KR101089172B1 - Step scribing method of bonded substrate and its control system - Google Patents

Abstract

The method relates to a step scribing method and a control system for a stepped substrate in which a scribing line is first formed on a stepped part of the bonded substrate to shorten the scribing process. Providing a pair of mother substrates including a dummy region and a second dummy region, moving each of the pair of upper and lower wheels to the first and second dummy regions of the pair of mother substrates, The first dummy area and the second dummy after the first scribing step and the first scribing step of scribing the stepped portions of the first dummy area and the second dummy area with a pair of upper and lower wheels. And a second scribing step of scribing a portion of the area free of steps with the pair of upper and lower wheels.

By using the above step scribing method of the bonded substrate and the control system thereof, the scribing process can be reduced and the time required for scribing can be shortened, thereby reducing the production cost.

Bonding, mosquito board, wheel, head, scribing

Description

Step scribing method of assembling substrates and control system

The present invention relates to a step scribing method and a control system of a bonded substrate, and in particular, a step of scribing a bonded substrate that shortens the scribing process by first forming a scribing line in the stepped portion of the bonded substrate. And a control system.

Generally, a liquid crystal display device includes a liquid crystal display panel including a driving circuit unit, a backlight unit disposed under the liquid crystal display panel to emit light to the liquid crystal display panel, and supporting the backlight unit and the liquid crystal display panel. It consists of a mold frame (mold frame) and case (case).

In addition, the liquid crystal display panel is formed by forming thin film transistor array substrates on a large area mother substrate, color filter substrates on a separate mother substrate, and then bonding the two mother substrates to each other. The unit is manufactured through a process of cutting into a liquid crystal display panel.

In general, cutting of the unit liquid crystal display panel is performed by forming a scribe line on the surface of the mother substrate using a wheel having a hardness higher than that of glass, and causing cracks to propagate along the scribing line.

FIG. 1 is a schematic cross-sectional view of a liquid crystal display panel in which a first mother substrate on which thin film transistor array substrates are formed and a second mother substrate on which color filter substrates are formed are bonded.

As shown in FIG. 1, the unit liquid crystal display panels are formed such that one side of the thin film transistor array substrates 1 protrudes from the color filter substrates 2. This is because a gate pad portion (not shown) and a data pad portion (not shown) are formed at edges of the thin film transistor array substrates 1 that do not overlap the color filter substrates 2.

Accordingly, the color filter substrates 2 formed on the second mother substrate 30 may have a first dummy region corresponding to an area where the thin film transistor array substrates 1 formed on the first mother substrate 20 protrude. Are spaced apart by (31).

In addition, each of the unit liquid crystal display panels may be appropriately disposed so as to make the best use of the first and second mother substrates 20 and 30, and depending on the model, the unit liquid crystal display panels generally have a second dummy area ( 32) spaced apart.

After the first mother substrate 20 on which the thin film transistor array substrates 1 are formed and the second mother substrate 30 on which the color filter substrates 2 are formed are bonded, the liquid crystal display panels are cut. That is, the first dummy region 31 formed on the color filter substrates 2 of the second mother substrate 30 and the second dummy region 32 spaced apart from the unit liquid crystal display panels are removed.

The cutting process of the liquid crystal display panel as described above will be described with reference to FIG. 2.

2 is an exemplary view schematically illustrating a cutting process of a liquid crystal display panel.

As shown in FIG. 2, the bonded substrate 101 on which the plurality of panel regions 111 are disposed and bonded to each other is separated through the conveying unit to separate the individual unit liquid crystal display panels 110 along the panel regions 111. It is transferred to the crushing unit. Here, the upper panel region may be an array substrate on which a thin film transistor is formed through an array process, and the lower panel region may be a color filter substrate on which a color filter is formed through a color filter process. The upper array substrate and the lower color filter substrate are bonded to each other to form one unit liquid crystal display panel 110.

The bonded substrate 101 transferred to the scribing unit includes a first scribing partitioning the panel region 111 in the first direction on the front and rear surfaces of the bonded substrate 101 through the scribing unit 180. Lines 151 are formed. At this time, the scribing unit 180 is provided with a pair of heads (not shown), so that the first scribing process is repeated four times in the first direction, that is, the X-axis direction, on the bonded substrate 101. The first scribing lines 151 are formed in the axial direction. As described above, the bonded substrate 101 having the first scribing process in the first direction is driven on the front and rear surfaces of the bonded substrate 101 by driving the head provided in the scribing unit 180 in the Y-axis direction. Second scribing lines 152 may be formed to partition the panel region 111 in a second direction. At this time, the second scribing lines 152 are formed on the bonded substrate 101 by repeating the eighth scribing process in the second direction, that is, the Y-axis direction.

