KR101043276B1 - Removing device of led inspection unit - Google Patents

Abstract

PURPOSE: An apparatus for eliminating foreign materials from a light emitting diode chip measuring unit is provided to improve the accuracy of a light emitting diode chip characteristic measuring process. CONSTITUTION: A cleaner is approached to or separated from a measuring unit. A cleaner driving unit(235) drives the cleaner. A controlling unit(240) controls the drive of the cleaner driving unit. A cleaner support supports the cleaner. A driving support supports the cleaner support to be move toward the measuring unit. A cleaner moving unit(233) approaches the cleaner or separates the cleaner from the measuring unit.

Description

Removing device of LED Inspection unit

The present invention relates to a foreign material removal device of the LED chip measuring unit, and more specifically, to remove the foreign substances present in the probe card and the probe pin of the measuring unit for measuring the characteristics of the LED chip can be accurately measured the characteristics of the LED chip It is to provide a foreign material removal device of the LED chip measuring unit.

LED (Light Emitting Diode) is a kind of light emitting device that emits light by power supply and is also called a Luminescent diode.

These LEDs are small, long in life, low in power consumption, and have fast-response advantages. Recently, these LEDs have been widely used as backlight units for various display devices that require light sources, as well as light sources for small lamps and various instruments. .

The LED is manufactured in the form of a small chip using a semiconductor process. A general LED chip manufacturing process is an epitaxial process (EPI) for preparing an epi wafer on a substrate, which is a base material, and a wafer for manufacturing a plurality of LED chips. It consists of a chip process (Fabrication) and a package process (Package) for packaging the LED chip manufactured in the chip process, and an inspection process for inspecting the LED chip that went through the packaging process.

This LED chip inspection process includes a supply unit for loading the wafer supplied from the package process and supplying the LED chip on the wafer to the next inspection process, a measurement unit for measuring the characteristics of the LED chip supplied from the supply unit, and the characteristics measured at the measurement unit. And a sorting unit for classifying the LED chips according to grades, and a loading unit for loading the LED chips classified by grades in the sorting unit for each grade.

An example of the LED chip measuring unit 1 corresponding to the measuring unit is shown in FIG. 1. As shown in this figure, the measuring unit 1 is transmitted to the probe card 10 and the probe card 10 to form a test position for measuring the optical characteristics and current characteristics of the LED chip transmitted from the supply unit It has an optical measuring unit 20 and a current measuring unit 30 for measuring the optical characteristics and the current characteristics of the LED chip.

As shown in Figs. 1 and 2, the probe card 10 has a reflecting plate 11 having a measuring hole 13 in which the LED chip transmitted from the supply unit is located in the central region thereof. In addition, the optical measuring unit 20 is provided as an integrating sphere having a spherical shape in the upper region of the probe card 10 and collects a spectrum of light emitted from the LED chip and light emitted from the reflector plate 11. Measure the optical properties. In addition, the current measuring unit 30 is provided with a probe pin 31 for measuring the current characteristics while applying a current to the LED chip located in the measuring hole 13 of the reflecting plate (11).

However, in the conventional LED chip measuring unit 1, contamination by foreign matter is frequently generated in the area around the reflecting plate 11 measuring hole 13 of the probe card 10 and the probe pin 31 of the current characteristic unit. There was a problem.

The foreign matter is buried in the area around the measuring hole 13 of the reflector plate 11 of the probe card 10 and the probe pin 31 due to static electricity and self-weight by dust floating around the measuring unit 1 or on the wafer. Some of the adhesive material used to load the chip is supplied to the measuring unit while remaining on the LED chip and transferred to the probe pin 31, and the adhesive material and dust remain on the probe pin 31 continuously. It exists in form.

As a result, a problem arises in that the current characteristics of the LED chip cannot be accurately measured. In addition, the contaminated probe pin applies an incorrect current to the LED chip, which affects the light emission of the LED chip, thereby causing a problem in that the optical characteristics are not accurately measured.

Accordingly, an object of the present invention is to provide a foreign material removal device of the LED chip measuring unit that can accurately measure the characteristics of the LED chip by removing the foreign substances present on the probe card and the probe pin of the measuring unit for measuring the characteristics of the LED chip. will be.

