KR100845117B1 - Antenna and manufacture method thereof - Google Patents

Abstract

An antenna and a manufacturing method thereof are provided to form an antenna pattern by previously forming an ABS(Acrylonitrile Butadiene Styrene) layer on a PC(Poly Carbonate) or PVC(Poly Vinyl Chloride) substrate through printing or coating according to a design shape of the antenna pattern. A manufacturing method of an antenna includes the steps of: preparing a printing compound for a pattern guide used as a guide of an antenna pattern by mixing ABS resin with thinner in a volume ratio of 1:1 to 7:3(S1); forming a pattern guide layer by printing or coating the printing compound on a PC or PVC substrate according to a design shape of the antenna pattern(S2); drying the substrate with the pattern guide layer at a normal temperature or in a thermal dryer(S3); performing ultrasonic degreasing of the substrate(S4); forming unevenness on a surface of the substrate by impregnating the substrate with a mixed solution of chromium anhydride and sulphuric acid to extract a rubber component from the pattern guide layer(S5); adsorbing and permeating metal ions into the unevenness of the pattern guide layer by impregnating the etched substrate with a mixed solution of metal ions and hydrochloric acid(S6); smoothing a surface of the pattern guide layer by impregnating the substrate with a sulphuric acid solution(S7); forming a conductive coating film on the surface of the pattern guide layer by performing chemical plating on the substrate(S8); forming a conductive copper pattern layer on the conductive coating film by performing electro or electroless plating on the substrate(S9); forming a nickel metal layer on the copper pattern layer by performing the electro or electroless plating on the substrate again(S10); forming a guide hole on the substrate by performing primary piercing punching along a printing pattern on the substrate(S11); and completely separating the entire product including the copper pattern layer from the substrate by performing secondary blanking punching through the second guide hole(S12).

Description

ANTENNA AND MANUFACTURING METHOD THEREOF {ANTENNA AND MANUFACTURE METHOD THEREOF}

1 is a schematic main process diagram showing an antenna manufacturing process according to the prior art.

Figure 2 is a block diagram showing for explaining the antenna manufacturing method according to the present invention.

Figure 3a to 3h is a process flowchart showing a manufacturing process of the antenna according to the present invention.

Explanation of symbols on the main parts of the drawings

102: substrate 104: pattern guide layer

104a: uneven portion 106: conductive film

108: copper pattern layer 110: nickel metal layer

112: guide hole 200: antenna

The present invention relates to an antenna, and more particularly, an antenna for easily forming an antenna pattern on a synthetic resin substrate such as PC or PVC without applying a conventional double injection method, and to improve work efficiency. It relates to a manufacturing method.

In general, an antenna is a device for use in transmitting or receiving radio waves for wireless communication, and is provided in various shapes and types.

Related to the conventional antenna manufacturing technology, a metal antenna pattern is formed on a substrate using a synthetic resin material such as PC (polycarbonate) or PVC (polyvinyl chloride), and is used in a technology for manufacturing an antenna.

However, as shown in FIG. 1, a metal antenna pattern cannot be formed directly on a PC or PVC substrate. As shown in FIG. 1, an ABS (acrylobutadiene styrene) layer 12 is laminated on one surface of the PC layer 11. It is used as a substrate 10 by performing a double injection, and the metallic antenna pattern 13 is formed on the ABS layer 12 of the substrate 10 made of the double injection through chemical vapor deposition, and the antenna pattern through the etching operation An antenna having a pattern is manufactured by removing the ABS layer 12 in the portion where (13) is not formed and performing a post-process for conduction.

By the way, according to the prior art antenna manufacturing as described above, the double injection for stacking the ABS layer on the PC layer has a problem that the work is cumbersome, the manufacturing cost increases and the work efficiency for the antenna manufacturing is low.

The present invention has been made in view of the above problems, and its object is to form an antenna pattern directly on a synthetic resin substrate such as PC or PVC without applying a conventional double injection method. The present invention provides an antenna and a method of manufacturing the same, which can provide ease of use and improve work efficiency in manufacturing the antenna.