In the scribing unit 180 as described above, the bonding substrate 101 is formed to form the first scribing lines 151 and the second scribing lines 152 on the front and rear surfaces of the bonding substrate 101. One head is provided on the upper and lower parts of the head), and each head is equipped with a scribing wheel made of a material having a higher hardness than glass. After the scribing process in the first direction and the second direction is completed, the bonded substrate 101 is separated into unit liquid crystal display panels 110 along the scribing lines 151 and 152 in the break process.

In the above scribing process, as shown in FIG. 3, the scribing process is performed from a direction in which a pair of upper and lower head portions are proceeded without distinguishing between the first dummy region and the second dummy region.

In this scribing process, scribing is performed three times when scribing the stepped portion on the bonded substrate without distinguishing the first dummy region and the second dummy region.

That is, in part A of FIG. 3, the upper wheels 181 and the lower wheels 182 provided at the upper and lower heads respectively simultaneously scan the first portions 331 and 231 without the step between the first dummy region and the second dummy region. After crushing, at part B, the upper wheel 181 scribes the stepped second part 332 of the first dummy area, and at part C, the upper roller 183 supports the second mother substrate. In the state, the lower wheel 182 scribes the stepped third portion 232 of the second dummy region of the first mother substrate.

As described above, when scribing the first portions 331 and 231 first before scribing the stepped portion, the third portion 232 may have the roller 183 as shown in FIG. 3. The scribing line had to be formed using.

Therefore, there was a problem in that the scribing precision cannot be maintained in the third portion. Moreover, when the scribing line of the part without a step | step is produced first and the scribing line of the part with a step | step is produced, there existed a problem that a crack direction cannot keep a straight line because of board | substrate bending.

In addition, as described above, there was also a problem that a large amount of time was consumed by scribing three times.

SUMMARY OF THE INVENTION An object of the present invention is to provide a step scribing method and control system for a bonded substrate that prevents warping of the end of a substrate by performing scribing of the stepped portion first. .

Another object of the present invention, by using a multi-scribing device scribing the stepped portion and the stepped portion at the same time at the same time with the parallax at the same time to reduce the scribing process time while preventing warpage of the substrate end To provide a step scribing method and a control system of the substrate.

It is still another object of the present invention to provide a step scribing method and control system for a bonded substrate that reduces the number of steps in the scribing process to increase the production efficiency.

In order to achieve the above object, the step scribing method of the bonded substrate according to the present invention comprises the steps of: providing a bonded substrate on which a plurality of panel regions are disposed and bonded, wherein the first dummy region and the second dummy region are formed; Moving each of the upper and lower wheels to the first dummy region and the second dummy region of the cemented substrate, and a first scribing portion having the step difference between the first dummy region and the second dummy region with the upper and lower wheels. And a second scribing step of scribing an unstepped portion of the first dummy area and the second dummy area with the upper and lower wheels after the scribing step and the first scribing step. .

In still another aspect, there is provided a method of scribing a bonded substrate according to the present invention, the method comprising: providing a bonded substrate including a plurality of panel regions disposed and bonded to each other, wherein the panel includes a first dummy region and a second dummy region; Moving the two pairs of upper and lower wheels to the first dummy region and the second dummy region of the second dummy region, the stepped portions of the first dummy region and the second dummy region, and the first dummy region and the second dummy region, respectively. Starting scribing any one of the stepped portion and the stepless portion with a pair of upper and lower wheels, and following another portion with the other pair of upper and lower wheels with a predetermined time difference after starting the preceding scribing. And starting to scribe.

In another step of the scribing method of the bonded substrate according to the present invention, a plurality of panel regions are arranged and bonded, the first dummy region of the upper portion, and the second dummy of the lower portion larger than the first dummy region Providing a bonded substrate including a region, and moving a pair of upper and lower wheels to a portion where there is no step between the first dummy region and the second dummy region of the bonded substrate; Moving a pair of wheels and a lower roller, and moving a pair of lower wheels and an upper roller to a stepped portion of the second dummy area, the pair of upper and lower wheels, a pair of upper wheels and a lower roller, a lower wheel and an upper Starting prescribing with any one pair of rollers, starting scribing halfway with any one of the remaining two pairs with a predetermined time difference after the start of the preceding scribing, After Lai ice starts with a predetermined time difference is characterized in that it comprises the steps beginning glacial trailing scribing the remaining pairs.

