KR101250932B1 - An antenna for mobile electronics and the producing method thereof - Google Patents

Abstract

PURPOSE: An antenna for mobile electronics and a producing method thereof are provided to reduce fabrication costs and the number of fabrication processes by using a laser for forming an antenna part. CONSTITUTION: Laser is irradiated on the surface of a housing object(C) to form an antenna unit(A). A catalyst metal compound is absorbed in a recess part(1). The catalyst metal compound is changed into a catalyst metal by an oxidation-reduction reaction. The housing object is precipitated in alkaline etchant to remove the catalyst metal absorbed in a peripheral unit(P). A first nickel-boron alloy layer(5) is electroless-plated by using the catalyst metal as a seed. The copper layer(6) is electroless-plated in the upper side of the first nickel-boron alloy film. A catalyst metal palladium(4) is absorbed in the upper side of the electroless-plated copper layer. A second nickel-boron alloy film(7) is electroless-plated in the upper side of the copper layer.

Description

An antenna for a mobile device and a method for manufacturing the same

The present invention relates to an antenna of a mobile device and a method of manufacturing the same, and more particularly, to etch the surface of a case or a housing of a mobile device injection-molded with synthetic resin such as ABS (arcrylonitrile-butadiene-styrene), PC (polycarbonate) The present invention relates to an antenna of a mobile device for adsorbing a catalytic metal by etching and plating nickel and copper by an electroless plating method and a method of manufacturing the same.

In recent years, synthetic resins such as ABS (arcrylonitrile-butadiene-styrene) and PC (polycarbonate) have been widely used as component materials due to the weight reduction and miniaturization of various electric and electronic devices.

On the other hand, the synthetic resin is light in weight, easy to shape the product by injection molding, and has the advantage of cheaper than the metal in terms of production cost, but in the case of parts requiring electrical conduction is difficult to manufacture due to the insulator properties of the synthetic resin.

In particular, in mobile devices such as mobile phones and tablet computers that are rapidly applied in weight reduction and thinning, it is urgently necessary to form an antenna for wireless communication in the case or housing of a mobile device made of synthetic resin, and thus, various methods have recently been developed. It is becoming.

On the other hand, in order to form an antenna on a synthetic resin coated object such as a synthetic resin case, a metal film through which electricity is applied is required.As a plating method for forming such a metal film, in the case of ABS synthetic resin, butadiene component of ABS synthetic resin is dissolved There is a method of forming irregularities on the surface, adsorbing a catalyst metal to the irregularities, and electroless plating using the catalyst metal as a seed.

 On the other hand, recently, in the case of PC synthetic resin widely used in electrical equipment because of excellent physical properties such as weather resistance, chemical resistance and the like than the ABS synthetic resin by etching the surface of the synthetic resin plated material using an organic solvent, There is a method of adsorbing a catalyst metal to unevenness, and electroless plating using the catalyst metal as a seed.

In another method, a heavy metal is mixed with a synthetic resin to injection molded a case, a housing, and the like, and the laser is etched to expose a mixed heavy metal, and the exposed heavy metal is seeded. There is a method of electroless plating using.

On the other hand, as a method of manufacturing an antenna of a mobile device using a conventional method of ABS synthetic resin, ABS synthetic resin and PC synthetic resin injection molding the case, using a separate injection molding mold to form an antenna portion on the surface of the case After double injection molding using only synthetic resin, the butadiene component of the antenna portion is dissolved to form irregularities on the surface, and the catalyst metal is adsorbed on the irregularities, followed by electroless plating using the catalyst metal as a seed. This patent is disclosed in detail in Patent Publication No. 10-0975012.

However, the method of manufacturing the antenna of the conventional mobile device has a problem that the quality of the weather resistance, chemical resistance, etc. are deteriorated in the characteristics of the ABS synthetic resin because at least 50% ABS synthetic resin should be included in the case in order to use the plating method of ABS synthetic resin There was this.

In addition, in order to form an antenna part, since injection molding has to be doubled, a separate injection molding mold is required, and there is a problem in that manufacturing time increases and manufacturing cost increases.

On the other hand, when PC synthetic resin is used for the object to be plated such as a case or a housing, it is difficult to control the etching rate because the synthetic resin is rapidly dissolved in the organic solvent used to form the unevenness on the surface of the plated object. In order to add a separate pattern forming process using a photosensitive agent or a masking (marsking), there was a problem that the manufacturing cost increases.

