KR100858491B1 - Apparatus and method for testing image sensor package - Google Patents

Abstract

The present invention consists of a plurality of image sensor packages each comprising a translucent substrate and a connection terminal and an image sensor disposed below, an image for testing an image sensor package from a package wafer in which each of the image sensor packages is cut. It relates to a sensor package inspection device. An image sensor package inspection apparatus according to the present invention includes a seating unit on which an image sensor package is seated for a test, an inspection unit configured to electrically and image test the image sensor package by providing a lens and a light source on one side of the image sensor package, At least one of a jig for supporting a package wafer having a plurality of cut image sensor packages, a transfer unit for transferring an image sensor package from the package wafer to the seating unit, and electrical and image testing of the image sensor package And a control and processing unit having a tester module.

Image sensor, package, defective, camera, lens, light source, pogo pin, adapter, wafer

Description

Image sensor package inspection device and method {APPARATUS AND METHOD FOR TESTING IMAGE SENSOR PACKAGE}

1A to 3 are schematic cross-sectional views of various types of image sensor packages according to the prior art.

4A and 4B are a plan view and a sectional view showing a state in which a plurality of image sensor packages shown in FIG. 2A are formed on a wafer;

4C is a cross-sectional view illustrating a state in which the wafers of FIGS. 4A and 4B are cut for each unit image sensor package.

5 is a plan view showing a schematic configuration of an image sensor package inspection apparatus according to an embodiment of the present invention.

6 is a view illustrating a jig for fixing a package wafer on which a plurality of image sensor packages are formed to an image sensor package inspection apparatus of the present invention.

7A shows a tray for loading an image sensor package for which inspection has been completed.

7B is a perspective view of a cassette on which a tray is mounted.

8A and 8B are enlarged cross-sectional views taken along the line X-X of FIG. 5, showing the socket base on which the image sensor package is seated.

9 is a cross-sectional view of the pogo pin mounted to the socket base shown in FIGS. 8A and 8B.

10A and 10B are perspective views of first and second package picker units for transferring an image sensor package.

Figure 11 is a cross-sectional view of the inspection unit from the rear of the image sensor package inspection apparatus of the present invention.

12A and 12B are cross-sectional and perspective views of the lens adapter.

It is sectional drawing of the modification of a mounting unit and an inspection part.

<Explanation of symbols for the main parts of the drawings>

12: wafer ring 14: mounting tape

30, 40, 50: image sensor 40W: package wafer

100: jig 102: package pusher

110: tray 120a, 120b: cassette

122: cassette body 124: door

126, 314 cylinder 128: lifting shaft

200: seating unit 210: seating table

220: rotating arm 230: rotating shaft

240: socket base 244: upper pogo pin

244c and 314c: contact portion 246: seating plate

247c: package support 249: socket printed circuit board

300: inspection unit 310: lower support

312: connecting plate 314: lower pogo pin

320: upper support 322: light source

340: socket cover 350: lens adapter

352: first diameter portion 354: second diameter portion

360: lens unit 400: transfer unit

410, 420: transfer guide rails 430, 440: transfer guide

450, 460: Package picker mounting portion 470, 480: Package picker unit

500: control and processing unit

The present invention relates to an inspection apparatus of a semiconductor device for detecting light, and more particularly, to an image sensor package inspection apparatus and method capable of automatically inspecting whether an image sensor package is defective before being assembled to a camera module.

Image sensors are semiconductor devices having a function of capturing images of people and objects. Recently, the market has been rapidly expanding as they are installed in mobile phones as well as general digital cameras and camcorders.

The image sensor is configured in the form of a camera module and mounted on the devices. The camera module is composed of a lens, a holder, an infrared filter, an image sensor, and a printed circuit board (PCB). The lens of the camera module forms an image and the image formed by the lens is collected by the IR filter to the image sensor, and the image sensor converts the optical signal of the image into an electrical signal to take an image.

Among these components, an image sensor for converting an optical signal into an electrical signal is directly mounted on a camera module in a bare chip state, or mounted on a camera module after packaging an image sensor chip. The use of an image sensor chip packaged in advance can solve the above-mentioned problems when using a bare chip. Next, an image sensor package manufactured by prepackaging the image sensor as described above will be described.

1A and 1B illustrate an image sensor package in which a chip scale package (CSP) method is applied to an image sensor chip and a manufacturing process thereof.

The image sensor package 30 shown in FIG. 1A is proposed by Shellcase Inc. and its manufacturing process is shown in FIG. 1B. Referring to FIG. 1B, first, as shown in FIG. 1B (a), a glass substrate 31, which is one of the light-transmissive substrates, is prepared, and an image sensor chip 32 is formed thereon by using an adhesive layer 34 such as epoxy. Next, the glass wafer 35 is attached to the top of the image sensor chip 32 using the adhesive layer 33 such as epoxy. In this case, the image sensor chip 32 is attached to the glass substrate 31 on one surface where the circuit is formed and the glass wafer 35 on the other surface. As such, after the glass substrate 31, the image sensor chip 32, and the glass wafer 35 are attached, the image sensor chip 32 and the adhesive layer 33 are illustrated in FIG. 1B (b). ) And the side surface of the glass wafer 35 is formed to be inclined at a predetermined angle using equipment such as a semiconductor wafer cutting saw. Then, as shown in (c) of FIG. 1B, an area between the image sensor chip 32 and the adhesive layer 34 using a dicing blade having a somewhat gentle tip angle. Is removed to expose the input / output pad of the circuit formed on one surface of the image sensor chip 32. Next, as shown in (d) of FIG. 1B, the metal wiring 36 is formed from the input / output pad of the exposed image sensor chip 32 to the lower surface of the glass wafer 35 via the inclined side surface. . In this case, the metal wire 36 is formed by forming a metal film from the input / output pad of the exposed sensor chip 32 to the lower surface of the glass wafer 35 through the inclined side surface, and etching the metal film to form a desired pattern. do. Finally, the connection terminal 37 like a solder ball is formed in the edge part of the metal wiring 36 formed in the lower surface of the glass wafer 35. Afterwards, the connection terminal 37 is connected to an external terminal or a PCB board. The image sensor package 30 manufactured according to the process illustrated in FIG. 1B is cut for each unit element along the cutting line of FIG. 1B, and reversed as shown in FIG. 1A.

As another example of a CSP, an image sensor package proposed by the applicant is shown in FIGS. 2A and 3.

The illustrated image sensor package 40 of FIG. 2A includes a glass substrate 41 which is one of the light transmissive substrates, a metal wiring 44 formed on the glass substrate 41, and a metal wiring 44 for protecting the metal wiring 44. The insulating film 45, the image sensor chip 42 electrically connected by the glass substrate 41, and the flip chip solder joint 43 and the image sensor chip 42 may be formed on the outer side of the image sensor chip 42 to be connected to the printed circuit board. Connection terminals 47, such as solder balls. Meanwhile, a dust seal layer 46 is formed between the glass substrate 41 and the image sensor chip 42 to prevent foreign matter from flowing into the space formed between the glass substrate 41 and the image sensor chip 42. do.