Here, the preceding scribing portion is a portion having a step, and the trailing scribing portion is characterized in that the portion does not have a step.

Further, in the step scribing method of the bonded substrate according to the present invention, the upper and lower wheels in the step of scribing the stepped portion of the first dummy region and the second dummy region is characterized in that the position shifted from each other do.

In the step scribing method of the bonded substrate according to the present invention, the upper and lower wheels are provided in the upper and lower heads, respectively, characterized in that the position of the upper and lower heads are independently controlled.

In the step scribing method of the bonded substrate according to the present invention, the upper and lower heads are provided in plural pairs.

In addition, the step scribing control system of the bonded substrate according to the present invention in order to achieve the above object, a plurality of panel regions are disposed and bonded, the scribing of the bonded substrate formed including a first dummy region and a second dummy region A system for controlling ice, comprising: moving means for moving an upper and lower head mounted with upper and lower wheels to the first dummy area and a second dummy area, and control means for controlling positions of upper and lower heads respectively equipped with upper and lower wheels; And, the control means is characterized in that for controlling the position of the upper and lower heads, respectively.

In addition, in order to achieve the above object, another stepped scribing control system of the bonded substrate according to the present invention includes a plurality of panel regions arranged and bonded to each other, the first dummy region of the upper and the first dummy region is wider than the first dummy region. A system for controlling the scribing of a bonded substrate including a large second dummy region, wherein the pair of upper and lower wheels is moved to a portion where there is no step difference between the first dummy region and the second dummy region of the bonded substrate, Moving means for moving a pair of upper wheels and a lower roller to a stepped portion of the first dummy area, and moving a pair of lower wheels and a top roller to a stepped portion of the second dummy area, and a pair of upper and lower wheels , A control means for independently controlling positions of the upper wheel and the lower roller pair and the lower wheel and the upper roller pair.

As described above, according to the step scribing method and control system of the bonded substrate according to the present invention, the scribing accuracy can be maintained by preventing warpage of the substrate when scribing, and the scribing accuracy can be maintained. By reducing the scribing process, it is possible to shorten the time required for scribing, thereby achieving the effect of reducing the production cost.

These and other objects and novel features of the present invention will become more apparent from the description of the present specification and the accompanying drawings.

First, a manufacturing method of a liquid crystal display panel applied to the present invention will be described with reference to FIG. 4.

4 is a flowchart schematically illustrating a method of manufacturing a liquid crystal display panel according to the present invention.

The manufacturing process of the liquid crystal display device may be classified into a driving element array process of forming a driving element on a lower array substrate, a color filter process of forming a color filter on an upper color filter substrate, and a cell process.

First, a plurality of gate lines and data lines arranged on a lower substrate to define a pixel region are formed by an array process, and thin film transistors, which are driving elements connected to the gate lines and data lines, are formed in the pixel regions, respectively (S10).

In addition, the upper substrate is formed with a color filter layer and a common electrode composed of red, green, and blue sub-color filters that implement color by a color filter process (S11).

Subsequently, after the alignment layers are applied to the upper and lower substrates, the alignment layers are oriented to provide an alignment control force or surface fixation force to liquid crystal molecules of the liquid crystal layer formed between the upper substrate and the lower substrate (S20, S21). . In this case, a rubbing or photoalignment method may be applied as the alignment treatment method.

In addition, the upper substrate and the lower substrate that have completed the rubbing process are inspected for defects of the alignment layer through an alignment layer inspector, form a spacer for maintaining a constant cell gap in the lower substrate, and apply a sealing material to the outer portion of the upper substrate. After the pressure is applied to the lower substrate and the upper substrate (S30).

On the other hand, since the lower substrate and the upper substrate is composed of a large area of the substrate, in order to manufacture a single unit liquid crystal display panel, the bonded mother substrate is scribed (S40).

Thereafter, a braking process of cutting the scribing line formed in this scribing process is performed (S50).

The present invention is applied to the scribing process as described above.

