outer periphery of the lighting device. Some LEDs are arranged. This LED is arrange | positioned so that light may be radiate toward the outer peripheral side of a horizontal direction, and it reflects the emitted light by the reflecting plate provided in the ceiling surface side, and irradiates it to the front side.

샤프/LED 실링 라이트［2010년 10월 5일 검색］Sharp / LED ceiling light [October 5, 2010 search] (http://www.sharp.co.jp/corporate/news/100819-a-2.html)(http://www.sharp.co.jp/corporate/news/100819-a-2.html)

그렇지만, 상기와 같은 종래의 조명기구에서는, 횡방향으로 출사된 LED로부터의 광을 반사시켜 전면측에 조사하는 것이기 때문에, 그 구성이 복잡하게 될 가능성이 있다. 또한, LED는, 점등장치의 근방에 배치되는 구성이 취해지기 때문에, LED로부터 발생하는 열과 점등장치로부터 발생하는 열이 상호 간섭하여, 그 열에 의해서 LED의 온도 상승을 초래할 우려가 있다.However, in the above-described conventional lighting device, since the light from the LED emitted in the lateral direction is reflected and irradiated to the front side, its configuration may be complicated. In addition, since the LED is configured to be arranged in the vicinity of the lighting device, heat generated from the LED and heat generated from the lighting device may interfere with each other, and the heat may cause the temperature rise of the LED.

본 발명은, 상기 과제에 감안하여 이루어진 것으로, 간소화된 구성으로, 발광소자의 온도 상승을 억제하기 쉽고, 또한, 발광소자로부터 출사되는 광의 이미지를 균일화할 수 있는 조명기구를 제공함을 목적으로 한다.This invention is made | formed in view of the said subject, Comprising: It aims at providing the illuminating device which is easy to suppress the temperature rise of a light emitting element, and can uniformize the image of the light emitted from a light emitting element with a simplified structure.

본 발명의 실시 형태에 의한 조명기구는, 기구 장착면에 설치된 배선기구에 부착되는 장착부를 가지는 기구 본체와；상기 장착부의 외주측의 기구 본체에 배치되는 점등장치와; 전면(前面)측에 발광소자의 실장면(實裝面)이 형성되고, 상기 점등장치의 외측에 위치되어 점등장치와 상하로 서로 겹치지 않도록 배치됨과 동시에 이면측이 상기 기구 본체에 배치된 기판과; 이 기판에 실장되고, 동심원 형상의 복수의 원주상에, 또는, 동일한 형상이고 중심이 같으며 크기가 상이한 복수의 다각형의 둘레 상에 열을 이루어 나열되며, 인접하는 열(列)간에, 둘레방향으로 오프셋되어 배치된 각 열 동수(同數)의 발광소자를 구비하고, 상기 기판의 표면에 백색의 반사층이 구비되며, 상기 기판은 절연성의 기판이다.An illuminating device according to an embodiment of the present invention includes: an appliance main body having a mounting portion attached to a wiring mechanism provided on an appliance mounting surface; a lighting device disposed on an appliance main body on the outer peripheral side of the mounting portion; A mounting surface of the light emitting element is formed on the front side, and is disposed outside the lighting device so as not to overlap with the lighting device so as to overlap each other, and the rear surface is disposed on the mechanism main body; ; It is mounted on this substrate, arranged in rows on a plurality of concentric circumferences, or on a perimeter of a plurality of polygons having the same shape, the same center, and different sizes, and the adjacent rows are arranged in a circumferential direction. The light emitting elements of the same number of columns arrange | positioned at offset and are provided, The white reflective layer is provided in the surface of the said board | substrate, The said board | substrate is an insulating board | substrate.

본 발명의 실시 형태에 의하면, 구성의 간소화가 가능하고, 방열 구조를 구성하기 쉬운 것으로 할 수 있으며, 또한, 복수의 발광소자로부터 출사되는 광의 이미지를 균일화함이 가능한 조명기구를 제공할 수 있다.According to the embodiment of the present invention, it is possible to simplify the configuration, to provide a heat dissipation structure that can be easily configured, and to provide a lighting apparatus capable of uniformizing the image of light emitted from the plurality of light emitting elements.