Looking at the manufacturing process of the image sensor package 40 with reference to Figure 2b, first, as shown in (a) of Figure 2b to prepare a glass substrate 41 and to form a metal wiring 44 on one surface. Subsequently, as shown in FIG. 2B (b), an insulating film 45 is formed on a portion of the glass substrate 41 and the metal wire 44. That is, except for the portion where the solder joint 43 and the connection terminal 47 are to be formed on the metal wire 44, that is, the insulating layer 45 is formed in the remaining region so that the portion is exposed. As shown in (c) of FIG. 2B, the image sensor chip 42 having the solder joint 43 formed on the edge thereof is cut for each unit and prepared separately from the glass substrate 41. In this case, a connection terminal 47 is formed on a part of the metal wire 44 of the glass substrate 41, and when the image sensor chip 42 is coupled, the exposed glass substrate 41 corresponding to the image sensing area thereof is formed. The dust seal layer 46 is formed at the edge of the region. In this state, the solder joint 43 is reflowed and the dust seal layer 46 is hardened to couple the image sensor chip 42 on the glass substrate 41 so that the image sensing region is downward. The image sensor package 40 manufactured as described above is cut for each unit element along the cutting line of FIG. 2B, and reversed as shown in FIG. 2A.

The image sensor package 50 for the camera module illustrated in FIG. 3 includes a glass substrate 51, a metal wire 54 formed on the glass substrate 51, and an insulating film for protecting the metal wire 54. 55, an image sensor chip 52 electrically connected by the glass substrate 51 and a flip chip solder joint 53, and mounted on the metal wire 54 outside the image sensor chip 52. A passive element 58 and a connection terminal 57. The image sensor package 50 shown in FIG. 3 has a structure substantially similar to that of the image sensor package 40 shown in FIG. 2A, but the passive elements 58 necessary for configuring the camera module, such as a decoupling capacitor, are formed on the glass substrate. It can be mounted together, and has a structure having connection terminals 57 for connecting with a flexible printed circuit board on one side. The manufacturing method of the image sensor package 50 for the camera module shown in FIG. 3 is almost similar to that of FIG. 2A.

The image sensor packages are sold as one part for manufacturing the camera module or assembled at least on a different line from the camera module. That is, the image sensor package is transferred to another line or factory as a separate component, mounted on a PCB substrate, attaching a flexible printed circuit (FPC), and a holder and lens housing on the PCB substrate. Install it to complete the camera module. At this time, the above-described image sensor package 30, 40, 50 is electrically connected to the PCB substrate through the connection terminals 37, 47, 57 formed in the lower portion thereof. The holder and lens housing are typically installed to surround the image sensor package 30, 40, 50 on the PCB substrate, and the holder and lens housing are installed such that an IR filter and a lens are positioned on the image sensor package. .

In general, the most fatal and most frequently occurring defects of the camera module are the defects of the image sensor, which is a defect caused by the defect of the image sensor chip itself or the inflow of dust into the image sensing area during the packaging process of the image sensor chip. That is, when dust particles are introduced into the image sensor package and fixed to the image sensing area of the image sensor, repetitive defects may be caused in the captured image. Even if it is not stuck in the image sensing area, the dust molecules moving in it are non-repeatable but unacceptable because they can cause defects. Therefore, the ingress or contamination of dust particles into the package should be minimized during the image sensor packaging process. This is why the image sensor packaging manufacturing line is managed with higher cleanliness compared to other general packaging manufacturing lines.

The inflow of moisture into the image sensing area is known to degrade the color filters or microlenses on the image sensor chip. Of course, this deterioration due to moisture takes a long time to appear as a deterioration of the image quality, which is generally not a problem. There is a need for a package structure that can be minimized.

The inspection process is essential to determine the failure of the image sensor itself and the defect caused by the inflow of dust particles until the camera module is completed. Typically, the sensor manufacturer manufactures an image sensor wafer, and then performs an open and short test and a probe test that checks the operation of each pixel. A map file indicating whether there is a defect is transmitted to an image sensor package company or a camera module company.

Image sensor packagers package the image sensor based on the map file received from the sensor manufacturer.The defects in the packaging process or the inflow of dust particles may cause the image sensor package to fail. It will be forwarded to the camera module vendor.

In order to complete the camera module, an inspection procedure must be performed to read whether such an image sensor is defective. The conventional inspection apparatus is divided into individual PCB units and completed the process of bonding the connecting means such as FPC. Each camera module is configured to inspect the image sensor for defects. Therefore, after the inspection of one camera module is completed, it must be taken out manually or automatically, and then the inspection process must be repeated by manually or automatically repositioning another camera module at the test position. Due to the low throughput, it greatly reduced the overall productivity of the camera module.

As described above, since the most fatal and most frequently occurring defects of the camera module are defects caused by the inflow of dust into the pixel area of the image sensor, whether the image sensor is defective after assembling the image sensor package to the camera module is already known. Inspection procedures to read are undesirable. In other words, the image sensor package is preferably read for defects before being assembled into the camera module. However, the conventional device for inspecting an image sensor package has only a function of testing a simple electrical failure by connecting the connection terminal of the image sensor package to an external terminal and energizing it. The image test could not be performed.

Accordingly, an object of the present invention is to solve the above-described problems of the prior art, and provides an image sensor package inspection apparatus and method capable of automatically performing electrical and image testing of an image sensor package which is a main component of a camera module at the same time. It is.

Another object of the present invention is to automatically perform the electrical and image test after manufacturing the image sensor package in place of the inspection process that is carried out by the image sensor manufacturers and camera module manufacturers, the sensor manufacturers or camera module manufacturers It is to provide an image sensor package inspection apparatus and method that can shorten the inspection process and time.

An image sensor package inspection apparatus according to an aspect of the present invention for achieving the above object is provided with a seating unit, the image sensor package is seated for testing, and a lens and a light source on one side of the image sensor package to provide the image sensor package; An inspection unit for electrical and image testing, a jig for supporting a package wafer including a plurality of image sensor packages each being cut, a transfer unit for transferring the image sensor package from the package wafer to the seating unit, and an image sensor package And a control and processing unit having a tester module for performing at least one of electrical and image tests.

The package wafer may be attached to one surface of a mounting tape on a transparent substrate of an image sensor package, a wafer ring may be attached to an edge of the mounting tape, and the jig may grip the wafer ring.

It is preferable to include a package pusher for lifting up and down the package wafer.

The seating unit includes a socket base on which an image sensor package is seated, and a connection terminal disposed below the terminal is electrically connected to the seating unit, and the transfer unit includes a first transfer part which grips the image sensor package on the package wafer and inverts it up and down. A second transfer unit may transfer an image sensor package between the socket base and the first transfer unit. In this case, it is preferable that the inspection unit includes a connecting plate which is lifted to electrically connect with the socket base, and a socket cover which is installed on the connecting plate to press the light transmissive substrate of the image sensor package and is provided with the lens. In particular, the socket base is a socket body, a seating plate which is installed to be movable up and down with respect to the socket body, and an image sensor package is seated on an upper surface thereof, and a seating plate installed on the socket body and penetrating the seating plate. One end protrudes as it moves downward, and includes an upper pogo pin electrically connected to the image sensor package, and the connection plate is provided with a lower pogo pin so that the connection plate is lifted so that the lower pogo pin and the upper pogo pin are mutually different. It is preferable to connect.

The seating unit may include a seating plate having a through opening formed of an upper portion on which the light transmissive substrate of the image sensor package is seated downward and a lower portion on which the lens is installed. In this case, the inspection unit preferably includes a socket base which is installed to be movable up and down and moved downward to be electrically connected to the image sensor package. In particular, the socket base is a socket body, a seating plate installed to be movable up and down with respect to the socket body and formed to cover the image sensor package, and the seating plate installed in the socket body and penetrating the seating plate to move downward. As one end protrudes, it is preferable to include a pogo pin electrically connected to the image sensor package.

