KR101142939B1 - Luminous Device - Google Patents

Abstract

An object of the present invention is to connect and use one or more LED chips in which a full-wave rectifying circuit and a plurality of light emitting cells are connected in series in one package to an AC power source.

The AC LED according to the present invention includes an LED chip electrically connected to a body and a plurality of light emitting cells mounted on the body, and a bridge rectifier circuit part and / or a resistor mounted adjacent to the LED chip in the body and electrically connected thereto. Or PTC.

LED chip, full-wave rectifier circuit, charge capacitor, discharge resistor

Description

Light emitting device

1 is a circuit diagram of a conventional AC light emitting device.

2 is a circuit diagram of a light emitting device according to a first embodiment of the present invention.

3 is a perspective view of a light emitting device according to a first embodiment of the present invention;

4 is a view for explaining a resistance according to the first embodiment of the present invention;

5 is a view for explaining a rectifying unit according to a first embodiment of the present invention.

6 is a perspective view of a light emitting device according to a second embodiment of the present invention;

7 is a view for explaining a resistance member according to a second embodiment of the present invention.

8 is a circuit diagram of a light emitting device according to a third embodiment of the present invention.

9 is a perspective view of a light emitting device according to a third embodiment of the present invention;

Description of the Related Art

1 power conversion unit 2 light emitting unit

3: full-wave rectifier circuit 4, 200: bridge portion

100: LED chip 210, 220: rectifier

230, 240: resistance member

The present invention relates to an AC light emitting device using one or more LED chips connected in series with a full-wave rectifying circuit and a plurality of light emitting cells in one package to an AC power source.

A light emitting diode (LED) refers to a device that generates a small number of carriers (electrons or holes) injected using a P-N junction structure of a compound semiconductor, and emits predetermined light by recombination thereof. Such light emitting diodes have been used as display devices and backlights, and researches for applying them to general lighting applications have recently been actively conducted.

This light emitting device using a light emitting diode is less than the conventional light bulb or fluorescent lamp, power consumption is several to several tens of times, it is superior in terms of power consumption reduction and durability.

In general, in order to use a light emitting diode for lighting, a light emitting device is formed through a separate packaging process, a plurality of individual light emitting devices are connected in series through wire bonding, and a protective circuit and an AC / DC converter are installed from the outside. Made in the form of a lamp.

1 is a conceptual diagram of a conventional AC light emitting device, in which a power converter 1 for converting AC power into DC power and a light emitting part 2 in which a plurality of LEDs 10-1 to 10-n are connected in series; It includes.

The power converter 1 includes a full-wave rectifier circuit 3 for full-wave rectification of AC 220V or 110V, and a resistor R1 for voltage dropping the full-wave rectified power source. The full-wave rectifying circuit 3 includes first to fourth diodes D1 to D4 respectively connected between the first to fourth nodes N1 to N4, and the first node N1 and the third node N3. ) Includes a bridge portion 4 connected to an AC power supply, and a capacitor C1 connected to a second node N2 and a fourth node N4 of the bridge portion 4. The apparatus further includes a voltage drop capacitor connected between the external power supply and the first node N1.

In the light emitting part 2, the first to nth LEDs 10-1 to 10-n are connected in series between the resistor R1 and the second node N2 through a wire. Where n is an integer. Conventionally, about 20 LEDs are connected in series to form a light emitting unit. When about 20 LEDs are connected in series like this, 10 ~ 20mA current and 3.4 × 20 = 68V voltage are required to emit them. Therefore, the AC power input from the outside is converted into the DC power by the power conversion unit 1, and the contact level is converted to a predetermined level and applied to the light emitting unit 2 to emit light.

In such a conventional light emitting device, the power conversion unit 1 is configured on a first printed circuit board. The individual LEDs of the light emitting portion 2 are also mounted on the second printed circuit board and then connected in series via wires. Subsequently, the light emitting device was implemented by electrically connecting the first and second printed circuit boards.

However, the capacitor in the power conversion unit provided to drop the AC of 220V to the required voltage has a shorter life than the LED, which shortens the overall life of the light emitting device.

In addition, since the resistance for the voltage drop of the AC power supply of 220V is located between the light emitting device and the power supply, a separate connection node exists between the light emitting device and the power supply, so that the connection between them may become unstable, and the node itself may have There is a problem that the overall resistance value can be changed by the resistance value.