In addition, when the antenna is manufactured using the plating method of the synthetic resin in which the heavy metal is mixed, since the raw material price is significantly higher than that of the general synthetic resin, the manufacturing cost is increased, and the plating metal is deposited on the surface other than the antenna part during the plating process. There was also a problem that the quality is reduced.

The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to form a high adhesion and uniform plating film on a mobile device molded of synthetic resin using electroless plating, 100% PC resin It can be used, and the process is simple to provide an antenna of the mobile device and a method of manufacturing the manufacturing cost is reduced.

An antenna manufacturing method of a mobile device according to the present invention for achieving the above object, the laser active step of generating a fine concavo-convex while forming an antenna unit by irradiating a laser to the surface of the case or the housing to be plated of the mobile device molded of synthetic resin Wow; An etching step of etching using an acidic etching solution so that the size of the unevenness formed on the surface of the antenna unit is increased; A first catalyst adsorption step of adsorbing a catalyst metal compound inside the unevenness to allow electroless plating on the antenna part by depositing the plated object on a catalyst adsorption solution; A catalytic activity step of depositing the plated object in an acidic catalytically active solution and converting the catalytic metal compound adsorbed to the antenna unit into a catalytic metal by using a redox reaction; A first partial etching step of removing the catalytic metal adsorbed to a peripheral portion other than the antenna portion by immersing the plated object in an alkaline first partial etching solution; A second catalyst adsorption step of depositing the plated object in a second catalyst adsorption solution to adsorb and supplement a catalyst metal on the surface of the antenna unit; A second partial etching step of immersing the plated object in a second partial etching solution to remove the catalyst metal adsorbed to the periphery in the second catalyst adsorption step and to reduce the roughness of the surface of the antenna part; ; A first nickel plating step of electroless plating a first nickel-boron (Ni-B) alloy film using a catalyst metal adsorbed on the surface of the antenna unit as a seed; Characterized in that configured.

A copper plating step of electroless plating a copper film on the upper surface of the first nickel-boron alloy film plated in the first nickel plating step so as to increase the conductivity of the plating film plated on the surface of the antenna unit is further included.

A third catalyst adsorption step of adsorbing the catalytic metal palladium on the upper surface of the copper film plated in the copper plating step; And a second nickel plating step of electroless plating the second nickel-boron alloy film on the upper surface of the copper film.

The etching solution of the etching step is characterized in that the composition is composed of sulfuric acid 10 ~ 15Vol%, water 85 ~ 90Vol% and heated to 50 ~ 60 ℃.

The catalyst adsorption solution of the first catalyst adsorption step water 969.6 ~ 994.9g / L, palladium chloride (PdCl ₂ ) 0.1 ~ 0.4g / L, tin chloride (SnCl ₂ ) 5 ~ 30g / L mixed solution 70 ~ 90Vol % And 98% hydrochloric acid (HCl) is characterized in that the composition by mixing 10-30% by volume.

The catalytically active solution of the catalytic activity step is characterized in that the composition of 98% sulfuric acid 4 ~ 8Vol%, water 92 ~ 96Vol% mixture.

The first partial etching solution of the first partial etching step is composed of water 900 ~ 950g / L, ammonium fluoride 50 ~ 100g / L, characterized in that heated to 40 ~ 70 ℃.

The second catalyst adsorption solution of the second catalyst adsorption step is a palladium chloride solution 70-90Vol% and 98% of 999.6-999.9 g / L of water and 0.1-0.4 g / L of palladium chloride (PdCl ₂ ). It is characterized in that the composition of hydrochloric acid 10 ~ 30Vol%.

The second partial etching solution is composed of 83 to 90 Vol% of ammonium fluoride solution and 10 to 17 Vol% of 98% sulfuric acid composed of water 910 to 950 g / L, ammonium fluoride 50 to 90 g / L, and heated to 40 to 70 ° C. It is characterized by.

The antenna of the mobile device is characterized in that manufactured according to the manufacturing method.

As described above, the method for manufacturing an antenna of a mobile device according to the present invention has the following effects.

First, in the laser activation step, by irradiating a laser on the surface of the plated object to form an antenna portion, the number of manufacturing processes is reduced, thereby reducing the manufacturing cost,

Secondly, irregularities can be generated on the surface of the synthetic resin by using the laser activation step and the etching step, and in particular, 100% PC resin having excellent weather resistance and chemical resistance can be used, thereby improving product quality.

