KR100956688B1 - Printed Circuit Board and Manufacturing Method Thereof - Google Patents

Abstract

A printed circuit board and a method of manufacturing the same are disclosed. A printed circuit board on which an electronic device is mounted, the printed circuit board including a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, and a stiffener formed on the metal support layer, and a manufacturing method thereof are rigid. By forming the metal support layer and the stiffener reliably, it is possible to minimize the occurrence of warpage of the product itself and to suppress the warpage caused by the high temperature during the packaging process.

Coreless Boards, Stiffeners, Package Boards

Description

Printed Circuit Board and Manufacturing Method Thereof

The present invention relates to a printed circuit board and a method of manufacturing the same.

As the performance of electronic devices has been miniaturized, the number of semiconductor chip terminals has increased remarkably, and thus, the thickness of the core of the FC-BGA substrate used as a package substrate has been thinned to improve the signal transmission speed. As the thickness of the core becomes thinner, the value of the loop inductance decreases, thereby improving signal transmission speed.

The absence of a core or a thinner core improves the electrical properties, but as the substrate becomes thinner, warpage problems occur during the product process. Therefore, it is difficult to proceed with the process, and a lot of time is required for the process, which leads to a problem that the lead time is long. In addition, there is a problem that a large number of defective products that do not meet the warpage specification of the final FC-BGA substrate products are mass produced.

As electronic components of printed circuit boards are miniaturized and thinned, inevitably low thicknesses are required, and the demand for thinning of substrates due to high performance is also increasing. The thin printed circuit board has a structure that is vulnerable to bending due to its thin thickness, and there is a problem in that the product can be bent due to residual stress generated in repeated thermal processes.

The present invention provides a printed circuit board and a method of manufacturing the same, which improves the bending resistance of the thin printed circuit board, and the occurrence of warpage can be suppressed as much as possible even in a high temperature thermal process performed at the time of solder ball or solder bump bonding.

According to one aspect of the invention, forming a first solder resist, forming a circuit laminate on the first solder resist, forming a second solder resist on the circuit laminate, a metal support layer on the second solder resist Forming a step, there is provided a printed circuit board manufacturing method comprising the step of forming a stiffener on the metal support layer.

Here, before forming the first solder resist, the method may further include providing a carrier, wherein the first solder resist may be formed on one side or both sides of the carrier.

After the forming of the metal support layer on the second solder resist, the step of separating the first solder resist, the circuit stack, the second solder resist and the metal support layer from the carrier may be further performed.

In addition, the separating of the first solder resist, the circuit stack, the second solder resist and the metal support layer from the carrier may be performed by cutting a part of the first solder resist, the circuit stack, the second solder resist and the metal support layer through a routing process. Can be performed.

The circuit laminate may include a circuit pattern layer and an insulating layer.

The stiffener is made of a metallic material, and the forming of the stiffener on the metal support layer may be performed by bonding the stiffener to the metal support layer through an ultrasonic bonding method.

The forming of the metal support layer on the second solder resist may include forming roughness on the surface of the second solder resist, forming a seed layer on the second solder resist through electroless plating, and forming a seed layer on the seed layer through electroplating. Forming a conductive material.

After forming the metal support layer in the second solder resist, the method may further include selectively removing a portion of the metal support layer.

Selectively removing a portion of the metal support layer may be performed by laminating a photosensitive material on the metal support layer, forming an etching resist on the metal support layer by selectively exposing and developing the photosensitive material, and etching the metal support layer. Can be.

The carrier may include a substrate and a separation layer covering a portion of the substrate. The substrate may be a metal laminate, and the separation layer may be formed of a material including a releasable material.

And selectively opening the first solder resist and the second solder resist after the step of separating the first solder resist, the circuit stack, the second solder resist and the metal support layer from the carrier and the first solder resist and the second solder. Bonding the solder balls to the circuit laminate exposed by opening the resist may be further performed.

