KR100926938B1 - Probe card assembly and its manufacturing method - Google Patents

Abstract

The present invention relates to a probe card assembly, wherein the probe card assembly according to the present invention comprises a space transducer including a top surface and a bottom surface on which a plurality of terminals are formed, a printed circuit board disposed on a bottom surface of the space transducer, and the space A probe substrate assembly disposed on the top surface of the transducer, the probe substrate assembly comprising a coupling structure connecting two or more probe substrates and adjacent probe substrates.

Probe card assembly, probe substrate assembly, coupling structure

Description

PROBE CARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

The present invention relates to a probe card assembly, and more particularly, to a probe card assembly including a probe substrate assembly connecting a plurality of probe substrates through a coupling means.

In general, the probe card electrically connects the wafer and the semiconductor device inspection equipment to test whether there is a defect during or after fabrication of a semiconductor device such as a semiconductor memory, a flat panel display (FPD), and transmits an electrical signal of the inspection equipment to the wafer. It is a device for transmitting to the formed semiconductor die (die), and the signal returned from the semiconductor die to the inspection equipment of the semiconductor element.

1 is a view showing a schematic configuration of a conventional probe card.

The conventional probe card includes a printed circuit board (PCB) 10, a space converter 20, and interface means 30 for electrically connecting the printed circuit board 10 and the space converter 20. And a probe 40 mounted to the space transducer 20. In addition, although not shown in FIG. 1, the probe card is usually provided with deformation compensation means for compensating for geometric deformation of the space transducer 20.

The printed circuit board 10 receives the electrical signal transmitted from the semiconductor inspection equipment, and transmits the received electrical signal to the probe 40 mounted in the space converter 20 through the interface means 30, while the probe ( And circuitry for forwarding the signal transmitted from 40 to the semiconductor inspection equipment in the reverse direction.

The space transformer 20 is usually manufactured in the form of a multi-layer ceramic (MLC) in which a ceramic substrate is formed in multiple layers. The upper and lower surfaces of the space converter 20 are formed by pads electrically connected to each other by internal wires and different in pitch (pitch), thereby performing a function of pitch conversion.

In addition, the plurality of pads 50 formed on the upper surface of the space transducer 20 are directly attached to a plurality of fine probes 40 manufactured by a MEMS (MicroElectric Mechanical System) method or carried through the probe substrate assembly on which the probe is mounted. Is attached.

On the other hand, the size of the probe card and the area in which the probe is located are determined according to the size of the target object. However, the conventional probe card could not flexibly respond to the change in the size of the object, and the size of the probe card to produce probe cards corresponding to the size of the object, for example, 6-inch, 8-inch, and 12-inch wafers, respectively. There was a difficulty to equip additional equipment.

As a conventional technique proposed to flexibly correspond to the size of a probe card, a technique of dividing a space transducer into which a probe is directly mounted, or dividing a probe substrate assembly for carrying a probe, is bonded to a space transducer.

Some embodiments of the present invention aim to provide a novel and improved coupling structure for interconnecting adjacent probe substrates in fabricating a probe substrate assembly by connecting a plurality of probe substrates.

It is also an object of some embodiments of the present invention to provide a novel and improved probe card assembly comprising a probe substrate assembly in which a plurality of probe transport probe substrates are interconnected using the coupling structure.

As a technical means for achieving the above-described technical problem, the probe card assembly for probe inspection of the device according to the first aspect of the present invention comprises a space transducer, the upper and lower surfaces formed with a plurality of terminals, A printed circuit board disposed on a lower surface, a probe substrate assembly disposed on an upper surface of the spatial transducer, wherein the probe substrate assembly includes a coupling structure connecting two or more probe substrates and an adjacent probe substrate. .

The probe substrate may include an upper probe substrate, a lower probe substrate, a reinforcement substrate interposed between the upper probe substrate and the lower probe substrate, and inserted into a side of the upper probe substrate, the upper probe substrate, the lower probe substrate, and the reinforcement substrate. It may include a plurality of probes fixed through.

Preferably, the coupling structure connects one or more of the upper and lower surfaces of the adjacent probe substrate. The coupling structure includes a pair of base parts and a horizontal connection part, and a hole into which the pair of base parts is inserted is formed in a surface to which the adjacent probe substrate is connected.

Preferably, when the coupling structure is a coupling structure connecting the upper surface of the probe substrate may further include a reinforcing structure formed on the upper portion of the horizontal connection.

