KR101147841B1 - Adhesive tape for manufacturing electronic component - Google Patents

Abstract

The present invention relates to a pressure-sensitive adhesive tape for electronic component manufacturing, and more particularly, the pressure-sensitive adhesive tape for electronic component manufacturing can be de-taped at room temperature without an additional heating process after the sealing resin encapsulation process, and all the required characteristics of the lamination process conditions The present invention relates to a pressure-sensitive adhesive tape for electronic component manufacturing that can satisfy and improve the limits of pressure-sensitive adhesive residue and sealing resin leakage of pressure-sensitive adhesive tapes that have been used in existing electronic component manufacturing processes. To this end, the adhesive tape for manufacturing an electronic component according to the present invention is an adhesive tape for manufacturing an electronic component including a heat-resistant base material and a pressure-sensitive adhesive layer on which the pressure-sensitive adhesive composition is applied. The pressure-sensitive adhesive composition is a phenoxy resin, an acrylic resin, a thermosetting agent. And an energy ray-curable acrylic resin and a photoinitiator, wherein the pressure-sensitive adhesive layer is cured by thermosetting and energy rays.

Description

Adhesive tape for electronic component manufacturing {ADHESIVE TAPE FOR MANUFACTURING ELECTRONIC COMPONENT}

The present invention relates to a pressure-sensitive adhesive tape for electronic component manufacturing, and more particularly, the pressure-sensitive adhesive tape for electronic component manufacturing can be de-taped at room temperature without an additional heating process after the sealing resin encapsulation process, and all the required characteristics of the lamination process conditions The present invention relates to a pressure-sensitive adhesive tape for electronic component manufacturing that can satisfy and improve the limits of pressure-sensitive adhesive residue and sealing resin leakage of pressure-sensitive adhesive tapes that have been used in existing electronic component manufacturing processes.

With the increasing use of portable devices (mobile phones, laptop computers, DVD / CD / MP3 players, PDAs, etc.) in modern life, device miniaturization and light weight are essential. Accordingly, miniaturization and thinning of semiconductor packages used in portable devices are a top priority. Conventional semiconductors use a surface-mount package method (gull-wing or quad-flat-package), which is connected to a circuit board through a long lead, but it shows a limitation in such required characteristics. In particular, portable communication devices using a high frequency of several GHz has a problem in that its performance and efficiency are deteriorated due to the exothermic reaction caused by the dielectric loss of the semiconductor device.

In recent years, the demand for the lead-free quad flat no-lead package (QFN) system has been rapidly rising to meet the demand characteristics of such semiconductors. In the case of QFN, the lead is not extended and exposed to the bottom of the package in the form of land around the die, which allows soldering directly to the circuit board. This can be manufactured significantly smaller and thinner than the package with the lead, and the area occupied by the circuit board is also reduced by about 40% compared to the conventional. In terms of heat generation, the heat dissipation is excellent because the lead frame on which the chip is placed is different from the existing method in which the lead frame is stacked by the sealing resin, and the lead frame is located at the bottom of the package and the die pad is directly exposed to the outside. This results in better electrical characteristics and only half the inductance of the package compared to the leaded package.

Since the interface between the lead frame and the sealing resin surface coexists at the bottom of the package, the sealing resin easily leaks between the lead frame and the molding mold when using a general metal molding mold, and contaminates the land surface or the die pad surface with the resin. Cause problems. Therefore, it is essential to prevent bleed-out or flash of the sealing resin during the resin process by laminating the lead frame with adhesive tape and then going through QFN manufacturing process and resin encapsulation process. have.

In general, a semiconductor device manufacturing process includes a tape lamination process of adhering an adhesive tape to one side of a lead frame, a die attach process of adhering a semiconductor element to a die pad of a lead frame, a semiconductor element and a lead frame. Wire bonding process for electrically connecting the land portions of the film, die bonding process, sealing resin encapsulation process (EMC molding) for sealing the lead frame with wire bonding using a sealing resin in a molding frame, and adhesive tape for semiconductors. It consists of a detaping process which removes from the sealed lead frame.

