KR101123080B1 - Carrier module for test handler - Google Patents

Abstract

The present invention relates to a carrier module of a test handler which can be accurately grasped and terminated without damaging a lead or ball formed in the lower part of the semiconductor device. The carrier module of the test handler of the present invention accommodates the semiconductor device (P). A carrier body 210 having a space portion 211 formed therein and a receiving portion 212 formed at one side and the other side of the space portion 211; A plurality of buttons 220 respectively installed at the receiving portions 212 of the carrier body 210; A plurality of guide pins 230 respectively inserted into the buttons 220; The first guide hole 240a into which the guide pin 230 is inserted is formed in the first direction X and communicates with the first guide hole 240a in a second direction Y different from the first direction X. A plurality of latches 240 in which second guide holes 240b are formed; It is composed of a plurality of elastic members 250 are connected to the receiving portion 212 and a plurality of buttons 220 to provide an elastic force to the button 220, the guide pin 230 by the movement of the button 220 The latch 240 is opened / closed by moving along the first guide hole 240a and the second guide hole 240b.

Handler, Carrier, Module, Latch, Pin, Guide, Hole

Description

Carrier module for test handler

The present invention relates to a carrier module of a test handler, and more particularly, to a carrier module of a test handler capable of accurately grasping and releasing without damaging a lead or a ball formed in a lower portion of a semiconductor device.

When manufacturing of the semiconductor device is completed, the test is performed using a test handler, and the semiconductor device is selected as good or defective according to the test result. The semiconductor device is mounted to a plurality of carrier modules installed in a tray during a test by using a test handle.

Referring to the accompanying drawings, a conventional carrier module for mounting a semiconductor device is as follows.

1A is a perspective view illustrating a carrier module used in a conventional test handler, and FIGS. 1B to 1D are partial perspective views illustrating a state of fixing various kinds of devices used in the conventional test handler.

In the tray 11, a plurality of images (predetermined frame shapes) 13 are formed in parallel at equal intervals in a rectangular frame 12, and the images 13 are formed in a frame facing the two images 13 ( One IC carrier 16 is housed in the carrier housing 15, respectively, in accordance with the plurality of attachment pieces 14 at the start portions 12a and 12b of 12, respectively. It is fixed to the attachment piece 14 by two by the fastener 17. As shown in FIG.

The outer shape of each of the IC carriers 16 is formed in the same shape at regular intervals, and the semiconductor element 18 is accommodated in the IC carrier 16. The shape of the IC receiving portion 19 of the IC carrier 16 is determined corresponding to the shape of the semiconductor element 18 accommodated in this way. Here, the IC accommodating portion 19 is formed with a rectangular recess. The both ends of the IC carrier 16 are provided with the attachment hole 21 and the guide pin insertion hole 22 of the attachment piece 14, respectively.

The tray 11, on which the IC carrier 16 is mounted, passes through the center of the IC carrier transfer device, receives the semiconductor element 18 in the IC carrier 16 in the middle thereof, and then applies a predetermined test temperature. Thereafter, a test corresponding to the semiconductor element is performed, and the semiconductor element 18 is accommodated in the takeout tray in accordance with the test result.

In order not to be displaced from the position of the semiconductor element 18 in the IC carrier 16, one corresponding latch 23 is conventionally shown in Figs. 1B and 1D, and the body 27 of the IC carrier 16 ) Is installed.

In the conventional latch 23, the latch 23 corresponding to the lower portion of the IC accommodating portion 19 protrudes integrally with the upward body 27, and is made of a resin material constituting the body 27 of the IC carrier 16. By using elasticity, the IC element 18 is accommodated in the IC accommodating part 19, and it is taken out from the IC accommodating part 19, and moves simultaneously with the IC adsorption pad 24 which adsorbs the semiconductor element 18. FIG. After the two latches 23 have a wide interval in the latch release mechanism 25, the semiconductor element 18 is accommodated or taken out. The latch release mechanism 25 is detached from the latch 23, and the latch 23 returns to its original state by the elastic force, and the upper part of the semiconductor device 18 accommodated is fixed to both sides.

As shown in FIG. 1D, another conventional embodiment, one end of the latch 23 provided corresponding to the side wall of the IC housing portion 19 is integrally formed, and the upper ends of the semiconductor devices 18 housed on both sides thereof. The control piece 26 which faces the upper part of the semiconductor element 18, and which is provided so that it may move is provided.

Since the conventional carrier module requires a separate carrier module suitable for each semiconductor device for semiconductor devices having various thicknesses and sizes, there is a problem in that it takes a long time to replace a carrier module suitable for each semiconductor device.

In addition, when the contact between the semiconductor device and the latch, the semiconductor device is scratched or damaged due to the latch, thereby lowering the reliability of the product.

