KR101329813B1 - Probe sheet, probe card and method of manufacturing the same - Google Patents

Abstract

Disclosed are a probe sheet, a probe card comprising the same, and a method of manufacturing the same. The probe sheet according to one embodiment includes an elastic base and a plurality of conductive balls. The elastic base has a first face and a second face opposite the first face. The plurality of conductive balls are exposed to the first region defined in the first surface and the second region defined in the second surface, and are arranged to electrically connect the first region and the second region. Therefore, the electrical characteristics can be measured more accurately even at fine pitch, and interference can be reduced and manufacturing cost can be reduced.

Description

PROBE SHEET, PROBE CARD AND METHOD OF MANUFACTURING THE SAME}

1 is a schematic cross-sectional view of a probe sheet according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of a probe card including the probe sheet shown in FIG. 1.

3 is a cross-sectional view of the probe card shown in FIG. 2.

4 is a schematic cross-sectional view of a semiconductor inspection apparatus including the probe card of FIG. 3.

5A to 5H are cross-sectional views showing a method for manufacturing a probe sheet according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

100: probe sheet 101: space transducer

110: base substrate 110a: first surface of base substrate

110b: second surface of base substrate 111: first substrate

112: second substrate 113: first terminal

114: second terminal 115: pressure pad

115a: conductive film 116: first vertical connection pattern

117: horizontal connection pattern 118: second vertical connection pattern

119: connection pattern 120: contact terminal

121: elastic base 121a: first surface of the elastic base

121b: second surface of elastic base 122: conductive ball

200: probe card 210: interposer

220: printed circuit board 400: semiconductor inspection device

410: test module 420: support

500: sacrificial substrate 501: fixing frame

510: first photoresist pattern 510a: first photoresist film

520: second photoresist film

The present invention relates to a probe sheet, a probe card including the same, and a method for manufacturing the same, and more particularly, to a probe sheet, a probe card including the same, and a method for manufacturing the same.

In general, semiconductor chips are manufactured through an oxidation process, a diffusion process, an ion implantation process, an etching process, and a metal process. The semiconductor chip thus manufactured is sorted as normal or abnormal through an electrical die sorting (EDS) process, and the semiconductor chip determined as abnormal is subjected to a repair process, and only the chip determined as normal is sliced and packaged. )do.

In this case, the EDS applies an electrical signal by contacting an electrical contact agent such as a probe card with a pad of the chip, and detects a response electrical signal corresponding to the applied electrical signal, thereby determining whether the semiconductor chip is normal or abnormal. To judge.

However, as semiconductor technology advances, terminal pitches of semiconductor chips become smaller and smaller, making it difficult to apply a conventional probe needle, and when the length of the probe pin becomes long, it is not possible to measure accurate electrical characteristics. Has occurred.

In order to solve this problem, although a MEMS type probe card has been developed, interference problems may occur as the pitch interval between the micro probes is narrowed, and manufacturing costs may increase.

In addition, in the case of using a conventional probe needle or a 3D MEMS type probe, when a tip portion is pointed to pressurize the wafer, a problem occurs that damages the terminal formed on the semiconductor chip of the wafer.

Such probe needles or 3D MEMS type probes can also be used for packaged semiconductor chips. In a BGA (Ball Grid Array) type package, when using conventional probe needles or 3D MEMS type probes, the tip portion is sharp. When pressure is applied to contact the BGA type solder ball, a problem occurs in the solder ball.

The technical problem to be solved by the present invention is to provide a probe sheet that can more accurately measure the electrical properties even in fine pitch, to mitigate interference and reduce the manufacturing cost.

Another technical problem to be achieved by the present invention is to provide a probe card comprising such a probe sheet.

Another technical problem to be achieved by the present invention is to provide a method for manufacturing such a probe sheet.

The probe sheet according to the embodiment of the present invention includes a space converter and a contact terminal. The space converter includes a base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, and a second surface formed on the second surface of the base substrate. It includes a terminal and a conductive pattern for electrically connecting the first terminal and the second terminal. The contact terminal includes a plurality of conductive balls arranged in the normal direction of the first terminal so as to be electrically connected to the first terminal, and an elastic base for fixing the conductive balls.

For example, the spacing between the second terminals is wider than the spacing between the first terminals.

For example, the probe sheet may further include a pressing pad disposed between the first terminal and the conductive ball.