Summarizing the required characteristics of the adhesive tape used in the semiconductor device manufacturing process as described above, the tape should be closely adhered to the lead frame without forming bubbles in appearance according to the lamination method of each laminator, and the die adhesiveness or wire bonding property For this to be excellent, the tape should be free of physical and chemical changes during the mentioned temperature ranges and process times. In other words, a part of the pressure-sensitive adhesive layer in the form of outgas should not come out to lower the bonding strength of the interface to be adsorbed and bonded to the surface of the semiconductor device element. In addition, variations in the dimensions of the tape, extreme changes in values such as the elastic modulus or viscosity, which are physical properties of the adhesive layer, and the adhesive layer flows out or is too brittle due to too high stiffness is a concern in maintaining the reliability of the semiconductor device. Can give During the sealing resin encapsulation process, the tape should be kept in close contact with the leadframe so that the sealing resin does not penetrate between the interfaces and contaminate the leadframe surface. Of course, it is possible to add a deflash process after the detapping process, but ultimately no additional cleaning process is recommended efficiently and economically. After detaping, there should be no specific reaction between the adhesive and the sealing resin and no adhesive remains on the surface such that the sealing resin surface condition is implemented as intended as the sealing resin was originally designed. In addition, there should be no adhesive residue on the surface of the lead frame.

In the taping process, the adhesive tape is adhered to the copper or PPF lead frame using a laminator, and the required characteristics of the adhesive tape vary depending on the type and method of the laminator. In the case of using a roller, a hot press, a mixed type of two cases, and pressing only the dam bar portion of the lead frame are divided. According to each method, the pressure-sensitive adhesive layer should be well adhered to the lead frame and maintain the adhesive force without delamination even during the handling of the lead frame laminated with the adhesive tape.

In the present invention, while satisfying the requirements of the above-described tape, there is a detailed object in the development of a pressure-sensitive adhesive layer suitable for laminators using a hot press of the lamination method. In this case, the pressure-sensitive adhesive layer has no adhesive force to the material of the stainless steel (STS) type, which is a general material of the laminator component at room temperature, and only when a certain heat and pressure is applied, the adhesive force should be adhered to the lead frame.

In the detapping process, no residue of the adhesive remains on the surface of the sealing resin or on the face of the lead frame after the tape is removed.

In the case of a pressure-sensitive adhesive using a conventional phenoxy resin, the adhesion between the two interfaces is significantly increased due to the affinity between the phenoxy and the sealing resin after the sealing resin encapsulation process. As a result, during the detapping process at room temperature, a high adhesive force between the adhesive and the sealing resin causes tearing of the tape or a problem of the residue of the adhesive on the sealing resin surface. In the detapping process, there are cases where automated heating machines are used to solve the problem of adhesive residue on the sealing resin surface or the surface of the lead frame and to remove the tape more easily. In the case of using a machine, the adhesive layer is heated to an appropriate temperature in which the lead frame to which the tape, which has been subjected to the sealing resin encapsulation, is heated, is passed through an oven or a hot plate to an appropriate temperature at which the tape can be removed. The tape is removed after giving fluidity. However, this additional heating detapping process has a problem that the operation efficiency and economics are reduced.

The present invention has been made to solve the above problems, an object of the present invention is to provide a pressure-sensitive adhesive tape for electronic component manufacturing can be taped at room temperature without an additional heating process after sealing the sealing tape for electronic component manufacturing process. I would like to.

In addition, another object of the present invention is to satisfy the required characteristics of the lamination process conditions and to improve the limits of the adhesive residue and sealing resin leakage of the adhesive tapes that have been used in the existing electronic component manufacturing process adhesive for electronic component manufacturing To provide a tape.

These and other objects and advantages of the present invention will become more apparent from the following description of a preferred embodiment thereof.

The object is an adhesive tape for producing an electronic component comprising a heat-resistant base material and a pressure-sensitive adhesive layer coated with a pressure-sensitive adhesive composition on the heat-resistant base material, wherein the pressure-sensitive adhesive composition is a phenoxy resin, an acrylic resin, a thermosetting agent, an energy ray-curable acrylic resin, and It includes a photoinitiator, wherein the pressure-sensitive adhesive layer is achieved by a pressure-sensitive adhesive tape for producing electronic components, characterized in that cured by heat curing and energy rays.