Third, by using the laser activation step and the etching step to form uniform irregularities in the antenna portion, the adhesion can be improved and the plating film of uniform thickness can be formed, thereby improving the reliability of the product.

Fourth, by removing the catalytic metal adsorbed on the surface other than the antenna portion in the first partial etching step and the second partial etching step, antenna defects are reduced, thereby improving product quality.

Fifth, by adsorbing the catalytic metal palladium on the upper surface of the copper plating film in the second catalyst adsorption step, the adhesion of the second nickel-boron alloy film formed in the second nickel electroless plating step and the copper film is improved to improve the quality of the product. ,

Sixth, by forming a plating film composed of the first nickel-boron alloy film / copper film / second nickel-boron alloy film, the conductivity of the plating film is increased and the electrical properties are improved, thereby improving the product quality.

1 is a flowchart illustrating a method of manufacturing an antenna of a mobile device according to the present invention.
Figure 2 is a schematic diagram showing a longitudinal cross-sectional view of the antenna unit and the peripheral portion of the antenna manufacturing method of a mobile device according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment according to the present invention, the portion in which the antenna is formed on the surface of the plated object is called the antenna portion (A), other than the antenna portion (A) Is called the peripheral portion (P).

In the method of manufacturing an antenna of a mobile device according to the present invention, as shown in Figs. 1 and 2, the antenna unit (A) by irradiating a laser on the surface of the case or the housing to be plated (C) of the mobile device molded of synthetic resin Laser active step (S10) for generating fine irregularities while forming a); An etching step (S40) of etching using an acidic etching solution so that the size of the unevenness formed on the surface of the antenna unit A is increased; A first catalyst adsorption step (S50) of adsorbing a catalyst metal compound inside the unevenness (1) to allow electroless plating on the antenna unit (A) by depositing the plated material on a catalyst adsorption solution; A catalytically active step (S60) of depositing the plated material (C) in an acidic catalytically active solution and converting the catalytic metal compound adsorbed to the antenna unit A to a catalytic metal using a redox reaction; A first partial etching step (S70) of depositing the plated material (C) in an alkaline first partial etching solution to remove the catalytic metal adsorbed on the peripheral portion (P); A second catalyst adsorption step (S80) of dipping the plated object (C) in a second catalyst adsorption solution to adsorb and supplement a catalyst metal in the antenna unit (A); The roughness of the surface of the antenna portion A is removed by depositing the plated object C on the second partial etching solution while removing the catalytic metal adsorbed to the peripheral portion P in the second catalyst adsorption step S80. A second partial etching step (S90) for etching to reduce the number of steps; In the first nickel plating step (S100) of electroless plating the first nickel-boron (Ni-B) alloy film 5 using the catalyst metal adsorbed on the surface of the antenna unit A as a seed. It is composed.

Electroless plating of the copper film (6) on the upper surface of the first nickel-boron alloy film (5) plated in the first nickel plating step (S100) to increase the conductivity of the plating film plated on the surface of the antenna portion (A) Copper plating step (S110) is further included.

A third catalyst adsorption step (S130) of adsorbing the catalytic metal palladium (4) on the upper surface of the copper film (6) plated in the copper plating step (S110); A second nickel plating step (S140) of electroless plating the second nickel-boron alloy film 7 on the upper surface of the copper film 6 is further included.

Hereinafter, the steps will be described in more detail.

In the laser activation step (S10), as shown in (a) of FIG. By finely crushing the surface of the antenna unit (A) by using to form a large amount of irregularities (1) with a constant density.

On the other hand, the peripheral portion (P) also has a small amount of fine peripheral unevenness (2) according to the characteristics of the resin and the injection molding conditions.

At this time, the laser activation step (S10) may be a diode laser, UV (ultra violet) laser, excimer (excimer) laser and the like, it is preferable to use a diode laser of 800 ~ 1100nm wavelength.

In addition, before irradiating the laser on the plated object (C), it is preferable to wash with water and dry to remove the foreign matter present on the surface of the plated object (C).

At this time, the water washing may be washed by projecting water onto the plated object (C) by a shower method, or by washing in a washing bath consisting of a three-stage water tank.

Next, after performing the laser activation step (S10), the degreasing step (S20) and washing with degreasing using an alkaline aqueous solution so that fine debris of dust or plated material (C), oil components that may be contaminated during handling are removed. Preferably, a washing step (not shown) is included.