For example, the base substrate may include a first substrate including the first terminal and a second substrate in contact with the first substrate and including the second terminal.

For example, the conductive pattern may include a first vertical connection pattern, a horizontal connection pattern, and a second vertical connection pattern. The first vertical connection pattern is connected to the first terminal and passes through the first substrate. The horizontal connection pattern is connected to the first vertical connection pattern and is formed on a surface of the first substrate facing the surface connected to the first terminal. The second vertical connection pattern penetrates the second substrate to connect the second terminal and the horizontal connection pattern.

A probe card according to an embodiment of the present invention includes a probe sheet, a printed circuit board, and an interposer. The probe sheet includes a space converter and a contact terminal. The space converter includes a base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, and a second surface formed on the second surface of the base substrate. It includes a terminal and a conductive pattern for electrically connecting the first terminal and the second terminal. The contact terminal includes a plurality of conductive balls arranged in the normal direction of the first terminal so as to be electrically connected to the first terminal, and an elastic base for fixing the conductive balls. The printed circuit board is disposed to face the probe sheet. The interposer is disposed between the probe sheet and the printed circuit board to electrically connect the probe sheet and the printed circuit board.

According to the method for manufacturing a probe sheet according to an embodiment of the present invention, a contact terminal including a plurality of conductive balls arranged in a line and an elastic base fixing the conductive balls is manufactured. Next, a base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, and a second terminal formed on the second surface of the base substrate. And a conductive pattern electrically connecting the first terminal and the second terminal. Thereafter, the contact terminal is attached to the first terminal.

The probe sheet may be manufactured through the following process. First, the conductive ball is aligned with the fixing frame on the top of the sacrificial substrate, and an elastic fluid is applied to the inside of the fixing frame in which the conductive ball is aligned. Thereafter, after curing the elastic fluid to form the elastic base, the elastic base is separated from the fixing frame and the sacrificial substrate.

The spatial transducer can be through the following process. A first vertical connection pattern electrically connected to the first terminal and the first terminal is formed on the first substrate. A horizontal connection pattern is electrically connected to the first vertical connection pattern. A second terminal having a wider pitch than the first terminal and a second vertical connection pattern electrically coupled to the second terminal are formed on the second substrate. Thereafter, the first substrate and the second substrate are combined to electrically connect the horizontal connection pattern and the second vertical connection pattern.

On the contrary, a first vertical connection pattern electrically coupled to the first terminal and the first terminal is formed on the first substrate. A second terminal having a wider pitch than the first terminal and a second vertical connection pattern electrically coupled to the second terminal are formed on the second substrate. A horizontal connection pattern is electrically connected to the second vertical connection pattern. Thereafter, the first substrate and the second substrate are combined to electrically connect the horizontal connection pattern and the first vertical connection pattern.

According to the probe sheet manufacturing method, the probe sheet may further form a pressing pad formed on the first terminal so as to be disposed between the first terminal and the conductive ball.

Such a pressure pad may be formed through the following process. A conductive film is formed on the first surface of the space transformer. A first photoresist film is formed on the conductive film. The first photoresist film is patterned. Thereafter, the conductive film is patterned using the first photoresist film.

Before patterning the conductive film, a second photoresist film may be further formed on the second surface of the space converter in order to protect the second terminal. The second photoresist layer may remove the second photoresist layer after patterning the conductive layer.

According to the method of manufacturing the probe sheet, an interposer is additionally disposed on the second surface of the space converter, and a printed circuit board is coupled to the space converter so that the interposer is electrically connected to the second terminal of the space converter. You can.

According to the present invention, it is possible to cope with ultrafine pitches and to improve electrical characteristics.

Advantages and features of the present invention, and methods of achieving the same will be apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but different from each other. It may be implemented in various forms, only this embodiment is provided to complete the disclosure of the present invention, to fully inform the scope of the invention to those skilled in the art to which the present invention pertains, The invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms herein include plural forms unless the context clearly dictates otherwise. As used herein, expressions of including, and / or comprising, or the like may refer to one or more other components, steps, operations, and / or components mentioned, components, steps, operations and / or elements. Or does not exclude the presence or addition of a device. In addition, the term 'up', 'up', 'upper' or 'down', 'lower' in this specification includes a case where another component is interposed therebetween. In addition, as used herein, "overlapping" indicates a shape in which the lower structure and the upper structure have a common center and overlap each other, and includes a case where another structure is interposed between the lower structure and the upper structure, and the upper structure and the lower structure. Either structure is meant to completely overlap the other structure. Also, unless otherwise defined for terms used herein, all terms used (including technical and scientific terms) are conventional in the art. It may be used in a sense that is common to those who have a knowledge of the world.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a probe sheet according to an embodiment of the present invention.

