KR101016020B1 - Socket for chip package - Google Patents

Abstract

The present invention relates to a socket for a chip package, in particular a base having a central opening; A cover coupled to the base such that the elastic member is interposed therebetween; A contact support unit inserted into the opening of the base and having a plurality of contact pins; And a latch that moves to an open and support position according to the movement of the cover, wherein the contact support unit has slots formed at intervals corresponding to a column pitch of the connection terminal of the chip package. A laminate in which a plurality of plate-shaped support plates having a thickness corresponding to a lateral pitch and having grooves to allow both ends of the contact pins to be seated and protrude to the outside are respectively stacked on the top and the bottom; And a plurality of contact pins having an intermediate portion bent and inserted into the slots, and having upper and lower ends protruding from the upper and lower surfaces of the stack through the recesses.

As a result, it is more stable than the conventional contact support unit, and can be easily assembled. Therefore, there is no fear of misassembly, productivity is improved, and manufacturing costs are reduced.

Chip Package, Sockets, Support Units

Description

Socket for Chip Package {SOCKET FOR CHIP PACKAGE}

The present invention relates to a socket for a chip package, and more particularly, a contact pin accommodated in a support plate is more stably received than a conventional contact support unit, and can be easily configured. The present invention relates to a socket for a chip package which has the advantage that there is no fear of assembling, productivity is improved, and manufacturing cost is reduced.

In general, a socket for a chip package uses a dedicated socket having a different electrode terminal arrangement form or a different pitch of the chip package applied to each socket. However, in this case, a dedicated socket is provided for each chip package. There is an increasing problem. In addition, even if the same external shape and the pitch of the electrode terminal is the same, the actual arrangement of the terminal of the chip package may be different, and thus have the same problem as above.

Therefore, in order to solve this problem, studies have been made to develop a universal socket corresponding to the case where only the terminal arrangement of the chip package is changed in the same matrix form. In particular, Korean Patent Publication No. 2003-22736, "Burn-In Test Socket" In this case, a plurality of contact pins corresponding to the terminals of the chip package can be supported to handle various chip packages having different terminal arrangements, and a socket capable of manufacturing such a socket even with a simple molding technique has been proposed.

However, as shown in FIG. 1, since the contact pin is placed on one support plate, the contact pin is easily detached or moved when the contact pin is impacted from the outside. Therefore, there is a problem in that careful handling is required and productivity is low.

Therefore, it is urgent to develop a stable lamination method against external impact while easily connecting the contact pin to the support plate.

In order to solve the problems of the prior art as described above, the present invention is a contact pin accommodated in the support plate as compared to the conventional contact support unit is stably accommodated, can be easily configured, there is no fear of misassembly, It is an object of the present invention to provide a socket for a chip package which has an advantage of improving productivity and reducing manufacturing costs.

In order to achieve the above object, the present invention

A base having a central opening; A cover coupled to the base such that the elastic member is interposed therebetween; A contact support unit inserted into the opening of the base and having a plurality of contact pins; And a latch moving to an open and support position according to the shanghai of the cover.

The contact support unit

Slots are formed at intervals corresponding to the column pitches of the connection terminals of the chip package, and have a thickness corresponding to the horizontal pitch, and upper and lower ends thereof have recesses for allowing both ends of the contact pins to be respectively seated and protrude outward. A laminated body in which a plurality of plate-shaped support plates are laminated; And,

An intermediate part is bent and inserted into the slot, and the upper and lower ends provide a plurality of contact pins protruding from the upper and lower surfaces of the stack through the recesses.

According to the socket for a chip package of the present invention, compared to the conventional contact support unit, the contact pin accommodated in the support plate can be stably accommodated, and the assembly can be easily configured, so that there is no fear of misassembly and productivity is improved. This has the advantage of reducing manufacturing costs.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a socket for a chip package, the base (10) having a central opening (12); A cover 30 coupled to the base 10 so that the elastic member 20 is interposed therebetween; A contact support unit 40 inserted into the opening 12 of the base 10 and having a plurality of contact pins 100; And a latch 50 that moves to an open and support position according to the movement of the cover 30, wherein the contact support unit 40 is a column pitch of the connection terminal of the chip package. Slot 46 is formed at intervals corresponding to the plate, the plate-like support plate having a thickness corresponding to the lateral pitch, and having a groove 47 to allow both ends of the contact pins to be seated and protrude to the outside, respectively ( A stack 43 in which a plurality of 45 are stacked; And, the middle portion 102 is bent and inserted into the slot 46, the top and bottom are a plurality of contact pins 100 protruding from the upper and lower surfaces of the laminate 43 through the groove 47 to the outside It is configured to include).

