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KR100839380B1 - Vacuum evaporation apparatus for organic light emission display - Google Patents

Vacuum evaporation apparatus for organic light emission display Download PDF

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KR100839380B1
KR100839380B1 KR1020060105806A KR20060105806A KR100839380B1 KR 100839380 B1 KR100839380 B1 KR 100839380B1 KR 1020060105806 A KR1020060105806 A KR 1020060105806A KR 20060105806 A KR20060105806 A KR 20060105806A KR 100839380 B1 KR100839380 B1 KR 100839380B1
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disposed
mask
organic light
gap plate
deposition
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KR20080038650A (en
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김태형
김의규
한욱
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삼성에스디아이 주식회사
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/191Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

본 발명에 따른 유기 발광 표시 장치의 진공 증착 장치는 진공 챔버, 진공 내측 하부로 배치되는 증착원, 챔버 내부의 증착원 위로 증착마스크를 구비하며 배치되는 마스크 프레임 조립체 및 마스크 프레임 조립체와 증착되는 기판을 사이에 두고 배치되는 마그넷 유닛을 포함한다. 또한, 마그넷 유닛은 기판 측으로 배치되는 갭플레이트(gap plate) 및 갭플레이트와 간격을 두고 배치되는 금속 자성체(metal magnet)를 포함한다. The vacuum deposition apparatus of the organic light emitting diode display according to the present invention comprises a vacuum chamber, a deposition source disposed under the vacuum inside, a mask frame assembly having a deposition mask disposed on the deposition source inside the chamber, the mask frame assembly and the substrate being deposited; It includes a magnet unit disposed in between. In addition, the magnet unit includes a gap plate disposed on the substrate side and a metal magnet disposed at a distance from the gap plate.

유기발광표시장치, 증착, 마스크, 러버마그넷, 메탈마그넷, 갭플레이트 Organic light emitting display, deposition, mask, rubber magnet, metal magnet, gap plate

Description

유기 발광 표시 장치의 진공 증착 장치{VACUUM EVAPORATION APPARATUS FOR ORGANIC LIGHT EMISSION DISPLAY}VACUUM EVAPORATION APPARATUS FOR ORGANIC LIGHT EMISSION DISPLAY}

도 1은 본 발명의 실시예에 따른 유기 발광 표시 장치의 진공 증착 장치의 개략도이다. 1 is a schematic diagram of a vacuum deposition apparatus of an organic light emitting diode display according to an exemplary embodiment of the present invention.

도 2는 도 1의 마스크 프레임 조립체 및 마그넷 유닛의 확대 단면도이다. FIG. 2 is an enlarged cross-sectional view of the mask frame assembly and the magnet unit of FIG. 1.

본 발명은 진공 증착 장치에 관한 것으로, 보다 상세하게는 금속 자성체(metal magnet)을 이용한 마그넷 유닛을 이용한 유기 발광 표시 장치의 진공 증착 장치에 관한 것이다. The present invention relates to a vacuum deposition apparatus, and more particularly, to a vacuum deposition apparatus of an organic light emitting display apparatus using a magnet unit using a metal magnet.

유기 발광 표시 장치는 유기물질에 양극(anode)과 음극(cathode)을 통하여 주입된 전자와 정공이 재결합(recombination)하여 여기자(exciton)를 형성하고, 형성된 여기자로부터의 에너지에 의해 특정한 파장의 빛이 발생하는 현상을 이용한 자체 발광형 표시 장치이다. In the organic light emitting diode display, electrons and holes injected into the organic material through an anode and a cathode recombine to form an exciton, and light having a specific wavelength is generated by energy from the exciton formed. It is a self-luminous display device using the phenomenon which occurs.

유기 발광 표시 장치는 백라이트와 같은 별도의 광원이 요구되지 않아 액정 표시 장치에 비해 소비 전력이 낮을 뿐만 아니라 광시야각 및 빠른 응답속도 확보 가 용이하다는 장점이 있어 차세대 표시 장치로서 주목 받고 있다. The organic light emitting diode display is attracting attention as a next-generation display because it does not require a separate light source such as a backlight, and thus has a lower power consumption than the liquid crystal display, and makes it easy to secure a wide viewing angle and a fast response speed.