According to another aspect of the present invention, a method of inspecting an image sensor package includes: separating an image sensor package from a package wafer including a plurality of image sensor packages, each of which is cut, and a tester module inspecting whether the image sensor package is defective. Electrically connecting the image sensor package to the image sensor package, and performing at least one of electrical and image tests of the image sensor package while irradiating or blocking light on the image sensor package.

Hereinafter, an image sensor package inspection apparatus according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings. Prior to the description of the device, in the image sensor package inspection device of the present invention, an image sensor package, that is, an image sensor package described in the related art, in which a connection terminal connected to an input / output pad of an image sensor chip is formed on a lower surface and manufactured at a wafer level (30, 40, 50) is preferably applied.

Therefore, the image sensor package inspected by the image sensor package inspection apparatus of the present invention may be any one of the above-described image sensor package 30, 40, 50 of the prior art. Therefore, hereinafter, duplicate description thereof will be omitted herein. However, hereinafter, the image sensor package 40 shown in FIG. 2A is used as the image sensor package inspected by the image sensor package inspection apparatus of the present invention. I will use it mainly. Accordingly, in the case where the image sensor packages 30, 40, and 50 shown in FIGS. 1A, 2A, and 3 are to be distinguished, that is, when the image sensor package 30 or 50 is to be applied, the reference numeral is replaced with 40. 30 or 50 will be used.

First, before the description of the inspection apparatus according to the present invention to look at the image sensor package to be examined more, as described in the prior art, a plurality of the image sensor package is formed on one wafer and then cut this unit image Implemented as a sensor package. As such, the state for cutting the plurality of image sensor packages formed on the wafer for each unit image sensor package and mounting them on the inspection apparatus according to the present invention is illustrated in FIGS. 4A to 4C.

4A and 4B are plan views and cross-sectional views illustrating a state in which a plurality of image sensor packages illustrated in FIG. 2A are formed on a wafer, and FIG. 4C illustrates a state in which the wafers of FIGS. 4A and 4B are cut by unit image sensor packages. It is a cross section.

Referring to the drawings, as mentioned in the prior art, the plurality of image sensor packages 40 are formed on one wafer, that is, the uncut parent substrate of the glass substrate 41 to form the package wafer 40W. The package wafer 40W attaches a mounting tape 14 to the other surface of the glass substrate 41 on which the image sensor chip 42 is not mounted, so that the package wafer 40W is a unit image sensor package 40. Do not let them fall apart when cutting with). In this case, the mounting tape 14 has a diameter larger than that of the package wafer 40W and extends outside of the package wafer 40W, and a wafer ring 12 is attached to an edge of the mounting tape 14 to attach the mounting tape. The tension is provided to the 14 to maintain the shape of the wafer even after the package wafer 40W is cut into the unit image sensor package 40.

That is, the package wafer 40W is cut into the unit image sensor package 40 with a cutting wheel (not shown) while the package wafer 40W is attached to the inside of the mounting tape 14 having the wafer ring 12 attached to the edge thereof. Cut with). Referring to FIG. 4C, which shows a side view of the package wafer 40W thus cut, the cutting wheel completely cuts the glass substrate 41 between the adjacent image sensor packages 40 and the mounting tape 14 cuts only a portion of the top. do. Thus, since the mounting tape 14 is supported by the wafer ring 12 without being completely cut, the shape of the package wafer 40W with all the cut image sensor packages 40 attached to the mounting tape 14. To some extent.

In the image sensor package inspection apparatus according to the present invention, the package wafer 40W in which all the image sensor packages 40 cut for each unit are attached to the mounting tape 14 supported by the wafer ring 12. ) To separate each cut image sensor package 40 and automatically perform electrical and image tests on it.

5 is a plan view showing a schematic configuration of an image sensor package inspection apparatus according to an embodiment of the present invention, Figure 6 is for fixing a package wafer having a plurality of image sensor package to the image sensor package inspection apparatus of the present invention 7A is a view showing a jig, and FIG. 7A is a view showing a tray for loading an inspected image sensor package, FIG. 7B is a perspective view of a cassette on which the tray is mounted, and FIGS. 8A and 8B are seats of the image sensor package. 5 is an enlarged cross-sectional view taken along line XX of FIG. 5, and FIG. 9 is a cross-sectional view of pogo pins mounted to the socket base shown in FIGS. 8A and 8B, and FIGS. 10A and 10B are image sensors. 1 is a perspective view of a first and a second package picker unit for transporting a package, and FIG. 11 is an image sensor package inspection device according to an embodiment of the present invention. And the cross-sectional view from the rear, Figure 12a and Figure 12b is a cross-sectional view and a perspective view of the lens adapter.

Referring to FIG. 5, the image sensor package inspection apparatus of the present invention includes a plurality of trays in which a jig 100 for fixing a package wafer on which a plurality of image sensor packages are formed and an image sensor package 40 on which the inspection is completed are seated. A plurality of cassettes 120 (120: 120a, 120b) is mounted, a mounting unit 200, the image sensor package 40 is seated for inspection, and an image sensor package mounted on the seating unit 200 ( The image sensor package 40 between the inspection unit 300 performing electrical and image tests on the 40, and the tray 110 and the mounting unit 200 mounted in the jig 100 and the cassettes 120a and 120b. A transfer module 400 for transferring the image sensor, a handler module in charge of the transfer, alignment, and position control of the image sensor package, and a tester module for the image sensor package for electrical and image testing of the image sensor package. This includes the combined control and processing unit 500.

The jig 100 (100a, 100b) is for fixing a package wafer 40W having a plurality of image sensor packages formed thereon, and the package wafer 40W through a mounting tape 14 around the package wafer 40W. The wafer ring 12 for supporting the pin is configured to be fixed. For example, as shown in FIG. 6, which is a cross-sectional view taken along the line VI-VI of FIGS. 5 and 5, the jig 100 has an upper portion each having a shape surrounding a portion of the wafer ring 12. It consists of a jig (100a) and a lower jig (100b), the upper jig (100a) is configured to be movable up and down, the step is formed inside the upper jig (100a) and the lower jig (100b) these When the wafer ring 12 is clamped, recesses 100g into which a part of the wafer ring 12 is fitted are formed inside these wafer rings 12. That is, when the wafer ring 12 supporting the package wafer 40W is placed in the inner step of the lower jig 100b while the upper jig 100a and the lower jig 100b are spaced apart from each other, the upper jig ( 100a is lowered to hold the wafer ring 12 together with the lower jig 100b.

The jig 100 is not limited to the configuration shown in FIGS. 5 and 6, and may be any configuration capable of holding the wafer ring 12 disposed through the mounting tape 14 around the package wafer 40W. Do.

Meanwhile, a package pusher 102 movable in horizontal and vertical directions is installed below the jig 100. The package pusher 102 moves horizontally to the bottom of the image sensor package 40 to be inspected on the package wafer 40W fixedly supported by the jig 100 and ascends from the bottom thereof to the image sensor package 40. To the top. This serves to allow the image sensor package 40 to easily fall off the mounting tape 14 when the first package picker unit 470 (to be described later) of the transfer unit 400 lifts the image sensor package 40. do.