Specific examples thereof are as shown in FIGS. 2 to 10. That is, in the form in which the contact pin is simply placed on the support plate, as shown in FIG. 1, since the contact pin cannot be stably received, the contact pin is placed on the support plate so that the center of gravity of the contact pin is located below the support plate. The center of the bow-shaped contact pin is provided with a slot to allow the curved center of the insert to go down, wherein the middle portion is bent to elastic deformation.

The socket to which the present invention is applied is a conventional socket, which generally includes a base, a cover, an elastic member and a latch engaged therebetween, and such a configuration may be applied to various known shapes, and the singularity of the contact support is One embodiment of a conventional socket configuration, as in the unit, is as shown in FIG. 2.

The contact support unit 40 applied here is composed of a stack of support plates and contact pins sandwiched between these support plates. Specific examples of the support plate 45 are shown in FIG. 3. That is, as shown in the upper left side of Figure 3, the support plate is provided with a slot and a recess to accommodate the contact pin, the contact pin accommodated therein is applicable to the bent form regardless of the bent middle portion. , An example thereof is as shown in the upper right of FIG. 3. Herein is shown the coupling of the contact pin on the finishing plate, which will be described later, the figure shown in the lower left of FIG. 3 firstly puts the contact in the required slot on the finishing plate, and then the support plate on top of it. Here's a second contact.

In this case, since the support plate must correspond to the terminal matrix of the chip package, the spacing of the slots and the thickness of the support plate must correspond to the matrix pitch. Here, the columns and rows vary in terms of the viewing point, but the matrix x-y pitch, the slot spacing of the support plate, and the support plate thickness correspond to each other.

In addition, it has a groove for stable guide of the contact, preferably further comprises a support portion 48 having a width that is wider than the outermost width of the groove 47 at both ends of the groove 47 or the slot 46; The contact pin 100 has an upper protrusion 104 shorter than a length of an upper support portion of the support portion 48 at an upper portion thereof, and a lower portion of the support portion 100 at a lower portion thereof. It may have a configuration having a lower protrusion 106 corresponding to the width and length of the lower support of the 48. That is, the groove (in each of the upper and lower ends of the support plate) further includes a support having a width that is wider than the outermost width of the groove, or the width that is larger than the outermost width of the groove on both ends (top and bottom) of the slot The upper and lower protrusions of the contact pins may further be coupled to each other so as to enable stable reception and guide of the contact pins. Since the upper protrusion is a portion in which the movement is made according to the elastic deformation of the contact pin, the upper protrusion has a configuration that corresponds to the width of the support 48 and is shorter than the length of the support 48, and the lower protrusion is Since it is a fixed part connected with the electrode of a test board, it is good to have a structure corresponding to the width | variety and length of the lower support part of the said support part 48 as mentioned above.

In addition, in order to facilitate stacking of the support plate, preferably, the stack 43 further includes a finish plate 49 at an end in the stacking direction of the support plate 45, and the finish plate 49 is left and right. It has a coupling shaft 41 at both ends, the support plate 45 may have a configuration further having a coupling tool 42 corresponding to the coupling shaft 41 at both left and right ends. That is, as shown in the specific example in Figures 4 to 6, it is possible to apply a closing plate having a coupling shaft in order to facilitate the alignment and assembly of the laminated support plate, easy handling after assembly, such a finish The play may include a slot or a groove corresponding to the slot for accommodating the curved intermediate portion of the contact pin as shown on the left side of FIG. 4, and includes a coupling shaft for fixing the supporting plate to be stacked, and the supporting plate to be stacked is the coupling. Couplers fitted to the shaft may be inserted into both sides to be laminated coupling is made. The closing plate may be present only at one end or may be disposed opposite to each other. In addition, the coupling shaft may be provided with only one pair consisting of one each on the left and right with respect to the entire laminate, and a series of support plates may be fitted thereto, and the heights of the coupling shafts may face each other as shown in FIGS. 5 to 6. Two pairs of coupling axes arranged differently may be arranged to facilitate the coupling. 4 illustrates a process of forming a laminate of one side, and FIGS. 5 to 6 illustrate a process of bonding each of the laminates configured as described above to each other.

