KR101308429B1 - Apparatus and mthod for fabrication of liquid crystal display device - Google Patents

Abstract

The present invention relates to a liquid crystal display device manufacturing apparatus and a manufacturing method for preventing the adhesion failure due to inflow of bubbles when the two substrates are bonded, the manufacturing apparatus of the liquid crystal display device according to the present invention, the first, second substrate And a lowering chamber for adhering and adhering the first and second substrates, and a lower and upper stages for adhering the first and second substrates, and installed on the upper stages to adsorb the second substrate to be fixed to the upper stages when loading. A plurality of adsorption pins for applying pressure to the substrate fixed to the upper stage during adhesion, and a plurality of adsorption pins for applying pressure to the second substrate during the loading; 2 is provided with a buffer member for adjusting the pressure of the plurality of suction pins to apply a predetermined pressure to the substrate. According to this configuration, the present invention not only adsorbs the second substrate to the upper stage by using a plurality of adsorption pins, but also attaches the second substrate from the upper stage by applying a predetermined pressure to the second substrate adsorbed to the upper stage when the bonding is performed. Since the first and second substrates are spaced apart to be sealed by the material, N2 gas may be introduced between the two substrates during the bonding process, thereby preventing the failure of the bonding.

Liquid crystal, dripping, adhesion chamber, adsorption pin, bubble

Description

Manufacturing apparatus and method for manufacturing a liquid crystal display device {APPARATUS AND MTHOD FOR FABRICATION OF LIQUID CRYSTAL DISPLAY DEVICE}

1 is a configuration diagram showing an initial state of a substrate bonding apparatus for a liquid crystal display device manufacturing process previously filed by the present applicant.

2 is a plan view of a state in which the loader mentioned in Patent Application 2003 95427 filed by the present applicant adsorbs a substrate.

3 is a cross-sectional view taken along line II ′ of FIG. 2.

4 is a schematic cross-sectional structural view of the upper stage of the cementation apparatus referred to in patent application 2003 95427 filed by the present applicant.

5a to 5d are cross-sectional views of the loader and upper stage showing the substrate loading method mentioned in patent application 2003 95427 filed by the applicant.

6 is a diagram illustrating an apparatus for manufacturing a liquid crystal display according to an exemplary embodiment of the present invention.

7A and 7E are steps of a manufacturing method of a liquid crystal display according to an exemplary embodiment of the present invention.

Description of the Related Art [0002]

1101: real 1102: liquid crystal

1103: first substrate 1104: lower stage

1112 through-hole 1122 adsorption pin

1124: buffer member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to an apparatus and a manufacturing method of a liquid crystal display device which can prevent a poor adhesion due to inflow of bubbles when two substrates are bonded.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, the key to development is how much high-quality images such as high definition, high brightness and large area can be realized while maintaining the features of light weight, thinness and low power consumption It can be said that it is hanging.

Such a liquid crystal display may be classified into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel includes first and second substrates bonded to each other with a predetermined space; And a liquid crystal layer injected between the first and second substrates.

The first substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, A plurality of thin film transistors which are switched by a plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing gate lines and data lines and signals of the gate lines to transfer the signals of the data lines to the pixel electrodes. Is formed.

The second substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G, B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.

At this time, in the liquid crystal injection method, the liquid crystal is injected between the two substrates by osmotic pressure when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material. When the liquid crystal is injected in this manner, the liquid crystal injection hole is sealed with the sealing material.

However, in such a method of manufacturing a liquid crystal display liquid crystal display device, since the liquid crystal is injected into the liquid crystal liquid by cutting the unit panel in a vacuum state between the two substrates and then injecting the liquid crystal, it takes a lot of time for the liquid crystal injection. When the liquid crystal display device having a large area is lowered and the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Accordingly, the present applicant has previously filed a bonding apparatus for dropping an appropriate amount of liquid crystal onto each liquid crystal panel region before bonding the two substrates and then bonding the two substrates together.

 That is, the present applicant has previously filed a bonding device in which a vacuum chamber is formed without a vacuum chamber being formed separately and the upper chamber unit and the lower chamber unit are contacted, and the vacuum chamber is made when the upper chamber chamber is contacted (Korean Patent Application No. 10-2002). -071227). Therefore, since the present invention can also be applied to the same apparatus as described above, briefly explaining the bonding apparatus as follows.