Preferably, when the coupling structure is a coupling structure connecting the lower surface of the probe substrate, the hole into which the pair of bases are inserted may include a stepped portion formed to receive the horizontal connection portion at an inlet thereof.

Preferably, the base portion of the coupling structure includes a spring structure formed on both sides thereof to elastically support both sides of the hole, or both sides thereof are formed to be in close contact with both sides of the hole, or at least one of the sides thereof. It may include a locking structure formed to be caught.

In addition, as a technical means for achieving the above-described technical problem, a method of manufacturing a probe card assembly according to a second aspect of the present invention, the space transducer including a top surface and a bottom surface formed with a plurality of terminals, A method of manufacturing a probe card assembly comprising a printed circuit board disposed on a bottom surface and a probe substrate assembly disposed on an upper surface of the spatial transducer, the method comprising: providing two or more probe substrates, combining adjacent probe substrates; Connecting to a structure to provide the probe substrate assembly and collectively connecting the probe substrate assembly to an upper surface of the spatial transducer.

Advantageously, providing said probe substrate assembly comprises forming a plurality of holes in one or more opposite sides of said adjacent probe substrate and said coupling structure comprising a pair of bases and horizontal connections. And inserting and fixing the hole.

Preferably, the plurality of holes and coupling structures may be formed by a MEMS process.

According to the present invention, there is provided a novel and improved coupling structure capable of easily connecting adjacent probe substrates to produce a probe substrate assembly having various areas, and a probe card assembly including the probe substrate assembly.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In addition, when a part is said to "include" a certain component, it means that it can further include other components, except to exclude other components unless otherwise stated.

2 shows a probe card assembly according to one embodiment of the invention.

As shown in FIG. 2, the probe card assembly 1000 may include a space transducer 200, a probe substrate assembly 100 disposed on an upper surface of the space transducer 200, and a lower surface of the space transducer 200. It includes a printed circuit board 300 disposed.

A plurality of terminals are formed on the top and bottom surfaces of the space converter 200, and the plurality of terminals formed on the top and bottom surfaces are electrically connected by internal wiring of the space converter 200. The space converter 200 may be an assembly of a plurality of MLC substrates.

The printed circuit board 300 is disposed on the bottom surface of the space converter 200, and although not shown, an interposer substrate may be interposed between the probe substrate assembly 100 and the printed circuit board 300.

The probe substrate assembly 100 is disposed on the top surface of the space transducer 200. The probe substrate assembly 100 includes a plurality of probe substrates 110, and a plurality of probes (not shown) are mounted on an upper surface of the probe substrate 110 to contact the object under test, and the probe substrate assembly 100 is provided. ) May be mounted to the space transducer 200 in a state where the coupling and the probe mounting of the probe substrate 110 are completed.

The technique of utilizing the probe substrate assembly 100 as a probe transport carrier without directly mounting the probe to the space transducer 200 may use the method disclosed in Korean Patent Publication No. 10-2006-0058189.

3 shows a probe substrate assembly 100 in accordance with one embodiment of the present invention.

As shown in FIG. 3, the probe substrate assembly 100 includes two or more probe substrates 110. In the present exemplary embodiment, the probe substrate assembly 100 is configured by using nine probe substrates 110, but the number of probe substrates 110 may be increased or decreased in correspondence to the area of the object under test.

As shown in the enlarged view of FIG. 3, the plurality of probe substrates 110 are connected by the probe substrate 110 and the coupling structure 120 adjacent to each other, and the MEMS process is formed on the upper surface of the probe substrate assembly 100. The probe produced by this is mounted in correspondence with the pad arrangement of the inspected object.

The coupling structure 120 is inserted into and fixed in the hole 114 formed in the adjacent probe substrate 110, and the number and positions of the coupling structures 120 mounted for the coupling with the adjacent probe substrate 110 are generally required. It is determined in consideration of the durability of the probe substrate assembly 100.

4 shows a partial cross section of a probe substrate assembly in which adjacent probe substrates are connected by a coupling structure, and FIG. 5 shows the coupling structure used in FIG. 4 in detail.

As shown in FIGS. 4 and 5, each probe substrate 110 is formed between the upper probe substrate 111, the lower probe substrate 113, and the upper probe substrate 111 and the lower probe substrate 113. Reinforcing substrates 112, which are laminated in a bonded state.

