KR100831402B1 - Apparatus for Supplying High Pressure Cleaning Liquid to Substrate - Google Patents

Abstract

The present invention relates to a high pressure cleaning liquid supply apparatus for cleaning a substrate that can stably supply a high pressure and high flow cleaning liquid.

The cleaning liquid supply apparatus includes: a cleaning liquid supply apparatus for cleaning a substrate which receives the cleaning liquid from the cleaning liquid tank and sprays the same through a spray nozzle, comprising: a housing having an internal space having a predetermined size; A high pressure pump installed in the housing and pressurizing the washing liquid introduced from the washing liquid tank to a high pressure of 80 to 200 kgf / cm 2 and feeding the washing liquid to the spray nozzle through the washing liquid supply pipe; A pulsator installed in communication with the high pressure pump in the cleaning liquid supply pipe and maintaining a pressure of the cleaning liquid supplied from the high pressure pump within a predetermined range; A pressure sensor for sensing a pressure of the cleaning liquid supply pipe; High pressure pump control means for receiving the pressure value sensed by the pressure sensor to control the operation of the high pressure pump; It is configured to include, it is possible to implement a high cleaning efficiency.

Substrate Cleaning, High Pressure Pump, Control, Pulsator, Pressure Sensor, Flow Sensor, Safety Valve

Description

Apparatus for Supplying High Pressure Cleaning Liquid to Substrate}

1 is a schematic configuration diagram of a cleaning apparatus used in a conventional substrate cleaning process.

2 is a schematic configuration diagram of another cleaning apparatus for substrate cleaning according to the related art.

3 is a flow chart of the cleaning liquid supply apparatus according to the present invention.

Figure 4 is an external perspective view of the cleaning liquid supply apparatus according to the present invention.

Fig. 5 is a front view showing the interior of the cleaning liquid supply device according to the present invention.

Explanation of symbols on the main parts of the drawings

100 ... Cleaning fluid supply 110 ... Housing

121 ... Connection port for cleaning fluid inlet 122 ... Connection port for cleaning fluid inlet

130 ... Leak detection sensor 140 ... Display

212 ... Cleaning fluid inlet 213 ... Cleaning fluid supply

220 ... high pressure pump 230 ... pulsator

241 pressure sensor 242 flow sensor

250 ... high pressure pump control means 260 ... safety valve

270 ... filter unit 271 ... first filter

272 ... 2nd filter 274 ... Drain tube for filter replacement

310 ... cleaning liquid tank 320 ... injection nozzle

324 ... Nozzle 330 ... Substrate

The present invention relates to a high pressure cleaning liquid supply apparatus, and more particularly, to a high pressure cleaning liquid supply apparatus capable of efficiently cleaning a target object such as a semiconductor substrate by spraying the cleaning liquid supplied to the injection nozzle at high pressure and high flow rate. .

As shown in FIG. 1, a cleaning apparatus used in a conventional substrate (wafer) cleaning process includes a cleaning liquid such as a chamber 10, a mixed liquid in which ultrapure water (De-Ionized Water, DI), or ultrapure water and various cleaning chemicals are mixed. A cleaning liquid tank (DI tank) 22 for supplying water and a nozzle block 12 installed in the chamber 10 and having a plurality of spray nozzles 14 installed to supply the cleaning liquid 16 to the spray nozzle 14. And a pump 24 provided between the cleaning liquid tank 22 and the nozzle block 12 to supply the cleaning liquid 16 to the nozzle block 12 at a predetermined pressure, and the air of the predetermined pressure to the nozzle block 12. And a plurality of rollers 20 for transporting the substrate 18 to be loaded and loaded in the chamber 10.

The substrate 18 is loaded and seated on the plurality of rollers 20 by a substrate loading apparatus (not shown). The roller 20 transfers the substrate 18 to face the spray nozzle 14 when the substrate 18 is loaded, and transfers the substrate 18 to the outside when cleaning is completed.

In the cleaning liquid tank 22, a cleaning liquid such as ultrapure water (DI) or a mixed solution of ultrapure water and various cleaning chemicals is stored in order to clean foreign substances remaining on the substrate 18, and the nozzle block 12 is supplied through the pump 24. ) To the cleaning liquid. At this time, the pump 24 pumps the cleaning liquid stored in the cleaning liquid tank 22 at a pressure of about 10 to 12 kgf / cm 2, and supplies the cleaning liquid to the nozzle block 12 through the cleaning liquid supply pipe 23, and the compressor 26 is air. The air is supplied to the nozzle block 12 through the pipe 25 at a pressure of about 5 to 7 kgf / cm 2.