도 1은 본 발명의 제1 실시 형태에 의한 조명기구를 나타내는 사시도이다.
도 2는 도 1의 조명기구를 나타내는 단면도이다.
도 3은 도 1의 조명기구를 하방으로부터 본 것을 나타내는 평면도이다.
도 4는 도 1의 조명기구에서의 광원부를 나타내는 평면도이다.
도 5는 본 발명의 제2 실시 형태에 의한 광원부를 나타내는 평면도이다.1 is a perspective view showing a lighting apparatus according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the lighting fixture of FIG. 1. FIG.
FIG. 3 is a plan view showing the lighting apparatus of FIG. 1 as viewed from below. FIG.
4 is a plan view illustrating a light source unit in the luminaire of FIG. 1.
It is a top view which shows the light source part by 2nd Embodiment of this invention.

이하, 본 발명의 제1 실시 형태에 대해서 도 1 내지 도 4를 참조하여 설명한다. 각 도면에서 리드선 등에 의한 배선 접속 관계는 생략해서 나타내고 있다. 아울러, 동일 부분에는 동일 부호를 붙이고, 중복된 설명은 생략한다.EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described with reference to FIGS. In each figure, the wiring connection relationship by a lead wire etc. is abbreviate | omitted and shown. In addition, the same code | symbol is attached | subjected to the same part and the overlapping description is abbreviate | omitted.

본 실시 형태의 조명기구는, 기구 장착면에 설치된 배선기구로서의 실링 마운팅 보디에 장착되어 사용되는 형식이며, 원주상에 복수의 열을 이루어서 배치된 복수의 발광소자를 갖는 광원부로부터 방사(放射)되는 광에 의해서 실내의 조명을 행하는 것이다.The luminaire of this embodiment is a type attached to and used by a sealing mounting body as a wiring mechanism provided on a fixture mounting surface, and radiates from a light source unit having a plurality of light emitting elements arranged in a plurality of rows on a circumference. Lighting of the room is performed by light.

도 1 내지 도 3에 있어서, 조명기구는, 본체(1)와, 광원부(2)와, 점등장치 (3)와, 장착부(4)와, 커버 부재(5)와, 반사판(6)을 구비하고 있다. 또한, 기구 장착면으로서의 천장면(C)에 설치된 실링 마운팅 보디(Cb)에 전기적 및 기계적으로 접속되는 어댑터(A)를 구비하고 있다. 이러한 조명기구는, 둥근 형태의 원형상의 외관으로 형성되어, 전면(前面)측을 광의 조사면(照射面)으로 하고, 배면측을 천장면(C)으로의 장착면으로 하고 있다.1 to 3, the lighting apparatus includes a main body 1, a light source unit 2, a lighting device 3, a mounting unit 4, a cover member 5, and a reflecting plate 6. Doing. Moreover, the adapter A connected electrically and mechanically to the sealing mounting body Cb provided in the ceiling surface C as a mechanism mounting surface is provided. Such a lighting fixture is formed in a circular circular appearance, and the front side is used as the irradiation surface of light, and the back side is used as the mounting surface to the ceiling surface C. FIG.

도 2에 대표로 나타내는 바와 같이, 본체(1)는, 냉간 압연 강판 등의 금속재료의 평판으로부터 원형상으로 형성되어 있고, 대략 중앙부에, 후술하는 점등장치 (3) 및 장착부(4)를 배치하기 위한 원형상 오목부(11) 및 개구(開口,12)가 형성되어 있다.As representatively shown in FIG. 2, the main body 1 is formed in circular shape from the flat plate of metal materials, such as a cold rolled steel plate, and arrange | positions the lighting apparatus 3 and the mounting part 4 mentioned later in the substantially center part. A circular recess 11 and an opening 12 are formed for this purpose.

광원부(2)는, 도 4의 참조와 더불어 설명하는 바와 같이, 기판(21)과, 이 기판(21)에 실장된 복수의 발광소자(22)를 구비하고 있다. 기판(21)은, 소정의 폭치수를 갖고 대략 서클 형상으로 형성되어 있고, 절연재인 유리 에폭시수지의 평판으로 이루어지며, 표면측에는 동박(銅箔)에 의해서 배선 패턴이 형성되어 있다. 또한, 배선 패턴의 위, 즉, 기판(21)의 표면에는 반사층으로서 작용하는 백색의 레지스트층이 설치되어 있다. 아울러, 기판(21)의 재료는, 절연재로 하는 경우에는, 세라믹스 재료 또는 합성수지 재료를 적용할 수 있다. 또한, 금속제로 하는 경우는, 알루미늄 등의 열전도성이 양호하고 방열성이 뛰어난 베이스판의 한 면에 절연층이 적층된 금속제의 베이스 기판을 적용할 수 있다.As described with reference to FIG. 4, the light source unit 2 includes a substrate 21 and a plurality of light emitting elements 22 mounted on the substrate 21. The board | substrate 21 has predetermined width dimension, is formed in substantially circle shape, consists of a flat plate of glass epoxy resin which is an insulating material, and the wiring pattern is formed in the surface side by copper foil. Further, a white resist layer serving as a reflective layer is provided on the wiring pattern, that is, on the surface of the substrate 21. In addition, when the material of the board | substrate 21 is used as an insulating material, a ceramic material or a synthetic resin material can be applied. Moreover, when it is made from metal, the metal base board in which the insulating layer was laminated | stacked on one side of the base board which is excellent in heat conductivity and excellent heat dissipation, such as aluminum, can be applied.