Although not shown, the probe is inserted into the upper probe substrate 111 and elastically set to the lower surface of the lower probe substrate 113 through the upper probe substrate 111, the reinforcing substrate 112, and the lower probe substrate 113. The terminal having a fixed position can be connected to the terminal formed on the upper surface of the space transducer. However, the specific mounting method of the probe does not form part of the present invention.

The coupling structures 120 and 130 connect the upper and lower surfaces of the adjacent probe substrate 110. In FIG. 4, the coupling structures 120 and 130 are connected to both the upper and lower surfaces, respectively, but it is also possible to connect only one of the upper and lower surfaces according to the specific specifications of the probe card assembly.

Holes 114 into which coupling structures 120 and 130 are inserted are formed in adjacent probe substrates 110. The hole 114 may be formed by a MEMS process using deep silicon etching together with a probe mounting hole formed in the probe substrate 110.

The upper coupling structure 120 connecting the upper surface of the adjacent probe substrate 110 may include a pair of bases 122 and a pair of bases 122 and a horizontal connector 121 connecting the bases 122. It includes a reinforcing structure 123 formed on the top.

The pair of bases 122 are inserted into and fixed in the holes 114 formed in corresponding sizes, and an adhesive may be utilized in this process for more secure fixing. In this embodiment, both sides of the base 122 are formed to be in close contact with both sides of the hole 114, which minimizes the assembly tolerances when connecting the probe substrate 110 to the alignment of the XY axis of the probe substrate 110 It is advantageous.

The reinforcing structure 123 formed on the top of the horizontal connecting portion 121 to reinforce the horizontal connecting portion 121 may be damaged when the probe substrate assembly 100 is damaged by an impact applied to the probe card assembly when the test object is probed. To prevent them.

The horizontal connection portion 121 should be formed at a height that does not interfere with the inspected object in consideration of the rotation range of the cantilever type probe generated during the probe test.

Meanwhile, the lower coupling structure 130 connecting the lower surfaces of the adjacent probe substrates 110 includes a pair of bases 132 and a horizontal connection 131 connecting the pairs of bases 132.

The base 132 and the horizontal connector 131 of the lower coupling structure 130 have the same configuration as the upper coupling structure 120. However, since the space transducer is to be coupled to the lower surface of the probe substrate 110 in close contact, it is advantageous that the reinforcing structure is not formed in the lower coupling structure 130 unlike the upper coupling structure 120.

Furthermore, the base 132 of the lower coupling structure 130 is inserted to prevent the horizontal connection 131 of the lower coupling structure 130 from protruding to the lower surface of the probe substrate 110 and interfering with the spatial transducer. A step portion 115 is formed in the hole 114 to be fixed so that the horizontal connection portion 131 may be buried inside the lower surface of the substrate.

The coupling structures 120 and 130 may be manufactured in a plate shape by a MEMS process.

On the other hand, Figure 6 and Figure 7 shows a coupling structure according to another embodiment of the present invention. Hereinafter, for convenience of description, the description will be made with reference to FIG. 4 based on differences from the coupling structures 120 and 130 illustrated in FIG. 5.

The coupling structures 140 and 150 shown in FIG. 6 further include wing-shaped spring structures 144 and 154 on both sides of the bases 142 and 152 as compared to the coupling structures 120 and 130 of FIG. 5. do.

Accordingly, when the bases 142 and 152 are inserted into and fixed to the holes 114 formed on the upper to lower surfaces of the probe substrate 110, the spring structures 144 and 154 formed on both sides of the bases 142 and 152. Both sides of the hole 114 are fixed in a state of elastically supporting.

As shown in FIG. 5, the coupling structures 140 and 150 according to the embodiment of FIG. 6 have bases 142 and 152 as compared with the case where both sides of the hole 114 and both sides of the bases 122 and 132 are in close contact with each other. ) Can be easily inserted into the hole 114 while utilizing the elasticity of the spring structure to allow the bases 142, 152 to maintain alignment within the hole 114.

The coupling structures 160, 170 shown in FIG. 7 further include locking structures 164, 174 formed on one side of the bases 162, 172 as compared to the coupling structures 120, 130 of FIG. 5.

Therefore, when the bases 162 and 172 are inserted into and fixed to the holes 114 formed on the top to bottom surfaces of the probe substrate 110, the locking structures 164 and 174 formed on one side of the bases 162 and 172. It is fixed in a state caught in one side of the hole 114.