The step of selectively opening the first solder resist and the second solder resist may be performed by irradiating the laser to a portion of the first solder resist and the second solder resist.

In addition, according to another aspect of the present invention, a printed circuit board on which an electronic device is mounted, comprising a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, and a stiffener formed on the metal support layer A printed circuit board is provided.

The laminate may include a circuit pattern layer and an insulating layer.

The solder resist may include a first solder resist stacked on one surface of the circuit laminate and a second solder resist stacked on the other surface of the circuit laminate, and the metal support layer may be formed on the second solder resist.

The stiffener is made of a material containing a metallic material, and may be bonded to the metal support layer by performing an ultrasonic bonding method. The stiffener may be partially opened in correspondence with the mounting position of the electronic device, and the height of the upper surface of the stiffener may correspond to the height of the upper surface of the electronic device.

In addition, the metal support layer and the solder resist may be partially opened to correspond to the position where the electronic device is mounted.

Meanwhile, the stiffener may be formed to cover a portion of the metal support layer.

The circuit stack and the electronic device may be electrically connected through solder balls joined to the circuit stack.

According to an embodiment of the present invention, by forming a rigid metal support layer and a stiffener on a printed circuit board, it is possible to minimize the occurrence of warpage of the product itself and to suppress warpage due to high temperature during the packaging process.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are only used to distinguish one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, an embodiment of a printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals. Duplicate description thereof will be omitted.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention, and FIGS. 2 to 16 are flowcharts illustrating a process of manufacturing a printed circuit board according to an embodiment of the present invention. 2 to 16, the carrier 10, the substrate 12, the separation layer 14, the first solder resist 20, the second solder resist 22, the circuit stack 30, and the circuit pattern The layer 32, the circuit pattern 32a, the pad 32b, the insulating layer 34, the insulating material 36, the vias 38, the metal support layer 40, the seed layer 42, the etching resist 46, Stiffener 50, solder ball 60 is shown.

According to an embodiment of the present invention, first, as shown in FIG. 2, a carrier 10 is provided (S100).

The carrier 10 serves as a base on which the substrate is formed, and supports the intermediate product for forming the substrate in the transfer process between the respective process equipments. In the manufacturing process of a thin coreless printed circuit board in which no core is present, a transfer and lamination process is performed using a carrier.

According to the present embodiment, the carrier 10 may be composed of a substrate 12 and a separation layer 14 covering a portion of the substrate 12.

The substrate 12 serves as a support to prevent the solder resist and the circuit stack 30 stacked on the carrier 10 from bending during the transfer and processing steps. Accordingly, the substrate 12 may be a material having a small difference in coefficient of thermal expansion from a material stacked on the carrier. According to the present embodiment, it may be a metal laminate in which metal foil is laminated on an insulating material. The substrate 12 may be a copper clad laminate (CCL) commonly used, and may be a metal laminate suitable for the nature of a process in which various other materials are laminated.

The separation layer 14 is formed so as not to cover the entire surface of the substrate 12 as shown in FIG. The separation layer 14 serves to easily separate the carrier 10 from the stacked circuit stack 30 and the solder resist 20 after the lamination process described later.

According to the present embodiment, a solder resist 20 is stacked on the carrier 10. The solder resist and the circuit laminate 30 stacked thereon are separated from the carrier in a process to be described later. Therefore, according to the exemplary embodiment of the present invention, the separation layer 14 may be formed of a material including a releasable material in which the solder resist may be easily separated from the carrier.

The release material may be a release film formed on the metal laminate, and in addition to the above, it may be formed on the metal laminate in various forms within the scope of the present invention. The release material also covers a portion of the metal laminate. This is to prevent the first solder resist 20, which will be described later, from being arbitrarily separated from the carrier 10 during the lamination and transfer process.

Then, as shown in FIG. 3, the first solder resist 20 is formed on one or both surfaces of the carrier 10 (S200).

