KR101204098B1 - Apparatus and method for driving vibration module - Google Patents

Abstract

Vibration module drive device of the present invention is a vibration module installed at least one vibration actuator therein; And driving means for receiving the optimal driving frequency of the actuator from the outside and recording therein, and driving the actuator at the recorded optimal driving frequency when a driving command of the host is received. According to the present invention, the driver IC implements the individual difference adjustment function for each vibration module, thereby generating a constant vibration force, thereby optimizing and finely adjusting the vibration force, thereby reducing production tact time. In addition, wide spec tolerances in design and production enable cost savings (wide choice of materials) and yield improvements.

Description

Apparatus and method for driving vibration module

The present invention relates to an apparatus and method for driving a vibration module having a vibration actuator installed therein.

In general, a drive IC for driving a vibration module in which an actuator is installed is designed as a vibration frequency center for driving an actuator. In particular, a drive IC stores and stores a waveform shape of a frequency in an internal register area. However, when the product is made by implementing the frequency, without considering the deviation and the assembly error according to the unit (unit), there is a vibration force deviation due to the following causes and can not implement a constant vibration surface.

(1) Actuator combinations that perform other functions

(2) Vibration force deviation when using one actuator

(3) When placing actuators in more than one multi type, vibration force interference occurs at different vibration frequencies.

Even when a driver IC that generates a constant vibration frequency is used, the vibration force due to a single part and a production process error has a wide spread and causes a decrease in production yield.

The technical problem to be solved by the present invention is to write the physical and electrical characteristics of each actuator in the non-volatile memory in the driver IC when using more than one vibration module, the driver IC determines the characteristics between the objects by a simple command from the host The present invention provides a vibration module driving apparatus and method for generating a constant vibration force.

According to an aspect of the present invention, there is provided a vibration module having at least one vibration actuator installed therein; And a driving means for receiving the optimal driving frequency of the actuator from the outside and recording therein, and driving the actuator at the recorded optimal driving frequency when a driving command of the host is received.

Here, the driving means may include a nonvolatile memory capable of recording and reading the optimum driving frequency of the actuator.

Here, the nonvolatile memory is located outside the driving means and can be accessed every time the actuator is driven.

According to another aspect of the present invention, there is provided a method of operating a vibration module having at least one vibration actuator installed therein, the method comprising: (a) simulating the actuator using an arbitrary frequency band; (b) measuring the vibration force of the actuator during each frequency simulation; (c) setting a frequency corresponding to the maximum value of the measured vibration force data as the actuator driving frequency; And (d) receiving the set driving frequency and writing the result to a nonvolatile memory.

Here, the method may further include driving the actuator at an optimal driving frequency recorded in the nonvolatile memory when a driving command of the host is received.

As described above, according to the present invention, since the driver IC implements the individual difference adjustment function for each vibration module, it is possible to generate a constant vibration force, thereby optimizing the vibration force and finely adjusting the production tact time. Can be saved. In addition, wide spec tolerances in design and production enable cost savings (wide choice of materials) and yield improvements.

1 is a view showing the configuration of a vibration module driving apparatus according to the present invention.
FIG. 2 is a detailed view of the driver IC in FIG. 1.
3 is a view showing the operation of the vibration module driving method according to the present invention.
4 is a graph of vibration force vs. frequency.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in this specification and drawing, duplication description is abbreviate | omitted by using the same code | symbol about the component which has substantially the same structure. Also, in the drawings of the present invention, there is also a portion in which the thickness, the size, and the like are partially exaggerated in order to facilitate understanding.

1 is a view showing the configuration of a vibration module driving apparatus according to the present invention.

Referring to FIG. 1, the vibration module driving apparatus according to the present invention includes a vibration module 100 and a driver IC 200 for driving the vibration module 100.

The vibration module 100 includes a vibration actuator 110, a support frame 120, an elastic member 130, and a case 140.

Vibration module 100 according to an embodiment of the present invention, the vibration actuator 110, the support frame 120, the elastic member 130, the case 140.

The vibration actuator 110 may include a base member (not shown), an insulating layer (not shown), a piezoelectric element portion 113, and an electrode portion 114. As the base member, a bar of a material having elasticity enough to vibrate in a predetermined mode by the stretching and contracting action of the piezoelectric element 113 is used. An insulating layer is coated on the surface of the base member, and the piezoelectric element portions 113 are disposed on the insulating layers disposed on the upper and lower surfaces thereof, respectively. The piezoelectric element unit 113 is composed of a single piezoelectric element layer, but is not limited thereto and may have a structure in which a plurality of piezoelectric element layers are stacked. The piezoelectric element portion 113 is disposed in both directions (upper and lower surface) of the base member, but is not limited thereto, and the piezoelectric element portion 113 may be disposed only in one surface direction of the base member. An electrode portion 114 for applying power to the piezoelectric element portion 113 is installed at an end portion of the piezoelectric element portion 113.

