KR100850454B1 - Block head assembly for dicing ? sorting system - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing and sorting system for semiconductor components, and more particularly, to a block head portion for dicing and sorting equipment having a buffer device for safely handling electronic components. .

Block head portion for dicing and sorting equipment according to the present invention, the lifting means; An elevating frame, the one side of which is supported to elevate to the elevating means; Rotating means installed on the other side of the elevating frame to have a rotating shaft in a horizontal direction; A rotating frame rotatably installed on the elevating frame, one end of which is coupled to the rotating shaft connected to the rotating means and rotated by the rotating means; A block head having a plurality of suction nozzles capable of lifting and lowering, coupled to the other end of the rotation frame; And a cushioning means installed on the block head to cushion the electronic component when the electronic component is laid down. The block head unit for dicing and sorting equipment is provided.

Description

Block head assembly for dicing and sorting equipment {Block head assembly for dicing & sorting system}

1 is a perspective view schematically showing a block head portion for dicing and sorting equipment according to an embodiment of the present invention;

FIG. 2 is a view schematically showing a cross section of FIG. 1;

3 is an exploded perspective view schematically showing a block head in which the buffer means of FIG. 1 is installed.

<Explanation of symbols for the main parts of the drawings>

1 ... block head part for dicing and sorting equipment 2 ... lift means

3 ... Elevation frame 4 ... Rotating means

5.Rotating frame 6 ... Blockhead

7 ... first buffer means 8 ... second buffer means

9.Sensor section 61 ... Blockhead cover

62 ... upper block 63 ... lower block

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing and sorting system for semiconductor components, and more particularly, to a block head unit for dicing and sorting equipment having a buffer device for safely handling semiconductor components. .

In general, the dicing and sorting equipment for semiconductor components cuts semiconductor package assemblies in which a plurality of semiconductor packages are integrally formed into individual semiconductor packages, sorts them, mounts them on a tray, and sends or ships them to the next process such as component mounting. It is a kind of manufacturing equipment.

The dicing and sorting equipment is subjected to the following process. First, when the integrated semiconductor package assembly is supplied (substrate loading), the semiconductor package is inspected (substrate inspection), cut into each semiconductor package, washed and dried (washing & drying). In addition, the semiconductor package is flipped (flip unit process), marking inspection (unit ball inspection). In addition, a defective product classified by the above inspection is mounted on a defective product tray, and a non-defective product is mounted on a non-defective product tray and sent out to the next process.

In this case, an apparatus for transferring the semiconductor packages or inverting the semiconductor packages is required between the processes. To this end, a block head provided with a plurality of semiconductor adsorption nozzles may be used to handle the plurality of semiconductor packages at once.

When the semiconductor packages are put down on the other block head to put down the semiconductor package to perform the necessary processes by adsorbing the semiconductor packages to the block head, or to turn the semiconductor package over, Mechanical forces may be applied to damage the semiconductor package or to cause defects.

In order to solve the above problems, it is possible to use a driving mode that detects the position of the block head by mounting a sensor pin using a photo sensor or the like, as used in a similar device. There is a problem in the field of implementation.

An object of the present invention is to provide a block head portion for dicing and sorting equipment in which a shock absorber for safely handling electronic components is provided.

In order to achieve the above object, the block head for dicing and sorting equipment according to an aspect of the present invention,

Elevating means;

An elevating frame, the one side of which is supported to elevate to the elevating means;

Rotating means installed on the other side of the elevating frame to have a rotating shaft in a horizontal direction;

A rotating frame rotatably installed on the elevating frame, one end of which is coupled to the rotating shaft connected to the rotating means and rotated by the rotating means;

A block head having a plurality of suction nozzles capable of lifting and lowering, coupled to the other end of the rotation frame; And

It is installed on the block head, characterized in that it comprises a; buffer means for buffering the electronic component when laying down the electronic component.