The first solder resist 20 covers the substrate 12 and the separation layer 14 of the carrier 10. Since the separation layer covers a portion of the substrate 12, the first solder resist and the substrate may be bonded to each other in an area not covered by the separation layer. The first solder resist may be bonded to the surface of the substrate 12 of the carrier to fix the relative positions of the carrier and the first solder resist during the manufacturing process of the substrate.

The first solder resist 20 may be formed by stacking a film type dry film type solder resist (DFSR) to cover the substrate 12 and the separation layer 14. Moreover, it can also form by the method of apply | coating a soldering resist ink.

According to an embodiment of the present invention, the first solder resist 20 and the substrate 12 of the carrier 10 may be in contact with each other on the outer side in a state where a release property is interposed therebetween.

Then, the circuit laminate 30 is formed in the first solder resist 20 (S300). Forming the circuit laminate will be described with reference to FIGS. 4 to 6.

Referring to FIG. 4, a circuit pattern 32a is formed on the first solder resist 20. As shown in FIG. 5, an insulating material 36 that insulates the circuit pattern 32a is stacked, and the via 38 and the circuit pattern 32a connecting the upper and lower circuit patterns are semi-additive process. Is formed. 4 and 5, the circuit laminate including one or more circuit pattern layers 32 and one or more insulating layers 34 may be formed as shown in FIG. 6.

The process of building-up the circuit stack 30 according to the embodiment of the present invention on the first solder resist 20 may be performed as follows. A metal layer is formed on one surface of the first solder resist by electroless plating, and the metal layer is patterned into a predetermined shape to form a circuit pattern 32a as shown in FIG. 4. The insulating material 36 is laminated on the formed circuit pattern. A portion of the insulating material 36 corresponding to the circuit pattern 32a is removed by laser drilling to form a via hole, and the via hole is filled with metal to form the via 38 and the circuit pattern 32a. As a result, one circuit pattern layer 32 and one insulation layer 34 may be formed, and the circuit laminate 230 including the circuit pattern layers and the insulation layers of several layers may be repeated by repeating the aforementioned processes. Can be formed.

In the description and drawings of the present invention, the process of forming the circuit laminate 30 on the first solder resist 20 is disclosed to be formed only on one surface of the carrier 10, but may be performed on both sides of the carrier. As a result, the carrier may be manufactured on two identical coreless printed circuit boards by removing the carrier in a carrier separation process described later.

Then, the second solder resist 22 is formed in the circuit laminate as shown in FIG. 7 (S400).

The second solder resist 22 may be formed by stacking a film type dry film type solder resist (DFSR) to cover the circuit pattern 32a and the insulating material 36 exposed on the upper surface of the circuit stack 30. Moreover, it can also form by the method of apply | coating a soldering resist ink.

Next, as shown in FIGS. 8 to 10, the metal support layer 40 is formed on the second solder resist 22 (S500).

According to an embodiment of the present invention, roughness may be formed on the surface of the second solder resist so that the seed layer 42 for forming the metal support layer 40 is formed on the second solder resist 22. In order to make the seed layer stick to the electroless plating on the second solder resist, a desmear treatment process may be performed.

Then, as shown in FIG. 9, the seed layer 42 is formed on the second solder resist 22 through electroless plating. The seed layer is thinly formed in the electroless chemical copper plating process. The seed layer serves as a base layer on which a conductive material may be formed in the electroplating process to be described later.

Then, a conductive material is formed on the seed layer 42 through electroplating as shown in FIG. 10. In the electrolytic plating process, a plating material is formed on the seed layer 42. The electrolytic plating may be performed for a predetermined time to form a conductive material having a desired thickness.

The conductive material formed on the seed layer 42 prevents the substrate from bending after the thin coreless substrate is separated from the carrier 10 by the metal support layer 40. In other words, since the coreless substrate does not include a core layer, its own rigidity may be relatively weak. Thus, a metal support layer is formed on the outside of the substrate to provide additional rigidity to the substrate.