발광소자(22)는, LED이며, 표면 실장형의 LED 패키지이다. 이 LED 패키지가 복수개 서클 형상의 기판(21)의 둘레방향을 따라서, 복수열, 본 실시 형태에서는, 내주측 및 외주측의 2열에 걸쳐 실장되어 있다. 둘레방향에 인접하는 각 LED 패키지는, 대략 등간격의 이격 거리를 두고 원주상에 나열되어 복수 개, 구체적으로는, 44개가 내주측 및 외주측의 2열로, 동수로 실장되어 있다.The light emitting element 22 is an LED and is a surface mount type LED package. The LED package is mounted along a circumferential direction of the plurality of circle-shaped substrates 21 in two rows, in this embodiment, in two rows on the inner circumferential side and the outer circumferential side. Each LED package adjacent to the circumferential direction is arranged on the circumference at substantially equal intervals, and a plurality of, in particular, 44 are mounted in the same number in two rows on the inner circumference side and the outer circumference side.

또한, 내주측 및 외주측의 열에서의 각 LED 패키지는, 그 상호가 둘레방향에서 겹치지 않도록 오프셋되어(도 4중, d로 도시한다) 배치되어 있다. 더 자세하게는, 한쪽 열(예를 들면, 내주측의 열)의 둘레방향에 인접하는 각 LED 패키지의 이격 거리의 대략 중앙부에, 다른쪽 열(예를 들면, 외주측의 열)의 LED 패키지가 배치되고, 다른쪽 열의 둘레방향에 인접하는 각 LED 패키지의 이격 거리의 대략 중앙부에, 한쪽 열의 LED 패키지가 배치되고, 이것이 둘레방향으로 연속된 상호의 배치 관계로 되어 있다.In addition, each LED package in the column on the inner circumferential side and the outer circumferential side is arranged so as to be offset so as not to overlap each other in the circumferential direction (shown as d in FIG. 4). More specifically, the LED package of the other row (for example, the column on the outer circumference) is located at approximately the center of the separation distance of each LED package adjacent to the circumferential direction of one row (for example, the row on the inner circumference side). The LED packages of one row are arrange | positioned at the substantially center part of the separation distance of each LED package adjacent to the circumferential direction of the other row, and this has a mutual arrangement relationship continuous in the circumferential direction.

즉, 각 열 동수(44개)의 발광소자(22)가 반경이 다른 대략 동심원의 원주상에 복수의 열(2열)을 이루어 나열되고, 인접하는 열간(내주측 및 외주측의 열)에, 둘레방향으로 오프셋되어 배치되어 있는 것으로, 이른바, 인접하는 열간에 지그재그 형상으로 배치되어 있는 것이다.That is, 44 columns of light emitting elements 22 are arranged in a plurality of rows (two rows) on circumferences of substantially concentric circles having different radii, and are arranged in adjacent columns (columns on the inner and outer circumferences). Are offset in the circumferential direction and are arranged in a zigzag shape between the adjacent columns.

이와 같이, 각 열 동수의 발광소자(22)를 실장하기 때문에, 위치를 오프셋시켜 균형 있게 발광소자(22)를 기판(21)상에 분산 배치할 수 있다.In this way, since the same number of light emitting elements 22 are mounted, the positions of the light emitting elements 22 can be distributed and arranged on the substrate 21 in a balanced manner.

LED 패키지는, 개략적으로는 세라믹스로 형성된 본체에 배치된 LED 칩과, 이 LED 칩을 밀봉하는 에폭시계 수지나 실리콘 수지 등의 몰드용의 투광성 수지로 구성되어 있다.An LED package is comprised with LED chip arrange | positioned generally in the main body formed from ceramics, and translucent resin for molds, such as epoxy resin and silicone resin which seal this LED chip.