That is, the nozzle block 12 receives the washing liquid 16 having a predetermined pressure from the pump 24 and the compressed air from the compressor 26. As such, the cleaning liquid 16 such as ultrapure water supplied to the nozzle block 12 is mixed with the compressed air supplied from the compressor 26 and sprayed onto the surface of the substrate 18 to be cleaned in the form of a bubble. .

The foaming liquid 16 mixed in the nozzle block 12 is sprayed onto the surface of the substrate 18 by a plurality of spray nozzles 14 arranged at predetermined intervals on the rear surface of the nozzle block 12.

The cleaning method of such a conventional cleaning apparatus will be described below. First, when the substrate 18 is loaded on the rollers 20 of the chamber 10 by a substrate loading apparatus (not shown), the rollers 20 are driven to transfer the substrate 18 to face the spray nozzle 14. do.

Subsequently, the pump 24 is driven to pump the cleaning liquid 16 from the cleaning liquid tank 22 to the nozzle block 12, and at the same time, the compressor 26 is driven so that air having a predetermined pressure is supplied to the nozzle block 12. By being supplied, the cleaning liquid 16 is sprayed on the surface of the substrate 18 through the spray nozzle 14 in the form of bubbles.

The foaming cleaning liquid 16 sprayed on the surface of the substrate 18 removes the small fine foreign matter remaining on the substrate 18 to clean the substrate 18. At this time, the small fine foreign matter on the substrate 18 is cleaned on the substrate 18 by the force of the bursting cleaning liquid 16 sprayed on the substrate 18.

Thereafter, the rollers 20 are driven to transfer the cleaned substrate 18, and the transferred substrate 18 is unloaded out of the chamber 10 by an unloading device (not shown).

As described above, the conventional cleaning device has a problem that the pressure of the cleaning liquid 16 pumped from the pump 24 is only a low pressure of about 10 to 12 kgf / cm 2, and the cleaning efficiency is lowered. That is, the conventional cleaning apparatus shown in FIG. 1 can efficiently remove foreign substances adhering to the resin film or foreign matter adhering to the edge of the pattern when the resin film is coated on the surface of the substrate on which the pattern is formed due to low cleaning pressure. There is no problem.

In order to improve this problem, the cleaning apparatus disclosed in Korean Patent Laid-Open Publication No. 2003-0083200 (cleaning apparatus) is supplied to the nozzle block 32 from the cleaning liquid tank (DI tank) 42, as shown in FIG. The cleaning liquid supply valve V1 provided between the nozzle block 32 and the pump 44 so as to switch the cleaning liquid, and the cleaning liquid supplied from the pump 44 can be switched to be recovered to the cleaning liquid tank 42. A cleaning liquid return control valve (V2) provided between the front end of the cleaning liquid supply valve (V1) and the cleaning liquid tank (42), and the cleaning liquid supply valve (V1) and the cleaning liquid return control valve (V2) through the controller 48 to periodically The pressure of the cleaning liquid sprayed from the injection nozzle 34 is periodically changed by opening and closing the valve.

Such a cleaning apparatus periodically changes the injection pressure of the cleaning liquid, that is, the pressure of the cleaning liquid conveyed to the injection nozzle 34, to remove foreign substances having different adhesion or particle sizes attached to the surface of the object to be cleaned such as a substrate (wafer). The advantage is that it can be removed.

However, the cleaning apparatus of FIG. 2 also has a low pressure of 10 to 12 kgf / cm 2, similar to the cleaning apparatus of FIG. 1, so that when the resin film is coated on the surface of the substrate on which the pattern is formed, foreign matter or pattern adhered to the resin film There is a problem in that the foreign matter attached to the edge of the can not be removed efficiently.

That is, the conventional cleaning apparatus shown in FIGS. 1 and 2 has a low injection pressure of the cleaning liquid, and thus strongly adheres foreign matters (particles) to the surface of the object to be cleaned, or a region in which the cleaning solution is not sprayed well. If located, there is a problem that such foreign matter can not be removed completely.