Herein, the heat resistant substrate has a thickness of 5 to 100 μm, a glass transition temperature of 110 to 450 ° C., a thermal expansion coefficient of 1 to 35 ppm / ° C. at 100 to 200 ° C., and a room temperature elastic modulus of 1 to 10 GPa. It features.

Preferably, the phenoxy resin is a phenoxy resin or modified phenoxy resin, the weight average molecular weight is characterized in that 1,000 to 500,000.

Preferably, the glass transition temperature of the pressure-sensitive adhesive composition is characterized in that 80 ~ 150 ℃.

Preferably, the energy ray-curable acrylic resin is characterized in that the resin having at least one carbon double bond in the molecule.

Preferably, the pressure-sensitive adhesive composition comprises 0.1 to 10 parts by weight of an acrylic resin, 5 to 20 parts by weight of a thermosetting agent and 5 to 30 parts by weight of the energy ray-curable acrylic resin, relative to 100 parts by weight of the phenoxy resin, wherein the photoinitiator is Characterized in that it comprises 0.5 to 10 parts by weight relative to 100 parts by weight of the energy ray-curable acrylic resin.

According to the present invention, it is possible to easily remove the adhesive tape at room temperature without a heating step in the detapping process of removing the adhesive tape for manufacturing the electronic component from the sealed lead frame. In addition, the present invention does not have a pressure-sensitive adhesive layer at room temperature, but the adhesive force is expressed only during the heating lamination process to enable lamination on the lead frame and form a partial interpenetrating network structure due to additional photocuring of the pressure-sensitive adhesive layer of the semiconductor device. It has improved heat resistance against the thermal history of the adhesive tape exposed during the manufacturing process, helps to improve the reliability of the device during the manufacture of semiconductor devices, prevents leakage of the sealing material, and leads the frame or the sealing material when the tape is removed after the process is completed. It can have the effect of being able to prevent transfer of an adhesive.

Hereinafter, the present invention will be described in detail with reference to examples of the present invention. These examples are only presented by way of example only to more specifically describe the present invention, it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .

The adhesive tape for manufacturing an electronic component according to the present invention relates to a masking adhesive tape which is required for a semiconductor device manufacturing process and satisfies the required characteristics thereof. The adhesive tape has excellent adhesion to metals such as lead frames and has excellent heat resistance. Phenoxy resin is used as a main material. With excellent adhesion and adhesion to the leadframe, there is no bleed-out or flash of the sealing resin and the degree of curing can be controlled by controlling the degree of curing, thereby controlling the temperature at which the adhesive force is expressed on the leadframe. In addition, the formation of an additional crosslinked structure by energy ray irradiation of the added photocurable resins solves the problem of remaining adhesive on the lead frame or sealing resin surface of the adhesive after detapping with improved cohesive force.

In addition, in the present invention, the adhesive tape for manufacturing the electronic component is described using a semiconductor packaging process, for example, but is not limited thereto. Of course, the adhesive tape may also be applied as a mask sheet on a high temperature manufacturing process of various electronic components.

The adhesive tape for manufacturing an electronic component according to the present invention is an adhesive tape for manufacturing an electronic component including a heat resistant substrate and an adhesive layer on which the adhesive composition is applied, wherein the adhesive composition includes a phenoxy resin, an acrylic resin, a thermosetting agent, It includes an energy ray-curable acrylic resin and a photoinitiator, wherein the pressure-sensitive adhesive layer is cured by thermosetting and energy rays.