The present invention for achieving the above object is a first step of providing a mixed mixture for the pattern guide for use as a guide of the antenna pattern by stirring and mixing the ABS resin and thinner in a ratio of 1: 1 to 7: 3 to capacity and; A second step of forming a pattern guide layer by printing or painting the printed mixture according to a design pattern of an antenna pattern on a substrate of PC or PVC; A third step of drying the substrate on which the pattern guide layer is printed in a room temperature or a heat dryer; A fourth step of performing degreasing using ultrasonic waves after the drying treatment; A fifth step of an etching step of forming an uneven portion on the surface by impregnating the substrate with a mixed solution of chromic anhydride and sulfuric acid to extract a rubber component from each pattern guide layer; A sixth step of impregnating the substrate subjected to the etching process into a mixed solution of metal ions and hydrochloric acid to adsorb and penetrate the metal ions to the uneven portion of the pattern guide layer; A seventh step of smoothly treating the surface of the pattern guide layer by impregnating the substrate having undergone the sixth step with a sulfuric acid solution; An eighth step of forming a conductive film on the surface of the pattern guide layer by chemically plating the substrate having undergone the seventh step; A ninth process of electroplating or electroless plating the substrate on which the conductive film is formed to form a conductive copper pattern layer on the conductive film; A tenth step of electroplating or electroless plating on the substrate including the copper pattern layer to form a nickel metal layer for corrosion resistance and decoration on the copper pattern layer; An eleventh step of forming a guide hole for the entire product punching by performing a primary piercing punching on the outside of a printed pattern shape formed on the substrate; It is characterized in that it is produced by a twelfth step of completely separating the entire product including the copper pattern layer from the substrate by performing a secondary blanking punching through the guide hole.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.

2 is a block diagram illustrating an antenna manufacturing method according to the present invention, Figures 3a to 3h is a schematic process flow chart showing the procedure of the antenna manufacturing process according to the present invention.

As shown in Fig. 2, the antenna according to the present invention comprises a first step (S1) having a print mixture for pattern guide for use as a guide of the antenna pattern by stirring the ABS resin and thinner (thinner), and the print mixture A second step (S2) of forming a plurality of pattern guide layers by printing the pattern according to the design of the antenna pattern on a PC or PVC substrate, and a third process of drying the substrate on which the pattern guide layer is printed in a room temperature or a heat dryer Step (S3), the fourth step (S4) of performing degreasing by ultrasonic waves after the drying treatment, and the substrate is impregnated with a mixed solution of chromic anhydride and sulfuric acid to extract a rubber component from each pattern guide layer. The fifth step (S5) of the etching operation for forming the irregularities in the step and the substrate subjected to the etching process is impregnated with a mixture of metal ions and hydrochloric acid to adsorb and sediment the metal ions on the uneven portion of the pattern guide layer The sixth step (S6), the seventh process (S7) to impregnate the surface of the pattern guide layer by impregnating the substrate subjected to the sixth step in a sulfuric acid solution, and the substrate subjected to the seventh step An eighth step (S8) of forming a conductive film on the surface of the pattern guide layer by plating, and a ninth step of forming a conductive copper (Cu) pattern layer on the conductive film by electroplating the substrate on which the conductive film is formed ( S9) and a tenth step (S10) of forming a nickel metal layer for corrosion resistance and decoration on the copper pattern layer by performing electroplating again on the substrate including the copper pattern layer, and to the outside of the printed pattern shape formed on the substrate. An eleventh step (S11) in which the primary piercing punching is performed to form guide holes for the entire product punching, and the second blanking punching through the guide holes is performed to remove the entire product including the copper pattern layer from the substrate. To that before separation it is manufactured by a process including a first step 12 (S12).

At this time, between the tenth step (S10) and the eleventh step (S11) of the electroplating or electroless plating on the substrate to further form a chromium layer on the nickel metal layer to prevent discoloration and wear resistance on the nickel metal layer ( S10-1) may be added.

