KR101032151B1 - LED Lighting Module mounted directly on heat sink or with heat sink itself - Google Patents

Abstract

The present invention relates to a heat dissipation structure module of a light emitting diode (LED), which is a means for dissipating heat generated from an LED, and a new heat dissipation structure module is applied so that the heat dissipation of the LED can be effectively performed. The purpose.

The heat dissipation structure module of the LED according to the present invention is an LED lighting module which can be attached directly to a heat sink or has its own heat dissipation structure, and radiates heat generated from the light emitting diode (LED) and the LED to the outside. As a means for comprising a LED heat dissipation base block (base block) for mounting the LED directly and the lead terminal for drawing out the LED terminal out and molding the molding (molding) to form an external shape.

LEDs, heat treatment structures, LED lighting modules, heat sinks

Description

LED lighting module mounted directly on heat sink or with heat sink itself}

The present invention relates to a heat dissipation structure module of an LED (Light Emitting Diode), and more particularly, in the heat dissipation process of LEDs, a heat dissipation structure that simplifies the heat transfer path to the heat sink is applied to the LED by maximizing the heat dissipation effect. The present invention relates to an LED heat dissipation structure module that can more efficiently heat dissipate, which reduces heat shock and improves work processes and costs in manufacturing LED lighting fixtures.

LED (Light Emitting Diode) is a semiconductor that emits light immediately when a certain current flows. As vacuum tubes have evolved into transistors and high-integrated circuits (LSIs), lightings are expected to rapidly evolve from incandescent lamps, the second-generation light source, and fluorescent lamps, the third-generation light source, to LEDs, semiconductor light sources.

In addition, LED light source has many advantages such as long life, high efficiency, small size, light weight, no mercury and environment-friendly, so it is rapidly replacing the existing light source, but there is a problem that heat is generated in the device. Therefore, it is very important to construct a heat treatment structure so that heat radiation can be effectively.

1 is a view showing the configuration of a general LED.

1A and 1B show a perspective view of the front and back of the LED 100, respectively, FIG. 1C shows a side view of the LED 100, and FIGS. 1D and 1E show the LED 100 from above respectively. And FIG. 1F is a view showing a solder pad for soldering the LED 100 to a PCB, and the general LED 100 is a lens 101 and a lens. It consists of a reflector 102, a substrate 103, a copper terminal 104 on both side surfaces and a rear surface of the bonded substrate 103, and a heat-dissipating copper pad 105 at the center of the rear surface of the bonded substrate 103. The copper terminal 104 on both sides of the front and rear surfaces is a terminal of the LED 100, and the copper foil pad 105 at the center of the rear surface is a copper foil layer for enhancing the heat dissipation effect of the LED 100. Through the heat of the LED 100 is emitted to the outside.

2 is a side view of a conventional general LED heat treatment structure.

As shown in FIG. 2, the heat dissipation structure of the conventional LED is, for example, a lens 201, a reflector 202, a substrate 203, and a copper terminal 204. LED 200 composed of heat-resistant copper foil pads 205, copper foil 211 for circuits, insulating layer 212 in which epoxy resin (FR4) or ceramic and epoxy resin are generally mixed, and aluminum substrate (213). ), A metal PCB composed of a circuit copper foil 211, a prepreg 214 joining the insulating layer 212 and the aluminum base plate 213, and a heat sink 220. It is composed.

In addition, in order to mount the LED 200 on the metal PCB, the heat-dissipating copper foil pad 205 and the copper terminal 204 and the circuit copper foil 211 at the bottom end of the LED 200, that is, the center of the rear surface of the bonded substrate 203. The solder layer 215 is formed by soldering.

In addition, the lowermost aluminum base plate 213 of the metal PCB is mounted on the heat dissipation plate 220 coated with the heat dissipation grease 216.

 Therefore, as described above, the heat dissipation structure of the LED according to the prior art is formed with a heat dissipation process through the metal PCB and the heat sink 220 in order to dissipate heat generated from the LED (200). .