1 is a block diagram showing an initial state of a substrate bonding apparatus (Korean Patent Application No. 10-2002-071227) for a liquid crystal display device manufacturing process previously filed by the present applicant.

As can be seen from this, the bonding apparatus is largely the base frame 100, the upper chamber unit 210 and the lower chamber unit 220, the chamber moving means (310, 320, 330, 340, 350), the upper stage 230 and the lower stage 240, sealing means, a pair of low vacuum chamber units 410, 420, alignment means 510, 520, 530, vacuum pumping means 610, support means 710, and photocuring means. It is composed.

The base frame 100 forms the exterior of the bonding apparatus in a state of being fixed to the ground, and serves to support other components.

In addition, the upper chamber unit 210 and the lower chamber unit 220 are mounted on the upper and lower ends of the base frame 100, respectively, and are coupled to each other.

The upper chamber unit 210 is tightly fixed to the upper base 211 exposed to the external environment and the bottom surface of the upper base 211, the inside of the upper chamber plate made of a rectangular frame having an arbitrary space 212 is configured.

In this case, an upper stage 230 is provided in an arbitrary space formed in the upper chamber plate 212, and the upper stage 230 is mounted to interlock with the upper chamber unit 210.

In addition, a seal member (hereinafter referred to as a “first seal member”) 213 is provided between the upper base 211 and the upper chamber plate 212 constituting the upper chamber unit 210 to provide the upper chamber plate. Between the inner space and the outer space of 212 is blocked.

In addition, the lower chamber unit 220 is mounted on the lower base 221 fixed to the base frame 100 and on the upper surface of the lower base 221 so as to be movable in the front, rear, left and right directions, and the inside thereof. Is configured to include a lower chamber plate 222 made of a rectangular frame having any space.

In this case, a lower stage 240 is provided in an arbitrary space formed in the lower chamber plate 222, and the lower stage 240 is fixed to an upper surface of the lower base 221.

In addition, a seal member (hereinafter referred to as a “second seal member”) 224 is provided between the lower base 221 constituting the lower chamber unit 220 and the lower chamber plate 222 to provide the second seal. The space between the space provided with the lower stage 240 inside the lower chamber plate 222 and the outer side of the member 224 is blocked.

In addition, at least one support part 225 is provided between the lower base 221 and the lower chamber plate 222 so that the lower chamber plate 222 is spaced apart from the lower base 221 by a predetermined interval. Support to maintain

At this time, one end of the support part 225 is fixed to the bottom of the lower chamber plate 222, and the other end thereof is free to flow in a horizontal direction from a part fixed to the bottom of the lower base 221. Is mounted. The support unit 225 allows the lower chamber plate 222 to be freed from the lower base 221 so that the lower chamber plate 222 can be moved back and forth and left and right.

The first seal member 213 and the second seal member 224 are formed of a sealing material such as a gasket or an O-ring.

In addition, the chamber moving means is erected in a direction perpendicular to the drive motor 310 fixed to the base frame 100, the drive shaft 320 axially coupled to the drive motor 310, and the drive shaft 320. The connecting shaft 330 connected to receive the driving force from the drive shaft 320 as a state, the connecting portion 340 for connecting the drive shaft 320 and the connecting shaft 330, and the end of the connecting shaft 330 It is configured to include a mounted jockey 350.

At this time, the drive motor 310 is located in the inner bottom of the base frame 100 is composed of a biaxial motor protruding the axis in a direction parallel to the ground.

In addition, the drive shaft 320 is connected to each other to transmit a driving force in a horizontal direction with respect to the two axes of the drive motor 310, the connecting shaft 330 is a driving force in a direction perpendicular to the drive shaft 320 Is connected to pass.

The jockey 350 mounted at the end of the connecting shaft 330 moves upwardly or downwardly according to the rotation direction of the connecting shaft 330 in contact with the upper chamber unit 210. 210 serves to move, and achieves the same configuration as a conventional nut housing.

In addition, the connection part 340 is composed of a bevel gear to transmit the rotational force of the drive shaft 320 transmitted in the horizontal direction to the connection shaft 330 connected in the vertical direction.

Each of the stages 230 and 240 may include fixed plates 231 and 241 fixed to the chamber units 210 and 220, adsorption plates 232 and 242 to which each substrate is fixed, and fixed plates 231 and 241 and adsorption plates 232 and 242. It comprises a plurality of fixed blocks (233, 243) provided between.

