KR101328940B1 - 냉각 장치 - Google Patents
냉각 장치 Download PDFInfo
- Publication number
- KR101328940B1 KR101328940B1 KR1020070014309A KR20070014309A KR101328940B1 KR 101328940 B1 KR101328940 B1 KR 101328940B1 KR 1020070014309 A KR1020070014309 A KR 1020070014309A KR 20070014309 A KR20070014309 A KR 20070014309A KR 101328940 B1 KR101328940 B1 KR 101328940B1
- Authority
- KR
- South Korea
- Prior art keywords
- guide holder
- heat dissipation
- heating element
- cooling
- heat
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
- 발열체와 접촉하는 방열부;상기 발열체와 상기 방열부를 둘러싸는 가이드 홀더; 및상기 가이드 홀더와 함께 상기 방열부와 상기 발열체를 밀착시키는 가압부를 포함하고,상기 가압부는상기 가이드 홀더를 관통하는 스크류와,상기 가이드홀더와 함께 상기 방열부와 발열체를 밀착시키는 가압판을 포함하며,상기 가압판은 외부공기가 내부로 유입할 수 있는 덕트 형상인 것을 특징으로 하는 냉각 장치.
- 제 1 항에 있어서,상기 가이드 홀더에는 상기 방열부로 공기가 유동할 수 있도록 서로 마주보는 위치에 개구부가 형성된 것을 특징으로 하는 냉각 장치.
- 제 2 항에 있어서상기 개구부 중에 적어도 하나에는 공기의 유동을 일으키는 냉각 팬이 더 구비된 것을 특징으로 하는 냉각 장치.
- 제 1 항에 있어서,상기 가이드 홀더에는 상기 발열체가 외부의 장치로 연결될 수 있도록 개구부가 형성된 것을 특징으로 하는 냉각 장치.
- 제 1 항에 있어서,상기 방열부는 발열체와 밀착되는 플레이트;와상기 플레이트에 형성된 다수개의 냉각 핀;을 포함하여 구성된 것을 특징으로 하는 냉각 장치.
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070014309A KR101328940B1 (ko) | 2007-02-12 | 2007-02-12 | 냉각 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070014309A KR101328940B1 (ko) | 2007-02-12 | 2007-02-12 | 냉각 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080075320A KR20080075320A (ko) | 2008-08-18 |
KR101328940B1 true KR101328940B1 (ko) | 2013-11-14 |
Family
ID=39878991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070014309A KR101328940B1 (ko) | 2007-02-12 | 2007-02-12 | 냉각 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101328940B1 (ko) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950000294B1 (ko) * | 1989-06-02 | 1995-01-12 | 삼성전기 주식회사 | 발열부품의 방열장치 |
KR200241148Y1 (ko) * | 2001-04-27 | 2001-10-12 | 천기완 | 반도체 칩의 냉각기 안전 밀착장치 |
KR100411430B1 (ko) | 2002-01-08 | 2003-12-24 | 엘지전자 주식회사 | 집적 회로 냉각 장치 |
KR100640067B1 (ko) * | 2000-05-02 | 2006-10-31 | 한라공조주식회사 | 컨트롤 박스의 스위칭 회로 냉각장치 |
-
2007
- 2007-02-12 KR KR1020070014309A patent/KR101328940B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950000294B1 (ko) * | 1989-06-02 | 1995-01-12 | 삼성전기 주식회사 | 발열부품의 방열장치 |
KR100640067B1 (ko) * | 2000-05-02 | 2006-10-31 | 한라공조주식회사 | 컨트롤 박스의 스위칭 회로 냉각장치 |
KR200241148Y1 (ko) * | 2001-04-27 | 2001-10-12 | 천기완 | 반도체 칩의 냉각기 안전 밀착장치 |
KR100411430B1 (ko) | 2002-01-08 | 2003-12-24 | 엘지전자 주식회사 | 집적 회로 냉각 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20080075320A (ko) | 2008-08-18 |
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