KR101219739B1 - 기판 코팅 장치 및 방법 - Google Patents
기판 코팅 장치 및 방법 Download PDFInfo
- Publication number
- KR101219739B1 KR101219739B1 KR1020060091254A KR20060091254A KR101219739B1 KR 101219739 B1 KR101219739 B1 KR 101219739B1 KR 1020060091254 A KR1020060091254 A KR 1020060091254A KR 20060091254 A KR20060091254 A KR 20060091254A KR 101219739 B1 KR101219739 B1 KR 101219739B1
- Authority
- KR
- South Korea
- Prior art keywords
- chemical liquid
- substrate
- nozzle
- liquid supply
- chemical
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 109
- 238000000576 coating method Methods 0.000 title claims abstract description 67
- 239000011248 coating agent Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000126 substance Substances 0.000 claims abstract description 244
- 239000007788 liquid Substances 0.000 claims abstract description 218
- 238000004140 cleaning Methods 0.000 claims description 23
- 238000011049 filling Methods 0.000 claims description 5
- 238000011068 loading method Methods 0.000 claims description 3
- 230000003111 delayed effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004904 shortening Methods 0.000 abstract description 2
- 238000003860 storage Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 5
- 201000004440 congenital dyserythropoietic anemia Diseases 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005002 finish coating Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Coating Apparatus (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Plasma & Fusion (AREA)
- Environmental & Geological Engineering (AREA)
Abstract
Description
Claims (9)
- 기판이 안착되는 스테이지와, 상기 스테이지의 상부에 위치하여 상기 기판에 약액을 분사하는 노즐부와, 상기 노즐부에 약액을 공급하는 복수개의 약액 공급부를 포함하되,상기 복수개의 약액 공급부는 각각 노즐부에 연결되어, 상기 노즐부에 약액을 선택적으로 공급하고, 상기 약액 공급부와 노즐부 사이에 분기되어 약액이 배출되는 약액 배출구가 더 마련된 것을 특징으로 하는 기판 코팅 장치.
- 청구항 1에 있어서, 상기 노즐부 또는 약액 배출구를 선택적으로 연결시키기 위해 밸브가 더 마련된 것을 특징으로 하는 기판 코팅 장치.
- 기판을 로딩하는 단계와, 약액을 노즐부에 공급하는 단계와, 상기 기판에 약액을 코팅하는 단계와, 코팅된 기판을 언로딩하는 단계를 포함하되,상기 약액을 노즐부에 공급하는 단계는 복수의 약액 공급부로부터 선택적으로 상기 노즐부에 약액을 선택적으로 공급하고, 나머지 약액 공급부는 세정 및 약액을 충전하는 것을 특징으로 하는 기판 코팅 방법.
- 청구항 3에 있어서, 상기 약액을 노즐부에 공급하는 단계는노즐을 준비하는 단계와,약액 공급부를 세정하는 단계와,상기 약액 공급부에 약액을 충전하는 단계와,상기 준비된 노즐을 장착하는 단계와,상기 세정 및 약액 충전을 마친 약액 공급부를 노즐에 연결하는 단계를 포함하는 것을 특징으로 하는 기판 코팅 방법.
- 삭제
- 삭제
- 삭제
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060091254A KR101219739B1 (ko) | 2006-09-20 | 2006-09-20 | 기판 코팅 장치 및 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060091254A KR101219739B1 (ko) | 2006-09-20 | 2006-09-20 | 기판 코팅 장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080026346A KR20080026346A (ko) | 2008-03-25 |
KR101219739B1 true KR101219739B1 (ko) | 2013-01-18 |
Family
ID=39413791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060091254A KR101219739B1 (ko) | 2006-09-20 | 2006-09-20 | 기판 코팅 장치 및 방법 |
Country Status (1)
Country | Link |
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KR (1) | KR101219739B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102322677B1 (ko) * | 2019-11-26 | 2021-11-05 | 세메스 주식회사 | 약액 토출 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010027041A (ko) * | 1999-09-10 | 2001-04-06 | 윤종용 | 포토레지스트 공급 시스템 |
KR20020034924A (ko) * | 2000-10-31 | 2002-05-09 | 기타지마 요시토시 | 용액 공급장치 |
KR20030016459A (ko) * | 2001-08-16 | 2003-03-03 | 삼성전자주식회사 | 이중 공급구조를 가지는 웨이퍼 코팅 시스템의 노즐연결구조 |
KR20030028303A (ko) * | 2001-09-29 | 2003-04-08 | 삼성전자주식회사 | 포토레지스트막 형성 장치 및 이를 이용한 포토레지스트막형성방법 |
-
2006
- 2006-09-20 KR KR1020060091254A patent/KR101219739B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010027041A (ko) * | 1999-09-10 | 2001-04-06 | 윤종용 | 포토레지스트 공급 시스템 |
KR20020034924A (ko) * | 2000-10-31 | 2002-05-09 | 기타지마 요시토시 | 용액 공급장치 |
KR20030016459A (ko) * | 2001-08-16 | 2003-03-03 | 삼성전자주식회사 | 이중 공급구조를 가지는 웨이퍼 코팅 시스템의 노즐연결구조 |
KR20030028303A (ko) * | 2001-09-29 | 2003-04-08 | 삼성전자주식회사 | 포토레지스트막 형성 장치 및 이를 이용한 포토레지스트막형성방법 |
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Publication number | Publication date |
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KR20080026346A (ko) | 2008-03-25 |
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