 In addition, when there are a plurality of LEDs connected in series, a connection board for connecting each LED is required, which increases the cost of connecting each LED in series. For example, if the number of LEDs is 20, at least 19 wires are also used to connect them.

In addition, each LED provided in the connection board has a limit in implementing a high quality light source by increasing the light emitting area.

Moreover, the simple linear arrangement between the light emitting elements causes the manufacturing cost to increase when the number of LEDs is increased to increase the light emitting efficiency.

Therefore, in order to solve the above problems, the present invention manufactures an LED chip in which a plurality of light emitting cells are connected at the wafer level, connects the LED chip and the rectifier circuit, and inserts a resistor into the device to make the device look and manufacture. It is an object of the present invention to provide a light emitting device which can simplify the process, reduce manufacturing cost and defective rate, and is advantageous for mass production.

A body according to the present invention, an LED chip electrically connected to a plurality of light emitting cells mounted on a heat sink of the body, a rectifying unit electrically connected to the LED chip, and electrically connected to the rectifying unit adjacent to the LED chip. A light emitting device including at least one resistance member connected thereto and a plurality of internal electrode terminals connected to the resistance member is provided.

In addition, the body according to the present invention, an AC LED chip mounted on the heat sink of the body, the cell blocks including a plurality of light emitting cells are connected in parallel, at least mounted inside the body and connected to the AC LED chip Provided is a light emitting device including one or more resistance members and a plurality of internal electrode terminals connected to the resistance members.

The rectifier includes a first rectifier mounted with a first diode and a fourth diode, and a second rectifier mounted with a second diode and a third diode. Here, the first resistor member is connected between the first rectifying unit and one internal electrode terminal, and the second resistor member is connected between the second rectifying unit and another internal electrode terminal.

And a first resistor member connected between the first pad of the AC LED chip and one internal electrode terminal, and a second resistor member connected between the second pad of the AC LED chip and the other internal electrode terminal.

The above includes a first resistance member connected on the first internal electrode terminal and the fourth internal electrode terminal, and a second resistance member connected on the second internal electrode terminal and the third internal electrode terminal. In this case, the resistance member is at least one of a chip resistor, a chip varistor, and a PTC.

On the other hand, it further comprises a phosphor for converting the light wavelength generated in the LED chip.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

2 is a circuit diagram of a light emitting device according to a first embodiment of the present invention. 3 is a perspective view of a light emitting device according to the first embodiment of the present invention.

2 and 3, the light emitting device according to the present exemplary embodiment includes a bridge unit including first to fourth diode units D10 to D40 bridged between the first to fourth nodes N10 to N40, respectively. (200), a first resistor (R10) connected to the first node (N10), a second resistor (R20) connected to the third node (N30), a second node (N20), and a fourth The plurality of cells 100-1 to 100-n connected to the node N40 includes the LED chips 100 connected in series.

Here, the first resistor R10 and the second resistor R20 are connected to an AC power source.

The bridge unit 200 will be described in more detail. The first diode is connected between the first node N10 and the second node N20 to transmit a signal of the first node N10 to the second node N20. A second diode unit D20 connected between the unit D10 and the second node N20 and the third node N30 to transmit a signal of the third node N30 to the second node N20; The third diode unit D30 connected between the third node N30 and the fourth node N40 to transmit a signal of the fourth node N40 to the third node N30, and the fourth node N40. And a fourth diode unit D40 connected between the first node N10 and transmitting a signal of the fourth node N40 to the first node N10. Each of the first to fourth diode units includes 1 to 10 diodes each connected in series. A light emitting diode may be used as the diode.

The LED chip 100 includes a plurality of light emitting cells 100-1 to 100-n connected in series between an N-type pad and a P-type pad. In the LED chip 100 of the present invention, each of the plurality of light emitting cells 100-1 to 100-n is connected in series at a wafer level. That is, the P electrode of the first light emitting cell 100-1 is connected to the P-type pad, and the N electrode is connected to the P electrode of the second light emitting cell 100-2. The N electrode of the second light emitting cell 100-2 is connected to the P electrode of the third light emitting cell 100-3. In this way, the N electrode of the n-th light emitting cell 100-n-1 is connected to the P electrode of the n-th light emitting cell, and the N electrode of the n-th light emitting cell 100-n is connected to the N-type pad. Connected. Of course, the present invention is not limited thereto, and a cell block in which a plurality of light emitting cells are connected in series may be connected in parallel between the first pad and the second pad.