LED 칩은, 청색광을 발광하는 청색의 LED 칩이다. 투광성 수지에는, 형광체가 혼입되어 있고, 백색광을 출사할 수 있도록 하기 위해, 청색의 광과는 보색(補色) 관계에 있는 황색계의 광을 방사하는 황색 형광체가 사용되고 있다.The LED chip is a blue LED chip that emits blue light. In the translucent resin, a phosphor is mixed, and a yellow phosphor that emits yellow light having a complementary color relationship with blue light is used so that white light can be emitted.

또한, LED는, LED 칩을 직접 기판(21)에 실장해도 좋고, 또한, 포탄(砲彈)형의 LED를 실장해도 좋으며, 실장 방식이나 형식은, 각별히 한정되는 것은 아니다.In addition, LED may be mounted directly on the board | substrate 21, LED may be mounted in shell type | mold, and a mounting method and a form are not specifically limited.

이와 같이 구성된 광원부(2)는, 도 2 및 도 3에 대표로 나타내는 바와 같이, 기판(21)이 장착부(4)의 주위에 위치하고, 발광소자(22)의 실장면이 전면측, 즉, 하방의 조사방향으로 향해져 배치되어 있다. 또한, 기판(21)의 이면측이 본체(1)의 내면측에 밀착하도록 예를 들면, 나사 등의 고정수단에 의해서 부착되어 있다. 따라서, 기판(21)은, 본체(21)와 열(熱)적으로 결합되어, 기판(21)으로부터의 열이 이면측으로부터 본체(21)에 전도되어 방열되도록 되어 있다.In the light source unit 2 configured as described above, the substrate 21 is positioned around the mounting portion 4 as shown in FIGS. 2 and 3, and the mounting surface of the light emitting element 22 is on the front side, that is, downward. It is arrange | positioned toward the irradiation direction of. In addition, the back surface side of the board | substrate 21 is attached by fixing means, such as a screw, for example so that it may be in intimate contact with the inner surface side of the main body 1. As shown in FIG. Therefore, the board | substrate 21 is thermally couple | bonded with the main body 21, and the heat from the board | substrate 21 is conducted to the main body 21 from the back surface side, and to radiate heat.

점등장치(3)는, 도 2 및 도 3에 나타내는 바와 같이, 대략 단원통(短圓筒) 형상의 케이스와, 이 케이스내에 장착되어 수용된 회로기판(31)과, 이 회로기판에 실장된 회로 부품을 구비하고 있다. 이 점등장치(3)는, 본체(1)의 중앙부에 형성된 오목부(11)에 배치되어 장착되어 있고, 어댑터(A)측이 전기적으로 접속되어, 어댑터(A)를 통하여 상용 교류 전원에 접속된다. 따라서, 점등장치(3)는, 이 교류 전원을 받아 직류 출력을 생성하고, 리드선을 통하여 그 직류 출력을 발광소자(22)에 공급하여, 발광소자(22)를 점등 제어하도록 되어 있다.As shown in Figs. 2 and 3, the lighting device 3 has a case of a substantially single cylinder shape, a circuit board 31 mounted and housed in the case, and a circuit mounted on the circuit board. It is equipped with parts. The lighting device 3 is disposed and mounted in the recess 11 formed in the center of the main body 1, and the adapter A side is electrically connected to the commercial AC power supply via the adapter A. do. Therefore, the lighting device 3 receives this AC power, generates a DC output, supplies the DC output to the light emitting element 22 through a lead wire, and controls the light emitting element 22 to be lit.

장착부(4)는, 대략 원통형상으로 형성된 어댑터 가이드이며, 이 어댑터 가이드의 중앙부에는, 어댑터(A)가 삽입통과되어, 결합되는 결합 입구가 형성되어 있다. 이 어댑터 가이드는, 그 외주면이 점등장치(3)의 케이스에서의 내주측에 위치하도록 배치되어 있는데, 환언하면, 어댑터 가이드의 외주측에는, 점등장치(3)가 배치되도록 되어 있다. 또한, 어댑터 가이드는, 본체(1)의 개구(12)를 삽입통과하여 전면측으로 연출(延出)되어 있다.The mounting portion 4 is an adapter guide formed in a substantially cylindrical shape, and a coupling inlet through which the adapter A is inserted and engaged is formed in the center portion of the adapter guide. This adapter guide is arrange | positioned so that the outer peripheral surface may be located in the inner peripheral side in the case of the lighting device 3, In other words, the lighting device 3 is arrange | positioned at the outer peripheral side of the adapter guide. Moreover, the adapter guide passes through the opening 12 of the main body 1, and is extended to the front surface side.