Hereinafter, two embodiments of the configuration of the present invention will be described with reference to the drawings.

Example 1

5 is a configuration diagram of a step scribing control system for a bonded substrate according to Embodiment 1 of the present invention, and FIG. 6 is a view for explaining a step scribing method for a bonded substrate according to Embodiment 1 of the present invention. .

As shown in FIG. 5, the control system according to the present embodiment includes moving means 40 for moving the upper and lower heads 61 and 62 to the first dummy region and the second dummy region of the bonded substrate 101. Control means 50 for controlling the moving means 40 to position the upper and lower heads 61 and 62. Upper and lower wheels 81 and 82 are mounted to the upper and lower heads 61 and 62, respectively.

That is, the control system according to the present invention is a system for controlling the scribing of the bonded substrate 101 in which a plurality of panel regions are disposed and bonded.

A first dummy region and a second dummy region are formed in the cemented substrate 101, and the first dummy region and the second dummy region of the cemented substrate 101 are, for example, a position previously input during the bonding process. Judging by the coordinates and the like.

Therefore, the upper and lower heads 61 and 62 are moved by the moving means 40 to the first dummy region and the second dummy region of the bonded substrate 101 thus determined. In addition, since the structure of this moving means 40 is achieved by the usual scribing line forming apparatus, the detailed description is abbreviate | omitted.

In addition, the control means 50 according to the first embodiment of the present invention is configured to independently control the positions of the upper and lower heads 61 and 62, respectively.

The above-described control means 50 simultaneously scribes the second and third portions having the step difference between the first dummy region and the second dummy region with the upper and lower wheels 81 and 82, and then the first dummy region and the second dummy region. The first part without the step of the dummy area is controlled to be scribed by the upper and lower wheels 81 and 82 simultaneously.

Therefore, when scribing the stepped portion of the bonded substrate 101, the upper and lower wheels 81 and 82 form a scribing line at a position shifted from each other.

Here, the control means 50 as described above includes a conventional microprocessor and the like, and the configuration of the control means by the microprocessor and the like can be easily realized by those skilled in the art, and thus a detailed description thereof will be omitted.

In addition, the step scribing control system of the bonded substrate according to the first embodiment of the present invention is not only a single scribing apparatus provided with upper and lower heads as shown in FIG. It can also be applied to ice devices. Even in this case, since each head can be controlled independently, it acts the same as a single scribing device, of course.

Next, the step scribing method of the bonded substrate according to the first embodiment of the present invention will be described with reference to FIG. 6.

First, the control means 50 controls the moving means 40, whereby a plurality of panel regions are disposed to be stepped between the first dummy region and the second dummy region of the bonded substrate 101, ie, FIG. The upper and lower heads 61 and 62 move to the A 'portion.

Accordingly, as can be seen in the portion A ′ of FIG. 6, the upper and lower heads 61 and 62 move to the second and third portions 332 and 232 having a step difference between the first dummy region and the second dummy region. Upper and lower wheels 81 and 82 scribe the second and third portions 332 and 232 with steps between the first and second dummy regions, respectively.

That is, the upper and lower wheels 81 and 82 simultaneously scribe the second and third portions 332 and 232 having a step difference between the first dummy region and the second dummy region at positions shifted from each other. In the present exemplary embodiment, since the second and third portions 332 and 232 having a step are scribed at the same time as in the portion A ′ of FIG. 6, the crack direction may occur due to the warpage of the substrate during the scribing process. The problem of not keeping this straight line is solved.

As such, after the scribing in the portion A 'is completed, the control means 50 moves the positions of the upper and lower heads 61 and 62 to the portion B' of FIG.

The portion B ′ of FIG. 6 is a portion 331 and 231 having no step difference between the first dummy region and the second dummy region, and thus is scribed with the upper and lower wheels 61 and 82 as in the prior art.

As described above, according to the present invention, only two scribing processes are executed, and in one process, the upper and lower wheels 61 and 82 are not placed on the same line, and the second process is followed by the upper and lower wheels ( 61,82 are on the same line.

Example 2

7 is a configuration diagram of a step scribing control system for a bonded substrate according to Embodiment 2 of the present invention, and FIG. 8 is a view for explaining a step scribing method for a bonded substrate according to Embodiment 2 of the present invention. 9 is a plan view illustrating a step scribing method of a bonded substrate according to a second embodiment of the present invention.