In the degreasing step (S20), the plated material (C) is immersed in a degreasing solution in which water and sodium metasilicate are mixed for 5 to 10 minutes to remove surface dirt and fine debris and oil components of the plated material (C). do.

In addition, the degreasing solution is preferably mixed with 40 ~ 90g sodium metasilicate per 1 liter of solution, and heated to 60 ~ 70 ℃.

On the other hand, the water washing step (not shown) is sequentially washed from the lower tank to the upper tank in the washing tub consisting of three stage water tank so that the clean water can be replaced in turn, and then each process of the present invention It is preferable that the washing step is included after the step.

In addition, the degreasing step (S20) it is preferable to include a neutralization step (S30) to remove the trace amount of the degreasing solution remaining on the surface of the plated (C) by using an acidic solution and neutralize the surface.

The neutralization step (S30) is neutralized by plating for 1 to 3 minutes at 20 ~ 30 ℃ in a neutralizing solution mixed with 98% sulfuric acid 5 ~ 10Vol%, water 90 ~ 95Vol%.

Next, it is preferable to wash the water in the same manner as the washing step.

The etching step (S40), as shown in (b) of Figure 2, using the acidic etching solution of the width and depth of the unevenness (1) formed in the antenna portion (A) of the plated material (C) Etching so that the size is enlarged.

At this time, the antenna portion A is etched by weakening the bonding force of the surface by the electromagnetic wave energy of the laser, but the peripheral portion (P) is not etched.

The etching solution is composed of sulfuric acid 10 ~ 15Vol%, water 85 ~ 90Vol%, the plated (C) is immersed in the etching solution at 50 ~ 60 ℃, 1-3 minutes to etch the surface.

Next, it is preferable to wash in the same manner as the washing step to remove the etching solution remaining on the surface of the plated (C).

On the other hand, the plated object (C) is formed of a synthetic resin of a non-conductor, so it is not possible to perform electroless plating directly on the antenna unit (A).

The first catalyst adsorption step (S50) is the electroless plating on the antenna portion (A) formed in the laser activation step (S10) and the etching step (S40) by immersing the plated (C) in a catalyst adsorption solution. It is a step of adsorbing the catalytic metal compound inside the unevenness (1) of the antenna unit (A).

On the other hand, the catalyst adsorption solution is a mixture solution of water 969.6 ~ 99.1g / L, palladium chloride (PdCl ₂ ) 0.1 ~ 0.4g / L, tin chloride (SnCl ₂ ) 5 ~ 30g / L and 70 ~ 90Vol%, It is formed by mixing 10-30 vol% of 98% hydrochloric acid (HCl), and the plated material is deposited in the catalyst adsorption solution at 20-30 ° C. for 2 to 3 minutes to form a catalytic metal compound inside the unevenness (1). It is preferable to adsorb.

At this time, inside the unevenness 1 of the antenna portion A, which is generated by the irradiation of the laser and whose size is enlarged in the etching step S40, as shown in (c) of FIG. 2, the palladium-tin ( The catalytic metal compound of Pd-Sn) (3) is adsorbed.

In addition, a small amount of palladium-tin (3) is also adsorbed to a part of the peripheral unevenness (2) of the peripheral portion (P).

Next, it is preferable to wash in the same manner as the washing step to remove the catalyst adsorption solution remaining on the surface of the plated (C).

The catalytically active step (S60) is a wave adsorbed to the antenna unit (A) by depositing the plated product (C) in an acidic catalytically active solution and removing tin components of the catalytic metal compound using a redox reaction. It is a step of converting the radium-tin (3) catalyst metal compound into palladium (Pd) (4) which is a catalyst metal.

On the other hand, the catalytically active solution used in the catalytic activity step (S60) is composed of a mixture of 98% sulfuric acid 4 ~ 8Vol%, water 92 ~ 96Vol%, the plating material (C) to the catalytically active solution 20 The palladium-tin (3) catalytic metal compound is converted into the catalytic metal palladium (4) by immersion for 1 to 2 minutes at ˜30 ° C.

In this case, electroless plating is possible by using the catalyst metal palladium (4) adsorbed on the unevenness (1) generated in the antenna unit (A), which has been performed up to the catalytic activation step (S60), as a seed. do.

