KR101173391B1 - Pushing apparatus for testing a semiconductor device and test handler including the same - Google Patents

Abstract

The pushing mechanism for testing a semiconductor device includes a plate, at least one pusher block and at least one connection block. The plate is mounted with a drive substrate having a socket. The pusher block is mounted to the plate so as to face the insert containing the semiconductor element of the test tray, and includes a pushing unit for pushing the semiconductor element to the test terminal of the test apparatus and a heating unit for heating the semiconductor element. The connection block is mounted to the pusher block and has a plug that protrudes to be inserted into the socket when the pusher block is mounted to the plate while in electrical connection with the heating portion.

Description

PUSHING APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE AND TEST HANDLER INCLUDING THE SAME}

The present invention relates to a pushing mechanism for testing a semiconductor device and a test handler including the same, and more particularly, to a pushing mechanism for pushing and connecting a semiconductor device to a test device of a test apparatus and a test handler including the same.

In general, a semiconductor device is one of electronic components having a structure in which chips are connected on a substrate. The semiconductor device may include, for example, a memory device such as DRAM, SRAM, or the like.

The semiconductor device is manufactured based on a wafer made of a thin single crystal substrate made of silicon. In detail, the semiconductor device may include a fab process for forming a plurality of chips patterned with a circuit pattern on the wafer, a bonding process for electrically connecting each of the chips formed in the fab process to each of the substrates, and a chip connected to the substrate. It is manufactured by performing a molding process or the like to protect it from the outside. The semiconductor devices thus manufactured are subjected to a separate test process to check their electrical functions.

In this case, the test process is substantially performed through a test device for performing a test on the semiconductor devices and a test handler for connecting the semiconductor devices to the test device.

The test handler is connected to the inner chamber provided with the semiconductor elements stored in each of the inserts of the test tray and the inner chamber, and provides a space for performing the test by receiving the test tray from the inner chamber. The test device includes a test chamber in which the test device is docked.

At this time, a pushing mechanism such as a match plate is disposed in the test chamber to push the semiconductor elements to each of the test terminals of the test apparatus stably.

The pushing mechanism is connected to a heater or cooling line formed therein and a power terminal or cooling line exposed to the outside to supply driving power to the heater such that a heating test or a cooling test is performed at the same place on the semiconductor devices. A fitting exposed to the outside of the furnace.

Thus, whenever a new installation of the pushing mechanism or a replacement of the installed pushing mechanism is required, the operator must directly connect the power terminal or the fitting to the power supply and the gas supply device individually, which may be inconvenient.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pushing mechanism for testing a semiconductor device, in which a connecting part such as a power supply terminal or a cooling line is automatically connected without a separate operation by an operator when newly installed or replaced.

It is another object of the present invention to provide a test handler comprising the pushing mechanism described above.

In order to achieve the above object of the present invention, a pushing mechanism for testing a semiconductor device according to one aspect includes a plate, at least one pusher block and at least one connection block.

The plate is mounted with a drive substrate having a socket. The pusher block is mounted to the plate so as to face an insert containing the semiconductor element of a test tray, and includes a pushing unit for pushing the semiconductor element to a test terminal of a test apparatus and a heating unit for heating the semiconductor element.

The connection block is mounted to the pusher block and has a plug that protrudes to be inserted into the socket when the pusher block is mounted to the plate in an electrically connected state with the heating portion.

In this case, the connection block may include a gas inlet through which a cooling gas for supplying the pusher block is introduced from the outside.

In addition, the connection block may be mounted between the pusher block and the elastic body. In this case, the pushing mechanism may be connected to the gas inlet and the pusher block through a flexible hose.

On the other hand, the pushing mechanism is mounted on the plate while the cooling gas is supplied from the outside, and when the pusher block is mounted on the plate, the inlet of the gas inlet and the inlet to supply the cooling gas to the gas inlet; It may further include a gas supply block having at least one supply port that is in close contact.

Thus, the gas supply block may have a plurality of supply ports connected to each of the inlets of the gas inlets of the plurality of connection blocks according to the plurality of pusher blocks. In addition, the pushing mechanism may further include a sealing member for sealing between the inlet and the supply port.