When the heat treatment is performed through the metal PCB and the heat sink, as shown in FIG. 2, the heat generated from the LED 200 emitted to the outside through the heat dissipation copper foil pad 205 is used for the circuit constituting the metal PCB. Since the copper foil 211 and the solder layer 215, the two prepreg (214) layer, the insulating layer 212, the aluminum base plate 213 and the heat dissipation grease 216 is transferred to the heat sink 220 As the heat passes through each layer, the heat dissipation effect is significantly reduced by the thermal resistance generated between the layers, and as a result, the temperature of the LED 200 is increased to decrease the luminous efficiency of the LED 200 and reduce the lifetime. There is a problem that causes adverse effects.

In addition, when the temperature of the metal PCB rises, there is a problem that a defect occurs such that an interlayer crack or a solder crack occurs due to thermal shock due to excessive thermal cycle.

The present invention is to solve the above-mentioned conventional problems, the light emission of the LED by applying to the LED heat dissipation structure by making a new LED lighting module that can be directly attached to the heat dissipation to simplify the heat transfer path or has a heat dissipation structure itself The purpose of the present invention is to provide a heat dissipation structure module for LEDs that can reduce the efficiency, shorten the lifespan, and cause problems such as cracks and cracks caused by thermal shocks, and can additionally reduce costs in manufacturing LED lighting equipment. have.

LED lighting module directly attached to the heat sink according to the present invention for achieving the above object, the LED structure, the silver plated LED heat dissipation base block, the plate spring, the cap and lead terminals, the LED The structure includes a light emitting LED, a bonding substrate attached to a lower portion of the LED and formed with a terminal of the LED, and a heat dissipating copper foil pad formed on a rear surface of the bonding substrate, wherein the LED heat dissipation base block includes the LED. A cylindrical first end for mounting, a cylindrical second end located below the first end and having an inner diameter larger than the outer diameter of the first end, and a third end located at the lower end of the second end. It is made, having an inner diameter of the same size as the outer diameter of the second end and is sandwiched between the cap and the top end of the second end and the cap ingot is fitted to the second end of the cylindrical It characterized in that it comprises based LED structure and the second plate to close to crimp the upper end surface of the second stage spring and a molar these moldings for the interior space of the cap caused the siding portions.

In addition, the LED lighting module directly attached to the heat sink according to the present invention comprises an LED structure, a silver plated LED heat dissipation base block, a cap and a lead terminal, the LED structure, the light emitting LED, and the LED And a heat dissipating copper foil pad formed on a rear surface of the splicing substrate, wherein the LED heat dissipation base block comprises: a first end having a cylindrical shape for mounting the LED; A second stage positioned below the first stage and having a larger diameter than the first stage, and a third stage positioned at the lower end of the second stage are integrally formed, and an upper surface of the first stage is soldered or prepreg. (prepreg) or a bonding layer formed of an adhesive is formed to bond and fix the LED, the cap has an inner diameter of the same size as the outer diameter of the second stage and is forcing to the second stage To be helpful, it characterized in that it comprises a molding member molding the inner space of the cap.

In addition, the LED lighting module directly attached to the heat sink according to the present invention is composed of an LED structure, a silver plated LED heat dissipation base block, a leaf spring, a cap and a lead wire, the LED structure, the light emitting LED, The bonded substrate is attached to the lower portion of the LED and the terminal of the LED is formed, and a heat-dissipating copper foil pad formed on the back surface of the bonded substrate, the LED heat dissipation base block, the first end of the cylindrical shape for mounting the LED and And a second end of a cylinder positioned below the first end and having an inner diameter larger than an outer diameter of the first end, and a third end formed at a lower end of the second end and configured in the form of a nut. The lower end of the stage includes a fixing portion for fixing to an external radiator, and has an inner diameter equal to the size of the outer diameter of the second stage, and fits in the cylindrical second stage. Molded between the spring cap and the upper surface of the second end and the cap and the leaf spring to compress the LED structure and the upper end of the second end to be in close contact with the cap and the space formed between the cap spring It is characterized by comprising a molding.

The LED lighting module having its own heat sink according to the present invention comprises an LED structure, an LED heat dissipation structure integrated base block, a leaf spring, a cap and a lead wire, and the LED structure includes a light emitting LED and a lower portion of the LED. And a heat dissipating copper foil pad formed on a rear surface of the bonded substrate, wherein the LED heat dissipation base block includes: a first end of a cylindrical shape for mounting the LED; A cylindrical second end having an inner diameter larger than an outer diameter of the first end so as to be positioned below the first end, a third end disposed at a lower end of the second end and having fixing holes formed at both sides thereof, and a lower end of the third end. The disk-shaped radiator is integrally formed, has an inner diameter equal to the size of the outer diameter of the second end, and has a cap and an image that is forcibly fitted to the second end of the cylinder. A plate spring inserted between the upper end face of the second end and the cap ingot to press and close the LED structure and the upper end face of the second end, and a molding part molded of an inner space of the cap formed therebetween. It is characterized by.