Therefore, the necessity for the washing | cleaning liquid supply apparatus for spraying washing liquid with high pressure and a high flow amount so that washing | cleaning efficiency may be improved is increasing.

In addition, as the objects to be cleaned such as substrates become larger, a plurality of spray nozzles need to be installed to efficiently clean a wide substrate at the same time, and for this purpose, it is necessary to increase the flow rate of the cleaning liquid supplied to the spray nozzles. .

In other words, there is a need for a cleaning liquid supply device capable of stably and efficiently processing a wide substrate at high pressure and large flow rates.

In addition, the conventional cleaning solution supplying device is formed integrally with or fixed to the cleaning device for cleaning the substrate, so that when an abnormality of the cleaning solution supply occurs or needs repair, it is difficult to effectively deal with the cleaning solution supply, and it is difficult to move. There is an increasing need for a cleaning solution supply device to solve these problems.

The present invention is to solve the above problems, it is possible to stably spray a high pressure, high flow rate of the cleaning liquid to obtain a high cleaning efficiency, high pressure cleaning liquid supply apparatus that can efficiently clean the large to-be-cleaned object The purpose is to provide.

In addition, an object of the present invention is to provide a high-pressure cleaning liquid supply apparatus capable of maintaining a spraying pressure of the cleaning liquid injected to the object to be cleaned, such as a substrate, even when a pressure drop or rise of the cleaning liquid occurs during the cleaning process.

In addition, an object of the present invention is to provide a high-pressure cleaning liquid supply apparatus capable of adjusting the injection pressure and the flow rate of the cleaning liquid in consideration of characteristics such as a substance to be cleaned and foreign matter.

In addition, by removing the foreign matter in the cleaning liquid flowing into the high-pressure pump or injection nozzle to prevent the pump failure, to prevent the foreign matter is injected from the injection nozzle, and to provide a high-pressure cleaning liquid supply device for easy replacement of the filter It is done.

In addition, an object of the present invention is to provide a high pressure cleaning liquid supply device that is free to install and move and that can be easily used in connection with other cleaning equipment such as a cleaning liquid tank or a spray nozzle.

In order to achieve the above object, the present invention provides a cleaning liquid supply apparatus for cleaning a substrate which receives cleaning liquid from a cleaning liquid tank and sprays the same through a spray nozzle, comprising: a housing having an internal space having a predetermined size; A high pressure pump installed in the housing and pressurizing the washing liquid introduced from the washing liquid tank to a high pressure of 80 to 200 kgf / cm 2 and feeding the washing liquid to the spray nozzle through the washing liquid supply pipe; A pulsator installed in communication with the high pressure pump in the cleaning liquid supply pipe and maintaining a pressure of the cleaning liquid supplied from the high pressure pump within a predetermined range; A pressure sensor for sensing a pressure of the cleaning liquid supply pipe; High pressure pump control means for receiving the pressure value sensed by the pressure sensor to control the operation of the high pressure pump; It provides a high pressure cleaning liquid supply device for cleaning the substrate comprising a.

Preferably, the housing may have a cleaning liquid inlet pipe connecting port for communicating the high pressure pump and the cleaning liquid tank with an outer side thereof, and a cleaning liquid supply pipe connecting port for communicating the cleaning liquid supply pipe with the injection nozzle.

Also, preferably, the housing may include a leak detection sensor that detects a cleaning liquid leaked therein, and a display device that displays a leak signal detected by the leak detection sensor.

Preferably, the flow rate supplied from the high pressure pump is 15 ~ 30 liter / min, the high pressure pump control means controls the operation of the high pressure pump by the flow rate value detected by the flow rate sensor for detecting the flow rate of the cleaning liquid supply pipe It can be configured to.

More preferably, the pressure of the cleaning liquid supply pipe is more than a predetermined pressure is opened to the safety valve for discharging the cleaning liquid to the outside of the housing; may further include a.

Preferably, the cleaning liquid inlet tube or the cleaning liquid inlet pipe from which the cleaning liquid flows in the cleaning liquid supply pipe is installed in the cleaning unit; may further include a.

Also preferably, the filter unit may include a first filter that primarily filters foreign matters in the cleaning liquid introduced into the high pressure pump, and a second filter that secondarily filters fine foreign matters in the cleaning liquid conveyed through the high pressure pump. It can be made, including.