As shown in FIG. 7, the control system according to the present embodiment is applied to a multi-scribing apparatus having a plurality of heads respectively at the top and the bottom thereof. In this case, each head can be independently controlled, of course.

Specifically, in the control system according to the present embodiment, two upper heads 61 and 63 and two lower heads 62 and 64 are respectively provided on the upper and lower portions of the bonded substrate 101, and the upper head 61 is provided. 63 and lower heads 62 and 64 are equipped with upper wheels 81 and 83 and lower wheels 82 and 84, respectively. That is, two pairs of upper and lower heads (or upper and lower wheels) are arranged.

According to the present embodiment, the upper head 61, 63 and the lower head 62, 64 are controlled by the control means 50 and the moving means 40 at the upper and lower portions of the cemented substrate 101, respectively.

The cemented substrate 101 includes a first dummy region and a second dummy region, and the first dummy region and the second dummy region of the cemented substrate 101 are, for example, a position previously input during the bonding process. Judging by the coordinates and the like.

Accordingly, the upper heads 61 and 63 and the lower heads 62 and 64 are moved by the moving means 40 to the first dummy region and the second dummy region of the bonded substrate 101 thus determined. In addition, since the structure of this moving means 40 is achieved by the usual scribing line forming apparatus, the detailed description is abbreviate | omitted.

In addition, the control means 50 according to the second embodiment of the present invention is configured to independently control the positions of the upper head (61, 63) and the lower head (62, 64), respectively.

The above-described control means 50 simultaneously scribes the second and third portions having the step difference between the first dummy region and the second dummy region with the upper and lower wheels 83 and 84, and the first dummy region with a parallax. The first part without the step of the second dummy area is controlled to be scribed by the upper and lower wheels 81 and 82 simultaneously.

That is, as shown in FIG. 9, the stepped portion of the bonded substrate 101 forms a scribing line at positions where the upper and lower wheels 83 and 84 are displaced from each other, and the portion without the stepped portion has a predetermined parallax. Another upper and lower wheels 81 and 82 form a scribing line.

Here, the control means 50 as described above includes a conventional microprocessor and the like, and the configuration of the control means by the microprocessor and the like can be easily realized by those skilled in the art, and thus a detailed description thereof will be omitted.

Next, the step scribing method of the bonded substrate according to the second embodiment of the present invention will be described with reference to FIGS. 7 to 9.

As shown in FIG. 7, first, the control means 50 controls the moving means 40 so that a plurality of panel regions are disposed and the upper portion of the first dummy region and the second dummy region of the bonded substrate 101. The heads 61 and 63 and the lower heads 62 and 64 are moved.

That is, as shown in FIG. 7 and FIG. 8, the upper and lower heads 63 and 64 are moved to the second and third portions 332 and 232 (A ′) having a step difference between the first dummy region and the second dummy region. In addition, the upper and lower heads 61 and 62 are moved to the first portions 331 and 231 (B ′) having no step.

First, the upper and lower wheels 83 and 84 scribe the second and third portions 332 and 232 having a step difference between the first dummy region and the second dummy region, respectively. In this case, the upper and lower wheels 83 and 84 simultaneously scribe the second and third portions 332 and 232 having a step difference between the first dummy region and the second dummy region at positions shifted from each other. In the present exemplary embodiment, since the second and third portions 332 and 232 having a step are scribed at the same time as in the portion 'A' of FIG. 8, the crack direction is straight due to the warpage of the substrate during the scribing process. The problem of not maintaining it is solved.

As described above, after the scribing of the portion A 'is started, another upper and lower heads 61 and 62 have a predetermined parallax and scribe the first portion 331,231 (B' portion of FIG. 8) without a step. The control means 50 is operated to ice.

As such, the reason for staggering when performing scribing is to prevent the scribing apparatus including the head from interfering with each other, and at the same time any one of A 'portion and B' portion of FIG. In order to prevent breakage of the bonded substrate by supporting the pressing force during the preceding scribing while the other part (part B 'in FIG. 8) is being subjected to the preceding scribing in the part A' in FIG. 8.

As described above, according to the present invention, the scribing time can be drastically reduced by performing only one scribing process by using the multi-scribing apparatus, but executing the part having a step and the part having no step at a time difference. have.

In the above-described embodiment 2 of the present invention, the prescribing is performed in the A 'portion, which is a stepped portion, on the contrary, the prescribing is performed in the B' portion, and the scribing is performed in the A 'portion with a predetermined time difference. It is okay to make the ice.