According to the LED lighting module directly attached to the heat sink or having its own heat dissipation structure according to the present invention, it is possible to construct a new heat dissipation structure to increase heat dissipation effect by simplifying the conventional complicated and multi-step heat transfer path, and thus LED It can improve the light divergence performance, prevent the shortening of the lifespan, eliminate the defects caused by the heat shock caused by excessive heat generation, and reduce the number of parts and the cost by simplifying the process, resulting in improved product reliability, quality improvement and Cost savings can be achieved, thus improving the reliability of the product, improving quality, and reducing costs.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.

Hereinafter, an LED lighting module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a view showing the configuration of the LED lighting module according to the present invention, Figure 3a is a top view from above, Figure 3b is a front view, Figure 3c is a side view.

5 to 6 are diagrams in which the LED lighting module according to the present invention is mounted on a heat sink.

First, referring to the structure of the LED lighting module directly attached to the heat sink according to the present invention, as shown in Figure 3a to 3c, the LED heat dissipation base block 301 plated with silver for mounting the LED structure 300 on top ) Is a cylindrical first end 302 in contact with the LED 300 and the second end 303 located below the first end 302 and having an inner diameter larger than the outer diameter of the first end 302. Is formed. This second end 303 has a cylindrical shape. In addition, the lower end of the second end 303 is formed with a third end 304 of the square pillar shape including an extension on both sides and a circular fixing bolt hole 305 is formed in the center of the extension of both ends, The first stage, the second stage and the third stage are integrally formed.

In addition, the LED structure 300 has the same configuration as that of the related art, that is, a bonded substrate having a light emitting LED 300-1 and a terminal 300-2 of the LED attached to the lower portion of the LED 300-1 ( 300-3 and the heat dissipation copper foil pad 300-4 formed on the back surface of the bonded substrate 300-3, detailed description thereof will be omitted.

Therefore, the LED structure 300 is mounted on the upper end of the first end 302 of the LED heat dissipation base block 301, and has an inner diameter equal to the size of the outer diameter of the second end 303, and has a cylindrical second. Between the top surface of the cap 308 and the second end 303 and the cap 308 which is forcibly fitted to the end 303, between the LED structure 300 and the top surface of the second end 303. The molding part 307 which molded the leaf | plate spring 306 which presses on pressure, and the internal space of the cap 308 which arises between them with the thermal conductive resin is comprised. The leaf spring 306 has a circular hole in the center thereof, as shown in the drawing, the upper portion of the leaf spring 306 is caught by the upper portion of the LED structure 300, the lower end of the leaf spring 306 is the second end By contacting the upper surface of the 303, the LED structure 300 and the upper end of the first end 302 of the LED heat dissipation base block is in close contact.

In addition, it can be fixed to the heat sink through a fixing bolt hole 305 formed in the third end 304 of the LED heat dissipation base block 301, one end of the lead terminal 309 is a jumper wire to input power from the outside The LED terminal 300-2 is connected to the LED terminal 300-2, and the other end of the lead terminal 309 penetrates one side of the molding unit 307 and the cap 308 to be directly drawn to the outside to form an LED lighting module. do. In this case, the lead terminal 309 and the jumper wire 310 are preferably provided before the molding portion 307 is formed.

Therefore, heat generated from the LED 300-1 is transferred to the LED heat dissipation base block 301 through the heat dissipation copper foil pad 300-4 and is discharged to the outside. In addition, by using a thermally conductive resin as a molding material, it is possible to further enhance the heat dissipation effect of the LED and to obtain an additional effect of easily configuring the LED circuit using the lead terminal 309 drawn outward.

4 is a view illustrating an LED lighting module according to another embodiment, FIG. 4A is a top view, FIG. 4B is a front view, and FIG. 4C is a side view. As shown in FIG. 4, the silver-plated LED heat dissipation base block 401 is positioned at a lower end of the first end 402 and a first end 402 of a cylindrical shape for mounting the LED structure 300. A round fixing bolt in the center of the extension of both ends in the form of a square column having a second end 403 having a diameter larger than the first end 402 and the second end 403 and an extension at both ends. The third end where the hole 405 is formed is integrally formed.