Here, the LED chip 100 emits light by the voltage difference between the second node N20 and the fourth node N40, and the P-type pad of the LED chip 100 is connected to the second node N20. , The N-type pad is connected to the fourth node N40.

As described above, the resistor R10 is connected between the first node N10 and the direct current power source, and the resistor R20 is connected between the third node N30 and the direct current power source. Through the resistors R10 and R20, the voltage / current of the DC power supply drops to a certain level, and the dropped voltage / current is applied to the bridge part 200, thereby extending the life of the bridge part 200. Excessive increase in voltage / current applied to the LED chip 100 can be suppressed. In addition, the resistor R10 may be disposed in the bridge unit 200 and the LED chip 100 to shorten a line for connecting the resistors R10 and R20 to them.

The operation of the light emitting device of this embodiment having the above-described configuration will be described based on the home AC power supply. When the first node N10 becomes a positive potential (+) through the first resistor R10 and the third node N30 becomes a negative potential (−) through the second resistor R20, the first node ( The positive potential (+) of N10 is applied to the second node N20 through the first diode unit D10, and the positive potential (+) of the second node N20 is applied to the LED chip 100 so that the LED The chip 100 emits light.

On the other hand, when the third node N30 becomes the positive potential (+) through the second resistor R20 and the first node N10 becomes the negative potential (−) through the first resistor R10, The positive potential (+) of the three nodes (N30) is applied to the second node (N20) through the second diode unit (D20), and the positive potential (+) applied to the second node (N20) is an LED chip ( 100 is applied to light the LED chip 100.

In this way, even when the current flow of the first and third nodes of the light emitting device connected to the AC power source, that is, the potential thereof is changed, the positive potential is continuously applied to the LED chip to emit the LED chip. The number of LED chips in the LED chip may vary depending on the size of the AC power source used.

The light emitting device of the present embodiment having the above-described circuit diagram will be described below with reference to FIG. 3.

The light emitting device of the present embodiment includes the LED chip 100 having a plurality of light emitting cells mounted on the body 110 connected in series, and the first internal electrode terminals 121 to the fourth internal electrode terminals formed on the body 110. 124, a first resistor R10 connected between the first internal electrode terminal 121 and the fourth internal electrode terminal 124, and the second internal electrode terminal 122 and the third internal electrode terminal ( The second resistor R20 and the plurality of diodes D10 to D40 connected between the plurality of diodes 123 are formed in an adjacent region of the LED chip 100, and the first resistor R10 and the second resistor are connected to each other. Rectifiers 210 and 220 connected to the resistor R20, a phosphor 150 thinly coated on the LED chip 100, and a molding unit 160 encapsulating the LED chip 100.

The apparatus further includes a first external electrode terminal 131 connected to the first internal electrode terminal 121, and a second external electrode terminal 133 connected to the third internal electrode terminal 123.

Here, the body 110 uses a shape in which the circumference protrudes in a circular shape as shown in FIG. 3. The body 110 may use an insulated poly phthalide (PPA) resin, a thermal conductive resin, or the like. The shape of the body 110 is also not limited to the circular shape, various shape modifications are possible. A circular metal pattern 111 is formed at the center of the body 110, and two axes extending from the metal pattern 111 are exposed to the outside of the circular body 110. The metal pattern 111 may emit heat generated from the LED chip 100 to the outside. In addition, a heat sink 112 is formed on the circular metal pattern 111, and the LED chip 100 having a plurality of light emitting cells connected in series on the heat sink 112 is mounted, and the first rectifying unit 210 and The second rectifier 220 is disposed. It is preferable that a thin insulating film (not shown) is formed on the heat generating plate 112. In this case, the above-described metal pattern 111 and / or the heat sink 112 may be inserted into the body 110 in the form of a metal slug.

