KR101352580B1 - Cooling structure of chip sensor - Google Patents

Abstract

The cooling structure of the component recognition apparatus according to the present invention comprises: a substrate in which a plurality of VIA holes are concentrated on one or more light source installation portions; A heat dissipation structure disposed to have a distance in front of the substrate while exposing the light irradiation part of the light source forward; A heat sink disposed at a rear side of the substrate to release heat; .

Light source, lamp, board, heat dissipation, heat sink, mesh, VIA hole

Description

Cooling structure of component recognition device

The present invention relates to a component recognition device, and more particularly, to a cooling structure of a component recognition device that can maximize the cooling efficiency of the light source by quickly dissipating heat generated from the light source.

In a chip mounter (component mounter) for automatically mounting a component (chip) on a printed circuit board, a component recognition device is installed to recognize a component to be mounted by being absorbed by a suction nozzle.

As shown in FIG. 1, the conventional component recognition device includes an adsorption head 40 fixed to an end of the nozzle 41 to adsorb the component 50, and a solid state image pickup device below the adsorption head 40. Used camera 60 is installed. The lens 61 of the camera 60 faces the adsorption head 40 and irradiates light toward the absorption head 40 so that the camera 60 recognizes the component 50 adsorbed to the adsorption head 40. And dimming means for injecting the light back into the lens 61 of the camera 60.

Here, the dimming means is installed at a position opposite to the lens 61 of the camera 60 with the adsorption head 40 therebetween, and the light irradiated from the dimming means is adsorbed to the adsorption head 40 ( The light source 10 is configured to directly enter the lens 61 of the camera 60 via 50.

The conventional component recognition device for a chip mounter (component mounting machine) configured as described above is gradually changing to a trend of using a high-brightness light source with the increase in the speed of component mounting equipment. As a kind of light source, it was common to use a halogen lamp or a diode element.

However, when using a high brightness light source, the light source is damaged by the heat generated by the light source itself, resulting in a change in the amount of light irradiated. As a result, the light source cannot uniformly irradiate light. In other words, it cannot provide a uniform amount of light, so that it is impossible to accurately recognize a part of a part supplied to the chip mounter.

 Conventional methods for solving the above problems include an air-cooled cooling device that installs and radiates a fan that blows air into the light source, and a water-cooled cooling device that cools the light source by circulating a refrigerant in a tube.

The air-cooled cooling device is a method of causing a change in the air flow rate by changing the rotation speed of the fan to the displacement of the heat generated from the substrate or the light source, and two representative methods of cooling by natural cooling method before the heat is transferred to the substrate There is a way.

Next, the water-cooled chiller is for forcibly circulating water or special liquid into the tube to cool the specific part. Such a water-cooled chiller is used to intensively cool a portion where the temperature increases a lot so that a change in the amount of light does not occur. Representatively, it is widely used for a part recognition device using a laser.

However, since the operating temperature of recently used light sources is maintained at a maximum of about 45 ° C. to about 85 ° C., the conventional chiller structure is not suitable for cooling the high heat of the recently used high brightness light sources.

 In addition, in the case of a component recognition device using a large number of light sources, it is more difficult to maintain the heat generated from the light source due to the higher amount of heat generated.

In order to solve this problem, the heat dissipation structure of the cooling autonomy must be further strengthened, but for this purpose, the volume of the cooling device is inevitably increased. This raises manufacturing costs.

In addition, when using a water-cooled cooling device to increase the cooling performance, the installation of a tube for circulating the cooling water and a pump and a controller for cooling water circulation must be installed, so that also the size of the cooling device is bound to increase. That is, the size is large, it is difficult to mount the water-cooled cooling device to the component recognition device.

On the other hand, in general, in the case of a metal substrate (PCB), the heat of the light source is easily released to the outside, while in the case of the resin substrate, the heat generated from the front surface is difficult to be released to the rear of the substrate technology to solve this problem This is necessary.

Accordingly, the present invention is to solve the above-mentioned conventional problems, the heat generated from the light source through the heat dissipation structure, the substrate and the heat sink quickly and at the same time to form a heat discharge passage between the heat dissipation structure and the substrate By quickly dissipating the heat generated from the outside can maximize the cooling efficiency of the light source. Accordingly, it is an object of the present invention to provide a cooling structure of a component recognition device capable of securing a uniform amount of light by maintaining a light source at a constant temperature.

The present invention for achieving the above object is a substrate in which a plurality of VIA holes concentrated on one or more light source installation site; A heat dissipation structure disposed to have a distance in front of the substrate while exposing the light irradiation part of the light source forward; A heat sink disposed at a rear side of the substrate to release heat; And a control unit.

As described above, by having a structure that maximizes the cooling efficiency of the light source, a uniform amount of light is secured, thereby maintaining the accuracy of component recognition.