Then, as shown in FIGS. 11 and 12, a portion of the metal support layer 40 is selectively removed (S600). The metal support layer 40 covers the second solder resist 22, which may be partially removed at a portion corresponding to the position of the electron holding mounted on the printed circuit board and the position where it is bonded to the printed circuit board. According to an embodiment of the present invention, the solder ball 60 may be bonded to the printed circuit board at a portion of the metal support layer 40 selectively removed, and the electronic device may be electrically connected to the printed circuit board by the solder ball 60. Can be connected.

By selectively removing a portion of the metal support layer 40, a photosensitive material is stacked on the metal support layer to open a portion (S610). Then, by selectively exposing and developing the photosensitive material, an etching resist 46 may be formed on the metal support layer as shown in FIG. 11 (S620). According to this embodiment, the etching resist exposes only the portion where the metal support layer is to be removed.

Then, by supplying the etching solution, the metal support layer 40 not covered by the etching resist 46 is etched as shown in FIG. 12 (S630). A portion of the metal support layer may be etched to partially expose the second solder resist 22.

Next, as shown in FIG. 13, the first solder resist 20, the circuit stack 30, the second solder resist 22, and the metal support layer 40 are separated from the carrier 10 (S700).

The carrier 10 is used only in the manufacturing process of the substrate and is not included in the final product coreless printed circuit board. Therefore, a process of separating the first solder resist 20, the circuit stack 30, the second solder resist 22, and the metal support layer 40 from the carrier is performed.

As described above, the separation layer 14 of the carrier 10 may be formed of a releasable material and covers a portion of the substrate 12 of the carrier. The first solder resist 20 is bonded to the substrate 12 of the carrier at the portion where the release material is not formed.

As shown in FIG. 13, a portion of the first solder resist 20, the circuit stack 30, the second solder resist 22, and the metal support layer 40 is cut. Here, the carrier can be separated by cutting the portion where the first solder resist 20 is bonded to the carrier 10.

According to this embodiment, the carrier can be easily separated by limiting the interface providing the bonding force between the first solder resist 20 and the carrier 10 to the interface between the first solder resist and the separation layer 14 of the carrier. have. By the routing process, the first solder resist is obtained only in the separation layer 14 of the carrier.

The separation process is characterized by utilizing only the portion of the first solder resist 20 that is not directly bonded to the substrate 12 of the carrier 10. By performing a routing process as shown in FIG. 13, the first solder resist 20 in contact with the separation layer 14, which is a release material, the circuit laminate 30, the second solder resist 22, and the metal support layer 40 stacked thereon. ) Can be easily separated from the carrier.

In this embodiment, the carrier 10 is completely cut, but if necessary, the substrate 12 of the carrier can be recycled by preventing the routing cutting depth from reaching the substrate 12 of the carrier 10.

Next, as shown in FIG. 14, the first solder resist 20 and the second solder resist 22 are selectively opened (S800). In the step S600 of selectively removing the metal support layer 40, the second solder resist is partially exposed. In other words, the metal support layer is partially opened in correspondence with the position of the electronic holding on the printed circuit board.

 The exposed second solder resist 22 is selectively opened at the portion where the metal support layer 40 is selectively removed. As the second solder resist is opened, the circuit pattern 32a and the pad 32b of the circuit stack 30 may be exposed to the outside. The printed circuit board and the electronic device may be electrically connected to each other by solder balls 60 bonded to the exposed circuit patterns and the pads.

In addition, the first solder resist 20 may be a surface facing the main board on which the printed circuit board is mounted. Therefore, the printed circuit board may be connected to the external substrate by selectively opening the first solder resist and bonding the solder balls 60 to the open and exposed circuit patterns 32a and pads 32b.