유기 발광 표시 장치의 발광 소자는 정공 주입 전극인 애노드 전극, 유기박막층 및 전자 주입 전극인 캐소드 전극으로 이루어지고, 유기박막층이 적(Red; R), 녹(G; Green) 및 청(Blue; B)을 내는 각각의 유기 물질로 이루어져 풀 칼라(full color)를 구현한다. The light emitting device of the organic light emitting diode display includes an anode electrode which is a hole injection electrode, an organic thin film layer, and a cathode electrode which is an electron injection electrode, and the organic thin film layer is red (R), green (G; Green), and blue (B; blue). Each material is made of organic materials to produce full color.

또한, 유기박막층은 전자와 정공의 균형을 좋게 하여 발광 효율을 높이도록 발광층(emitting layer; EML), 전자 수송층(electron transport layer; ETL) 및 정공 수송층(hole transport layer; HTL)을 포함한 다층 구조로 이루어질 수 있으며, 경우에 따라서는 별도의 전자 주입층(electron injection layer; EIL)과 홀 주입층(hole injection layer; HIL)을 더 포함할 수 있다. In addition, the organic thin film layer has a multilayer structure including an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL) to improve the light emission efficiency by improving the balance between electrons and holes. In some cases, it may further include a separate electron injection layer (EIL) and a hole injection layer (HIL).

이와 같이 구성된 유기 발광 표시 장치를 제작함에 있어서, 투명한 절연기판에 ITO등으로 이루어진 애노드 전극을 포토리소 그래피법 등으로 성막하여 스트라이프 형상으로 형성한다. In manufacturing the organic light emitting display device configured as described above, an anode electrode made of ITO or the like is formed on a transparent insulating substrate by photolithography or the like to form a stripe shape.

그리고 애노드 전극이 형성된 기판에 유기박막층 및 캐소드 전극의 형성패턴과 동일한 패턴을 갖는 마스크를 밀착시키고 증착물질을 증착하여 유기박막층 및 캐소드 전극의 패턴을 형성한다. A mask having the same pattern as that of the organic thin film layer and the cathode electrode is closely attached to the substrate on which the anode electrode is formed, and a deposition material is deposited to form a pattern of the organic thin film layer and the cathode electrode.

또한, 상기와 같은 증착 공정을 실시함에 있어서, 상기한 기판과 마스크를 밀착시키기 위해 일반적으로 고무 자성체(rubber magnet)를 사용하고 있다. In addition, in performing the deposition process as described above, rubber magnets are generally used to bring the substrate into close contact with the mask.

그런데 상기한 고무 자성체를 사용하여 기판과 마스크를 고정한 상태에서 유기 박막을 증착하는 경우에는 고무 자성체에서 아웃개싱(out gassing)이 발생하게 되며, 상기한 아웃개싱은 유기 발광층의 수명을 저하시키는 주요 요인으로 작용한다. However, when the organic thin film is deposited while the substrate and the mask are fixed by using the rubber magnetic material, out gassing occurs in the rubber magnetic material, and the outgassing is a major factor that reduces the lifespan of the organic light emitting layer. Acts as.

또한, 고무 자성체는 금속 자성체(metal magnet)에 비해 자력의 세기가 약하고, 자장이 불균일하므로 대형의 기판에 증착을 실시하는 경우에 적용하기에는 부적합하다. In addition, the rubber magnetic material has a weaker magnetic force and a nonuniform magnetic field than the metal magnet, which is not suitable for the case of depositing a large substrate.

본 발명은 상기한 문제점을 해결하기 위한 것으로, 본 발명의 목적은 금속 자성체를 사용하여 아웃개싱을 방지하고, 대면적의 기판에 대한 증착 공정에 적합한 진공 증착 장치를 제공하는 데 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a vacuum deposition apparatus suitable for a deposition process for a large-area substrate by preventing outgassing using a magnetic metal.

