KR101191976B1 - Uninterrupted chip bonding device that use series chip bondingyong variableness diameter roll for flexible embedded packaging - Google Patents

Abstract

The present invention relates to a continuous chip bonding apparatus using a variable diameter roll for continuous chip bonding for flexible embedded manufacturing, and has a variable diameter capable of continuously bonding a plurality of chips having various heights and widths in flexible embedded manufacturing. The present invention relates to a continuous chip bonding apparatus using a variable diameter roll for continuous chip bonding for flexible embedded fabrication capable of simultaneously performing chip placement and fast and stable bonding on a flexible substrate using the roll and the roll.
The clearance chip for continuous chip bonding for the flexible embedded manufacturing of the present invention for this purpose, the flexible substrate having a predetermined width and supplied in one direction; At least one chip mounted on a metal pad of the flexible substrate, the solder pump having a predetermined height and a predetermined width; A roller tank having a variable diameter mounted on the flexible substrate on which the chip is mounted to face up and down by pulling in and out; It consists of.

Description

Uninterrupted chip bonding device that use series chip bondingyong variableness diameter roll for flexible embedded packaging}

The present invention relates to a continuous chip bonding apparatus using a variable diameter roll for continuous chip bonding for flexible embedded manufacturing, and more particularly, to a plurality of ultra-compact chips having various heights and widths in flexible embedded manufacturing. Continuous chip using a variable diameter roll for continuous chip bonding for flexible chip fabrication and the rapid and stable bonding of microchips on a flexible substrate using rolls with variable diameters and corresponding rolls It relates to a bonding device.

With the recent miniaturization of small digital devices, high-density and ultra-thin structures are required for small digital devices. Furthermore, electronic devices and wearable PCs are required. Ultra-thin flexible electromagnetic plates are used in digital devices having flexibility, such as).

1 illustrates a cross-sectional view of a flexible electromagnetic plate.

The flexible electromagnetic plate is formed by stacking a plurality of flexible substrates on which chips are mounted, and the chips mounted on each flexible substrate are electrically connected to each other.

The conventional process sequence as described above is bonded to the substrate with the chip pad facing up in the chip placement process, the via hole for the electrical connection of the chip is processed using a laser, and the chip is electrically processed through metallization (Metallization) Will be connected.

In this method, since the chip is aligned, the via holes are processed to form an electrical connection structure of the chip, and thus the chip is easily aligned.

However, the conventional method as described above has a problem that productivity is lowered because many processes such as via hole formation, photoresist coating, and lithography are required by laser, and the continuous process is impossible due to the via hole formation and metal line formation processes. Have

In addition, since the chip used in the embedded packaging uses a thin chip having a thickness of about 50 to 150um, a flip chip using a conventional thermocompression process may cause reliability problems such as chip breakage. It has a structure that can only be bonded.

Therefore, there is a need for a supplementary measure to prevent the chip from breaking due to the thermocompression that puts high pressure on the chip.

An object of the present invention for solving the problems according to the prior art, a flexible substrate using a roll having a variable diameter capable of continuously bonding a plurality of microchips having various heights and widths in the flexible embedded manufacturing and the corresponding roll The present invention provides a continuous chip bonding apparatus using a variable-diameter roll for continuous chip bonding for flexible embedded fabrication capable of simultaneously performing ultra small chip placement and fast and stable bonding.

According to an aspect of the present invention, there is provided a continuous chip bonding apparatus using a variable diameter roll for continuous chip bonding for manufacturing a flexible embedded device, the flexible substrate having a predetermined width and supplied in one direction; At least one micro chip mounted on a metal pad of the flexible substrate, the solder pump having a predetermined height and a predetermined width; A roller tank having a variable diameter mounted on the flexible substrate having the microchip mounted thereon to draw in and out; Characterized in that consisting of.

Preferably, the flexible substrate is arranged in a row, characterized in that the metal pads having a plurality of different shapes are provided on the left and right sides so that the microchip can be accommodated.

Preferably, the roller tank is provided with a pair of roller tanks of an upper roller tank and a lower roller tank in a pair of up and down.

Preferably, the roller group is characterized in that the ultra-compact chip arrangement and bonding of the upper, lower roller group in accordance with the change in the thickness and width of the micro chip mounted on the flexible substrate.

Preferably, the roller tank is characterized by consisting of an upper roller tank having a variable diameter of a plurality of bonding shapes different in diameter and width.

Preferably, the roller tank is characterized in that the heating pipe is provided on the central rotation axis of the lower roller tank.

Preferably, the roller tank, when the microchip having solder bumps is placed on the flexible substrate and is introduced between the upper roller tank of the upper variable diameter and the lower roller tank of the lower side in which the heating pipe is embedded, only the portion where the microchip is located is selectively selected. It is characterized by intensive heating and pressing.

Preferably, chips are not pre-positioned on the flexible substrate, and chip arrays are supplied in their respective positions, and a plurality of chips are simultaneously formed by separating, placing, and bonding chips in a chip array. It is characterized in that the continuous placement and bonding on the flexible substrate.