Meanwhile, as shown in FIG. 14, the process of selectively opening the first solder resist 20 and the second solder resist 22 may be performed by irradiating a laser to a portion to be opened of the first solder resist 20 and the second solder resist. Can be performed. According to this embodiment, after the carrier 10 is separated, the first solder resist and the second solder resist are cured. Therefore, the first solder resist and the second solder resist can be selectively opened by partially irradiating the laser roll-cured first solder resist and the second solder resist.

Then, the solder ball 60 is bonded to the pad 32b exposed to the outside as shown in FIG. 15 (S900). The solder ball is a conductive means between the electronic device and the printed circuit board on the surface on which the electronic device is mounted, and a conductive means between the main board and the printed circuit board on the surface on which the printed circuit board is mounted on the main board.

Before the first solder resist 20 and the second solder resist 22 are opened and the solder balls 60 are bonded to the pad 32b, the pad may be surface treated by nickel / gold plating. Also, surface treatment method (OSP) using organic materials is possible.

Next, as shown in FIG. 16, the stiffener 50 is formed on the metal support layer 40 (S1000). Stiffeners give rigidity to coreless printed circuit boards. The stiffener can be a rigid metallic material. The stiffener is a metallic material, and an ultrasonic bonding process may be performed to bond the metal support layer formed of the conductive material during the plating process.

As shown in FIG. 16, the rigid metal stiffener 50 may be attached to the metal support layer 40 by performing an ultrasonic bonding process. The stiffener may be a material such as a metal intermediate support. The stiffener may be a material including copper or other metals (SUS and Ni). According to the principle of ultrasonic bonding, the same properties are best adhered to each other, so it is preferable to use a stiffener made of copper for both the metal support layer and the stiffener.

The principle of ultrasonic bonding is through the physical interruption between the metal and its tissue. According to this embodiment, the stiffener 50 and the metal support layer 40 can be reliably bonded within a short time.

In the case of attaching the stiffener 50 through ultrasonic bonding, the process time may be within several seconds. Therefore, the ultrasonic bonding method can perform a large amount of work in a considerably less time than the stiffener bonding process using a polymer resin.

As shown in FIG. 16, the stiffener 50 is partially opened corresponding to the position where the electronic device is mounted. The thickness of the entire package substrate module may be reduced by mounting the electronic device in the open portion of the stiffener.

The printed circuit board may be provided in which the warpage is eliminated in the manufacturing process through the method of manufacturing the printed circuit board described with reference to FIGS. 1 to 16. In addition, a printed circuit board having reduced warpage in the electronic device mounting and solder ball bonding process may be provided through the metal support layer 40 and the stiffener after manufacturing.

Hereinafter, a printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIG. 17.

According to an embodiment of the present invention, as shown in FIG. 17, a printed circuit board on which electronic devices are mounted, the circuit laminate 30, the solder resists 20 and 22 stacked on the circuit laminate, and the metal support layer formed on the solder resist. 40, a printed circuit board including a stiffener 50 formed on a metal support layer is disclosed.

The circuit laminate of the printed circuit board includes one or more circuit pattern layers 32 and one or more insulating layers 34. That is, the circuit laminate 30 may be a multilayer substrate in which a circuit pattern layer and an insulating layer are alternately stacked.

According to an embodiment of the present invention, the first solder resist 20 is formed on one surface of the circuit laminate. The first solder resist may be stacked on one surface of the circuit laminate 30, and the second solder resist 22 may be stacked on the other surface of the circuit laminate 30.

The metal support layer 40 may be formed in the second solder resist. The metal support layer is formed in the second solder resist to impart rigidity to the coreless printed circuit board. In addition, according to the present embodiment, since the stiffener 50 is formed on the metal support layer, greater rigidity can be given to the printed circuit board.

Part of the metal support layer 40 and the second solder resist 22 may be opened to correspond to the position where the electronic device is mounted on the printed circuit board. A portion of the metal support layer 40 and the second solder resist 22 may be opened to expose the circuit pattern 32a or the pad 32b of the circuit stack 30 to the outside. The solder ball 60 is bonded to the exposed circuit pattern or pad. Through the solder ball, the electronic device is electrically connected to the printed circuit board.