In this case, each of the adsorption plates 232 and 242 is formed of a polymer-based polyimide, and is composed of an electrostatic chuck (ESC) for fixing each substrate by electrostatic power.

The sealing means is an O-ring (hereinafter referred to as “third seal member”) 250 mounted to protrude to an arbitrary height along the upper surface of the lower chamber plate 222 of the lower chamber unit 220. The third seal member 250 is formed of a conventional rubber material.

In this case, the third seal member 250 has a thickness such that when the upper and lower chamber units 210 and 220 are coupled to each other, a pair of substrates fixed to the stages 230 and 240 of the inner space are not in close contact with each other. It is formed to have.

In addition, each of the low vacuum chamber units 410 and 420 may be formed to have a space forming a vacuum state, and one surface of each of the low vacuum chamber units 410 and 420 may be in close contact with the upper surface of the upper chamber unit 210 and the lower surface of the lower chamber unit 220. .

In this case, each of the low vacuum chamber units 410 and 420 is formed such that the inner space gradually increases toward its central portion.

The shape of the upper chamber unit 210 and the lower chamber unit 220 is coupled to each other when the internal space is vacuumed by the difference in atmospheric pressure with the atmospheric pressure of the outside of the chamber units (210, 220) described above Each stage (230,240) can be bent, in particular, because the degree of warpage gradually increases toward the center portion is to prevent the deflection of the center portion as described above.

In addition, the alignment means is used to align the position of each substrate (not shown) fixed to each of the stages 230 and 240, and the position change of the lower stage 240 is not made, but the lower chamber unit ( By moving the 220 to change the position of the upper stage 230 to position alignment between each substrate is to be performed.

Such an alignment means includes a plurality of linear actuators 510, a plurality of alignment cameras 520, a plurality of cams 530, and a plurality of restoring means (not shown). .

Each of the linear actuators 510 is mounted along the circumference of the upper chamber unit 210, and moves the moving shaft 511 downward so that the moving shaft 511 is lower chamber plate 222 of the lower chamber unit 220. Operate to be accommodated in the receiving groove (222a).

In addition, the linear actuator 510 is corrected so that the upper stage 230 is inclined to be equal to the inclination degree of the lower stage 240 so that the working surfaces of the stages 230 and 240 are horizontal to each other.

The linear actuator 510 should be provided at least at two diagonal corners of the upper chamber unit 210, more preferably at four corners of the upper chamber unit 210.

At this time, the receiving grooves 222a are formed to correspond to the end shapes of the respective moving shafts 511. That is, the bottom surface of each of the moving shafts 511 and the inner surface of each of the receiving grooves 222a are gradually inclined downward toward the center thereof.

When the contact between the respective moving shafts 511 and the receiving grooves 222a is made, even if the positions are not exactly matched with each other, the ends of the moving shafts 511 are inclined in the receiving grooves 222a. This is to ensure that the location of each other is exactly matched in the process of receiving guidance.

In addition, each alignment camera 520 is an alignment mark (not shown) of a substrate (not shown) to be fixed to each stage 230 or 240 through the upper chamber unit 210 or the lower chamber unit 220. Is omitted, and at least two or more are positioned to observe at least two diagonal edges of each substrate to be fixed to the upper stage 230 and the lower stage 240.

The vacuum pumping means 610 is provided in at least one chamber unit (210, 220), serves to vacuum the inner space of each chamber unit (210, 220).

The support means 710 is configured to protrude upward through the lower stage 240 to seat a substrate loaded into the lower stage 240 and to unload the bonded substrate seated on the lower stage 240. To play a role.

Of course, when the substrate is not loaded, the upper surface of the support means 710 is positioned lower than the upper surface of the lower stage 240.

The photocuring means is mounted through at least one of the chamber units 210 and 220 and serves to temporarily cure the seal material applying region of the substrate fixed to each of the stages 230 and 240. This photocuring means is composed of a UV irradiation unit 800 for performing UV irradiation.

In addition, the upper chamber unit 210 is further provided on the surface of the lower chamber plate 222 of the lower chamber unit by a gap checking sensor 920 for checking the gap between the chamber units 210 and 220. The error of the movement of) can be confirmed beforehand.

Hereinafter, the manufacturing method of the liquid crystal display device using the bonding apparatus configured as described above will be briefly described.