아울러, 장착부(4)는, 반드시 어댑터 가이드 등으로 지칭되는 부재일 필요는 없다. 예를 들면, 본체(1)이나 반사판(6)에 형성되는 개구(開口)이어도 좋은데, 요컨대, 배선 기구로서의 실링 마운팅 보디(Cb)에 대향해서, 어댑터(A)가 결합되는 부재나 부분을 의미하고 있다.In addition, the mounting part 4 does not necessarily need to be a member referred to as an adapter guide or the like. For example, although the opening formed in the main body 1 or the reflecting plate 6 may be sufficient, in other words, it means the member and the part which the adapter A couple | bonds with it facing the sealing mounting body Cb as a wiring mechanism. Doing.

커버 부재(5)는, 아크릴 수지 등의 투광성을 갖고, 유백(乳白)색을 갖고 확산성을 구비한 재료로 형성되어 있으며, 평탄 형상으로 형성된 원 형상의 베이스부 (51)와, 이 베이스부(51)의 외주로부터 비스듬히 내주 방향으로 연출한 측연(側緣)부(52)를 구비하고 있다. 그리고, 커버 부재(5)는, 광원부(2)를 포함한 본체(1)의 전면측을 덮도록 본체(1)의 외주연부(外周緣部)에 부착되도록 되어 있다.The cover member 5 is formed of a light-transmissive material such as an acrylic resin, has a milky white color, and has a diffusibility, and has a circular base portion 51 formed in a flat shape, and the base portion. The side edge part 52 extended diagonally from the outer periphery of 51 by the inner peripheral direction is provided. And the cover member 5 is attached to the outer periphery of the main body 1 so that the front surface side of the main body 1 containing the light source part 2 may be covered.

반사판(6)은, 도 2에 나타내는 바와 같이, 냉간 압연 강판 등의 금속재료의 평판으로부터 경사 형상의 반사면(61)을 갖는 원 형상으로 형성되어 있고, 대략 중앙부에 어댑터(A)를 조작하기 위한 개구가 형성되어 있다. 따라서, 발광소자(22)로부터 출사되는 일부의 광은, 반사면(61)에 의해서 전면측에 반사되어 유효하게 사용되게 된다.As shown in FIG. 2, the reflecting plate 6 is formed in the circular shape which has the inclined reflecting surface 61 from the flat plate of metal materials, such as a cold rolled steel plate, and operates the adapter A in the substantially center part. An opening is formed. Therefore, a part of light emitted from the light emitting element 22 is reflected by the reflecting surface 61 to the front side, and is used effectively.

어댑터(A)는, 천장면(C)에 설치된 실링 마운팅 보디(Cb)에, 상면측에 설치된 마운팅 날에 의해서 전기적 및 기계적으로 접속되는 것으로 대략 원통형상을 이루며, 주벽(周壁)의 양측에는 한 쌍의 걸림부(A1)가, 내장된 스프링에 의해서 상시 외주측으로 돌출하도록 설치되어 있다. 이 걸림부(A1)는 하면측에 설치된 레버를 조작함으로써 몰입(沒入)하도록 되어 있다. 또한, 이 어댑터(A)로부터는, 상기 점등장치(3)로 접속되는 도시하지 않은 전원 코드가 도출되어 있고, 점등장치(3)와 커넥터를 사이에 두고 접속되도록 되어 있다.The adapter A is electrically and mechanically connected to the sealing mounting body Cb provided on the ceiling surface C by a mounting blade provided on the upper surface side, and has a substantially cylindrical shape. The adapter A is provided on both sides of the main wall. The pair of locking portions A1 are provided so as to protrude to the outer circumferential side at all times by the built-in spring. This locking part A1 is immersed by operating the lever provided in the lower surface side. Moreover, the power supply cord which is not shown in figure connected to the said lighting device 3 is derived from this adapter A, and is connected so that the lighting device 3 and a connector may be connected.

