KR101103908B1 - Light emitting device package - Google Patents
Light emitting device package Download PDFInfo
- Publication number
- KR101103908B1 KR101103908B1 KR1020090099926A KR20090099926A KR101103908B1 KR 101103908 B1 KR101103908 B1 KR 101103908B1 KR 1020090099926 A KR1020090099926 A KR 1020090099926A KR 20090099926 A KR20090099926 A KR 20090099926A KR 101103908 B1 KR101103908 B1 KR 101103908B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- cavity
- lens unit
- package body
- Prior art date
Links
- 239000000463 material Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 238000009826 distribution Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- ODPYDILFQYARBK-UHFFFAOYSA-N 7-thiabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2SC2=C1 ODPYDILFQYARBK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 for example Polymers 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
An embodiment relates to a light emitting device package.
The light emitting device package according to the embodiment includes a package body having a cavity; A plurality of lead electrodes disposed in the cavity; A light emitting device electrically connected to the plurality of lead electrodes; A resin material on the light emitting element disposed in the cavity; And a lens part on which a concentric pattern is formed on the resin material.
Light emitting element, package
Description
An embodiment relates to a light emitting device package.
Group III-V nitride semiconductors are spotlighted as core materials of light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties. Ⅲ-Ⅴ nitride semiconductor is made of a semiconductor material having a compositional formula of normal In x Al y Ga 1 -x- y N (0≤x≤1, 0≤y≤1, 0≤x + y≤1).
A light emitting diode (LED) is a kind of semiconductor device that transmits and receives a signal by converting electricity into infrared light or light using characteristics of a compound semiconductor.
LEDs or LDs using such nitride semiconductor materials are widely used in light emitting devices for obtaining light, and have been applied to light sources of various products such as keypad light emitting units, electronic displays, and lighting devices of mobile phones.
The embodiment provides a light emitting device package having a new structure.
The embodiment provides a light emitting device package that can improve color deviation.
The embodiment provides a light emitting device package having a concentric pattern.
The light emitting device package according to the embodiment includes a package body having a cavity; A plurality of lead electrodes disposed in the cavity; A light emitting device electrically connected to the plurality of lead electrodes; A resin material on the light emitting element disposed in the cavity; And a lens part on which a concentric pattern is formed on the resin material.
The embodiment can provide a light emitting device package having a new structure.
The embodiment can provide a light emitting device package that can improve color deviation.
The embodiment can improve the thickness of the light emitting device package.
In the description of an embodiment, each layer, region, pattern or structure may be "under" or "under" the substrate, each layer, region, pad or pattern. In the case where it is described as being formed at, "up" and "under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criteria for up / down or down / down each layer will be described with reference to the drawings.
In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.
Hereinafter, a light emitting device package according to an embodiment will be described in detail with reference to the accompanying drawings.
1 is a perspective view illustrating a light emitting device package according to a first embodiment, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG.
1 and 2, the light
The
The
The
At least a portion of the
One end of the
In addition to providing power to the
The
The
A
The space of the
At least one
The
The surface of the
The
Between the
The
The
One of the
The
A plurality of
The
The
The
The concentric
2 and 3, the center P0 of the patterns may be a groove or a pattern may be disposed, but is not limited thereto. The centers P0 of the patterns correspond to the
The first pattern P1 and the second pattern P2 of the
The angle θ2: 30 to 60 ° of the second side surface S2 of the first pattern P1 may be greater than the angle θ3 of the second side surface S2 of the second pattern P2 adjacent in the outward direction. Accordingly, the inclined second side surface S2 of each pattern may be formed such that its inclination angle gradually decreases toward the outer direction X. FIG. The θ2 is about 30 to 80 °, the θ3 is less than θ2 may be formed of 20 ~ 70 °. Accordingly, the inclined direction of each pattern is formed in a form inclined outward from the pattern center.
The heights H1 and H2 of the adjacent first pattern P1 and the second pattern P2 may be the same or different from each other, and in other cases, may be gradually lowered toward the outer direction X. The inclination angles of the patterns P1 and P2 of the
The gap G between the pattern of the
4 is a side sectional view showing a light emitting device package according to the second embodiment and an enlarged pattern thereof. In the description of the second embodiment, the same parts as the first embodiment will be denoted by the same reference numerals, and redundant description thereof will be omitted.