A portion of the first internal electrode terminal 121 to the fourth internal electrode terminal 124 is exposed to the outside of the body. The first internal electrode terminal 121 and the third internal electrode terminal 123 are connected to the first external electrode terminal 131 and the third external electrode terminal 133. Of course, the present invention is not limited thereto, and the second internal electrode terminal 122 and the fourth internal electrode terminal 124 may also be connected to separate external electrode terminals.

As described above, the first resistor R10 and the second resistor R20 use a material having a predetermined resistance component, and in this embodiment, a chip resistor, a chip varistor, and a chip PTC (Positive Temperature Co) at least one of -efficient). Of course, all the resistors typically used in electrical and electronic equipment can also be used.

Fixed resistors can not prevent the forward voltage drop (V _F) of the LED array significantly lower temperature, the current increases as the input LED rises only by a fixed resistor, depending on the heat sink temperature. Therefore, by using PTC, the resistance value of PTC becomes large in proportion to the heat sink temperature, thereby making it possible to stabilize the LED current and make the luminous efficiency constant. It is preferable that the first resistor R10 and the second resistor R20 have the same resistance value. Of course, the present invention is not limited thereto, and may have different resistance values.

FIG. 4 is a diagram for describing the resistance of the present embodiment, and the first resistor R10 and the second resistor R20 will be described in detail with reference to FIG. 4. The resistors R10 and R20 include a resistive material 201, a resistive electrode 202 formed at both ends of the resistive material 201, and a connection member 203 formed under the resistive electrode 202. The resistance value of the resistive material 201 may vary from tens to tens of thousands of mega ohms, depending on the purpose of use. The connection member 203 refers to a material that is formed under the resistance electrode 202 to facilitate connection with the first internal electrode terminals 121 to the fourth internal electrode terminals 124. In this embodiment, a solder bumper is used as the connection member 203. Of course, a conductive paste may be used as the connecting member 203. As a result, the first resistor R10 is connected between the first internal electrode terminal 121 and the fourth internal electrode terminal 124 through its connecting member 203, and the second resistor R20 is connected to the second internal electrode. It is connected between the terminal 122 and the third internal electrode terminal 123.

The rectifiers 210 and 220 described above are configured in two, and the diode units D10 to D40 are configured in four. The first diode unit D10 and the fourth diode unit D40 are mounted on the first rectifying unit 210, and the second diode unit D20 and the third diode unit D30 are mounted on the second rectifying unit 220. do.

5 is a view for explaining the rectifying unit according to the present embodiment. Hereinafter, the rectifying unit of the present invention will be described in detail with reference to FIG. 5. The first rectifying part 210 and the second rectifying part 220 are conductive members, and the first diode part D10 and the fourth diode part D40 or the second diode part D20 and the first connected to the conductive member. A first rectifying pad 211 formed between the third diode unit D30 and the first diode unit D10 and the fourth diode unit D10 and D40 or between the second diode unit D20 and the third diode unit D30. ) And a second rectifying pad 221. At this time, the P electrodes of the first diode portion D10 and the second diode portion D20 are electrically connected to the conductive member, and the N electrodes of the third diode portion D30 and the fourth diode portion D40 are electrically conductive members. Is electrically connected to the

As the conductive member, a material having excellent electrical conductivity may be used, and a metal or a doped silicon film may be used. The first to fourth diode units D10 to D40 may be mounted using a conductive paste, or may be mounted using solder bumps. The first rectifying pad 211 and the second rectifying pad 221 may also be made of the same material as the conductive member.

Referring to the connection between the resistor, the diode unit and the LED chip as follows.

The first resistor R10 is connected between the first internal electrode terminal 121 and the fourth internal electrode terminal 124. The fourth internal electrode terminal 124 is connected to the first rectifying pad 211 of the first rectifying part 210 through the first wire 141. The P electrode of the first diode unit D10 is electrically connected to the conductive member of the first rectifying unit 210, and the N electrode is connected to the P-type pad of the LED chip 100 through the second wire 142. The P electrode of the second diode unit D20 is electrically connected to the conductive member of the second rectifying unit 220, and the N electrode is connected to the P-type pad of the LED chip 100 through the third wire 143. The second rectifying pad 221 of the second rectifying part 220 is connected to the second internal electrode terminal 122 through the fourth wire 144. The N electrode of the third diode unit D30 is electrically connected to the conductive member of the second rectifying unit 220, and the P electrode is connected to the N type pad of the LED chip 100 through the fifth wire 145. The N electrode of the fourth diode unit D40 is electrically connected to the conductive member of the first rectifying unit 210, and the P electrode is connected to the N type pad of the LED chip 100 through the sixth wire 146.