The tray 110 is a member for loading an image sensor package that has been inspected. Referring to FIG. 7A, a plurality of concave rectangular concave grooves 114 are formed in a matrix form on the tray-shaped tray body 112. The rectangular concave groove 114 is formed in a shape in which the image sensor package 40 can be seated. Since a plurality of such trays 110 are stacked and mounted in the cassettes 120a and 120b, a plurality of trays 110 may be provided at each corner of the top surface (or bottom surface) of the tray body 112 so as to be spaced apart from the stacked trays 110. The protrusion 116 is formed to protrude. In addition, the tray 110 may have a protrusion or a concave, a combination of a protrusion and a concave so as to have an alignment function. The bottom (or top) of the tray body 112 is formed with a recess (not shown) corresponding to the tip of the protrusion 116, the upper and lower trays 110 when the tray 110 is stacked It is desirable to make the) easily aligned with each other. The number of rectangular concave grooves 114 formed on the tray body 112 is not limited, but the tray 110 used in the present embodiment is 64 squares in which eight are arranged in the horizontal direction and eight are arranged in the vertical direction. Concave groove 114 is formed.

In the embodiment of the present invention, the first and second cassettes 120a and 120b are arranged side by side in front of the image sensor package inspection apparatus. After the empty tray 40 is mounted on the first and second cassettes 120a and 120b, the good quality of the inspected image sensor package 40 is the tray 40 mounted on the first cassette 120a. The defective item is placed on the tray 40 mounted on the second cassette 120b. Since each of the cassettes 120a and 120b has the same configuration, the first cassette 120a will be described as an example here.

Referring to FIG. 7B, which shows a perspective view of the first cassette 120a with the door open, the first cassette 120a includes a cassette body 122 and a cassette body 122 having a rectangular parallelepiped having at least a front surface and an upper surface thereof. It includes a door 124 to open and close the front. A handle 124a for facilitating opening and closing of the door and a window 124b for checking the inside of the cassette body 122 are formed in front of the door 124. A predetermined space is formed inside the cassette body 122 so that the tray 110 described above is stacked and mounted. In addition, an elevator for lifting and lowering the stacked and mounted trays 110 is provided below the cassette body 122. The elevator extends from the cylinder 126 provided in the lower portion of the cassette body 122 and from the cylinder 126 to the inside of the cassette body 122 through the lower portion of the cassette body 122. And a lifting shaft 128 having an upper end supporting the bottom surface of the 110. At this time, the upper end of the lifting shaft 128 preferably has a plate shape so as to stably support the bottom surface of the tray 110.

Referring back to FIG. 5, the mounting unit 200 in which the image sensor package 40 separated from the mounting tape 14 is seated for inspection includes a pair of seating bases 210 and a pair of seating posts ( 210 is rotated arm 220 is disposed at both opposite ends, the rotary shaft 230 provided at the center of the rotary arm 220, and the rotary arm 220 to rotate the rotary arm 220 (not shown) ) Includes the motor. A pair of socket bases 240 are detachably or integrally mounted to each seating base 210 disposed at both ends of the rotary arm 220.

The rotary arm 220 extends back and forth (up and down in FIG. 5) of the image sensor package inspection apparatus to position each seating table 210 disposed at both ends thereof in front and rear of the apparatus, respectively. At this time, the rotary arm 220 is reciprocated by 180 degrees by the motor about the rotary shaft 230 provided in the center thereof. Accordingly, the positions of the seating table 210 located in the front and rear are changed to each other.

Referring to FIG. 8A, in which the socket base 240 to which the image sensor package 40 illustrated in FIG. 2A is applied is illustrated, each of the socket bases 240 has a recess 242 having an open upper surface. A plurality of upper pogo pins 244 (pogo pins) as a connection member which is formed through the socket body 241 and the through hole of the socket body 241 and is upwardly disposed and electrically connected to the image sensor package 40. And a seating plate 246 inserted into the recess 242 so as to be movable up and down with respect to the socket body 241, a spring interposed between the socket body 241 and the seating plate 246. The same plurality of elastic members 248 and a socket printed circuit board 249 attached to the bottom surface of the socket body 241.

An upper surface of the seating plate 246 is opened to form a recess 247 on which the image sensor package 40 is seated. The recess 247 has a size and shape corresponding to the image sensor package 40, but an inclined surface 247a is formed on an upper side thereof. This serves to guide the inlet of the recess 247 to be somewhat larger than the image sensor package 40 so that the image sensor package 40 is seated in the recess 247. In addition, a plurality of through holes penetrated up and down is formed in the seating plate 246 so that the upper pogo pin 244 is inserted therein and exposed to the bottom surface 247b of the seating plate 246. In particular, a package support part 247c having a convex shape for contacting and supporting the bottom surface of the image sensor package 40 is formed at the center of the bottom surface 247b of the seating plate 246. That is, the overall shape of the recess 247 and the position of the upper pogo pin 244 should correspond to the shape of the lower surface of the image sensor package and the position of the connection terminal.

An upper contact pad 245a is formed on an upper surface of the socket printed circuit board 249 at a position corresponding to a through hole of the socket body 241, and an upper surface of the upper surface of the socket printed circuit board 249 is formed on the upper surface of the socket printed circuit board 249. The lower contact pad 245b connected to the contact pad 245a is formed.

In addition, an upper pogo pin 244 having elasticity at both ends and elasticity as a connecting member installed in the socket base 240, referring to FIG. 9, the pogo pin body having a hollow pipe shape having both ends opened ( 244b), contact portions 244c inserted into both ends of the pogo pin body 244b, respectively, and springs 244s interposed between the contact portions 244c in the pogo pin body 244b. It includes. The pogo pin is formed in the middle of the contact portion 244c such that a small diameter portion 244d having a smaller diameter than both ends thereof is formed and the inner diameter of the pogo pin body 244b becomes smaller at a position corresponding to the small diameter portion 244d. Grooves 244g are formed outside the body 244b to limit the movement of the contact portion 244c. The upper pogo pin 244 is the contact portion 244c has a predetermined elastic force in the pogo pin body 244b, and the length is contracted or stretched.

Specifically, when the image sensor package 40 is seated on the socket base 240 configured as described above, the lower surface of the image sensor chip 42 of the image sensor package 40 contacts first. do. An elastic member 248 provided between the bottom surface of the seating plate 246 and the bottom surface of the recess 242 biases the seating plate 246 upward. When the image sensor package 40 is seated on the seating plate 246, the bottom surface of the image sensor chip 42 located at a position higher than the connection terminal 47 of the image sensor package 40 is the seating plate 246. Is placed on the package support 247c. At this time, the connection terminal 47 is still spaced apart from the upper contact portion 244c of the upper pogo pin 244. Subsequently, when the image sensor package 40 is pressed downward by the socket cover 340 to be described later, the seating plate 246 is lowered and the upper contact portion 244c of the upper pogo pin 244 is seated plate 246. It protrudes above the bottom surface 247b of the) and is connected to the connection terminal 47 of the image sensor package 40. At this time, since the upper contact portion 244c of the upper pogo pin 244 is elastically coupled to the pogo pin body 244b, a predetermined elastic force exists between the connection terminal 47 and thus maintains a constant contact force. .

In this case, the lower contact portion 244c of the upper pogo pin 244 is in contact with the upper contact pad 245a formed on the upper surface of the socket printed circuit board 249. Accordingly, the connection terminal 47 of the image sensor package 40 is electrically connected to the lower contact pad 245b connected to the upper contact pad 245a formed on the lower surface of the socket printed circuit board 249. . The lower contact pad 245b is electrically connected to the control and processing unit 500 through a lower pogo pin 314, which is a contact member installed on the lower support 310, which will be described later.