In addition, the connection block and the plate may be aligned with each other through the coupling of the pin and the hole.

The pusher block may further include a sensor electrically connected to the plug while sensing the temperature of the semiconductor portion.

In order to achieve the above object of the present invention, a pushing mechanism for testing a semiconductor device according to another aspect includes a plate, at least one pusher block and a gas supply block.

The pusher block is mounted to the plate so as to face an insert containing the semiconductor element of the test tray, and includes a pushing unit for pushing the semiconductor element to a test terminal of the test apparatus.

The gas supply block is mounted to the plate in a state in which cooling gas is supplied from the outside, and when the pusher block is mounted to the plate, at least one gas supply block is connected to the pusher block to supply the cooling gas to the pusher block. It has a supply port.

Accordingly, the pushing mechanism may further include a connection block mounted to the pusher block and having a gas inlet connected closely to the supply port through an inlet when the pusher block is mounted to the plate.

In order to achieve the other object of the present invention described above, a test handler according to one aspect includes a core chamber, a test chamber and a pushing mechanism.

The inner chamber is provided with a test tray equipped with inserts accommodating each of the plurality of semiconductor devices, and is connected to a cooling device to provide a space for cooling the semiconductor devices.

The test chamber is connected to the inner chamber to receive the test tray, and a test apparatus for testing the semiconductor devices is docked from the outside.

The pushing mechanism is disposed in the test chamber and pushes the semiconductor elements to the test terminals to connect each of the semiconductor elements to each of the test terminals of the test apparatus.

Accordingly, the pushing mechanism is mounted on the plate to face the test tray transferred to the test chamber, the plate having a driving substrate having a socket, the inserts facing each of the inserts, and each of the semiconductor elements respectively connected to the test terminals. A pusher block including a pushing unit for pushing the heat sink and a heating unit for heating each of the semiconductor devices, and the socket when the pusher block is mounted to the plate in an electrically connected state with the heating unit. It may include a connection block having a plug protruding to be inserted into.

According to the pushing mechanism for a semiconductor test and a test handler including the same, when the pusher block having a heating part is mounted on a plate, a plug electrically connected to the heating part is mounted on the plate through a connection block mounted to the pusher block. New installation or replacement of the pushing mechanism by allowing the gas inlet of the connection block and the gas supply block mounted on the plate to be automatically contacted with the cooling gas supplied from the outside while being automatically inserted into the socket of the driving board. The assembly can be done easily each time.

As such, as the work time for assembling and detaching the pushing mechanism is shortened, productivity can be expected to be improved by efficiently performing a test process for the semiconductor devices.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.
FIG. 2 is a perspective view schematically showing a pushing mechanism of the test handler shown in FIG. 1.
3 is a perspective view illustrating a structure in which the pusher block of the pushing mechanism illustrated in FIG. 2 is partially separated.
4 is a view from above of the pushing mechanism shown in FIG. 2;
5 is a cross-sectional view taken along the line II ′ of FIG. 3.
FIG. 6 is a perspective view illustrating a structure in which the pusher block illustrated in FIG. 3 is connected to a driving substrate and a gas supply block.
FIG. 7 is a view illustrating a pushing unit and a heating unit of the pusher block illustrated in FIG. 5 in detail.
8 is a perspective view illustrating in detail the driving substrate shown in FIG. 6.
FIG. 9 is a perspective view showing in detail the gas supply block shown in FIG. 6.
FIG. 10 is a view illustrating a structure in which cooling gas is dispersed in the pusher block illustrated in FIG. 6.

Hereinafter, a pushing mechanism for testing a semiconductor device and a test handler including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.

Referring to FIG. 1, a test handler 1000 according to an embodiment of the present invention may include a loading stacker 100, a loading unit 200, an inner chamber 300, a test chamber 400, and a pushing mechanism 500. The desorption chamber 600, the unloading part 700, the sorting buffer part 800, and the unloading stacker 900 are included.

A plurality of first customer trays CT1 are disposed in the loading stacker 100. A plurality of semiconductor devices SD are accommodated in the first customer trays CT1 at first intervals.

The test tray TT is disposed in a horizontal state in the loading unit 200. In the test tray TT, the semiconductor devices SD transferred from the first customer trays CT1 are loaded and received at second intervals.