The coupling structures 160 and 170 according to the embodiment of FIG. 7 may improve the fastening force to the holes 114 of the coupling structures 160 and 170 in comparison with the coupling structures 120 and 130 of FIG. 5. There is an advantage.

Using the above-described probe substrate assembly, the prepared two or more probe substrates are connected to adjacent probe substrates by a coupling structure to form a probe substrate assembly, and the probes are collectively connected to the upper surface of the space transducer by using the probe substrate assembly. The card assembly can be manufactured.

Each probe substrate is bonded to an upper probe substrate, a lower probe substrate, and a reinforcement substrate interposed between the upper probe substrate and the lower probe substrate, inserted into the upper probe substrate, and inserted into the upper probe substrate, the lower probe substrate, and the reinforcement. It may be manufactured by fixing a plurality of probes penetrating the substrate.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a view showing a schematic configuration of a conventional probe card.

2 illustrates a probe card assembly in accordance with some embodiments of the present invention.

3 illustrates a probe substrate assembly in accordance with some embodiments of the present invention.

4 is a partial cross-sectional view of a probe substrate assembly in accordance with some embodiments of the present invention.

5-7 illustrate a coupling structure in accordance with some embodiments of the present invention.

Claims (14)

A probe card assembly for inspecting a device, comprising: A space converter including an upper surface and a lower surface on which a plurality of terminals are formed; A printed circuit board disposed on a bottom surface of the space converter, A probe substrate assembly disposed on an upper surface of the spatial transducer Including but not limited to: The probe substrate assembly, Two or more probe substrates and Coupling structure connecting adjacent probe boards Including, The probe substrate, Upper probe substrate, Lower probe substrate, A reinforcing substrate interposed between the upper probe substrate and the lower probe substrate; A plurality of probes inserted into the upper probe substrate and fixed through the upper probe substrate, the reinforcement substrate, and the lower probe substrate; Probe card assembly comprising a. delete The method of claim 1, The coupling structure, A probe card assembly connecting one or more of the top and bottom surfaces of the adjacent probe substrate. The method of claim 3, wherein The coupling structure, Including a pair of base and horizontal connections, And a hole into which the pair of base portions are inserted in a surface to which the adjacent probe substrate is connected. The method of claim 4, wherein The coupling structure, A coupling structure connecting the upper surface of the probe substrate, Reinforcement structure formed on the horizontal connecting portion Probe card assembly further comprising. The method of claim 4, wherein The coupling structure, A coupling structure connecting the lower surface of the probe substrate, The hole into which the pair of bases is inserted, A stepped portion formed to receive the horizontal connection at its inlet Probe card assembly comprising a. The method of claim 4, wherein The base portion, Spring structures formed on both sides thereof to elastically support both sides of the hole Probe card assembly comprising a. The method of claim 4, wherein The base portion, Probe card assembly is formed so that both sides are in close contact with both sides of the hole. The method of claim 4, wherein The base portion, Locking structure formed such that at least one of the sides of the side is caught in the hole Probe card assembly comprising a. A space transducer including a top surface and a bottom surface having a plurality of terminals formed thereon, a printed circuit board disposed on a bottom surface of the space transducer, and a probe substrate assembly disposed on an upper surface of the space transducer. In the manufacturing method, (a) providing at least two probe substrates, (b) connecting adjacent probe substrates to a bonding structure to provide the probe substrate assembly; (c) collectively connecting the probe substrate assembly to the top surface of the spatial transducer; Including but not limited to: In step (a), (a-1) bonding an upper probe substrate, a lower probe substrate, and a reinforcing substrate interposed between the upper probe substrate and the lower probe substrate; (a-2) fixing a plurality of probes inserted into the upper probe substrate and penetrating the upper probe substrate, the lower probe substrate, and the reinforcing substrate; Method of manufacturing a probe card assembly comprising a. delete The method of claim 10, In step (b), (b-1) forming a plurality of holes in one or more opposite sides of the adjacent probe substrate; (b-2) inserting and fixing the coupling structure including a pair of bases and a horizontal connection into the plurality of holes Method of manufacturing a probe card assembly comprising a. The method of claim 12, And said plurality of holes are formed by a MEMS process. The method of claim 12, And said coupling structure is formed by a MEMS process.

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