The socket base 240 having the shape shown in FIG. 8A may be applied to the image sensor package 50 shown in FIG. 3 by adjusting the position of the upper pogo pin 244 and the height of the package support 247c. In particular, the package support part 247c is formed in response to the height difference between the bottom surface of the image sensor package 40 and the connection terminal 47. For example, in order to apply the image sensor package 50 shown in FIG. 3 to the socket base 240, the upper pogo pin 244 is positioned below the connection terminal 57, and the image sensor chip 52 and the manual The package support part 247c may be formed in concave shape so that the element 58 may be accommodated.

FIG. 8B also shows the socket base 250 when the image sensor package 30 shown in FIG. 1A is used as the image sensor package 40. In this case, the upper pogo pin 244 is formed in the center of the recess 242, the configuration and operation except that the shape of the seating plate 256 is slightly different from the seating plate 246 of FIG. Same as the socket base 240 shown. The adhesive layer 34 and / or the metal wiring 36, which is a lower surface of the image sensor package 30, is formed on the periphery of the recess 257 and / or on the upper side of the upper surface of the seating plate 256. ) And the package support for contacting and supporting the formed inclined side. Therefore, when the image sensor package 30 is seated on the seating plate 256, the inclined side surfaces on which the adhesive layer 34 and / or the metal wiring 36 of the image sensor package 30 are formed are respectively seated plate 256. First contact with the periphery of the recess 257 of the top surface and / or the inclined surface 257a of the recess 257. Other configurations and operations are the same as the socket base 240 shown in FIG. 8A. As described above, the seating plate 256 of the inspection apparatus according to the present invention may be variously changed according to the shape of the image sensor package 40 to be inspected.

Next, the transfer unit 400 grips and separates the image sensor package 40 from the package wafer 40W on the jig 100 that fixes the package wafer 40W, and then vertically inverts the image sensor package 40. A first transfer part, and a second to transfer the image sensor package 40 between the socket base 240 and the first and second cassettes (120a, 120b) and the first transfer portion located at the front end of the rotary arm 220 It includes a transfer unit. Referring back to FIG. 5, the first conveying unit of the conveying unit 400 extends in the lateral direction so that opposite ends are fixed to the left and right walls of the image sensor package inspection apparatus of the present invention and spaced in parallel to each other. A guide rail 410, a first conveyance guide 430 mounted on the first conveyance guide rail 410 and moving along the transverse direction, and movably mounted to the first conveyance guide 430. The first package picker mounting portion 450 and the first package picker unit 470 rotatably installed at the front end of the first package picker mounting portion 450 about a horizontal axis. In addition, the second conveying unit of the conveying unit 400 is mounted on the second conveying guide rail 420 and parallel to the first conveying guide rail 410, the second conveying guide rail 420 is mounted Accordingly, the second transport guide 440 moving in the lateral direction, the second package picker mounting part 460 mounted to the second transport guide 440 so as to be movable back and forth, and the second package picker mounting part 460. It includes a second package picker unit 480 installed to be movable up and down at the front end of the.

Referring to FIG. 10A, the first package picker unit 470 may include a first package picker body 472 rotatably mounted about a horizontal axis at a front end of the first package picker mounting unit 450, and The first package picker body 472 includes a first shaft 474 mounted vertically to the bottom of the package picker body 472 and a first package picker 476 mounted to a bottom surface of the first shaft 474. In this case, the first package picker body 472 may be provided with a plurality of first shafts and package pickers 474 and 476 that operate independently from each other.

Referring to FIG. 10B, the second package picker unit 480 is installed above the first package picker unit 470 by a predetermined height, and moves up and down on the front surface of the second package picker mounting unit 460. A second package picker body 482 that is possibly mounted, a second shaft 484 that is rotatably mounted about a vertical axis below the second package picker body 482, and the second shaft 484. A second package picker 486 mounted to the bottom surface of the &lt; RTI ID = 0.0 &gt;

In this case, the plurality of second package picker units 480 may be installed side by side on the front surface of the second package picker mounting portion 460. This is when the plurality of first shafts and package pickers 474 and 476 are installed on the first package picker body 472, and thus, the plurality of image sensor packages 40 may be processed simultaneously.

The first and second package pickers 476 and 486 actually hold the image sensor package 40, and in this embodiment, the image sensor package 40 is gripped using vacuum suction.

In the transfer unit 400 configured as described above, the first package picker unit 470 moves horizontally in front, rear, left, and right at the top of the package wafer 40W fixed to the jig 100 to grip the image sensor package 40. Located at the top of the). Thereafter, the first shaft 474 of the first package picker unit 470 moves up and down, and the first package picker 476 mounted thereto grips the image sensor package 40. At this time, the image sensor chip 42 of the image sensor package 40 is attached (by vacuum) to the tip of the first package picker 476. In addition, the package pusher 102 installed at the bottom of the jig 100 rises from the bottom of the image sensor package 40 to be gripped by the first package picker 476 and pushes it upward so that the image sensor package 40 is mounted on the tape. The first package picker 476 assists in gripping the image sensor package 40 by allowing it to fall easily at 14.

After holding the image sensor package 40 by the first package picker unit 470, the glass substrate 41 of the image sensor package 40 is rotated by 180 degrees with respect to its axis of rotation, thereby inverting the image sensor package 40 up and down. ) Face up. Thereafter, the second package picker unit 480, which is spaced a predetermined height above the first package picker unit 470, moves to an upper portion of the image sensor package 40 held by the first package picker 476. The image sensor package 40 is gripped again and transferred to the mounting table 210 of the mounting unit 200. At this time, the glass substrate 41 of the image sensor package 40 is attached (by vacuum) to the tip of the second package picker 486.

Alignment camera (for example, on its left side (or right side)) at a position adjacent to the socket base 240 located at the front end of the rotating arm 220 about the rotation axis 230 of the seating unit 200 ( 490 is fixedly installed upward. The alignment camera 490 photographs the lower surface of the image sensor package 40 lifted by the second package picker 486 and then transmits the photographed image signal to the control and processing unit 500. The control and processing unit 500 equipped with the function of the handler module analyzes the image signal of the photographed image sensor package 40 to recognize the alignment alignment state of the sensor. After that. If the image sensor package 40 is misaligned, the motor rotates the second shaft 484 to align the orientation of the image sensor package 40. This is to accurately seat the image sensor package 40 on the mounting plate 246 of the socket base 240.

In the image sensor package inspection apparatus of the present invention including the transfer unit 400, the configuration of the drive unit, such as a motor, hydraulic or pneumatic cylinder for the horizontal, front and rear and vertical movement and rotation about the vertical axis is Since the art is generally well known in the art, a description of the configuration and operation relationship will be omitted herein.

By using the transfer unit 400, the image sensor on the seating plate 246 of the socket base 240 located at the front end of the rotary arm 220 around the rotating shaft 230 of the mounting unit 200 When the package 40 is placed, the rotary arm 220 rotates 180 degrees to move the socket base 240 and the image sensor package 40 seated thereon to the inspection unit 300.

The transferred socket base 240 operates together with the inspection unit 300 such that the image sensor package 40 is subjected to an electrical and image test. Therefore, the socket base 240 forms an image sensor package inspection unit together with the inspection unit 300.

