KR101096478B1 - 노광 장치 - Google Patents
노광 장치 Download PDFInfo
- Publication number
- KR101096478B1 KR101096478B1 KR1020107021093A KR20107021093A KR101096478B1 KR 101096478 B1 KR101096478 B1 KR 101096478B1 KR 1020107021093 A KR1020107021093 A KR 1020107021093A KR 20107021093 A KR20107021093 A KR 20107021093A KR 101096478 B1 KR101096478 B1 KR 101096478B1
- Authority
- KR
- South Korea
- Prior art keywords
- reticle
- pattern
- partial
- exposure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009826 distribution Methods 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims description 24
- 230000007246 mechanism Effects 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 187
- 239000000758 substrate Substances 0.000 abstract description 155
- 238000005286 illumination Methods 0.000 abstract description 52
- 238000003384 imaging method Methods 0.000 abstract description 31
- 230000009467 reduction Effects 0.000 abstract description 21
- 230000002093 peripheral effect Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 description 30
- 238000012546 transfer Methods 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 15
- 238000001514 detection method Methods 0.000 description 12
- 230000008859 change Effects 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000004075 alteration Effects 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 230000010355 oscillation Effects 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010436 fluorite Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 229910017768 LaF 3 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
도 2a 는 농도 필터의 구성의 일례를 나타내는 상면도이다.
도 2b 는 농도 필터에 형성되는 마크의 일례를 나타내는 도면이다.
도 3 은 본 실시형태의 노광 장치에서 사용되는 레티클의 구성을 나타내는 도면이다.
도 4a 및 도 4b 는 조도 분포 검출 센서의 구성을 나타내는 도면이다.
도 5 는 레티클을 사용하여 반도체 집적 회로 등의 마이크로 디바이스를 제조할 때의 제조 공정을 설명하기 위한 도면이다.
도 6 은 쇼트 영역에 최초의 부분 패턴을 전사하는 상황을 나타내는 도면이다.
도 7 은 쇼트 영역에 2번째의 부분 패턴을 전사하는 상황을 나타내는 도면이다.
도 8 은 쇼트 영역에 3번째의 부분 패턴을 전사하는 상황을 나타내는 도면이다.
도 9 는 레티클의 얼라인먼트 기구를 나타내는 도면이다.
Claims (16)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 감응 물체 상에 설정된 구획 영역에 전사해야 할 패턴이 형성된 마스크를 통해 노광하는 노광 장치로서,
상기 구획 영역에 전사해야 할 패턴이 복수의 부분 패턴으로 분할되어 형성된 마스크를 적어도 3개의 지지 위치에서 수평하게 지지하는 지지 장치와, 상기 지지 장치에 지지된 상기 마스크에 형성된 상기 부분 패턴의 어느 하나와, 상기 감응 물체에 설정된 상기 구획 영역을 분할한 부분 구획 영역의 어느 하나와의 상대적인 위치를 조정하는 조정 장치를 구비한 것을 특징으로 하는 노광 장치. - 제 9 항에 있어서,
상기 지지 장치는 상기 구획 영역에 전사해야 할 패턴을 복수의 가늘고 긴 직사각형 형상의 영역으로 분할하여, 그 가늘고 긴 직사각형 형상의 영역을 그 길이 방향을 나타내는 제 1 방향에 직교하는 제 2 방향으로 배열적으로 형성한 마스크를 지지하고, 상기 조정 장치는 상기 가늘고 긴 직사각형 형상의 영역을 상기 부분 패턴으로 하여 위치 조정을 행하는 것을 특징으로 하는 노광 장치. - 제 10 항에 있어서,
상기 지지 장치는 상기 적어도 3 개의 지지 위치 중 상기 마스크의 일방의 변을 따라 배치된 2 개의 지지 위치를 지나는 제 3 방향과 상기 제 1 방향이 평행해지도록 상기 마스크를 지지한 것을 특징으로 하는 노광 장치. - 제 10 항에 있어서,
상기 지지 장치는 상기 지지 위치의 2개를 지나는 제 3 방향에 대한 상기 마스크의 휨량 및 그 제 3 방향에 수평면 내에서 직교하는 제 4 방향에 대한 상기 마스크의 휨량 중 그 휨량이 큰 것에 관한 방향과 상기 제 2 방향이 평행해지도록 상기 마스크를 지지한 것을 특징으로 하는 노광 장치. - 제 9 항 내지 제 12 항 중 어느 한 항에 있어서,
상기 부분 패턴의 이미지를 상기 감응 물체 상에 투영하는 투영계를 더 구비하고, 상기 조정 장치는 상기 투영계의 이미지면과 상기 감응 물체를 상대 이동하는 포커스 조정 기구 및 레벨링 조정 기구의 적어도 일방을 포함하는 것을 특징으로 하는 노광 장치. - 제 13 항에 있어서,
상기 마스크의 지지에 수반되는 휨량을 상기 부분 패턴의 위치와의 관계로 미리 구하여 기억된 기억 장치와, 상기 기억 장치에 기억된 휨량에 기초하여, 상기 포커스 조정 기구 및 상기 레벨링 조정 기구의 적어도 일방을 제어하는 제어 장치를 더 구비한 것을 특징으로 하는 노광 장치. - 제 9 항 내지 제 12 항 중 어느 한 항에 있어서,
상기 조정 장치는 상기 부분 패턴의 일부와 이것에 인접하는 부분 패턴의 일부가 중첩되도록 위치 조정을 행하는 것을 특징으로 하는 노광 장치. - 제 15 항에 있어서,
상기 부분 패턴이 중첩되는 중첩부를 노광하는 노광광의 에너지 분포를 서서히 작아지도록 경사적으로 설정하는 감광 (減光) 장치를 더 구비한 것을 특징으로 하는 노광 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003014457 | 2003-01-23 | ||
JPJP-P-2003-014457 | 2003-01-23 | ||
PCT/JP2004/000570 WO2004066371A1 (ja) | 2003-01-23 | 2004-01-23 | 露光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057013382A Division KR101019389B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117024284A Division KR101205262B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100120219A KR20100120219A (ko) | 2010-11-12 |