The LED structure 300 is formed by forming a bonding layer 406 using solder or prepreg or adhesive on the first end 402 of the LED heat dissipation base block 401 to mount the LED structure 300. The heat dissipating copper foil pad 300-4 at the center of the back surface of the bonded substrate 300-3, and the terminal 300-2 of the LED structure 300 is leaded by a jumper 407. The cap 410 is connected between the terminal 408 and the outside and has an inner diameter equal to the size of the outer diameter of the second end and is forcibly fitted to the cylindrical second end 403. The inner space of the cap 410 is formed of a molding portion 409 using a thermally conductive resin.

Subsequently, an LED lighting module according to another embodiment of the present invention will be described in detail with reference to the drawings.

7a and 7b are views showing the configuration of the LED lighting module according to the present invention, Figure 7a is a top view from above, Figure 7b is a side view.

8 is a diagram in which the LED lighting module according to the present invention is mounted on a heat sink.

As shown in FIGS. 7A and 7B, the LED heat dissipation base block 701 plated with silver includes a cylindrical first end 702 and a first end 702 for mounting the LED structure 300. A cylindrical second end 703 located at the lower end and having an inner diameter larger than the outer diameter of the first end 702 and a third end 704 formed at the lower end of the second end 703 in the form of a nut are integrally formed. .

Therefore, the LED structure 300 is mounted on the upper end of the first end 702 of the LED heat dissipation base block 701 and has an inner diameter equal to the size of the outer diameter of the second end 703 and has a cylindrical second end. 703 is interposed between the cap 709 and the top end of the second end 703 and the cap 709 so as to be interposed between the LED structure 300 and the top end of the second end 703. The molding part 707 which shape | molded the inner space of the leaf | plate spring 708 which contact | contacts by applying pressure, and the cap 709 which arises between them is comprised. The leaf spring 708 is formed with a circular hole in the center, the upper portion of the leaf spring 708 is caught in the upper portion of the LED structure 300, the lower end of the leaf spring 708 is the upper surface of the second end 703 By contacting the first structure 702 of the LED structure 300 and the LED heat dissipation base block 701 is in close contact.

In addition, in order to input power from the outside, the LED terminal 300-2 is drawn out through the lead wire 706.

In addition, a fixing part 705 is formed at the lower end of the third end 704 of the LED heat dissipation base block 701 so as to be fixed to the heat dissipation plate. The fixing portion 705 is formed of a threaded cylinder.

Therefore, heat generated from the LED 300-1 is transferred to the LED heat dissipation base block 701 through the heat dissipation copper foil pad 300-4 and is discharged to the outside. In addition, by using a thermally conductive resin as a molding material, it is possible to further enhance the heat dissipation effect of the LED and to obtain an additional effect of easily configuring the LED circuit using the jumper wire 706 drawn outward.

In addition, if the LED heat dissipation structure for heat dissipation using the LED light module directly attached to the newly designed heat sink, as can be seen in Figure 8, the high of the lower portion of the LED light module 700 directly mounted on the newly designed heat sink The government 705 is placed in a fixing groove 801 formed of a threaded circular hole for fixing to the heat radiator 800, and the LED heat dissipation base block 701 of the LED lighting module 700 of the LED lighting module 700. Since the LED heat dissipation structure is simply completed by simply rotating the third end 704 formed in the hexagonal nut shape in the direction of the arrow, the heat transfer path is extremely shortened and the heat dissipation effect is very good.

9 has the same structure as the LED lighting module attached directly to the heat sink shown in FIG. However, the fixing part 901 formed at the lower portion of the LED heat dissipation base block 701 is formed in a cylindrical shape in which a groove 902 is formed at the upper portion thereof, and a detailed description thereof will be omitted. In addition, when the LED lighting module 900 formed by FIG. 9 looks at the mounting of the newly designed heat sink, as shown in FIG. 10, the upper part of the LED lighting module 900 includes heat radiation consisting of a circular hole coated with heat-dissipating grease. Simply put into the fixing groove 1001 of the sieve 1000, press the press in the direction of the arrow to press and fix it, so that the LED heat dissipation structure is simply completed, the heat transfer path is extremely shortened and the heat dissipation effect is very good.