As illustrated in FIG. 11, the inspection unit 300 moves up and down on the upper and lower supports 310 and 320 disposed to face each other and is spaced up and down by a predetermined distance from the upper and lower surfaces of the lower support 310. And a socket cover 340 mounted on the lower surface of the upper support 320 so as to be movable up and down therefrom.

The lower support 310 is provided with a cylinder 315, both ends of the connecting plate 312 is fixed to the front end of the piston 316 of the cylinder 315, the connection by the operation of the cylinder 315 The plate 312 is moved up and down. When the socket base 240 is positioned between the connecting plate 312 and the socket cover 340, the connecting plate 312 may be positioned at a position corresponding to the lower contact pad 245b of the socket printed circuit board 249. Lower pogo pins 314 are installed. In particular, the lower pogo pin 314 is installed such that its upper contact portion 314c protrudes from the upper surface of the connecting plate 312. The lower pogo pin 314 is also similar to the upper pogo pin 244 described above, the upper contact portion 314c is elastically moved relative to the body of the lower pogo pin 314. Accordingly, when the connecting plate 312 moves upward to contact and support the lower surface of the socket base 240 by the operation of the cylinder 315, the lower pogo pin 314 and the lower contact pad 245b. Are elastically contacted, so that the connection between them is kept stable, and these connections are electrically connected to the control and processing unit 500 via the wiring 318.

The upper support 320 is provided with at least one cylinder 324, both ends of the socket cover 340 is fixed to the front end of the piston 326 of the cylinder 324, the operation of the cylinder 324 The socket cover 340 is moved up and down. The through hole 342 for coupling the adapter is formed in the center of the socket cover 340. The lens adapter 350 is inserted into the through hole 342, and the lens adapter 360 includes a lens housing 362 and a lens 364 fixed in the lens housing 362. Is fitted. In addition, a light source 322 is installed on the upper support 320 to the upper portion of the socket cover 340, to provide the light required for the image test of the image sensor package 40. An incandescent lamp, a white LED, and the like may be used as the light source 322.

12A and 12B, the lens adapter 350 includes hollow cylindrical first and second diameter parts 352 and 354, and the first diameter part 352 has an outer diameter 353. The through hole 342 has a size corresponding to the inner diameter, and the second diameter portion 354 has a size corresponding to the inner diameter 355 of the lens housing 362. Therefore, one side of the lens adapter 350 is fixedly mounted to the socket cover 340, and the lens unit 360 is fixedly mounted to the other side. The lens adapter 350 is for mounting various types of lenses to the socket cover 340.

Since the lens unit 360 used in the camera module varies in diameter, a socket cover corresponding to each lens unit 360 is applied to the lens unit 360 having such various diameters to the socket cover 340. Instead of preparing 340, the lens unit 360 is installed on the socket cover 340 through the lens adapter 350. Accordingly, the lens adapter 350 may prepare a plurality of lens sensors 350 having the same outer diameter 353 of the first diameter portion 352 but different inner diameters 355 of the second diameter portion 354. Even if the lens optimized for) has an outer diameter different from the inner diameter of the through hole 342, it can be mounted on the socket cover 340.

The outer diameter 353 of the first diameter portion 352 and the inner diameter of the through hole 342 are formed with male and female threads corresponding to each other, and the inner diameter 355 of the second diameter portion 354 and the lens housing 362 The outer diameter of the female and male threads corresponding to each other is formed to facilitate the coupling between each other. In addition, since they are screwed together, the lens unit 360 may be focused by adjusting a distance between the image sensor package 40 and the lens unit 360 by rotating the screw on one side after the screwing.

The lens adapter 350 illustrated in FIGS. 12A and 12B is applied when the outer diameter of the lens unit 360 is smaller than the inner diameter of the through hole 342. Alternatively, when the outer diameter of the lens portion is larger than the inner diameter of the through hole 342, the inner diameter of the second diameter portion 354 may be larger than the outer diameter of the first diameter portion 352.

Of course, a screw is not formed in the outer diameter 353 of the first diameter portion 352 and the inner diameter of the through hole 342, the inner diameter 355 of the second diameter portion 354, and the outer diameter of the lens housing 362. They can be fitted together or fixed to each other by other means.

For accurate image testing in the image sensor package inspection apparatus of the present invention, it should be evaluated using the lens optimized according to the image sensor package 40. Accordingly, since the lenses used according to the image sensor package 40 to be inspected are different, when the image sensor package 40 to be tested is changed, the replacement of the lens is also required. On the other hand, such a lens adapter is preferably made of a material such as plastic.

The control and processing unit 500 is a combination of a handler module in charge of the transfer, alignment and position control of the image sensor package, and a tester module in charge of electrical and image testing of the image sensor package. That is, the handler module may include the above-described jig 100, the package pusher 102, the elevator 120, the rotary arm 220, the transfer unit 400, the connection plate 312, and the socket cover installed in the cassettes 120a and 120b. 340) to control the operation. The tester module controls the lighting of the light source 322, applies a constant reference suppression and current to the upper pogo pin 244 of the socket base 240, and receives and processes the output signal of the image sensor package 40 accordingly. By determining whether the image sensor package 40 is defective, and receives a signal from the alignment camera 490 to perform image processing of the image sensor package 40. As described above, the handler module and the tester module communicate with each other, so that the handler module moves the image sensor package to a predetermined position, that is, the first unit according to whether or not the image sensor package 40 determined by the tester module is defective. Or it is transferred to the second cassette (120a or 120b).

In the test of the image sensor package 40 performed in the image sensor package inspection apparatus of the present invention, both electrical and image tests are performed.

The electrical test may be performed by applying a constant current and voltage to each input / output pad through the connection terminal of the image sensor package 40, and comparing the result value with the initial set value to determine whether or not the defect is determined according to the degree of difference. Perform current and power approval tests.

The image test determines whether or not a defect is caused by the presence or absence of black spots or spots on the image captured by the image sensor package 40, similarly to a display device such as a conventional LCD. As in the inspection unit 300 described above, the test is performed while the light source 322 provided on the upper portion of the image sensor package 40 to be tested is irradiated with a certain amount of light. In this case, the lens unit 360 optimized for the image sensor package 40 is positioned between the image sensor package 40 and the light source 322 through the lens adapter 350. The tester module in the control and processing unit 500 signal-processes the output image of the image sensor package 40 as to whether there is a physical or electrical problem in the image sensor package 40 that has converged the light, which impedes the progress of the light. To judge. The items detected in the image sensor package inspection apparatus of the present invention are similar to those of a typical display device such as dead pixels, line noise, RGB abnormalities, and the like.

The image test performed in the image sensor package inspection apparatus of the present invention includes a dark room inspection, color integration inspection, lens center position inspection, screen division (center / edge) inspection, pixel defect inspection, horizontal line defect inspection, vertical Line defect checks, smudge checks, shading defect checks, and bit miss checks.

Next, a process of inspecting whether the image sensor package 40 is defective by using the image sensor package inspection apparatus according to the present invention will be described. First, the package wafer 40W attached to the mounting tape 14 and supported by the wafer ring 12 is placed on the lower jig 100b of the jig 100, and then the upper jig 100a is lowered. The wafer ring 12 is gripped together with the lower jig 100b. At this time, the package wafer 40W is disposed such that the glass substrates 41 of the plurality of image sensor packages 40 are attached to the mounting tape 14 and face downward. In addition, the empty tray 110 is mounted in the first and second cassettes 120a and 120b, and the lifting shaft 128 is raised to an appropriate position.