Example 3

10 is a configuration diagram of a step scribing control system for a bonded substrate according to Embodiment 3 of the present invention, and FIG. 11 is a view for explaining a step scribing method for a bonded substrate according to Embodiment 3 of the present invention. 12 is a plan view illustrating a step scribing method of a bonded substrate according to a third embodiment of the present invention.

As shown in FIG. 10, the control system according to the present embodiment is applied to a multi-scribing apparatus having a plurality of heads respectively at the top and the bottom thereof. In this case, each head can be independently controlled, of course.

Specifically, in the control system according to the present embodiment, three upper heads 61, 63, 63 ′ and lower heads 62, 64, 64 ′ are provided on the upper and lower portions of the bonded substrate 101, respectively. .

In the drawing, the bonded substrate 101 of the present embodiment is formed by including a plurality of panel regions are bonded to each other, including a first dummy region of the upper portion, and a second dummy region of the lower portion larger than the first dummy region. The subject was made. However, it goes without saying that the first dummy region may be a bonded substrate having a larger width than the second dummy region.

The upper head 61 and the lower head 62 are mounted with the upper wheel 81 and the lower wheel 82, respectively, and the upper head 63 and the lower head 64 'are equipped with the upper wheel 83 and the lower roller 84', respectively. The lower head 64 is equipped with an upper wheel 83 'and a lower roller 84, respectively. That is, three pairs of upper and lower heads 61, 62, 63, 64 ', 63', 64 are arranged adjacent to each other. In the drawing, a wheel or roller is mounted on one head, but the wheel and the roller may be installed together on one head, and one of them may be selectively used.

According to the present embodiment, the upper heads 61, 63, 63 'and the lower heads 62, 64, 64' are controlled by the control means 50 and the moving means 40 at the upper and lower portions of the bonded substrate 101, respectively. Position is controlled.

The first dummy region and the second dummy region of the cemented substrate 101 are determined by, for example, position coordinates previously input in the bonding process.

Accordingly, the upper heads 61, 63, 63 ′ and the lower heads 62, 64, 64 ′ are moved to the moving means 40 to the first dummy region and the second dummy region of the bonded substrate 101 determined as described above. Are moved respectively.

In detail, the pair of upper and lower wheels 81 and 82 are moved to the portion where the first dummy region and the second dummy region of the cemented substrate 101 do not have a step by the moving means 40, and the first dummy region. One pair of the upper wheel 83 and the lower roller 84 'is moved to the stepped portion of the, and one pair of the lower wheel 84 and the upper roller 83' is moved to the stepped portion of the second dummy area.

Since the configuration of the moving means 40 is achieved by a conventional scribing line forming apparatus, a detailed description thereof will be omitted.

In addition, the control means 50 according to the third embodiment of the present invention is configured to independently control the positions of the upper head 61, 63, 63 'and the lower head 62, 64, 64'.

The above-described control means 50 simultaneously scribes the first portions 331 and 231 without the step difference between the first and second dummy regions with the upper and lower wheels 81 and 82, and the upper and lower wheels 81 and 82 of the upper and lower wheels 81 and 82, respectively. Scribing the second part 332 with the step difference of the first dummy area with the upper wheel 83 at a time lag and a scribing time point, The stepped third portion 232 of the two dummy areas is controlled to be scribed with the lower wheel 84. As a result, the three pairs of upper and lower heads 61, 62, 63, 64 ', 63', 64 start scribing with a time difference from each other.

According to this embodiment, while the upper wheel 83 is scribing the upper surface of the bonded substrate 101, the lower roller 84 'proceeds at the same time while the lower roller 84' is in contact. Similarly, while the lower wheel 84 is scribing the lower surface of the cemented substrate 101, the upper surface of the lower wheel 84 proceeds simultaneously with the upper roller 83 '.

The upper roller 83 'and the lower roller 84' cancel the bending moment due to the pressing force of the lower wheel 84 and the upper wheel 83, respectively, so that precise scribing is possible and the substrate is bonded during scribing. To prevent the 101 from being broken.

Here, the control means 50 as described above includes a conventional microprocessor and the like, the configuration of the control means by such a microprocessor can be easily realized by those skilled in the art, a detailed description thereof will be omitted.