First, the 1st board | substrate with which the liquid crystal was dripped, and the 2nd board | substrate with which the sealing material was apply | coated are prepared by another process line.

Inside the space between the chamber units 210 and 220 so that the portion to which the seal material is applied is directed downward to the second substrate coated with the seal material (not shown) by the loader part (not shown in the figure). Bring in

In addition, the upper chamber unit 210 moves downward to bring the upper stage 230 to the loaded second substrate so that the upper chamber unit 210 moves by the vacuum suction force and the electrostatic suction force by the suction plate (electrostatic chuck) 232. The upper stage 230 attaches and raises the loaded second substrate.

When the attachment of the second substrate to the upper stage 230 is completed, the upper chamber unit 210 is raised to return to the original position, and the first substrate on which the liquid crystal is dropped by the loader is located in each chamber unit. It is brought into the space between 210 and 220.

In this state, the support means 710 attached to the lower stage 240 lifts up, and the loader part is carried out along with the first substrate mounted on the loader part. The support means 710 descends to seat the first substrate on the lower stage 240, and the lower stage 240 fixes the first substrate by using vacuum force and electrostatic force.

When the loading of each substrate is completed, the driving motor 310 of the chamber moving means is driven to rotate the driving shaft 320 and the connecting shaft 330 to move the jockey 350 downward. In this case, the upper chamber unit 210 mounted on the jockey 350 moves gradually downward with the jockey 350.

At this time, since each of the moving shafts 511 is protruded downward by a certain height by the driving of each linear actuator 510, when the upper chamber unit 210 moves downward, the respective moving shafts 511 The end of is received in each receiving groove (222a) and is in contact with the inner surface of each receiving groove (222a).

Thereafter, the moving shaft 511 of each linear actuator 510 is moved downward along the upper chamber unit 210 which is moved downward by the chamber moving means in a state of protruding by the determined protruding height, and the jockey 350 The upper chamber unit 210 mounted on the upper surface of the upper chamber unit 210 continuously contacts the upper surface of the third seal member 250 mounted on the bottom of the upper chamber plate 212 along the circumferential portion of the lower chamber plate 222. do.

In this state, if the jockey portion 350 is continuously moved downward, the jockey portion 350 is taken out of the upper chamber unit 210 and each substrate is formed by the weight and atmospheric pressure of the upper chamber unit 210 itself. The inner space of each chamber unit 210, 220 in which it is located is sealed from its outer space.

In addition, each substrate attached to each of the stages 230 and 240 is pressurized by a predetermined portion by the weight and atmospheric pressure of the upper chamber unit 210.

At this time, the respective substrates are not completely bonded, but are bonded only to the extent that positional variation of any one substrate is possible. The interval between the upper chamber unit 210 and the lower chamber unit 220 is used by the information read by the interval confirmation sensor 920.

In the above state, the vacuum pump means 610 is driven, and the space provided with each substrate is vacuumed. When a full vacuum of the space is made, the alignment of the substrates by the alignment means is performed.

That is, the alignment camera 520 observes each alignment mark formed on each substrate to check the deviation amount between the substrates, and after confirming the distance to which the upper stage 230 should move based on the deviation amount, This is performed by moving the lower chamber plate 222 by manipulating the rotation amount of the cam 530.

In this case, the lower chamber plate 222 is connected to the upper chamber unit 210 by the linear actuator 510, and is spaced apart from the lower base 221 by the support unit 225 at a predetermined interval. If the lower chamber plate 222 is moved in one direction by the rotation of each cam 530, the upper chamber unit 210 is also moved in the movement direction of the lower chamber plate 222.

Particularly, since the lower chamber plate 222 is formed separately from the lower stage 240, only the upper stage 230 is moved to obtain an effect of moving only the upper stage 230, thereby smoothly aligning positions between the substrates attached to the stages 230 and 240. This is possible.

After aligning the substrates and pressing the seal members to be bonded to each other, the release force and the electrostatic force applied to the upper stage 230 are released, and the chamber moving means is operated to move the upper chamber unit 210 to a predetermined height. Raise.

At this time, the second substrate attached to the upper stage 230 maintains a state where the second substrate adhered to the first substrate attached to the lower stage 240 apart from the upper stage 230.

Of course, the rising distance of the upper chamber unit 210 should be increased by a minute height such that the space inside the chamber plates 212 and 222 is kept closed by the third seal member 250 from the external environment.

