KR100959566B1 - 개선된 냉각 시스템을 갖는 정전척 및 정전척 시스템 - Google Patents
개선된 냉각 시스템을 갖는 정전척 및 정전척 시스템 Download PDFInfo
- Publication number
- KR100959566B1 KR100959566B1 KR1020030015008A KR20030015008A KR100959566B1 KR 100959566 B1 KR100959566 B1 KR 100959566B1 KR 1020030015008 A KR1020030015008 A KR 1020030015008A KR 20030015008 A KR20030015008 A KR 20030015008A KR 100959566 B1 KR100959566 B1 KR 100959566B1
- Authority
- KR
- South Korea
- Prior art keywords
- refrigerant
- flow path
- electrostatic chuck
- lower electrode
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title abstract description 7
- 239000003507 refrigerant Substances 0.000 claims abstract description 92
- 239000002826 coolant Substances 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 31
- 238000000034 method Methods 0.000 description 8
- 239000000112 cooling gas Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 상판 및 상기 상판과 접착된 하판으로 이루어진 하부 전극을 포함하는 정전척에 있어서,상기 상판에는 동심원 형태로 배치된 중앙의 제1 유로부와 가장자리의 제2 유로부가 경계면에 의해 서로 분할되도록 구비되며, 상기 하판에는 상기 제1 및 제2 유로부들과 연결된 냉매 공급홀들 및 냉매 배출홀들이 구비되며,각각의 제1 및 제2 유로부는 알파벳 ‘C’자 형태를 각각 갖는 외측 유로부와 내측 유로부를 포함하고, 상기 외측 및 내측 유로부의 중앙 부위들은 상기 냉매 공급홀과 냉매 배출홀에 각각 연결되고, 상기 외측 및 내측 유로부들의 일측 단부들이 서로 연결되며, 상기 외측 및 내측 유로부들의 타측 단부들이 서로 연결되는 것을 특징으로 하는 정전척.
- 제 1 항에 있어서, 상기 제1 및 제2 유로부들 각각의 내부에는 2개 이상의 열전달판이 설치되는 것을 특징으로 하는 정전척.
- 정전척, 제1 냉매 공급밸브, 제2 냉매 공급밸브, 제1 냉매 탱크, 제2 냉매 탱크, 제1 센서, 제2 센서 및 제어부를 포함하는 정전척 시스템에 있어서,상기 정전척은 상판 및 상기 상판과 접착된 하판으로 이루어진 하부 전극을 포함하고,상기 상판에는 동심원 형태로 배치된 중앙의 제1 유로부와 가장자리의 제2 유로부가 경계면에 의해 서로 분할되도록 구비되며, 상기 하판에는 상기 제1 및 제2 유로부들과 연결된 냉매 공급홀들 및 냉매 배출홀들이 구비되고,각각의 제1 및 제2 유로부는 알파벳 ‘C’자 형태를 각각 갖는 외측 유로부와 내측 유로부를 포함하고, 상기 외측 및 내측 유로부의 중앙 부위들은 상기 냉매 공급홀과 냉매 배출홀에 각각 연결되고, 상기 외측 및 내측 유로부들의 일측 단부들이 서로 연결되며, 상기 외측 및 내측 유로부들의 타측 단부들이 서로 연결되고,상기 제1 및 제2 냉매 탱크들은 상기 냉매 공급홀들 및 냉매 배출홀들을 통해 상기 제1 및 제2 유로부들과 각각 연결되고,상기 제1 및 제2 센서들은 상기 냉매 배출홀들에 인접하도록 배치되며,상기 제어부는 상기 제1 및 제2 센서들에 의해 검출된 온도에 따라 냉매의 유량을 개별적으로 제어하는 것을 특징으로 하는 정전척 시스템.
- 제 3 항에 있어서, 상기 제1 및 제2 유로부들 각각의 내부에는 2개 이상의 열전달판이 설치되는 것을 특징으로 하는 정전척 시스템.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030015008A KR100959566B1 (ko) | 2003-03-11 | 2003-03-11 | 개선된 냉각 시스템을 갖는 정전척 및 정전척 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030015008A KR100959566B1 (ko) | 2003-03-11 | 2003-03-11 | 개선된 냉각 시스템을 갖는 정전척 및 정전척 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040080141A KR20040080141A (ko) | 2004-09-18 |
KR100959566B1 true KR100959566B1 (ko) | 2010-05-27 |
Family
ID=37364887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030015008A Expired - Lifetime KR100959566B1 (ko) | 2003-03-11 | 2003-03-11 | 개선된 냉각 시스템을 갖는 정전척 및 정전척 시스템 |
Country Status (1)
Country | Link |
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KR (1) | KR100959566B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100712224B1 (ko) * | 2005-09-27 | 2007-04-27 | 주식회사 래디언테크 | 냉각 유로 |
KR100712225B1 (ko) * | 2006-12-28 | 2007-04-27 | 주식회사 래디언테크 | 정전척 |
KR101540146B1 (ko) * | 2012-06-22 | 2015-07-28 | 삼성전기주식회사 | 전력 모듈용 방열 시스템 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5160556U (ko) * | 1974-11-08 | 1976-05-13 | ||
JPH1154600A (ja) * | 1997-08-06 | 1999-02-26 | Tokyo Electron Ltd | 温度調整装置、基板処理装置及び塗布現像処理装置 |
JP2000216140A (ja) * | 1999-01-20 | 2000-08-04 | Hitachi Ltd | ウエハステ―ジおよびウエハ処理装置 |
-
2003
- 2003-03-11 KR KR1020030015008A patent/KR100959566B1/ko not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5160556U (ko) * | 1974-11-08 | 1976-05-13 | ||
JPH1154600A (ja) * | 1997-08-06 | 1999-02-26 | Tokyo Electron Ltd | 温度調整装置、基板処理装置及び塗布現像処理装置 |
JP2000216140A (ja) * | 1999-01-20 | 2000-08-04 | Hitachi Ltd | ウエハステ―ジおよびウエハ処理装置 |
Also Published As
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KR20040080141A (ko) | 2004-09-18 |
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