다음으로, 조명기구의 천장면(C)으로의 부착 상태에 대해 설명한다. 도 2에 나타내는 바와 같이, 천장면(C)에 실링 마운팅 보디(Cb)가 설치되어 있다. 또한, 이 실링 마운팅 보디(Cb)에는, 어댑터(A)가 전기적 및 기계적으로 접속되어 있다. 이 상태로부터 도면상에 화살표로 나타내는 바와 같이, 장착부(4)로서의 어댑터 가이드의 결합 입구를 어댑터(A)에 맞추면서, 어댑터(A)의 걸림부(A1)가 어댑터 가이드의 결합 입구에 확실히 결합될 때까지 기구 본체를 하방으로부터 손으로 밀어 올려 장착 조작을 행한다.Next, the attachment state to the ceiling surface C of a luminaire is demonstrated. As shown in FIG. 2, the ceiling mounting body C is provided with the sealing mounting body Cb. In addition, the adapter A is electrically and mechanically connected to this sealing mounting body Cb. From this state, as indicated by the arrow on the drawing, the engaging portion A1 of the adapter A can be reliably engaged with the engaging inlet of the adapter guide while aligning the engaging inlet of the adapter guide as the mounting portion 4 with the adapter A. The instrument body is pushed up by hand from below until a mounting operation is performed.

또한, 기구 본체를 떼어내는 경우에는, 커버 부재(5)를 떼어내고, 어댑터(A)에 설치되어 있는 레버를 조작하여 어댑터(A)의 걸림부(A1)의 결합을 해제함으로써 떼어낼 수 있다.In addition, when removing a mechanism main body, it can remove by removing the cover member 5 and releasing the engagement of the latching part A1 of the adapter A by operating the lever provided in the adapter A. FIG. .

조명기구의 천장면(C)으로의 부착상태에 있어서, 점등장치(3)에 전력이 공급되면, 기판(21)을 통해 발광소자(22)에 통전되어, 각 발광소자(22)가 점등된다. 발광소자(22)로부터 출사된 광은 커버 부재(5)를 투과하여 외방으로 조사된다.In the state where the lighting device is attached to the ceiling surface C, when electric power is supplied to the lighting device 3, the light emitting element 22 is energized through the substrate 21, and each light emitting element 22 is turned on. . Light emitted from the light emitting element 22 passes through the cover member 5 and is irradiated outward.

이 경우, 발광소자(22)는, 위치를 오프셋시켜 균형 있게 분산해서 배치되어 있으므로, 광원부(2)의 휘도 불균형을 경감할 수 있어, 복수의 발광소자로부터 출사되는 광의 이미지를 균일화함이 가능해진다.In this case, since the light emitting elements 22 are arranged in such a manner as to be offset and distributed in a balanced manner, the luminance unevenness of the light source unit 2 can be reduced, so that the image of the light emitted from the plurality of light emitting elements can be made uniform. .

또한, 기판(21)이 장착부(4)의 주위에 위치하고, 발광소자(22)의 실장면이 전면측으로 향하여져 배치되어 있으므로, 구성의 간소화가 가능하고, 더욱이, 기판 (21)으로부터의 열을 방열하기 위한 방열 구조를 구성하기 쉬운 것으로 할 수 있다. 예를 들면, 본 실시 형태와 같이, 기판(21)의 이면측을 본체(1)에 열적으로 결합하여, 기판(21)으로부터의 열을 본체(21)에 전도하여 방열하는 구성을 용이하게 실현할 수 있다. 이에 의해 발광소자(22)의 온도 상승을 억제함이 가능해진다.Moreover, since the board | substrate 21 is located around the mounting part 4, and the mounting surface of the light emitting element 22 is arrange | positioned toward the front side, the structure can be simplified and the heat | fever from the board | substrate 21 is further reduced. The heat dissipation structure for heat dissipation can be made easy. For example, as in the present embodiment, the rear surface side of the substrate 21 is thermally coupled to the main body 1 to easily realize a configuration in which heat from the substrate 21 is conducted to the main body 21 to radiate heat. Can be. This makes it possible to suppress the temperature rise of the light emitting element 22.

아울러, 점등장치(3)는, 장착부(4)의 외주측에 배치되어 있고, 기판(21)은, 장착부(4)의 주위에 위치하며, 이면측이 본체(1)에 열적으로 결합되어 있으므로, 점등장치(3)로부터 생기는 열과 발광소자(22)로부터 생기는 열의 상호 열적 간섭이 경감되어, 발광소자(22)의 온도 상승을 효과적으로 억제할 수 있다.In addition, since the lighting device 3 is disposed on the outer circumferential side of the mounting portion 4, the substrate 21 is located around the mounting portion 4, and the rear surface side is thermally coupled to the main body 1. The mutual thermal interference between the heat generated from the lighting device 3 and the heat generated from the light emitting element 22 can be reduced, so that the temperature rise of the light emitting element 22 can be effectively suppressed.