According to the present invention, the foreign material removal apparatus of the measuring unit for measuring the optical characteristics and the current characteristics of the LED chip, the cleaner is provided to be accessible and spaced apart from the measuring unit; A cleaner driving unit for driving the cleaner; It is achieved by the foreign material removal device of the LED chip measuring unit, characterized in that it comprises a control unit for controlling the driving of the cleaner driving unit.

A cleaner support for supporting the cleaner, and a driving support for supporting the cleaner support to the measuring unit in a reciprocating manner; The cleaner driving unit preferably has a cleaner mover for approaching and separating the cleaner support body from the measuring unit with respect to the driving support, and a cleaner driver for driving the cleaner.

At this time, the cleaner support is coupled to the lifting support in the lower area of the measurement unit, it is effective that the cleaner mover is provided with a cylinder for raising and lowering the cleaner support.

The cleaner is preferably a rotary brush rotatably supported by the cleaner support, and the cleaner driver is more preferably a cleaner rotary motor for rotating the rotary brush.

The control unit may include a cleaning cycle setting unit for setting a cleaning cycle and transferring a cleaning execution signal to the controller; It is more effective to have a cleaning time setting section for setting the cleaning time required and delivering a cleaning end signal to the control section.

In this case, when the cleaning execution signal is transmitted from the cleaning period setting unit, the control unit preferably controls the cleaner driving unit to approach and drive the cleaner.

In addition, when the cleaning end signal is transmitted from the cleaning time setting unit, the control unit is effective to control the cleaner driving unit so that the cleaner is spaced apart from the measuring unit.

On the other hand, the object is, according to another embodiment of the present invention, the foreign material removal apparatus of the measuring unit for measuring the optical characteristics and the current characteristics of the LED chip, the cleaner spaced apart from the measuring unit; A cleaner driver for driving the cleaner; A probe card provided in the measuring unit to measure characteristics of the LED chip; A stage supporting the probe card so as to be accessible and spaced apart from the cleaner; A stage driver for driving the stage; It is also achieved by the foreign material removal device of the LED chip measuring unit, characterized in that it comprises a control unit for controlling the driving of the cleaner driver and the stage driver.

Here, the cleaner is installed in the lower region of the probe card, the stage is supported to move the probe card in the X-axis, Y-axis, Z-axis and θ axis to the cleaner side, the stage driver is the stage and the X-axis It is preferable to move on the Y axis, the Z axis, and the θ axis.

The cleaner is a rotary brush, and the cleaner driver is effectively a cleaner rotary motor for rotating the rotary brush.

The control unit may include a cleaning cycle setting unit for setting a cleaning cycle and transferring a cleaning execution signal to the controller; It is more preferable to have a cleaning time setting section for setting the cleaning time required and delivering a cleaning end signal to the control section.

In this case, when the cleaning execution signal is transmitted from the cleaning period setting unit, the controller may more effectively control the stage driver and the cleaner driver so that the probe card approaches and is driven by the cleaner.

In addition, when the cleaning end signal is transmitted from the cleaning time setting unit, the control unit preferably controls the cleaner driver and the stage driver so that the probe card is spaced apart from the cleaner after the cleaner is stopped.

According to the present invention, there is provided a foreign material removal device of the LED chip measuring unit that can accurately measure the characteristics of the LED chip by removing the foreign substances present in the probe card and the probe pin of the measuring unit for measuring the characteristics of the LED chip.