In the adhesive tape for manufacturing an electronic component according to the present invention, a polymer film having excellent heat resistance may be used as the base material to which the pressure-sensitive adhesive composition is applied to form the pressure-sensitive adhesive layer. Such heat resistant substrates are capable of processing in the form of films and should be free of physical-chemical changes during the temperature ranges and times described above with sufficient heat resistance. In addition, it is preferable that the temperature at which the heat-resistant base material is reduced by 5% is at least 300 ° C or higher, and the thermal expansion coefficient at 100 to 200 ° C is about 1 to 35 ppm / ° C. It is preferable that the film has a glass transition temperature of 110 to 450 ° C. Stable and excellent high temperature heat resistance can maintain the flatness of the substrate during high temperature lamination to enable uniform lamination and ensure high wire bonding. The dimensional stability of the film maintained even at high temperatures can suppress the leakage of the resin because there is no deformation in the molding mold even during the resin encapsulation process. In addition, the elastic modulus is 1 ~ 10GPa at room temperature, it is preferable to maintain 100 ~ 5000MPa within the range of 100 ~ 300 ℃. In case of using substrate films with too low elastic modulus or severe folding, wrinkles may occur during handling of the tape, loading the tape into lamination equipment, and feeding the tape into the equipment. This can cause lamination failure (partial delamination) later and cause uneven wire bonding and resin bleed-out. Examples of the substrate that satisfies these characteristics include heat resistant polymer films, and examples include films processed with heat resistant polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyester, polyamide, polyetherimide, and the like. Can be mentioned.

In addition, the thickness of the base film is not particularly limited and is determined by the application limits of lamination equipment and resin encapsulation equipment. Generally, 5 to 100 µm is preferable, but 10 to 40 µm is more preferable in order to suppress wrinkles caused by external force, maintain proper heat resistance, and facilitate handling. If necessary, a sand mat treatment, a corona treatment, a plasma treatment, and a primer treatment are also possible in order to improve the adhesion between the pressure-sensitive adhesive and the base film.

In addition, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for manufacturing electronic components according to the present invention is based on a thermoplastic phenoxy resin having excellent heat resistance and excellent adhesive force, and preserving heat resistance while controlling excessive curing shrinkage of the phenoxy resin thermosetting agent and phenoxy resin. It includes a photocurable resin (energy ray curable acrylic resin) and a photoinitiator therefor. In addition, an acrylic resin is included to prevent a sudden increase in adhesion between the phenoxy resin and the encapsulating resin.

Examples of the phenoxy resins, which are thermoplastic resins, are bisphenol A phenoxy, bisphenol A / bisphenol F phenoxy, bromine phenoxy, phosphorus phenoxy, bisphenol A / bisphenol S-type phenoxy and caprolactone. Although modified phenoxy etc. can be mentioned, Especially, bisphenol-A phenoxy resin is especially preferable because it is excellent in heat resistance, environmentally friendly property, hardener compatibility, and cure rate. In addition, the weight average molecular weight of the phenoxy resin is preferably in the range of 1,000 to 500,000, and in this case, the problem of pressure-sensitive adhesive residue during detaping may be minimized by improving heat resistance due to an increase in internal cohesion. If the molecular weight is less than 1,000, the internal cohesion force is not realized, the heat resistance required is not realized, and if the molecular weight is more than 500,000, there may be a problem of poor workability resulting from high viscosity or uneven coating surface even after coating. The miscibility of is difficult to control.

In addition, examples of the organic solvent that can dissolve the phenoxy resin include ketones, alcohols, glycol ethers, and esters. Some examples thereof include cyclohexanone, methyl ethyl ketone, benzyl alcohol, diethylene glycol alkyl ether, phenoxypropanol, propylene glycol methyl ether acetate, tetrahydrofuran, N-methylpyrrolidone, and the like. Or two or more kinds thereof may be mixed. When using an organic solvent, 5-40 weight part of phenoxy resin is suitable with respect to 100 weight part of organic solvents, and 20-35 weight part is more preferable. If necessary, aromatic hydrocarbon solvents such as toluene, xylene, aromatic 100, and hexane may be added as a diluent in order to improve coating defect and adhesion to the base film. The amount of diluent should not exceed 40% relative to the solvent.