Referring to FIG. 1, a probe sheet 100 according to an embodiment of the present invention includes a space transformer 101 and a contact terminal 120.

The contact terminal 120 includes an elastic base 121 and a conductive ball 122. The elastic base 121 has elasticity. The elastic base 121 fixes the conductive balls 122 arranged in a line. The conductive ball 122 has a size of approximately several micrometers. The size of the conductive ball 122 may vary depending on the pitch between terminals of the semiconductor chip to be measured. In other words, if the pitch between terminals of the semiconductor chip is small, the diameter of the conductive ball 122 is also made small. If the pitch between terminals of the semiconductor chip is large, the diameter of the conductive ball 122 is also made large. At least one conductive ball line formed by arranging the conductive balls 122 is preferably arranged.

The space converter 101 includes a base substrate 110, a first terminal 113, a second terminal 114, and a connection pattern 119.

The base substrate 110 includes, for example, a ceramic. The first surface 110a is in contact with the second surface 121b of the elastic base 121, and the second surface 110b is opposite to the first surface 110a.

The first terminal 113 is formed on the first surface 110a, and the second terminal 114 is formed on the second surface 110b. The spacing between the second terminals 114 is wider than the spacing between the first terminals 9113. The first terminal 113 and the second terminal 114 may include, for example, gold (Au) having excellent conductivity. The connection pattern 119 electrically connects the first terminal 113 and the second terminal 114.

As such, the base substrate 110 is, for example, the first substrate 111 and the second substrate 112 in order to make the distance between the second terminals 114 larger than the distance between the first terminals 113. It may be formed in a multi-layer structure including a. By way of example only two layers are shown, but may be formed of three or more layers.

The connection pattern 119 includes a first vertical connection pattern 116, a horizontal connection pattern 117, and a second vertical connection pattern 118.

The first vertical connection pattern 116 is electrically connected to the first terminal 113 formed on the first substrate 111 and is formed to vertically penetrate the first substrate 111. The second vertical connection pattern 118 is electrically connected to the second terminal 114 formed under the second substrate 112 and is formed to vertically penetrate the second substrate 112. The horizontal connection pattern 117 is formed between the first substrate 111 and the second substrate 112 to electrically connect the first vertical connection pattern 116 and the second vertical connection pattern 118. do.

The space converter 101 having such a structure increases the pitch between the first regions (or the first terminals 113) to the pitch between the second regions (or the second terminals 114). Let's do it. That is, the pitch between the first regions electrically connected with the terminals formed on the semiconductor chip on the actual wafer is very small. Thus, the space transducer 100 increases the pitch between the pads to allow for easier inspection.

The pressure pad 115 may be formed on the first terminal 113. The pressure pad 115 protrudes from the first terminal 113 so that when the elastic base 121 is attached to the space converter 101, the conductive balls 122 are pressed to form the conductive balls 122. It protrudes based on the first surface 121a of the elastic base 121. As such, when the conductive balls 122 protrude relative to the first surface 121a of the elastic base 121, the stability of electrical connection with the semiconductor chip is increased.

When the first terminal 113 protrudes to a sufficient height from the first surface 110a of the base substrate 110, the pressing pad 115 may be omitted.

FIG. 2 is a schematic plan view of a probe card including the probe sheet shown in FIG. 1, and FIG. 3 is a cross-sectional view of the probe card shown in FIG.

2 and 3, the probe card 200 according to an embodiment of the present invention includes a probe sheet 100, an interposer 210, and a printed circuit board 220. The probe sheet 100 is substantially the same as the probe sheet 100 illustrated in FIG. 1. Therefore, further description is omitted.

The printed circuit board 220 is disposed to face the probe sheet 100, and the interposer 210 is disposed between the probe sheet 100 and the printed circuit board 220 so that the probe sheet ( 100) and the printed circuit board 220 is electrically connected.