다음으로, 본 발명의 제2 실시 형태에 대해서 도 5를 참조하여 설명한다. 도 5는, 도 4와 마찬가지로, 광원부(2)의 평면을 나타내고 있다. 아울러, 제 1 실시 형태와 동일 또는 상당 부분에는 동일 부호를 붙이고, 중복된 설명은 생략한다.Next, 2nd Embodiment of this invention is described with reference to FIG. FIG. 5 has shown the plane of the light source part 2 similarly to FIG. In addition, the same code | symbol is attached | subjected to 1st Embodiment or an equivalent part, and the overlapping description is abbreviate | omitted.

본 실시 형태에서는, 발광소자(22)를 내주측, 중앙측 및 외주측의 3열에 걸쳐 실장한 것이다. 그리고, 각 열에 있어서, 둘레방향에 인접하는 각 LED 패키지는, 대략 등간격의 이격 거리를 비워서 원주상에 나열되어 동수 실장되어 있다.In this embodiment, the light emitting element 22 is mounted over three columns on the inner circumferential side, the center side, and the outer circumferential side. In each column, each LED package adjacent to the circumferential direction is arranged in the same number in the circumferential direction, leaving a spaced distance of approximately equal intervals.

또한, 인접하는 각 열에서의 각 LED 패키지는, 그 상호가 둘레방향에서 겹치지 않도록 오프셋되어 배치되어 있다. 즉, 내주측의 열의 각 LED 패키지와 중앙측의 열의 각 LED 패키지는, 도면상에 d1로 나타내는 오프셋이 마련되어 있고, 중앙측의 열의 각 LED 패키지와 외주측의 열의 각 LED 패키지는, 도면상에 d2로 나타내는 오프셋이 마련되어 있다.In addition, each LED package in each adjacent column is offset and arrange | positioned so that they may not overlap in a circumferential direction. That is, each LED package in the column on the inner circumference side and each LED package in the column on the center side are provided with an offset indicated by d1 on the drawing, and each LED package in the column on the center side and each LED package in the column on the outer circumference side is The offset represented by d2 is provided.

따라서, 각 열 동수(44개)의 발광소자(22)가 반경이 다른 대략 동심원의 원주상에 복수의 열(3열)을 이루어 나열되고, 인접하는 열간(내주측 및 중앙측의 열, 중앙측 및 외주측의 열)에, 둘레방향으로 오프셋되어 배치되어 있는 것이다.Therefore, the light emitting elements 22 of each column number 44 are arranged in a plurality of rows (three rows) on circumferences of substantially concentric circles having different radii, and adjacent columns (columns on the inner circumference side and center side, center) The rows on the side and the outer circumferential side are offset in the circumferential direction.

이와 같이, 제1 실시 형태와 마찬가지로, 각 열 동수의 발광소자(22)를 실장하기 때문에, 위치를 오프셋시켜 균형 좋게 발광소자(22)를 기판(21)상에 분산 배치할 수 있어, 복수의 발광소자로부터 출사되는 광의 이미지를 균일화함이 가능해진다.As described above, in the same manner as in the first embodiment, since the same number of light emitting elements 22 are mounted, the light emitting elements 22 can be arranged on the substrate 21 in a balanced manner by offsetting the positions. The image of the light emitted from the light emitting element can be made uniform.

아울러, 본 발명은, 상기 각 실시 형태의 구성에 한정됨 없이, 발명의 요지를 일탈하지 않는 범위에서 여러 가지의 변형이 가능하다. 예를 들면, 본 조명기구는, 천장에 바로 장착하는 직접 장착 타입 외에, 천장면에 매달리는 팬던트 타입, 천장 매설 타입이어도 상관없다. 또한, 발광소자를 기판에, 크기가 다른, 중심을 대략 같이 하는 다각형의 둘레 상에 복수의 열을 이루어 나열하고, 인접하는 열간에, 둘레방향으로 오프셋되어 배치하며 각 열 동수로 실장하도록 해도 좋다. 구체적으로는, 가령, 육각형의 다각형의 둘레 상에 발광소자를 실장하는 경우에는, 내측의 육각형의 둘레 상에, 및 외측의 육각형의 둘레 상에 발광소자를 나열하고, 내측에 나열된 발광소자와 외측에 나열된 발광소자를 둘레방향으로 오프셋시켜 배치하는 경우이다.In addition, this invention is not limited to the structure of each said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary of invention. For example, the luminaire may be a pendant type suspended from the ceiling or a ceiling embedded type in addition to the direct mounting type mounted directly on the ceiling. Further, the light emitting elements may be arranged on a substrate in a plurality of rows arranged on the periphery of approximately same center polygons of different sizes, and are arranged in the same number of rows with the adjacent rows being offset in the circumferential direction. . Specifically, for example, in the case of mounting the light emitting element on the circumference of the hexagonal polygon, the light emitting elements are arranged on the circumference of the inner hexagon and on the circumference of the outer hexagon, and the light emitting element and the outer side arranged inside This is the case where the light emitting elements listed in the above arrangement are offset in the circumferential direction.