At this time, the block head is a block head cover is installed on the lower end of the rotating frame, the upper block is installed inside the block head cover, and the lower portion is installed to be able to move up and down spaced apart from the lower end of the block head upper portion And at least one first buffering means for allowing the lower block to be elastically biased in opposite directions with respect to the upper block and the block head cover, and the lower block protrudes below the lower surface of the lower block. And at least one second buffering means which is elastically biased in the protruding direction with respect to the block head. In addition, the second buffer means is preferably provided with a sensor unit that can measure the degree of compression of the second buffer means.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view schematically showing a block head portion for dicing and sorting equipment according to an embodiment of the present invention, FIG. 2 is a view schematically showing a cross section of FIG. 1, and FIG. 3 is a buffer of FIG. 1. An exploded perspective view schematically showing a block head provided with means.                     

Referring to the drawings, the block head portion 1 for dicing and sorting equipment includes an elevating means 2, an elevating frame 3, a rotating means 4, a rotating frame 5, a block head 6, and cushioning. And means 7 and 8.

The elevating means (2) is supported by a predetermined support structure, the block head (6) provided with the buffer means (7, 8), the rotating frame (5) to which the block head is fixed, and the rotating frame The whole lifting frame 3 supporting (5) is lifted. At this time, the elevating means (2) is driven by a predetermined driving means, and the screw bar is installed in the direction in which the elevating frame (3) is elevated, coupled with the screw bar, of the elevating frame (3) It is possible to use a ball screw having a nut portion to which one end is fixed.

The lifting frame 3 is lifted by the lifting means 2, one side is supported and installed to be able to lift the lifting means. The lifting means (3) is provided with the rotating means (4) to have a horizontal axis of rotation on one side opposite to the side supported by the lifting means (2). In addition, the pivot frame 5 is installed at one end of the lifting frame 3 so as to be rotatable by the pivoting means 4 so as to be rotatable.

In this case, as shown in FIG. 1, the lifting frame 3 is rotatable so that the two rotating frames 5 can rotate at a predetermined angle with each other in order to efficiently perform the work in the dicing and sorting equipment. Can be installed. In addition, the two rotating frames 5 preferably have an angle of 90 degrees to each other. In addition, if necessary, two or more of the rotating frames 5 may be installed to have a predetermined angle to each other. At this time, as shown in the figure, the two lifting frames (5, 5 ') to the lifting frame (3) may be installed in combination with the rotating shaft having an angle of 90 degrees to each other.

The rotating means 4 is installed on one side of the lifting frame 3 opposite to the lifting means, and rotates the rotating frame 5. The rotating means 4 is connected in a direct connection structure by a predetermined shaft joint means such as a horizontal rotating shaft and the coupling of the rotating frame (5). As the rotation means 4, a motor having a speed reducer capable of forward rotation and reverse rotation may be used.

The rotating frame 5 is installed to be rotatable to the lifting frame 3, one end is coupled to the rotating shaft connected to the rotating means 4 is rotated by the rotating means (4). The rotation frame 5 is provided with the block head 6 provided with a plurality of adsorption nozzles for adsorbing electronic components. The block head 6 simultaneously adsorbs the plurality of electronic components on the floor to the side surface. In the case of taking over the block head located or the reverse operation, the lifting means 2 is lifted by the lifting means 2 and the rotating frame 5 is rotated by a predetermined angle to perform the necessary work.

The block head 6 is installed on the rotating frame, and simultaneously absorbs, transfers or takes over a plurality of electronic components by a plurality of suction nozzles installed on the bottom surface thereof. The block head 6 is installed at the lower end of the pivot frame 5, the upper surface of the block head 6 and the pivot frame of the connection portion between the block head 6 and the pivot frame 5 At least one bracket may be attached to the side of (5) by a predetermined connection means such as welding to reinforce the strength of the mutual connection portion.

The block head 6 includes a block head cover 61, an upper block 62, and a lower block 63. The upper surface of the block head cover 61 is fixed to the lower end surface of the pivot frame 5 by fastening means such as welding. In addition, a space is formed in the inner surface of the block head cover 61, the upper block 62 is inserted and fixed from the lower surface in the space. In addition, the lower block 63 is provided on the inner surface of the space of the block head cover 61 so as to move up and down by a predetermined interval below the upper block 62. In addition, through-holes and insertion grooves are formed in each of the block head cover 61, the upper block 62, and the lower block 63 so that the buffer means 7 and 8 can be installed. desirable.