As described above, the present invention provides a method of simultaneously arranging and bonding a chip on a flexible substrate by using a roll having a variable diameter capable of continuously bonding a plurality of chips having various heights and widths in the flexible embedded manufacturing process and a corresponding roll. There is a feat that can be done.

In addition, if the variable diameter roll is used, the chip having solder bumps is placed on the substrate, and when the chip is drawn between the upper variable diameter roll and the lower roll containing the heating pipe, only the portion where the chip is located is selectively concentrated and heated. There is an effect that can perform a chip bonding process.

1 is a cross-sectional view of a flexible electromagnetic plate
Figure 2 shows a continuous chip bonding apparatus by a roll having a variable diameter in accordance with the present invention.
Figure 3 is a side view showing a continuous chip bonding apparatus by a roll having a variable diameter in accordance with the present invention.
4 is a view showing the upper roller tank having a variable diameter according to the present invention.
5 is a view showing a state in which the microchip is mounted by a roll having a variable diameter according to the present invention.
Figure 6 shows another embodiment of a continuous chip bonding apparatus using a roll having a variable diameter in accordance with the present invention.

The present invention for achieving the above object,

A flexible substrate having a predetermined width and supplied in one direction;

At least one micro chip mounted on a metal pad of the flexible substrate, the solder pump having a predetermined height and a predetermined width;

A roller tank having a variable diameter mounted on the flexible substrate having the microchip mounted thereon to draw in and out; It was achieved by providing a continuous chip bonding apparatus using a variable diameter roll for continuous chip bonding for flexible embedded manufacturing, characterized in that consisting of.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, they can be replaced at the time of the present application It should be understood that there may be various equivalents and variations.

2 is a view showing a continuous chip bonding apparatus by a roll having a variable diameter according to the present invention.

As shown, a continuous chip bonding apparatus using a variable diameter roll according to the present invention and a roll having a variable diameter capable of continuously bonding a plurality of microchips 20 having various heights and widths in flexible embedded manufacturing and the corresponding By using the roll, the micro chip 20 may be disposed on the flexible substrate 10 and bonding may be performed quickly and stably.

Such a continuous chip bonding apparatus using the variable diameter roll is basically composed of a flexible substrate 10, a micro chip 20, and a roller bath 30 as shown in Figs.

The flexible substrate 10 has a predetermined width and is supplied in one direction.

The metal pad 12 provided on the flexible substrate 10 is for electrical connection between the micro chip 20 and the flexible substrate 10 and may be formed on the flexible substrate 10 through an electroplating process. .

In this case, the flexible substrate 10 is arranged in a row, and the metal pads 12 having a plurality of different shapes are provided on the left and right sides to accommodate the micro chip 20.

In addition, the solder pad 22 is provided on the metal pad 12 of the flexible substrate 10 to mount one or more microchips 20 having a predetermined height and a predetermined width.

The micro chip 20 is placed on the metal pad 12 using the chip mounting equipment 24 to attach the micro chip 20 to the metal pad 12 provided on the flexible substrate 10. .

As described above, in the case where the microchips 20 having different heights and widths are welded to the metal pads 12 using the chip mounting equipment 24, the microchips 20 are disposed so that the chip pads face the metal pads 12. By disposing the micro chip 20 and the metal pad 12 electrically, this eliminates the need to machine via holes in flexible embedded packaging, simplifying the process. Is generated. In other words, in the conventional flexible embedded packaging, the chip pad is bonded to the flexible substrate 10 so that the chip pad faces upward, so that the via hole processing and the metallization process are required in the subsequent process. No machining or metallization processes are required, which simplifies the process.

The roller bath 30 for bonding the flexible substrate 10 on which the microchip 20 is mounted may draw in and pull out the flexible substrate 10 in one direction.

At this time, the roller tank 30 is facing up and down, but the upper roller tank 32 located in the upper has a variable diameter.

That is, the upper roller group 32 constitutes a circular roll having different widths on both sides of the cylindrical body, as shown in FIGS. 3 and 4, and the wide portion bonds the wide micro chip 20. The other end of the narrow width bonds the narrow micro chip 20.

In addition, the upper roller group 32 comprises the some roll from which the width | variety differs.

The roller tank 30 has upper and lower brackets for supporting the upper and lower roller tanks 32 and 34, and the pair of roller tanks 30 are upper and lower roller tanks 32 and the lower roller tanks (up and down). It is formed by two sets of roller bath 30 of 34).

The upper and lower intervals of the upper and lower roller tanks 32 and 34 are adjusted according to the thickness of the micro chip 20 mounted on the flexible substrate 10.

Here, the roller tank 30 is provided with a heating pipe 36 on the central rotation axis of the lower roller tank 34.

In this way, the flexible substrate 10 mounted differently in height and width of the microchip 20 is inserted between the upper and lower roller baths 32 and 34, thereby quickly providing a plurality of microchips 20 having various heights and widths. ) Is continuously bonded.