본 발명에 따른 유기 발광 표시 장치의 진공 증착 장치는 진공 챔버, 진공 내측 하부로 배치되는 증착원, 챔버 내부의 증착원 위로 증착마스크를 구비하며 배치되는 마스크 프레임 조립체 및 마스크 프레임 조립체와 증착되는 기판을 사이에 두고 배치되는 마그넷 유닛을 포함한다. 또한, 마그넷 유닛은 기판 측으로 배치되는 갭플레이트(gap plate) 및 갭플레이트와 간격을 두고 배치되는 금속 자성체(metal magnet)를 포함한다. The vacuum deposition apparatus of the organic light emitting diode display according to the present invention comprises a vacuum chamber, a deposition source disposed under the vacuum inside, a mask frame assembly having a deposition mask disposed on the deposition source inside the chamber, the mask frame assembly and the substrate being deposited; It includes a magnet unit disposed in between. In addition, the magnet unit includes a gap plate disposed on the substrate side and a metal magnet disposed at a distance from the gap plate.

또한, 갭플레이트는 일정한 간격을 두고 형성되는 복수의 홈들을 구비하고, 금속 자성체는 홈들의 내부로 배치될 수 있다. In addition, the gap plate may include a plurality of grooves formed at regular intervals, and the magnetic metal may be disposed inside the grooves.

또한, 이웃하는 금속 자성체들이 서로 반대의 극 방향으로 배치될 수 있다. In addition, neighboring magnetic metals may be disposed in opposite polar directions.

또한, 갭플레이트의 내부로 설치되는 냉각 튜브를 더 포함할 수 있다. The apparatus may further include a cooling tube installed into the gap plate.

또한, 마그넷 유닛은 그 하부로 금속 자성체가 일정한 간격으로 배열되는 마그넷 플레이트를 더 포함할 수 있다. In addition, the magnet unit may further include a magnet plate below which the magnetic metal is arranged at regular intervals.

이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

도 1은 본 발명의 실시예에 따른 진공 증착 장치를 도시한 개략도이다. 도시한 바와 같이, 본 발명의 실시예에 따른 진공 증착 장치는 내부가 진공으로 유지되는 챔버(10), 챔버(10) 내부에 배치되는 증착원(20), 증착원(20)의 상부로 배치되는 마스크 프레임 조립체(30), 및 마스크 프레임 조립체(30)와의 사이에 기판(40)을 두고 배치되는 마그넷 유닛(50)을 포함한다. 1 is a schematic view showing a vacuum deposition apparatus according to an embodiment of the present invention. As shown, the vacuum deposition apparatus according to an embodiment of the present invention is disposed above the chamber 10, the deposition source 20 disposed inside the chamber 10, the deposition source 20 is maintained in a vacuum interior And a magnet unit 50 disposed with the substrate 40 between the mask frame assembly 30 and the mask frame assembly 30.

챔버(10)의 내부는 기판(40)에 박막을 증착 시 내부 공간이 소정의 진공도와 상온보다 높은 소정의 온도로 유지된다. The inside of the chamber 10 is maintained at a predetermined temperature higher than a predetermined vacuum degree and room temperature when the thin film is deposited on the substrate 40.

증착원(20)은 챔버(10) 내의 상부 또는 하부로 증착물을 수용하며 배치되고, 이 증착원(20)의 반대측에 마스크(32)와 프레임(34)이 결합된 마스크 프레임 조립체(30)를 개재한 상태로 기판(40)이 배치된다. The deposition source 20 is disposed to receive deposits above or below the chamber 10, and the mask frame assembly 30 having the mask 32 and the frame 34 coupled to the deposition source 20 is coupled to the deposition source 20. The board | substrate 40 is arrange | positioned in the state interposed.

이때, 마스크(32)는 프레임(34)에 인장력이 가하여지도록 고정된다. At this time, the mask 32 is fixed so that a tensile force is applied to the frame 34.

프레임(34)은 중앙이 개구된 직사각형으로 이루어질 수 있으며, 탄성력을 가지는 재질로 형성될 수 있다. 또한, 프레임(34)은 마스크(32)에 가하여지는 인장력을 충분히 견딜 수 있는 강성을 가져야 하며 피 증착물과 마스크(32)의 밀착 시 간섭을 일으키지 않은 구조를 갖는다. The frame 34 may be formed as a rectangle having an open center, and may be formed of a material having elastic force. In addition, the frame 34 should have a rigidity that can withstand the tensile force applied to the mask 32 sufficiently, and has a structure that does not cause interference when the deposition object and the mask 32 are in close contact.