Accordingly, the test handler 1000 may load the picker 150 to change the semiconductor device SD from the first interval to the second interval between the loading stacker 100 and the loading unit 200. It may further include.

The inner chamber 300 is connected to the loading unit 200. The test tray TT may be transferred to the inner chamber 300 by being converted from a horizontal state to a vertical position from the loading unit 200.

The inner chamber 300 is connected to the cooling device 20 to cool the inside. Thus, the inner chamber 300 provides a space for cooling the semiconductor elements SD stored in the test tray TT to a predetermined temperature, for example, about −5 ° C. In this case, the cooling device 20 may be installed outside the inner chamber 300 to provide a cooling gas into the inner chamber 300 or may be directly installed in the inner chamber 300.

The test chamber 400 is connected to the inner chamber 300 to receive a test tray TT from the inner chamber 300. The test chamber 400 provides a space for substantially testing the semiconductor devices SD. Accordingly, a test device 30 for docking the semiconductor device SD is substantially docked on one side of the test chamber 400.

The pushing mechanism 500 is disposed inside the test chamber 400. The pushing mechanism 500 pushes the semiconductor devices SD stored in the test tray TT to be connected to the test device 30.

Hereinafter, the pushing mechanism 500 will be described in more detail with reference to FIGS. 2 to 10.

FIG. 2 is a perspective view schematically showing a pushing mechanism of the test handler shown in FIG. 1, FIG. 3 is a perspective view showing a structure in which the pusher block of the pushing mechanism shown in FIG. 2 is partially separated, and FIG. 4 is shown in FIG. 2. It is a view seen from above of the pushed mechanism.

Referring further to FIGS. 2-4, the pushing mechanism 500 includes a plate 510, a plurality of pusher blocks 520 and a plurality of connecting blocks 560.

The plate 510 is disposed to face the test tray TT transferred to the test chamber. In this case, each of the semiconductor devices SD is fixed to each of a plurality of inserts (not shown) of the test tray TT, and the plate 510 is provided with a mounting hole 512 corresponding to the inserts. Can be. Here, each insert may be formed of a predetermined number, for example, four into one to form the insert block 40.

The plate 510 is mounted with a driving substrate 514 at a portion opposite to the insert block 40. The driving substrate 514 is electrically connected to an external power supply device (not shown) to receive driving power.

Each of the pusher blocks 520 is mounted to the plate 510 to face the insert block 40. In detail, the pusher block 520 may be mounted to the mounting hole 512 to be mounted so that a part of the pusher block 520 facing the insert block 40 is exposed to the outside.

The pusher block 520 includes at least one pushing portion 530 that protrudes to push the semiconductor element SD stored in the insert and to be connected to the test terminal 32 of the test apparatus 30. . Thus, the pusher block 520 may include four pushers 530 having a size similar to that of the insert block 40 when four inserts are configured as one to form the insert block 40. have. In this case, the pusher block 520 is coupled to the insert block 40 to push the semiconductor devices SD through the pushing parts 530.

The test device 30 is a test board in which a plurality of test terminals 32 are formed while facing the test tray TT to collectively inspect the semiconductor devices SD stored in the test tray TT. 34 may be included. In addition, a high fix board (not shown) may be disposed between the test board 34 and the test tray TT to guide electrical connection of the semiconductor devices SD according to the types of the semiconductor devices SD. Can be.

In addition, the pusher block 520 may have an alignment protrusion 522 at an edge thereof so that the pushing unit 530 correctly pushes the semiconductor device SD, and thus the insert block 40 has the alignment block. The protrusion 522 may have an alignment hole 42 inserted into and coupled to the protrusion 522.

In addition, the pusher block 520 is opposite to the insert block 40 so that the pusher 530 pushes the semiconductor device SD so that an excessive force is applied so that the semiconductor device SD is not damaged. An elastic body 570 such as a compression spring may be installed at the site.

Accordingly, the pushing unit 530 of the pushing mechanism 500 pushes the semiconductor element SD cooled in the inner chamber into contact with the test terminal 32, thereby first targeting the semiconductor element SD. Cooling test can be performed.