On the other hand, as shown in (c) of Figure 2, due to tin (Sn) that acts as an adsorbent in the first catalyst adsorption step (S50) even a part of the peripheral irregularities (2) in the peripheral portion (P). The radium-tin (3) catalytic metal compound is adsorbed and is converted into the catalytic metal palladium (4) and remains in the catalytic activation step (S60), as shown in FIG.

Therefore, the catalytic metal palladium 4 adsorbed to the peripheral portion P should be removed so that the performance of the antenna is not degraded.

The first partial etching step (S70), as shown in (e) of FIG. 2, the catalyst metal palladium (4) adsorbed on the peripheral portion P by immersing the plated product in an alkaline first partial etching solution. ) Step.

At this time, the first partial etching step (S70) is heated to 40 ~ 70 ℃ the first partial etching solution composed of 900 ~ 950g / L water, 50 ~ 100g / L ammonium fluoride and 50 ~ 60 seconds of deposition is carried out.

On the other hand, the peripheral concave-convex (2) in the peripheral portion (P) has a small depth and width of the amount of the catalytic metal adsorbed, and by using the first partial etching solution, to protect the antenna portion (A) The first partial etching step 70 may be performed without a separate masking process to remove the palladium 4 catalyst metal adsorbed on the peripheral portion P.

Next, it is preferable to wash the water in the same manner as the washing step.

The second catalyst adsorption step (S80) is a step of adsorbing the catalytic metal palladium 4 so that the catalytic metal partially removed from the antenna unit A is replenished in the first partial etching step 70.

On the other hand, as shown in Figure 2 (f), while the catalytic metal palladium is supplemented to the antenna portion (A), a small amount of the catalytic metal palladium also on a part of the peripheral irregularities (2) in the peripheral portion (P) (4) is adsorbed.

At this time, the second catalyst adsorption step (S80) is a hydrochloric acid of 70 ~ 90Vol% and 98% of a palladium chloride solution composed of 999.6 ~ 999.9g / L water, 0.1 ~ 0.4g / L palladium chloride (PdCl ₂ ) It is carried out by immersing the plated object for 110 to 130 seconds in the second catalyst adsorption solution formed at 10 to 30 Vol%.

On the other hand, in the second catalyst adsorption step (80) is used to act as the adsorbent in the first catalyst adsorption step (S50) as a step of adsorbing the palladium (4) to the catalyst metal already adsorbed to the antenna unit (A). No tin chloride is used.

The second partial etching step S90 removes a trace amount of the catalytic metal palladium 4 adsorbed to the peripheral part P in the second catalyst adsorption step 80, and roughens the surface of the antenna part A. It is a step to reduce roughness.

On the other hand, the second partial etching step (S90) is an aqueous ammonium fluoride solution composed of 910 ~ 950g / L water, 50 ~ 90g / L ammonium fluoride 83 ~ 90Vol%, 98% sulfuric acid 10 ~ 17Vol% It is carried out by heating the second partial etching solution to 40 ~ 70 ℃ and immersing the plated (C) for 100 to 120 seconds.

Therefore, after the second partial etching step (S90), the plated object (C) is in a state in which the catalytic metal palladium (4) is adsorbed only to the antenna unit (A).

On the other hand, it is preferable to wash in the same manner as the water washing step after each process step as described above.

In the first nickel plating step (S100), as shown in FIG. 2G, first nickel-boron is used by using palladium 4 adsorbed to the antenna unit A as a seed. It is a step of electroless plating the (Ni-B) alloy film 5.

On the other hand, since the palladium (4) adsorbed to the peripheral portion (P) in the second catalyst adsorption step (S80) is removed in the second partial etching step (S90), the first nickel- in the peripheral portion (P) The boron alloy film 5 is not plated.

Meanwhile, in the present invention, nickel-boron alloy having excellent weatherability and ductility is used, but copper, nickel-phosphorus (Ni-P) alloy, and chromium (Cr) may be electroless plated according to the characteristics of the product.

At this time, the first nickel plating step (S100) is nickel sulfate 30g / L to plate the first nickel-boron alloy film 5, dimethylamine borane (DMAB) 3g / L as a reducing agent, sodium citrate complex 25g / L It is preferable to use a nickel-boron plating solution composed of 25 g / L sulfuric acid.

In addition, the nickel-boron plating solution is preferably maintained at a pH of 6 ~ 8, 50 ~ 65 ℃, the thickness of the first nickel-boron alloy film (5) by forming a thickness of 0.5 ~ 1㎛ synthetic resin and plating film To increase the adhesion between.