The phenoxy resin can be used even with the addition of a suitable crosslinking agent, but any crosslinking agent or curing agent can be used as long as the resin having a hydroxyl group as a functional group can be cured. Melamine, urea-formaldehyde, isocyanate functional prepolymers, phenol curing agents, amino curing agents and the like. The amount of the thermosetting agent is preferably 0.1 to 40 parts by weight and more preferably 5 to 20 parts by weight relative to 100 parts by weight of the phenoxy resin. If the amount of curing agent is too small (<5 parts by weight) and an insufficient crosslinked structure is formed, the adhesive layer will recede (reduce relative glass transition temperature and increase loss modulus) so that the leadframe becomes too deep into the adhesive layer during lamination. The pressure-sensitive adhesive, which is dug and pushed by the lead frame, rises around the die pad or land portion of the lead frame, and can be sandwiched between the sealing resin and the lead frame during the resin sealing process to cause an adhesive residue during detaping. In addition, when the amount of the curing agent is too large (> 20 parts by weight), the adhesive force and wettability of the adhesive layer may be so low that it may cause a delamination problem, and the adhesive layer may be broken during lamination due to the excessively increased strength. This may cause the tape to bend due to excessive curing shrinkage during the drying and curing process after the adhesive is applied to the base film, and lamination workability may be deteriorated.

In addition, the energy ray-curable acrylic compound (resin) to form an additional crosslinked structure in the crosslinked structure of the phenoxy resin may be an acrylic polymer having a carbon-carbon double bond, an acrylic oligomer, an acrylic monomer, and the like, and at least one unsaturated bond. Have This acryl group acts as a functional group for forming a crosslinked structure through a free radical reaction, and according to the number thereof, reactivity, crosslinked structure, and degree of curing can be controlled. As the number of functional groups increases, the reaction (crosslinking) rate increases, the glass transition temperature increases, and the heat resistance increases, but the flexibility and adhesive strength of the adhesive layer decrease. In selecting an acrylic resin having an appropriate number of functional groups, as with the selection of a thermosetting agent to cure a phenoxy resin, one must use a balance between cohesion and rigidity. Examples of the acrylic compound used for such energy ray curing include epoxy acrylate, aromatic urethane acrylate, aliphatic urethane acrylate, polyether acrylate, polyester acrylate, acryl acrylate, etc., alone or two or more of each other. It can also be used in combination with other oligomers. In addition, among the oligomers of each kind can be selected according to the number of functional groups, it is possible to use an oligomer having a functional group of about 2 to 9. In order to prevent the adhesive layer from remaining on the sealing resin surface and the lead frame during detapping due to the increase in cohesion, strength, and glass transition temperature of the adhesive layer through high curing density, functional groups of about 6 to 9 may be used. Preferred oligomers are. The content of the energy ray-curable acrylic compound is added 1 to 40 parts by weight with respect to 100 parts by weight of the phenoxy resin, preferably used in a proportion of 5 to 30 parts by weight.

In addition, photoinitiators used to initiate curing by the energy ray of the energy ray-curable acrylic compound include benzophenone series, thioxanthone series, alpha hydroxy ketone series, alpha amino ketone series, phenylglyoxylate series and alacryl phospha. Take over. The photoinitiator may be used alone or in combination of two or more kinds depending on the efficiency and properties of the photoinitiator in order to form a uniform crosslinked structure according to the thickness of the pressure-sensitive adhesive layer or the intensity of energy rays. The photoinitiator is used in an amount of 0.5 to 10 parts by weight, preferably 1 to 5 parts by weight, based on 100 parts by weight of the energy ray-curable acrylic resin.

Finally, the acrylic resin may contain a hydroxyl group, a carboxyl group or an epoxy group. Acrylic resins are acrylonitrile, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, acrylic acid, 2-hydroxyethyl (meth) acrylate, methyl (meth) acrylate, styrene monomer, glycidyl It can be obtained through single or two or more types of copolymerization of monomers such as (meth) acrylate, isooctyl acrylate and stearyl methacrylate. Moreover, it is preferable that the weight average molecular weights of said acrylic resin are 100,000-3,000,000. The content of the acrylic resin is used in a ratio of 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of the phenoxy resin. In this case, when the content of the acrylic resin is less than 0.1 parts by weight with respect to 100 parts by weight of the phenoxy resin, the tape may be torn due to high adhesive strength with the sealing resin during the detapping process at room temperature, 10 weight In the case of excess portion, the adhesive force between the pressure-sensitive adhesive and the sealing resin may be deteriorated, thereby causing a problem of bleed-out or flash during the sealing resin sealing process.