FIG. 6 is a perspective view illustrating a structure in which the pusher block illustrated in FIG. 3 is connected to a driving substrate and a gas supply block. FIG. 7 is a view illustrating a pushing portion and a heating portion of the pusher block illustrated in FIG. 5 in detail. FIG. 6 is a perspective view illustrating the driving substrate illustrated in FIG. 6 in detail.

6 to 8, the pusher block 520 may include at least one heating unit 540 that heats the semiconductor device SD when the pusher 530 pushes the semiconductor device SD. More).

The heating unit 540 is installed at a portion of the pushing unit 530 in contact with the semiconductor element SD. In detail, the pushing part 530 has a through hole 532 at the center thereof, and the heating part 540 has a structure inserted into the through hole 532 from a portion in contact with the semiconductor element SD. . Accordingly, the pusher block 520 includes the same number of heating parts 540 as the number of the pushing parts 530.

The heating part 540 receives driving power from the through hole 532 through a power terminal 542 extending outwardly in the direction of the plate 510 and the pushing part 530 receives the semiconductor device SD. ) Is heated in direct contact with the semiconductor element SD when pushing.

Accordingly, each of the semiconductor devices SD that have undergone the cooling test is heated by the heating unit 540 to be in contact with the test terminal 32 by the pushing unit 530 again, so that the heating test is performed. Can be performed.

Each of the connection blocks 560 is mounted between the plate 510 and the pusher blocks 520 to each of the pusher blocks 520 with the elastic body 570 therebetween. Thus, the distance between the connection block 560 and the pusher block 520 may be adjusted by the elastic body 570.

The connection block 560 includes a plug 562 protruding in a direction opposite to the elastic body 570 in a state of being electrically connected to the power terminal 542. In this case, when the pusher block 520 includes four pushing parts 530, the plug 562 is connected to the power supply terminals 542 of the pushing parts 530 in a power circuit board 523. ) Can be connected. In addition, since the distance between the connection block 560 and the pusher block 520 is adjusted by the elastic body 570, the plug 562 is the power circuit board 523 through the flexible wire 563. It can be connected with.

The plug 562 is automatically inserted and connected to the socket 515 of the driving substrate 514 when the pusher block 520 is mounted to the plate 510, thereby supplying driving power to the heating unit 540. The separate connection work of the operator for supply can be eliminated.

At this time, in order for the plug 562 to be accurately inserted into the socket 515, the connection block 560 and the plate 510 are positioned at each other through the coupling of the pin 564 and the hole 516. Can be aligned.

As such, by simply assembling the pusher block 520 having the heating part 540 to the plate 510, the pusher block 520 is replaced or the pushing mechanism 500 is newly manufactured. This can be done efficiently by reducing the time required to do this. As a result, productivity improvement of the process of testing the semiconductor devices SD may be expected.

In addition, the pusher block 520 may further include a sensor 550 for sensing the heating temperature by the heating unit 540 to control the heating unit 540. In this case, the sensor 550 may be electrically connected to the plug 562 to transmit the sensing temperature to an external control device through the driving substrate 514 to which the plug 562 is connected. Accordingly, the sensor 550 may also be automatically connected to the control device through one assembly operation of mounting the pusher block 520 on the plate 510.

After the heating test is performed on the semiconductor device SD as described above, the heating unit 540 of the pusher block 520 is moved to rapidly perform the cooling test on the other semiconductor device SD cooled in the inner chamber. There is a need to cool rapidly.

FIG. 9 is a detailed perspective view illustrating the gas supply block illustrated in FIG. 6, and FIG. 10 is a view illustrating a structure in which cooling gas is dispersed in the pusher block illustrated in FIG. 6.

9 and 10, the pusher block 520 is formed with a channel 526 through which the cooling gas CG provided from the outside flows around the heating part 540.

In this case, when the pusher block 520 has four pushing parts 530, the center portion 527 connecting the channels 526 of the four heating parts 540 to the center of the pusher block 520 is connected to the center of the pusher block 520. The cooling gas CG may be distributed and supplied from the central portion 527 to the channels 526.

Meanwhile, the pushing mechanism 500 further includes a gas supply block 580 mounted to the plate 510. In detail, the gas supply block 580 may be mounted to the plate 510 such that a part of the gas supply block 580 is exposed to a portion on which the pusher block 520 is mounted.