An object of the present invention is to solve the above problems, it is configured to be suitable for a semiconductor device having a variety of thickness and size to the carrier module of the test handler that can reduce the replacement time of the carrier module according to the size of the semiconductor device The point is to provide.

Another object of the present invention is that the first guide hole and the second guide hole in which the guide pin is inserted are formed in different directions so that the latch does not fall freely so that the lead or the ball formed on the lower portion of the semiconductor device due to the free fall of the latch. It is to provide a carrier module of the test handler which can prevent the damage and can be gripped accurately.

It is still another object of the present invention to provide a carrier module of a test handler in which a latch of the latch is formed on the latch to prevent the latch from being reversed so that the latch can be easily opened and released.

The carrier module of the test handler of the present invention includes a carrier body having a space for accommodating a semiconductor device, the receiving body being formed at one side and the other side of the space; A plurality of buttons each installed at a receiving portion of the carrier body; A plurality of guide pins each inserted into the button; A plurality of latches in which a first guide hole into which the guide pin is inserted is formed in a first direction and a second guide hole is formed to communicate with the first guide hole in a second direction different from the first direction; Consists of a plurality of elastic members connected to the receiving portion and the plurality of buttons, respectively, to provide elastic force to the button, the guide pin is moved along the first guide hole and the second guide hole by the movement of the button to open / close the latch It is characterized by.

Since the carrier module of the test handler of the present invention can be easily released after testing by fastening semiconductor devices having various thicknesses and sizes, the overall work time is saved and the work efficiency is increased.

In addition, the carrier module of the test handler is formed by forming the first guide hole and the second guide hole in which the guide pins are inserted in different directions so that the latch does not fall freely. There is an advantage that can be held accurately without damaging the ball.

In addition, since the carrier module of the test handler of the present invention can stably hold and release the semiconductor device by changing the structure of the latch and the button structure, damage of the semiconductor device can be reduced and cost can be reduced. .

(Example)

An embodiment of a carrier module of the test handler of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view of the carrier module of the test handler of the present invention, Figure 3 is a cross-sectional view of the carrier module showing the closed state of the latch shown in Figure 2, in particular Figure 3 is a cross-sectional view taken along line AA of the carrier module shown in FIG. to be.

2 and 3, the carrier module of the test handler of the present invention includes a carrier body 210, a plurality of buttons 220, a plurality of guide pins 230, a plurality of latches 240 and a plurality of elastic members ( 250).

Carrier body 210 is to support the overall carrier module of the present invention is formed with a space portion 211 for accommodating the semiconductor device (P), each receiving portion (one side and the other side of the space portion 211 ( 212) is formed. A plurality of buttons 220 are each installed in the receiving portion 212 of the carrier body 210, a plurality of guide pins 230 are each inserted into the button 220. The guide pin 230 moves along the first guide hole 240a and the second guide hole 240b by the movement of the button 220 to open / close the latch 240. Each of the plurality of latches 240 has a first guide hole 240a in which the guide pin 230 is inserted in a first direction X, and has a first direction in a second direction Y different from the first direction X. The second guide hole 240b is formed to communicate with the guide hole 240a. The plurality of elastic members 250 are respectively connected to the receiving portion 212 and the plurality of buttons 220 to provide an elastic force to the button 220.

Referring to the carrier module configuration of the present invention having the above configuration in more detail as follows.

The carrier body 210 has a space 211 for accommodating the semiconductor device P in the center thereof, and the housing 212 is formed at both sides, that is, one side and the other side of the space 211. The space 211 is preferably formed in a rectangular shape to accommodate the semiconductor device P having a rectangular shape. Receiving portions 212 formed on both sides of the space portion 211 is provided with a button 220, a guide pin 230, a latch 240 and an elastic member 250 to be described later.

The plurality of buttons 220 is composed of a button body 221 and a plurality of protruding members 222, as shown in Figs. 3, 4A and 4B, respectively. 4A is an enlarged and exploded perspective view of the button and the latch, and FIG. 4B is a perspective view showing another embodiment of the button shown in FIG. 4A.

The button body 221 is installed in the receiving portion 212 of the carrier body 210, the groove 221a for connecting the elastic member 250 is formed on the upper portion, the insertion groove 221b is formed on the lower portion. . The plurality of protruding members 222 are formed to face the lower portion of the button body 221. That is, it is formed to be located on both sides of the insertion groove (221b) formed in the lower portion of the button body 221. Each of the plurality of protruding members 222 is integrally formed at the lower portion of the button body 221 and a fixing hole 222a for fitting the guide pin 230 is formed. The latch 240 is inserted into and inserted into the guide pin 230 between the plurality of protruding members 222, and one groove 221a is formed on the upper part of the upper part of the button body 221 or the plurality of grooves 221a are inserted therein. ) Can be formed. In the case where one groove 221a is formed, the plurality of elastic members 250 are connected to each other by applying one spring as shown in FIG. 4A, whereas in the case where the plurality of grooves 221a are formed, as shown in FIG. 4B. As described above, the plurality of elastic members 250 are each formed of a plurality of springs, and the plurality of springs are respectively connected to the plurality of grooves 221a.