In addition, the glass transition temperature of the pressure-sensitive adhesive composition of the pressure-sensitive adhesive tape for producing electronic components according to the present invention is preferably 80 ~ 150 ℃, and the normal temperature adhesive strength of the pressure-sensitive adhesive layer to the stainless steel material of 0 ~ 1 gf / 50mm desirable. If the glass transition temperature is lower than 80 ° C, the change of physical properties of the pressure-sensitive adhesive at the high temperature becomes too severe due to the thermal history during the QFN process, and if the lamination temperature is higher than 150 ° C, the lamination temperature of the tape becomes 170 ° C or higher, and the warpage after lamination ( warpage) This is because the thermal expansion of the lead frame is severe, the difference in thermal expansion with the tape increases, and eventually the warpage phenomenon increases.

Hereinafter, the present invention can be implemented in the following forms, and the present invention is not limited by the embodiment.

[Example]

100 g of phenoxy resin (Kukdo Chemical, YP50) is dissolved in 300 g of methyl ethyl ketone, and 1 g of acrylic resin (Samwon, AT5910), 15 g of isocyanate-based thermosetting agent (Dow Corning, CE138), energy ray curable compound 20 g of phosphorus aliphatic polyurethane acrylate (Japan Synthetic, UV7600B80) and 2 g of acryl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. The stirred pressure-sensitive adhesive composition was applied to a 25 μm-thick polyimide film (LN, Kolon) and dried in a 150 ° C. dryer for about 3 minutes. Its thickness was found to be about 6 mu m. The dried tape passed through the dryer was subjected to an energy ray curing step for irradiating ultraviolet rays to form an additional crosslinked structure, thereby producing a final adhesive tape for electronic component manufacturing.

Comparative Example 1

100 g of phenoxy resin (Kukdo Chemical, YP50) is dissolved in 300 g of methyl ethyl ketone, and 15 g of isocyanate-based thermosetting agent (Dow Corning, CE138), aliphatic polyurethane acrylate (Japan) Synthesis, UV7600B80) 20g and 2g of acryl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. The stirred pressure-sensitive adhesive composition was applied to a 25 μm-thick polyimide film (LN, Kolon) and dried in a 150 ° C. dryer for about 3 minutes. Its thickness was found to be about 6 mu m. The dried tape passed through the dryer was subjected to an energy ray curing step for irradiating ultraviolet rays to form an additional crosslinked structure, thereby producing a final adhesive tape for electronic component manufacturing.

Comparative Example 2

100g of acrylic resin (Samwon, AT5910) was dissolved in 320g of ethyl acetate as a main agent of the adhesive, 10g of isocyanate-based thermosetting agent (Dow Corning, CE138), 25g of aliphatic polyurethane acrylate (Japan Synthetic, UV7600B80), an energy ray-curable compound, 0.5 g of epoxy acrylate (CYTEC, EB600), 0.1 g of silicone acrylate, and 1 g of an acryl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. Epoxy and silicone acrylates were added to prevent the development of adhesive force at high temperature lamination and the adhesive residue during detapping. The stirred solution was applied to a polyimide film (LN, Kolon) having a thickness of 25 μm and dried in a 150 ° C. dryer for about 3 minutes. The thickness was found to be about 6 mu m. The dried tape passed through the dryer was irradiated with ultraviolet light in a nitrogen atmosphere to form an additional crosslinked structure, and the amount of ultraviolet light was about 300 mJ / cm 2.