11 and 12 show the same LED lighting module as shown in FIGS. 7 and 9, respectively, except that the lead wire 706 connected to the terminal 300-2 of the LED structure 300 is an LED heat dissipation base block ( Two circular holes 1101 and 1201 penetrating from left and right to the center of the first end 702 and the second end 703 of the 701, and the third end 704 and the lower fixing portion ( Through the circular holes 1102 and 1202 vertically penetrating the center of 705 and 901, the lead line 706 can be directly drawn out. In addition, molding portions 1103 and 1203 molded using a thermally conductive resin are formed in the spaces between the circular holes 1101, 1102, 1201 and 1202 and the LED structure 300 and the LED heat dissipation base block 701, respectively. do.

Subsequently, an LED lighting module having a self-heating structure according to an embodiment of the present invention will be described in detail with reference to the drawings.

13 is a view showing an LED lighting module having a self-heating structure according to the present invention. As shown in FIG. 13, the LED heat dissipation structure-integrated base block 1301 for mounting the LED structure 300 thereon includes a first end 1302 having a cylindrical shape in which the LED 300 is in contact with the first end 1302. ) And a second end 1303 having an inner diameter larger than the outer diameter of the first end 1302 is formed. This second end 1303 has a cylindrical shape. In addition, a lower end of the second end 1303 is formed with a third end 304 provided with circular fixing holes 1305 on both sides, and a heat sink 1306 having a cylindrical shape is integrated at the lower end of the third end 1304. Is formed.

In addition, in the heat sink 1306, in order to increase the heat radiation efficiency, a plurality of disk-shaped heat sinks 1308 are formed at regular intervals.

The method of coupling the LED structure 300 and the LED heat dissipation base block 1301 is the same as that of the LED lighting module described in FIGS. 3, 7, 9, 11, and 12, and the lead wire 1307 is a terminal of the LED structure 300. It is connected to the 300-2 and drawn out to the outside. Therefore, detailed description thereof is omitted.

5 and 6 illustrate another embodiment of the present invention, as shown in FIG. 5, which illustrates a form of a 1 × N array structure in which an LED lighting module may be mounted in a single row. As shown, the form of NxN array structure which can mount | mount N LED lighting module is shown.

Comparing the heat dissipation structure using the existing heat dissipation structure and the LED lighting module directly attached to the newly designed heat sink, the heat transfer path of the conventional heat dissipation structure can be seen in Figure 2, the LED heat dissipation copper foil pad 205 ⇒ solder Layer 215 ⇒ circuit board copper foil layer 211 ⇒ prepreg 214 ⇒ circuit board insulation layer (FR4) 212 ⇒ prepreg 214 ⇒ aluminum base layer 213 ⇒ heat dissipation grease 216 ⇒ heat sink 220), the heat transfer path of the new heat dissipation structure using the LED lighting module attached directly to the newly designed heat sink, although the heat dissipation effect is very long, complex and high heat resistance, as shown in Figures 3 and 4 Similarly, copper foil pad ⇒ heat dissipation base block ⇒ heat dissipation grease ⇒ heat sink is very simple and short, so the heat dissipation effect is very high.

In addition, in the LED lighting module having its own heat dissipation structure, the heat dissipation body is integrally formed on the LED light module without providing a separate heat dissipation, and the heat dissipation plate having a disk shape is formed at regular intervals, so that the heat dissipation effect is good and the lighting fixture It can be done easily without taking any heat dissipation measures.

Therefore, as described above, the heat dissipation efficiency of the LED can be maximized and life can be prevented. Therefore, if the LED luminaire is manufactured by directly attaching to a newly designed heat sink or using an LED light module having its own heat dissipation structure, high efficiency and long life can be achieved. It is possible to manufacture lighting fixtures, and it is also possible to manufacture economical lighting fixtures with simple structure and low price.

The LED lighting module according to the embodiment of the present invention has been described above. Although the embodiments adopted in the present invention have been described using specific conditions, these descriptions are for illustrative purposes only, and changes and modifications may be made without departing from the spirit and scope of the following claims. .

1 is a diagram of a component part of a general lighting LED.

2 is a side view showing the structure of a conventional general LED heat treatment structure.