When a plurality of springs are connected to the button body 221, it is possible to provide greater elastic force when only one spring is connected. That is, when the button 220 is lowered by the elastic force of the elastic member 250, the latch 230 provides more solidity to the semiconductor device P by providing a greater elastic force when a plurality of springs are used. It is possible to grip the space portion 211 of the carrier body 210.

As shown in FIGS. 3, 4A, and 4B, the plurality of latches 240 have a first guide hole 240a formed in the first direction X, and a second direction Y different from the first direction X. The second guide hole 240b is formed to communicate with the first guide hole 240a, and the first direction X and the second direction Y cross each other at an angle θ of 60 to 120 degrees (degree). . Each of the plurality of latches 240 includes a latch fixing pin 241 and a latch body 242.

The latch fixing pin 241 is fixedly installed on the receiving portion 212 of the latch body, and the latch body 242 is installed to be inserted into the latch fixing pin 241 and rotated, and the first guide in the first direction (X). The hole 240a is formed, and the second direction Y and the second guide hole 240b different from the first direction X are formed to communicate with the first guide hole 240a. As such, when the first guide hole 240a and the second guide hole 240b formed in the latch body 242 are formed in different directions (X, Y), the button 220 is moved by the elastic member 250. As the guide pin 230 is guided and moved in the first guide hole 240a and the second guide hole 240b, the latch 240 does not fall freely. Accordingly, the latch 240 can be stably gripped without damaging a lead or a ball (not shown) formed in the lower portion of the semi-elementary body P in a state in which the latch 240 is not freely dropped by the elastic force of the elastic member 250.

The latch body 242 inserted into the latch fixing pin 241 and rotated is formed with a guide curved surface 242a, a flat surface 242b, and a reversing prevention jaw 242c. The guide curved surface 242a is formed to be rotated by being guided by the insertion groove 221b formed in the lower portion of the button 220 on one side of the latch body 242, that is, the insertion groove 221b formed in the button body 221. The surface 242b is formed to extend with the guide curved surface 242a and is formed to be seated in the insertion groove 221b formed at the bottom of the button 220. The latch body 242 has a hole 242d through which the latch fixing pin 241 is inserted.

The reversal prevention jaw 242c is formed between the guide curved surface 242a and the flat surface 242b to prevent the reversal of the latch 240, and the height h1 of the reversal prevention jaw 242c is lower than the latch body 242. It is formed smaller than the height h2. Here, the height h1 of the bump 242c is 0.3 to 0.4 mm, and the lower height h2 is preferably 0.55 to 0.7 mm, but the height h1 of the bump 242c is 0.4 mm and the lower height h2 is 0.6 mm was applied.

Each of the plurality of elastic members 250 is applied with one spring. The elastic member 250 may be a plurality of springs are applied. One spring is connected to the button 220 when the elastic member 250 is composed of one spring, and each spring is connected to the button 220 when the elastic member 250 is composed of a plurality of springs, that is, two springs. To provide elasticity to the button 220.

An operation of the carrier module of the test handler of the present invention having the above configuration will be described with reference to FIGS. 3 to 5.

First, as shown in FIG. 3, when the plurality of latches 240 hold the semiconductor device P, the plurality of latches 240 are substantially horizontal in the first direction X with respect to the semiconductor device 200. Gripping in the state. That is, when the plurality of latches 240 hold the semiconductor device P, the flat surface 242b of the latch 240 is inserted in close contact with the insertion groove 221b formed under the button 220, and the latches The reversal prevention jaw 242c of the 240 is appropriately pressed by the button 220. In addition, the button 220 is pressed to receive an appropriate elastic force by the elastic member 250 installed on the upper portion of the button 220.

When the driving source (not shown) presses the lower portion of the button 220 in the direction of the arrow a2 as shown in FIG. 5 while the latch 240 holds the semiconductor device P, the guide pin 230 is connected to the second guide. Guided by the hole 240b to move in the vertical direction, the button 220 is to release the force for pressing the latch 24. That is, the button 220 leaves the inversion prevention step 242c of the latch 240, and the latch 240 is in a state of being adhered to the surface of the semiconductor device P only. When the button 220 continuously pushes the button 220 in the state where the button 220 is separated from the reversal prevention jaw 242c, the guide pin 230 is moved from the second guide hole 240b to the first guide hole 240a to latch. Push 240).

