KR101004873B1 - Camera Module Package - Google Patents

Abstract

Camera module package according to the present invention comprises a housing for receiving a lens; A socket formed to receive the housing and fixed to and electrically connected to the main substrate of the electrical device; And a flexible substrate equipped with an image sensor for forming an image by imaging light incident through the lens, and a rigid substrate connected to the flexible substrate so as to be bent toward the flexible substrate and electrically connected to the socket. a substrate portion including a rigid substrate, wherein the image sensor is bonded to an opposite surface of a surface of the flexible substrate facing the lens, and the rigid substrate is bent toward the flexible substrate to be connected to the image sensor. It is characterized in that the adhesive.

Description

Camera Module Package

The present invention relates to a camera module package, and more particularly, to a camera module package for performing an imaging function mounted on a personal portable terminal or the like to capture an image.

Recently, with the development of communication technology and digital information processing technology, portable terminal technology in which various functions such as information processing and arithmetic, communication, image information input and output are integrated is emerging.

Specific examples include a PDA equipped with a digital camera and a communication function, a mobile phone with a digital camera function, a personal multi-media player (PMP), and the like.

In addition, due to the development of digital camera technology and information storage capability, it is becoming increasingly common to mount a high specification digital camera module package on a personal portable device.

In recent years, personal portable terminals have been slimmed and thinned according to the consumer's inclination, and the camera module package mounted in the main body of the portable portable terminal is also aimed at miniaturization.

However, as the camera module package is miniaturized, the performance of the camera module package is gradually improved, so it is difficult to produce a camera module package that satisfies all these conditions.

In particular, as the camera module package has been miniaturized in the past, a lot of electronic interference is gradually received, and it is difficult to manufacture a small size while preventing such interference, and to produce a small size, it is difficult to produce by an automated process.

Therefore, while reducing the size of the camera module package to increase the effect of preventing electronic interference and to produce a camera module package, there is a need for a technology that has an effect of easy automation.

The present invention is to solve the above-described problems of the prior art, the object of the camera module package is to reduce the size of the camera module package while preventing electromagnetic interference, the camera module package having the effect of easy automation in producing a camera module package To provide.

Camera module package according to the present invention comprises a housing for receiving a lens; A socket formed to receive the housing and fixed to and electrically connected to the main substrate of the electrical device; And a flexible substrate mounted with an image sensor for forming an image by imaging light incident through the lens, and a rigid substrate bent to the flexible substrate toward the flexible substrate and electrically connected to the socket. The image sensor may be bonded to the opposite side of the surface facing the lens in the flexible substrate, the rigid substrate is bent toward the flexible substrate is bonded to the image sensor It is done.

In addition, in the camera module package according to the present invention, the image sensor is adhered to the opposite side of the surface facing the lens on the flexible substrate, the flexible substrate is opened so that the image sensor is exposed in the direction toward the lens It may be characterized by.

In addition, in the camera module package according to the present invention, the rigid substrate may be bent toward the flexible substrate to be bonded to the image sensor.

In addition, in the camera module package according to the present invention, the rigid substrate may include a connection pad formed to be in electrical contact with the socket on the opposite side of the surface facing the flexible substrate.

In addition, in the camera module package according to the present invention, the socket may include an electrode terminal electrically connected to the rigid substrate.

In addition, in the camera module package according to the present invention, the socket may protrude upward to be in contact with the bottom surface of the rigid substrate, and may include an electrode terminal that is electrically connected to the rigid substrate to be electrically connected. .

In addition, the camera module package according to the present invention may be formed to accommodate the housing and may further include a shield case for shielding electromagnetic waves in the image sensor.

The camera module package according to the present invention may mount a board portion including a flexible substrate to which the image sensor is bonded and a rigid substrate that is bent toward the flexible substrate and electrically connected to the socket, thereby preventing an electromagnetic interference. Larger, easier automation in producing camera module packages reduces manufacturing costs.

In addition, in the camera module package according to the present invention, since the image sensor is bonded to the flexible substrate, a space for wire bonding is not required in the flexible substrate, thereby greatly reducing the size thereof.

The camera module package according to the present invention will be described in more detail with reference to FIGS. 1 to 6. Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention.

However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be readily proposed, but they will also be included within the scope of the inventive concept.

1 is a perspective view of a camera module package according to a first embodiment of the present invention, FIG. 2 is a longitudinal cross-sectional view of the camera module in FIG. 1, and FIG. 3 is a perspective view for explaining the camera module of FIG. 1.

1 to 3, the camera module package 100 includes a lens barrel 110, an image sensor 120, an IR filter 130, a housing 140, a substrate unit 150, and a socket 160. Include.

The lens barrel 110 has an internal space of a predetermined size, and corresponds to a hollow cylinder in which one or more lenses are arranged along an optical axis, and a lens hole for transmitting light may be formed in an upper surface thereof.