Preferably, the filter unit may include a filter replacement drain pipe for discharging the cleaning liquid therein.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. Terms to be described later are set in consideration of functions in the present invention, which may vary depending on the intention or custom of the producer producing the product, and the definitions should be made based on the contents throughout the present specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a configuration diagram of the flow path of the cleaning liquid supply apparatus 100 according to the present invention, Figure 4 is an external perspective view of the cleaning liquid supply apparatus 100 according to an embodiment of the present invention, Figure 5 is an embodiment of the present invention It is a front view which shows the inside of the washing | cleaning liquid supply apparatus 100 by the same.

As shown in FIG. 3, the cleaning liquid supply device 100 according to the present invention includes a housing 110, a high pressure pump 220, a pulsator 230, a pressure sensor 241, and a high pressure pump control means 250. It is configured to include, and may further include a flow sensor 242, safety valve 260 and filter unit 270.

3 to 5 will be described with respect to the high pressure cleaning liquid supply apparatus 100 according to the present invention.

As shown in FIG. 3, the cleaning solution supply device 100 according to the present invention receives the cleaning solution from the cleaning solution tank 310 and supplies a high pressure cleaning solution to the injection nozzle unit 320. The cleaning liquid supplied to the 320 is injected at a high pressure through the injection nozzle 324 to clean the object to be cleaned such as the substrate (wafer) 330.

3 and 5 will be described with respect to the high-pressure pump 220 and its peripheral device.

The high pressure pump 220 pressurizes the cleaning liquid supplied from the cleaning liquid tank 310 to the cleaning liquid supply pipe 213 through the cleaning liquid inlet pipe 212 and pressurizes the cleaning liquid to the cleaning liquid supply pipe 213, thereby spraying the nozzle 320 connected to the cleaning liquid supply pipe 213. So that a high pressure cleaning liquid can be supplied.

In the cleaning solution tank 310, a cleaning solution such as ultrapure water or a mixture of ultrapure water and various cleaning chemicals is stored to clean foreign substances remaining in the object to be cleaned, such as the substrate 320, and the cleaning solution tank 310 is stored in the cleaning solution tank 310. The stored cleaning liquid is supplied to the cleaning liquid supply device 100 through the cleaning liquid inlet pipe connection port 121 exposed to the outside of the housing 110 when the tank opening / closing valve 311 and the inlet pipe opening / closing valve 211 are opened. In this case, the pretreatment filter 312 may be passed through the pretreatment filter 312 before being supplied to the cleaning solution supply device 100 to remove the foreign matter. Such a pretreatment filter 312 may be installed inside the cleaning solution supply device 100. It may be.

In addition, the injection nozzle unit 320 is supplied with the cleaning liquid through the injection nozzle pipe 321 connected to the cleaning liquid supply pipe connection port 122 exposed to the outside of the housing 110, the cleaning liquid flowed into the injection nozzle pipe 321 Is supplied to the nozzle block 323 through the branch pipe 322 and is injected at a high pressure to the substrate 330 through a plurality of injection nozzles 324 mounted to the nozzle block 323.

At this time, the cleaning liquid supplied to the nozzle block 323 is mixed with the air supplied by the air supply device (not shown) and sprayed in the form of bubbles to clean the object to be cleaned such as the substrate 330.

Meanwhile, the high pressure pump 220 pressurizes the cleaning liquid introduced from the cleaning liquid tank 310 to a high pressure of 80 to 200 kgf / cm 2 to supply the injection nozzle 320. As described above, since the cleaning liquid supply device 100 according to the present invention pumps the cleaning liquid at a high pressure, the pressure of the cleaning liquid injected from the injection nozzle 324 is very high, thereby increasing the cleaning efficiency. In particular, when a resin film is coated on the surface of the substrate 330 on which the pattern is formed, foreign matters attached to the resin film or foreign matters attached to the edge of the pattern may be efficiently removed.

In addition, the high-pressure pump 220 according to the present invention by the supply flow rate is 15 to 30 liter / min, it is possible to achieve an efficient cleaning even for a wide substrate 330.

The high-pressure pump 220 is an example, the output of 7.5kw, 10HP, the operating pressure of 100kgf / ㎠ and the maximum operating pressure of 160kgf / ㎠, the operating flow rate of 23 liter / min and the maximum operating flow rate of 30 liter / min A pump having may be used, but the specification is not particularly limited as long as the aforementioned pressure or flow rate can be maintained.