The interposer 210 may be formed of, for example, a pogo block including a plurality of pogo pins. The interposer 210 may be in electrical contact with the probe sheet 100 and the printed circuit board 220 even when the heights of the terminals of the probe sheet 100 and the printed circuit board 220 are not constant. To improve the reliability.

4 is a schematic cross-sectional view of a semiconductor inspection apparatus including the probe card of FIG. 3.

Referring to FIG. 4, the semiconductor inspection apparatus 400 according to the exemplary embodiment includes a probe card 200, a test module 410, and a support 420. The probe card 200 is substantially the same as the probe card 200 described with reference to FIGS. 2 and 3. Therefore, further description is omitted.

The test module 410 is electrically connected to the probe card 200. The test module 410 applies a first signal to a semiconductor chip (not shown) in contact with the probe card 200 through the probe card 200.

The semiconductor chip generates a second signal in response to the first signal, and the second signal is applied to the test module 410 through the probe card 200.

The test module 410 determines whether the semiconductor chip is defective by using the second signal.

The support 420 supports the test module 410 and the probe card 200.

Although not shown, the semiconductor inspection apparatus 400 may further include a transfer robot and a controller for transferring the semiconductor wafer to the probe card 200.

5A to 5H are cross-sectional views showing a method for manufacturing a probe sheet according to the present invention.

1 and 5A, conductive balls 122 are disposed on the sacrificial substrate 500 on which the fixing frame 501 is disposed to form conductive ball lines. The conductive ball 122 may include, for example, a metal having good conductivity. The fixing frame 501 and the sacrificial substrate 500 may be formed integrally or separately. When the fixing frame 501 and the sacrificial substrate 500 are integrally formed, the fixing frame 501 may be made of an elastic material.

Referring to FIG. 5B, after the elastic fluid is applied to the inside of the fixing frame 501 in which the conductive balls 122 are disposed, the elastic fluid is hardened.

Referring to FIG. 5C, after the elastic material fluid is hardened to form the elastic base 121, the elastic base 121 is separated from the fixing frame 501 and the sacrificial substrate 500. Preferably, a planarization process is performed to planarize the first surface 121a and the second surface 121b of the elastic base 121. For example, the first surface 121a and the second surface 121b of the elastic base 121 may be ground.

Referring to FIG. 5D, a second vertical connection pattern 118 penetrating through the second substrate 112 is formed, and is electrically connected to the second vertical connection pattern 118 on one surface of the second substrate 112. The connected horizontal connection patterns 117 are formed, and the second terminal 114 is formed on the second surface of the second substrate 112. The second vertical connection pattern 118, the horizontal connection pattern 117, and the second terminal 114 may be formed in any order. The second substrate 112 may include, for example, a ceramic.

Referring to FIG. 5E, a first substrate 111 including a first terminal 113 and a first horizontal connection pattern 116 electrically connected to the first terminal is formed. Thereafter, the first substrate 111 is attached to the first surface of the second substrate 112 so that the first horizontal connection pattern 116 is electrically connected to the horizontal connection pattern 117.

In FIGS. 5D and 5E, the horizontal connection pattern 117 is formed on the surface of the second substrate 112 to be coupled to the first substrate 111. However, the horizontal connection pattern 117 is illustrated in FIG. It may be formed on the first substrate 111 and electrically coupled to the second horizontal connection pattern 118 of the second substrate 112.

Thereafter, a planarization process may be performed to planarize the surfaces of the first surface 110a and the second surface 110b of the base substrate 110. For example, the first surface 121a and the second surface 121b of the base substrate 110 may be ground. Meanwhile, the planarization process may be performed before the first substrate 111 and the second substrate 112 are bonded to each other.

Referring to FIG. 5F, a conductive film 115a is formed on the first surface 110a of the base substrate 110. Thereafter, a first photoresist film 510a is formed on the conductive film 115a. Optionally, a second photoresist film 520 may be formed on the second surface 110b of the base substrate 110.

Referring to FIG. 5G, the first photoresist film 510a is patterned by, for example, a photolithography process to form a first photoresist pattern 510, and the first photolithography pattern. Using the 510 as a mask, the pressure pad 115 is formed by patterning the conductive film 115a shown in FIG. 5F. The second photoresist layer 520 protects the second terminal 114 when the conductive layer 115a is patterned.

Thereafter, the first photoresist pattern 510 and the second photoresist layer 520 are removed.