1 is a side view of a conventional LED chip measuring unit,
Figure 2 is an enlarged perspective view of the probe card of the measuring unit of Figure 1,
Figure 3 is a side view of the LED chip measuring unit having a foreign matter removing apparatus according to the present invention,
Figure 4 is a perspective view of the installation area of the foreign material removal device of the LED chip measuring unit according to the first embodiment of the present invention,
5 and 6 are side views of Figure 4 for explaining the driving of the debris removal device,
7 is a control block diagram of the foreign material removing apparatus of FIGS. 4 to 6;
8 is a control flow chart of the foreign material removing apparatus of FIGS. 4 to 6;
Figure 9 is a perspective view of the installation area of the foreign material removal device of the LED chip measuring unit according to a second embodiment of the present invention,
10 and 11 is a side view of Figure 9 for explaining the driving of the debris removal device,
12 is a control block diagram of the foreign substance removing apparatus of FIGS. 9 to 11;
13 is a control flow chart of the foreign matter removing apparatus of FIGS. 9 to 11.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a side view of the LED chip measuring unit having a foreign matter removing apparatus according to the present invention. As shown in this figure, the foreign material removing apparatus 201, 301 according to the present invention is installed so as to approach and space relative to each other relative to the probe card 110 in the lower region of the probe card 110 of the measuring unit 101. .

At this time, the mutual access and separation of the probe card 110 and the foreign matter removing device (201, 301) is the foreign matter removal device 201 approaches and probe card 110 according to the form that the LED chip is supplied to the probe card (110). Examples of spaced apart (hereinafter described as the first embodiment of the present invention), or probe card 110 is approached and spaced apart from the foreign matter removing apparatus 301 (hereinafter described in the second embodiment) It can be configured as.

Hereinafter, embodiments of the present invention will be described. For reference, the first embodiment described below relates to a foreign matter removing apparatus 201 that can be applied to a form in which LED chips are loaded on a wafer and transferred to a lower portion of the probe card 110. The foreign material removing apparatus 201 moves to the probe card 110 while the wafer is not supplied during the driving.

In addition, the second embodiment relates to a foreign matter removal device 301 that can be applied to a form in which the LED chip is individually loaded on the chip block of the rotary index (not shown) and continuously transferred to the probe card 110. In order to drive the removal device 301, the probe card 110 moves to the foreign material removal device 301.

4 is a perspective view of a foreign matter removal device installation area of the LED chip measuring unit according to the first embodiment of the present invention, Figures 5 and 6 are views for explaining the driving of the foreign material removal device as a side view of FIG. 4 is a control block diagram of the debris removing device of FIGS. 4 to 6, and FIG. 8 is a flow chart of the debris removing device of FIGS. 4 to 6.

As shown in the drawings, the foreign material removing apparatus 201 of the LED chip measuring unit according to the first embodiment includes a cleaner 210 and a cleaner 210 for removing foreign substances present in the measuring unit 101. A cleaner support unit 220 for supporting the cleaner supporter 220, a cleaner drive unit 230 for driving the cleaner 210 while approaching and separating the cleaner supporter 220 toward the probe card 110 of the measurement unit 101, and a cleaner drive unit. The controller 240 controls the driving of the unit 230.

5 and 6, the cleaner 210 is rotated around the measuring hole 113 of the probe card 110 and the reflecting plate 111 of the measuring unit and the probe pin 131 of the current measuring unit 130 by rotating ( Hereinafter, it may be provided with a soft rotating brush for removing foreign substances such as dust present in the 'cleaning area'. At this time, the cleaner 210 is rotated by the cleaner driver 235 of the cleaner driving unit 230 to be described later in a state rotatably coupled to the cleaner support 220.

Here, the cleaner 210 may be provided in various forms in addition to the rotary brush form, for example, the air spray is installed on the cleaner support 220 to spray the compressed air delivered from the air compressor to the area to be cleaned to remove the foreign matter It may be provided as a nozzle, or may be provided as an ultrasonic cleaner for removing foreign matter in the area to be cleaned using ultrasonic waves.

The cleaner support 220 reciprocates so as to approach and space the probe card 110 when the cleaner mover 233 of the cleaner driving unit 230 to be described later is driven while supporting the cleaner 210. The reciprocating movement of the 220 is from a position spaced apart from the lower region of the probe card 110 of the measuring unit 101 by allowing the cleaner support 220 to be lifted and coupled to the driving support 231 of the cleaner driving unit 230 which will be described later. The reflective plate 111 of the probe card 110 is preferably provided to elevate to the area adjacent to the lower portion.