The adhesive tapes for manufacturing the electronic parts manufactured in Examples and Comparative Examples were evaluated, respectively, and are shown in Table 1 below.

division Example Comparative Example 1 Comparative Example 2 Room Temperature Adhesion to ST304 Plate none none Almost none Lamination Condition Hot press, 200 ℃, 2MPa, 20s Leadframe marks remaining on adhesive layer after detapping Distinct Distinct Tackiness of adhesive layer Sealing resin leak none none Leaked Detapping at room temperature possible impossible possible

As can be seen in Table 1, the room temperature adhesive strength of the STS 304 material of the embodiment including the acrylic resin in the phenoxy resin was not able to be measured, and the lead frame marks remaining on the pressure-sensitive adhesive layer after the tapering were also clearly observed. . In addition, there was no leakage of the sealing resin after the sealing resin encapsulation process, and detapping was possible at room temperature without additional thermal process.

On the other hand, in the case of Comparative Example 1 to which only phenoxy resin was applied, physical properties were similar to those of Example, but it was difficult to remove the tape when detapping at room temperature. In addition, in the case of Comparative Example 2 to which the acrylic resin was applied, the fine adhesive force between the adhesive and the STS 304 material remained. It can be assumed that the inherent adhesion properties of acrylic resins cannot be eliminated through UV curing, or due to the softness or flexibility of the adhesive layer coming from the acrylic chain of the polymer (weight average molecular weight ~ 800,000), the adhesive force by van der Waals or polar group This may be due to the fine cohesion resulting from the increase of the adhesive surface due to the physical deformation of the pressure sensitive adhesive layer. In addition, in the case of Comparative Example 2, it was confirmed that such a low adhesive force caused a serious resin leakage problem in the sealing resin encapsulation process, and the lead frame surface was contaminated with the sealing resin. Examination of the traces of the leadframe pattern remaining after detapping confirmed that the adhesive was agglomerated by pressing around the dyna land marks, which caused the relatively soft adhesive layer to be deformed due to the flow of resin at high temperature and pressure during the sealing resin process. This suggests the possibility of facilitating resin leakage.

Although the present invention has been described in detail only with respect to the above embodiments and comparative examples, it will be apparent to those skilled in the art that various modifications and changes are possible within the scope of the present invention, and such modifications and modifications belong to the appended claims. It is natural.

Claims (6)

In the adhesive tape for electronic component manufacturing,
An adhesive tape for producing an electronic component comprising a heat-resistant base material and an adhesive layer on which the pressure-sensitive adhesive composition is applied.
The pressure-sensitive adhesive composition includes a phenoxy resin, an acrylic resin, a thermosetting agent, an energy ray curable acrylic resin, a photoinitiator,
The pressure-sensitive adhesive layer is cured by heat curing and energy rays,
The pressure-sensitive adhesive composition comprises 0.1 to 10 parts by weight of acrylic resin, 5 to 20 parts by weight of thermosetting agent and 5 to 30 parts by weight of the energy ray-curable acrylic resin, relative to 100 parts by weight of the phenoxy resin,
The photoinitiator comprises 0.5 to 10 parts by weight relative to 100 parts by weight of the energy ray-curable acrylic resin,
The phenoxy resin is characterized in that 5 to 40 parts by weight with respect to 100 parts by weight of an organic solvent, characterized in that the adhesive tape for manufacturing electronic components. The method of claim 1,
The heat-resistant substrate has a thickness of 5 ~ 100㎛, glass transition temperature of 110 ~ 450 ℃, the thermal expansion coefficient of the substrate at 100 ~ 200 ℃ 1 ~ 35 ppm / ℃, characterized in that the room temperature elastic modulus of 1 ~ 10GPa Adhesive tape for electronic component manufacturing. The method of claim 1,
The phenoxy resin is a phenoxy resin or a modified phenoxy resin, characterized in that the weight average molecular weight of 1,000 to 500,000, the adhesive tape for producing electronic components. The method of claim 1,
Glass transition temperature of the pressure-sensitive adhesive composition is characterized in that 80 ~ 150 ℃, the adhesive tape for electronic component manufacturing. The method of claim 1,
The energy ray-curable acrylic resin is a pressure-sensitive adhesive tape for producing electronic components, characterized in that the resin having at least one carbon double bond in the molecule. delete