Next, washing with water is performed in the same manner as washing with water, and washing with ultrasonic waves is performed to remove nickel metal grains deposited on the surface of the plated material C without being plated and precipitated in the nickel-boron plating solution. It is preferable to wash.

Copper plating step of electroless plating the copper film (6) on the upper surface of the first nickel-boron alloy film (5) plated in the first nickel plating step (S100) to increase the conductivity of the antenna unit (A) ( S110) is further included.

On the other hand, the copper plating step (S110) is a copper concentration of 2.5 ~ 3 g / L, sodium hydroxide 8 ~ 9g / L, formalin 3 ~ 3.8g / L, EDTA 30 ~ 35g / L plating solution at a temperature of 45 ~ 55 ℃ Electroless plating is preferred for 2 to 5 minutes.

In addition, the thickness of the copper film 6 is preferably generated in 10 ~ 40㎛ to increase the electrical properties of the product to increase the conductivity.

Next, a third partial etching step S120 may be further included to remove the first nickel-boron alloy film 5 and the copper film 6 which are finely plated on the peripheral portion P. FIG.

At this time, the third partial etching step (S120) is heated to 40 ~ 50 ℃ the third partial etching solution composed of 90 ~ 92Vol% of water and 98% sulfuric acid 8 ~ 10Vol%, the plated material (C) Immersed for 50 to 60 seconds to remove the first nickel-boron alloy film 5 and the copper film 6 finely plated on the peripheral portion P.

On the other hand, the electroless plated copper film 6 is excellent in electrical conductivity but has a high ductility, so that the surface may be scratched or peeled off during use or handling, so that the second nickel having a hardness higher than that of copper on the upper surface of the copper film 6 It is preferable to plate the boron alloy film 7.

In the present invention, a third catalyst adsorption step S130 is further included to improve adhesion between the copper film 6 and the second nickel-boron alloy film 7 which is plated on the upper surface of the copper film 6.

The third catalyst adsorption step (S130) is a step of adsorbing the catalytic metal palladium (4) on the upper surface of the electroless plated copper film (6) in the copper plating step (S110).

At this time, the third catalyst adsorption step (S130) is composed of 99.7 ~ 99.9 Vol% of 0.01 ~ 0.02 g / L palladium chloride solution, 0.1 ~ 0.3 Vol% of 98% hydrochloric acid, the second catalyst of pH 2-4 The catalyst metal palladium (4) is adsorbed on the upper surface of the copper film (6) by immersing the adsorption solution at 20 to 30 ° C. for 5 to 10 seconds.

On the other hand, the third catalyst adsorption step (S130) is capable of directly adsorbing the catalytic metal palladium (4) to the copper film (6) that is a metal, it was used as an adsorbent in the first catalyst adsorption step (S50) Tetrachloride is not used.

Next, the same washing with the washing step, washing with water using ultrasonic waves to remove the copper grains deposited on the surface of the plated material (C) without being plated and precipitated in the copper plating solution. It is preferable.

A second nickel plating step (S140) of electroless plating the second nickel-boron alloy film 7 on the upper surface of the copper film 6 is further included.

In this case, the second nickel plating step (S140) is a step of plating a second nickel-boron alloy film 7 having a high hardness on the upper surface of the copper film 6 so that the copper film 6 is protected. It is preferable to use a nickel-boron alloy plating solution prepared in the same manner as in the nickel plating step (S100), and the plating thickness is preferably 1 to 4 μm.

On the other hand, after the second nickel plating step (S140), the plated object (C), as shown in Figure 2 (h), the antenna portion (A) is a first nickel-boron alloy film (5), A copper film 6 and a second nickel-boron alloy film 7 are laminated and plated, and the third catalyst adsorption step S130 is performed between the copper film 6 and the second nickel-boron alloy film 7. The catalytic metal palladium (4) adsorbed at is left.

On the other hand, it is preferable to further include a discoloration prevention step (S150) so that the surface of the second nickel-boron alloy film (7) plated in the second nickel plating step (S140) is not discolored.

At this time, the discoloration prevention step may be carried out by immersing the plated object for 1 minute in a solution heated to 45 ~ 55 ℃ composed of 90 ~ 92Vol% of water, 8 ~ 10Vol% of sodium gluconate (Sodium Gluconate).

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents. Of course, such modifications are within the scope of the claims.