Referring to FIG. 4, the light emitting
In addition, the
The
In addition, the size and height of the
The light emitting
In addition, the thickness of the light emitting
5 is a side cross-sectional view illustrating a light emitting device package according to a third embodiment, and FIG. 6 is a partially enlarged view of the pattern of FIG. 5. In the description of the third embodiment, the same parts as the first embodiment will be denoted by the same reference numerals, and redundant descriptions thereof will be omitted.
5 and 6, in the light emitting
7 to 10 are diagrams illustrating an example of a pattern of a lens unit according to an exemplary embodiment.
Referring to FIG. 7, the pattern of the lens unit may be formed such that the distance T1 between the patterns is gradually smaller from the pattern center O toward the outer direction X, and the pattern size is the outer direction (from the pattern center O). It can be formed gradually smaller toward X).
Referring to FIG. 8, the pattern of the lens unit may be formed such that the distance T2 between the patterns gradually increases from the pattern center O toward the outward direction X, and the pattern size may be increased from the pattern center O to the outward direction ( It can be formed to gradually increase toward X).
Referring to FIG. 9, the pattern of the lens unit may be formed to have the same interval T3 and size between the patterns, and the upper portion of the lens unit may be formed in the shape of a convex lens as shown in FIG. 2 or may be formed flat. .
Referring to FIG. 10, the patterns of the lens unit may have different intervals (T4, T5, T6) and sizes between the regions A1, A2, A3. In addition, the pattern interval T4 of the first region A1 adjacent to the pattern center O of the lens unit is the same, and the pattern interval T5 of the second region A2 adjacent to the outside of the first region A1. Is smaller than the pattern spacing of the first region A1 and smaller than the pattern size of the first region. The pattern spacing T6 of the third region A3 adjacent to the outside of the second region A2 is the same. It may be formed to have the same size as the pattern size of the first region A1.
Such an embodiment may control the color deviation of the lens center and the lens side by varying the light distribution of the first area A1, the second area A2, and the third area A3.
In the light emitting device package according to the embodiment, the pattern of the lens portion formed on the upper portion is formed in a concentric shape, the inclination angle of each concentric pattern, the curvature of the inclined surface (one side or both sides), the spacing between the patterns, the size of the patterns, According to the array direction of the patterns, the desired light distribution shape can be realized without generating color deviation.
11 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment. In describing the fourth embodiment, the same parts as the above-described embodiments refer to the above-described embodiment, and the concentric pattern described above may be selectively applied.
Referring to FIG. 11, the light emitting
One end of the first
The other end of the second
The other end of the first
The
12 and 13 are diagrams illustrating a light distribution distribution according to the first embodiment. In the first embodiment, the measurement was carried out under the conditions of providing a resin in which a light emitting element and a yellow phosphor of a blue LED chip were added.
FIG. 12 is a light distribution distribution of blue light emitted from the light emitting device package of FIG. 1, and has a peak-to-peak directivity angle of 90 to 120 degrees, and color in all regions of the light distribution. Deviation does not occur.
FIG. 13 is a light distribution distribution of yellow light emitted from the light emitting device package of FIG. 1, and has a peak-to-peak directivity angle of 70 to 120 degrees, and color in all regions of the light distribution. Deviation does not occur.
The orientation angle distribution and the color deviation are examples, and the color deviation distribution and the orientation angle may be changed according to the pattern shape according to the embodiment disclosed above, but are not limited thereto.
The light emitting device package may be implemented as a light emitting module through an array structure using at least one or a plurality of light emitting devices, and may be used as a light source for an illumination device, an indicator device, a display device, and the like. .
Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
Although the above description has been made based on the embodiments, these are only examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.
1 is a perspective view of a light emitting device package according to a first embodiment.
2 is a cross-sectional view taken along the line A-A of FIG.
FIG. 3 is a view illustrating some patterns of the lens unit of FIG. 2.
4 is a side cross-sectional view of a light emitting device package according to the second embodiment.
5 is a side cross-sectional view of a light emitting device package according to a third embodiment.
FIG. 6 is a view illustrating some patterns of the lens unit of FIG. 5.
7 to 10 are diagrams illustrating an example of a pattern of a lens unit according to an exemplary embodiment.
11 is a side cross-sectional view of a light emitting device package according to the fourth embodiment.
12 and 13 are diagrams illustrating a light distribution of FIG. 1.