상기한 프레임(34)은 36Alloy(Invar), 42Alloy, SUS410, SUS420 및 SUS430 등의 재질로 이루어질 수 있다. The frame 34 may be made of 36Alloy (Invar), 42Alloy, SUS410, SUS420 and SUS430.

마스크(32)는 프레임(34)에 인장력이 가하여지도록 그 가장자리부가 지지되고, 복수의 단위 패턴을 구비하며, 하나의 단위 패턴에 의해 하나의 소자가 증착된다. The mask 32 is supported at its edge so as to apply a tensile force to the frame 34, has a plurality of unit patterns, and one element is deposited by one unit pattern.

각 단위 패턴에는 소정의 슬롯들이 형성되어 피증착될 박막이 소정의 패턴으로 형성될 수 있도록 한다. Predetermined slots are formed in each unit pattern so that a thin film to be deposited may be formed in a predetermined pattern.

마스크(32)는 자성을 띤 박판으로 이루어질 수 있는 데, 니켈 또는 니켈과 코발트의 합금으로 이루어질 수 있고, 바람직하게는 미세 패턴의 형성이 용이하고, 표면 거칠기가 좋은 니켈 85 중량%와 코발트 15중량%으로 이루어진 합금으로 이루어질 수 있다. The mask 32 may be formed of a magnetic thin plate, and may be made of nickel or an alloy of nickel and cobalt, and is preferably 85 wt% nickel and 15 wt% cobalt, which is easy to form a fine pattern and has a good surface roughness. It may be made of an alloy consisting of%.

또한, 마스크(32)는 슬롯을 전주(electro forming)법에 의해 형성하여 미세한 패터닝과 우수한 표면 평활성을 얻도록할 수 있다. 이러한 증착용 마스크(32)는 에칭(etching) 방법에 의해서도 제조될 수 있는 데, 포토 레지스트를 이용해 슬롯의 패턴을 가지는 레지스트 층을 박판에 형성하거나 슬롯의 패턴을 가진 필름을 박판에 부착한 후 박판을 에칭함으로써 제조할 수 있다. In addition, the mask 32 may form slots by an electroforming method to obtain fine patterning and excellent surface smoothness. The deposition mask 32 may also be manufactured by an etching method. A photoresist layer may be used to form a resist layer having a slot pattern on a thin plate, or a film having a slot pattern may be attached to a thin plate and then laminated. It can manufacture by etching.

한편, 마그넷 유닛(50)은 기판(40)을 사이에 두고 마스크 프레임 조립체(30)와 대향되도록 배치되며, 마그넷 유닛(50)에서 발생하는 자장에 의해 마스크(32)가 기판(40)에 밀착되어 피증착물에 음영이 생기지 않도록 한다. On the other hand, the magnet unit 50 is disposed to face the mask frame assembly 30 with the substrate 40 therebetween, and the mask 32 is in close contact with the substrate 40 by the magnetic field generated by the magnet unit 50. To prevent shadows on the deposit.

상기와 같은 진공 증착 장치를 사용하여 기판(40)에 박막을 증착함에 있어서, 전술한 바와 같이 챔버(10)의 내부 공간을 소정의 진공도를 갖는 진공으로 유지하고, 상온보다 높은 소정의 온도로 만든 후, 증착원(20)으로부터 증착물을 기화 또는 승화시켜 마스크(32)를 통해 기판(40)에 증착한다. In depositing a thin film on the substrate 40 using the vacuum deposition apparatus as described above, as described above, the internal space of the chamber 10 is maintained at a vacuum having a predetermined degree of vacuum, and is made at a predetermined temperature higher than room temperature. Thereafter, the deposit is vaporized or sublimed from the deposition source 20 and deposited on the substrate 40 through the mask 32.

이하에서는 마그넷 유닛(50)의 구성에 대하여 상세하게 설명하도록 한다. 도 2는 도 1의 마스크 프레임 조립체(30), 기판(40) 및 마그넷 유닛(50)을 확대하여 도시한 단면도이다. Hereinafter, the configuration of the magnet unit 50 will be described in detail. FIG. 2 is an enlarged cross-sectional view of the mask frame assembly 30, the substrate 40, and the magnet unit 50 of FIG. 1.