KR101096478B1 true KR101096478B1 (ko) | 2011-12-20 |
Family
ID=32767401
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117024284A Expired - Fee Related KR101205262B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
KR1020057013382A Expired - Fee Related KR101019389B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
KR1020107021093A Expired - Fee Related KR101096478B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117024284A Expired - Fee Related KR101205262B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
KR1020057013382A Expired - Fee Related KR101019389B1 (ko) | 2003-01-23 | 2004-01-23 | 노광 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2004066371A1 (ko) |
KR (3) | KR101205262B1 (ko) |
WO (1) | WO2004066371A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101441844B1 (ko) * | 2003-08-21 | 2014-09-17 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
TW201837984A (zh) * | 2004-11-18 | 2018-10-16 | 日商尼康股份有限公司 | 曝光裝置、曝光方法、及元件製造方法 |
US7738692B2 (en) * | 2006-07-20 | 2010-06-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of determining quality of a light source |
JP5007538B2 (ja) * | 2006-08-30 | 2012-08-22 | 株式会社ニコン | 露光装置、デバイスの製造方法及び露光方法 |
US10256132B2 (en) * | 2016-04-28 | 2019-04-09 | Varian Semiconductor Equipment Associates, Inc. | Reticle processing system |
KR102685228B1 (ko) * | 2017-03-31 | 2024-07-15 | 가부시키가이샤 니콘 | 패턴 산출 장치, 패턴 산출 방법, 마스크, 노광 장치, 디바이스 제조 방법, 컴퓨터 프로그램, 및, 기록 매체 |
KR20240017069A (ko) | 2021-07-05 | 2024-02-06 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 플랫 패널 디스플레이의 제조 방법, 그리고 노광 데이터 작성 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000068738A1 (fr) * | 1999-05-07 | 2000-11-16 | Nikon Corporation | Table de montage, micro-appareil, masque photographique, procede d'exposition, et procede de fabrication d'appareil |
JP2001102277A (ja) * | 1999-09-27 | 2001-04-13 | Toshiba Corp | 濃度フィルタ、露光装置及び露光方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4924257A (en) * | 1988-10-05 | 1990-05-08 | Kantilal Jain | Scan and repeat high resolution projection lithography system |
JP3307988B2 (ja) * | 1992-07-17 | 2002-07-29 | 株式会社ニコン | 投影露光方法及び装置 |
JP3316697B2 (ja) * | 1992-10-22 | 2002-08-19 | 株式会社ニコン | 投影光学装置、レーザ装置、走査型露光装置、走査露光方法、及び該方法を用いたデバイス製造方法 |
JPH1145846A (ja) * | 1997-07-25 | 1999-02-16 | Nikon Corp | 走査型露光方法及び装置 |
WO2000059012A1 (fr) * | 1999-03-26 | 2000-10-05 | Nikon Corporation | Procede et dispositif d'exposition |
JP4189086B2 (ja) | 1999-06-30 | 2008-12-03 | 株式会社東芝 | 濃度フィルタ |
JP2001318470A (ja) * | 2000-02-29 | 2001-11-16 | Nikon Corp | 露光装置、マイクロデバイス、フォトマスク、及び露光方法 |
JP2001319871A (ja) * | 2000-02-29 | 2001-11-16 | Nikon Corp | 露光方法、濃度フィルタの製造方法、及び露光装置 |
JP2001358062A (ja) * | 2000-04-11 | 2001-12-26 | Nikon Corp | 露光方法及び露光装置 |
-
2004
- 2004-01-23 WO PCT/JP2004/000570 patent/WO2004066371A1/ja active Application Filing
- 2004-01-23 JP JP2005508121A patent/JPWO2004066371A1/ja active Pending
- 2004-01-23 KR KR1020117024284A patent/KR101205262B1/ko not_active Expired - Fee Related
- 2004-01-23 KR KR1020057013382A patent/KR101019389B1/ko not_active Expired - Fee Related
- 2004-01-23 KR KR1020107021093A patent/KR101096478B1/ko not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000068738A1 (fr) * | 1999-05-07 | 2000-11-16 | Nikon Corporation | Table de montage, micro-appareil, masque photographique, procede d'exposition, et procede de fabrication d'appareil |
JP2001102277A (ja) * | 1999-09-27 | 2001-04-13 | Toshiba Corp | 濃度フィルタ、露光装置及び露光方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004066371A1 (ja) | 2006-05-18 |
KR101205262B1 (ko) | 2012-11-27 |
KR20110131288A (ko) | 2011-12-06 |
KR20100120219A (ko) | 2010-11-12 |
KR20050092434A (ko) | 2005-09-21 |
KR101019389B1 (ko) | 2011-03-07 |
WO2004066371A1 (ja) | 2004-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3567152B2 (ja) | リソグラフィック装置、デバイス製造方法、およびその方法により製造したデバイス | |
KR100824572B1 (ko) | 노광방법 및 노광장치 | |