In this case, although not shown in detail, in the present embodiment, at least one spacer may be further provided so that the lenses disposed in the lens barrel 110 maintain a predetermined distance between adjacent lenses. However, the number of lenses disposed in the lens barrel 110 is not limited and may be all at least one.

In addition, the camera body may further include an actuator (not shown) capable of reciprocating the lens in the optical axis direction when power is applied.

The actuator is a VCM (Voice Coil Motor) using a magnet and a coil to realize lens movement by an electromagnetic force generated by the electric field generated by applying power to the coil and the magnetic field generated by the magnet, and a piezoelectric body when the power is applied. It may be provided in various forms such as a piezo actuator (Piezo Actuator) using a piezoelectric material to realize the movement of the lens by the deformation of.

On the other hand, as shown in Figure 1, the lens barrel 110 is coupled to the housing 140, the coupling method may be a male screw portion is formed on the outer surface of the lens barrel 110, the male screw portion It may be screwed with the female screw formed on the inner surface of the housing 140. However, the coupling structure of the lens barrel and the housing is not limited to this structure.

Although not necessarily a component in the present invention, the housing 140 may be provided with an adhesive bonding IR filter 130 that can filter the infrared rays of the light passing through the lens therein.

The image sensor 120 has an image imaging region on an upper surface thereof to form light incident through a lens, and is an imaging device capable of converting it into an electrical signal.

In addition, the image sensor 120 is mounted on the bottom surface of the flexible substrate 152 in the substrate unit 150, and receives the light incident through the lens through a portion formed to be open to the flexible substrate 152. In this case, since the image sensor 120 is electrically connected while directly contacting the flexible substrate 152, wire bonding is not performed.

The housing 140 partially receives the lens barrel 110 therein, and a bottom surface of the housing 140 is formed in an open shape. Therefore, the substrate 150 is accommodated in the housing 140 through the lower portion of the open housing 140.

In addition, an adhesive may be applied to the bottom of the housing 140 to be adhered to one surface of the substrate unit 150, and the sides of the housing 140 and the flexible substrate 152 are fixed to each other by being bonded to each other.

In addition, the shield case 170 is positioned outside the housing 140, and the shield case 170 accommodates the housing 140. Therefore, for this structure, a binding portion 142 protruding outward is formed on the middle outer wall of the housing 140 so that the binding groove 172 is assembled to the binding portion 142 and the shield case 170.

However, the present invention is not limited to this structure, and protrusions protruding from the sidewall of the shield case 170 may be formed, and a groove for engaging with the protrusions may be formed in the housing 140.

An open groove 144 is inserted into the lower side of the housing 140 to insert the flexible substrate 152 into the housing 140 and to expose the rigid substrate 154 integrally connected to the flexible substrate 152 to the outside. Is provided.

Therefore, since the flexible substrate 152 is bonded to the housing 140 and then the rigid substrate 154 exposed through the open groove 144 is bent and adhered to the flexible substrate 152, the operation thereof becomes very easy.

The substrate unit 150 includes a flexible substrate 152 on which the image sensor 120 is formed to form an image of light incident through a lens, and a flexible substrate 152 to be bent toward the flexible substrate 152. It may include a rigid substrate 154 connected to and electrically connected to the socket 160.

Here, the substrate unit 150 may be implemented using a rigid-flexible substrate, and the rigid-flexible substrate refers to a substrate in which the rigid substrate 154 is integrally bent to the flexible substrate 152.

An image sensor 120 is adhered to the bottom of the flexible substrate 152 through an adhesive. The lens barrel 110 is configured to form light coming from lenses positioned in front of the housing 140. The center of the flexible substrate 152 should be open because it is exposed in the direction.

Therefore, since the flexible substrate 152 and the image sensor 120 are electrically connected to each other through direct bonding, the wire bonding does not need to be performed. Accordingly, since a space for wire bonding is not required on the substrate, The effect is that the size can be greatly reduced.

The rigid substrate 154 may be bent to the flexible substrate 152 and may be integrally connected. A connection pad 156 is formed on one surface of the rigid substrate 154, and the connection pad 156 is in contact with the electrode terminal 162 of the socket 160 to be electrically connected to each other.

In this case, when the rigid substrate 154 integrally connected to the flexible substrate 152 is bent downward, the rigid substrate 154 is in contact with the image sensor 120 located on the bottom surface of the flexible substrate 152, and the adhesive is attached to the contact portion. By applying the rigid substrate 154 and the image sensor 120 may be bonded to each other and fixed.

In addition, the socket 160 may be fixed to the main board 10 of the personal portable terminal, and the housing 140 may be inserted and accommodated in an accommodation space inside the socket 160. Since the socket 160 can be mounted on the main board 10 through an automated process, the operation is easier.