In this state, the alignment camera 520 again checks the positional alignment between the substrates. In this case, the positional alignment is confirmed using the alignment marks formed on the substrates.

If, as a result of checking the position alignment, the position alignment between the substrates is not precisely made and the error range is exceeded, the position adjustment of the upper stage 230 is performed again using each cam 530.

If the alignment between the substrates is correct as a result of the alignment check, N2 gas is injected into the space in which the substrates are positioned to bring the space into the atmospheric pressure to press the two substrates bonded by the seal material.

That is, since the space between the two substrates bonded to the seal material is in a vacuum state, the two substrates are further pressurized by the difference in air pressure between the respective substrates and the outside to achieve complete bonding.

Then, the seal material of the two bonded substrates is irradiated with UV to cure the seal member, and then the bonded substrate is unloaded.

As the unloading of the bonded substrates is performed as described above, the bonding between the other substrates is repeatedly performed.

In the bonding apparatus as described in FIG. 1, in order to bond two substrates, a loader for loading the substrate is required, and at least one substrate is inverted and loaded in the bonding apparatus.

Accordingly, in the loader and bonding device for manufacturing a liquid crystal display device of the present invention, the upper stage further includes a pad adsorption device in the bonding device described in FIG. 1, and the back surface of the substrate (the material layer for forming the liquid crystal display device is not formed). And a loader for supporting the uncoated side) with adsorption force and inverting the substrate to load the bonding apparatus.

Therefore, the present applicant can not only load the backside by vacuum adsorption when loading the substrate into the bonding apparatus, but also invert the substrate in the loader portion, and allow the upper stage of the bonding apparatus to vacuum suction and pad adsorption. In addition to preventing sagging of the substrate and allowing the upper stage to be easily adsorbed, there has been previously filed a loader and a bonding apparatus for manufacturing a liquid crystal display device without using a separate substrate reversing device and a loading method using the same ( See Korean Patent Application No. 95427, 2003).

 FIG. 2 is a plan view showing a state in which a loader adsorbed a substrate mentioned in Patent Application No. 2003954954 filed by the present applicant, and FIG. 3 is a cross-sectional view taken along line II ′ of FIG. 2.

That is, as shown in Figures 2 and 3, the loader is formed with a plurality of robot fingers (32a-32d) and each robot finger (32a-32d) formed in a direction parallel to each other to form a substrate At least one arm 32 having a plurality of suction pads 33a-33e for adsorption is provided. The arm 32 is not only capable of moving forward and backward, but is also configured to be rotatable at least 180 °. Although not shown in the figure, a vacuum means for providing a vacuum suction force to each of the suction pads 33a to 33e, and a pipe provided between the vacuum means and the suction pads 33a to 33e. The pipe may be installed inside the robot fingers 32a-32d and may be installed outside the robot fingers 32a-32d through a separate hose.

2 and 3, the arm 32 of the loader adsorbs the rear surface of the substrate 20 through the adsorption pads 33a-33e, and inverts the substrate so that the surface on which the seal member 34 is formed faces downward. One state is shown.

4 is a schematic cross-sectional structural view of the upper stage of the cementation apparatus mentioned in patent application 2003 95427 filed by the present applicant.

As described above with reference to FIG. 1, the upper stage 121 of the bonding apparatus according to the embodiment of the present invention is equipped with at least one electrostatic chuck (adsorption plate) to provide a fixed electric power to allow fixing of the substrate, and a vacuum force. At least one vacuum hole is formed to receive and receive the substrate, and the suction pin 121d may be further provided to adsorb the substrate by moving up and down. Here, the suction pin 121d is installed at a position not overlapping with the robot fingers 32a-32d of the arm for loading the substrate. When the suction pin 121d is completely raised, the suction pin 121d is provided. The upper stage surface of the portion where the suction pin 121d is formed has a recessed portion so that the end of the upper end 121 is received into the upper stage 121.

The substrate bonding method of the liquid crystal display device using the loader and the bonding device configured as described above will be described below.

5A-5D are cross-sectional views of the loader and upper stage illustrating the substrate loading method mentioned in patent application 2003 95427 filed by the applicant.

First, a plurality of liquid crystal panel regions are defined to prepare a first substrate having a thin film transistor array formed in each liquid crystal panel region and a second substrate having a color filter array formed in each liquid crystal panel region. Then, the seal member 34 for bonding the two substrates to the edge of each liquid crystal panel region of the first substrate or the second substrate is formed.