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090099926A KR101103908B1 (en) | 2009-10-20 | 2009-10-20 | Light emitting device package |
PCT/KR2010/007203 WO2011049373A2 (en) | 2009-10-20 | 2010-10-20 | Light emitting device package and lighting system including same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090099926A KR101103908B1 (en) | 2009-10-20 | 2009-10-20 | Light emitting device package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110043015A KR20110043015A (en) | 2011-04-27 |
KR101103908B1 true KR101103908B1 (en) | 2012-01-12 |
Family
ID=43900825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090099926A KR101103908B1 (en) | 2009-10-20 | 2009-10-20 | Light emitting device package |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101103908B1 (en) |
WO (1) | WO2011049373A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101515439B1 (en) * | 2013-12-26 | 2015-05-04 | (주)한성스마트엘이디 | LED lighting device |
KR101540106B1 (en) * | 2013-12-26 | 2015-07-30 | (주)한성스마트엘이디 | LED lighting device |
WO2016014450A1 (en) * | 2014-07-21 | 2016-01-28 | CoreLed Systems, LLC | Led luminaire |
US9793450B2 (en) | 2015-11-24 | 2017-10-17 | Samsung Electronics Co., Ltd. | Light emitting apparatus having one or more ridge structures defining at least one circle around a common center |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014116687A1 (en) | 2014-11-14 | 2016-05-19 | Osram Opto Semiconductors Gmbh | Optoelectronic component and lighting device |
JP2017098414A (en) * | 2015-11-24 | 2017-06-01 | 三星電子株式会社Samsung Electronics Co.,Ltd. | Light-emitting device |
CN109416163B (en) * | 2016-05-04 | 2021-05-04 | Lg伊诺特有限公司 | Lighting module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03148493A (en) * | 1989-10-21 | 1991-06-25 | Ngk Insulators Ltd | Device for enlarging band of drum can |
JP2007088093A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Light-emitting device |
KR100744031B1 (en) * | 2005-12-21 | 2007-08-01 | 서울반도체 주식회사 | Luminescent device having fresnel lens |
KR100869573B1 (en) * | 2007-05-29 | 2008-11-21 | 삼성전기주식회사 | Difussion lense, optical device and lighting apparutus thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8297801B2 (en) * | 2004-07-16 | 2012-10-30 | Osram Sylvania Inc. | Light emitting diode disc optic with heat sink housing |
US7595515B2 (en) * | 2005-10-24 | 2009-09-29 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
TWM318731U (en) * | 2007-03-02 | 2007-09-11 | Everlight Electronics Co Ltd | Illumination device |
JP3148493U (en) * | 2008-11-07 | 2009-02-19 | 一品光学工業股▲ふん▼有限公司 | Convex Fresnel LED lens and its LED assembly |
-
2009
- 2009-10-20 KR KR1020090099926A patent/KR101103908B1/en active IP Right Grant
-
2010
- 2010-10-20 WO PCT/KR2010/007203 patent/WO2011049373A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03148493A (en) * | 1989-10-21 | 1991-06-25 | Ngk Insulators Ltd | Device for enlarging band of drum can |
JP2007088093A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Light-emitting device |
KR100744031B1 (en) * | 2005-12-21 | 2007-08-01 | 서울반도체 주식회사 | Luminescent device having fresnel lens |
KR100869573B1 (en) * | 2007-05-29 | 2008-11-21 | 삼성전기주식회사 | Difussion lense, optical device and lighting apparutus thereof |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101515439B1 (en) * | 2013-12-26 | 2015-05-04 | (주)한성스마트엘이디 | LED lighting device |
KR101540106B1 (en) * | 2013-12-26 | 2015-07-30 | (주)한성스마트엘이디 | LED lighting device |
WO2016014450A1 (en) * | 2014-07-21 | 2016-01-28 | CoreLed Systems, LLC | Led luminaire |
US9285098B2 (en) | 2014-07-21 | 2016-03-15 | CoreLed Systems, LLC | LED luminaire |
US9793450B2 (en) | 2015-11-24 | 2017-10-17 | Samsung Electronics Co., Ltd. | Light emitting apparatus having one or more ridge structures defining at least one circle around a common center |
Also Published As
Publication number | Publication date |
---|---|
WO2011049373A2 (en) | 2011-04-28 |
WO2011049373A3 (en) | 2011-07-14 |
KR20110043015A (en) | 2011-04-27 |
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