As described above, two wires are connected to one pad of the LED chip 100. This is because the number of wires that can be connected to one pad is difficult due to the thickness of the pad of the LED chip 100, the thickness of the wire, and the wire bonding process. Of course, three or more wire bonding is possible by adjusting the thickness of the pad, the thickness of the wire, and the bonding process. In addition, after connecting a plurality of wires into one, one wire may be connected to the pad of the LED chip 100.

When the positive voltage (+) is applied to the first internal electrode terminal 121 and the negative voltage (-) is applied to the third internal electrode terminal 123 through the above-described connection relationship, the positive voltage (+) is the first The LED chip 100 may be connected through the resistor R10, the fourth internal electrode terminal 124, the first wire 141, the first rectifying unit 210, the first diode unit D10, and the second wire 142. The negative voltage (−) is applied to the P-type pad, and the negative voltage (−) is applied to the second resistor R20, the second internal electrode terminal 122, the fourth wire 144, the second rectifier 220, and the third diode unit D30. The n-type pad of the LED chip 100 is applied through the fifth wire 145. As a result, the LED chip 100 emits light.

On the other hand, when the positive voltage (+) is applied to the third internal electrode terminal 123 and the negative voltage (-) is applied to the first internal electrode terminal 121, the positive voltage (+) is the second resistor (R20). Through the second internal electrode terminal 122, the fourth wire 144, the second rectifying unit 220, the second diode unit D20, and the third wire 143 to the P-type pad of the LED chip 100. The negative voltage (−) is applied to the first resistor R10, the fourth internal electrode terminal 124, the first wire 141, the first rectifying portion 210, the fourth diode portion D40, and the sixth wire. 146 is applied to the N-type pad of the LED chip 100 through. As a result, the LED chip 100 emits light. At this time, as shown in the drawing, the first external electrode terminals 131 and the third external electrode terminals 131 and 133 are connected to a DC power source.

Phosphor 150 is thinly coated on the LED chip 100. The phosphor 150 may be a phosphor having a garnet structure or a silicate structure, and various kinds of phosphors may be used as long as the LED chip 100 may emit light having a desired color by converting a wavelength of light emitted from the LED chip 100. For example, the YAG: Ce phosphor is ported onto the LED chip 100 emitting blue to implement white color. In this case, the phosphor 150 and the molding unit 160 may be manufactured through separate processes, or the phosphor 150 may be uniformly distributed in the molding unit 160. The molding part 160 is thinly formed in a dome shape in the protrusion of the body 110. Of course, the present invention is not limited thereto, and the shape of the molding part and the molding area may be variously changed.

The manufacturing method of the light emitting device having the above-described structure may be very diverse, but the manufacturing method is briefly described as follows.

A body having a plurality of electrode terminals, a metal pattern, and a heat dissipation plate is provided, and a rectifier having a diode part and a resistor are provided. An LED chip having a plurality of light emitting cells connected in series is mounted on a heat sink of a body, and a rectifying portion is mounted in an adjacent region of the LED chip. In addition, a resistor is mounted between adjacent electrode terminals. Next, the wires are electrically connected between the diode unit and the LED chip and the internal electrode terminals. After the phosphor is thinly coated on the LED chip, a molding process is performed to form a molding unit, thereby manufacturing a light emitting device.

The present invention is not limited to the above description, and a separate member and a manufacturing process may be further inserted to improve the efficiency of the light emitting device.

For example, a heat sink for dissipating heat of the LED chip to the outside may be further included. It is preferable to use a material having excellent thermal conductivity as the heat sink, and it is most preferable to use a metal having excellent thermal conductivity and electrical conductivity. To this end, a part of the body, that is, a region in which the LED chip is to be removed is formed to form a through hole, a heat sink may be inserted into the through hole, and then the LED chip may be mounted on the heat sink. If the body itself is used as a metal, it can be used as a heat sink. At this time, a heat sink is formed between the electrode terminal and the heat sink. In addition, the LED chip may further include a reflective member for centralizing the light emitted, or may further include a diffuse reflection pattern member for diffusing the light. In addition, the present invention may add a capacitor and a resistor connected in parallel to the above-described structure to reduce the number of light emitting cells in the LED chip, and to improve brightness and brightness.