In addition, since the contact pins are more preferably arranged to have no symmetrical structure, a force may be applied in one direction when the chip package is coupled in the case where the contact pins are arranged only in one direction. In order for the external forces applied to the chip package according to the elastic deformation to cancel each other, as shown in FIG. 7, it is preferable that the middle portion of the contact pin is symmetrically formed. A separate dummy plate may be inserted. That is, the stack 43 further has a dummy support plate 45 'in the middle of the supporting plate 45 in the stacking direction, and the middle of the contact pin 100 based on the dummy support plate 45'. It is preferable that the part 102 arrangement be symmetrical.

Specific examples of the laminated body and the contact support unit assembly method in the case of having such a configuration are as shown in FIGS. 4 to 6.

The contact support unit, which can be configured in this way, can be seated in the central opening of the base, as shown in the specific example in FIG. 9, and the upper and lower ends of the contact pins having a constant clearance can be positioned as necessary. 2 and 8, in order to ensure the accuracy, the upper portion of the support unit, the adapter, the lower guide unit may be further added to align it.

In order to insert the chip package into the socket configured as described above, as shown in FIG. 10, the latch is moved to the open position through the normal latch driving. After the chip package is inserted into the socket, the latch is moved to the support position and inserted into the socket. The chip package may be fixed to perform a test, and after the test, the latch may be moved to an open position to remove the chip package, thereby removing the chip package from the socket.

Also, other details may be referred to the description of the Republic of Korea Patent Publication No. 2003-22736, "burn-in test socket".

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

FIG. 1 is a view illustrating a support plate applied to a socket having a conventional contact support unit and a contact pin coupled thereto.

Figure 2 is an exploded perspective view schematically showing an embodiment of a socket for a chip package of the present invention.

3 is a diagram illustrating a coupling relationship between a support plate and a contact pin applied to a socket for a chip package according to the present invention.

Figure 4 is a view showing a coupling relationship in the case of applying a closing plate that can be applied to the socket for the chip package of the present invention sequentially.

FIG. 5 is a diagram illustrating a case where the upper and lower portions partially coupled as shown in FIG. 4 are applied by applying a dummy support plate.

FIG. 6 is a diagram illustrating another case in which the upper and lower laminates are coupled to each other by applying a dummy support plate when the finishing plate applicable to the socket for a chip package of the present invention is applied.

7 is a view showing a coupling relationship between the support plate and the contact pin when the dummy support plate that can be applied to the socket for the chip package of the present invention.

8 is a diagram illustrating a coupling relationship when the adapter applicable to the socket for a chip package of the present invention is applied and a partially enlarged view thereof.

9 is a perspective view illustrating a coupling relationship between a base and a contact support unit applied to a socket for a chip package according to the present invention.

10 is a view schematically showing a latch driving mechanism that can be applied to the socket for a chip package of the present invention.

Explanation of symbols on the main parts of the drawings

10: base 12: opening

20: elastic member 30: cover

40: contact support unit 41: coupling shaft

42: coupler 43: laminate

45: support plate 45 ': dummy support plate

46: slot 47: groove

48: support 49: closing plate

50: latch 60: IC guide

70: adapter 80: lead guide

100: contact pin 102: middle part

104: upper protrusion 106: lower protrusion

Claims (4)

A base having a central opening; A cover coupled to the base such that the elastic member is interposed therebetween; A contact support unit inserted into the opening of the base and having a plurality of contact pins; And a latch moving to an open and support position according to the shanghai of the cover. The contact support unit Slots are formed at intervals corresponding to the column pitches of the connection terminals of the chip package, and have a thickness corresponding to the horizontal pitch, and upper and lower ends thereof have recesses for allowing both ends of the contact pins to be respectively seated and protrude outward. A laminated body in which a plurality of plate-shaped support plates are laminated; And a middle portion is bent and inserted into the slot, the top and bottom includes a plurality of contact pins projecting outward from the top and bottom of the laminate through the groove, Both ends of the groove or the slot includes a support having a width that is larger than the outermost width of the groove, The contact pin may have an upper protrusion corresponding to a width of an upper support of the support and shorter than a length of an upper support of the support, and a lower protrusion corresponding to a width and a length of a lower support of the support. A socket for chip package, characterized in that. delete The method of claim 1, The laminate is The finishing plate further has a closing plate at the end in the stacking direction of the support plate, the closing plate has a coupling shaft on both left and right ends, the support plate further comprises a coupling hole corresponding to the coupling shaft on both left and right ends . The method of claim 1, The laminate is And a dummy support plate in the middle with respect to the stacking direction of the support plate, wherein the middle portion of the contact pin is arranged symmetrically with respect to the dummy support plate.

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