The buffer means 7 and 8 are installed in the block head 6 to cushion the electronic component when the electronic component is laid down. At this time, the block head 6 is provided with a plurality of the buffer means (7, 8), and absorbs the impact that can be applied to the electronic component in a multi-step when handling the electronic component adsorbed to the block head (6) Thus, the electronic component can be sufficiently protected.

In the present embodiment, the buffer means 7 and 8 are provided with a first buffer means 7 and a second buffer means 8. First, in a first step, the first buffer means mechanically absorbs the shock applied to the electronic component, and in the second step, the second buffer unit is attached to the second buffer means by using a sensor. The shock applied to the electronic component can be electrically and controllably absorbed.

The block head cover 61 is provided with a first through hole 611 on the upper surface for the first buffering means 7. In addition, a second through hole 612 is formed in the upper block 62 by extending the first through hole 611 for the first buffer means 7, and the second buffer means 8 is formed in the upper block 62. In order to form a third through hole 622. In addition, the lower block 63 has an insertion groove 631 in which a screw is formed on an inner surface thereof by extending the first through hole 611 and the second through hole 621 for the first buffering means 7. And a fourth through hole 632 is formed for the second buffering means 8.

The at least one first buffering means 7 may be installed such that the lower block 63 is elastically biased in the opposite direction with respect to the upper block 62 and the block head cover 61. In the present embodiment, the two first buffering means 7 are installed in the direction in which the block head 6 is lifted on both sides with respect to the pivot frame 5 of the block head 6. The first buffering means 7 includes a support pin 71 and an elastic member 72. At this time, the buffer means is shown to be larger than the actual use for the understanding of the present invention, it is preferable that the interference is not provided with the electronic component adsorption nozzle installed in the block head (6).

A bolt having a head and a thread may be used as the support pin 71. The head of the support pin 71 is exposed to the upper surface of the block head cover 61 and the thread of the support pin 71 is provided. Is coupled to the screw portion made in the insertion groove 631 through the first through hole 611 and the second through hole 621.

As the elastic member 72, a member such as a spring having an elastic force may be used, and the elastic member 72 may be installed to surround the threaded portion of the support pin. One end of the elastic member 72 is supported on the upper surface of the lower block 63 formed with the insertion groove 631, the support pin 71 is coupled, the other end of the first through hole 611 is It is supported on the inner surface of the formed block head cover 61.

The at least one second buffering means 8 may protrude below the lower surface of the lower block 63 so as to be elastically biased in the protruding direction with respect to the block head 6. In the present embodiment, one second buffering means 8 is installed in a direction in which the block head 6 is lifted on one side with respect to the pivot frame 5 of the block head 6.

The second buffering means 8 includes a buffer cylinder 81, an elastic member 82, and a buffer shaft 83. In addition, the second buffering means 8 is preferably provided with a sensor unit 9 that can measure the degree of buffering the second buffering means (8).

The buffer cylinder 81 passes through the third through hole 622 and the fourth through hole 632 in the block head 6. In addition, a buffer shaft 83 is inserted and installed in the buffer cylinder 81, one end of the elastic member 82 is supported on the inner surface of the buffer cylinder 81, and the other of the elastic member 82 One end is inserted to be supported by one end inserted into the buffer cylinder 81 of the buffer shaft 83. At this time, the compressed shaft 83 is supplied with compressed air to the buffer cylinder 81 into which the buffer shaft 83 is inserted, without using the separate elastic member 82. The buffer cylinder 81 may be buffered.

When the block head 6 comes into contact with the bottom surface or another block head to simultaneously adsorb a plurality of electronic components or take over to another block head, the block head 6 protrudes from the bottom of the block head to the bottom or the other block head. A groove in which the buffer shaft 83 may be positioned may be formed.

In addition, the sensor unit 9 may be installed on one side of the second buffering means 8, wherein the second buffering means 8 may be provided with a bottom surface or the other block head. Once the buffering function is in contact, and the buffer shaft 83 is pressed into the buffer cylinder 81 to some extent, the sensor unit 9 can detect it. In this case, it is preferable to use a contact type magnetic sensor in place of the photo sensor, which is a conventional and expensive installation structure as the sensor unit 9. At this time, the buffer means is shown to be larger than the actual use for the understanding of the present invention, it is preferable that the interference is not provided with the electronic component adsorption nozzle installed in the block head (6).