Accordingly, the plate 510 is provided with a gas supply plate equipped with a plurality of first fittings 519 connected through a gas supply device (not shown) for generating external cooling gas (CG) and an air hose (not shown). 518 is mounted and the gas supply block 580 includes a first fitting 519 and a second fitting 582 connected through an air hose (not shown). As a result, the gas supply block 580 may always maintain the state in which the cooling gas CG is supplied.

Thus, the gas supply block 580 is at least one supply for discharging the supplied cooling gas (CG) to the site where the pusher block 520 is mounted, specifically, the site where the connection block 560 is mounted. Has a sphere 584.

In this case, the gas supply block 580 may not be mounted to the plate 510 at a portion where the supply holes 584 are formed, and thus the mounting portion 586 protrudes in a wing shape and is mounted to the plate 510. It may be included separately.

Meanwhile, the connection block 560 includes a gas inlet 565 having an inlet 566 at a position where the pusher block 520 is in contact with the supply port 584 when the pusher block 520 is mounted to the plate 510. do. The gas inlet 565 is connected to the central portion 527 of the pusher block 520. In this case, since the gap between the connection block 560 and the pusher block 520 may be adjusted by the elastic body 570, the gas inlet 565 and the central portion 527 are flexible hoses 567. ) Can be connected.

When the pusher block 520 is mounted to the plate 510 according to the above configuration, the supply port 584 and the gas inflow of the gas supply block 580 in the state where the cooling gas CG is supplied. While the inlet 566 of the part 565 contacts each other, the cooling gas CG discharged from the supply port 584 passes through the central portion 527 connected through the gas inlet 565 and the hose 567. It may be supplied to the channel 526 formed around the heating unit 540.

At this time, the supply port 584 of the gas supply block 580 is mounted between the connection block 560 and the pusher block 520 when the pusher block 520 is mounted to the plate 510. Since the elastic body 570 is in close contact with the inlet 566 of the gas inlet 565, leakage of the cooling gas CG may be primarily prevented.

Accordingly, the sealing member 590 may be additionally installed between the supply port 584 and the inlet 566 to prevent secondary leakage of the cooling gas CG. In this case, the sealing member 590 may be made of a material having its own elasticity, such as rubber, silicon, or viton.

In addition, the sealing member 590 may have a gasket structure so as not to affect the coupling of the gas supply block 580 and the connection block 560 by its thickness. Alternatively, a groove into which the sealing member 590 may be inserted may be formed around the supply part or the inlet 566 of any one of the gas supply block 580 and the connection block 560.

As described above, the cooling gas CG is automatically supplied to the channel 526 of the pusher block 520 only by mounting the pusher block 520 on the plate 510. ) Can be simply configured without additional connection work. As a result, the test process of the semiconductor device SD may be further improved.

On the other hand, since the gas supply block 580 is provided with a plurality of pusher blocks 520 substantially on the plate 510, the gas supply block 580 supplies the cooling gas CG to a predetermined number of pusher blocks 520. It may have a plurality of supply ports 584 that are in close contact with the inlets 566 of the connection blocks 560. In this case, by reducing the number of the gas supply block 580, it can be expected to reduce the manufacturing cost accordingly.

The dichroic chamber 600 is connected to the test chamber 400. The test tray TT loaded with the semiconductor devices SD that have undergone the test process is transferred to the desorption chamber 600. In the dichroic chamber 600, the semiconductor elements SD that are cooled in the genus chamber 300 and then heated in the heating unit 550 are restored to room temperature.

The unloading part 700 is connected to the desorption chamber 600. The test tray TT, in which the semiconductor devices SD at a room temperature, are stored, is transferred from the desorption chamber 600 to the unloading unit 700. In this case, the test tray TT may be switched to a horizontal state again. In the unloading unit 700, the semiconductor devices SD are separated from the test tray TT.

The sorting buffer unit 800 is connected to the unloading unit 700. A plurality of sorting tables 810 may be installed in the sorting buffer unit 800 to classify and position the semiconductor elements SD according to a result of a cooling test and a heating test in the test chamber 400. . In this case, the semiconductor devices SD are received at the second intervals in the sorting tables 810.