The second solder resist 22 is stacked on the other surface of the circuit stack 30, and a part of the second solder resist may also be opened. As the second solder resist is partially opened, the circuit pattern 32a or the pad 32b may be exposed. The solder ball 60 may be bonded to the exposed circuit pattern or pad, and the printed circuit board may be electrically connected to the external substrate through the solder ball.

The stiffener 50 for reinforcing the rigidity of the coreless printed circuit board is partially opened corresponding to the position where the electronic device is mounted as shown in FIG. 17. The stiffener is a shape in which a part is open. The electronic device may be mounted on the printed circuit board through the open portion of the stiffener, and the electronic device may be connected to the circuit stack through the solder ball 60.

In the present exemplary embodiment, a part of the stiffener is opened so that the electronic device may be mounted surrounded by the stiffener, but the stiffener may be modified in various forms according to the designer's intention and the mounting position of the electronic device.

The height of the upper surface of the stiffener 50 may be formed to correspond to the height of the upper surface of the electronic device to be mounted. In other words, the height of the top surface of the stiffener 50 formed on the metal support layer 40 and the height of the top surface of the electronic device mounted on the coreless printed circuit board may be equally adjusted. The same height of the top surface of the stiffener and the top surface of the electronic device can be a very easy structure when a metal heat spreader is installed for the heat dissipation effect in the future. Therefore, the thickness of the stiffener may vary depending on what thickness of the electronic device is mounted.

For example, if the thickness of the electronic device is 500um, the metal support layer 40 may have a thickness of 25 to 50um and the stiffener 50 may have a thickness of 475 to 450um, thereby facilitating a heat spreader process to be formed in the future. have.

And as described in the manufacturing process of the printed circuit board according to an embodiment of the present invention, the stiffener 50 may be made of a material containing a metallic material. It may be formed of the same metal material as the metal support layer 40 formed through the electroplating process.

According to an embodiment of the present invention, the material of the stiffener 50 may be copper such as the metal support layer 40 or other metals (SUS, Ni). As described above, the stiffener 50 may be formed on the metal support layer by ultrasonic bonding.

In the case of a structure where warpage is likely to occur, such as a thin coreless printed circuit board, a rigid stiffener 50 may be used to prevent warpage of a product. In addition, even after the stiffeners are bonded, even in a plurality of thermal processes (IR reflow process) performed at the user side of the printed circuit board, it is possible to provide a stable thin coreless substrate having less warpage.

In addition, the stiffener 50 may cover a part of the metal support layer 40 in consideration of the position tolerance a generated in the bonding process. In order to attach the stiffener 50 to the metal support layer, a force is applied under ultrasonic conditions in the ultrasonic bonding equipment. A horn of the ultrasonic bonding device is used to apply a force between the stiffener and the metal support layer. Since the physical cut-in joining method between the metal tissues by the left and right vibration is used, a joint position tolerance of 50 um may be locally generated. Therefore, in consideration of such tolerances, as shown in FIG. 17, when the stiffener 50 and the metal support layer 40 are bonded to each other, a position tolerance (a) of 50 μm or more may be provided to improve work efficiency.

In other words, the printed circuit board and the method of manufacturing the same according to an embodiment of the present invention can provide a printed circuit board having less warpage and resistant to warpage during the packaging process by using a metal support layer and a stiffener. And the adhesion reliability of a metal support layer and a stiffener is excellent.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

2 to 16 are flow charts showing a printed circuit board manufacturing process according to an embodiment of the present invention.