When the guide pin 230 pushes the latch 240, the latch 240 is rotated clockwise by using the latch fixing pin 241 as the rotation axis, so that the guide curved surface 242a of the latch 240 is lower than the button 220. It comes in contact with. When the guide curve surface 242a is further pushed further in the state in which the button 240 is in contact with the lower portion of the button 220, the guide curved surface 242a is further rotated in the clockwise direction to the insertion groove 221b formed in the lower portion of the button 220 ), The latch 240 rotates clockwise as shown in FIG. 5 to completely release the grip of the semiconductor device P. Referring to FIG. In this state, the semiconductor device P can be separated from the space portion 211 of the carrier body 210 by a picker (not shown) or other adsorption means.

When the new semiconductor device P is accommodated in the space portion 211 of the carrier body 210, the button 240 is released by the elastic member 250 by releasing a force pushing the button 240. a1) to descend in the vertical direction. When the button 240 is lowered, the guide pin 230 is guided to the first guide hole 240a and lowered to push the latch 240. When the latch 240 is pushed by the guide pin 230, the latch 240 is rotated counterclockwise so that the guide curved surface 242a of the latch 240 is separated from the insertion groove 221b formed at the bottom of the button 220. The guide pin 230 is interlocked with the button 240 to move from the first guide hole 240a to the second guide hole 240b.

When the guide pin 230 is completely moved to the lower side of the second guide hole 240b as shown in FIG. 3, the lower portion of the button 220 is seated on the flat surface 242b of the latch 240 to stop the rotation. That is, as the button 220 is seated closely on the flat surface 242b beyond the reversal prevention jaw 242c of the latch 240, the latch 240 grips the semiconductor device P again.

As described above, when the latch 240 is rotated counterclockwise to grip the semiconductor device P, the guide pin 230 is guided and moved to the first guide hole 240a and the second guide hole 240b. The 240 may hold the semiconductor device P without free fall. As a result, the latch 240 may reduce the impact applied to the semiconductor device P when the semiconductor device P is held, thereby forming a lead or ball formed under the semiconductor device P by the latch 240. To reduce damage to the back.

The carrier module of the test handler of the present invention is applied to the field of test handlers for testing semiconductor devices, and is also widely applicable to the field of semiconductor devices for holding (grips) semiconductor devices or other components.

1A to 1D are cross-sectional views showing a conventional carrier module.

2 is a plan view of a carrier module of the test handler of the present invention;

3 is a cross-sectional view of the carrier module showing a closed state of the latch shown in FIG.

Figures 4a and 4b is an exploded perspective view of the button and latch shown in Figure 2,

5 is a cross-sectional view of a carrier module showing an open state of the latch shown in FIG.

Description of the Related Art [0002]

210: carrier body 211: space part

212: receiving portion 220: button

221: button body 222: protruding member

230: guide pin 240: latch

241: latch fixing pin 242: latch body

250: elastic member

Claims (10)

A space for accommodating a semiconductor device, the carrier body having a receiving portion formed on one side and the other side of the space portion, a plurality of buttons respectively provided on the receiving portion of the carrier body, and a plurality of guides inserted in the buttons, respectively. A plurality of latches having a first guide hole in which the guide pin is inserted, the second guide hole being formed in a first direction and communicating with the first guide hole in a second direction different from the first direction; In the carrier module of the test handler consisting of an elastic member connected to the plurality of buttons and each of which provides an elastic force to the button, The plurality of buttons are each installed in the receiving portion of the carrier body and a groove for connecting the elastic member is formed in the upper portion and a plurality of protrusions formed to face the lower body of the button body and the insertion groove is formed in the lower portion It is composed of a member, each of the plurality of protruding member is formed with a fixing hole for fitting the guide pin, the latch is inserted into the guide pin between the plurality of protruding member is inserted, The plurality of latches and the latch fixing pin is fixed to each of the receiving portion of the latch body; It is inserted into the latch fixing pin is installed so as to rotate, the first guide hole is formed in the first direction and the second body and the second direction and the second guide hole different from the first direction formed of the latch body formed in communication with the first guide hole The latch body is not rotated so that the guide pin is guided to the first guide hole and the second guide hole by the elastic member so that the latch body does not fall freely. The latch body has a guide curved surface that is guided by the insertion groove formed in the button body between the plurality of protruding members formed on the button on one side, is formed to extend to the guide curved surface formed on the button body between the plurality of protruding members A flat surface seated in the insertion groove is formed, and a reverse prevention jaw is formed between the guide curved surface and the flat surface to prevent reversal of the latch, and the height of the reverse prevention jaw is formed smaller than the lower height of the latch body. The guide pin is a carrier module of the test handler, characterized in that for moving the button along the first guide hole and the second guide hole to open / close the latch. delete delete delete delete delete delete delete delete delete

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