Description of the Related Art [0002]
S10: laser activation step S20: degreasing step
S30: neutralization step S40: etching step
S50: first catalyst adsorption step S60: catalytic activity step
S70: first partial etching step S80: second catalyst adsorption step
S90: second partial etching step S100: first nickel plating step
S110: copper plating step S120: third partial etching step
S130: third catalyst adsorption step S140: second nickel plating step
1: Unevenness 2: Surroundings
3: palladium-tin 4: palladium
5: first nickel-boron alloy film 6: copper film
7: second nickel-boron alloy film A: antenna portion
P: Peripheral C: Plated Object

Claims (9)

In the antenna manufacturing method of a mobile device,
A laser activation step (S10) of generating unevenness (1) while forming an antenna portion (A) by irradiating a laser on the surface of the case or housing to-be-plated object (C) of the mobile device molded of synthetic resin;
An etching step (S40) of etching using an acidic etching solution so that the size of the unevenness (1) formed in the antenna unit (A) is increased;
A first catalyst adsorption step (S50) of depositing the plated material (C) on a catalyst adsorption solution to adsorb a catalytic metal compound inside the unevenness (1) to allow electroless plating on the antenna unit (A);
A catalytically active step (S60) of depositing the plated material (C) in an acidic catalytically active solution and converting the catalytic metal compound adsorbed to the antenna unit A to a catalytic metal using a redox reaction;
A first partial etching step (S70) of depositing the plated object (C) in an alkaline first partial etching solution to remove the catalytic metal adsorbed on the peripheral portion (P) other than the antenna portion (A);
A second catalyst adsorption step (S80) of depositing the plated material (C) in a second catalyst adsorption solution to adsorb and supplement a catalyst metal on the surface of the antenna unit (A);
The roughness of the antenna portion A is removed by depositing the plated material C on the second partial etching solution while removing the catalytic metal adsorbed to the peripheral portion P in the second catalyst adsorption step S80. A second partial etching step (S90) for etching to reduce the number of parts;
A first nickel plating step (S100) of electroless plating the first nickel-boron (Ni-B) alloy film 5 using the catalyst metal adsorbed to the antenna unit A as a seed; Antenna manufacturing method of a mobile device, characterized in that configured. The method of claim 1,
Electroless plating of the copper film (6) on the upper surface of the first nickel-boron alloy film (5) plated in the first nickel plating step (S100) to increase the conductivity of the plating film plated on the surface of the antenna portion (A) Copper plating step (S110) to the antenna manufacturing method of a mobile device, characterized in that it further comprises. The method of claim 2,
A third catalyst adsorption step (S130) of adsorbing the catalytic metal palladium (4) on the upper surface of the copper film (6) plated in the copper plating step (S110);
The second nickel plating step (S140) of electroless plating the second nickel-boron alloy film (7) on the upper surface of the copper film (6) further comprises an antenna manufacturing method of a mobile device. The method of claim 1,
The etching solution of the etching step (S40) is 10 to 15% by volume of sulfuric acid, 85 to 90% by volume of water, the antenna manufacturing method of a mobile device, characterized in that heated to 50 ~ 60 ℃. The method of claim 1,
The catalyst active solution of the catalytic activity step (S60) is a method of manufacturing an antenna of a mobile device, characterized in that the composition of 98% sulfuric acid 4 ~ 8Vol%, water 92 ~ 96Vol% mixture. The method of claim 1,
The first partial etching solution of the first partial etching step (S70) is water 900 ~ 950g / L, ammonium fluoride 50 ~ 100g / L composition, the antenna manufacturing of the mobile device, characterized in that heated to 40 ~ 70 ℃ Way. The method of claim 1,
The second catalyst adsorption solution of the second catalyst adsorption step (S80) is 70 to 90 vol% of a palladium chloride solution composed of 999.6 to 999.9 g / L of water and 0.1 to 0.4 g / L of palladium chloride (PdCl ₂ ), Antenna manufacturing method of a mobile device, characterized in that the composition of 98% hydrochloric acid 10 ~ 30Vol%. The method of claim 1,
The second partial etching solution is composed of 83 to 90 Vol% of ammonium fluoride solution and 10 to 17 Vol% of 98% sulfuric acid composed of water 910 to 950 g / L, ammonium fluoride 50 to 90 g / L, and heated to 40 to 70 ° C. Antenna manufacturing method of a mobile device, characterized in that the. An antenna of a mobile device, which is manufactured according to the method of any one of claims 1 to 8.

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