At this time, the reciprocating movement of the cleaner support 220 may be implemented as a reciprocating movement in the X-axis direction or the Y-axis direction, not the lifting movement, which is the cleaner driving unit 230 to be described later. Probe from the position spaced apart from one side of the probe card 110 of the measurement unit 101 by the drive of the cleaner driving unit 230 is coupled to the drive support 231 of the drive support 231 in the X-axis direction or Y-axis direction The card 110 may be implemented to reciprocate to an area adjacent to a lower portion of the measuring hole 113 of the reflector plate 111.

Alternatively, the reciprocating movement of the cleaner support 220 is measured by driving the cleaner drive unit 230 while the cleaner support 220 is rotatably supported by the driving support 231 of the cleaner drive unit 230 which will be described later. It may also be implemented to reciprocate to the area adjacent to the lower portion of the measuring plate 113 of the reflecting plate 111 of the probe card 110 from the position spaced on one side of the unit (101).

On the other hand, the cleaner driving unit 230 is a driving support 231 for supporting the cleaner support 220 to approach and spaced apart from the probe card 110 side of the measuring unit 101, and to reciprocate the cleaner support 220 The cleaner mover 233 and a cleaner driver 235 for driving the cleaner 210 may be provided.

The driving support 231 supports the cleaner support 220 to be liftable. For this purpose, the driving support 231 and the cleaner support 220 are preferably provided with lifting guides that are liftably coupled to each other.

The driving support 231 may have a structure for supporting the cleaner support 220 according to the reciprocating movement of the cleaner support 220. For example, as described above, when the cleaner support member 220 is configured to reciprocate in the X-axis or Y-axis direction, a sliding guide coupling structure in the X-axis or Y-axis direction is provided on the driving support 231 and the cleaner support 220. As described above, if the cleaner support 220 is a reciprocating structure, the driving support 231 and the cleaner support 220 may be provided with a rotatable coupling structure that is rotatably coupled to each other.

The cleaner mover 233 may be provided in one region of the driving support 231 to provide a cylinder for elevating the cleaner support 220 to the probe card 110 side of the measuring unit 101. The cylinder is provided with a hydraulic cylinder or a pneumatic cylinder and the cylinder shaft may be configured to lift the cleaner support 220 to the probe card 110 side of the measuring unit 101.

The cleaner mover 233 may also be provided in various configurations according to the reciprocating movement of the cleaner support 220. When the cleaner support 220 is a structure in which the cleaner support 220 is lifted or reciprocated in the X-axis or Y-axis, In addition to the cylinder as described above, it may be configured by a combination of a motor and a cam or a motor and a rack and pinion, and the cleaner support 220 may be configured as a forward and reverse motor for reciprocating the cleaner support 220 when the structure is a reciprocating rotation. Can be.

In addition, the cleaner driver 235 is preferably provided as a cleaner rotating motor for rotating the cleaner 210 of the rotary brush type while being supported under the cleaner support 220.

On the other hand, the controller 240 drives the cleaner mover 233 and the cleaner driver 235 of the cleaner drive unit 230 based on a cleaning cycle and cleaning execution time which are set in advance. In this case, the cleaning period may be set at regular time intervals or at intervals of measuring times of the LED chips whose characteristics are measured in the measuring unit 101.

To this end, the control unit 240 may include a cleaning period setting unit 241. The cleaning period setting unit 241 may be provided as a timer for checking the time or a counter for checking the number of times the LED chip is measured. Can be.

As a result, the controller 240 may control the cleaning execution driving of the cleaner mover 233 and the cleaner driver 235 in response to the cleaning execution signal transmitted from the cleaning cycle setting unit 241.

In addition, the controller 240 may include a cleaning time setting unit 243 for setting a cleaning time. When the cleaning period setting unit 241 described above is provided as a timer, the cleaning time setting unit 243 sends a cleaning end signal to the control unit 240 so that cleaning can be stopped after cleaning for a predetermined time using the timer. I can deliver it.

Accordingly, the control unit 240 may control the cleaning stop driving of the cleaner driver 235 and the clear mover in response to the cleaning end signal transmitted from the cleaning time setting unit 243.