Hereinafter, the operation of the present invention configured as described above.

The block head portion 1 for dicing and sorting equipment according to the present invention serves to transfer the electronic components or to turn the electronic components over between the accessories for each operation in the dicing and sorting apparatus. do. In this case, a block head provided with a plurality of electronic component adsorption nozzles simultaneously adsorbs a plurality of electronic components and transports them, or a plurality of the block heads cooperate with each other.

After finishing the previous process in the dicing and sorting equipment, the plurality of electronic components arranged in a predetermined shape is lowered by the elevating means 2 to send the block head 6 to a predetermined position, and the lower block A vacuum is formed on an adsorption nozzle provided on the lower surface of 63 to adsorb the electronic components simultaneously.

At this time, when the lower surface of the lower block 6 contacts the bottom surface, firstly, the first buffering means 7 mechanically absorbs the shock applied to the electronic component, and then the second buffering means 8. While absorbing this mechanically, the sensor unit 9 installed in the second buffering means 8 senses the degree of operation of the second buffering means and stops the operation of the block head 6.

The first buffering means 7 is provided between the lower surface of the block head cover 61 and the upper surface of the lower block 63 while the support pin 71 is pushed out of the block head cover 61. The elastic member 72 is compressed, and the electronic components adsorbed on the lower block 83 are buffered.

In addition, the second buffering means 8 is attached to the buffer cylinder 81 when the buffer shaft 83 is pressed in the buffer cylinder 81 and the buffer shaft 83 reaches a predetermined position. The sensor unit 9 detects this, and sends a signal detected by the sensor unit 9 to the lifting means 2 to stop the operation of the lifting means 2 to stop the block head 6. Stop it.

At this time, the operation of the block head portion 1 for dicing and sorting equipment in the process of absorbing the electronic components, as described above, put the electronic component in a predetermined place, or the block that adsorbs the electronic components. In the case of taking over from the head 6 to another block head, the same goes.

However, in case of taking over from the block head 6 that absorbs the electronic component to another block head, the block heads 6 mutually rotate by rotating the pivot frames 5 on which the block heads 6 are mounted. Facing the block head 6 on one side and the buffer shaft 83 reaches a predetermined position, the sensor unit 9 detects this and stops the movement of the block head 6. Afterwards, a vacuum is formed on the block head 6 on the other side while releasing the vacuum formed on the block head 6 on one side, thereby transferring the electronic components between the block heads 6.

The effects of the present invention made as described above are as follows.

In the block head portion for dicing and sorting equipment according to the present invention, the first buffer means mechanically absorbs the impact applied to the electronic component in the first step, and the second buffer means is applied in the next second step. Provided is a block head portion for dicing and sorting equipment capable of electrically and controllably absorbing an impact applied to the electronic component using a sensor attached to the second buffering means.

In addition, the use of a contact type magnetic sensor as the sensor unit is low cost and simple installation structure is advantageous in the field adaptation, such as maintenance and repair.

In addition, it is possible to efficiently transfer and flow the electronic components in the automated overall dicing and sorting equipment.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. will be. Therefore, the true scope of protection of the present invention should be defined by the technical spirit of the appended claims.

Claims (3)

delete Elevating means; An elevating frame, the one side of which is supported to elevate to the elevating means; Rotating means installed on the other side of the elevating frame to have a rotating shaft in a horizontal direction; A rotating frame rotatably installed on the elevating frame, one end of which is coupled to the rotating shaft connected to the rotating means and rotated by the rotating means; A block head having a plurality of suction nozzles capable of lifting and lowering, coupled to the other end of the rotation frame; And It is installed in the block head, and provided with a buffer means for buffering the electronic component when laying down the electronic component, The block head has a block head cover installed at a lower end of the pivot frame, an upper block installed inside the block head cover, and a lower block installed at a lower end of the block head to be spaced apart at a predetermined interval. And At least one first buffer means for the buffer means to bias the lower block in an opposite direction with respect to the upper block and the block head cover, and And at least one second buffering means which protrudes below the lower surface of the lower block and is elastically biased in the protruding direction with respect to the block head. The method of claim 2, Block head portion for dicing and sorting equipment, characterized in that the second buffer means is provided with a sensor unit for measuring the degree of cushioning the second buffer means.

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