On the other hand, the support frame 120 has a rod shape, a pair of receiving portions 121 for receiving the vibration actuator 110 and facing each other is formed at both ends of the support frame 120. The receiving part 121 has a "c" shape, and the receiving part 121 is accommodated with the vibration actuator 110. On the inner side of the receiving portion 121, the connecting portion 121a is disposed to face each other, the connecting portion 121a has a configuration that is electrically connected to the electrode portion 114 of the vibration actuator 110. One end of the accommodating part 121 is provided with a first limiting part 121b for limiting the movement of the elastic member 130, and the inner part of the accommodating part 121 moves the electrode part 114 of the vibration actuator 110. The second limiting portion 121c is formed to limit the number of times. In addition, a circuit pattern 122 is formed in the support frame 120, and the circuit pattern 122 is mainly embedded in the support frame 120. A part of the circuit pattern 122 is configured to be electrically connected to the connecting portion 121a, and the other part of the circuit pattern 122 is configured to be electrically connected to the connecting portion 122a. The connection part 122a of the circuit pattern 122 is exposed to the outside of the support frame 120, and is configured to be electrically connected to an external circuit.

On the other hand, the elastic member 130 performs a function of electrically connecting the electrode portion 114a and the connecting portion 121a while elastically supporting the vibration actuator 110 to the receiving portion 121. To this end, the elastic member 130 is formed of a conductive material while being formed of a good elastic material, it is formed of a metallic material such as iron. A part of the elastic member 130 is formed by bending a part to have a "V" shape. That is, the elastic member 130 has a plate spring shape of which a portion is curved. Specifically, the elastic member 130 is composed of a first portion 131, a second portion 132, a third portion 133, the first portion 131 and the third portion 133 is in the form of a horizontal plate The second portion 132 has a curved shape. When a load is applied in the height (vertical) direction of the elastic member 160, the distance L between the first part 131 and the third part 133 increases and the height H decreases, mainly in the height direction. Elasticity will work. Therefore, the assembler deforms the shape from the original shape by slightly applying a load in the height direction to the elastic member 130, and arranges the elastic member 130 in the receiving portion 121 in the deformed state, thereby vibrating the actuator 110 Is elastically supported by the receiving portion 121. On the other hand, the first portion 131 of the elastic member 130 is installed so that the movement is limited by the first limiting portion (121c) of the receiving portion 121, the configuration is such that the vibration actuator 110 vibrates the elastic member Even if the 130 moves, the elastic member 130 is not separated from the receiving portion 121. The lower end portion of the second portion 132 of the elastic member 130 is disposed to contact the electrode portion 114, and the upper end portion of the third portion 133 is disposed to contact the connection portion 121a, thereby forming the electrode portion 114. And an electrical connection is made between the connecting portion 121a. According to one embodiment of the present invention, one elastic member 130 is disposed between each of the receiving portions 121 between the electrode portion 114 and the connecting portion 121a, but the present invention is not limited thereto. That is, according to the present invention, a plurality of elastic members may be disposed between the electrode portion 114 and the connection portion 121b. In addition, the elastic member 130 may not only be disposed between the electrode portion 114 and the connecting portion 121a, but may be further disposed between the electrode portion 114 and the connecting portion 121b.

On the other hand, the case 140 is configured to surround the support frame 120, and serves to protect the vibration actuator 110, etc. installed in the support frame 120. In FIG. 1, the case 140 has a shape surrounding only the top and bottom surfaces and one side of the support frame 120, but is not limited thereto. In FIG. 1, the vibration module 100 includes a case 140, but is not limited thereto and may not include the case.

The driver IC 200 receives the optimum driving frequency of the vibration actuator 110 from the outside and records the inside thereof, and drives the vibration actuator 110 at the optimum driving frequency recorded by a command of a host (not shown).

2 is a detailed view of the driver IC 200, which includes an interface unit 210, a register 220, a control logic 230, a nonvolatile memory 240, a timing controller 250, a boost controller 260, and a driver. And a switching unit 270 and a plurality of terminals.

Command terminal receives control command from host. The CS / EN terminal receives a signal for performing chip selection and enable of the driver IC 200. A signal for performing a reset of the driver IC 200 is applied to the RESET terminal. The waveform applied from the host is applied to the AUDIO / PWM terminal. The CLK terminal is clocked from the host. The VOP terminal outputs a positive (+, positive) voltage to the vibration actuator 110 and may be set up to n channels. The VON terminal outputs a negative voltage to the vibration actuator 110 and may be set up to n channels.

The interface unit 210 interfaces an object that controls the driver IC 200, that is, a signal received from the host through the command terminal to the register 210. In particular, the interface unit 210 separates valid information (address, impedance, frequency, phase, R, L, C data, etc.) from the signal received from the host.

The register 220 stores data for driving the vibrating actuator 110, and may be written / read. In the register of the conventional vibration module driver IC, an optimal driving frequency for driving the vibration actuator 110 is stored in the register, and when the power is not supplied, all data recorded in the register is initialized. However, in the present invention, the optimal driving frequency for driving the vibration actuator 110 is stored in the nonvolatile memory 240, so that it is not deleted even if power is not supplied.