When the liquid crystal display device is manufactured by the liquid crystal dropping method, an appropriate amount of liquid crystal is dropped into each liquid crystal panel region of the first substrate or the second substrate. The present invention can be applied to both the liquid crystal injection method and the liquid crystal display device manufacturing method of the liquid crystal dropping method, for the sake of easier explanation, assuming that the liquid crystal is dropped on the first substrate and the seal material is applied to the second substrate do.

Then, the loader sucks the back surface of the first substrate and the second substrate (the surface on which no thin film transistor or color filter array is formed). That is, the back surface of the substrate is sucked through the suction pads 33a to 33e formed on the robot fingers 32a to 32d.

In this way, each substrate is adsorbed and loaded into the bonding apparatus.

That is, as shown in FIG. 5A, the arm 32 which adsorbs the second substrate 20 to which the seal material 34 is applied is rotated 180 ° so that the portion to which the seal material 34 is applied is directed downward. After inverting the second substrate 20 to face, the second substrate 20 is positioned below the upper stage 230 in the bonding apparatus. Of course, when the loader loads the substrate onto the bonding apparatus after inverting the substrate using the inverting apparatus as in the related art, the arm may be positioned on the inverted substrate and the substrate may be supported by the suction pad. .

As shown in FIG. 5B, the suction pin 121d provided in the upper stage 230 is lowered to suck the rear surface of the second substrate 20 through the suction pin 121d. At this time, when the distance between the second substrate 20 loaded in the bonding apparatus by the arm and the upper stage 230 is wide, the upper stage 230 may also be lowered for a predetermined period.

After the second substrate 20 is sucked by the suction pin 121d in this manner, as shown in FIG. 5C, the arm 32 of the loader releases the suction force of the suction pads 33a-33e and slightly rises. After being separated from the second substrate 20, it exits from the bonding apparatus.

As shown in FIG. 5D, the second substrate 20 adsorbed by the suction pin 121d by raising the suction pin 121d is formed by the vacuum hole or the electrostatic chuck formed on the surface of the upper stage 230. 2 The substrate 20 is adsorbed. At this time, the suction pin 121d is completely accommodated in the upper stage 230.

In this manner, the second substrate 20 is completely loaded on the upper stage 230.

Although not shown in the drawing, as mentioned in FIG. 1, the arm adsorbing the first substrate loads the first substrate onto the lower stage 240 without inverting the substrate to bond the two substrates together.

That is, as described above, the second substrate, which is attached to the upper stage 230 by aligning each substrate and releasing the attraction force and the electrostatic force applied to the upper stage 230, is separated from the upper stage 230. Only the predetermined degree with which the 1st board | substrate which was attached to 240 is adhere | attached is maintained.

Then, N2 gas is injected into the space where each substrate is located to bring the space to atmospheric pressure to pressurize the two substrates bonded by the seal material.

That is, since the space between the two substrates bonded to the seal material is in a vacuum state, the two substrates are further pressurized by the difference in air pressure between the respective substrates and the outside to achieve complete bonding.

However, even when the second substrate attached to the upper stage 230 is separated from the upper stage by releasing the suction force and the electrostatic force applied to the upper stage, the second substrate does not easily fall off and is attached to the lower stage. It is not sealed by the first substrate and the seal member, which is not sealed. Consequently, when the N2 gas is injected, N2 gas is introduced between the first and second substrates so that pressure is not applied to the two substrates at atmospheric pressure, so that a defect occurs. Done.

The present invention is to solve the above problems, the liquid crystal display device manufacturing apparatus that can prevent the adhesion failure due to the inflow of bubbles when the two substrates when the two substrates are easily separated from the upper stage when the two substrates are bonded and The purpose is to provide a manufacturing method.

An apparatus for manufacturing a liquid crystal display according to an exemplary embodiment of the present invention for achieving the above object is a bonding chamber for bonding the first and second substrates, and for adsorbing and bonding the first and second substrates, respectively. A plurality of suction pins installed on the lower and upper stages, the upper stages to adsorb the second substrate to be fixed to the upper stage when being loaded, and to apply pressure to the substrate fixed to the upper stage when being bonded; A buffer member for adjusting the pressure of the plurality of suction pins so that the plurality of suction pins do not apply pressure to the second substrate, and the plurality of suction pins apply a predetermined pressure to the second substrate during the bonding. Characterized in that it is configured.