The roller bath 30 simultaneously arranges and bonds the microchip 20 of the upper and lower roller baths 32 and 34 according to the variation in the thickness and width of the microchip 20 mounted on the flexible substrate 10. To do.

In summary, when the flexible embedded fabrication is performed, a roller tank 30 having a variable diameter capable of continuously bonding a plurality of microchips 20 having various heights and widths and a corresponding roll on the flexible substrate 10 may be used. The chip 20 may be disposed and bonded at the same time.

The roller tank 30 is composed of an upper roller tank 32 having a variable diameter of a plurality of bonding shapes different in diameter and width.

In addition, the variable diameter roller group 30 means a roll having a plurality of bonding shapes different in diameter and width, and the diameter and width of the shape are determined and bonded according to the geometry (height, width) of the chips to be bonded. The number of variable diameter shapes is determined by the number of microchips 20.

The roller tank 30 is provided with a heating pipe 36 on the central rotation axis of the lower roller tank 34.

Here, the microchip 20 is bonded to the flexible substrate 10 by the heating pipe 36 of the lower roller bath 34 that heats the microchip 20 and the flexible substrate 10. In order to enable bonding of the micro chip 20, the chip is heated and pressed using a roller heated to a set temperature.

At this time, the appropriate heating temperature of the roller tank 30 is 150-300 degreeC.

On the other hand, the heating pipe 36 is installed so as to pass through the rotation axis of the lower roller tank 34 to the interior of the lower roller tank 34 to heat the heat at a fixed position irrespective of the rotation of the lower roller tank 34 The heating pipe 34 may be configured to dissipate heat by a built-in heating wire to dissipate heat by resistance of electricity or by receiving a heated heating medium from an external heat source such as a boiler.

On the other hand, the roller tank 30 has a solder bump 22, but the micro chip 20 having various heights and widths is disposed on the flexible substrate 10 and the upper roller tank 32 of the upper variable diameter and When the heating pipe 36 is drawn between the lower roller tank 34 on the lower side, only the portion where the microchip 20 is located is selectively concentrated and heated and compressed.

On the other hand, as shown in FIG. 6, when chips are not disposed on the flexible substrate 10 and the chip arrays 40 are supplied to their respective positions, the chips are separated and disposed in the chip array 40. As the variable diameter rolls may simultaneously perform bonding, a plurality of microchips 20 are continuously disposed on the flexible substrate 10 and bonded.

A plurality of chip arrays 40 are pulled into and out of the flexible substrate 10 on which the microchips 20 are mounted.

At this time, the roller tank 30 is facing up and down, but the upper roller tank 32 located in the upper has a variable diameter.

Each of the chip arrays 40 having the micro chip 20 having different shapes as the flexible substrate 10 is inserted between the roller tanks 30 is formed by the upper and lower roller tanks 32 and 34. The microchip 20 having different heights and thicknesses is mounted on the flexible substrate by intensive heating and compression while being introduced into the roller bath 30 together with the substrate 10.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Various modifications and variations are possible within the scope of the appended claims.

10: flexible board 12: metal pad
20: Micro chip 22: Solder pump
24: chip mounting equipment 30: roller
32: upper roller tank 34: lower roller tank
36: heating pipe

Claims (8)

A flexible substrate having a predetermined width and supplied in one direction, at least one chip having a predetermined height and a predetermined width having a solder pump mounted on a metal pad of the flexible substrate, and having the chip mounted thereon In the continuous chip bonding apparatus which uses the variable diameter roll for continuous chip bonding for flexible embedded manufacture which consists of the roller tank which has the variable diameter mounted up and down by drawing this draw-in and drawing-out,
The roller tank is composed of two pairs of roller tanks, the upper roller and the lower roller, and a pair of upper and lower rollers. The part bonds a wide chip, the other end narrows a narrow chip, and simultaneously arranges and bonds chips of the upper and lower rollers according to the variation of the thickness and width of the chip mounted on the flexible substrate. Do it,
The chips are not pre-positioned on the flexible substrate, and the chip arrays are supplied to their respective positions, and the variable diameter rolls perform the separation, placement, and bonding of the chips in the chip array simultaneously so that a plurality of chips are placed on the flexible substrate. The gap compensation device for continuous chip bonding for flexible embedded manufacturing, characterized in that the continuous placement and bonding on.
The method of claim 1,
The flexible substrate,
The gap compensation device for continuous chip bonding for flexible embedded manufacturing, characterized in that the metal pads having a plurality of different shapes are arranged on the left and right sides so as to accommodate the chips.
delete delete delete The method of claim 1,
The roller tank,
Spacer compensator for continuous chip bonding for flexible embedded manufacturing, characterized in that the heating pipe is provided on the central rotation axis of the lower roller tank.
The method of claim 1,
The roller tank,
When the chip with solder bumps is placed on the flexible substrate and then introduced between the upper roller tank of the upper variable diameter and the lower roller tank of the lower side in which the heating pipe is embedded, only the portion where the chip is positioned is selectively concentrated and pressed. Gap compensator for continuous chip bonding for flexible embedded manufacturing.

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