Next, the step scribing method of the bonded substrate according to the third embodiment of the present invention will be described with reference to FIGS. 10 to 12.

As shown in FIG. 10, first, the control means 50 controls the moving means 40, so that a plurality of panel regions are arranged and bonded to the first dummy region and the second dummy region of the bonded substrate 101. The upper head 61, 63, 63 'and the lower head 62, 64, 64' are moved.

That is, as shown in FIGS. 10 and 11, the upper and lower heads 61 and 62 are moved to the first portions 331 and 231 (B ′) having no step between the first dummy region and the second dummy region. The upper and lower heads 63 and 64 'are moved to the stepped second part 332 (A' part) of the first dummy area, and the third part 232 (C ') with the stepped part of the second dummy area. Part) to move the upper and lower heads 63 'and 64).

Then, when the upper roller 83 'supports the upper surface of the bonded substrate 101, the lower wheel 84 has a lower surface of the bonded substrate 101 at the third portion 232 having the step of the second dummy region. Scribe (preceding scribing process).

Next, when the lower roller 84 'supports the lower surface of the cemented substrate 101 at a time difference from the scribing start time of the lower wheel 84, the upper wheel 83 has a step difference of the first dummy region. In the second portion 332 which is present, scribing of the top surface of the bonded substrate 101 starts (intermediate scribing process).

Subsequently, the upper and lower wheels 81 and 82 scribe the first portions 331 and 231 having no step difference between the first dummy region and the second dummy region, respectively, with a time difference between the scribing start time of the upper wheel 83. Start (following scribing process).

As such, the reason for staggering when performing scribing is to prevent the scribing apparatus including the head from interfering with each other.

The scribing start time is somewhat parallax, but after the parallax has elapsed, scribing is performed while the three pairs of heads move simultaneously.

In the present embodiment, the scribing is supported by the lower roller 84 'and the upper roller 83' in the second and third portions 332 and 232 having a step as shown in portions A 'and C' of FIG. In this case, the problem that the crack direction did not maintain a straight line due to the warpage of the substrate during the scribing process of the stepped portion is solved.

As such, the control means 50 operates to scribe at a predetermined time difference in the order of C '-> A'-> B '.

As described above, according to the present invention, the scribing time can be drastically reduced by performing only one scribing process by using the multi-scribing apparatus, but executing the part having a step and the part having no step at a time difference. have.

In the third embodiment of the present invention described above, scribing is performed in the order of C 'to A' and B ', which is a stepped portion of the second dummy region, but the order may be arbitrarily performed.

As mentioned above, although the invention made by this inventor was demonstrated concretely according to the said Example, this invention is not limited to the said Example and can be variously changed in the range which does not deviate from the summary.

1 is a schematic cross-sectional view of a liquid crystal display panel in which a first mother substrate on which thin film transistor array substrates are formed and a second mother substrate on which color filter substrates are formed are bonded;

2 is an exemplary view schematically showing a cutting process of a liquid crystal display panel;

3 is a view for explaining a conventional scribing process,

4 is a flowchart schematically illustrating a method of manufacturing a liquid crystal display panel according to the present invention;

5 is a configuration diagram of a step scribing control system of a bonded substrate according to Embodiment 1 of the present invention;

6 is a view for explaining a step scribing method of the bonded substrate according to the first embodiment of the present invention,

7 is a configuration diagram of a step scribing control system of a bonded substrate according to Embodiment 2 of the present invention;

8 is a view for explaining a step scribing method of the bonded substrate according to a second embodiment of the present invention,

9 is a plan view illustrating a step scribing method of a bonded substrate according to Example 2 of the present invention.

10 is a configuration diagram of a step scribing control system of a bonded substrate according to Embodiment 3 of the present invention;

11 is a view for explaining a step scribing method of a bonded substrate according to a third embodiment of the present invention;

12 is a plan view illustrating a step scribing method of a bonded substrate according to Embodiment 3 of the present invention.