On the other hand, in the case of using the high-pressure pump 220, pulsation may occur significantly when pumping. For example, the high pressure pump 220 is different from the operating cycle or the speed of each cylinder (piston) provided therein is a change in pressure when the pressure is supplied to the cleaning liquid. As such, when the pulsation of the high pressure pump 220 occurs, the pressure of the cleaning liquid injected from the injection nozzle 324 is changed so that the substrate 330 cannot be uniformly cleaned.

In order to solve this problem, the high pressure pump 220 is preferably equipped with a plurality of cylinders to minimize pulsation. For example, the high pressure pump 220 has nine cylinders (not shown) including four cylinders for performing a suction operation, four cylinders for performing a discharge operation, and one cylinder for repeating suction and discharge operations. Pulsation can be minimized.

However, even in such a case, the pulsation occurs, and therefore, it is necessary to install the pulsator 230 at the rear end of the high pressure pump 220 so as to make the pressure of the cleaning liquid supplied from the high pressure pump 220 even more uniform. desirable. That is, the pulsator 230 is installed in the cleaning solution supply pipe 213 so as to communicate with the high pressure pump 220 to prevent the pressure of the cleaning solution pumped from the high pressure pump 220 to change rapidly to stably maintain the high pressure cleaning solution. Allow to spray.

In addition, a pressure drop may appear in the cleaning liquid flowing through the cleaning liquid supply pipe 213 due to an internal factor or an external factor of the cleaning liquid supply device 100. That is, the cleaning liquid injected through the injection nozzle 324 due to internal and external factors such as the flow rate of the cleaning liquid flowing from the cleaning liquid tank 310 or the output of the high pressure pump 220 is changed due to the change of the external voltage. A pressure drop may occur, and in this case, a problem arises in that the foreign matter of the substrate 330 cannot be sufficiently cleaned.

In order to solve this problem, the present invention provides a pressure sensor 241 for detecting the pressure of the cleaning liquid supply pipe 213 and / or a flow sensor 242 for detecting the flow rate so that the pressure of the cleaning liquid supply pipe 213 can be kept constant. And a high pressure pump control means 250 for controlling the operation of the high pressure pump 220 by receiving a pressure value and / or a flow rate value applied from the pressure sensor 241 and / or the flow sensor 242. do.

That is, the high pressure pump control means 250 changes the pumping flow rate of the high pressure pump 220 according to the pressure value and / or the flow rate value sensed by the pressure sensor 241 and / or the flow rate sensor 242 to maintain a constant pressure. Supply the cleaning liquid.

At this time, the high pressure pump control means 250 operates the high pressure pump 220 according to the pressure value or the flow rate value detected by the pressure sensor 325 or the flow sensor 326 installed in the injection nozzle unit 320 outside the apparatus. It may be configured to control.

As such, by supplying the cleaning liquid with a constant pressure through the high pressure pump control means 250, the high pressure cleaning liquid can be injected from the injection nozzle 324 of the injection nozzle unit 320 to the substrate 330 at a constant pressure. The efficiency is increased.

In addition, by using the high pressure pump control means 250, the operation of the high pressure pump 220 may be controlled by adjusting the injection pressure or the flow rate of the cleaning liquid in consideration of the characteristics of the object to be cleaned or the foreign matter.

High pressure pump control means 250 provided in the present invention may be configured to control the voltage or current applied to the high pressure pump 220 to adjust the flow rate of the cleaning liquid pumped from the high pressure pump 220, high pressure pump 220 If the pumping flow rate or the pumping pressure of) can be controlled is not particularly limited. For example, the high pressure pump control means 250 may be integrally formed with the high pressure pump 220, such as an inverter pump, or may be separately formed outside the high pressure pump 220. In addition, various methods such as voltage control, current control, frequency control, pulse amplitude modulation (PAM) control, and pulse width modulation (PWM) control may be used as the control method.

On the other hand, the cleaning liquid supply device 100 according to the present invention is the cleaning liquid to the outside of the housing 110 through the pipe 261 and the safety valve connecting port 124 when the pressure of the cleaning liquid supply pipe 213 is more than the set value. The safety valve 260 may be provided to prevent overload, damage, or failure of the cleaning liquid supply device 100 by discharging the liquid. That is, the safety valve 260 automatically opens when a pressure higher than the set pressure is applied to the cleaning liquid supply pipe 213, thereby reducing the pressure in the cleaning liquid supply pipe 213. Therefore, the shape or structure is not particularly limited as long as it can perform such a function, and may include both a conventional relief valve or a safety valve.