The upper stage has an adsorption mechanism for adsorbing the substrate, and a plurality of through holes through which the plurality of suction pins pass.

The apparatus for manufacturing the liquid crystal display may further include a suction pin driver for driving the respective suction pins and the buffer member.

A method of manufacturing a liquid crystal display according to an exemplary embodiment of the present invention includes preparing a first substrate on which liquid crystal is dropped and a second substrate opposite thereto, supplying the second substrate to a bonding device, and adsorbing a plurality of upper stages. Fixing the second substrate to the upper stage using a pin, fixing the first substrate to the lower stage, vacuuming the interior of the bonding apparatus, releasing the holding force of the upper stage and Pre-bonding the first and second substrates using an adsorption pin, and releasing the vacuum force of the bonding device to completely bond the pre-bonded first and second substrates. do.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

6 is a diagram illustrating an apparatus for manufacturing a liquid crystal display according to an exemplary embodiment of the present invention.

The apparatus for manufacturing a liquid crystal display device according to the present invention, as mentioned in the Republic of Korea Patent Application No. 10-2002-071227 filed by the present applicant, the vacuum chamber is not formed separately and has an upper chamber unit and a lower chamber unit And the vacuum chamber is made when the upper and lower chamber units are in contact with each other. However, there is a difference in the structure of the upper stage. Therefore, only the upper stage will be described.

In an apparatus for manufacturing a liquid crystal display according to an exemplary embodiment of the present invention, as illustrated in FIG. 6, an upper stage for adsorbing a first substrate by a plurality of adsorption holes 1107 and an electrostatic chuck (not shown). 1230, a lower stage 1104 for adsorbing the second substrate by the plurality of adsorption holes 1105, and a first substrate adsorbed to the upper stage 1230 through the upper stage 1230. A plurality of suction pins 1122 for separating one substrate from the upper stage 1230 and a suction pin driver 1120 for driving the plurality of suction pins 1122 up and down.

The upper stage 1230 is provided with a plurality of through holes 1112 through which the plurality of suction pins 1122 penetrate, and one side of the plurality of through holes 1112 is a head portion of the plurality of suction pins 1122. It is formed to be inserted.

The plurality of suction pins 1122 are installed to allow vertical movement in the plurality of through holes 1112 formed in the upper stage 1230. A vacuum suction pad is formed at the end head portion of the plurality of suction pins 1122 to adsorb the substrate.

The suction pin driver 1120 is connected to the plurality of suction pins 1122 to vertically move the plurality of suction pins 1122. In this case, a plurality of buffer members 1124 are installed between the suction pin driver 1120 and each suction pin 1122 to separate the first substrate adsorbed onto the upper stage 1230 separately from the first substrate suction. do. Such a plurality of buffer members 1124 serve to provide the pressure set by the adjustable buffer force to each suction pin 1122.

That is, as mentioned in FIGS. 5A to 5B, the arm adsorbing the substrate to which the seal material is applied is rotated 180 ° to invert the substrate so that the portion to which the seal material is applied is directed downward, and then the upper stage in the bonding apparatus. The substrate is positioned on the lower side, and the plurality of suction pins 1122 are lowered to adsorb the substrate. At this time, when the plurality of suction pins 1122 impact the substrate, the substrate may fall off from the arm. Therefore, when the substrate is loaded, the plurality of suction pins 1122 serve as a buffer so as to hardly impact the substrate.

On the contrary, as described above, the first and second substrates are released even if the vacuum force and the suction force provided on the upper stage are released to drop the second substrate from the upper stage under the condition that they can be bonded by the seal material. In order to prevent the substrate from falling, when the plurality of suction pins 1122 are lowered and the first substrate is spaced apart from the upper stage 1230, the first substrate is opposite to the loading of the first substrate. The suction pins 1122 must impact the first substrate.

Therefore, the buffer member 1124 has almost no impact on the first substrate when the first substrate is loaded, and the pressure of the plurality of suction pins 1122 to impact the first substrate at a predetermined pressure when the substrate is bonded. Function to adjust.

For example, the buffer member 1124 may apply a predetermined pressure to the first substrate when the end portions of the plurality of suction pins 1122 are positioned near the surface of the upper stage 1230. When the end portions of the two suction pins 1122 are separated from the surface of the upper stage 1230 by more than a predetermined distance, the pressure is adjusted so that there is almost no pressure.