17 is a cross-sectional view showing a printed circuit board according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: carrier 12: substrate

14: separation layer 20: first solder resist

22: second solder resist 30: circuit laminate

32: circuit pattern layer 32a: circuit pattern

32b: pad 34: insulating layer

36: insulation material 38: via

40: metal support layer 42: seed layer

46: etching resist 50: stiffener

60: solder ball

Claims (26)

Forming a first solder resist; Forming a circuit laminate on the first solder resist; Forming a second solder resist on the circuit laminate; Forming a metal support layer on the second solder resist; And Printed circuit board manufacturing method comprising the step of forming a stiffener on the metal support layer. The method of claim 1, Prior to forming the first solder resist, Providing a carrier, The first solder resist is a printed circuit board manufacturing method, characterized in that formed on one side or both sides of the carrier. The method of claim 2, After forming the metal support layer in the second solder resist, And separating the first solder resist, the circuit laminate, the second solder resist and the metal support layer from the carrier. The method of claim 3, Separating the first solder resist, the circuit stack, the second solder resist and the metal support layer from the carrier, And a portion of the first solder resist, the circuit laminate, the second solder resist, and the metal support layer through a routing process. The method of claim 1, The circuit laminate is a printed circuit board manufacturing method comprising a circuit pattern layer and an insulating layer. The method of claim 1, The stiffener is made of a metallic material, Forming a stiffener in the metal support layer, Printed circuit board manufacturing method, characterized in that carried out by bonding the stiffener to the metal support layer through an ultrasonic bonding method. The method of claim 1, Forming a metal support layer in the second solder resist, Forming a seed layer on the second solder resist through electroless plating; And forming a conductive material on the seed layer through electrolytic plating. The method of claim 7, wherein Forming a metal support layer in the second solder resist, And forming a roughness on the surface of the second solder resist before forming the seed layer in the second solder resist. The method of claim 1, After forming the metal support layer in the second solder resist, And selectively removing a portion of the metal support layer. The method of claim 9, Selectively removing a portion of the metal support layer, Stacking a photosensitive material on the metal support layer; Selectively etching and developing the photosensitive material to form an etching resist on the metal support layer; And etching the metal support layer. The method of claim 2, The carrier, Board; Printed circuit board manufacturing method comprising a separation layer covering a portion of the substrate. The method of claim 11, Printed circuit board manufacturing method, characterized in that the substrate is a metal laminate. The method of claim 11, The separation layer is a printed circuit board manufacturing method, characterized in that made of a material containing a releasable material. The method of claim 3, After separating the first solder resist, the circuit stack, the second solder resist and the metal support layer from the carrier, Selectively opening the first solder resist and the second solder resist; And And bonding solder balls to the circuit laminate exposed by opening the first solder resist and the second solder resist. The method of claim 14, Selectively opening the first solder resist and the second solder resist, And irradiating a laser onto a portion of the first solder resist and the second solder resist. A printed circuit board on which an electronic device is mounted, Circuit stacks; A solder resist laminated on the circuit laminate; A metal support layer formed on the solder resist; And Printed circuit board comprising a stiffener formed on the metal support layer. The method of claim 16, The circuit laminate includes a circuit pattern layer and an insulating layer. The method of claim 16, The solder resist is A first solder resist laminated on one surface of the circuit laminate; A printed circuit board comprising a second solder resist laminated on the other surface of the circuit laminate. The method of claim 18, The metal support layer is formed on the second solder resist. The method of claim 16, The stiffener is a printed circuit board, characterized in that made of a material containing a metallic material. The method of claim 16, The stiffener is bonded to the metal support layer by performing an ultrasonic bonding method. The method of claim 16, The stiffener is a part of the printed circuit board, characterized in that the opening is opened corresponding to the mounting position. The method of claim 16, The metal support layer and the solder resist is a part of the printed circuit board, characterized in that each of the opening corresponding to the mounting position. The method of claim 16, The height of the upper surface of the stiffener is corresponding to the height of the upper surface of the electronic device. The method of claim 16, The stiffener is a printed circuit board, characterized in that to cover a portion of the metal support layer. The method of claim 16, The circuit laminate and the electronic device is a printed circuit board, characterized in that electrically connected through the solder ball bonded to the circuit laminate.

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