With this configuration, the foreign material removal process of the LED chip measuring unit according to the first embodiment will be described with reference to FIGS. 5 and 6, and FIGS. 7 and 8.

First, when a cleaning execution signal is transmitted from the cleaning cycle setting unit 241 in the process of measuring the characteristics of the LED chips in the measuring unit 101 (S01 in FIG. 7), the LED chips are cut off from the supply to the measuring unit 101 and measured. There is no LED chip on the unit 101. At this time, the cleaner 210 is spaced apart from the lower region of the probe card 110, as shown in FIG.

Then, the controller 240 drives the cleaner mover 233 to move the cleaner support 220 to the measurement unit 101 as shown in FIG. 6 (S02). As a result, the cleaner 210 approaches the probe hole 131 around the measurement hole 113 of the reflector 111 and the probe pin 131 of the current measurement unit 130 under the probe card 110.

Then, the controller 240 drives the cleaner driver 235 until the cleaning end signal is transmitted from the cleaning time setting unit 243 (S03). As a result, the cleaner 210 removes foreign substances such as dust existing in the vicinity of the measuring hole 113 of the reflecting plate 111 and the probe pin 131 of the current measuring unit 130.

When the cleaning end signal is transmitted from the cleaning time setting unit 243 (S04), the controller 240 stops driving the cleaner driver 235 (S05), and the cleaner support 220 measures the measuring unit 101. The cleaner mover 233 is driven to return to be spaced apart from (S06). As a result, the cleaner 210 is spaced apart from the probe hole 110 in the space around the measurement hole 113 of the reflector 111 and the probe pin 131 of the current measurement unit 130 as shown in FIG. 5. Will move.

When the cleaning of the measuring unit 101 is finished in this way, the LED chips are supplied to the measuring unit 101 again, and the optical measuring unit 120 and the current measuring unit 130, which are the measuring unit 101, have optical characteristics of the LED chip. The overcurrent characteristic is measured.

This process is repeatedly performed in response to the cleaning period set in advance in the cleaning period setting unit 241.

In this way, the foreign matter present in the measurement unit 101 is completely removed, the measurement unit 101 can accurately measure the characteristics of the LED chip.

9 is a perspective view illustrating an installation area of a foreign matter removing device of an LED chip measuring unit according to a second embodiment of the present invention, and FIGS. 10 and 11 are side views of FIG. 9 to explain driving of the foreign material removing device. 12 is a control block diagram of the foreign substance removing apparatus of FIGS. 9 to 11, and FIG. 13 is a flow chart of the foreign substance removing apparatus of FIGS. 9 to 11.

As shown in the drawings, the foreign material removing device 301 of the LED chip measuring unit according to the second embodiment of the cleaner 310 to remove the foreign substances present in the measuring unit 101, the cleaner 310 A cleaner driver 335 for driving the engine, a stage 360 for approaching and separating the probe card 110 of the measuring unit 101 with respect to the cleaner 310, and a stage driver 350 for driving the stage 360. And a controller 340 for controlling the driving of the cleaner driver 335 and the stage driver 350.

The cleaner 310 is rotated in the same manner as in the above-described first embodiment by surrounding the reflecting plate 111 measuring hole 113 of the probe card 110 and the probe pin 131 of the current measuring unit 130 (hereinafter referred to as 'cleaning'). And a soft rotating brush for removing foreign substances such as dust present in the target region. At this time, the cleaner 310 is rotated by the cleaner driver 335 in a state rotatably coupled to the fixed cleaner support 320.

The cleaner 310 may also be provided with an air spray nozzle or an ultrasonic cleaner 310 as in the first embodiment.

The cleaner driver 335 is preferably provided as a cleaner rotating motor for rotating the cleaner 310 of the rotary brush type while being supported under the cleaner support 320.

The stage is a probe card 110 is approached and spaced apart from the cleaner 310, in terms of structural conditions, the cleaner 310 is fixed to one area below the probe card 110, the probe card 110 is It is desirable to allow the cleaner 310 to approach and be spaced apart by the Z-axis lifting drive and the X, Y-axis reciprocating drive and the θ-axis rotation drive.