Thereafter, the first package picker 476 of the first package picker unit 470 of the transfer unit 400 grips the image sensor package 40. At this time, the package pusher 102 installed at the bottom of the jig 100 rises from the bottom of the image sensor package 40 to be gripped by the first package picker 476 and pushes it upward so that the first package picker 476 is imaged. Helps to grip the sensor package 40. At this time, since the image sensor chip 42 of the image sensor package 40 is attached to the tip of the first package picker 476 (by vacuum), the glass substrate 41 faces downward. The picker unit 470 rotates 180 degrees after holding the image sensor package 40 so that the glass substrate 41 of the image sensor package 40 faces upward. Next, the image sensor in which the second package picker 486 of the second package picker unit 480, which is spaced a predetermined height above the first package picker unit 470, is held by the first package picker 476. The package 40 is gripped again so that the glass substrate 41 of the image sensor package 40 is attached to the tip of the second package picker 486 and the image sensor chip 42 and the connection terminal 47 face downward. do.

In this case, when a plurality of first shafts and package pickers 474 and 476 are installed in the first package picker body 472, each of the plurality of first package pickers 476 may be formed. After holding the image sensor package 40 and rotating 180 degrees, the plurality of second package picker units 480 may hold the plurality of image sensor packages 40 again.

When the second package picker 486 lifts the image sensor package 40 and then moves to the upper portion of the alignment camera 490, the alignment camera 490 is connected to the second package picker 486. After taking the image sensor package 40 lifted by the image signal, the image signal is sent to the control and processing unit 500. The control and processing unit 500 analyzes the image signal of the photographed image sensor package 40 and recognizes the alignment alignment state of the sensor. Then, if the image sensor package 40 is misaligned, the motor may rotate the second shaft. By rotating 484, the orientation of the image sensor package 40 is aligned.

Then, the transfer unit 400 moves the second package picker 486 onto the socket base 240 positioned at the front end of the rotary arm 220 about the rotation axis 230 of the seating unit 200. After moving, the image sensor package 40 is seated on the mounting plate 246 of the socket base 240. In this case, when the two second package pickers 486 lift the image sensor package 40 one by one, the image sensor package 40 may be seated one by one on the pair of socket base 240 arranged side by side. When the image sensor package 40 is seated in the recess 247 of the seating plate 246, the rotation arm 220 of the seating unit 200 rotates 180 degrees, whereby the image sensor package 40 is seated. The socket base 240 moves from the front end to the rear end of the rotary arm 220, that is, the inspection unit 300.

The socket base 240 moved to the inspection unit 300 is located between the lower and upper supports 310 and 320, as shown in FIG. 11. Thereafter, the cylinder 315 of the lower support 310 is operated to move the connecting plate 312 upward, so that the connecting plate 312 is connected to the socket printed circuit board 249 of the socket base 240. He comes in contact with and supports him. At this time, the lower pogo pin 314 provided on the connecting plate 312 and the lower contact pad 245b of the socket printed circuit board 249 are elastically contacted to maintain a stable connection. Thereafter, the cylinder 324 of the upper support 320 pushes the piston 326 to lower the socket cover 340. When the socket cover 340 is lowered, the pressing surface 341 protruding from the lower surface of the socket cover 340 presses the upper portion of the image sensor package 40, the image sensor package 40 and it is seated Lower the seating plate 246 together. When the seating plate 246 is lowered, as described above, the upper contact portion 244c of the upper pogo pin 244 protrudes above the bottom surface 247b of the recess 247 of the seating plate 246, It is connected to the connection terminal formed in the lower portion of the image sensor package 40. In this case, the lower contact portion 244c of the upper pogo pin 244 also contacts the upper contact pad 245a of the socket printed circuit board 249, such that the lower contact pad 245b and the lower pogo pin 314 are provided. Is electrically connected to the control and processing unit 500 through.

The control and processing unit 500 applies the constant voltage and current to the image sensor package 40 to perform an electrical test. In addition, the image sensor package 40 receives the light irradiated from the light source 322 located above it and transmits the generated image signal to the control and processing unit 500 to perform an image test. In this case, when the image sensor package 40 is seated one by one on a pair of socket base 240 arranged side by side, the test is performed simultaneously in one inspection unit 300.

As such, while the image sensor package 40 is inspected by the inspection unit 300 located at the rear of the rotary shaft 230, the transfer unit 400 moves the image sensor package 40 to the rotary arm ( It rests on a socket base 240 located at the front end of 220. When the test of the image sensor package 40 is completed, the rotating arm 220 of the seating unit 200 is rotated 180 degrees again, so that the socket base 240 located at the rear inspection unit 300 is moved forward again. The socket base 240 of the front in which the image sensor package 40 to be transported and tested is seated is transported to the rear to perform a test.

When the tester module of the control and processing unit 500 completes the electrical and image testing of the image sensor package 40 to determine whether it is defective, the tester module determines that the handler module of the control and processing unit 500 The test result signal is transmitted to the handler module so that the second package picker 486, that is, the second transfer part of the transfer unit 400 moves the tested image sensor package 40 to a predetermined position. That is, by the communication between the tester module and the handler module in the control and processing unit 500, the handler module may check the image sensor package 40 transferred to the front after the second package picker 486 is completed. It sorts according to whether or not and controls to transfer to the first and second cassettes (120a, 120b). Accordingly, the image sensor package 40 is seated in the hollow rectangular recess 114 of the tray 110 mounted on the first and second cassettes 120a and 120b.

On the other hand, in the image sensor package inspection apparatus according to the present invention, in addition to the electrical test, as an image test, dark room inspection, color integration inspection, lens center position inspection, screen division (center / edge) inspection, pixel defect inspection, horizontal line defect inspection, vertical line Various tests such as defect inspection, stain inspection, joke defect inspection, beat miss inspection, etc. are performed, so even if each importance is taken into consideration, that is, even if a weighting factor is given to each inspection item, Categorizing two things as bad and good can be unreasonable. Therefore, in the image sensor package inspection apparatus according to the present invention, by setting an appropriate range on the boundary between two defects and good, the tested image sensor package can be classified into three stages of defect, re-inspection and good, and re-inspection in the darkroom for each item. It can be classified as a retest for each inspection, color integration test, lens center position test, etc. To this end, one or more trays for re-inspection may be additionally provided, and the tester module should control the second package picker 486, that is, the second transfer unit correspondingly, for each result. On the other hand, for the image sensor package classified as a re-inspection, the inspector examines the test result or performs a re-inspection to determine whether there is a defect.

In the above-described embodiment, since the image sensor package 40 is seated on the socket base 240 of the seating unit 200 with its glass substrate 41 facing up, the transfer unit 400 is packaged. After holding the image sensor package 40 on the wafer 40W, the image sensor package 40 is rotated 180 degrees and then mounted on the socket base 240 of the mounting unit 200.

In contrast, the inspection apparatus is configured such that the image sensor package 40 is seated in the mounting unit with the glass substrate 41 facing down, and the electrical test and the image test of the image sensor package 40 are performed in this state. If so, the transfer unit 400 may be unnecessary for the first transfer unit, thereby simplifying the apparatus.