In addition, after the fourth step (S4) to the tenth step (S10) is washed with water for washing the substrate, respectively.

The manufacturing process of the present invention is described in more detail with reference to FIGS. 2 and 3 as follows.

(Step 1-Printing Material Stirring Mixing)

ABS resin and thinner were added to the stirrer at a volume ratio of 1: 1 to 7: 3 to capacity, and stirred and mixed for 1 to 72 hours according to the mixing ratio to dissolve the ABS resin in the thinner to provide a print mixture of ABS concentrate. To be.

At this time, the printing mixture of the ABS resin and thinner thickens the viscosity while increasing the proportion of the ABS resin when using the printing method within the above range, and dilutes the viscosity while increasing the proportion of the thinner when using the coating method.

(2nd process-pattern guide printing or painting)

The printing mixture in which the ABS resin is dissolved in thinner is printed or painted on the substrate 102 of PC or PVC according to the design pattern of the antenna pattern, and as shown in FIG. The pattern guide layer 104 is formed.

At this time, since the printing operation uses a general method such as silk printing, a detailed description thereof will be omitted.

(Step 3-Drying)

The substrate 102 on which the pattern guide layer 104 is printed is solidified by drying for 10 minutes to 1 hour in a room temperature or a heat dryer.

(Step 4-Ultrasonic Degreasing)

The substrate after the drying treatment is subjected to ultrasonic degreasing to remove the foreign matter from the substrate, and to improve the adhesion and coating strength, thereby improving the etching effect in the subsequent etching process.

(Step 5-Etching)

The substrate was impregnated with a mixture of chromic anhydride and sulfuric acid (lactic acid), but the rubber component of butadiene from each of the pattern guide layers 104 printed on the substrate 102 at a concentration of 40-50% and a temperature of 72 ± 5 ° C. By extracting this, as shown in FIG. 3B, the uneven part 104a is formed in the surface.

(Step 6-First Activity)

The substrate subjected to the etching process is impregnated with a mixed solution of metal ions such as palladium and hydrochloric acid, but is uneven in the pattern guide layer 104 as shown in FIG. 3C at a concentration of 10 to 15% and a temperature of 33 ± 5 ° C. Metal ions such as palladium are adsorbed and penetrated into the unit 104a to exhibit a catalytic function.

(Step 7-Second Activity)

The surface of the pattern guide layer 104 is smoothly treated by impregnating the substrate 102 subjected to the sixth step into a sulfuric acid solution having a concentration of 15 to 20% by reducing metal ions adsorbed and penetrated into the uneven portions 104a. .

(Step 8-Chemical Plating)

Subsequently, the substrate subjected to the seventh step was impregnated with a mixed solution of nickel sulfate, sodium hypochlorite and sodium citrate, and subjected to chemical (electroless) plating at a concentration of 2-5% and a temperature of 50 ± 5 ° C. As described above, the conductive film 106 of chemical nickel is formed on the surface of the pattern guide layer 104.

In this case, the conductive film 106 may be formed of a chemical copper conductive film by replacing the nickel sulfate with copper sulfate.

In addition, since the plating deposition is difficult on the substrate 102 made of PC or PVC material, a plating layer formed by chemical or electroplating is formed only on the pattern guide layer 104 of the ABS material having a pattern shape.

(Step 9-First Electroplating)

Electroplating is performed on the substrate 102 on which the conductive film 106 is formed to form a conductive copper (Cu) pattern layer 108 on the conductive film 106, as shown in FIG.

At this time, the substrate 102 is impregnated with a mixed solution such as sulfuric acid and copper sulfate, and electroplated under conditions having a concentration of 15-25%, a temperature of 21 ± 5 ° C., and a current density of 4-5 A / dm 2. It is to form a plating layer having adhesion.