To this end, the stage 360 includes an X-axis stage 361 and a Y-axis stage that are relatively movable relative to each other so as to support the lower region of the probe card 110 in the X-, Y-, Z-, and θ-axes. (363), Z-axis stage (365) and [theta] -axis stage (367).

In addition, the stage driver 350 may include an X-axis driver 351 and a Y-axis driver for driving the X-axis stage 361 and the Y-axis stage 363 and the Z-axis stage 365 and the θ-axis stage 367, respectively. 353), the Z-axis driver 355, and the θ-axis driver 357 may be provided. At this time, each driver may be implemented in a configuration such as a hydraulic cylinder or a stationary motor and cam, or a stationary motor and a rack and pinion.

When the probe card 110 approaches the cleaner 310 by the driving of the stage driver 350, the probe pin 110 around the reflecting plate 111 measuring hole 113 and the current measuring unit 130 on the probe card 110 ( 131 and the like come into contact with the cleaner 310.

The controller 340 drives the stage driver 350 and the cleaner driver 335 based on a cleaning cycle and cleaning execution time which are set in advance.

In this case, the cleaning period may be set at regular time intervals as in the above-described first embodiment, or may be set at intervals of measuring the number of LED chips whose characteristics are measured in the measuring unit 101. To this end, the controller 340 may include the cleaning period setting unit 341 as in the first embodiment. Accordingly, the controller 340 may control the cleaning execution driving of the stage driver 350 and the cleaner driver 335 in response to the cleaning execution signal transmitted from the cleaning period setting unit 341.

In addition, the control unit 340 includes a cleaning time setting unit 343 for setting a cleaning time as in the first embodiment, so that the cleaner 310 can stop the cleaning driving after the cleaning driving for a predetermined time. The cleaning end signal may be transmitted to the controller 340.

Accordingly, the controller 340 may control the cleaning stop driving of the cleaner driver 335 and the stage driver 350 in response to the cleaning end signal transmitted from the cleaning time setting unit 343.

With this configuration, the foreign material removal process of the LED chip measuring unit according to the second embodiment will be described with reference to FIGS. 10 and 11, and FIGS. 12 and 13.

First, when a cleaning execution signal is transmitted from the cleaning period setting unit 341 in the process of measuring the characteristics of the LED chips in the measuring unit 101 (S01 'in FIG. 13), the LED chip is stopped by the supply to the measuring unit 101 and measured. There is no LED chip on the unit 101. At this time, the cleaner 310 is spaced apart from the lower region of the probe card 110, as shown in FIG.

Then, the controller 340 drives the stage driver 350 to move the probe card 110 toward the cleaner 310 as shown in FIG. 11 (S02 ′). As a result, the cleaner 310 is in contact with the periphery of the measuring hole 113 of the reflecting plate 111 and the probe pin 131 of the current measuring unit 130 under the probe card 110.

Then, the controller 340 drives the cleaner driver 335 until the cleaning end signal is transmitted from the cleaning time setting unit 343 (S03 '). As a result, the cleaner 310 removes foreign substances such as dust existing in the vicinity of the measuring hole 113 of the reflecting plate 111 of the probe card 110 and the probe pin 131 of the current measuring unit 130.

When the cleaning end signal is transmitted from the cleaning time setting unit 343 (S04 ′), the controller 340 stops driving the cleaner driver 335 (S05 ′), and then the probe card 110 determines that the cleaner ( The stage driver 350 is driven back to be spaced apart from 310 (S06 ′). As a result, the probe card 110 moves to a position spaced upward with respect to the cleaner 310 as shown in FIG. 10.

When the cleaning of the measuring unit 101 is finished, the LED chips are supplied to the measuring unit 101 again, and the measuring unit 101 is the optical measuring unit 120 and the current measuring unit 130 are optical characteristics of the LED chip. The overcurrent characteristic is measured.

This process is repeatedly performed in response to the cleaning period set in advance in the cleaning period setting unit 341.

As a result, the foreign matter present in the measuring unit 101 is completely removed, so that the measuring unit 101 can accurately measure the characteristics of the LED chip.