The control logic 230 processes the data stored in the register 220 through the interface unit 210 according to a signal input to the CS / EN terminal, the AUDIO / PWM terminal, and / or the CLK terminal to drive the vibration actuator 110. Generate real data to make it work. In the present invention, the control logic 230 receives the optimal driving frequency for driving the vibration actuator 110 through the command terminal and stores in the nonvolatile memory 240. In the present invention, the optimum driving frequency for driving the vibration actuator 110 is measured and calculated by an external device (not shown) and transmitted to the control logic 230.

The nonvolatile memory 240 stores an optimal driving frequency for driving the vibration actuator 110 by the control logic 230. In the conventional vibration module driver IC, a driving frequency for driving the vibration actuator 110 is stored in a register, and when the power is not supplied, all data recorded in the register is initialized. However, in the present invention, the optimal driving frequency for driving the vibration actuator 110 is stored in the nonvolatile memory 240, and is not deleted even when power is not applied, and each vibration actuator can be driven at the optimum driving frequency. Will be.

The timing controller 250 is responsible for internal synchronization of the driver IC 200, and in particular, adjusts the timing of the driving frequency. The clock may be provided to the control logic 230 instead of the CLK terminal to handle internal synchronization.

The boost controller 260 is a power supply unit and generates a voltage for driving the vibration actuator 110.

The driver & switching unit 270 serves to switch the control logic 230 to read the driving frequency stored in the nonvolatile memory 240 and output the vibration frequency to the vibration actuator 110.

According to an exemplary embodiment of the present invention, the nonvolatile memory 240 in which the optimal driving frequency is stored is provided in the driver IC 200. However, the present invention is not limited thereto and is located outside the driver IC 200. The vibration actuator 110 may drive the vibration actuator 110 by reading an optimum driving frequency from the non-volatile memory 240 that is externally located every time it is driven.

Next, the operation of the vibration module driving method according to the present invention will be described with reference to FIG.

First, when a driving command is received from the host, the control logic 230 initializes the driver IC 200 (step 310).

When the initialization of the driver IC 200 is completed, the external device simulates the vibration actuator 110 by using the frequency control (step 320). Any driving frequency for driving the vibration actuator 110 may be sequentially reduced or simulated by sequentially increasing any driving frequency.

The external equipment measures the vibration force of the vibration actuator 110 generated during the simulation (step 330).

The external device calculates vibration force data according to the corresponding frequency based on the measured vibration force (step 340). The external device calculates the vibration force displacement data according to the resonance frequency as shown in FIG.

The external device evaluates the maximum value from the calculated vibration force displacement data (step 350), and transmits the maximum value to the control logic 230 through the command terminal.

The control logic 230 determines the maximum value received as the optimal driving frequency and records the optimal driving frequency in the nonvolatile memory 240 (step 360). The control logic 230 receives the vibration force signal according to the frequency as shown in FIG. 4 received from the external equipment and calculates the resonance frequency of the point where the displacement is the largest as the optimum driving frequency of the vibration actuator 110.

In operation 370, the control logic 230 reads the optimal driving frequency recorded in the nonvolatile memory 240 to determine whether the driving command is received from the host. ), And the driver & switching unit 270 drives the vibrating actuator 110 by outputting the optimum driving frequency to the VOP terminal and the VON terminal (step 380).

As a result, when the type of the vibration actuator 110 driving waveform is defined by the host at a specific frequency, the driver IC 200 has an offset function, and thus the vibration frequency may be different for each vibration actuator 110, but the vibration force is constant. . For example, each vibration module 100 may operate at a different frequency based on an internal optimization frequency even if the host commands a drive at a specific frequency or type, but maintains the vibration force to reduce the dispersion of force to achieve constant vibration. This is possible.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely an example, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Could be. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

100: vibration module 110: vibration actuator
120: support frame 121: receiving portion
200: driver IC 210: control logic
220: non-volatile memory

Claims (5)

A vibration module having at least one vibration actuator installed therein; And
Transmits the vibration force characteristic of the actuator to an external device, receives the optimum driving frequency of the actuator based on the characteristic from the external device, records it in an internal non-volatile memory, and drives the actuator at the recorded optimal driving frequency A driving means for discharging;
And the optimum driving frequency data recorded in the non-volatile memory is not deleted even when no power is supplied. delete The memory of claim 1, wherein the non-volatile memory is
Vibration module operating apparatus, characterized in that located outside the drive means accessible every time the actuator is driven. A method of operating a vibration module having at least one vibration actuator installed therein,
(a) simulating the actuator using an arbitrary frequency band in an external device;
(b) measuring the vibration force of the actuator in each of the arbitrary frequency bands in the simulation, and calculating an optimum driving frequency corresponding to the maximum value of the measured vibration force data;
(c) receiving the calculated optimum driving frequency from the external device; And
(d) writing the optimum driving frequency into a nonvolatile memory in which the optimum driving frequency data is not deleted even when no power is supplied;
Vibration module operating method comprising a. The method of claim 4, wherein after step (d),
and (e) driving the actuator at an optimal driving frequency recorded in the non-volatile memory when a driving command of a host is received.

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