In addition, since it has a structure that maximizes the cooling efficiency of the light source and has a simple structure, the manufacturing cost can be lowered and miniaturized.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is an exploded perspective view of the cooling structure of the component recognition apparatus according to the present invention, Figure 3 is a side cross-sectional view showing a coupling state according to Figure 2, Figure 4 is a view showing a heat emission pattern of the substrate according to Figure 2, Figure 5 is a view illustrating a VIA hole shape of the substrate according to FIG. 2, FIG. 6 is an exploded perspective view illustrating a state in which a heat dissipation member is provided behind a substrate of a component recognition apparatus according to the present invention, and FIG. 7 is a part according to the present invention. It is an exploded perspective view showing a state in which a tube for circulating the heat transfer medium is provided behind the substrate of the recognition device.

As shown, the component recognition device 100 of the present invention includes a light source 110, a printed circuit board (120), a heat dissipation structure 130 and a heat sink 140. In addition, the spacer 150 and a fan (not shown) may be further included.

The cooling structure of the component recognition device 100 of the present invention having the above configuration has the purpose of rapidly dissipating heat generated from the light source 110 and the substrate 120 to the outside.

The cooling structure of the component recognition device having the above configuration may be separately installed at the front or upper side of the camera for imaging the component to irradiate light to the component, and the irradiated light may be reflected and incident back to the camera. The component can be detected by

First, the light source 110 is installed in a grounded and fixed state through a coupling hole on the substrate 120, and has a manner of lighting as power is supplied to the wiring of the substrate 120. That is, the light emitted from the light source 110 is reflected through the component, and the reflected light is incident on the lens of the camera (not shown) to recognize the component.

Such light sources 110 may be provided as one, but when provided in plural, it is preferable that each light source 110 is disposed to have a predetermined distance so that light emitted from each light source 110 does not interfere with each other. .

As the type of the light source 110, a general high frequency neon lamp or a diode element is preferably used.

Next, the substrate 120 is provided to install the light source 110 in front of the substrate 120, the substrate 120, when using a resin substrate 120 having a plurality of layer layers, the substrate 120 The heat dissipation pattern 122 may be formed on the front surface of the substrate and the front surfaces of the layer layers, respectively.

In addition, a plurality of VIA holes 121 may be formed in the substrate 120 to intensively discharge heat of a portion where the light source 110 is installed. In addition, a fastening hole (not shown) for installing the substrate 120 may be formed at an edge portion of the substrate 120.

A fastening member 180 such as a screw may be fastened to the fastening hole. That is, the fastening holes of the heat dissipation structure 130 to be described later and the fastening holes of the heat sink 140 to be described later through the fastening holes of the substrate 120 may correspond to each other to form an integrated structure.

Here, since the fastening member 180 is fastened in contact with all of the heat dissipation structure 130, the substrate 120, and the heat sink 140, which will be described later, heat generated from the substrate 120 and the light source 110. It can also serve to distribute the to all of the above configuration.

Next, as described above, the heat emission pattern 122 is arranged in a mesh shape on the entire surface of each layer layer of the resin substrate 120, and the heat emission pattern 122 forms a mesh with a metal line. Provides a structure for quickly discharging heat generated from the 110 and the substrate 120 to the outside.

The heat dissipation pattern 122 may form a horizontal pattern 122a and a vertical pattern 122b in front of the substrate 120 and in front of each layer layer.

The horizontal pattern 122a and the vertical pattern 122b are preferably formed in a metal line shape, and preferably have a rectangular lattice shape formed to be orthogonal to each other.

Here, the vertical pattern 122b extends at right angles in a state connected to one side horizontal pattern 122a, and one side of the vertical pattern 122b is connected to the horizontal pattern 122a on one side and the horizontal pattern on the other side. It is preferable to arrange | position in the shape cut | disconnected with 122a.

In addition, the spacing of the cells formed by the horizontal pattern 122a and the vertical pattern 122b may be variously formed, but it is preferable to have an interval of 1 mm to 5 mm.

As described above, when the heat emission pattern 122 is applied to the resin substrate 120 in which heat generated on the front surface is hardly discharged to the rear, heat generated from the light source 110 and the substrate 120 It can provide a structure that can be discharged quickly. That is, the heat dissipation patterns 122 formed on the entire surface of each layer layer of the resin substrate 120 may have an effect of simultaneously discharging heat from various surfaces.

Next, the VIA holes 121 are formed in plural in the portion where the light source 110 is installed and are formed to intensively discharge heat generated from the light source 110. The VIA holes 121 are formed of the substrate 120. The light source 110 and the substrate 120 through the heat emission pattern 122 formed on each layer layer of the substrate 120 by being positioned so as to be connected to the heat emission patterns 122 formed on the front surface of each layer layer. It is easy to discharge the heat to the outside.