Referring to FIG. 5H, the output shown in FIG. 5C and the output of FIG. 5F are combined. At this time, the pressing pad 115 presses the conductive ball 122 to protrude upward, thereby improving reliability of electrical contact when the wafer contacts the semiconductor chip.

According to the present invention, it is possible to improve the reliability of the contact method of the probe pin, which is unstable in the contact method of the probe pin, and can be applied to an ultra-fine pitch semiconductor wafer that cannot be measured by the probe pin method.

These embodiments of the present invention are merely for illustrating the present invention, but the present invention is not limited thereto.

As described in detail above, the probe sheet and the probe card according to the present invention improve the reliability of the contact method of the probe pin which was unstable in the conventional contact method of the probe pin (Probe needle), it is impossible to measure by the probe pin method It can be applied to ultra-fine pitch semiconductor wafers.

In addition, interference problems that may occur in the probe card manufactured by the MEMS method can be alleviated, and the manufacturing process can be simplified to reduce the manufacturing cost, and can be easily applied to a large area inspection card.

Further, the probe card according to the present invention does not damage the terminals formed on the semiconductor chip of the wafer even when pressure is applied to the wafer.

Moreover, when the probe sheet formed in the present invention is used in a BGA package, cracks do not occur in the solder balls of the BGA package.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (13)

A base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, a second terminal formed on the second surface of the base substrate, and the first substrate; A space converter including a conductive pattern electrically connecting one terminal to the second terminal; A contact terminal including a plurality of conductive balls arranged in a normal direction of the first terminal to be electrically connected to the first terminal, and an elastic base for fixing the conductive balls; And A pressure pad disposed between the first terminal and the conductive ball; Probe sheet comprising a. The probe sheet of claim 1, wherein a spacing between the second terminals is wider than a spacing between the first terminals. delete The method of claim 1, wherein the base substrate A first substrate including the first terminal and And a second substrate in contact with the first substrate and including the second terminal. The method of claim 4, wherein the conductive pattern is A first vertical connection pattern connected to the first terminal and penetrating the first substrate; A horizontal connection pattern connected to the first vertical connection pattern and formed on a surface of the first substrate facing the surface connected to the first terminal; And a second vertical connection pattern penetrating the second substrate to connect the second terminal and the horizontal connection pattern. Probe sheet A printed circuit board disposed to face the probe sheet; An interposer disposed between the probe sheet and the printed circuit board to electrically connect the probe sheet and the printed circuit board, The probe sheet is A base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, a second terminal formed on the second surface of the base substrate, and the first substrate; A space converter including a conductive pattern electrically connecting one terminal to the second terminal; A contact terminal including a plurality of conductive balls arranged in a normal direction of the first terminal to be electrically connected to the first terminal, and an elastic base for fixing the conductive balls; And A pressure pad disposed between the first terminal and the conductive ball; Probe card comprising a. Manufacturing a contact terminal including a plurality of conductive balls arranged in a row and an elastic base fixing the conductive balls A base substrate including a first surface and a second surface facing the first surface, a first terminal formed on the first surface of the base substrate, a second terminal formed on the second surface of the base substrate, and the first substrate Manufacturing a space converter including a conductive pattern electrically connecting the first terminal and the second terminal; And attaching the contact terminal to the first terminal. The method of claim 7, wherein the manufacturing of the contact terminal Aligning the conductive ball with the fixing frame on the upper part of the sacrificial substrate Applying an elastic material fluid to the fixing frame in which the conductive balls are aligned Curing the elastic fluid to form the elastic base; and And separating the elastic base from the fixing frame and the sacrificial substrate. The method of claim 8, further comprising planarizing a first surface of the contact terminal separated from the sacrificial substrate and a second surface opposite to the first surface. The method of claim 7, further comprising forming a pressing pad formed on the first terminal to be disposed between the first terminal and the conductive ball. The method of claim 10, wherein the forming of the pressure pad Forming a conductive film on the first surface of the spatial transducer Forming a first photoresist film on the conductive film Patterning the first photoresist film And patterning the conductive film using the first photoresist film. 12. The method of claim 11, further comprising forming a second photoresist film on the second surface of the space converter to protect the second terminal before patterning the conductive film. . The method of claim 12, further comprising removing the second photoresist film after patterning the conductive film.

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