3 is a view showing the structure of the LED lighting module directly attached to the heat sink according to an embodiment of the present invention.

4 is a view showing the structure of the LED lighting module directly attached to the heat sink according to an embodiment of the present invention.

FIG. 5 is a diagram in the case of using one LED heat treatment structure constructed by using an LED lighting module directly attached to a heat sink according to the present invention.

FIG. 6 is a diagram of a case where N columns are used when using an LED heat treatment structure constructed by using an LED lighting module attached directly to a heat sink according to the present invention.

7A and 7B are views showing the structure of the LED lighting module attached directly to the heat sink of the present invention.

8 is a diagram in which the LED heat treatment structure module according to the present invention is mounted on a heat sink.

9A and 9B are views showing the structure of the LED lighting module attached directly to the heat sink of the present invention.

10 is a view in which the LED heat treatment structure module according to the present invention is mounted on a heat sink.

11 is a view showing the structure of the LED lighting module attached directly to the heat sink of the present invention.

12 is a view showing the structure of the LED lighting module attached directly to the heat sink of the present invention.

13 is a view showing the structure of the LED lighting module having a self-heating structure according to the present invention.

Claims (13)

In the LED lighting module directly attached to the heat sink, LED structure, silver plated LED heat dissipation base block, leaf spring, cap and lead terminal, The LED structure, With LED illuminating, A bonded substrate attached to a lower portion of the LED and having terminals of the LED; Made of a heat-dissipating copper foil pad formed on the rear surface of the bonded substrate, The LED heat dissipation base block, A first end having a cylindrical shape for mounting the LED; A second cylindrical end having an inner diameter larger than an outer diameter of the first end so as to be positioned below the first end; The third end is formed at the bottom of the second end in the form of a square pillar including an extension in both ends is formed in the center of the third end formed with a circular fixed bolt hole in the center of both ends, The cap has an inner diameter equal to the size of the outer diameter of the second end and is fitted to the second end of the cylindrical, The leaf spring has a circular hole formed at the center thereof, and is inserted between the cap and the upper end surface of the second end to compress the LED structure and the upper end surface of the second end to closely contact the inner space of the cap. LED lighting module directly attached to the heat sink, characterized in that comprises a molded molding. The method of claim 1, One end of the lead terminal is connected to the LED terminal through a jumper wire and the other end of the lead terminal is directly attached to the heat sink, characterized in that it is drawn out directly through the one side of the molding portion and the cap to the outside . The method of claim 1, The molding unit directly attaches to the heat sink, characterized in that to enhance the heat dissipation effect of the LED by molding using a thermally conductive resin. delete delete In the LED lighting module directly attached to the heat sink, LED structure, silver plated LED heat dissipation base block, leaf spring, cap and lead wire, The LED structure, With LED illuminating, A bonded substrate attached to a lower portion of the LED and having terminals of the LED; Made of a heat-dissipating copper foil pad formed on the rear surface of the bonded substrate, The LED heat dissipation base block, A first end having a cylindrical shape for mounting the LED; A second cylindrical end having an inner diameter larger than an outer diameter of the first end so as to be positioned below the first end; Located at the bottom of the second end is composed of a hexagonal nut shape and the lower end is made of a third end including a fixing portion formed to be fixed to the heat sink, The cap has an inner diameter equal to the size of the outer diameter of the second end and is forcibly fitted to the cylindrical second end, and the leaf spring is sandwiched between the cap and the upper end surface of the second end. The LED structure and the upper surface of the second end is pressed and in close contact with the molded part molded in the inner space of the cap, the fixing part of the third end is a heat sink characterized in that made of a cylinder with a groove formed on the top Directly attached LED lighting module. delete delete The method of claim 6, The lead wire is connected to the LED terminal, LED lighting module, characterized in that drawn directly to the outside through both sides of the molding portion and the cap. The method of claim 6, Two first through holes penetrating from the left and right of the LED heat dissipation base block to the center and a second through hole vertically penetrating the center of the fixing part to be connected to the first through holes are formed. The LED lighting module is connected to the LED terminal, the LED lighting module characterized in that it is directly drawn out through the first through hole and the second through hole. The method of claim 6, The molding unit directly attaches to the heat sink, characterized in that to enhance the heat dissipation effect of the LED by molding using a thermally conductive resin. delete delete

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