Here, the VIA hole 121 may be filled with a metal material to be connected to the heat dissipation patterns 122 of each layer layer in a grounded state. That is, the VIA hole 121 rapidly heats heat generated from the light source 110 and the front surface of the substrate 120 to the heat sink 140 to be described later behind the heat discharge pattern 122 and the substrate 120. Is released.

Meanwhile, as shown in FIG. 5, the VIA hole 121 may be formed in a circular shape, but various shapes, such as a triangle, a square, a rhombus, and a polygon, may be selectively formed.

In addition, as shown in FIG. 4, the VIA holes 121 of the substrate 120 may be formed in respective compartments of the heat dissipation pattern 122, and may be formed at intervals of one compartment.

Next, the heat dissipation structure 130 is preferably made of a metal capable of heat transfer in order to perform the role of the support for fixing the substrate 120 and the heat sink 140 and the function of heat dissipation.

The heat dissipation structure 130 as described above includes a fixing part 130a having a through hole formed therein so that the light source 110 can pass through the light source 110 to be exposed to the front, and a substrate from a lower end of the fixing part 130a. It is preferable that the support part 130b bent to the rear of the 120 to extend horizontally to the substrate 120 and the heat sink 140 to be described later to the installation surface is formed.

Here, the fixing part 130a may be disposed to have a distance in front of the substrate 120 while exposing the light irradiation part of the light source 110 through the front. In addition, by inserting the above-described fastening member 180 from the fastening hole of the fixing part 130a, the substrate 120 and the heat sink 140 to be described later may be integrally fixed to the rear of the fixing part 130a. .

On the other hand, the support portion 130b is formed to extend from one side of the fixing portion 130a to the rear of the substrate 120, by a fastening means (not shown) in the proper position of the chip mounter (component mounter) Can be fixed.

Since the fixing part 130a is fixed in close contact with the device, heat generated from the light source 110 and the substrate 120 may be transferred to the device, thereby maximizing cooling efficiency.

Next, the spacing member 150 is disposed between the substrate 120 and the heat dissipation structure 130 while surrounding the outside of the light source 110 to maintain the gap between the substrate 120 and the heat dissipation structure 130. The wind of the fan (not shown) which will be described later may be easily passed between the substrate 120 and the heat sink 140.

That is, the wind is easily passed between the respective light sources 110 to provide a structure in which heat of the substrate 120 and the light source 110 can be easily discharged to the outside.

The spacing member 150 is preferably a circular ring shape, but may also be manufactured as a polygonal ring. In addition, the spacing member 150 is preferably made of a metal that allows heat transfer for ease of heat transfer.

Next, the heat sink 140 is disposed at the rear of the substrate 120 to emit heat generated from the light source 110 and the substrate 120 to the outside, and is attached to the rear of the substrate 120. . The heat sink 140 may be fixed to the rear of the substrate 120 by the fastening member 180 described above.

Here, the size of the heat sink 140 is preferably smaller than the width of the substrate 120. This is to allow the wind to easily escape to the rear when the wind of the fan (not shown) is blown from the front of the substrate 120.

Next, the fan (not shown) is installed to discharge heat generated from the light source 110 and the substrate 120 to the outside, and serves to blow or suck air through a propeller rotating by a motor. The fan may be installed at the rear of the heat sink 140 or in the vicinity of the component recognition apparatus 100 of the present invention.

Meanwhile, after the heat transfer material is applied to the rear of the substrate 120, the heat dissipation member 160 may be further attached to the rear of the substrate 120 to which the heat transfer material is applied. Here, it is preferable to use a heat radiation compound (not shown) or grease (not shown) as the heat transfer material.

In addition, as shown in FIG. 6, a heat transfer terminal pad (thermal pad) (not shown) or a heat transfer metal mesh 170 may be attached to the heat dissipation member 160.

In addition, as shown in FIG. 7, a tube 170 may be arranged between the substrate 120 and the heat sink 140 to circulate the refrigerant gas to release heat.

Here, the tube 170 may be provided with a separate circulation motor (not shown) for circulating the refrigerant gas. In addition, it is preferable to use a commonly used freon gas (freon gas) as the refrigerant gas.

Therefore, heat generated from the light source 110 may be discharged through the contact surface of the heat dissipation structure 130 and transferred to the support 130b of the heat dissipation structure 130 to be discharged through the attachment surface. In addition, the gap between the substrate 120 and the heat dissipation structure 130 is maintained by the spacer 150 surrounding the light source 110 to allow the wind to pass between the respective light sources 110, the light source 110 The heat can be rapidly released to the heat sink 140 through the VIA hole 121 portion of the substrate 120, which is excellent in cooling effect.