The shield case 170 accommodates the housing 140 to shield electromagnetic interference of the image sensor 120 and may be made of a metal material. A binding groove 172 may be provided at a side surface of the shield case 170 to bind to the binding unit 142 of the housing 140 and be fixed to each other.

3 to 6 are perspective views illustrating an assembly process of a camera module package according to an embodiment of the present invention.

As shown in FIG. 3, in the camera module package, the flexible substrate 152 is accommodated under the housing 140, and the rigid substrate 154 integrally connected to the flexible substrate 152 is exposed to the outside.

In this case, as shown in FIG. 4, the rigid substrate 154 is bent toward the flexible substrate 152 (ⓐ), and the bent rigid substrate 154 is disposed below the flexible substrate 152. Contact with the bottom of the

When the rigid substrate 154 is bent to contact the image sensor 120, the connection pad 156 formed on one surface of the rigid substrate 154 faces the lower portion of the housing 140.

In addition, as shown in FIG. 5, an adhesive is applied to the contact surface between the rigid substrate 154 and the image sensor 120 to contact the rigid substrate 154 and the image sensor 120. Accordingly, the rigid substrate 154 in contact with the image sensor 120 is fixed to an open portion of the lower portion of the housing 140.

As shown in FIG. 6, the manufactured camera module may be inserted into an internal space of the socket 160 fixed to the main board 10 of the personal mobile terminal. In this case, the connection pad 156 of the rigid substrate 154 and the electrode terminal 162 of the socket 160 are electrically connected to each other under the housing 140.

In general, the camera module package may be mounted using a socket and a connector by using a socket as a method for mounting on a personal mobile terminal.

In this case, the mounting method using the socket is a method of mounting the socket containing the camera module therein to the main board of the personal portable terminal and electrically connecting the socket. This method has a great effect of preventing electromagnetic interference (EMI) by the socket, and it is easy to automate the construction of such a package.

However, the mounting method using such a socket manufactures a chip by contacting the image sensor with wire bonding on the rigid substrate, which requires space for wire bonding the image sensor on the rigid substrate and increases the size of the camera module package. There are disadvantages.

In addition, the mounting method using the connector is a method of mounting the camera module on the connector to be electrically connected to the main board of the personal mobile terminal. In this case, the method using the connector may use a Chip On Flexible (COF) method of directly contacting the image sensor using a flexible substrate, thereby reducing its size.

However, since the mounting method using the connector does not block electromagnetic waves from the outside like a socket, the effect of preventing electromagnetic interference is small, and the connector of the camera module package must be manually mounted on the main board to achieve an automated process. There is difficulty.

Therefore, while reducing the size of the camera module package to increase the effect of preventing electronic interference and to produce a camera module package, there is a need for a technology that has an effect of easy automation.

As a result, the camera module package according to the present exemplary embodiment may mount the substrate unit 150 including the flexible substrate 152 and the rigid substrate 154 that is bent toward the flexible substrate 152 to the socket 160. The socket 160 can increase the effect of preventing electromagnetic interference.

In addition, the production of the camera module package by simply mounting the camera module to the socket 160 mounted on the main board 10 in advance by an automated process is easy to automate, thereby reducing the manufacturing cost economical effect have.

In addition, in the camera module package according to the present embodiment, since the image sensor 120 is directly bonded to the flexible substrate 152, a separate space for wire bonding does not need to be provided in the flexible substrate 152, thereby greatly reducing its size. It has an effect.

1 is a perspective view of a camera module package according to a first embodiment of the present invention.

FIG. 2 is a central longitudinal cross-sectional view of the camera module in FIG. 1. FIG.

3 to 6 are perspective views illustrating an assembly process of a camera module package according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

110 .... lens barrel 120 .... image sensor

130 ... IR Filter 140 ... Housing

150 .... PCB 160 .... Socket

Claims (7)

A housing containing the lens; A socket formed to receive the housing and fixed to the main substrate of the electrical device; And A flexible substrate mounted with an image sensor for forming an image of light incident through the lens, and a rigid substrate connected to the flexible substrate so as to be bent toward the flexible substrate and electrically connected to the socket; A substrate portion; Including; The image sensor is adhered to the opposite side of the surface facing the lens in the flexible substrate, Wherein the rigid substrate is bent toward the flexible substrate and adhered to the image sensor. delete delete delete The method of claim 1, The socket is And an electrode terminal electrically connected to the rigid substrate. The method of claim 1, The socket is And an electrode terminal protruding upward to contact the bottom surface of the rigid substrate and electrically connected to the rigid substrate. The method of claim 1, An inner space is formed to accommodate the housing, and the image sensor package further comprises a shield case for shielding electromagnetic waves.

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