FIG. 13 shows a modification of the mounting unit and the inspection unit for performing the electrical test and the image test of the image sensor package 40 with the glass substrate 41 facing down, that is, without the inversion of the image sensor package 40. do. The seating unit shown in FIG. 13 is identical to the seating unit 200 shown in FIG. 5 except for the seating unit. In the seating unit 210 ′ of the seating unit of the present embodiment, a through opening is formed, and an upper portion of the through opening has a shape corresponding to the glass substrate 41 of the image sensor package 40, and a lower portion thereof (the configuration described above). It has a cylindrical shape formed with a female thread inside so that the lens adapter (350). Since the glass substrate 41 is generally rectangular in shape, the upper and lower portions of the through openings are different from each other so that a step is formed between the upper and lower portions, and the image sensor package 40 is formed on the upper portion of the through openings. The upper and lower sizes of the through openings are adjusted to be seated.

The inspection unit shown in FIG. 13 is different from the inspection unit 300 shown in FIG. 5 in that the light source 322 is located at the bottom and the socket base is located at the top. That is, the inspection unit illustrated in FIG. 13 is disposed on the lower and upper support bases 310 'and 320 disposed to face each other at a predetermined distance up and down, and the upper surface of the lower support 310' (the same configuration as described above). ) A light source 322 and a socket base 240 ′ mounted to a lower surface of the upper support 320 to be movable up and down. In this case, the seating 210 is positioned between the lower support 310 'and the upper support 320.

The socket base 240 ′ is configured in the same manner as the socket base 240 or 250 illustrated in FIG. 8A or 8B, but is installed on the upper support 320 with the upside down. The socket base 240 'is fixed to the front end of the piston 326 of the cylinder 324 installed on the upper support 320, and is moved up and down by the operation of the cylinder 324.

On the other hand, since the socket base 240 'does not rotate unlike the above-described embodiment, the pogo pin 244 in the socket base 240' is connected to the control and processing unit 500 through the wiring 318. Is electrically connected to the In addition, a spacer may be provided between the seating table 210 'and the lower support 310' to maintain a gap therebetween. For example, the spacer has a protrusion having a lower end fixed to the lower support 310 ′ and a free end on the upper end, and the upper end of the spacer is rotated by the seating support 210 ′ so that the lower support 310 ′ and the upper end. When positioned between the support 320, the seat 210 is preferably formed to be seated on the top of the spacer. In contrast, the spacer may be attached to the seating plate 210 '.

By the mounting unit and the inspection unit configured as described above, the image sensor package 40 is mounted by the second transfer unit 420, 440, 460, 480 of the transfer unit 400 with the glass substrate 41 facing downward. An electrical test and an image test are performed by sitting on top of the through opening formed in the base 210 '. That is, when the image sensor package 40 is seated on the seating table 210 ', the rotary arm 220 rotates to move the image sensor package 40 to the inspection unit in the same manner as in the above-described embodiment. Subsequently, the socket base 240 ′ installed on the upper support 320 descends to cover the image sensor chip 42 and the connection terminal 47 (upward) of the image sensor package 40. The pogo pin 244 of 240'and the connection terminal 47 of the image sensor package 40 are connected.

Thereafter, the control and processing unit 500 applies a constant voltage and current to the image sensor package 40 to perform an electrical test. In addition, the image sensor package 40 receives light irradiated from the light source 322 positioned below it, that is, installed in the lower support 310 ′, and receives the image signal generated according to the control and processing unit 500. Image test is performed.

Although described above with reference to the drawings and embodiments, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims below. You will understand.

For example, in the above-described embodiment, the rotary arm has a rod shape and a socket base is mounted at opposite ends thereof. However, two rotary arms of the above-described embodiment are arranged side by side and connect each center portion to each other. Rotating arm consisting of can be applied. As described above, the rotating arm of the "H" type is equipped with a pair of socket bases at each of the four end portions, and rotates by installing a rotating shaft at the center of the connecting member. Can be.

In addition, in the present embodiment, the mounting table 210 is provided at both ends of the rotary arm 220, but may be installed in the inspection unit 300. In this case, the transfer unit 400 must transfer the image sensor package 40 while moving between the jig 100, the cassettes 120a and 120b, and the inspection unit 300.

Meanwhile, in the above-described embodiment, it is apparent that the glass substrate provided on the upper part of the image sensor package does not mean only a substrate whose material is glass, but includes, for example, a transparent substrate made of transparent plastic, quartz, or the like. .

The image sensor package inspection apparatus of the present invention configured as described above may perform an image test as well as an electrical test of the image sensor package in the step of assembling the camera module. Accordingly, it is possible to know whether the image sensor package is defective before assembling the camera module, thereby improving the yield of the camera module.

In particular, since the image test can be performed with the optimized lens for each image sensor package, a more accurate image test can be performed even in the image sensor package step before being assembled into the camera module.

Claims (10)

In the image sensor package inspection apparatus, A seating unit in which the image sensor package is seated for testing; An inspection unit including an lens and a light source on one side of the image sensor package to perform an electrical and image test of the image sensor package; A jig for supporting a package wafer having a plurality of image sensor packages, each cut; A transfer unit for transferring an image sensor package from the package wafer to the seating unit; And a control and processing unit having a tester module for controlling at least one of electrical and image testing of the image sensor package in the inspection unit. The image package of claim 1, wherein one surface of a mounting tape is attached to a transparent substrate of the image sensor package, a wafer ring is attached to an edge of the mounting tape, and the jig grips the wafer ring. Sensor package inspection device. The image sensor package inspection apparatus according to claim 1, further comprising a package pusher which is lifted below the package wafer. The mounting unit of claim 1, wherein the seating unit includes a socket base to which an image sensor package is seated, and a connection terminal disposed below is electrically connected to the seating unit, and the transfer unit includes an image sensor in the package wafer. An image sensor package inspection apparatus comprising a first transfer unit for holding the package to invert it up and down, and a second transfer unit for transferring the image sensor package between the socket base and the first transfer unit. The method according to claim 4, wherein the inspection unit comprises a connecting plate for elevating to electrically connect with the socket base, and a socket cover provided on the connecting plate to press the light-transmitting substrate of the image sensor package and the lens is provided An image sensor package inspection device. The method of claim 5, wherein the socket base is a socket body, a mounting plate which is installed to be elastically movable up and down with respect to the socket body and the image sensor package is mounted on the upper surface, and installed in the socket body and penetrates the mounting plate One end protrudes as the seating plate moves downward to include an upper pogo pin electrically connected to the image sensor package, and the connection plate is provided with a lower pogo pin to lift and lower the connection plate to raise and lower the pogo pin and the upper pogo. Image sensor package inspection device, characterized in that the pins are connected to each other. The mounting unit according to any one of claims 1 to 3, wherein the seating unit includes a seating plate having a through opening formed of an upper portion on which the translucent substrate of the image sensor package is seated downward and a lower portion on which the lens is installed. Image sensor package inspection device. The image sensor package inspection apparatus according to claim 7, wherein the inspection unit includes a socket base electrically connected to the image sensor package by moving upward and downward and moving downward. The method of claim 8, wherein the socket base is a socket body, a mounting plate which is installed to be movable up and down elastically with respect to the socket body and to cover the image sensor package, and installed in the socket body and penetrates through the mounting plate One end protrudes as the plate moves downward, the image sensor package inspection apparatus comprising a pogo pin electrically connected to the image sensor package. As an image sensor package inspection method, Separating the image sensor package from the package wafer having a plurality of image sensor packages, each cut; Photographing the image sensor package to recognize an alignment alignment state and then aligning the alignment according to the state; Electrically connecting the image sensor package to an inspection unit for inspecting whether the image sensor package is defective; And performing at least one of an electrical and an image test of the image sensor package while irradiating or blocking light to the image sensor package.

Images