In this case, the electroless plating may be performed on the conductive film 106 to form a conductive copper pattern layer 108 on the conductive film 106 by conducting reduction plating of copper ions without flowing a current.

(Step 10-Second Electroplating)

Electroplating is again performed on the substrate 102 including the copper pattern layer 108 to form a nickel metal layer 110 on the copper pattern layer 108 for corrosion resistance and decoration, as shown in FIG. 3F.

At this time, the substrate 102 is impregnated with a mixed solution such as nickel sulfate, nickel chloride and boric acid, but the electroplating under the conditions of 19 ~ 24% concentration, 54 ± 5 ℃ temperature and current density of 2 ~ 3A / dm 2 It is for the decoration of gloss by nickel metal and of course to have corrosion resistance.

In this case, the electroless plating may be performed to reduce and precipitate nickel ions without flowing a current to form the conductive nickel metal layer 110 on the copper pattern layer 108.

(Step 11-Primary Piercing Punch)

As shown in FIG. 3G, the primary piercing punching is performed to the outside of the printing pattern shape including the nickel metal layer 110 formed on the substrate 102. To form).

(Step 12-2nd Blanking)

Press blanking of the secondary blanking through the guide hole 112 to completely remove the entire product including the copper pattern layer 108 for antenna pattern from the substrate 102 as shown in FIG. 3H. ) To complete.

Meanwhile, the antenna according to the present invention and a method of manufacturing the same have been described above with reference to specific embodiments and the accompanying drawings, but the present invention is not particularly limited thereto. Various substitutions, modifications, and variations may be made by those skilled in the art, and modifications and variations in such categories may be attributed to the present invention.

As described above, according to the antenna of the present invention and a method of manufacturing the same, an ABS layer, which is effective for forming an antenna pattern, is formed on a substrate such as PC or PVC by printing or painting, but is formed on the substrate in advance according to the design pattern of the antenna pattern. By forming the pattern, it is possible to simply form the pattern and do not need to apply the conventional double injection method can increase the overall work efficiency when manufacturing the antenna.

Claims (3)

A first process of mixing and mixing the ABS resin and the thinner in a volume ratio of 1: 1 to 7: 3 by volume to provide a pattern mixture for pattern guide for use as a guide of an antenna pattern; A second step of forming a pattern guide layer by printing or painting the printed mixture according to a design pattern of an antenna pattern on a substrate of PC or PVC; A third step of drying the substrate on which the pattern guide layer is printed in a room temperature or a heat dryer; A fourth step of performing degreasing using ultrasonic waves after the drying treatment; A fifth step of an etching step of forming an uneven portion on the surface by impregnating the substrate with a mixed solution of chromic anhydride and sulfuric acid to extract a rubber component from each pattern guide layer; A sixth step of impregnating the substrate subjected to the etching process into a mixed solution of metal ions and hydrochloric acid to adsorb and penetrate the metal ions to the uneven portion of the pattern guide layer; A seventh step of smoothly treating the surface of the pattern guide layer by impregnating the substrate having undergone the sixth step with a sulfuric acid solution; An eighth step of forming a conductive film on the surface of the pattern guide layer by chemically plating the substrate having undergone the seventh step; A ninth process of electroplating or electroless plating the substrate on which the conductive film is formed to form a conductive copper pattern layer on the conductive film; A tenth step of electroplating or electroless plating on the substrate including the copper pattern layer to form a nickel metal layer for corrosion resistance and decoration on the copper pattern layer; An eleventh step of forming a guide hole for the entire product punching by performing a primary piercing punching on the outside of the printed pattern shape formed on the substrate; And a twelfth step of completely separating the entire product including the copper pattern layer from the substrate by performing a secondary blanking through the guide hole. delete  The ABS concentrate and the ABS resin and thinner stirred and mixed at a volume ratio of 1: 1 to 7: 3 to capacity are printed or painted on the PC or PVC substrate in the shape of the antenna pattern to form a pattern guide layer. An antenna comprising a conductive antenna pattern on a pattern guide layer made of resin.

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