In addition, the light emitting device of the present invention may be mounted around the LED chip without a resistor mounted on the internal electrode terminal. This second embodiment of the present invention will be described with reference to the drawings. In the following embodiment, a description overlapping with the first embodiment described above will be omitted.

6 is a perspective view of a light emitting device according to a second embodiment of the present invention.

Referring to FIG. 6, the light emitting device according to the present embodiment includes a body 110, an LED chip 100 mounted in the body 110, and a rectifier 210 for supplying DC power to the LED chip 100. , 220, and first internal electrode terminals 121 to 4 formed through the resistance members 230 and 240 and the body 110 for the voltage drop of the AC power supplied to the rectifiers 210 and 220. An internal electrode terminal 124. The body 110 includes a heat sink 112, and the LED chip 100, the rectifiers 210 and 220, and the resistance members 230 and 240 are mounted on the heat sink 112. In this embodiment, as shown in FIG. 6, the LED chip 100 is mounted at the center of the body 110, and two rectifiers 210 and 220 and resistance members 230 and 240 are respectively disposed around the LED chip 100. ) Is implemented. In the present embodiment, the AC power is input through the first internal electrode terminal 121 and the third internal electrode terminal 123, and the first and second resistance members 230 and the second resistance member ( 240 is mounted on the heat sink 112 in an area adjacent to the first internal electrode terminal 121 and the third internal electrode terminal 123.

FIG. 7 is a diagram of the resistance member according to the present embodiment and the first resistance member 230 and the second resistance member 240 will be described based on this.

Each of the first resistance member 230 and the second resistance member 240 may be formed on the insulating substrates 231 and 241 and the first terminals 232 and 242 spaced apart from each other on the insulating substrates 231 and 241. Resistors connected to the second terminals 233, 243, the first terminals 232, 242, and the second terminals 233, 244. The resistance includes a resistive material 201, a resistance electrode 202, and a connection member 203. As the first resistor member 230 and the second resistor 240 described above, the chip resistor or PTC of the previous embodiment may be used, or an element having all the resistance characteristics used in an electronic circuit may be used.

Hereinafter, the preferable connection relationship between the above-mentioned components is demonstrated.

The first internal electrode terminal 121 is connected to the first terminal 232 of the first resistance member 230 through the first wire 141. The second terminal 233 of the first resistance member 230 is connected to the fourth internal electrode terminal 124 through the second wire 142. The fourth internal electrode terminal 124 is connected to the first rectifying pad 211 of the first rectifying part 210 through the third wire 143. The P electrode of the first diode unit D10 is electrically connected to the conductive member of the first rectifying unit 210, and the N electrode is connected to the P-type pad of the LED chip 100 through the fourth wire 144. The N electrode of the fourth diode portion is electrically connected to the conductive member of the first rectifying portion 210, and the P electrode is connected to the N type pad of the LED chip 100 through the fifth wire 145. The third internal electrode terminal 123 is connected to the first terminal 242 of the second resistance member 240 through the sixth wire 146. The second terminal 243 of the second resistance member 240 is connected to the second internal electrode terminal 122 through the seventh wire 147. The second internal electrode terminal 122 is connected to the second rectifying pad 221 of the second rectifying part 220 through the eighth wire 148. The P electrode of the second diode unit D20 is electrically connected to the conductive member of the second rectifying unit 220, and the N electrode is connected to the P-type pad of the LED chip 100 through the ninth wire 149. The N electrode of the third diode unit D30 is electrically connected to the conductive member of the second rectifying unit 220, and the P electrode is connected to the N type pad of the LED chip 100 through the tenth wire 140.

The operation of the light emitting device of this embodiment having the above-described connection relationship will be described below.

Considering a case where a positive voltage (+) is applied to the first internal electrode terminal 121 and a negative voltage (−) is applied to the third internal electrode terminal 123 as follows. Positive voltage (+) is the first wire 141, the first resistance member 230, the second wire 142, the fourth internal electrode terminal 124, the third wire 143, the first rectifier 210 A predetermined level drop through the first diode unit D10 and the fourth wire D40 is applied to the P-type pad of the LED chip 100. The negative voltage (−) is the sixth wire 146, the second resistance member 240, the seventh wire 147, the second internal electrode terminal 122, the eighth wire 148, and the second rectifier 220. The N-type pad of the LED chip 100 is applied through the third diode unit D30 and the tenth wire 140. As a result, the LED chip 100 emits light.