As described above, according to the present invention, there is provided a foreign material removing apparatus of the LED chip measuring unit in which the characteristics of the LED chip are accurately measured by removing the foreign matter present in the measuring unit 101 for measuring the characteristic of the LED chip.

110: probe card 131: probe pin
201,301: Debris removal device 210,310: Cleaner
233: Cleaner mover 235,335: Cleaner mover
240,340 control unit 241,341 cleaning cycle setting unit
243,343: cleaning time setting unit 350: stage driver
360: stage

Claims (13)

In the foreign matter removal apparatus of the measuring unit for measuring the optical characteristics and the current characteristics of the LED chip,
A cleaner provided to be accessible and spaced from the measuring unit;
A cleaner driving unit for driving the cleaner;
The foreign material removal apparatus of the LED chip measuring unit, characterized in that it comprises a control unit for controlling the driving of the cleaner driving unit. The method of claim 1,
A cleaner support for supporting the cleaner, and a driving support for reciprocating the cleaner support to the measuring unit;
And the cleaner driving unit includes a cleaner mover for approaching and spaced apart from the cleaner support to the measuring unit with respect to the driving support, and a cleaner driver for driving the cleaner. The method of claim 2,
The cleaner support is coupled to the lifting support relative to the driving support in the lower region of the measuring unit,
The cleaner mover is a foreign material removal device of the LED chip measuring unit, characterized in that provided with a cylinder for raising and lowering the cleaner support. The method of claim 2,
The cleaner is a rotary brush rotatably supported by the cleaner support,
The cleaner driver is a foreign matter removal device of the LED chip measuring unit, characterized in that the cleaner rotating motor for rotating the rotary brush. The method according to any one of claims 1 to 4,
The controller
A cleaning cycle setting unit for setting a cleaning cycle and transferring a cleaning execution signal to the controller;
And a cleaning time setting unit configured to set a cleaning time and deliver a cleaning end signal to the control unit. The method of claim 5,
The controller
When the cleaning execution signal is transmitted from the cleaning cycle setting unit, the foreign matter removal apparatus of the LED chip measuring unit, characterized in that for controlling the cleaner driving unit to be driven to approach the measuring unit. The method of claim 5,
The controller
The foreign material removal device of the LED chip measuring unit, characterized in that for controlling the cleaner driving unit to be spaced apart from the measuring unit after stopping the cleaner when the cleaning end signal is transmitted from the cleaning time setting unit. In the foreign matter removal apparatus of the measuring unit for measuring the optical characteristics and the current characteristics of the LED chip,
A cleaner spaced apart from the measurement unit;
A cleaner driver for driving the cleaner;
A probe card provided in the measuring unit to measure characteristics of the LED chip;
A stage supporting the probe card so as to be accessible and spaced apart from the cleaner;
A stage driver for driving the stage;
And a controller for controlling driving of the cleaner driver and the stage driver. The method of claim 8,
The cleaner is installed in the lower area of the probe card
The stage supports the probe card so as to be movable in the X and Y axes and the Z and θ axes to the cleaner side.
And a stage driver moves the stage in the X-axis, Y-axis, Z-axis, and θ-axis. The method of claim 8,
The cleaner is a rotating brush
The cleaner driver is a foreign matter removal device of the LED chip measuring unit, characterized in that the cleaner rotating motor for rotating the rotary brush. The method according to any one of claims 8 to 10,
The controller
A cleaning cycle setting unit for setting a cleaning cycle and transferring a cleaning execution signal to the controller;
And a cleaning time setting unit configured to set a cleaning time and deliver a cleaning end signal to the control unit. The method of claim 11,
The controller
When the cleaning execution signal is transmitted from the cleaning cycle setting unit, the foreign material removal device of the LED chip measuring unit, characterized in that for controlling the stage driver and the cleaner driver so that the probe card is approached and driven by the cleaner. The method of claim 11,
The controller
The foreign material removal device of the LED chip measuring unit, characterized in that for controlling the cleaner driver and the stage driver so that the probe card is spaced apart from the cleaner after the cleaning stop signal is transmitted from the cleaning time setting unit.

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