In the unloading stacker 900, a plurality of second customer trays CT2 divided by grades are disposed. In the second customer trays CT2, the semiconductor devices SD received from the sorting buffer unit 800 at the second interval are classified according to grades and stored at the first interval.

Accordingly, the test handler 1000 may change the semiconductor device SD from the second interval to the first interval between the sorting buffer unit 800 and the unloading stacker 900. 850 may be further included.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

SD: Semiconductor Device TT: Test Tray
20: cooling device 30: test device
100: loading stacker 150: loading picker
200: loading unit 300: the inner chamber
400: test chamber 500: pushing mechanism
510: plate 514: driving substrate
515: socket 520: pusher block
530: pushing unit 540: heating unit
550 sensor 560 connection block
562: plug 565: gas inlet
566: inlet 567: hose
570: elastomer 580: gas supply block
584: supply port 590: sealing member
600: Dichroic chamber 700: Unloading part
800: sorting buffer unit 900: unloading stacker
1000: test handler

Claims (13)

A test tray provided with inserts accommodating each of the plurality of semiconductor devices, the inner chamber being connected to a cooling device to provide a space for cooling the semiconductor devices;
A test chamber connected to the inner chamber to receive the test tray and to which a test device for testing the semiconductor devices is docked from the outside; And
A pushing mechanism disposed in the test chamber, for pushing the semiconductor elements to the test terminals to connect each of the semiconductor elements to each of the test terminals of the test apparatus;
The pushing mechanism,
A plate mounted with a drive substrate having a socket facing the test tray transferred to the test chamber;
At least one pusher block mounted on the plate so as to face each of the inserts, the pusher block including a pushing unit for pushing each of the semiconductor elements to the test terminals and a heating unit for heating each of the semiconductor elements; And
A test handler mounted to the pusher block, the test handler including at least one connection block having a plug protruding to be inserted into the socket when the pusher block is mounted to the plate while being electrically connected to the heating unit; . The test handler of claim 1, wherein the connection block comprises a gas inlet through which cooling gas for supplying the pusher block is introduced from the outside. The test handler of claim 2, wherein the gas inlet and the pusher block are connected via a flexible hose. According to claim 2, wherein the cooling gas is supplied from the outside, at least one supply in close contact with the inlet of the gas inlet for supplying the cooling gas to the gas inlet when the pusher block is mounted to the plate And a gas supply block having a sphere. 5. A test handler according to claim 4, wherein the gas supply block has a plurality of feed ports connected to each of the inlets of the gas inlets of the plurality of connection blocks according to the plurality of pusher blocks. The test handler according to claim 4, further comprising a sealing member for sealing between the inlet and the supply port. The test handler of claim 1, wherein the connection block and the plate are aligned with each other through coupling of a pin and a hole. The test handler of claim 1, wherein the pusher block further comprises a sensor electrically connected to the plug while sensing a temperature of the semiconductor device portion. A test tray provided with inserts accommodating each of the plurality of semiconductor devices, the inner chamber being connected to a cooling device to provide a space for cooling the semiconductor devices;
A test chamber connected to the inner chamber to receive the test tray and to which a test device for testing the semiconductor devices is docked from the outside; And
A pushing mechanism disposed in the test chamber, for pushing the semiconductor elements to the test terminals to connect each of the semiconductor elements to each of the test terminals of the test apparatus;
The pushing mechanism
A plate facing the test tray transferred to the test chamber;
At least one pusher block mounted to the plate so as to face each of the inserts, the at least one pusher block including a pushing unit to push each of the semiconductor devices to each of the test terminals; And
And a gas supply block having at least one supply port supplied from the outside with the pusher block in contact with the pusher block when the pusher block is mounted to the plate to supply the cooling gas to the pusher block. Test handler. 10. The test handler of claim 9, further comprising a connection block mounted to the pusher block, the connection block having a gas inlet intimately connected to the supply port through an inlet when the pusher block is mounted to the plate. The test handler of claim 10, wherein the gas inlet and the pusher block are connected via a flexible hose. 11. The test handler of claim 10 wherein the gas supply block has a plurality of feed ports connected to each of the inlets of the plurality of pusher blocks. delete

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