As a result, by having a structure that maximizes the cooling efficiency of the light source 110, a uniform amount of light may be secured to maintain accuracy of component recognition. In addition, since the structure is simple while maximizing the cooling efficiency of the light source 110, the manufacturing cost can be reduced and miniaturization is possible.

Although the technical idea of the cooling structure of the component recognition device of the present invention has been described with the accompanying drawings, this is illustrative of the best embodiment of the present invention and is not intended to limit the present invention.

Accordingly, it is a matter of course that various modifications and variations of the present invention are possible without departing from the scope of the present invention. And are included in the technical scope of the present invention.

1 is a view showing a conventional component recognition device for a chip mounter.

Figure 2 is an exploded perspective view of the cooling structure of the component recognition device according to the present invention.

Figure 3 is a side cross-sectional view showing a coupling state according to FIG.

4 is a view showing a heat emission pattern of the substrate according to FIG.

5 is a view showing a VIA hole shape of the substrate according to FIG.

Figure 6 is an exploded perspective view showing a state having a heat dissipation member in the rear of the substrate of the component recognition apparatus according to the present invention.

Figure 7 is an exploded perspective view showing a state in which a tube for circulating the heat transfer medium in the rear of the substrate of the component recognition apparatus according to the present invention.

Description of the Related Art

100: part recognition device 110: light source

120: substrate 121: VIA hole

122: heat discharge pattern 122a: horizontal pattern

122b: vertical pattern 130: heat dissipation structure

130a: fixed part 130b: support part

140: heat sink 150: space member

160: heat radiation member 170: tube

180: fastening member

Claims (17)

A substrate in which a plurality of VIA holes are concentrated in at least one light source installation portion; A heat dissipation structure disposed to have a distance in front of the substrate while exposing the light irradiation part of the light source forward; And And a heat sink disposed at the rear of the substrate to release heat. The substrate is a cooling structure of the component recognition device, characterized in that the heat discharge pattern consisting of a metal line in a mesh shape on the front surface. Claim 2 has been abandoned due to the setting registration fee. The method of claim 1, Cooling structure of the component recognition device comprising a fan for blowing or sucking air to release heat of the light source and the substrate. The method according to claim 1 or 2, And a ring-shaped spacer disposed around the outside of the light source to allow air to pass between the light sources between the substrate and the heat sink. Claim 4 has been abandoned due to the setting registration fee. The method of claim 3, The spacing member is a cooling structure of the component recognition device, characterized in that using a heat transfer metal. delete The method of claim 1, When the substrate is a resin substrate having a plurality of layer layers, the heat dissipation pattern is formed on the entire surface of each layer layer of the substrate, the cooling structure of the component recognition device. Claim 7 has been abandoned due to the setting registration fee. The method according to claim 6, The heat dissipation pattern is a cooling structure of a component recognition device, characterized in that the horizontal grid pattern and the vertical pattern is a rectangular grid shape. Claim 8 was abandoned when the registration fee was paid. The method of claim 7, wherein The heat dissipation pattern is a cooling structure of the component recognition device, characterized in that the spacing of each compartment is 1mm ~ 5mm. Claim 9 has been abandoned due to the setting registration fee. 9. The method of claim 8, The VIA hole of the substrate is provided in each compartment of the heat discharge pattern, the cooling structure of the component recognition device, characterized in that formed at intervals of one compartment. Claim 10 has been abandoned due to the setting registration fee. The method of claim 1, The VIA hole is a cooling structure of the component recognition device, characterized in that selectively forming any one of a circle, a triangle, a square, a rhombus, a polygon. The method of claim 1, And a heat dissipation member for applying heat transfer material to the rear of the substrate and then transferring heat to the heat sink and the heat sink. Claim 12 is abandoned in setting registration fee. 12. The method of claim 11, The heat dissipation member is a cooling structure of the component recognition device, characterized in that using a thermal pad (thermal pad) for heat transfer. Claim 13 has been abandoned due to the set registration fee. 12. The method of claim 11, The heat dissipation member is a cooling structure of a component recognition device, characterized in that using a metal mesh for heat transfer. The method of claim 1, The heat dissipation structure may include a fixing part for fixing the light source to be exposed to the front, and a supporting part for horizontally extending from the lower end of the fixing part to the rear side of the substrate to be fixed to the installation surface. Cooling structure. Claim 15 is abandoned in the setting registration fee payment. The method of claim 14, The heat dissipation structure is a cooling structure of the component recognition device, characterized in that the heat transfer metal for releasing the heat of the light source. The method of claim 1, Cooling structure of the component recognition device between the substrate and the heat sink to arrange a tube for releasing heat by circulating the refrigerant gas. Claim 17 has been abandoned due to the setting registration fee. 17. The method of claim 16, The refrigerant gas is a cooling structure of the component recognition device using a freon gas.

Images