US6710847B1 (en) | Exposure method and exposure apparatus | |
US6607863B2 (en) | Exposure method of production of density filter | |
US6842225B1 (en) | Exposure apparatus, microdevice, photomask, method of exposure, and method of production of device | |
US8440375B2 (en) | Exposure method and electronic device manufacturing method | |
EP1083462A1 (en) | Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device | |
US7034922B2 (en) | Exposure apparatus and exposure method | |
JP2001318470A (ja) | 露光装置、マイクロデバイス、フォトマスク、及び露光方法 | |
WO1999066370A1 (fr) | Procede relatif a l'elaboration d'un masque | |
US10678152B2 (en) | Layout method, mark detection method, exposure method, measurement device, exposure apparatus, and device manufacturing method | |
KR20010085449A (ko) | 광학 결상 시스템에서의 광행차 측정 방법 | |
EP2135137A1 (en) | Exposure method and electronic device manufacturing method | |
US8343693B2 (en) | Focus test mask, focus measurement method, exposure method and exposure apparatus | |
JP2014140071A (ja) | 露光方法及び露光装置、並びにデバイス製造方法 | |
JP2002353108A (ja) | 露光方法、露光装置、フォトマスク、デバイス製造方法、及びフォトマスク製造方法 | |
JPWO2002025711A1 (ja) | 結像特性の計測方法及び露光方法 | |
KR101096478B1 (ko) | 노광 장치 | |
JP5668999B2 (ja) | 露光方法及び露光装置、並びにデバイス製造方法 | |
JP2003224055A (ja) | 露光方法及び露光装置 | |
JPWO2002047132A1 (ja) | X線投影露光装置およびx線投影露光方法および半導体デバイス | |
JP5397596B2 (ja) | フレア計測方法及び露光方法 | |
JP2005079470A (ja) | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 | |
JP2002141262A (ja) | 表面状態の検出方法及びマイクロデバイスの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20100920 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110104 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20110914 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20110104 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
A107 | Divisional application of patent | ||
AMND | Amendment | ||
J201 | Request for trial against refusal decision | ||
PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20111014 |
|
PJ0201 | Trial against decision of rejection |
Patent event date: 20111014 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20110914 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20111117 Appeal identifier: 2011101007531 Request date: 20111014 |
|
PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20111014 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20111014 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20110304 Patent event code: PB09011R02I |
|
B701 | Decision to grant | ||
PB0701 | Decision of registration after re-examination before a trial |
Patent event date: 20111117 Comment text: Decision to Grant Registration Patent event code: PB07012S01D Patent event date: 20111115 Comment text: Transfer of Trial File for Re-examination before a Trial Patent event code: PB07011S01I |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20111214 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20111214 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20141120 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20141120 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20151118 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20151118 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20161122 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20161122 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20171120 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20171120 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20181129 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20181129 Start annual number: 8 End annual number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20191202 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20191202 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20201201 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20211201 Start annual number: 11 End annual number: 11 |
|
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20230925 |