도시한 바와 같이, 마그넷 유닛(50)은 갭플레이트(gap plate, 52), 갭플레이트(52)와 일정 거리를 두고 배치되는 금속 자성체(54) 및 금속 자성체(54)가 결합되어 배열되는 마그넷 플레이트(58)를 포함한다. As shown, the magnet unit 50 is a gap plate (gap plate, 52), the magnetic metal plate 54 and the magnetic metal plate 54 are arranged to be coupled to be arranged at a distance from the gap plate 52, the magnet plate (58).

이와 같이, 본 발명의 실시예에 따른 진공 증착 장치는 강력하고 균일한 자장을 발생시키는 금속 자성체(54)를 구비함으로써 대형 기판(40)의 증착 시 기판(40)과 마스크(32)를 강력하게 밀착시킬 수 있다. As such, the vacuum deposition apparatus according to the exemplary embodiment of the present invention includes a metal magnetic material 54 that generates a strong and uniform magnetic field, thereby strongly strengthening the substrate 40 and the mask 32 when the large substrate 40 is deposited. It can be in close contact.

이 경우 고무 자성체를 사용하는 경우와는 달리 아웃개싱이 발생할 염려가 없다. In this case, unlike the case of using a rubber magnetic material, there is no fear of outgassing.

갭플레이트(52)에는 복수의 홈(52a)이 일정한 간격을 두고 형성된다. 상기한 홈(52a)의 내측으로는 금속 자성체(54)가 상기한 갭플레이트(52)에 접촉하지 않으면서 배치된다. 이에 따라 복수의 금속 자성체들(54)은 서로 일정한 피치를 형성하며 배치된다. A plurality of grooves 52a are formed in the gap plate 52 at regular intervals. Inside the groove 52a, the magnetic metal body 54 is disposed without contacting the gap plate 52 described above. Accordingly, the plurality of magnetic metals 54 are disposed to form a constant pitch with each other.

또한, 상기와 같이 금속 자성체(54)가 갭플레이트(52)에 접촉하지 않으므로 기판(40)이 깨어지는 것이 방지된다. In addition, since the magnetic metal body 54 does not contact the gap plate 52 as described above, the substrate 40 is prevented from being broken.

한편, 도시한 바와 같이 이웃하는 금속 자성체들(54)은 그 극의 방향이 서로 반대가 되도록 배열될 수 있다. 즉, 하나의 금속 자성체(54)의 N극이 갭플레이트(52) 및 기판(40)의 방향으로 배열되면, 이와 이웃하는 금속 자성체(54)의 S극이 갭플레이트(52) 및 기판(40)의 방향으로 의 배치될 수 있다. Meanwhile, as shown, the neighboring magnetic metals 54 may be arranged such that their poles are opposite to each other. That is, when the N poles of one magnetic metal body 54 are arranged in the directions of the gap plate 52 and the substrate 40, the S poles of the adjacent magnetic metal bodies 54 are the gap plate 52 and the substrate 40. Can be arranged in the direction of.

또한, 상기한 갭플레이트(52)의 내부에는 내부로 냉각수가 흐르는 냉각 튜브가 배치되어 기판(40)의 온도를 균일하게 유지시켜 줄 수 있다. In addition, a cooling tube through which cooling water flows may be disposed inside the gap plate 52 to maintain the temperature of the substrate 40 uniformly.

상기에서는 본 발명의 바람직한 실시예에 대하여 설명하였지만, 본 발명은 이에 한정되는 것이 아니고 특허청구범위와 발명의 상세한 설명 및 첨부한 도면의 범위 안에서 여러 가지로 변형하여 실시하는 것이 가능하고 이 또한 본 발명의 범위에 속하는 것은 당연하다. Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

상술한 바와 같이, 본 발명의 진공 증착 장치에 따르면 금속 자성체를 사용함으로써 고무 자성체의 사용시 발생하는 아웃개싱을 방지할 수 있으며, 강하고 균일한 자장을 제공하여 대면적 기판의 증착에 적용이 가능하다. As described above, according to the vacuum vapor deposition apparatus of the present invention, by using a metal magnetic material, it is possible to prevent outgassing generated when the rubber magnetic material is used, and to provide a strong and uniform magnetic field, which can be applied to the deposition of a large area substrate.