On the other hand, when the positive voltage (+) is applied to the third internal electrode terminal 123, the negative voltage (-) is applied to the first internal electrode terminal 121 as follows. The positive voltage (+) is the sixth wire 146, the second resistance member 240, the seventh wire 147, the second internal electrode terminal 122, the eighth wire 148, and the second rectifier 220. A predetermined level drop through the second diode unit D20 and the ninth wire 149 is applied to the P-type pad of the LED chip 100. The negative voltage (−) is the first wire 141, the first resistance member 230, the second wire 142, the fourth internal electrode terminal 124, the third wire 143, and the first rectifier 210. The n-type pad of the LED chip 100 is applied through the fourth diode unit D40 and the fifth wire 145. As a result, the LED chip 100 emits light.

As such, the resistance members 230 and 240 may be positioned in an area adjacent to the LED chip 100 to easily adjust the resistance value. In addition, various types of resistors can be used without being affected by the size or characteristics of the resistors, thereby improving the stability of the light emitting device.

In addition, the present invention can change the structure of the LED chip to manufacture a light emitting device capable of alternating current drive without a diode unit. That is, the LED chip can be driven even though AC power is applied to the first and second pads of the LED chip by connecting a plurality of cell blocks connected in series in parallel. For this purpose, a predetermined resistor must be disposed between the first and second pads of the LED chip and the AC power supply. This second embodiment of the present invention will be described with reference to the drawings. In the following embodiments, descriptions overlapping with those of the first and second embodiments described above will be omitted.

8 is a circuit diagram of a light emitting device according to a third embodiment of the present invention. 9 is a perspective view of a light emitting device according to a third embodiment of the present invention.

8 and 9, in the light emitting device of the present embodiment, an LED chip 1000 in which a plurality of cell blocks 1000a and 1000b connected in series are connected in parallel between a first pad P10 and a second pad P20. ), A first resistor R10 connected to the first pad P10, and a second resistor R20 connected to the second pad P20. Here, an AC power source is connected between the first resistor R10 and the second resistor R20.

In the present embodiment, two cell blocks 1000a and 1000b are connected in parallel between the first pad P10 and the second pad P20. That is, the P-type pad of the first cell block 1000a and the N-type pad of the second cell block 1000b are connected to the first pad P10, and the N-type pad and the first pad of the first cell block 1000a are connected. The P-type pad of the two cell block 1000b is connected to the second pad P20.

Thus, when a positive voltage is applied to the first pad P10 through the first resistor R10, and a negative voltage is applied to the second pad P20 through the second resistor R20, the first cell block ( The LED chip 1000 emits light by 1000a). In addition, when a positive voltage is applied to the second pad P20 through the second resistor R20 and a negative voltage is applied to the first pad P10 through the first resistor R10, the second cell block ( The LED chip 1000 emits light by 1000b).

This allows the light emitting device of this embodiment to emit light from an AC power supply without the addition of complicated circuits.

 The light emitting device of this embodiment having the above-described circuit diagram will be described below with reference to FIG. 9.

In the light emitting device according to the second embodiment of the present invention, the AC driving LED chip 1000 mounted on the body 110 and the first internal electrode terminals 121 to the fourth internal electrode terminals formed on the body 110 are provided. 124, the first resistance member 230 connected between the first internal electrode terminal 121 and the first pad P10 of the LED chip 1000, and the third internal electrode terminal 123. The second resistor member 240 is connected between the second pads P20 of the LED chip 1000.

The connection relationship between the LED chip and the resistors of the present embodiment described above will be described.

The first terminal 232 of the first resistance member 230 is connected to the first internal electrode terminal 121 through the first wire 121, and the second terminal 233 is connected through the second wire 142. It is connected to the first pad P10 of the LED chip 1000. The first terminal 242 of the second resistance member 240 is connected to the third internal electrode terminal 123 through the third wire 143, and the second terminal 243 is connected through the fourth wire 144. It is connected to the second pad P20 of the LED chip 1000.