In addition, the cleaning solution supply apparatus 100 according to the present invention may further include a filter unit 270 installed in the cleaning solution inlet pipe 212 or three semen supply pipe 213 to remove the foreign matter.

At this time, the filter unit 270 is installed in the cleaning liquid inlet pipe 212 to primarily filter the foreign matter in the cleaning liquid flowing into the high pressure pump 220, the first filter to prevent abnormal operation of the high pressure pump 220 A second filter (271) is installed in the cleaning liquid supply pipe 213 to secondaryly finely filter the fine foreign matter in the cleaning liquid conveyed through the high pressure pump 220 (2) to prevent the foreign matter from being injected from the injection nozzle 324 ( 272).

In addition, the filter unit 270 may include a filter replacement drain pipe 274 for discharging the cleaning solution filled in the filter to the outside when the filter is replaced. That is, as shown in FIG. 3 as an example, the filter unit 270 may include a filter replacement drain pipe 274 for replacing the second filter 272 and a drain valve 273 for opening and closing thereof. The drained cleaning liquid may be discharged to the outside through the drain connection port 123 exposed to the outside of the housing 110.

As described above, the cleaning liquid supply device 100 according to the present invention includes the high pressure pump 220 by providing the filter unit 270 to remove foreign substances in the cleaning liquid flowing into the high pressure pump 220 or the injection nozzle unit 320. It is possible to prevent the failure of the () and to effectively prevent the foreign matter is injected from the injection nozzle 324, in particular, by providing a filter replacement drain pipe 274 has the advantage of easy replacement of the filter.

In addition, the cleaning liquid supply device 100 according to the present invention includes a housing 110 for accommodating the high pressure pump 220, the pulsator 230, the filter unit 270, the safety valve 260, and the like integrally therein. It is configured to include.

As shown in FIGS. 4 and 5, the housing 110 includes various components such as a high pressure pump 220 therein, and a connection port for introducing or discharging the cleaning liquid into and out of the housing 110.

As described above, the connection port exposed to the outside of the housing 110 is a pumped in the washing liquid inlet pipe connection port 121, the high pressure pump 220 for introducing the washing liquid from the washing liquid tank 310 to the high pressure pump 220. Cleaning liquid supply pipe connection port 122 for supplying the cleaning liquid to the injection nozzle unit 320, connecting port 123 for draining the cleaning liquid inside the filter 272 when the filter 272 is replaced, and the cleaning liquid supply pipe 213. And a safety valve connecting port 124 for discharging the cleaning liquid to the outside when the inside becomes higher than the set pressure.

In addition, when the cleaning solution leaks inside the housing 110, a leakage port connecting port 125 may be installed outside the housing 110 to discharge the leaked cleaning solution to the outside. At this time, a leak detection sensor 131 may be installed on the bottom side of the housing 110 to detect when a leak occurs in the interior of the housing 110, when the leak is detected by the leak detection sensor 131 In this case, the user may take measures in response to the leak by displaying the leak state on the display device 140 installed outside the housing 110.

And, as shown in Figures 4 and 5, the housing 110 may be configured to be easy to move by mounting the movement stage 113, such as wheels, the housing 110 by mounting the position fixing means 114 ) Can be configured to maintain a fixed position.

In addition, the cover 111 to which the handle 112 is mounted may be installed to install, repair, or replace various components inside the housing 110. That is, as illustrated in FIG. 5, the cover 111 may be mounted on the opening 115 formed in the housing 110 through the cover mounting tool 116 to easily mount, replace, and repair various components. Will be.

As described above, the cleaning liquid supply device 100 according to the present invention mounts various components inside the housing 110, and the cleaning liquid tank 310, the spray nozzle 320, and the like inside the housing 110 outside the housing 110. By installing various connection ports 121, 122, 123, 124 and 125 for connecting parts, the installation and movement of the device is free and there is an advantage that it can be easily connected and used with other external cleaning equipment through piping.

As described above, according to the present invention, by using a high pressure pump, it is possible to stably spray a high pressure cleaning liquid to obtain high cleaning efficiency, and to supply a high flow amount of cleaning liquid, which can be used for cleaning a large substrate.