Referring to the operation of the manufacturing apparatus of the liquid crystal display according to the present invention having such a configuration as follows.

 7A to 7B are diagrams illustrating a method of manufacturing a liquid crystal display according to an exemplary embodiment of the present invention in stages.

First, the 1st board | substrate 1103 with which the liquid crystal 1102 was dripped, and the 2nd board | substrate 1106 with which the sealant 1101 were apply | coated are provided, respectively. Here, a plurality of panels are designed on one of the first and second substrates 1103 and 1106 to form a thin film transistor array on each panel, and on the remaining substrates, a plurality of panels are designed to correspond to each panel. Each panel is provided with a color filter array including a black matrix layer, a color filter layer, a common electrode, and the like. In the following description, the substrate on which the thin film transistor array is formed is referred to as a first substrate 1103, and the substrate on which the color filter array is formed is referred to as a second substrate 1106. In addition, the second substrate 1106 to which the material 1101 is coated is cleaned in an ultra sonic cleaner (USC) to remove particles generated during the process. That is, since the liquid crystal 1102 is apply | coated without the liquid crystal 1102, the 2nd board | substrate 1106 can wash | clean.

Of course, both the liquid crystal 1102 and the actual material 1103 may be formed on the first substrate 1103.

First, as described with reference to FIGS. 5A to 5D, the first substrate 1103 on which the second substrate 1106 to which the actual material 1101 is applied is fixed to the upper stage 1230 and the liquid crystal 1102 is dropped. To the lower stage 1104 (see FIG. 7A).

At this time, as described above, the buffer member 1124 adjusts the pressure so that the plurality of suction pins 1122 do not apply pressure to the second substrate 1106.

 As described above with reference to FIG. 1, the upper chamber unit 210 is lowered so that the inner spaces of the upper chamber unit 210 and the lower chamber unit 220 are sealed by the third seal member 250.

After vacuuming the sealed space and aligning the respective substrates, the suction force and the electrostatic force applied to the upper stage 1230 are released, and the suction pin driving unit 1120 drives the plurality of suction pins 1122 down. Thus, the second substrate 1106 is dropped from the upper stage 1230 on the first substrate 1103, and a certain pressure is applied to the material 1101 between the first and second substrates. At this time, the buffer member 1124 adjusts the pressure so that the plurality of suction pins 1122 apply a predetermined pressure to the second substrate 1106 (see FIG. 7B).

Then, the N2 gas is injected into the internal space where the first and second substrates are positioned to bring the space into an atmospheric pressure state to pressurize the two substrates bonded by the real material.

That is, since the space between the two substrates bonded to the seal material is in a vacuum state, the two substrates are further pressurized by the difference in air pressure between the respective substrates and the outside to achieve complete bonding.

Then, the seal material of the two bonded substrates is irradiated with UV to cure the seal member, and then the bonded substrate is unloaded.

As the unloading of the bonded substrates is performed as described above, the bonding between the other substrates is repeatedly performed.

The manufacturing apparatus and manufacturing method of the liquid crystal display according to the embodiment of the present invention as described above adsorb the second substrate to the upper stage by using a plurality of adsorption pins, as well as the second adsorbed on the upper stage during bonding. Since the second substrate is separated from the upper stage by applying a predetermined pressure to the substrate, the first and second substrates are sealed by the real material, thereby preventing N2 gas from being introduced between the two substrates during the bonding process.

Claims (7)

A bonding chamber for bonding the first and second substrates, Lower and upper stages for adsorbing and adhering the first and second substrates, respectively; It is installed to be movable up and down through a plurality of through holes of the upper stage, the second substrate is fixed to the upper stage by adsorbing the second substrate during loading, by applying pressure to the second substrate fixed to the upper stage when the bonding A plurality of adsorption pins separating the second substrate from the upper stage and dropping the second substrate on the first substrate, and applying a predetermined pressure to the second substrate to bond the substance between the first and second substrates; The plurality of adsorption pins do not apply pressure to the second substrate during the loading, and the pressures during vertical movement of the plurality of adsorption pins are applied such that the plurality of adsorption pins apply a constant pressure to the second substrate during the bonding. A cushioning member to adjust, And a suction pin driver for driving the suction pins and the buffer member in the vertical direction. delete delete delete delete delete delete

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