기판은, 원형의 서클 형상 또는 육각형이나 팔각형의 다각형상으로 형성함이 바람직하지만, 이 형상으로 한정되는 것은 아니다. 요컨대, 발광소자를 원주상에, 또는 다각형의 둘레 상에 배치할 수 있으면, 기판의 형상은 각별히 한정되는 것은 아니다. 또한, 기판은, 복수로 분할 형성되어 있고, 이를 조합한 전체로서 구성하도록 해도 좋다.The substrate is preferably formed in a circular circle shape or a hexagonal or octagonal polygonal shape, but is not limited to this shape. In other words, the shape of the substrate is not particularly limited as long as the light emitting element can be arranged on the circumference or the circumference of the polygon. In addition, the board | substrate is formed in multiple numbers, and you may comprise as a whole which combined this.

또한, 광원부로부터 방사되는 광의 균제도(均齊度)를 향상시키기 위해, 발광소자에 대응하여 확산 렌즈를 설치하거나, 커버 부재에 광의 투과율 제어수단을 설치해도 좋다.Moreover, in order to improve the uniformity of the light radiated | emitted from a light source part, you may provide a diffusion lens corresponding to a light emitting element, or you may provide the light transmittance control means in a cover member.

또한, 발광소자는, LED나 유기 EL 등의 고체 발광소자를 적용할 수 있고, 이 경우, 발광소자의 개수, 열수는, 특별히 한정되는 것은 아니다.In addition, as a light emitting element, solid light emitting elements, such as LED and organic electroluminescent element, can be applied, In this case, the number and number of light emitting elements are not specifically limited.

1…본체 2…광원부
3…점등장치 4…장착부(어댑터 가이드)
5…커버 부재 6…반사판
21…기판 22…발광소자(LED)
C…기구 장착면(천장면) Cb…배선 기구(실링 마운팅 보디)One… Body 2. Light source
3 ... Lighting device 4.. Mounting section (adapter guide)
5 ... Cover member 6.. Reflector
21 ... Substrate 22... Light emitting element (LED)
C ... Instrument mounting surface (ceiling surface) Cb.. Wiring mechanism (sealing mounting body)

Claims (3)

기구 장착면에 설치된 배선기구에 부착되는 장착부를 가지는 기구 본체와；
상기 장착부의 외주측의 기구 본체에 배치되는 점등장치와;
전면(前面)측에 발광소자의 실장면이 형성되고, 상기 점등장치의 외측에 위치되어 점등장치와 상하로 서로 겹치지 않도록 배치됨과 동시에 이면측이 상기 기구 본체에 배치된 기판과;
이 기판에 실장되고, 동심원 형상의 복수의 원주상에, 또는, 동일한 형상이고 중심이 같으며 크기가 상이한 복수의 다각형의 둘레 상에 열을 이루어 나열되며, 인접하는 열(列)간에, 둘레방향으로 오프셋되어 배치된 각 열 동수(同數)의 발광소자를 구비하고,
상기 기판의 표면에 백색의 반사층이 구비되며,
상기 기판은 절연성의 기판인 것을 특징으로 하는 조명기구.An instrument body having a mounting portion attached to a wiring instrument provided on the instrument mounting surface;
A lighting device disposed in the mechanism body on the outer circumferential side of the mounting portion;
A substrate on which a mounting surface of a light emitting element is formed on a front surface side, which is disposed outside the lighting device so as not to overlap each other up and down with the lighting device, and a rear surface of which is disposed on the mechanism main body;
It is mounted on this substrate, arranged in rows on a plurality of concentric circumferences, or on a perimeter of a plurality of polygons having the same shape, the same center, and different sizes, and the adjacent rows are arranged in a circumferential direction. Light emitting elements having the same number of columns arranged offset by
A white reflective layer is provided on the surface of the substrate,
And the substrate is an insulating substrate. 삭제delete 삭제delete
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CN102444845A (en) 2012-05-09
TWI509187B (en) 2015-11-21

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