The operation of the light emitting device of this embodiment having the above-described connection relationship will be described below.

Considering a case in which a positive voltage (+) is applied to the first internal electrode terminal 121 and a negative voltage (−) is applied to the third internal electrode terminal 123, it is as follows. The positive voltage (+) is applied to the first pad P10 of the LED chip 1000 through the first wire 141, the first resistance member 230, and the second wire 142. The negative voltage (−) is applied to the second pad P20 of the LED chip 1000 through the third wire 143, the second resistor 240, and the fourth wire 144. As a result, the first cell block 1000a of the LED chip 1000 emits light. In addition, a case in which a positive voltage (+) is applied to the third internal electrode terminal 123 and a negative voltage (−) is applied to the first internal electrode terminal 121 is as follows. The positive voltage (+) is applied to the second pad P20 of the LED chip 1000 through the third wire 143, the second resistance member 240, and the fourth wire 144. The negative voltage (−) is applied to the first pad P10 of the LED chip 1000 through the first wire 141, the first resistance member 230, and the second wire 142. As a result, the second cell block 1000b of the LED chip 1000 emits light.

As described above, in the present embodiment, the connection relationship of cells arranged inside the LED chip can be changed to emit light at AC without a separate rectifier circuit, and the resistor is mounted in the adjacent area of the LED chip together with the LED chip to strengthen the electrical bond. The size of the device can be reduced. The above-described embodiments are not limited to each embodiment, and the techniques applied to the individual embodiments may be applied to different embodiments.

As described above, in the present invention, a bridge circuit composed of an LED chip and a plurality of diodes in which a plurality of light emitting cells are connected in series, and a resistor are integrated on the body to simplify the manufacturing process and reduce the size of the light emitting device.

In addition, the manufacturing cost of the light emitting device can be reduced by using an AC LED chip capable of operating in alternating current without a bridge circuit, and the size of the light emitting device can be reduced by integrating a resistor.

In addition, by using the LED chip that is connected between the light emitting cells can save the connection cost for the connection between the light emitting cells, and can prevent the defects that can occur when connecting to reduce the defective rate when manufacturing the light emitting device using the LED chip You can.

Claims (15)

Body; An LED chip mounted on the body and including a plurality of light emitting cells connected in series; A bridge rectifier circuit part electrically connected to the LED chip in the body and provided to surround the LED chip; And And at least one resistor member positioned between the bridge rectifier circuit unit and an AC power source. Light emitting device driven by alternating current. The method according to claim 1, The body includes a heat sink for dissipating heat of the LED chip to the outside.  The method according to claim 2, And the LED chip is mounted on the heat sink. The method according to claim 1, The LED chip further comprises an N-type pad and a P-type pad on its top. The method of claim 4, The P electrode of the first light emitting cell in the LED chip is connected to the P-type pad, The N electrode of the n-th light emitting cell in the LED chip is connected to the N-type pad. The method according to claim 1, The bridge rectifier circuit unit, A first diode unit connected between a first node and a second node to transmit a signal of the first node to the second node; A second diode unit connected between the second node and a third node to transmit a signal of the third node to the second node; A third diode unit connected between the third node and a fourth node to transmit a signal of the fourth node to the third node; And And a fourth diode unit connected between the fourth node and the first node to transmit a signal of the fourth node to the first node. The method of claim 6, And the first diode portion, the second diode portion, the third diode portion, and the fourth diode portion comprise one diode. The method of claim 6, Wherein the first diode portion, the second diode portion, the third diode portion, and the fourth diode portion include a plurality of diodes connected in series. The method according to claim 7 or 8, The diode is a light emitting device, characterized in that the light emitting diode. The method of claim 6, And the resistance member includes a resistance member connected between the first node and the AC power supply. The method of claim 6, And the resistance member includes a resistance member connected between the third node and the AC power source. The method according to claim 10 or 11, The resistor member is at least one of a chip resistor, a chip varistor and a PCT (Positive Temperature Co-efficient). The method according to claim 1, Light emitting device further comprises a phosphor for converting the light wavelength generated in the LED chip. 14. The method of claim 13, The phosphor is coated on the LED chip. 14. The method of claim 13, And a molding part formed separately from the phosphor.

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