Claims (5)

진공 챔버;A vacuum chamber; 상기 진공 챔버 내측 하부로 배치되는 증착원;A deposition source disposed below the inside of the vacuum chamber; 상기 진공 챔버 내부의 상기 증착원 위로 증착마스크를 구비하며 배치되는 마스크 프레임 조립체; 및A mask frame assembly having a deposition mask disposed above the deposition source in the vacuum chamber; And 상기 마스크 프레임 조립체와 증착되는 기판을 사이에 두고 배치되는 마그넷 유닛Magnet unit disposed between the mask frame assembly and the substrate to be deposited 을 포함하고,Including, 상기 마그넷 유닛은,The magnet unit, 상기 기판 측으로 배치되는 갭플레이트(gap plate); 및 A gap plate disposed on the substrate side; And 상기 갭플레이트와 간격을 두고 배치되는 금속 자성체(metal magnet)Metal magnets spaced apart from the gap plate 를 포함하는 유기 발광 표시 장치의 진공 증착 장치.Vacuum deposition apparatus of an organic light emitting display device comprising a. 제1 항에 있어서,According to claim 1, 상기 갭플레이트는 일정한 간격을 두고 형성되는 복수의 홈들을 구비하고, 상기 금속 자성체는 상기 홈들의 내부로 배치되는 유기 발광 표시 장치의 진공 증착 장치.The gap plate includes a plurality of grooves formed at regular intervals, and the metal magnetic material is disposed inside the grooves. 제2 항에 있어서,The method of claim 2, 이웃하는 상기 금속 자성체들이 서로 반대의 극 방향으로 배치되는 유기 발광 표시 장치의 진공 증착 장치.The vacuum deposition apparatus of the organic light emitting diode display, wherein the adjacent magnetic metals are arranged in opposite polar directions. 제1 항에 있어서,According to claim 1, 상기 갭플레이트의 내부로 설치되는 냉각 튜브를 더 포함하는 유기 발광 표시 장치의 진공 증착 장치.And a cooling tube installed inside the gap plate. 제1 항에 있어서,According to claim 1, 상기 마그넷 유닛은 그 하부로 상기 금속 자성체가 일정한 간격으로 배열되는 마그넷 플레이트를 더 포함하는 유기 발광 표시 장치의 진공 증착 장치.The magnet unit further includes a magnet plate below which the magnetic metal is arranged at regular intervals.
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Cited By (52)

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Publication number Priority date Publication date Assignee Title
US8193011B2 (en) 2009-08-24 2012-06-05 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8707889B2 (en) 2011-05-25 2014-04-29 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8859325B2 (en) 2010-01-14 2014-10-14 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
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US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
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US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
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US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
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US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9453282B2 (en) 2010-03-11 2016-09-27 Samsung Display Co., Ltd. Thin film deposition apparatus
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus

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KR102081282B1 (en) * 2013-05-27 2020-02-26 삼성디스플레이 주식회사 Substrate transfer unit for deposition, deposition apparatus comprising the same, method for manufacturing organic light emitting display apparatus using the same, organic light emitting display apparatus manufacture by the method
KR102246293B1 (en) * 2014-08-05 2021-04-30 삼성디스플레이 주식회사 Magnet plate assembly, and apparatus for deposition comprising the same and the method of depositing using the same
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030069679A (en) * 2002-02-22 2003-08-27 삼성에스디아이 주식회사 magnet plate for alignment of mask of organic thin film deposition device and alignment structur of magnet plate between mask
JP2004146251A (en) * 2002-10-25 2004-05-20 Optrex Corp Metal mask deposition method, wiring pattern, and organic electroluminescence display element
KR20050035561A (en) * 2003-10-13 2005-04-19 삼성오엘이디 주식회사 Mask frame assembly, and forming apparatus of thin layer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030069679A (en) * 2002-02-22 2003-08-27 삼성에스디아이 주식회사 magnet plate for alignment of mask of organic thin film deposition device and alignment structur of magnet plate between mask
JP2004146251A (en) * 2002-10-25 2004-05-20 Optrex Corp Metal mask deposition method, wiring pattern, and organic electroluminescence display element
KR20050035561A (en) * 2003-10-13 2005-04-19 삼성오엘이디 주식회사 Mask frame assembly, and forming apparatus of thin layer

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