In addition, the spray pressure can be maintained at a constant level even in the case of a pressure drop of the cleaning liquid during the cleaning process through a pulsator and a high pressure pump control means, and by installing a safety valve, the pressure inside the cleaning liquid supply pipe is higher than the set value. Even when it rises, the effect that the injection pressure of a washing | cleaning liquid can be maintained at a constant level can be acquired.

In addition, the present invention has the effect that it is possible to adjust the operating pressure or the flow rate of the high-pressure pump in accordance with the characteristics of the object to be cleaned, foreign matter, etc. by providing a high-pressure pump control means.

In addition, the filter unit is provided to remove foreign substances in the cleaning liquid, thereby preventing the failure of the high-pressure pump and effectively preventing foreign substances from being injected from the injection nozzle. The filter replacement drain pipe facilitates replacement of the filter. You can get it.

In addition, the cleaning liquid supply apparatus according to the present invention mounts various components inside the housing, and installs various connection ports for connecting the equipment for cleaning and the components inside the housing to the outside of the housing, whereby the installation and movement of the apparatus is free and It can be easily connected and used with cleaning equipment.

While the invention has been shown and described with respect to particular embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as set forth in the claims below. I want to make it clear.

Claims (8)

In the cleaning liquid supply apparatus for substrate cleaning to receive the cleaning liquid from the cleaning liquid tank 310 and sprayed through the injection nozzle 324, A housing 110 having an internal space of a predetermined size; The high pressure pump is installed inside the housing 110, pressurizes the cleaning liquid introduced from the cleaning liquid tank 310 to a high pressure of 80 ~ 200kgf / ㎠ and pumped to the injection nozzle 324 through the cleaning liquid supply pipe 213 220; A pulsator 230 installed to communicate with the high pressure pump 220 in the cleaning liquid supply pipe 213 and maintaining a pressure of the cleaning liquid supplied from the high pressure pump 220 within a predetermined range; A pressure sensor 241 for detecting a pressure of the cleaning liquid supply pipe 213; And High pressure pump control means 250 for controlling the operation of the high pressure pump 220 by receiving the pressure value sensed by the pressure sensor (241); High pressure cleaning liquid supply apparatus for cleaning a substrate comprising a. The method of claim 1, The housing 110 communicates a cleaning liquid inlet pipe connection port 121 for communicating the high pressure pump 220 and the cleaning liquid tank 310 to the outside thereof, and the cleaning liquid supply pipe 213 and the injection nozzle 324. And a cleaning liquid supply pipe connection port (122) for cleaning the substrate. The method of claim 1, The housing 110 includes a leakage detection sensor 131 for detecting a cleaning liquid leaked therein and a display device 140 for displaying a leakage signal detected by the leakage detection sensor 131. High pressure cleaning liquid supply device for cleaning. The method of claim 1, The flow rate supplied from the high pressure pump 220 is 15 ~ 30 liter / min, The high pressure pump control unit 250 controls the operation of the high pressure pump 220 by the flow rate value detected by the flow rate sensor 242 for detecting the flow rate of the cleaning solution supply pipe 213. High pressure cleaning liquid supply device. The method according to any one of claims 1 to 4, A safety valve 260 which is opened when the pressure of the cleaning liquid supply pipe 213 is greater than or equal to a predetermined pressure to discharge the cleaning liquid to the outside of the housing 110; High pressure cleaning liquid supply apparatus for cleaning the substrate, characterized in that it further comprises. The method according to any one of claims 1 to 4, And a filter unit 270 installed in the cleaning solution inlet pipe 212 or the cleaning solution supply pipe 213 through which the cleaning solution flows from the cleaning solution tank 310 to remove foreign substances. Cleaning liquid supply apparatus. The method of claim 6, The filter unit 270 may secondary the first filter 271 for first filtering the foreign matter in the cleaning solution flowing into the high pressure pump 220, and the fine foreign matter in the cleaning solution pumped through the high pressure pump 220. A high pressure cleaning liquid supply device for cleaning a substrate, comprising a second filter (272) to be microfiltered. The method of claim 6, The filter unit 270 is a high pressure cleaning liquid supply apparatus for cleaning the substrate, characterized in that it comprises a filter replacement drain pipe 274 for discharging the cleaning liquid therein.

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