Claims (16)

A plurality of panel regions are disposed and bonded to each other to provide a bonded substrate including a first dummy region and a second dummy region; Moving each of the pair of upper and lower wheels to the first dummy region and the second dummy region of the bonded substrate; A first scribing step of scribing the stepped portions of the first dummy region and the second dummy region with the upper and lower wheels; And a second scribing step of scribing the stepless portion of the first dummy area and the second dummy area with the upper and lower wheels after the first scribing step. How to Cry. A plurality of panel regions are disposed and bonded to each other to provide a bonded substrate including a first dummy region and a second dummy region; Moving two pairs of upper and lower wheels to the first dummy region and the second dummy region of the bonded substrate, respectively; Starting scribing any one of the stepped portion and the stepless portion in the first dummy region and the second dummy region with a pair of upper and lower wheels; And starting a subsequent scribing of the other part with the other pair of upper and lower wheels with a predetermined time difference after the start of the preceding scribing. Providing a bonded substrate including a plurality of panel regions disposed and bonded to each other, the first dummy region having an upper portion and a lower second dummy region having a width greater than that of the first dummy region; A pair of upper and lower wheels is moved to a portion where there is no step between the first dummy region and the second dummy region of the bonded substrate, and a pair of upper wheels and a lower roller are moved to a portion having a step of the first dummy region, and a second Moving the lower wheel and the upper roller pair to the stepped portion of the dummy area, Starting scribing with any one of the upper and lower wheel pairs, the upper wheel and lower roller pair, and the lower wheel and upper roller pair; Starting scribing with any one of the remaining two pairs with a predetermined time difference after the start of the preceding scribing; And starting the subsequent scribing with the remaining pair after the intermediate scribing with a predetermined time difference. The method according to claim 2 or 3, Wherein the preceding scribing portion is a step having a step, the trailing scribing portion is step difference scribing method, characterized in that the portion does not have a step. The method according to any one of claims 1 to 3, And in the step of scribing the stepped portions of the first dummy region and the second dummy region, the upper and lower wheels are located at positions shifted from each other. The method according to claim 1 or 2, Wherein the position of the upper and lower wheels are independently controlled step of scribing substrate, characterized in that the control. The method of claim 3, And the position of the pair of upper and lower wheels, the pair of the upper wheel and the lower roller, and the pair of the lower wheel and the upper roller are controlled independently of each other. The method of claim 1, And the upper and lower wheels are provided in plural pairs. A system for controlling scribing of a bonded substrate, wherein a plurality of panel regions are disposed and bonded to each other, the first dummy region and the second dummy region formed thereon. Moving means for moving the upper and lower wheels to the first dummy area and the second dummy area; It includes a control means for controlling the position of the upper and lower wheels, And the control means controls the positions of the upper and lower wheels independently of each other. A system for controlling scribing of a bonded substrate, wherein a plurality of panel regions are disposed and bonded to each other, the first dummy region having an upper portion and a second dummy region having a lower width than the first dummy region. A pair of upper and lower wheels is moved to a portion where there is no step between the first dummy region and the second dummy region of the bonded substrate, and a pair of upper wheels and a lower roller are moved to a portion having a step of the first dummy region, and a second A moving means for moving the lower wheel and the upper roller pair to the stepped portion of the dummy area; And a control means for independently controlling positions of the pair of upper and lower wheels, the pair of upper wheels and lower rollers, and the pair of lower wheels and upper rollers, respectively. 10. The method of claim 9, The control means scribes the stepped portion of the first dummy area and the second dummy area with the upper and lower wheels, and then scribes the portion of the first dummy area and the second dummy area without the step with the upper and lower wheels. And a step scribing control system for the bonded substrate, characterized in that the control is carried out. 10. The method of claim 9, The control means starts scribing any one of the stepped portion and the stepless portion in the first dummy region and the second dummy region with a pair of upper and lower wheels, and then moves another portion with a predetermined parallax. And a stepwise scribing control system for the cemented substrate, characterized in that it is controlled to trail scribe with another pair of upper and lower wheels. The method of claim 10, The control means, Starting scribing with any one of the upper and lower wheel pairs, the upper wheel and lower roller pair, and the lower wheel and upper roller pair; Starting scribing with any one of the remaining two pairs with a predetermined time difference after the start of the preceding scribing, and And controlling the step of starting the trailing scribing with the other pair after the start of the middle scribing with a predetermined time difference. The method according to claim 12 or 13, Wherein the preceding scribing portion is a step having a step, the trailing scribing portion step difference scribing control system of the bonded substrate, characterized in that the portion does not have a step. 14. The method according to any one of claims 11 to 13, And the upper and lower wheels are at positions displaced from each other when scribing the stepped portion. 10. The method of claim 9, The step scribing control system of the bonded substrate, characterized in that the upper and lower wheels are provided in plurality.

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